CN107587138A - A kind of cleaning and conditioning agent for printed circuit board PTH - Google Patents

A kind of cleaning and conditioning agent for printed circuit board PTH Download PDF

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Publication number
CN107587138A
CN107587138A CN201710938435.4A CN201710938435A CN107587138A CN 107587138 A CN107587138 A CN 107587138A CN 201710938435 A CN201710938435 A CN 201710938435A CN 107587138 A CN107587138 A CN 107587138A
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China
Prior art keywords
cleaning
conditioning agent
circuit board
printed circuit
triethanolamine
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CN201710938435.4A
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Chinese (zh)
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不公告发明人
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New Mstar Technology Ltd Of Hunan
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New Mstar Technology Ltd Of Hunan
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Priority to CN201710938435.4A priority Critical patent/CN107587138A/en
Publication of CN107587138A publication Critical patent/CN107587138A/en
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Abstract

The present invention relates to one kind to be used for printed circuit board PTH (Plating Through Hole, hole metallization) cleaning and conditioning agent, and composition includes:10 25% triethanolamine, 5 10% nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n=10), 3 10% coconut oil alkanolamide phosphate ester salt(Detergent 6503), 3 10% dimethyl diallyl ammonium chloride acrylamide-acrylic acid copolymer (polyquaternium 39), remaining is pure water.Dimethyl diallyl ammonium chloride acrylamide-acrylic acid copolymer (polyquaternium 39) cationic compound selected by the present invention stable performance in triethanolamine alkaline medium, not facile hydrolysis, and can stably be coexisted with coconut oil alkanolamide Phosphate Anionic Surfactants.The defects of cleaning and conditioning agent of the present invention overcomes short poor current printed circuit board industry cleaning and conditioning agent alkali resistance, facile hydrolysis, service life, electric charge tuning performance difference.

Description

A kind of cleaning and conditioning agent for printed circuit board PTH
Technical field
The present invention relates to electronic chemical product technical field special in printed circuit board manufacturing, more particularly to print Cleaning and conditioning agent required for circuit board PTH processing procedures.
Background technology
Printed circuit board is also known as printed substrate, is the supporter and the supplier of electrical connection of electronic component.Printing Circuit board can be divided into single sided board, dual platen and multi-layer sheet by its wiring board number of plies.In dual platen and multi-layer sheet, between layers Circuit realize that its is effectively connected by PTH (Plating Through Hole, hole metallization), PTH refers to use chemical plating The hole wall for each layer printed conductor for making to insulate originally with electric plating method plates conductive metal layer, so as to realize circuit reliable connected Technique.In the present age, as multilayer printed circuit board develops to directions such as high density, fine pore, high aperture ratios, PTH Cheng Ying Ring one of core process of printed circuit board quality.In printed circuit board industry, qualified PTH quality requirement coating has well Mechanical tenacity and reliable electric conductivity, coating should uniformly complete and thickness between 5-10 μm, while require base material and coating Between not stratified, bubble-free, without drilling cuttings, flawless, hole resistance is less than 1000 μ Ω etc..
In modern printed circuit board industry, the most frequently used epoxy resin(FR-4), polytetrafluoroethylene (PTFE)(PTFE), polyamides it is sub- Amine(PI)Deng copper-clad base plate when numerical controlled machinery bores conductive hole, the metal bit of rotation causes the conductive hole of aforesaid substrate at a high speed Hole wall have accumulated substantial amounts of negative electrical charge.For in process after guarantee equally in electronegative Pd colloids catalyst Energy efficient sorption in hole Wall, have to carry out hole wall the adjustment of charge polarity in process of production, to ensure PTH mass and electroless copper quality.Mesh Before, in printed circuit board industry, most widely used technical scheme is to use the cleaning and conditioning agent pair containing cation quaternary ammonium salt The adjustment of charge polarity is carried out in electronegative hole wall, e.g., ammonium cation is added in the alkaline medium such as hydramine or sodium hydroxide The surfactants such as salt come realize its clean greasy dirt and electric charge adjustment.But the open defect of existing cleaning and conditioning agent is: In alkaline system, under 40-70 DEG C of condition of work, ammonium cation salt compound is very easy to hydrolysis, so as to cause cleaning and conditioning Agent quick aging is failed.In actual production, this just needs the decoction frequently more renewed so that production cost increase, causes to provide Source wastes.
The content of the invention
It is an object of the invention to:For current printed circuit board industry cleaning and conditioning agent alkali resistance is poor, facile hydrolysis, use The defects of short life, electric charge tuning performance difference, there is provided a kind of cleaning and conditioning agent for printed circuit board PTH, it is particularly suitable In epoxy resin(FR-4), polytetrafluoroethylene (PTFE)(PTFE)And polyimides(PI)Deng copper-clad base plate in the cleaning needed for PTH processing procedures Regulator.
The object of the present invention is achieved like this:A kind of cleaning and conditioning agent for printed circuit board PTH processing procedures, its component It is by weight percentage:Triethanolamine is 10-25%, nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n= 10) it is 5-10%, coconut oil alkanolamide phosphate ester salt(Detergent 6503)For 3-10%, dimethyl diallyl ammonium chloride-the third Acrylamide-acrylic copolymer (polyquaternium -39) is 3-10%, pure water 45-74%.
In the present invention:The weight percent content of described triethanolamine is 10-25%, most preferably 20%.
In the present invention:Described nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n=10) weight Degree is 5-10%, most preferably 6%.
In the present invention:Described coconut oil alkanolamide phosphate ester salt(Detergent 6503)Weight percent content be 3-10%, most preferably 5%.
In the present invention:Described dimethyl diallyl ammonium chloride-acrylamide and acrylic acid copolymer (polyquaternium- 39) weight percent content is 3-10%, most preferably 8%.
In the present invention:Described pure water is deionized water, and the weight percent content of pure water is 45-74%.
The advantage of the invention is that:Dimethyl diallyl ammonium chloride-acrylamide and acrylic acid preferred for this invention is common Polymers (polyquaternium -39), the ternary polymerization quaternary ammonium salt high-molecular compound, its positive charge density is high, in the alkali of triethanolamine Property medium in not facile hydrolysis, can stablize with selected coconut oil alkanolamide phosphate ester salt anion surfactant and coexist; Anion surface active coconut oil alkanolamide phosphate ester salt have it is excellent emulsify, disperse and wettability, be particularly conducive to this All kinds of small conductive through holes of printed circuit board are penetrated into the described cleaning and conditioning agent infiltration of invention, and make the absorption of its hole wall certain The positive charge of amount, so as to be advantageous to the absorption of colloid palladium, electroless copper activity is improved, improves hole copper backlight level;Institute of the present invention Preferable nonionic surfactant nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n=10) and it is two terminal modified Alkyl, the existing very strong oil-wet dirty removal capacities of the nonionic surfactant, has good suds antifoam performance again;The present invention Described printed circuit board PTH cleaning and conditioning agent use range is wide, available for epoxy resin(FR-4), polytetrafluoroethylene (PTFE) (PTFE)And polyimides(PI)Deng the cleaning and conditioning of the printed circuit board of base material;The cleaning and conditioning agent of the present invention is at 40-70 DEG C Use condition under, polyquaternium cationic and Phosphate Anionic Surfactants in system can coexist in three steadily in the long term In monoethanolamine alkaline system, this greatly solve current printed circuit board cleaning and conditioning agent facile hydrolysis, alkali resistance it is poor, using the longevity The defects of ordering short, electric charge tuning performance difference.
Dimethyl diallyl ammonium chloride-acrylamide and acrylic acid copolymer that cleaning and conditioning agent of the present invention is selected (polyquaternium -39) is a kind of high ternary polymerization quarternary ammonium salt compound of positive charge density, in pH value 8-13 alkaline medium Stable performance, not facile hydrolysis, and stably being coexisted with anion surfactant, particularly useful for making printed circuit board PTH Cleaning and conditioning agent.
Published Patents, a kind of wiring board pore wall charge adjustment of Chinese Patent Application No. 200910109138.4 Agent, disclose a kind of formula of pore wall charge regulating agent for circuit board:8.5%-14.5% triethanolamine, the 16 of 0.6%-9.5% Alkyl ammomium chloride, 0.3-0.6% NP-9,0.55%-0.1% sodium chloride, remaining composition are then clear water.
Published Patents, a kind of Teflon substrate circuit board hole wall of Chinese Patent Application No. 200910108825.4 Inorganic agent, a kind of hole wall processing agent for teflon substrate circuit board is disclosed, its composition includes by weight:Dimethylformamide 98.7%, OP-10 dosage 0.5%, polyvinyl chloride Polypropylene copolymer resin 0.8%, remaining is pure water.
Published Patents, Chinese Patent Application No. 201210269802.3 is a kind of to be used for high-frequency circuit board chemical plating Copper pretreatment solution, its component and percentage by weight composition:Organic amine 5-20%, phosphoesterase 30 .5-10%, cation surface activating Agent 0.5-5%, surfactant 0.5-3%, fatty alcohol 0.5-2%, remaining is pure water.
Cleaning and conditioning agent still suffers from cation easily hydrolysis in the related published patent application scheme of the above, and alkali resistance is poor, Service life is short, the defects of electric charge tuning performance difference.
Brief description of the drawings
Fig. 1 is embodiments of the invention, comparative example 1, comparative example 2, the perseverance of 3 four kinds of 60-65 DEG C of cleaning and conditioning agent of comparative example Tepidarium;
Fig. 2 is electroless copper series medicament needed for printed circuit board backlight experiment involved in the present invention;
Fig. 3 is the model that present invention experiment through hole radius-thickness ratio used is 8,10;
Fig. 4 is that the backlight through cleaning and conditioning agent of the present invention production is 10 grades of hole copper gold as photo.
Embodiment
With reference to embodiment, the invention will be further described, but the implementation of the present invention is not limited to this.
The present invention proposes a kind of cleaning and conditioning agent for PTH, is made up of following components:
Triethanolamine is 10-25%, most preferably 20%;Nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n= 10) it is 5-10%, most preferably 6%;Coconut oil alkanolamide phosphate ester salt(Detergent 6503)For 3-10%, most preferably 5%;Two Methyl diallyl ammonium chloride-acrylamide and acrylic acid copolymer (polyquaternium -39) is 3-10%, most preferably 8%;Pure water 45-74%。
Embodiment:According to the optimum proportioning of the present invention, 20 parts of weight are sealed than triethanolamine, 6 parts of weight than nonyl butyl Hold APEO (C9H19O(C2H4O)nC4H10, n=10), 5 parts of weight are than coconut oil alkanolamide phosphate ester salt(Detergent 6503), 8 parts of weight are than dimethyl diallyl ammonium chloride-acrylamide and acrylic acid copolymer (polyquaternium -39) and 61 parts Weight is sufficiently stirred than deionized water, and a kind of cleaning for printed circuit board PTH for producing most ratio of greater inequality of the present invention is adjusted Whole dose.
Comparative example 1:It is open according to a kind of 200910109138.4 pore wall charge regulating agent for circuit board of Chinese Patent Application No. 11.5 parts of weight are compared cetyl chloride by a kind of pore wall charge regulating agent for circuit board formula than triethanolamine, 0.8 part of weight Ammonium, 0.5 part of weight are fully stirred than NP-9,0.8 part of weight than sodium chloride and 86.4 parts of weight ratio deionized waters according to collocation method Mix the pore wall charge regulating agent for circuit board for producing the described most ratio of greater inequality of its invention.
Comparative example 2:According to a kind of Teflon substrate circuit board hole wall processing of Chinese Patent Application No. 200910108825.4 Agent, by 98.7 parts of weight than dimethylformamide, 0.5 part of weight is than OP-10, and 0.8 part of weight is than polyvinyl chloride Polypropylene copolymer Resin is sufficiently stirred a kind of hole wall processing agent for teflon substrate circuit board for producing its invention embodiment most ratio of greater inequality.
Comparative example 3:Before being used for high-frequency circuit board electroless copper according to Chinese Patent Application No. 201210269802.3 is a kind of Processing solution, by 18 parts of weight than triethanolamine, 3 parts of weight are than TXP-7,2.5 parts of weight season more poly- than cationic surfactant Ammonium salt -7(AP-500), 0.5 part of weight is than TX-10, and 1.2 parts of weight are than n-butanol and 74.8 parts of weight ratio pure water, according to configuration One kind that method produces the most ratio of greater inequality described in its inventive embodiments 6 is used for high-frequency circuit board electroless copper pretreatment solution.
It is according to the printed circuit board electroless copper backlight experiment known to colleague technical staff and examination criteria below (《Thickness wishes general 10 grades of standard series tables of row》), adjusted by the cleaning of the polytetrafluoroethylene (PTFE) printed circuit board to 2 sections of difference radius-thickness ratios Whole experiment, to embodiments of the invention, comparative example 1, comparative example 2, comparative example 3, its performance difference of parallel contrast test.Need It is bright, in whole experimental period, embodiment and the equal constant temperature of comparative example liquid medicine in 60-65 DEG C of water bath, embodiment with All comparative examples no longer add new decoction, only maintain the liquid level of each cleaning and conditioning agent constant by adding deionized water.
Explanation:
1. through hole radius-thickness ratio 8, refer to the polytetrafluoroethylene (PTFE) printed circuit board of selection, thickness of slab 2.0mm, bore dia 0.25mm;
2. through hole radius-thickness ratio 10, refer to the polytetrafluoroethylene (PTFE) printed circuit board of selection, thickness of slab 2.5mm, bore dia 0.25mm;
3. in table 1-6,5 continuous sample holes that every group of experiment have chosen above-mentioned base material carry out backlight test, involved sample panel Material, sample well, backlight experiment are tested according to printed circuit board industry electroless copper plating backlight and carried out;
4. the criterion reference of backlight level《Thickness wishes general 10 grades of standard series tables of row》, it requires circuit-board industry backlight etc. Level have to be larger than 8 grades.
The embodiment of table 1 and the 1st day backlight experimental data of comparative example
The embodiment of table 2 and the 2nd day backlight experimental data of comparative example
The embodiment of table 3 and the 3rd day backlight experimental data of comparative example
The embodiment of table 4 and the 5th day backlight experimental data of comparative example
The embodiment of table 5 and the 8th day backlight experimental data of comparative example
The embodiment of table 6 and the 10th day backlight experimental data of comparative example
Embodiment, comparative example 1, comparative example 2, the comparative example described in this patent are can be seen that from upper table 1, table 2, table 3 3 four kinds of cleaning and conditioning agent are all higher than 9.0 grades, all table in first three day that its new preparation uses, printed circuit plate hole copper backlight level Reveal good cleaning and conditioning;As can be seen from Table 4,5 days carried out in experiment, difference starts to show, described in this patent Embodiment its hole copper backlight level still greater than 9.5 grades, comparative example starts the phenomenon that backlight level is less than 8.0 grades occur;From table 5 In as can be seen that 8 days carried out in experiment, embodiment its hole copper backlight level described in this patent is still greater than 9.3 grades, comparative example All backlight level of cleaning and conditioning agent be respectively less than 8.0 grades;As can be seen from Table 6, at the 10th day of experiment, this patent institute The embodiment hole copper backlight level stated remains to be more than 9.0 grades, and 3 comparative example hole copper backlight levels are all 5.0 or so, all It is unable to reach the industry requirement that backlight level is more than 8.0.

Claims (6)

1. a kind of cleaning and conditioning agent for printed circuit board PTH processing procedures, its component are by weight percentage:Triethanolamine 10-25%, nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n=10) and 5-10%, coconut oil alkanolamide phosphorus Acid esters salt(Detergent 6503)3-10%, dimethyl diallyl ammonium chloride-acrylamide and acrylic acid copolymer (polyquaternium- 39) 3-10%, pure water 45-74%.
2. cleaning and conditioning agent according to claim 1, the weight percent content of triethanolamine is 10-25%, it is most preferably 20%。
3. cleaning and conditioning agent according to claim 1, nonyl butyl end-capping APEO (C9H19O(C2H4O)nC4H10, n =10) weight percent content is 5-10%, most preferably 6%.
4. cleaning and conditioning agent according to claim 1, coconut oil alkanolamide phosphate ester salt(Detergent 6503)Weight Degree is 3-10%, most preferably 5%.
5. cleaning and conditioning agent according to claim 1, dimethyl diallyl ammonium chloride-acrylamide and acrylic acid copolymerization The weight percent content of thing (polyquaternium -39) is 3-10%, most preferably 8%.
6. cleaning and conditioning agent according to claim 1, the weight percent content of pure water is 45-74%.
CN201710938435.4A 2017-10-11 2017-10-11 A kind of cleaning and conditioning agent for printed circuit board PTH Pending CN107587138A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114196484A (en) * 2021-11-17 2022-03-18 广东世运电路科技股份有限公司 Pore-finishing agent for manufacturing printed circuit board
CN114845471A (en) * 2022-07-04 2022-08-02 深圳市板明科技股份有限公司 Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof
CN115029749A (en) * 2022-06-01 2022-09-09 南通赛可特电子有限公司 Alkaline pore-finishing agent and application thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114196484A (en) * 2021-11-17 2022-03-18 广东世运电路科技股份有限公司 Pore-finishing agent for manufacturing printed circuit board
CN114196484B (en) * 2021-11-17 2023-09-29 广东世运电路科技股份有限公司 Hole-forming agent for manufacturing printed circuit board
CN115029749A (en) * 2022-06-01 2022-09-09 南通赛可特电子有限公司 Alkaline pore-finishing agent and application thereof
CN114845471A (en) * 2022-07-04 2022-08-02 深圳市板明科技股份有限公司 Oil removing and hole finishing method for PTH (plated through hole) process of printed circuit board, alkaline oil removing and hole finishing agent and preparation method thereof

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