CN107591373A - Protect ring structure and preparation method thereof - Google Patents
Protect ring structure and preparation method thereof Download PDFInfo
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- CN107591373A CN107591373A CN201610537323.3A CN201610537323A CN107591373A CN 107591373 A CN107591373 A CN 107591373A CN 201610537323 A CN201610537323 A CN 201610537323A CN 107591373 A CN107591373 A CN 107591373A
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Abstract
One kind protection ring structure and preparation method thereof.Wherein, protection ring structure includes：First protection ring is to K protection rings, common K protection ring, and K is more than 2 integer；First protection ring is located at chip perimeter, and the kth protection ring is located on the outside of the protection ring of kth 1；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K；Also include：For first protection ring into K protection rings, each protection ring has at least one opening；In the opening on the different protection rings, at least two are offset from each other.The protective effect of ring structure is protected to improve.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of protection ring structure and preparation method thereof.
Background technology
Integrated circuit is manufactured on silicon chip or other semiconductor material substrates, is then packaged and is tested.
When encapsulation, it is necessary to first integrated circuit is cut (saw).The mechanical force of cutting may cause edge to form small split
Trace, especially close to edge.The slight crack formed may cause it towards the central circuit region promotion of integrated circuit
In circuit region damage., typically can be on an integrated circuit die between electricity in order to protect the circuit region of IC Center
Between road region and its Cutting Road, chip protection ring (seal ring) is configured.Chip protection ring can prevent any slight crack from invading
Enter the circuit region of IC interior, for example, slight crack caused by the stress (stress) when cutting integrated circuit etc..Core
Piece protection ring is generally formed in the Cutting Road (scribe line) of each chip of wafer and the peripheral region of integrated circuit
Between (periphery region).
The protection ring structure of existing chip generally includes two or more closure metal coating ring, such as Fig. 1 institutes
Show, when with two closure metal coating rings, respectively the first protection ring 11 and the second protection ring 12, the second protection ring are located at
The outside of first protection ring 11.First protection ring 11 and the second protection ring 12 can connect with corresponding Semiconductor substrate, with to collection
When being cut into circuit chip, protection ring structure, which can play, reduces plasma damage (Plasma induced
Damage, PID) and reduce electrostatic interference effect.
The content of the invention
The present invention solves the problems, such as to be to provide a kind of new protection ring structure and preparation method thereof, to improve protection ring structure
Protective effect.
To solve the above problems, the present invention provides a kind of protection ring structure, including protection ring combination；The protection ring combination
Including the first protection ring to K protection rings, common K protection ring, K is more than 2 integer；First protection ring is located at chip week
Side, the kth protection ring are located on the outside of the protection ring of kth -1；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to K
Between arbitrary integer；The protection ring combination also includes：First protection ring is into K protection rings, each protection ring tool
There is at least one opening；In the opening on the different protection rings, at least two are offset from each other.
Optionally, the distance between two described openings mutually to stagger are more than or equal to 500 μm.
Optionally, the protection ring combination also includes the connection strap being connected between two neighboring protection ring.
Optionally, there is the company positioned at the opening nearside between the kth protection ring and the protection ring of kth -1
Narrow bars.
Optionally, in the closing structure that the connection strap and the protection ring are formed, at least with being opened described in one
Mouthful.
Optionally, the protection ring combination also includes N bar connection straps, and the connection strap is located at first protection ring and institute
Between stating the second protection ring, first protection ring is divided into N number of first ring segment by the connection strap, by second protection ring
Accordingly it is divided into N number of second ring segment, corresponding second ring segment of first ring segment；Wherein, N be more than 2 it is whole
Number；One first opening, first opening are located in one of first ring segment；One second opening, described second opens
Mouth is located in one of second ring segment, and second opening staggers with the described first opening, and is opened with described first
First ring segment of mouth correspondingly has the second ring segment of the described second opening；The protection ring structure also includes the 3rd opening,
3rd opening is located at first ring segment, and first opening and the described 3rd opening are located at different described first
Ring segment.
Optionally, the protection ring structure includes multiple protection ring combinations, and the different protection ring combinations are not positioned at
With in layer, the protection ring structure also includes：The first contact band of column, the first contact band of column connection two described first up and down
First protection ring described in protection ring or the connection bottom；The second contact band of column, the second contact band of column connection two up and down
Second protection ring described in second protection ring or the connection bottom；M bar connecting poles, the connecting pole connect positioned at described first
Strike the post between ring and the second contact band of column, the described first contact band of column is divided into M the first shell of columns by the connecting pole, will
The second contact band of column is accordingly divided into M the second shell of columns, corresponding second shell of column of first shell of column；Its
In, M is more than 2 integer；One the 4th opening, the 4th opening are located in one of first shell of column；One the 5th
Opening, the 5th opening are located in one of second shell of column；First shell of column and tool with the described 4th opening
There is the second shell of column of the 5th opening corresponding；5th opening staggers with the described 4th opening.
To solve the above problems, present invention also offers a kind of preparation method for protecting ring structure, including：Form protection ring
Combination；Forming protection ring combination includes being formed the first protection ring to K protection rings, common K protection ring, K for more than 2 it is whole
Number；First protection ring is located at chip perimeter, and the kth protection ring is located on the outside of the protection ring of kth -1；When K is equal to 2
When, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K；Formed protection ring combination be additionally included in it is each described
At least one opening is formed on protection ring；And make in the opening being located on the different protection rings, at least two are phases
Mutually stagger.
Optionally, by logical operation, by the opening design in relevant position.
Optionally, the distance between two described openings mutually to stagger are more than or equal to 500 μm.
Optionally, forming the protection ring combination also includes：Connection strap is formed between the adjacent protection ring.
Optionally, by logical operation, the connection strap is designed in relevant position.
Optionally, forming the protection ring combination also includes：Between the kth protection ring and the protection ring of kth -1
The connection strap positioned at the opening nearside is set.
Optionally, forming the protection ring combination also includes：One formed with the protection ring in the connection strap closes
Close in structure, at least form an opening.
Optionally, when K is equal to 2, forming the protection ring combination also includes forming N bar connection straps, the connection strap position
Between first protection ring and second protection ring, first protection ring is divided into N number of first by the connection strap
Ring segment, second protection ring is accordingly divided into N number of second ring segment, corresponding second ring of first ring segment
Section；Wherein, N is more than 2 integer；One first opening, first opening are located in one of first ring segment；One
Second opening, second opening are located in one of second ring segment, and second opening staggers with the described first opening,
And second ring segment of first ring segment with the described first opening correspondingly with the described second opening；The protection ring knot
Structure also includes the 3rd opening, and the 3rd opening is located at first ring segment, and first opening and the described 3rd opening
Positioned at different first ring segments.
Optionally, the preparation method includes forming multiple protection ring combinations, and the different protection ring combinations are located at
Different layers, the preparation method also include：Form the first contact band of column, the first contact band of column connection two layers described the up and down
First protection ring described in one protection ring or the connection bottom；The second contact band of column is formed, the second contact band of column connects
Second protection ring described in lower two layers of second protection ring or the connection bottom；M bar connecting poles are formed, the connecting pole is located at
Between the first contact band of column and the second contact band of column, the described first contact band of column is divided into M by the connecting pole
First shell of column, the described second contact band of column is accordingly divided into M the second shell of columns, first shell of column is corresponded to described in one
Second shell of column；Wherein, M is more than 2 integer；One the 4th opening is formed, the 4th opening is located in one of described the
One shell of column；One the 5th opening is formed, the 5th opening is located in one of second shell of column；5th opening and institute
The 4th opening is stated to stagger；First shell of column with the described 4th opening and the second shell of column pair with the described 5th opening
Should.
Compared with prior art, technical scheme has advantages below：
In technical scheme, there is provided one kind protection ring structure, including the first protection ring are individual to the common K of K protection rings
Protection ring, K are more than 2 integer；First protection ring is located at chip perimeter, and the kth protection ring is located at the kth -1 guarantor
On the outside of retaining ring；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K；Also include：Described first protects
For retaining ring into K protection rings, each protection ring has at least one opening；The opening on the different protection rings
In, at least two are offset from each other.Due to the presence of opening, the becket knot of closure is not present in the periphery of chip area
Structure, now, compared to existing protection ring structure, the protection ring structure can be better protected from noise signal in chip area
The influence of each device, improve the protective effect of protection ring structure.Simultaneously as two existed on different protection rings are mutual
The opening to stagger, it can prevent aqueous vapor and pollutant from carrying out in chip area, ensureing that protection ring structure disclosure satisfy that prevents aqueous vapor
With the design requirement in terms of pollutant.
Further, in the closing structure that the connection strap and the protection ring are formed, at least with being opened described in one
Mouthful.Opening in closing structure being present so that any one complete closure protection ring is not present in whole protection ring structure, therefore,
The noise that now entirely protection ring structure more will not be in capturing ambient, not only the device in chip area be more not susceptible to make an uproar
Induced-current caused by sound influences, and is also more not easy to be influenceed by faradic with the substrate that protection ring structure is connected, and enters
One step improves the protective effect of protection ring structure.
Further, by logical operation, by the opening and connection strap design in relevant position.Pass through logical operation
Mode will be open and connect accordingly post design accordingly protection ring structure in so that opening and connection strap can flexibly adjust
Whole, so as to provide more design spaces to chip designer, and this method is simple and convenient, is advantageous to save the process time
And process costs.
Brief description of the drawings
Fig. 1 is existing protection ring structural representation；
Fig. 2 is the protection ring structural representation that one embodiment of the invention provides；
Fig. 3 is the protection ring structural representation that another embodiment of the present invention provides；
Fig. 4 is the preparation method counter structure schematic diagram for the protection ring structure that another embodiment of the present invention provides；
Fig. 5 is the protection ring structural representation that another embodiment of the present invention provides.
Embodiment
As stated in the Background Art, although traditional protection ring structure can have above-mentioned advantage, because itself and semiconductor serve as a contrast
Bottom connects, and is to be made using metal good conductor again, so the electric noise of substrate can be transmitted near chip by protection ring
Different place, even if apart from far.So, it is necessary to the structure optimization to protection ring so that substrate noise is not easy by guarantor
Retaining ring conducts.The problem of another traditional protection ring is that protection ring surrounds whole chip, when there is magnetic flux change to pass through chip,
Protection ring can induce electric current, and this electric current, which is injected into substrate, can also form substrate electric noise.
That is, the metal ring structure of closure in existing protection ring structure be present.Its design consideration is, in core
, it is necessary to prevent cutting from producing particle and falling in chip internal in piece cutting process, and after follow-up encapsulation, it is necessary to
The waterproof airway dysfunction that can have been played.Therefore, existing protection ring is generally completely enclosed in chip surrounding.
But these closure metal ring structures, equivalent to forming for a kind of antenna for receiving electromagnetic field signal, they are easy
(radio frequency, RF) noise in capturing ambient and produce magnetic energy, magnetic energy can will cause induced-current to be injected into substrate.It is this
Situation is extremely disadvantageous for the analog signal sensitive chip for being closed the encirclement of metal ring structure.
Simultaneously as protection ring is connected to substrate, therefore protection ring inevitably forms a kind of circuit between substrate
Path, this circuit paths cause protection ring noise caused by Semiconductor substrate nearby, easily from a regional spread of chip
To another region, (noise in such as environment is transferred to another from a turning of chip easily by these circuit paths and turned
Angle), so as to which the device sensitive to analog signal interferes, or sensor current signal is easily by protection ring structure injection lining
Bottom, unnecessary signal interference is caused to substrate.
Therefore, the present embodiment provides a kind of new protection ring structure and preparation method thereof.The protection ring structure includes protecting
Retaining ring combines, and the protection ring combination includes the first protection ring and the second protection ring on the outside of the first protection ring.The guarantor
In retaining ring structure, the first protection ring has the first opening, and the second protection ring has the second opening.Because the first opening and second is opened
The presence of mouth, the metal ring structure of closure is not present in the periphery of chip area, now, described compared to existing protection ring structure
Protection ring structure can be better protected from influence of the noise signal to each device in chip area, improve the protection of protection ring structure
Effect.Simultaneously as the first opening and the second opening stagger, it can prevent aqueous vapor and pollutant from carrying out in chip area, so as to
Ensure that protection ring structure disclosure satisfy that the design requirement avoided in terms of aqueous vapor and pollutant.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
One embodiment of the invention provides a kind of protection ring structure, refer to Fig. 2.
As shown in Fig. 2 the protection ring structure combines including protection ring, protection ring combination has the He of the first protection ring 110
Second protection ring 120.First protection ring 110 is located at chip perimeter.Second protection ring 120 is located at the outside of the first protection ring 110.
Please continue to refer to Fig. 2, protection ring structure also includes two connection straps, respectively connection strap 131 and connection strap 132.
Connection strap 131 and connection strap 132 are between the first protection ring 110 and the second protection ring 120.Also, connection strap 131 and connection
First protection ring 110 is divided into two the first ring segments (two the first ring segments do not mark respectively) by bar 132, by the second protection ring
120 are accordingly divided into two the second ring segments (two the second ring segments do not mark respectively).Wherein, corresponding one of first ring segment the
Two ring segments.In the present embodiment, first ring segment is longer, and another first ring segment is shorter, likewise, second ring segment compared with
Long, another second ring segment is shorter, and the first longer ring segment is corresponding with the second longer ring segment, the first shorter ring segment with it is shorter
The second ring segment it is corresponding.
From the foregoing, the first ring segment is corresponding with the second ring segment refers to：It is by identical that first ring segment is located at the second ring segment
Two connection straps mark off what is come, also, they are positioned at the same side of two connection straps.Such as in Fig. 2, the first shorter ring
Section and the second shorter ring segment are respectively positioned on the upside of connection strap 131 and the downside of connection strap 132.
In other embodiments, protection structure can include N bar connection straps, and connection strap is located at the first protection ring 110 and second
Between protection ring 120, the first protection ring 110 is divided into N number of first ring segment by connection strap, and the second protection ring 120 is accordingly divided
Into N number of second ring segment, corresponding second ring segment of first ring segment.Wherein, N is more than 2 integer.
Please continue to refer to Fig. 2, protection ring structure also includes one first opening 140 and one second opening 150.First opens
Mouth 140 is located in one of the first ring segment.Second opening 150 is located in one of the second ring segment.Second opening 150 is opened with first
Mouth 140 staggers, and the first ring segment with the first opening 140 is corresponding with the second ring segment with the second opening 150, this implementation
Example in, have first opening 140 the first ring segment be the first shorter ring segment, have second opening 150 the second ring segment for compared with
The second short ring segment.
In the present embodiment, the second opening 150 and the first the distance between 140 d1 of opening are more than or equal to 500 μm, herein
More than distance, to ensure in the time more than 10 years, any aqueous vapor (moisture) or pollutant (impurity) are not
It can spread and be carried out inside the second protection ring 120 and the second protection ring 120 from the external world, so that it is corresponding to protect ring structure to meet
Protection demand.
In the present embodiment, when the second protection ring 120 is rectangle, the second opening 150 and the first opening the distance between 140
D1 maximums can be the length of side of the wherein a line of the second protection ring 120.Such as when the second protection ring 120 is 25mm × 32mm
Rectangle when, second opening 150 with first be open 140 distance d1 can be with 25mm or 32mm.
In the present embodiment, the width w2 minimums of the openings of width w1 and second 150 of the first opening 140 can be design rule
Distance between the minimum metal allowed.And first opening 140 width w1 and second opening 150 width w2 maximums 1 μm with
Under, so as to prevent aqueous vapor or pollutant from diffusing into the chip area of protection ring inside configuration.
In the present embodiment, the minimum metal that the width w3 minimum values of connection strap can equally be allowed by design rule is wide
Degree.And the width w3 maximums of connection strap are similarly disposed at less than 1 μm, to cause the first protection ring 110 and the second protection ring 120
Between big portion region be insulating regions.
In the present embodiment, the width w4 of the first protection ring 110 may be about 10 μm.And the second protection ring 120 is as fracture
Stopping protection ring, its width w5 may be about 2 μm to 5 μm, so as to both ensure protective effect, meanwhile, saving is taken up space.
In the protection ring structure of the offer of this implementation, including the first protection ring 110 and positioned at the outside of the first protection ring 110
Second protection ring 120.First protection ring 110 has the first opening 140, and the second protection ring 120 has the second opening 150.Due to
The presence of first opening 140 and the second opening 150, the periphery of chip area are not present the metal ring structure of closure, now, compared
In existing protection ring structure, the protection ring structure of the present embodiment can be better protected from noise signal to each device in chip area
Influence, improve it is described protection ring structure protective effect.Simultaneously as the first opening 140 and the second opening 150 stagger, energy
Enough prevent aqueous vapor and pollutant from carrying out each structure in chip area, so as to ensure to protect ring structure disclosure satisfy that to avoid aqueous vapor and
Design requirement in terms of pollutant.
Another embodiment of the present invention provides another protection ring structure, refer to Fig. 3.
As shown in figure 3, the protection ring structure combines including protection ring, protection ring combination has the He of the first protection ring 210
Second protection ring 220.First protection ring 210 is located at chip perimeter.Second protection ring 220 is located at the outside of the first protection ring 210.
Please continue to refer to Fig. 3, protection ring structure also includes three connection straps, respectively connection strap 231, the and of connection strap 232
Connection strap 233.Connection strap 231, connection strap 232 and connection strap 233 are between the first protection ring 210 and the second protection ring 220.
Also, the first protection ring 210 is divided into three the first ring segments (three first by connection strap 231, connection strap 232 and connection strap 233
Ring segment does not mark respectively), the second protection ring 220 accordingly is divided into three the second ring segments, and (three the second ring segments are not marked respectively
Note).Wherein, corresponding second ring segment of first ring segment, such as the first ring segment between connection strap 231 and connection strap 232
The second ring segment between corresponding connection strap 231 and connection strap 232.
In other embodiments, protection structure can include N bar connection straps, and connection strap is located at the first protection ring 210 and second
Between protection ring 220, the first protection ring 210 is divided into N number of first ring segment by connection strap, and the second protection ring 220 is accordingly divided
Into N number of second ring segment, corresponding second ring segment of first ring segment.Wherein, N is more than 2 integer.
Please continue to refer to Fig. 3, protection ring structure also includes one first opening 240 and one second opening 250.First opens
Mouth 240 is located in one of the first ring segment.Second opening 250 is located in one of the second ring segment.Second opening 250 is opened with first
Mouth 240 staggers, and corresponding the second ring segment with the second opening 250 of the first ring segment with the first opening 240.
Please continue to refer to Fig. 3, in the present embodiment, protection ring structure also includes the 3rd opening 261 and the 3rd opening 262, the
Three openings 261 and the 3rd opening 262 be located at the first ring segment, and the first opening 240 is open with two the 3rd and is located at different the
One ring segment.That is, in the present embodiment, in all the first ring segments without the first opening 240, each ring segment has one
Individual 3rd opening.
In the present embodiment, the second opening 250 and the first opening the distance between 240 are more than or equal to 500 μm, refer to
Previous embodiment corresponding contents.
In the present embodiment, the minimum widith of the opening 261 of first the 240, second opening of opening the 250, the 3rd and the 3rd opening 262
Can be by distance between minimum metal that design rule allows, and the Breadth Maximum of the first opening 240 and the second opening 250 can be with
For less than 1 μm, previous embodiment corresponding contents are referred to.
In the present embodiment, the width minimum of connection strap equally can be by minimum metal width that design rule allows.
And the width maximum of connection strap is similarly disposed at less than 1 μm, previous embodiment corresponding contents are referred to.
In the present embodiment, the width of the first protection ring 210 may be about 10 μm.Second protection ring 220 stops as fracture
Protection ring, its width may be about 2 μm to 5 μm, refer to previous embodiment corresponding contents.
In the protection ring structure of the offer of this implementation, including the first protection ring 210 and positioned at the outside of the first protection ring 210
Second protection ring 220.First protection ring 210 has the first opening 240, and the second protection ring 220 has the second opening 250.Due to
The presence of first opening 240 and the second opening 250, the periphery of chip area are not present the metal ring structure of closure, now, compared
In existing protection ring structure, the protection ring structure of the present embodiment can be better protected from noise signal to each device in chip area
Influence, improve protection ring structure protective effect.Simultaneously as the first opening 240 and the second opening 250 stagger, Neng Goufang
Sealing gas and pollutant are carried out in chip area, and aqueous vapor and block contaminant side are prevented so as to ensure to protect ring structure disclosure satisfy that
The design requirement in face.
Further, due to the presence of the 3rd opening 261 and the 3rd opening 262, in the present embodiment, ring structure is entirely protected
In the absence of the becket of any one closure, therefore, the noise that now entirely protection ring structure more will not be in capturing ambient, no
Device only in chip area, which is more not susceptible to induced-current caused by noise, to be influenceed, and the lining being connected with protection ring structure
Bottom is also more not easy to be influenceed by faradic, further improves the protective effect of protection ring structure.Namely, this implementation
The protection ring structure of offer enables to substrate noise to be not easy to conduct by protection ring.Due to the closing structure in the absence of closing,
Protection ring will not produce induced-current, so as to further obviate the electric noise of substrate.
It should be noted that in other embodiments of the invention, protection ring structure can include multiple protection rings and combine, no
It is located at protection ring combination in different layers, now, the protection ring structure also includes：The first contact band of column, the first contact band of column
Two the first protection rings or the connection protection ring of the bottom first above and below connection；The second contact band of column, the second contact band of column connection
Upper and lower two the second protection rings or the connection protection ring of the bottom second；M bar connecting poles, connecting pole positioned at first contact the band of column and
Between the second contact band of column, the first contact band of column is divided into M the first shell of columns by connecting pole, and the second contact band of column is accordingly divided
Into M the second shell of columns, corresponding second shell of column of first shell of column；Wherein, M is more than 2 integer；One the 4th opening,
4th opening is located in one of the first shell of column；One the 5th opening, the 5th opening are located in one of the second shell of column；With
First shell of column of four openings is corresponding with the second shell of column with the 5th opening；5th opening staggers with the 4th opening.Protection ring knot
Structure can also include the 6th opening, and the 6th opening be located at the second shell of column, and the 4th opening and the 6th opening are located at different the
Two shell of columns.
That is, in other embodiments, it can use and be designed with above-mentioned first protection ring and the second protection ring identical
Thinking, contact stud ring is designed, so that the contact band of column similarly has the function that to prevent capturing ambient noise, so as to
Further improve the protective effect of protection ring structure.Wherein, the contact band of column both can be the through hole of protection ring above and below connection
Post (via) or contact plunger post (contact).
Another embodiment of the present invention provides a kind of preparation method for protecting ring structure, incorporated by reference to reference to figure 4.
The preparation method includes：Protection ring combination is formed, protection ring combination has the first protection ring 310 and the second protection
Ring 320.First protection ring 310 is located at chip perimeter.Second protection ring 320 is located at the outside of the first protection ring 310.
Please continue to refer to Fig. 4, form N bar connection straps, connection strap be located at the first protection ring 310 and the second protection ring 320 it
Between, the first protection ring 310 is divided into N number of first ring segment by connection strap, and the second protection ring 320 is accordingly divided into N number of second ring
Section, corresponding second ring segment of first ring segment.Wherein, N is more than 2 integer.Form one first opening, the first opening
It is located in one of the first ring segment.One second opening is formed, the second opening is located in one of the second ring segment.Second opening with
First opening staggers, and corresponding the second ring segment with the second opening of the first ring segment with the first opening.When N is equal to 2,
Made structure is structure shown in Fig. 2, and when N is equal to 3, made structure is structure shown in Fig. 3.
In the present embodiment, preparation method also includes forming the 3rd opening, and the 3rd opening is located at the second ring segment, and first opens
Mouth and the 3rd opening are located at the second different ring segments.
In the present embodiment, connection strap, the first opening, the second opening and the 3rd opening can be designed by logical operation
In relevant position.Specific logical operation expression can be as follows：
Formula one, MARK1_s=MARK1 and (seal ring area)；
Formula two, Mn=(Mn not MARK0) or MARK1_s；
Wherein, MARK0 represents to be used for the layer for making the first opening and the second opening, and MARK 1 represents to be used for making connection strap
Layer.
In said process, formula one is represented by the layer that will make connection strap with making protection ring (including the first protection ring 310
With the second protection ring 320) take union (intersection), so as to prevent connection strap protrude from outside the scope of protection ring (scope it
It is within the first protection ring 310 and beyond the second protection ring 320 outside), and then connection strap is limited to the first protection ring 310 and the
Between two protection rings 320.Formula two represents, to the first protection ring 310 and the second protection ring 320 (to the first protection ring 310 and second
Protection ring 320 is typically constructed of metal, and therefore, is represented with Mn) the first opening and the second opening are set on relevant position, together
When, it is also provided with connection strap.
When N is equal to 3, above-mentioned logical operation process can produce closure becket equivalent to as shown in Figure 4 in script
Structure in add the operation of mark (mark) 340 and the position of mark 350, i.e., can be in mark 340 when concrete technology is realized
Place forms the first opening, and the second opening is formed at mark 350.Likewise, it is respectively formed the 3rd at mark 361 and mark 362
Opening.At mark 331, mark 332 and mark 333, then connection strap is correspondingly formed.By said process, can ultimately form
Protection ring structure as shown in Figure 3, therefore, the protection ring structure that the preparation method of the present embodiment makes to obtain may be referred to Fig. 3
Shown protection ring structure corresponding contents.
It should be noted that in other embodiments, preparation method can include forming multiple protection ring combinations, difference protection
Ring group, which is closed, is located at different layers, and preparation method also includes：Form the first contact band of column, the first two layers first up and down of contact band of column connection
Protection ring or the connection protection ring of the bottom first；Form the second contact band of column, the second two layers second up and down of contact band of column connection
Protection ring or the connection protection ring of the bottom second；M bar connecting poles are formed, connecting pole is positioned at the first contact band of column and the second contact
Between the band of column, the first contact band of column is divided into M the first shell of columns by connecting pole, and the second contact band of column is accordingly divided into M the
Two shell of columns, corresponding second shell of column of first shell of column.Wherein, M is more than 2 integer；Form one the 4th to be open, the 4th
Opening is located in one of the first shell of column；One the 5th opening is formed, the 5th opening is located in one of the second shell of column；5th opens
Mouth staggers with the 4th opening.The first shell of column with the 4th opening is corresponding with the second shell of column with the 5th opening；Preparation method
Also include forming the 6th opening, the 6th opening is located at the second shell of column, and the 4th opening and the 6th opening are located at different second
Shell of column.
When it is the through hole band of column to contact the band of column, the opening of making the 4th, the 5th opening and the 6th are opened on the mistake of relevant position
Journey, equally can simply it be obtained by the way of logical operation.Wherein it is possible to reference to above-mentioned formula one, (attention is needed formula one
In seal ring area replace with via area) and following formula three process
Formula three, Vn=(Vn not MARK0) or (MARK1_s size down to via slot size)；
Formula three represents, to setting the 4th opening, the 5th to open on the first contact band of column and the second contact band of column relevant position
While mouth and the 6th opening, corresponding connecting pole is also provided with.
It will be open accordingly by way of logical operation with connecting pole (connecting pole) design in protection ring structure accordingly
In so that opening and connection strap (connecting pole) can be adjusted flexibly, so as to provide more design spaces to chip designer, and
And this method is simple and convenient, be advantageous to save process time and process costs.Certainly, in other embodiments, can also use
Other methods form protection ring structure provided by the present invention.
Another embodiment of the present invention provides a kind of preparation method for protecting ring structure, incorporated by reference to reference to figure 5.
Fig. 5 is refer to, the protection ring structure includes the protection ring 430 of the first protection ring 410 to the 3rd, totally three protections
Ring.Wherein, the first protection ring 410 is located at chip perimeter, and the second protection ring 420 is on the outside of first protection ring 410, and the 3rd
Protection ring 430 is located at the outside of the second protection ring 420.
It should be noted that in other embodiments, protection ring structure can include the first protection ring to K protection rings, common K
Individual protection ring, K are more than 2 integer.First protection ring is located at chip perimeter, and the kth protection ring is located at the kth -1
On the outside of protection ring；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K.
Please continue to refer to Fig. 5, for first protection ring into K protection rings, the first protection ring 410 has two openings,
Respectively be open V3 and opening V4.Second protection ring 420 has two openings, and be respectively open V2 and opening V5.And the 3rd protects
Retaining ring 430 has an opening V1.And the V2 and opening V3 that is open mutually staggers.And the V1 and opening V2 that is open then can direct phase
Right, certainly, in other embodiments, opening V1 and opening V2 can also mutually stagger, further to prevent aqueous vapor from entering chip region
Domain.
It should be noted that in other embodiments, into K protection rings, each protection ring has first protection ring
At least one opening；In the opening on the different protection rings, at least two are offset from each other.
In the present embodiment, the distance between two described openings mutually to stagger are more than or equal to 500 μm, that is, be open V2
The distance between opening V3 is more than or equal to 500 μm.Reason may be referred to previous embodiment corresponding contents.
In the present embodiment, the protection ring structure also includes the connection strap being connected between two neighboring protection ring.Specifically
, there is connection strap 401 and connection strap 403, the second protection ring 420 and between the 3rd protection ring 430 and the second protection ring 420
There is connection strap 402 and connection strap 404 between one protection ring 410.
In the present embodiment, there is the institute positioned at the opening nearside between the second protection ring 420 and the 3rd protection ring 430
State connection strap.That is, opening V1 nearsides have connection strap 401 and connection strap 403, and opening V2 nearsides have connection strap 401, connection strap
402nd, connection strap 403 and connection strap 404, and the V3 nearsides that are open have connection strap 402 and connection strap 404.
In the present embodiment, opening nearside refers to：The regional extent that distance to opening is 500 μm.Specifically, connection strap
401 and connection strap 403 to opening V1 distance be less than or equal to 500 μm, connection strap 401, connection strap 402, connection strap 403 and connection
Bar 404 arrives opening V2 distance less than or equal to 500 μm, and connection strap 402 and connection strap 404 to opening V3 distance are less than or equal to
500μm.In above-mentioned distance range, each connection strap preferably can prevent aqueous vapor from entering between adjacent guard rings, so as to
The bad phenomenons such as protection ring (peeling) peeling-off with corresponding substrate are prevented, to cause protection ring more muchly to protect
Corresponding chip area.
It is located at it should be noted that having in other embodiments, between the kth protection ring and the protection ring of kth -1
The connection strap of the opening nearside.
In the present embodiment, the presence for the V4 and opening V5 that is open so that form one of the connection strap and the protection ring
In closing structure, at least with an opening.
It should be noted that in other embodiments, in the closing structure that the connection strap is formed with the protection ring,
At least there is an opening.
In the protection ring structure that the present embodiment is provided, due to the presence of opening, closure is not present in the periphery of chip area
Metal ring structure, now, compared to existing protection ring structure, it is described protection ring structure can be better protected from noise signal pair
The influence of each device in chip area, improve the protective effect of protection ring structure.Simultaneously as exist on different protection rings
Two openings mutually to stagger, can prevent aqueous vapor and pollutant from carrying out in chip area, ensure that protection ring structure can expire
Foot avoids the design requirement of aqueous vapor and pollutant method.
Meanwhile in connection strap and a closing structure of protection ring composition, at least with an opening.Closure
Opening in structure be present so that any one complete closure protection ring is not present in whole protection ring structure, therefore, now entirely
The noise that ring structure more will not be in capturing ambient is protected, not only the device in chip area is more not susceptible to caused by noise
Induced-current influences, and is also more not easy to be influenceed by faradic with the substrate that protection ring structure is connected, and further improves
Protect the protective effect of ring structure.
The preparation method that the embodiment of the present invention additionally provides the protection ring structure of previous embodiment, due to the protection ring of formation
Therefore structure is as shown in figure 5, can combine with reference to figure 5 and previous embodiment corresponding contents.
The protection ring 430 of the first protection ring 410 to the 3rd is formed, totally three protection rings.Wherein, the first protection ring 410 is formed
In chip perimeter, the second protection ring 420 is formed in the outside of the first protection ring 410, and the 3rd protection ring 430 is formed to be protected second
The outside of retaining ring 420.
It should be noted that in other embodiments, the preparation method can form the first protection ring to K protection rings,
Common K protection ring, K are more than 2 integer；First protection ring is located at chip perimeter, and the kth protection ring is positioned at described the
On the outside of k-1 protection rings；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K.
Please continue to refer to Fig. 5, first protection ring forms two into K protection rings, in the first protection ring 410 and opened
Mouthful, two openings are formed in the second protection ring 420, an opening is formed in the 3rd protection ring 430.And be open V2 and opening V3
Mutually stagger.
It should be noted that in other embodiments, at least one opening can be formed on each protection ring；And make
In the opening on the different protection rings, at least two are offset from each other.
In the present embodiment, by logical operation, each opening is designed in relevant position, may be referred to previous embodiment phase
Answer content.
In the present embodiment, the distance between two described openings (be open V2 and opening V3) mutually to stagger be more than or
Equal to 500 μm.Its reason may be referred to previous embodiment corresponding contents.
In the present embodiment, the preparation method also includes：Connection strap is formed between the adjacent protection ring.Specially
Connection strap 401 and connection strap 403 are formed between three protection rings 430 and the second protection ring 420, the second protection ring 420 and first is protected
Connection strap 402 and connection strap 404 are formed between retaining ring 410.
In the present embodiment, by logical operation, the connection strap is designed in relevant position.It specifically may be referred to foregoing reality
Apply a corresponding contents.
In other embodiments, it can be opened being set between the kth protection ring and the protection ring of kth -1 positioned at described
The connection strap of mouth nearside.
In the present embodiment, the presence for the V4 and opening V5 that is open so that form one of the connection strap and the protection ring
In closing structure, at least with an opening.
It should be noted that in other embodiments, it is additionally included in one that the connection strap is formed with the protection ring and closes
Close in structure, at least form an opening.
The preparation method that the present embodiment is provided can form corresponding protection ring structure, and technique is simple, particularly
By logical operation, by the opening and connection strap design in relevant position so that opening and connection strap can be adjusted flexibly
Whole, so as to provide more design spaces to chip designer, and this method is simple and convenient, is advantageous to save the process time
And process costs.
Although present disclosure is as above, the present invention is not limited to this.Any those skilled in the art, this is not being departed from
In the spirit and scope of invention, it can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
The scope of restriction is defined.
Claims (16)
1. one kind protection ring structure, including：
Protection ring combines；
Protection ring combination includes the first protection ring to K protection rings, common K protection ring, K for more than 2 integer；Described
One protection ring is located at chip perimeter, and the kth protection ring is located on the outside of the protection ring of kth -1；When K is equal to 2, k is equal to 2；
When K is more than 2, k is 2 to the arbitrary integer between K；
Characterized in that, the protection ring combination also includes：
For first protection ring into K protection rings, each protection ring has at least one opening；Positioned at the different protection rings
On the opening in, at least two are offset from each other.
2. protection ring structure as claimed in claim 1, it is characterised in that the distance between two described openings mutually to stagger
More than or equal to 500 μm.
3. protection ring structure as claimed in claim 2, it is characterised in that the protection ring combination also includes being connected to adjacent two
Connection strap between individual protection ring.
4. protection ring structure as claimed in claim 3, it is characterised in that the kth protection ring and the protection ring of kth -1 it
Between have positioned at it is described opening nearside the connection strap.
5. protection ring structure as claimed in claim 4, it is characterised in that form one of the connection strap and the protection ring
In closing structure, at least with an opening.
6. protection ring structure as claimed in claim 2, it is characterised in that when K is equal to 2, the protection ring combination also includes N
Bar connection strap, the connection strap is between first protection ring and second protection ring, and the connection strap is by described
One protection ring is divided into N number of first ring segment, and second protection ring is accordingly divided into N number of second ring segment, one described first
Corresponding second ring segment of ring segment；Wherein, N is more than 2 integer；One first opening, first opening are located at it
In first ring segment；One second opening, described second, which is open, is located in one of second ring segment, and described second
Opening staggers with the described first opening, and first ring segment with the described first opening is correspondingly with the described second opening
The second ring segment；The protection ring structure also includes the 3rd opening, and the 3rd opening is located at first ring segment, and described
First opening and the described 3rd opening are located at different first ring segments.
7. protection ring structure as claimed in claim 6, it is characterised in that the protection ring structure includes multiple protection rings
Combination, the different protection ring combinations are located in different layers, and the protection ring structure also includes：
The first contact band of column, the first contact band of column are connected described in two first protection rings up and down or the connection bottom
First protection ring；
The second contact band of column, the second contact band of column are connected described in two second protection rings up and down or the connection bottom
Second protection ring；
M bar connecting poles, the connecting pole is between the described first contact band of column and the second contact band of column, the connecting pole
The described first contact band of column is divided into M the first shell of columns, the described second contact band of column is accordingly divided into M the second shell of columns,
Corresponding second shell of column of one first shell of column；
Wherein, M is more than 2 integer；
One the 4th opening, the 4th opening are located in one of first shell of column；
One the 5th opening, the 5th opening are located in one of second shell of column；
First shell of column with the described 4th opening is corresponding with the second shell of column with the described 5th opening；
5th opening staggers with the described 4th opening.
A kind of 8. preparation method for protecting ring structure, it is characterised in that including：
Form protection ring combination；Forming the protection ring combination includes being formed the first protection ring to K protection rings, common K protection
Ring, K are more than 2 integer；First protection ring is located at chip perimeter, and the kth protection ring is located at the protection ring of kth -1
Outside；When K is equal to 2, k is equal to 2；When K is more than 2, k is 2 to the arbitrary integer between K；
Forming the protection ring combination also includes forming at least one opening on each protection ring；And make and be located at different institutes
State in the opening on protection ring, at least two are offset from each other.
9. the preparation method of protection ring structure as claimed in claim 8, it is characterised in that by logical operation, opened described
Mouth design is in relevant position.
10. the preparation method of protection ring structure as claimed in claim 9, it is characterised in that two mutually stagger described open
The distance between mouth is more than or equal to 500 μm.
11. the preparation method of protection ring structure as claimed in claim 10, it is characterised in that form the protection ring combination also
Including：Connection strap is formed between the adjacent protection ring.
12. the preparation method of protection ring structure as claimed in claim 11, it is characterised in that by logical operation, by described in
Connection strap is designed in relevant position.
13. the preparation method of protection ring structure as claimed in claim 12, it is characterised in that form the protection ring combination also
Including：The connection strap positioned at the opening nearside is set between the kth protection ring and the protection ring of kth -1.
14. the preparation method of protection ring structure as claimed in claim 12, it is characterised in that form the protection ring combination also
Including：In the closing structure that the connection strap and the protection ring are formed, an opening is at least formed.
15. the preparation method of protection ring structure as claimed in claim 8, it is characterised in that when K is equal to 2, form the guarantor
Retaining ring combination also include form N bar connection straps, the connection strap between first protection ring and second protection ring,
First protection ring is divided into N number of first ring segment by the connection strap, and second protection ring is accordingly divided into N number of second
Ring segment, corresponding second ring segment of first ring segment；Wherein, N is more than 2 integer；One first opening, institute
State the first opening and be located in one of first ring segment；One second opening, second opening are located in one of described
Second ring segment, second opening stagger with the described first opening, and with first ring segment pair of the described first opening
There should be the second ring segment of the described second opening；The protection ring structure also includes the 3rd opening, and the 3rd opening is located at institute
The first ring segment is stated, and first opening and the described 3rd opening are located at different first ring segments.
16. the preparation method of protection ring structure as claimed in claim 15, it is characterised in that the preparation method includes being formed
Multiple protection ring combinations, the different protection ring combinations are located at different layers, and the preparation method also includes：
The first contact band of column is formed, the first contact band of column connects two layers of first protection ring up and down or the connection bottom
First protection ring；
The second contact band of column is formed, the second contact band of column connects two layers of second protection ring up and down or the connection bottom
Second protection ring；
M bar connecting poles are formed, the connecting pole is between the described first contact band of column and the second contact band of column, the company
Connect post and the described first contact band of column is divided into M the first shell of columns, the described second contact band of column is accordingly divided into M the second posts
Section, corresponding second shell of column of first shell of column；Wherein, M is more than 2 integer；
One the 4th opening is formed, the 4th opening is located in one of first shell of column；
One the 5th opening is formed, the 5th opening is located in one of second shell of column；It is described 5th opening with it is described
4th opening staggers；First shell of column with the described 4th opening is corresponding with the second shell of column with the described 5th opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610537323.3A CN107591373A (en) | 2016-07-08 | 2016-07-08 | Protect ring structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610537323.3A CN107591373A (en) | 2016-07-08 | 2016-07-08 | Protect ring structure and preparation method thereof |
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|---|---|
| CN107591373A true CN107591373A (en) | 2018-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610537323.3A Pending CN107591373A (en) | 2016-07-08 | 2016-07-08 | Protect ring structure and preparation method thereof |
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| CN1519924A (en) * | 2003-02-03 | 2004-08-11 | �����ɷ� | Semiconductor device and its mfg. method |
| CN1542911A (en) * | 2003-04-01 | 2004-11-03 | �����ɷ� | Semiconductor device with guard ring for preventing water from entering circuit region from outside |
| US20090140391A1 (en) * | 2007-11-30 | 2009-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal Ring in Semiconductor Device |
| US20100084751A1 (en) * | 2008-10-03 | 2010-04-08 | Qualcomm Incorporated | Double Broken Seal Ring |
| CN103579199A (en) * | 2012-07-31 | 2014-02-12 | 台湾积体电路制造股份有限公司 | Double seal ring |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1519924A (en) * | 2003-02-03 | 2004-08-11 | �����ɷ� | Semiconductor device and its mfg. method |
| CN1542911A (en) * | 2003-04-01 | 2004-11-03 | �����ɷ� | Semiconductor device with guard ring for preventing water from entering circuit region from outside |
| US20090140391A1 (en) * | 2007-11-30 | 2009-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Seal Ring in Semiconductor Device |
| US20100084751A1 (en) * | 2008-10-03 | 2010-04-08 | Qualcomm Incorporated | Double Broken Seal Ring |
| CN103579199A (en) * | 2012-07-31 | 2014-02-12 | 台湾积体电路制造股份有限公司 | Double seal ring |
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Application publication date: 20180116 |