CN107573690A - A kind of heat sink material formula of computer display and preparation method thereof - Google Patents
A kind of heat sink material formula of computer display and preparation method thereof Download PDFInfo
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- CN107573690A CN107573690A CN201710838748.2A CN201710838748A CN107573690A CN 107573690 A CN107573690 A CN 107573690A CN 201710838748 A CN201710838748 A CN 201710838748A CN 107573690 A CN107573690 A CN 107573690A
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Abstract
The invention discloses heat sink material formula of a kind of computer display and preparation method thereof, is made up of according to parts by weight the following raw material：20 30 parts of dimethicone,15 25 parts of silica gel,20 30 parts of methacrylic acid,10 20 parts of epoxy resin,10 15 parts of ethyl acrylate,5 10 parts of carbon fiber,10 20 parts of polyamide,20 25 parts of water-soluble silicate,68 parts of paraffin,35 parts of thickener,Pass through crushing,High thermal high is qualitative and decompression is annealed and the addition of adjuvant,The heat-conducting silicone grease of finished product is obtained by steps such as low temperature precipitations again,With the good capacity of heat transmission,Timely the heat between space can be conducted,With good cooling system,So that the temperature of pyrogen is maintained in stable scope,Also it is avoided that generation greasy dirt,But also it can prevent the volatile ingredient in heat sink material from volatilizing,In the application of reality,Conductive capability can also be reduced while can ensureing with good heat conductive ability,With preferable insulating capacity.
Description
Technical field
The present invention relates to heat sink material technical field, the heat sink material formula of specially a kind of computer display and its
Preparation method.
Background technology
With the popularization of electronic product and the development of electronic product, the developing direction of electronic product in miniaturization and
Integrated direction is developed, and with the miniaturization of modern electronic product and integrated, and its heat dissipation problem is also just into main
Problem.Radiate with heat conduction application, even very bright and clean two planes in surface can all have space to go out when contacting with each other
Existing, the air in these spaces is the non-conductor of heat, can hinder conduction of the heat to fin.And in computer display
Using this phenomenon, it is necessary to develops the mesh that a kind of material filling plays heat-conducting medium between with regard to more obvious
's.
Existing Heat Conduction Material is in the field of business to be roughly divided into four kinds：Native graphite, electrographite, graphite are dilute and CNT dissipates
Hot material.The scattered price of native graphite is very cheap, but radiating effect is undesirable.The dilute good heat dissipation effect of graphite, but it is too expensive,
But if directly carrying out heat conduction, radiating between electronic product using material attachments such as graphite, powdered graphite can drop to electricity
Inside sub- product, cause electronic product short-circuit, and there is manufacturing process complexity, its application surface for heat conduction ester in general sense
The problem of narrow, particularly raw material be readily volatilized to form greasy dirt and dry.
The content of the invention
To achieve the above object, the present invention provides following technical scheme：A kind of heat sink material of computer display is matched somebody with somebody
Side, is made up of according to parts by weight the following raw material：
Dimethicone 20-30 parts, silica gel 15-25 parts, methacrylic acid 20-30 parts, epoxy resin 10-20 parts, propylene
Acetoacetic ester 10-15 parts, carbon fiber 5-10 parts, polyamide 10-20 parts, water-soluble silicate 20-25 parts, paraffin 6-8 parts, thickener
3-5 parts.
It is preferably according to above-mentioned technical proposal, is made up of according to parts by weight the following raw material：
25 parts of dimethicone, 20 parts of silica gel, 25 parts of methacrylic acid, 15 parts of epoxy resin, 13 parts of ethyl acrylate, carbon
7 parts of fiber, 15 parts of polyamide, 23 parts of water-soluble silicate, 7 parts of paraffin, 4 parts of thickener.
It is preferably according to above-mentioned technical proposal, the epoxy resin uses epoxide number as 0.38-0.54mol/100g's
Epoxy resin.
It is preferably according to above-mentioned technical proposal, the thickener uses NPAM type polyacrylamides.
In addition, present invention also offers a kind of heat sink material preparation method of computer display, comprise the following steps：
(1) dimethicone, silica gel, methacrylic acid, epoxy resin and ethyl acrylate are mixed according to formula rate
Crushed after uniformly by pulverizer, until raw material turn into slurry, obtain mixed serum；
(2) take carbon fiber according to formula rate, and by carbon fiber crush it is broken after form powder and cross 100 mesh sieves and obtain
Powder carbon fiber；
(3) obtained powder carbon fiber in obtained mixed serum in step (1) and step (2) is mixed, and filled
Compound is put into Sealing furnace that to carry out high thermal high qualitative until well mixed by point stirring after well mixed, then through over-subtraction
Pressure annealing obtains solidifying filler；
(4) obtained solidification charges in step (3) are taken out, and sufficiently crushed by pulverizer, after crushing
60-80 mesh sieves are crossed, polyamide is added thereto according still further to ratio and water-soluble silicate is stirred mixing, in the process of mixing
In be warming up to 60-80 DEG C, then add paraffin according to formula rate thereto and be stirred, until paraffin turns into liquid and mixed
Uniformly, finally thickener proportionally added to obtain heat-conducting silicone grease；
(5) heat-conducting silicone grease by above-mentioned steps processing is put into refrigeration 30-60min in -5-0 DEG C of refrigerator-freezer to can obtain
Finished product heat-conducting silicone grease.
It is preferably according to above-mentioned technical proposal, in step (3), high thermal high is qualitative and depressurizes the specific behaviour of annealing
It is as method：Including increasing temperature and pressure stage, constant temperature and pressure stage, constant temperature decompression phase and decrease temperature and pressure stage, the heating rises
Pressure phase temperature rises to 140-180 DEG C by normal pressure, and average heating rate is 5 DEG C/min, and pressure rises to 2.0-3.0Mpa by normal pressure,
Average rate of pressure rise is 0.2Mpa/min；The constant temperature and pressure stage holding temperature is at 140-180 DEG C, and pressure is in 2.0-
3.0Mpa, and the duration is 2.0-3.0h；The constant temperature decompression phase maintains temperature constant at 140-180 DEG C, pressure by
2.0-3.0Mpa reduces to 1.5-2.0Mpa；The decompression annealing stage pressure is down to normal pressure by 1.5-2.0Mpa, average decompression speed
Rate is 0.4Mpa/min, and temperature is down to normal temperature by 140-180 DEG C, and average rate of temperature fall is 10 DEG C/min.
Compared with prior art, the beneficial effects of the invention are as follows：
(1) present invention is using dimethicone, silica gel and methacrylic acid as main raw material, is further advanced by heating
The ester shape thing that decompression and grinding and concentration thickening power are formed, for filling the space between pyrogen and fin, energy
It is enough timely to conduct the heat between space, there is good cooling system so that the temperature of pyrogen maintains
In stable scope, prevent from damaging caused by radiating is bad；
(2) acted on by the cooling precipitation in preparation process, the paraffin inside mixing material and water-soluble silica gel are saltoutd
Go out and form film on surface, the internal material such as dimethicone for easily producing oil stain can be coated on inside, avoid producing
Greasy dirt, but also can prevent the volatile ingredient in heat sink material from volatilizing；
(3) preparation technology of the present invention is simple, and cost is low, and the limit of tolerable temperature is wider, and applicable surface is big, and in reality
In the application on border, conductive capability can also be reduced while can ensureing with good heat conductive ability, there is preferably insulation energy
Power.
Brief description of the drawings
Fig. 1 is preparation method schematic flow sheet of the present invention；
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Embodiment 1
A kind of heat sink material formula of computer display, it is made up of according to parts by weight the following raw material：
20 parts of dimethicone, 15 parts of silica gel, 20 parts of methacrylic acid, 10 parts of epoxy resin, 10 parts of ethyl acrylate, carbon
5 parts of fiber, 10 parts of polyamide, 20 parts of water-soluble silicate, 6 parts of paraffin, 3 parts of thickener.
Preferably, the epoxy resin uses epoxy resin of the epoxide number for 0.38mol/100g；The thickener is adopted
With NPAM type polyacrylamides.
In addition, present invention also offers a kind of heat sink material preparation method of computer display, comprise the following steps：
(1) dimethicone, silica gel, methacrylic acid, epoxy resin and ethyl acrylate are mixed according to formula rate
Crushed after uniformly by pulverizer, until raw material turn into slurry, obtain mixed serum；
(2) take carbon fiber according to formula rate, and by carbon fiber crush it is broken after form powder and cross 100 mesh sieves and obtain
Powder carbon fiber；
(3) obtained powder carbon fiber in obtained mixed serum in step (1) and step (2) is mixed, and filled
Compound is put into Sealing furnace that to carry out high thermal high qualitative until well mixed by point stirring after well mixed, then through over-subtraction
Pressure annealing obtains solidifying filler, and high thermal high is qualitative and the concrete operation method of decompression annealing is：Including increasing temperature and pressure rank
Section, constant temperature and pressure stage, constant temperature decompression phase and decrease temperature and pressure stage, the increasing temperature and pressure phase temperature rise to 140- by normal pressure
180 DEG C, average heating rate is 5 DEG C/min, and pressure rises to 2.0-3.0Mpa by normal pressure, and average rate of pressure rise is 0.2Mpa/
min；The constant temperature and pressure stage holding temperature is at 140-180 DEG C, and pressure is in 2.0-3.0Mpa, and the duration is 2.0-
3.0h；The constant temperature decompression phase maintenance temperature is constant at 140-180 DEG C, and pressure reduces to 1.5-2.0Mpa by 2.0-3.0Mpa；
The decompression annealing stage pressure is down to normal pressure by 1.5-2.0Mpa, and average rate of pressure reduction is 0.4Mpa/min, and temperature is by 140-
180 DEG C are down to normal temperature, and average rate of temperature fall is 10 DEG C/min；
(4) obtained solidification charges in step (3) are taken out, and sufficiently crushed by pulverizer, after crushing
60-80 mesh sieves are crossed, polyamide is added thereto according still further to ratio and water-soluble silicate is stirred mixing, in the process of mixing
In be warming up to 60-80 DEG C, then add paraffin according to formula rate thereto and be stirred, until paraffin turns into liquid and mixed
Uniformly, finally thickener proportionally added to obtain heat-conducting silicone grease；
(5) heat-conducting silicone grease by above-mentioned steps processing is put into refrigeration 30-60min in -5-0 DEG C of refrigerator-freezer to can obtain
Finished product heat-conducting silicone grease.
Embodiment 2
A kind of heat sink material formula of computer display, it is made up of according to parts by weight the following raw material：
25 parts of dimethicone, 20 parts of silica gel, 25 parts of methacrylic acid, 15 parts of epoxy resin, 13 parts of ethyl acrylate, carbon
7 parts of fiber, 15 parts of polyamide, 23 parts of water-soluble silicate, 7 parts of paraffin, 4 parts of thickener.
Preferably, the epoxy resin uses epoxy resin of the epoxide number for 0.46mol/100g；The thickener is adopted
With NPAM type polyacrylamides.
In addition, present invention also offers a kind of heat sink material preparation method of computer display, comprise the following steps：
(1) dimethicone, silica gel, methacrylic acid, epoxy resin and ethyl acrylate are mixed according to formula rate
Crushed after uniformly by pulverizer, until raw material turn into slurry, obtain mixed serum；
(2) take carbon fiber according to formula rate, and by carbon fiber crush it is broken after form powder and cross 100 mesh sieves and obtain
Powder carbon fiber；
(3) obtained powder carbon fiber in obtained mixed serum in step (1) and step (2) is mixed, and filled
Compound is put into Sealing furnace that to carry out high thermal high qualitative until well mixed by point stirring after well mixed, then through over-subtraction
Pressure annealing obtains solidifying filler, and high thermal high is qualitative and the concrete operation method of decompression annealing is：Including increasing temperature and pressure rank
Section, constant temperature and pressure stage, constant temperature decompression phase and decrease temperature and pressure stage, the increasing temperature and pressure phase temperature rise to 140- by normal pressure
180 DEG C, average heating rate is 5 DEG C/min, and pressure rises to 2.0-3.0Mpa by normal pressure, and average rate of pressure rise is 0.2Mpa/
min；The constant temperature and pressure stage holding temperature is at 140-180 DEG C, and pressure is in 2.0-3.0Mpa, and the duration is 2.0-
3.0h；The constant temperature decompression phase maintenance temperature is constant at 140-180 DEG C, and pressure reduces to 1.5-2.0Mpa by 2.0-3.0Mpa；
The decompression annealing stage pressure is down to normal pressure by 1.5-2.0Mpa, and average rate of pressure reduction is 0.4Mpa/min, and temperature is by 140-
180 DEG C are down to normal temperature, and average rate of temperature fall is 10 DEG C/min；
(4) obtained solidification charges in step (3) are taken out, and sufficiently crushed by pulverizer, after crushing
60-80 mesh sieves are crossed, polyamide is added thereto according still further to ratio and water-soluble silicate is stirred mixing, in the process of mixing
In be warming up to 60-80 DEG C, then add paraffin according to formula rate thereto and be stirred, until paraffin turns into liquid and mixed
Uniformly, finally thickener proportionally added to obtain heat-conducting silicone grease；
(5) heat-conducting silicone grease by above-mentioned steps processing is put into refrigeration 30-60min in -5-0 DEG C of refrigerator-freezer to can obtain
Finished product heat-conducting silicone grease.
Embodiment 3
A kind of heat sink material formula of computer display, it is made up of according to parts by weight the following raw material：
30 parts of dimethicone, 25 parts of silica gel, 30 parts of methacrylic acid, 20 parts of epoxy resin, 15 parts of ethyl acrylate, carbon
10 parts of fiber, 20 parts of polyamide, 25 parts of water-soluble silicate, 8 parts of paraffin, 5 parts of thickener.
Preferably, the epoxy resin uses epoxy resin of the epoxide number for 0.54mol/100g；The thickener is adopted
With NPAM type polyacrylamides.
In addition, present invention also offers a kind of heat sink material preparation method of computer display, comprise the following steps：
(1) dimethicone, silica gel, methacrylic acid, epoxy resin and ethyl acrylate are mixed according to formula rate
Crushed after uniformly by pulverizer, until raw material turn into slurry, obtain mixed serum；
(2) take carbon fiber according to formula rate, and by carbon fiber crush it is broken after form powder and cross 100 mesh sieves and obtain
Powder carbon fiber；
(3) obtained powder carbon fiber in obtained mixed serum in step (1) and step (2) is mixed, and filled
Compound is put into Sealing furnace that to carry out high thermal high qualitative until well mixed by point stirring after well mixed, then through over-subtraction
Pressure annealing obtains solidifying filler, and high thermal high is qualitative and the concrete operation method of decompression annealing is：Including increasing temperature and pressure rank
Section, constant temperature and pressure stage, constant temperature decompression phase and decrease temperature and pressure stage, the increasing temperature and pressure phase temperature rise to 140- by normal pressure
180 DEG C, average heating rate is 5 DEG C/min, and pressure rises to 2.0-3.0Mpa by normal pressure, and average rate of pressure rise is 0.2Mpa/
min；The constant temperature and pressure stage holding temperature is at 140-180 DEG C, and pressure is in 2.0-3.0Mpa, and the duration is 2.0-
3.0h；The constant temperature decompression phase maintenance temperature is constant at 140-180 DEG C, and pressure reduces to 1.5-2.0Mpa by 2.0-3.0Mpa；
The decompression annealing stage pressure is down to normal pressure by 1.5-2.0Mpa, and average rate of pressure reduction is 0.4Mpa/min, and temperature is by 140-
180 DEG C are down to normal temperature, and average rate of temperature fall is 10 DEG C/min；
(4) obtained solidification charges in step (3) are taken out, and sufficiently crushed by pulverizer, after crushing
60-80 mesh sieves are crossed, polyamide is added thereto according still further to ratio and water-soluble silicate is stirred mixing, in the process of mixing
In be warming up to 60-80 DEG C, then add paraffin according to formula rate thereto and be stirred, until paraffin turns into liquid and mixed
Uniformly, finally thickener proportionally added to obtain heat-conducting silicone grease；
(5) heat-conducting silicone grease by above-mentioned steps processing is put into refrigeration 30-60min in -5-0 DEG C of refrigerator-freezer to can obtain
Finished product heat-conducting silicone grease.
The present invention is tested for the performance of the heat sink material of obtained computer display using following method：
Method of testing：Choose above-mentioned according to preparation method obtained three samples in different embodiments, record respectively
For embodiment 1, embodiment 2, embodiment 3, then the heat sink material of the computer display prepared using common method is taken to make
For comparative sample, its properties is tested, including thermal conductivity factor (W/ (mK)), heat storage coefficient (W/ (m2K it is)), resistance to
The limiting temperature (DEG C) and dielectric constant (F/m) received, test result is as follows：
| Thermal conductivity factor | Heat storage coefficient | The limiting temperature of tolerance | Dielectric constant | |
| Comparative sample | 2.8 | 0.48 | -20-+180 | 2.8 |
| Embodiment 1 | 5.2 | 1.10 | -50-+230 | 2.2 |
| Embodiment 2 | 4.6 | 0.86 | -46-+240 | 2.0 |
| Embodiment 3 | 4.8 | 0.92 | -42-+220 | 1.8 |
Test result：As can be seen that the radiating of computer display disclosed by the invention from the test of upper several samples
Thermal conductivity factor, heat storage coefficient, the limiting temperature of tolerance and the dielectric constant of material are all greatly improved, and simply the present invention is real for this
Parameter testing result important selected in example is applied, is not restricted to the improvement of other performance parameters of correlation of the invention.
In summary, the advantage of the invention is that：
(1) present invention is using dimethicone, silica gel and methacrylic acid as main raw material, is further advanced by heating
The ester shape thing that decompression and grinding and concentration thickening power are formed, for filling the space between pyrogen and fin, energy
It is enough timely to conduct the heat between space, there is good cooling system so that the temperature of pyrogen maintains
In stable scope, prevent from damaging caused by radiating is bad；
(2) acted on by the cooling precipitation in preparation process, the paraffin inside mixing material and water-soluble silica gel are saltoutd
Go out and form film on surface, the internal material such as dimethicone for easily producing oil stain can be coated on inside, avoid producing
Greasy dirt, but also can prevent the volatile ingredient in heat sink material from volatilizing；
(3) preparation technology of the present invention is simple, and cost is low, and the limit of tolerable temperature is wider, and applicable surface is big, and in reality
In the application on border, conductive capability can also be reduced while can ensureing with good heat conductive ability, there is preferably insulation energy
Power.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Claims (6)
1. the heat sink material formula of a kind of computer display, it is characterised in that be made up of according to parts by weight the following raw material：
Dimethicone 20-30 parts, silica gel 15-25 parts, methacrylic acid 20-30 parts, epoxy resin 10-20 parts, acrylic acid second
Ester 10-15 parts, carbon fiber 5-10 parts, polyamide 10-20 parts, water-soluble silicate 20-25 parts, paraffin 6-8 parts, thickener 3-5
Part.
2. the heat sink material formula of a kind of computer display according to claim 1, it is characterised in that according to weight
Number is made up of the following raw material：
25 parts of dimethicone, 20 parts of silica gel, 25 parts of methacrylic acid, 15 parts of epoxy resin, 13 parts of ethyl acrylate, carbon fiber
7 parts, 15 parts of polyamide, 23 parts of water-soluble silicate, 7 parts of paraffin, 4 parts of thickener.
A kind of 3. heat sink material formula of computer display according to claim 1, it is characterised in that the epoxy
Resin uses epoxy resin of the epoxide number for 0.38-0.54mol/100g.
A kind of 4. heat sink material formula of computer display according to claim 1, it is characterised in that the thickening
Agent uses NPAM type polyacrylamides.
5. the heat sink material preparation method of a kind of computer display, it is characterised in that comprise the following steps：
(1) dimethicone, silica gel, methacrylic acid, epoxy resin and ethyl acrylate are well mixed according to formula rate
Crushed afterwards by pulverizer, until raw material turn into slurry, obtain mixed serum；
(2) take carbon fiber according to formula rate, and by carbon fiber crush it is broken after form powder and cross 100 mesh sieves and obtain powder
Carbon fiber；
(3) obtained powder carbon fiber in obtained mixed serum in step (1) and step (2) is mixed, and fully stirred
Mix until well mixed, compound is put into Sealing furnace to carry out high thermal high qualitative after well mixed, then moved back by decompression
Fire obtains solidifying filler；
(4) obtained solidification charges in step (3) are taken out, and sufficiently crushed by pulverizer, 60- is crossed after crushing
80 mesh sieves, polyamide is added according still further to ratio thereto and water-soluble silicate is stirred mixing, is risen during mixing
Temperature is to 60-80 DEG C, then adds paraffin according to formula rate thereto and be stirred, until paraffin turns into liquid and mixed equal
It is even, finally thickener is proportionally added to obtain heat-conducting silicone grease；
(5) heat-conducting silicone grease by above-mentioned steps processing is put into refrigeration 30-60min in -5-0 DEG C of refrigerator-freezer and can obtain finished product
Heat-conducting silicone grease.
6. the heat sink material preparation method of a kind of computer display according to claim 5, it is characterised in that in step
Suddenly in (3), high thermal high is qualitative and the concrete operation method of decompression annealing is：Including increasing temperature and pressure stage, constant temperature and pressure rank
Section, constant temperature decompression phase and decrease temperature and pressure stage, the increasing temperature and pressure phase temperature rise to 140-180 DEG C by normal pressure, average to rise
Warm speed is 5 DEG C/min, and pressure rises to 2.0-3.0Mpa by normal pressure, and average rate of pressure rise is 0.2Mpa/min；The constant temperature is permanent
Pressing stage holding temperature, pressure is in 2.0-3.0Mpa, and the duration is 2.0-3.0h at 140-180 DEG C；The constant temperature subtracts
Pressure stage holding temperature is constant at 140-180 DEG C, and pressure reduces to 1.5-2.0Mpa by 2.0-3.0Mpa；The decompression annealing stage
Pressure is down to normal pressure by 1.5-2.0Mpa, and average rate of pressure reduction is 0.4Mpa/min, and temperature is down to normal temperature by 140-180 DEG C, is put down
Equal rate of temperature fall is 10 DEG C/min.
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Application publication date: 20180112 |
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