CN107603143A - A kind of copper-clad plate epoxy resin of low-k FR 4 - Google Patents
A kind of copper-clad plate epoxy resin of low-k FR 4 Download PDFInfo
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- CN107603143A CN107603143A CN201610553835.9A CN201610553835A CN107603143A CN 107603143 A CN107603143 A CN 107603143A CN 201610553835 A CN201610553835 A CN 201610553835A CN 107603143 A CN107603143 A CN 107603143A
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- epoxy resin
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Abstract
The invention discloses a kind of copper-clad plate epoxy resin of low-k FR 4, the raw material composition and parts by weight of composite curing epoxy resin include：13~20 parts of epoxy resin, 0.3~7 part of curing agent, 5~13 parts of fire retardants, 10~18 parts of fillers and 7~10 parts of dimethylformamides, wherein, filler is selected from boehmite, calcirm-fluoride, silicon powder, glass hollow pearl, at least one of the hydrotalcite through 500 DEG C of calcinings.Low dielectric filler is used in the present invention, the copper-clad plates of FR 4 obtained by above-mentioned epoxy resin have good combination property, dielectric constant is small, water absorption rate is low, has good hydrothermal stability and high pliability, with resistance to CAF performances and good punching processing performance, and cost is low, technique is simple, meets PCB requirement.
Description
Technical field
The present invention relates to copper-clad plate solidified resin technical field, and in particular to a kind of low-k FR-4 copper-clad plate rings
Oxygen tree fat.
Background technology
Various alignment systems such as communicate positioning, bus location, individual is positioned, remote control is surveyed and drawn, navigation system obtains quickly
Development, promotes the continuous appearance of various positioning electronic products.In order to realize the targets such as its miniaturization, lightweight, meet that high frequency is believed
Number transmission, the demand of high transmission speed and high-frequency low-consumption, it is necessary to copper-clad plate product of the exploitation with low-k.
Current low-k copper-clad plate is typically all using polyflon, cyanate ester resin, polyphenylene oxide resin
Or polyimide resin makes, can be combined with covering to produce using the glass fabric of low-k, low dielectric loss
Copper coin.Though copper-clad plate obtained by such scheme there are outstanding dielectric properties, the shortcomings that certain also all be present.Polyflon
Melt viscosity is big, and PTFE base copper-clad plate needs compressing at a high temperature of 380~400 DEG C, complex process.Polyphenylene oxide
Resin base copper-clad plate will use toluene in manufacturing process, pollute environment, equally exist the problem of melt viscosity is big.Cyanic acid ester group
The cost of copper-clad plate is too high.Polyimide resin base copper-clad plate cost is high, complex process.
The content of the invention
It is an object of the invention to overcome defect present in prior art, there is provided a kind of low-k FR-4 copper-clad plates
With epoxy resin, above-mentioned resin is applied in copper-clad plate, cost is low, good manufacturability and has good dielectric properties.
To realize above-mentioned technique effect, the technical scheme is that：A kind of low-k FR-4 copper-clad plate epoxies
Resin, it is characterised in that the raw material composition and parts by weight of the composite curing epoxy resin include：13~20 parts of asphalt mixtures modified by epoxy resin
Fat, 0.3~7 part of curing agent, 5~13 parts of fire retardants, 10~18 parts of fillers and 7~10 parts of dimethylformamides, wherein, filler is
Selected from boehmite, calcirm-fluoride, silicon powder, glass hollow pearl, at least one of the hydrotalcite through 500 DEG C of calcinings.
Preferable technical scheme is, filler be selected from least one of silicon powder, glass hollow pearl and selected from boehmite,
At least one of hydrotalcite through 500 DEG C of calcinings combines, the weight hundred of silicon powder and glass hollow pearl in the filler
Divide than being 43~65%.
Preferable technical scheme is that epoxy resin is by bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin and alicyclic ring
Race's epoxy composite forms, and the weight sum of dicyclopentadiene type epoxy resin and cycloaliphatic epoxy resin is not in epoxy resin
Less than 25%.
Preferable technical scheme is that fire retardant is phosphonium flame retardant, and phosphonium flame retardant is selected from phosphorus-containing phenolic aldehyde, organic phosphine
At least one of salt, phosphate and phosphite ester.
Preferable technical scheme is that the curing agent is combined by dicyandiamide class curing agent and imidazole curing agent, Gu
The percentage by weight of dicyandiamide class curing agent is 20~60% in agent.
Preferable technical scheme is that imidazole curing agent is one in 2- phenylimidazoles, 2-ethyl-4-methylimidazole
Kind.
The advantages of the present invention are：
Used in the present invention in boehmite, calcirm-fluoride, silicon powder, glass hollow pearl, the hydrotalcite through 500 DEG C of calcinings
At least one as low dielectric filler, the FR-4 copper-clad plates obtained by above-mentioned epoxy resin have good combination property, be situated between
Electric constant is small, water absorption rate is low, has good hydrothermal stability and high pliability, has resistance to CAF performances and good rushes
Hole machined performance, and cost is low, technique is simple, meets PCB requirement.
Embodiment
With reference to embodiment, the embodiment of the present invention is further described.Following examples are only used for more
Add and clearly demonstrate technical scheme, and can not be limited the scope of the invention with this.
Embodiment 1
The raw material composition of low-k FR-4 copper-clad plate epoxy resin and parts by weight include in embodiment 1：20 parts
Epoxy resin, 0.3 part of curing agent, 13 parts of fire retardants, 10 parts of fillers and 10 parts of dimethylformamides, wherein, filler is boehmite.
Epoxy resin combined by bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin and cycloaliphatic epoxy resin and
Into the weight percentage of three kinds of epoxy resin is respectively 80%, 10%, 10% in epoxy resin.
Fire retardant is brominated flame-retardant, specially TDE.
Curing agent is combined by dicyandiamide class curing agent and imidazole curing agent, dicyandiamide class curing agent in curing agent
Percentage by weight is 20%.
Imidazole curing agent is 2- phenylimidazoles.
Embodiment 2
The difference of embodiment 2 and embodiment 1 is, the raw material composition of low-k FR-4 copper-clad plate epoxy resin and
Parts by weight include：13 parts of epoxy resin, 7 parts of curing agent, 5 parts of fire retardants, 18 parts of fillers and 7 parts of dimethylformamides, wherein,
Boehmite percentage by weight is 65% in filler, and silicon powder, the total amount of glass hollow pearl are 35%, silicon powder and glass hollow pearl
Weight ratio be 3: 1.
Epoxy resin combined by bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin and cycloaliphatic epoxy resin and
Into the weight percentage of three kinds of epoxy resin is respectively 70%, 10%, 15% in epoxy resin.
Fire retardant is phosphonium flame retardant, and phosphonium flame retardant is the composition of phosphorus-containing phenolic aldehyde, organic phosphonium salt and phosphate, fire-retardant
The percentage by weight of phosphorus-containing phenolic aldehyde is 30%, organic phosphonium salt 52%, phosphate 18% in agent.
Curing agent is combined by dicyandiamide class curing agent and imidazole curing agent, dicyandiamide class curing agent in curing agent
Percentage by weight is 20%.
Imidazole curing agent is that 2- phenylimidazoles and 2-ethyl-4-methylimidazole combine according to weight ratio 1: 1.
Embodiment 3
The difference of embodiment 3 and embodiment 1 is, the raw material composition of low-k FR-4 copper-clad plate epoxy resin and
Parts by weight include：18 parts of epoxy resin, 3.5 parts of curing agent, 7.5 parts of fire retardants, 14 parts of fillers and 8.5 parts of dimethyl formyls
Amine.
Filler is that glass hollow pearl and boehmite, the hydrotalcite through 500 DEG C of calcinings combine, silicon powder and glass in filler
The percentage by weight of glass hollow bead is 43%, and the percentage by weight of boehmite is 20%, the weight of the hydrotalcite through 500 DEG C of calcinings
Percentage is 27%.
Epoxy resin combined by bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin and cycloaliphatic epoxy resin and
Into the weight percentage of three kinds of epoxy resin is respectively 70%, 20%, 10% in epoxy resin.
Fire retardant is phosphonium flame retardant, and phosphonium flame retardant is that phosphate and phosphite ester by weight 1: 2 combine.
Curing agent is combined by dicyandiamide class curing agent and imidazole curing agent, dicyandiamide class curing agent in curing agent
Percentage by weight is 60%.
Imidazole curing agent is 2-ethyl-4-methylimidazole.
Comparative example
Comparative example is using conventional silicon powder as filler.
Embodiment and comparative example are used for the production of copper-clad plate, two sides to form through hot pressing and covered coated with the copper foil of same size
Copper coin, test the dielectric constant of above-mentioned copper-clad plate.
In result of the test, the dielectric constant of embodiment 3 is minimum, and embodiment 2 and embodiment 1 are taken second place, and the dielectric of comparative example 1 is normal
Number highest.It is in addition, also optimal through water absorbing properties and mechanical performance toughness test, the water absorbing properties and mechanical performance of embodiment 3.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (6)
- A kind of 1. low-k FR-4 copper-clad plate epoxy resin, it is characterised in that the original of the composite curing epoxy resin Material composition and parts by weight include：13~20 parts of epoxy resin, 0.3~7 part of curing agent, 5~13 parts of fire retardants, 10~18 parts fill out Material and 7~10 parts of dimethylformamides, wherein, filler be selected from boehmite, calcirm-fluoride, silicon powder, glass hollow pearl, through 500 At least one of the hydrotalcite of DEG C calcining.
- 2. low-k FR-4 copper-clad plate epoxy resin according to claim 1, it is characterised in that filler be selected from At least one of silicon powder, glass hollow pearl and at least one of the hydrotalcite combination selected from boehmite, through 500 DEG C of calcinings Form, silicon powder and the percentage by weight of glass hollow pearl are 43~65% in the filler.
- 3. low-k FR-4 copper-clad plate epoxy resin according to claim 2, it is characterised in that epoxy resin by Bisphenol A type epoxy resin, dicyclopentadiene type epoxy resin and cycloaliphatic epoxy resin combine, bicyclic penta in epoxy resin The weight sum of diene type epoxy resin and cycloaliphatic epoxy resin is not less than 25%.
- 4. low-k FR-4 copper-clad plate epoxy resin according to claim 3, it is characterised in that fire retardant be containing Phosphorus fire retardant, phosphonium flame retardant are selected from least one of phosphorus-containing phenolic aldehyde, organic phosphonium salt, phosphate and phosphite ester.
- 5. low-k FR-4 copper-clad plate epoxy resin according to claim 4, it is characterised in that the curing agent Combined by dicyandiamide class curing agent and imidazole curing agent, the percentage by weight of dicyandiamide class curing agent is 20 in curing agent ~60%.
- 6. low-k FR-4 copper-clad plate epoxy resin according to claim 3, it is characterised in that imidazoles solidify Agent is one kind in 2- phenylimidazoles, 2-ethyl-4-methylimidazole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553835.9A CN107603143A (en) | 2016-07-11 | 2016-07-11 | A kind of copper-clad plate epoxy resin of low-k FR 4 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553835.9A CN107603143A (en) | 2016-07-11 | 2016-07-11 | A kind of copper-clad plate epoxy resin of low-k FR 4 |
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| CN107603143A true CN107603143A (en) | 2018-01-19 |
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| CN201610553835.9A Pending CN107603143A (en) | 2016-07-11 | 2016-07-11 | A kind of copper-clad plate epoxy resin of low-k FR 4 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111087714A (en) * | 2019-11-19 | 2020-05-01 | 苏州亨利通信材料有限公司 | Preparation process of PVC (polyvinyl chloride) cable material for 5G photoelectric hybrid cable |
| CN111253694A (en) * | 2019-11-19 | 2020-06-09 | 苏州亨利通信材料有限公司 | PVC (polyvinyl chloride) cable material for 5G photoelectric hybrid cable |
| CN114103306A (en) * | 2021-11-05 | 2022-03-01 | 江苏耀鸿电子有限公司 | Halogen-free lead-free high-Tg copper-clad plate and processing technology thereof |
-
2016
- 2016-07-11 CN CN201610553835.9A patent/CN107603143A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111087714A (en) * | 2019-11-19 | 2020-05-01 | 苏州亨利通信材料有限公司 | Preparation process of PVC (polyvinyl chloride) cable material for 5G photoelectric hybrid cable |
| CN111253694A (en) * | 2019-11-19 | 2020-06-09 | 苏州亨利通信材料有限公司 | PVC (polyvinyl chloride) cable material for 5G photoelectric hybrid cable |
| CN114103306A (en) * | 2021-11-05 | 2022-03-01 | 江苏耀鸿电子有限公司 | Halogen-free lead-free high-Tg copper-clad plate and processing technology thereof |
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Addressee: Jiangyin's application interface Co. Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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