CN107603148A - A kind of flexibility coat copper plate curable resin composition - Google Patents
A kind of flexibility coat copper plate curable resin composition Download PDFInfo
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- CN107603148A CN107603148A CN201610554230.1A CN201610554230A CN107603148A CN 107603148 A CN107603148 A CN 107603148A CN 201610554230 A CN201610554230 A CN 201610554230A CN 107603148 A CN107603148 A CN 107603148A
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- coupling agent
- copper plate
- epoxy resin
- flexibility coat
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Abstract
The invention discloses a kind of flexibility coat copper plate curable resin composition, the raw material composition and parts by weight of composite curing epoxy resin include：20~30 parts of polyurethane modified epoxy resin, 10~20 parts of dimer acid glycidyl ester type epoxy resin, 2~4 parts of dicy-curing agent, 0.5~5 part of curing accelerator, 40~70 parts of organic solvent, 2~8 parts of coupling agent.By introducing modified epoxy in resin glue composition of the present invention, contribute to the toughness of improvement solidified resin film-forming, assign the excellent tensile strength of copper-clad plate and elongation percentage, coupling agent passes through chemical bond, improve copper-clad plate supporting material and epoxy resin interface intensity, improve separation strength between the two.
Description
Technical field
The present invention relates to copper-clad plate solidified resin technical field, and in particular to a kind of flexibility coat copper plate is combined with solidified resin
Thing.
Background technology
The reinforcing material that flexibility coat copper plate (FCCL) uses at present is PI films, and flex section uses in Rigid-flex PCB
Reinforcing material is also PI films.PI film flexural properties are splendid but with high costs, and this causes the price of its derivative PCB product very
It is high.But some deflection requirements are relatively low or the occasion of static flexure, it is not necessary to so high flexural property, can then use
The preferable FR-4 (semi-flexible FR-4) of flexural property substitutes FCCL, reduces material cost.CN102702989A discloses one kind
Flexibility coat copper plate cover layer, solidified resin composition therein is 30~40 parts of solvent epoxy varnish, solvent type epoxy toughness reinforcing
10~20 parts of agent, 6~25 parts of halogen-free flame retardants, 1~3 part of antiradiation agent, 1~3 part of additive, 20~40 parts of solvent.Further
, epoxy toughening agent is XNBR, nbr carboxyl terminal, anacardol, polypropylene glycol diglycidyl ether, linoleic acid
One or more kinds of mixtures in dimer diglycidyl ether；Additive includes curing agent and accelerator.However, rubber
Although glue can provide the pliability of system, the negative effect to system separation strength is larger.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of flexibility coat copper plate solidified resin
Composition, above-mentioned composition cured film separation strength are larger.
To realize above-mentioned technique effect, the technical scheme is that：A kind of flexibility coat copper plate curable resin composition,
Characterized in that, the raw material composition and parts by weight of the composite curing epoxy resin include：Polyurethane modified epoxy resin 20
~30 parts, 10~20 parts of dimer acid glycidyl ester type epoxy resin, 2~4 parts of dicy-curing agent, curing accelerator 0.5~5
Part, 40~70 parts of organic solvent, 2~8 parts of coupling agent.
Preferable technical scheme is that coupling agent is monoalkoxy type titanate coupling agent and/or imide ring modified silane
Coupling agent.
Preferable technical scheme is that coupling agent is coupled by monoalkoxy type titanate coupling agent and imide ring modified silane
Agent combines, and the percentage by weight of imide ring modified silane coupler is 70~90% in coupling agent.
Preferable technical scheme is that organic solvent is selected from acetone, butanone, cyclohexanone, hexamethylene, dioxane, second two
One or more of mixing in alcohol monomethyl ether, triglyme, DMF.
Preferable technical scheme is that curing accelerator is selected from 2-methylimidazole, 1- methylimidazoles, 2- ethyl -4- methyl
At least one of imidazoles, 1- cyanoethyls -2-ethyl-4-methylimidazole, 2- phenylimidazoles, 2- phenyl -4-methylimidazole.
Preferable technical scheme is that the phosphorus content of phosphorous epoxy resin is not less than 3%.
Preferable technical scheme is that filler is the group selected from least one of magnesium hydroxide, aluminium hydroxide and mica powder
Compound, the percentage by weight sum of magnesium hydroxide and aluminium hydroxide is not less than 90% in filler.
The advantages of the present invention are：
By introducing modified epoxy in resin glue composition of the present invention, help to improve solidified resin film-forming
Toughness, assigns the excellent tensile strength of copper-clad plate and elongation percentage, and coupling agent improves copper-clad plate supporting material and ring by chemical bond
Oxygen tree fat boundary strength, improves separation strength between the two.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more
Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The raw material composition of flexibility coat copper plate curable resin composition and parts by weight include in embodiment 1：Polyurethane changes
20 parts of epoxy resin of property, 20 parts of dimer acid glycidyl ester type epoxy resin, 2 parts of dicy-curing agent, 5 parts of curing accelerator,
40 parts of organic solvent, 8 parts of coupling agent.
Coupling agent is monoalkoxy type titanate coupling agent.
Organic solvent is DMF.Curing accelerator is 2-methylimidazole.
The phosphorus content of phosphorous epoxy resin is 2%.Filler is magnesium hydroxide.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is that the raw material of flexibility coat copper plate curable resin composition forms and weight
Number includes：30 parts of polyurethane modified epoxy resin, 10 parts of dimer acid glycidyl ester type epoxy resin, dicy-curing agent 4
Part, 0.5 part of curing accelerator, 70 parts of organic solvent, 2 parts of coupling agent.
Coupling agent is combined by monoalkoxy type titanate coupling agent and imide ring modified silane coupler, coupling agent
The percentage by weight of middle imide ring modified silane coupler is 70%.
Organic solvent is the combination of acetone and DMF weight ratio 1: 2.
Curing accelerator is that 1- methylimidazoles and 2- phenyl -4-methylimidazole are mixed with weight ratio 1: 2.
The phosphorus content of phosphorous epoxy resin is 3%.
Filler is the composition of magnesium hydroxide, aluminium hydroxide and mica powder, and the percentage by weight of three kinds of components is in filler
50%th, 40%, 10%.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is that the raw material of flexibility coat copper plate curable resin composition forms and weight
Number includes：25 parts of polyurethane modified epoxy resin, 15 parts of dimer acid glycidyl ester type epoxy resin, dicy-curing agent 3
Part, 3 parts of curing accelerator, 55 parts of organic solvent, 5 parts of coupling agent.
Coupling agent is combined by monoalkoxy type titanate coupling agent and imide ring modified silane coupler, coupling agent
The percentage by weight of middle imide ring modified silane coupler is 90%.
Organic solvent is the combination of triglyme, DMF by weight 1: 2.
Curing accelerator is 2- phenyl -4-methylimidazole.The phosphorus content of phosphorous epoxy resin is not less than 4%.
Filler is the composition of magnesium hydroxide, aluminium hydroxide and mica powder, and the percentage by weight of three kinds of components is in filler
55%th, 40%, 5%.
Comparative example
Comparative example is added without coupling agent.
Embodiment and comparative example are used for the production of copper-clad plate, two sides to form through hot pressing and covered coated with the copper foil of same size
Copper coin, carry out peel strength and the test of tensile strength elongation percentage：
Peel strength (PS)：Tested by IPC-TM-6502.4.9；Tensile strength and elongation percentage：Enter by JIS C2318
Row test.
Result of the test：Embodiment 1-3 peel strength is substantially better than comparative example.Embodiment 1-3 tensile strength and extension
Rate is closer to comparative example.In addition, filler magnesium hydroxide, aluminium hydroxide and phosphorous epoxy resin each contribute to improve solidified resin
The fire resistance of composition film-forming.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (7)
- A kind of 1. flexibility coat copper plate curable resin composition, it is characterised in that the raw material group of the composite curing epoxy resin Into and parts by weight include：20~30 parts of polyurethane modified epoxy resin, dimer acid glycidyl ester type epoxy resin 10~20 Part, 2~4 parts of dicy-curing agent, 0.5~5 part of curing accelerator, 40~70 parts of organic solvent, 2~8 parts of coupling agent.
- 2. flexibility coat copper plate curable resin composition according to claim 1, it is characterised in that coupling agent is single alcoxyl Fundamental mode titanate coupling agent and/or imide ring modified silane coupler.
- 3. flexibility coat copper plate curable resin composition according to claim 2, it is characterised in that coupling agent is by single alcoxyl Fundamental mode titanate coupling agent and imide ring modified silane coupler are combined, and imide ring modified silane is coupled in coupling agent The percentage by weight of agent is 70~90%.
- 4. flexibility coat copper plate curable resin composition according to claim 1, it is characterised in that organic solvent be selected from In acetone, butanone, cyclohexanone, thiacyclohexane, dioxane, glycol monoethyl ether, triglyme, DMF One or more of mixing.
- 5. flexibility coat copper plate according to claim 2 resin glue composition, it is characterised in that curing accelerator be selected from 2-methylimidazole, 1- methylimidazoles, 2-ethyl-4-methylimidazole, 1- cyanoethyls -2-ethyl-4-methylimidazole, 2- phenyl miaows At least one of azoles, 2- phenyl -4-methylimidazole.
- 6. flexibility coat copper plate according to claim 1 resin glue composition, it is characterised in that the phosphorus of phosphorous epoxy resin Content is not less than 3%.
- 7. flexibility coat copper plate according to claim 1 resin glue composition, it is characterised in that filler is selected from hydroxide The composition of at least one of magnesium, aluminium hydroxide and mica powder, the percentage by weight of magnesium hydroxide and aluminium hydroxide in filler Sum is not less than 90%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554230.1A CN107603148A (en) | 2016-07-11 | 2016-07-11 | A kind of flexibility coat copper plate curable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554230.1A CN107603148A (en) | 2016-07-11 | 2016-07-11 | A kind of flexibility coat copper plate curable resin composition |
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| Publication Number | Publication Date |
|---|---|
| CN107603148A true CN107603148A (en) | 2018-01-19 |
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| CN201610554230.1A Pending CN107603148A (en) | 2016-07-11 | 2016-07-11 | A kind of flexibility coat copper plate curable resin composition |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111976246A (en) * | 2020-09-01 | 2020-11-24 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
| CN115353717A (en) * | 2022-08-25 | 2022-11-18 | 陕西生益科技有限公司 | Resin composition and application thereof |
| CN115895338A (en) * | 2022-11-17 | 2023-04-04 | 佛山英捷力新材料科技有限公司 | UV-LED character ink-jet ink for flexible circuit board and preparation method thereof |
-
2016
- 2016-07-11 CN CN201610554230.1A patent/CN107603148A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111976246A (en) * | 2020-09-01 | 2020-11-24 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
| CN111976246B (en) * | 2020-09-01 | 2021-03-12 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
| CN115353717A (en) * | 2022-08-25 | 2022-11-18 | 陕西生益科技有限公司 | Resin composition and application thereof |
| CN115353717B (en) * | 2022-08-25 | 2023-11-10 | 陕西生益科技有限公司 | Resin composition and application thereof |
| CN115895338A (en) * | 2022-11-17 | 2023-04-04 | 佛山英捷力新材料科技有限公司 | UV-LED character ink-jet ink for flexible circuit board and preparation method thereof |
| CN115895338B (en) * | 2022-11-17 | 2023-11-07 | 佛山英捷力新材料科技有限公司 | UV-LED character ink-jet ink for flexible circuit board and preparation method thereof |
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Addressee: Jiangyin's application interface Co. Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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Application publication date: 20180119 |