CN107605697B - Partition plate structure, two-stage compressor and air conditioner - Google Patents
Partition plate structure, two-stage compressor and air conditioner Download PDFInfo
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- CN107605697B CN107605697B CN201711001131.1A CN201711001131A CN107605697B CN 107605697 B CN107605697 B CN 107605697B CN 201711001131 A CN201711001131 A CN 201711001131A CN 107605697 B CN107605697 B CN 107605697B
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Abstract
The invention provides a partition plate structure, a two-stage compressor and an air conditioner. The partition plate structure solves the problem that the partition plate structure in the prior art is poor in heat-conducting property.
Description
Technical Field
The invention relates to the field of air conditioners, in particular to a partition plate structure, a two-stage compressor and an air conditioner.
Background
In a two-stage compression process, refrigerant gas is first compressed in the lower cylinder, then the gas is compressed in the upper cylinder to reach a certain intermediate pressure, and finally the gas is discharged from the compressor. Therefore, the upper cylinder is pressurized more than the lower cylinder. According to the pressure-enthalpy diagram of the two-stage compression refrigeration cycle, the higher the pressure, the higher the temperature. Therefore, the temperature of the upper cylinder is higher than that of the lower cylinder, which leads to the adverse effects of increased thermal expansion deformation and abrasion of parts of the upper cylinder, carbonization of lubricating oil and the like, and influences the performance.
Disclosure of Invention
The invention mainly aims to provide a partition plate structure, a two-stage compressor and an air conditioner, and aims to solve the problem that the partition plate structure in the prior art is poor in heat-conducting performance.
In order to achieve the above object, according to a first aspect of the present invention, there is provided a diaphragm structure including a diaphragm body installed between an upper cylinder and a lower cylinder of a dual stage compressor, the diaphragm body being provided with a heat conduction groove for being filled with a heat conduction medium to transfer heat generated from the dual stage compressor.
Further, the heat conduction groove is located inside the partition body.
Further, the heat conduction groove is located at one end, close to the upper air cylinder, of the partition plate body.
Further, the baffle body is the cylinder, and the heat conduction groove is the ring channel, and the heat conduction groove encircles the center pin setting of baffle body.
Further, the longitudinal section of the heat conduction groove is circular or polygonal.
Furthermore, a diversion trench is arranged on the partition body and communicated with the heat conduction trench, and the heat conduction medium is sent into the heat conduction trench through the diversion trench.
Further, the guiding gutter extends along the radial direction of baffle body to communicate with the heat conduction groove.
Furthermore, the bottom of the flow guide groove and the bottom of the heat conduction groove are located on the same plane, and/or the top of the flow guide groove and the top of the heat conduction groove are located on the same plane.
Further, the separator body includes: the first end of the first partition plate is used for being connected with the upper air cylinder; and the first end of the second partition plate is connected with the second end of the first partition plate, and the second end of the second partition plate is used for being connected with the lower air cylinder.
Further, the heat conduction groove is arranged at the second end of the first partition plate, the heat conduction groove is an open groove, and the notch of the heat conduction groove faces the second partition plate.
Further, the second end of the first partition plate and the first end of the second partition plate are both provided with heat conduction grooves.
Further, the first partition plate is connected with the second partition plate in a clamping mode, an adhesion mode or a fastening piece mode.
Further, the heat-conducting medium is heat-conducting liquid.
Further, the heat transfer medium is a nanofluid.
According to a second aspect of the present invention, there is provided a two-stage compressor comprising a diaphragm structure, an upper cylinder and a lower cylinder, the diaphragm structure being disposed between the upper cylinder and the lower cylinder, the diaphragm structure being as described above.
According to a third aspect of the present invention, there is provided an air conditioner comprising a two-stage compressor, the two-stage compressor being the above-mentioned two-stage compressor.
According to the clapboard structure, the heat conducting groove is formed in the clapboard body, and the heat conducting medium is filled in the heat conducting groove, so that the overall heat conducting performance of the clapboard structure can be improved, and the heat transfer of the clapboard structure to the two-stage compressor is improved. The baffle plate body is arranged between an upper cylinder and a lower cylinder of the double-stage compressor. In a specific installation process, a heat-conducting medium is filled in the heat-conducting groove, and then the partition plate body is installed between the upper cylinder and the lower cylinder of the two-stage compressor. Considering that the heat conducting performance of the heat conducting medium is good, the heat transfer performance can be improved, so that the heat generated by the two-stage compressor is transferred, and the problem that the heat conducting performance of the partition plate structure in the prior art is poor is solved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 shows a schematic structural view of a first embodiment of a separator plate structure according to the invention;
FIG. 2 shows a schematic cross-sectional view A-A of the separator structure of FIG. 1;
FIG. 3 shows a schematic structural view of a second embodiment of a separator structure according to the invention;
fig. 4 shows a schematic sectional structure view of B-B of the separator structure in fig. 3.
Wherein the figures include the following reference numerals:
10. a separator body; 11. a heat conducting groove; 12. a diversion trench; 13. a first separator; 14. a second separator; 20. mounting holes; 30. an assembly hole; 40. an airway; 50. an arc-shaped groove.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The present invention provides a partition plate structure, please refer to fig. 1 to 4, the partition plate structure includes a partition plate body 10, the partition plate body 10 is installed between an upper cylinder and a lower cylinder of a two-stage compressor, a heat conducting groove 11 is arranged on the partition plate body 10, and the heat conducting groove 11 is used for filling a heat conducting medium to transfer heat generated by the two-stage compressor.
According to the clapboard structure, the heat conduction groove 11 is formed in the clapboard body 10, and the heat conduction medium is filled in the heat conduction groove 11, so that the overall heat conduction performance of the clapboard structure can be improved, and the heat transfer of the clapboard structure to the double-stage compressor is improved. Wherein the diaphragm body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor. In a specific installation process, a heat transfer medium is filled in the heat transfer groove 11, and then the separator body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor. Considering that the heat conducting performance of the heat conducting medium is good, the heat transfer performance can be improved, so that the heat generated by the two-stage compressor is transferred, and the problem that the heat conducting performance of the partition plate structure in the prior art is poor is solved.
In order to facilitate the filling of the heat transfer medium, as shown in fig. 2 and 4, a heat transfer groove 11 is provided inside the separator body 10.
In this embodiment, the heat conduction groove 11 is disposed inside the partition board body 10, and during the filling process of a specific heat conduction medium, the heat conduction medium can be sealed inside the partition board body 10, so as to facilitate the stability of the whole structure and the installation and replacement during the use.
In consideration of the heat distribution of the upper and lower cylinders, as shown in fig. 2 and 4, the heat conduction groove 11 is located at one end of the diaphragm body 10 near the upper cylinder.
Considering that the pressure of the upper cylinder of the double-stage compression is higher than that of the lower cylinder, the temperature of the upper cylinder is higher than that of the lower cylinder. In the present embodiment, the heat conduction groove 11 is provided at one end of the separator body 10 close to the upper cylinder, so that the heat of the upper cylinder can be better transferred.
In consideration of the specific use of the separator structure, as shown in fig. 1 and 3, the separator body 10 is a cylinder, the heat-conducting groove 11 is an annular groove, and the heat-conducting groove 11 is disposed around the central axis of the separator body 10.
In the present embodiment, in order to match the structure of the upper cylinder and the lower cylinder of the two-stage compression. The partition body 10 is a cylinder, and the heat-conducting groove 11 is an annular groove. In order to be able to provide the heat conductive performance of the heat conductive medium, it is preferable that the heat conductive groove 11 is provided around the central axis of the separator body 10.
For the specific structure of the heat conduction groove 11, optionally, the longitudinal section of the heat conduction groove 11 is circular or polygonal.
Alternatively, as shown in FIG. 4, the heat-conducting groove 11 has a circular longitudinal cross section
Alternatively, as shown in fig. 2, the heat conduction groove 11 has a rectangular longitudinal section.
In order to conveniently feed the heat transfer medium into the heat transfer groove 11, as shown in fig. 2 and 4, a guide groove 12 is provided on the partition body 10, the guide groove 12 is communicated with the heat transfer groove 11, and the heat transfer medium is fed into the heat transfer groove 11 through the guide groove 12.
In the present embodiment, the baffle body 10 is provided with the diversion trench 12, wherein the diversion trench 12 is communicated with the heat conduction trench 11. When the diaphragm structure is used, a heat transfer medium is fed into the heat transfer groove 11 through the guide groove 12, and then the diaphragm body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor.
For the specific arrangement of the guide grooves 12, the guide grooves 12 extend in the radial direction of the partition body 10 to communicate with the heat conduction grooves 11.
In the present embodiment, the heat conduction groove 11 is disposed around the central axis of the partition body 10, the diversion groove 12 extends along the radial direction of the partition body 10, and the diversion groove 12 is communicated with the heat conduction groove 11. When the diaphragm structure is used, a heat transfer medium is fed into the heat transfer groove 11 through the guide groove 12, and then the diaphragm body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor.
With respect to the relationship between the flow guide grooves 12 and the heat conduction grooves 11, optionally, the groove bottoms of the flow guide grooves 12 and the groove bottoms of the heat conduction grooves 11 are located on the same plane, and/or the groove tops of the flow guide grooves 12 and the groove tops of the heat conduction grooves 11 are located on the same plane.
Optionally, the bottom of the flow guide groove 12 and the bottom of the heat conduction groove 11 are located on the same plane.
Optionally, the top of the flow guide groove 12 and the top of the heat conduction groove 11 are located on the same plane.
Optionally, the bottom of the guide channel 12 and the bottom of the heat conducting channel 11 are located on the same plane, and the top of the guide channel 12 and the top of the heat conducting channel 11 are located on the same plane. Heat conduction slot 11 encircles the center pin setting of baffle body 10, and guiding gutter 12 extends along the radial direction of baffle body 10, and guiding gutter 12 and heat conduction slot 11 intercommunication.
As for the specific structure of the separator body 10, as shown in fig. 2, the separator body 10 includes: a first end of the first partition plate 13 is used for being connected with the upper air cylinder; and a second partition plate 14, a first end of the second partition plate 14 being connected to a second end of the first partition plate 13, and a second end of the second partition plate 14 being adapted to be connected to the lower cylinder.
In the present embodiment, the separator body 10 is composed of a first separator 13 and a second separator 14. Wherein a first end of the second separator 14 is connected to a second end of the first separator 13. When the diaphragm structure is installed, a first end of the first diaphragm 13 is connected to the upper cylinder, and a second end of the second diaphragm 14 is connected to the lower cylinder. The diaphragm structure is thus installed between the upper and lower cylinders of the two-stage compressor.
In consideration of the feasibility of processing, in the present embodiment, the first separator 13 and the second separator 14 are of a composition type structure. In the using process, the heat conduction grooves 11 and the flow guide grooves 12 are processed on the first partition plate 13 and/or the second partition plate 14, and then the first partition plate 13 and the second partition plate 14 are assembled, so that the complete partition plate body 10 is formed.
Alternatively, the first separator 13 is integrally formed with the second separator 14.
In this embodiment, the first partition 13 is provided with a diversion trench 12, the diversion trench 12 is communicated with the heat conduction trench 11, and the diversion trench 12 is an open trench.
In order to ensure better heat dissipation of the upper cylinder, as shown in fig. 2 and 4, the heat conduction groove 11 is disposed at the second end of the first partition plate 13, the heat conduction groove 11 is an open groove, and the notch of the heat conduction groove 11 is disposed toward the second partition plate 14.
In this embodiment, the heat conduction groove 11 is disposed at the second end of the first partition plate 13, so that the heat conduction groove 11 is closer to the upper cylinder, and the heat of the upper cylinder can be better dissipated. In consideration of the feasibility of processing, the heat conduction groove 11 is an open groove, and the notch of the heat conduction groove 11 is disposed toward the second partition plate 14. When the first partition plate 13 and the second partition plate 14 are combined, the second partition plate 14 is mounted on the first partition plate 13, that is, the opening of the heat conduction groove 11 is closed, so that it can be ensured that the heat conduction medium is stably arranged in the heat conduction groove 11.
Optionally, the second end of the first partition plate 13 and the first end of the second partition plate 14 are both provided with the heat conduction groove 11. Wherein, the heat conduction groove 11 on the first partition plate 13 is higher than the heat conduction groove 11 on the second partition plate 14.
Aiming at the connection mode of the first partition plate 13 and the second partition plate 14, the first partition plate 13 and the second partition plate 14 are clamped, bonded or connected through a fastening piece.
Optionally, the first partition plate 13 is clamped with the second partition plate 14, and the first partition plate 13 and the second partition plate 14 can be conveniently detached and installed by clamping the first partition plate 13 with the second partition plate 14.
Alternatively, the first separator 13 is bonded to the second separator 14.
Optionally, the first partition 13 and the second partition 14 are connected by a fastener.
Preferably, the heat conducting medium is a heat conducting liquid.
Optionally, the heat transfer medium is a nanofluid.
Preferably, the outer edge of the partition body 10 is provided with an arc-shaped groove 50, and the diversion trench 12 is communicated with the arc-shaped groove 50. The positioning of the separator body 10 can be facilitated by the provision of the arc-shaped groove 50.
Regarding the specific structure of the partition plate structure, as shown in fig. 1, the partition plate structure is provided with a mounting hole 20, the mounting hole 20 is used for a crankshaft to pass through, and the heat conduction groove 11 is arranged around the mounting hole 20.
In addition, the partition structure is provided with fitting holes 30, and the fitting holes 30 are used to mount the partition structure on the upper and lower cylinders.
Preferably, the mounting hole 30 is plural, and the plural mounting holes 30 are arranged at intervals around the mounting hole 20.
Preferably, the heat conduction groove 11 is provided between the mounting hole 20 and the fitting hole 30.
Preferably, the partition structure is provided with an air passage 40, and the air passage 40 is used for communicating the cavities of the upper cylinder and the lower cylinder.
The specific structure and processing procedure of the separator structure of the present invention are explained:
in the partition plate structure of the invention, an inner groove (heat conduction groove 11) is processed in the partition plate body 10 close to the upper cylinder side, and the section of the inner groove can be rectangular or circular.
In this embodiment, the separator body 10 is divided into two separate upper and lower portions, and optionally, half of the inner tank is formed in each of the two portions and then welded together. In addition, the inner tank may be formed only in a part thereof.
In the specific application process, the heat conducting groove 11 of the clapboard body 10 is filled with liquid (or nano fluid) with larger heat conductivity coefficient, so that the heat dissipation in the upper cylinder can be accelerated in the operation process of the compressor, the thermal expansion deformation and abrasion of parts are reduced, the deterioration of lubricating oil is prevented, and the overall performance of the clapboard structure is improved.
The invention also provides a two-stage compressor which comprises a partition plate structure, an upper air cylinder and a lower air cylinder, wherein the partition plate structure is arranged between the upper air cylinder and the lower air cylinder and is the above partition plate structure.
The invention also provides an air conditioner which comprises the two-stage compressor.
From the above description, it can be seen that the above-described embodiments of the present invention achieve the following technical effects:
according to the clapboard structure, the heat conduction groove 11 is formed in the clapboard body 10, and the heat conduction medium is filled in the heat conduction groove 11, so that the overall heat conduction performance of the clapboard structure can be improved, and the heat transfer of the clapboard structure to the double-stage compressor is improved. Wherein the diaphragm body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor. In a specific installation process, a heat transfer medium is filled in the heat transfer groove 11, and then the separator body 10 is installed between the upper cylinder and the lower cylinder of the two-stage compressor. Considering that the heat conducting performance of the heat conducting medium is good, the heat transfer performance can be improved, so that the heat generated by the two-stage compressor is transferred, and the problem that the heat conducting performance of the partition plate structure in the prior art is poor is solved.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A partition plate structure is characterized by comprising a partition plate body (10), wherein the partition plate body (10) is installed between an upper air cylinder and a lower air cylinder of a two-stage compressor, a heat conducting groove (11) is formed in the partition plate body (10), and the heat conducting groove (11) is used for filling a heat conducting medium so as to transfer heat generated by the two-stage compressor;
the clapboard body (10) consists of a first clapboard (13) and a second clapboard (14); wherein a first end of the second partition (14) is connected with a second end of the first partition (13); the first end of the first partition plate (13) is connected with the upper air cylinder, and the second end of the second partition plate (14) is connected with the lower air cylinder;
the heat conducting groove (11) is arranged at the second end of the first partition plate (13), the heat conducting groove (11) is an open groove, and a notch of the heat conducting groove (11) faces the second partition plate (14); or the second end of the first clapboard (13) and the first end of the second clapboard (14) are both provided with the heat conduction groove (11), and the heat conduction groove (11) on the first clapboard (13) is higher than the heat conduction groove (11) on the second clapboard (14);
a diversion trench (12) is formed in the partition body (10), the diversion trench (12) is communicated with the heat conduction trench (11), and the heat conduction medium is sent into the heat conduction trench (11) through the diversion trench (12);
the outer edge of the partition board body (10) is provided with an arc-shaped groove (50), and the diversion groove (12) is communicated with the arc-shaped groove (50).
2. The baffle structure of claim 1 wherein the heat conducting channel (11) is located inside the baffle body (10).
3. The separator structure according to claim 1, wherein the separator body (10) is a cylindrical body, the heat-conducting groove (11) is an annular groove, and the heat-conducting groove (11) is provided around a central axis of the separator body (10).
4. Partition structure according to claim 1, characterised in that the heat-conducting channel (11) has a circular or polygonal longitudinal cross-section.
5. The baffle structure according to claim 1 wherein the flow guide grooves (12) extend in a radial direction of the baffle body (10) to communicate with the heat conduction grooves (11).
6. Partition structure according to claim 1, characterised in that the bottom of the flow-guiding channel (12) is in the same plane as the bottom of the heat-conducting channel (11) and/or the top of the flow-guiding channel (12) is in the same plane as the top of the heat-conducting channel (11).
7. Partition structure according to claim 1, characterized in that the first partition (13) is snapped, glued or connected by fasteners to the second partition (14).
8. The baffle structure of claim 1 wherein the heat transfer medium is a heat transfer liquid.
9. The separator structure of claim 1, wherein said heat transfer medium is a nanofluid.
10. A two-stage compressor comprising a diaphragm structure, an upper cylinder and a lower cylinder, said diaphragm structure being disposed between said upper cylinder and said lower cylinder, characterized in that said diaphragm structure is as claimed in any one of claims 1 to 9.
11. An air conditioner comprising a two-stage compressor, wherein said two-stage compressor is the two-stage compressor of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711001131.1A CN107605697B (en) | 2017-10-23 | 2017-10-23 | Partition plate structure, two-stage compressor and air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711001131.1A CN107605697B (en) | 2017-10-23 | 2017-10-23 | Partition plate structure, two-stage compressor and air conditioner |
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| CN107605697A CN107605697A (en) | 2018-01-19 |
| CN107605697B true CN107605697B (en) | 2020-10-09 |
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| CN201711001131.1A Active CN107605697B (en) | 2017-10-23 | 2017-10-23 | Partition plate structure, two-stage compressor and air conditioner |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204186587U (en) * | 2014-09-24 | 2015-03-04 | 珠海格力节能环保制冷技术研究中心有限公司 | Multi-cylinder Dual-level enthalpy adding compressor |
| CN105805016A (en) * | 2016-03-10 | 2016-07-27 | 广东美芝制冷设备有限公司 | Rotary compressor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003269356A (en) * | 2002-03-18 | 2003-09-25 | Sanyo Electric Co Ltd | Horizontal type rotary compressor |
| CN105626537B (en) * | 2016-01-04 | 2018-01-23 | 广东美芝制冷设备有限公司 | Cylinder and its manufacture method, compressor |
| CN205349744U (en) * | 2016-01-04 | 2016-06-29 | 广东美芝制冷设备有限公司 | Cylinder and rotary compressor who has it |
| CN207420801U (en) * | 2017-10-23 | 2018-05-29 | 珠海凌达压缩机有限公司 | Diaphragm structure, double-stage compressor and air conditioner |
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2017
- 2017-10-23 CN CN201711001131.1A patent/CN107605697B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204186587U (en) * | 2014-09-24 | 2015-03-04 | 珠海格力节能环保制冷技术研究中心有限公司 | Multi-cylinder Dual-level enthalpy adding compressor |
| CN105805016A (en) * | 2016-03-10 | 2016-07-27 | 广东美芝制冷设备有限公司 | Rotary compressor |
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