CN107573487A - Phosphazene compound containing sulfydryl, curing agent and the epoxy resin of phosphonitrile containing sulfydryl - Google Patents
Phosphazene compound containing sulfydryl, curing agent and the epoxy resin of phosphonitrile containing sulfydryl Download PDFInfo
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- CN107573487A CN107573487A CN201610523586.9A CN201610523586A CN107573487A CN 107573487 A CN107573487 A CN 107573487A CN 201610523586 A CN201610523586 A CN 201610523586A CN 107573487 A CN107573487 A CN 107573487A
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Abstract
The invention discloses phosphazene compound containing sulfydryl, curing agent, the epoxy resin of phosphonitrile containing sulfydryl.The sulfydryl phosphazene compound its there is molecular structure shown in formula (I).The fire-retardant compound has good anti-flammability, and its solidfied material has good heat resistance, water resistance, cohesiveness and mechanical performance, electrical property, is a kind of fire retardant matter also with larger economy and environmentally friendly friendly.In addition, said composition, which is applied to composite metal substrate and wiring board, can improve its anti-flammability, while economy and environmentally friendly friendly.
Description
Technical field
The present invention relates to the technical field of fire retardant matter, more particularly to phosphazene compound containing sulfydryl, curing agent, phosphorus containing sulfydryl
Nitrile epoxy resins.
Background technology
The family such as the electronic products such as mobile phone, computer, video camera, electronic game machine, air-conditioning, refrigerator, television image, sound equipment articles for use
With, office electric equipment products and the various products that use of other field, for safety, it is required for possessing different degrees of anti-flammability
Energy.
Traditional technology typically uses addition aluminium hydroxide hydrate, magnesium hydroxide hydrate etc. into material system to contain
The inorganic fire-retarded material such as the metal hydroxides of the crystallization water, and brominated bisphenol A, bmminated bisphenol-A type are added into material system
The method of the higher organic fire-resisting material of the content of halogen such as epoxy resin, product is set to reach required fire resistance or wait
Level.In order to improve the anti-flammability of these organic chemicals for containing halogen, such as antimony oxide is also usually added into system
Deng to the disagreeableness inorganic fire-retarded material of environment.
Halogen-containing fire retardant matter can produce the noxious material of no degradability or difficult degradation in burning, and (such as dioxin has
Machine halogen chemical substance), pollution environment, influence the mankind and animal health.
For the purpose of environmental protection, people replace chemical combination containing halogen using the not halogen-containing compound such as phosphorous, nitrogenous
Thing as fire retardant, particularly in electronics, electrically, on Electric Industrial, using the simple function with reactivity (in a molecule only
Have an active reactive group) flame-retardant composition, such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is (hereinafter referred to as
DOPO), it is more derivative compound using DOPO, addition or does not add aluminium hydroxide hydrate, magnesium hydroxide hydrate
To reach flame retardant effect.
In electronic applications, usually used DOPO and novolac type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A
The high cost such as phenol aldehyde type epoxy resin, the product (abbreviation DOPO epoxy resin) of polyfunctional epoxy resin reaction, as covering copper
The epoxide resin material of plate purposes.These use the copper-clad plate manufactured by DOPO epoxy resin, have good fire resistance, but
There is the defects of many in cohesiveness, heat resistance, processability etc., be not suitable for manufacturing high multilayer, the Gao Ke that modern communicationses need
By property, high cohesiveness, excellent machinability product.Simultaneously because cost is higher, it is unfavorable for spreading to the low costs such as mobile phone and disappears
The civil goods such as power-consuming son field.
With the further raising of people's multiple stratification, high reliability request short to electronic product, small, thin, high, civilian consumption
The factor such as the popularization of electronics and increasingly severeer pollution pressure, there is an urgent need to good anti-flammability, resistance in market
The copper-clad plate material of hot, good mechanical performance and dielectric properties.
The content of the invention
In view of this, one aspect of the present invention provides a kind of phosphazene compound containing sulfydryl, and the reactive phosphorus nitrile compound has
Good flame-retardance, heat resistance, good mechanical performance.
A kind of phosphazene compound containing sulfydryl, it has the molecular structure as shown in formula (I)：
In formula (I), R is inertia nucleophilic group, R1For-O- ,-NR '-or-S- in any one, R ' is arbitrary organic
Group, R2For arbitrary organic group, M is the phosphonitrile base M of ring three1, the phosphonitrile base M of ring more than four2Or non-annularity polyphosphazene base M3In
A kind of or its at least two combination；A is integer more than or equal to zero, for example, 0,1,2,3,4,5,6,7 or 8, b be more than or equal to
1 integer, for example, 1,2,3,4,5,6,7,8,9 or 10, b be preferably greater than 2 integer；A and b sums are number of phosphorus atoms in M
2 times.
In the present invention, the arbitrary organic group, condition is that the specified atom is no more than normal valency, and is produced
Raw stable compound.Preferably, R ' is hydrogen atom, substituted or unsubstituted straight chained alkyl or branched alkyl, substitution or not taken
In the cycloalkyl in generation, substituted or unsubstituted aralkyl, substituted or unsubstituted aryl or substituted or unsubstituted heteroaryl
Any one or its at least two combination.
Preferably, R2Expression is each independently selected from substituted or unsubstituted straight chain alkylene group, substituted or unsubstituted
Branched alkylene, substituted or unsubstituted arylene；It is preferred that C1~C30Substituted or unsubstituted straight chain alkylene group, C1~C30
Substituted or unsubstituted branched alkylene, C6~C30Substituted or unsubstituted arylene；Further preferred C1~C10Substitution
Or unsubstituted straight chain alkylene group, C1~C10Substituted or unsubstituted branched alkylene, C6~C16Substituted or unsubstituted sub- virtue
Perfume base；Particularly preferred phenylene, methylphenylene, dimethylphenylene, ethylphenylene,
Methylene, ethylidene, propylidene, middle propyl group, sub- normal-butyl or isopropylidene.
In the present invention, the R is the inertia nucleophilic group provided by nucleopilic reagent.In the present invention, the inertia parent
Core group refers to that the nucleophilic group does not have reactivity, refers specifically to, a kind of functional group, and it lives without common sense
Property group, it be not easy with the speed of a reality routine organic synthesis under conditions of reacted, be directed to the present invention
Phosphazene compound refers to, and reacts remaining by nucleopilic reagent and chloro phosphazene compound dehalogenation compound (such as NaCl, KCl, HCl)
, without common sense reactivity functional group.Nucleophilic is carried out for example with hydroquinones, obtains O-Ar-OH, Ar is benzene
Base, because remaining group O-Ar-OH has reactivity, therefore, it is not belonging to the inertia nucleophilic group of the present invention.
In the present invention, the nucleopilic reagent refers to, and the nucleopilic reagent of nucleophilic substitution can occur with halo phosphonitrile.
During nucleophilic substitution, nucleopilic reagent sloughs leaving group, the halogen atom in nucleophilic group attack halo phosphonitrile, parent
Core group is connected with M.Methanol CH is used for example, working as3When as nucleopilic reagent and halo phosphonitrile nucleophilic substitution occurs for OH,
CH3OH sloughs H+, methoxyl group CH3Halogen atom in O- substitution halo phosphonitriles, is connected, now R is with-the P- in phosphonitrile
CH3O-。
Preferably, R is selected from-OR14、-SR15、-C≡C-R6、-O-NO2,-I orIn any one or at least two combination；
R14、R15、R3、R4、R5、R6、R13、R16、R11And R12It independently is substituted or unsubstituted straight chained alkyl or side chain
Alkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted aralkyl, substituted or unsubstituted alkoxy, substitution or not
Substituted alkyl sulfenyl, substituted or unsubstituted cycloalkyloxy, substituted or unsubstituted aralkoxy, substituted or unsubstituted alkane
Base aryloxy group, substituted or unsubstituted carbonate group, substituted or unsubstituted sulfonate group, substituted or unsubstituted phosphonate ester
In base, substituted or unsubstituted aryl or substituted or unsubstituted heteroaryl any one or at least two combination.
Term " substituted " used in the present invention refer to any one or more hydrogen atoms on specified atom by selected from
The substituent substitution of designated groups, condition is that the specified atom is no more than normal valency, and the result substituted is to produce stabilization
Compound.When substituent is oxo group or ketone group (i.e.=O), then 2 hydrogen atoms on atom are substituted.Ketone substitutes
Base is not present on aromatic rings." stable compound " be refer to it is sufficiently strong strongly from reactant mixture separation to effective
Purity is simultaneously configured to compounds effective.
In foregoing description, substituted or unsubstituted straight chained alkyl or branched alkyl be preferably substituted or unsubstituted C1~
C12 (such as C1, C2, C3, C4, C5, C6, C7, C8, C9, C10 or C11) straight chained alkyls or branched alkyl, preferably C1~C8 straight chains
Alkyl or branched alkyl, it is methyl when carbon number is C1, when carbon number is C2, as ethyl.
The substituted or unsubstituted cycloalkyl be preferably carbon number for C3~C12 (such as C4, C5, C6, C7, C8,
C9, C10 or C11) substituted or unsubstituted cycloalkyl.
Substituted or unsubstituted aryl is preferably phenyl, benzyl, 1,2,3,4- tetralyls,Deng.The example of phenyl includes
Xenyl, terphenyl, benzyl, phenethyl or phenylpropyl etc..
Substituted or unsubstituted heteroaryl is five yuan or six membered heteroaryl.
Substituted or unsubstituted alkoxy is C1-C12 (such as C1, C2, C3, C4, C5, C6, C7, C8, C9, C10 or C11)
Alkoxy.
Substituted or unsubstituted aralkyl is C7-C12 (such as C8, C9, C10 or C11) aralkyl.
Substituted or unsubstituted alkyl sulfenyl is C1-C8 (such as C1, C2, C3, C4, C5, C6, C7 or C8) alkyl sulfenyl.
Substituted or unsubstituted cycloalkyloxy is C3-C8 (such as C4, C5, C6, C7 or C8) cycloalkyloxy,
Substituted or unsubstituted aralkoxy is C7-C12 (such as C8, C9, C10 or C11) aralkoxy.
Substituted or unsubstituted alkyl-aryloxy is C7-C12 (such as C8, C9, C10 or C11) alkyl-aryloxy.
Preferably, the substituted or unsubstituted alkoxies of the R or aryloxy.
The example of alkoxy includes, but are not limited to methoxyl group, ethyoxyl, isopropoxy, propoxyl group, butoxy and penta oxygen
Base.Alkoxy grp can be substituted by substituents, as alkenyl, alkynyl, halogen, hydroxyl, alkyl carbonyl oxy, aryl-carbonyl oxygen,
Alkoxy carbonyloxy group, aryloxy group carbonyloxy group, carboxylate, alkyl-carbonyl, aryl carbonyl, alkoxy carbonyl, amino carbonyl, alkyl ammonia
Base carbonyl, dialkyl amino carbonyl, alkylthiocarbonyl, alkoxy, phosphate, phosphonate radical close, phosphinic acids root close, amino (including
Alkyl amino, dialkyl amido, arylamino, ammonia diaryl base and alkyl aryl amino), acylamino- (including alkyl-carbonyl ammonia
Base, aryl-amino-carbonyl, carbamoyl and urea groups), amidino groups, imino group, sulfydryl, alkylthio group, arylthio, carbothioic acid ester,
It is sulfuric ester, alkyl sulphinyl, sulfonic group, sulfamoyl, sulfonamido, nitromethyla, trifluoromethyl, cyano group, azido, miscellaneous
Ring group, alkylaryl or aromatics or heteroaromatic group.The example of the alkoxy grp of halogen substitution includes, but are not limited to a fluorine methoxy
Base, difluoro-methoxy, trifluoromethoxy, a chloromethane epoxide, dichloro methoxyl group, trichloromethoxy.
The example of the aryl oxide includes phenoxy group, benzyloxy, naphthoxy or biphenylyloxy, and the aryl oxide can be by alkane
Base etc. substitutes.
Preferably, the phosphazene compound is any one in the phosphazene compound with following structure or at least two
The mixture of kind：
Ph-O-M-(S-CH2-SH)5、(Ph-O)2-M-(S-CH2-SH)4、(Ph-O)3-M-(S-CH2-SH)3、(Ph-O)4-
M-(S-CH2-SH)2。
Here, M1Structure is：
M2Structure is：
Wherein, x is more than or equal to 4；
M3Structure is：
Wherein, y is more than or equal to 3.
It should hand over, in M1And M2In the expression of structural formula, there is symbolOnly to " ring-type "
A kind of signal of structure.M1、M2And M3InThe key connected on middle P atoms only represents substituent in three
Substitution occurs on P atoms, is not to be construed as the expression of methyl.
In the flame-retardant compound of the present invention, it should be understood that the group being connected with M is connected on M phosphorus atoms,
That is M1、M2And M3The side base on phosphorus atoms in structure.Further illustrate, M1、M2And M3Occur in structure on P atoms
Two singly-bounds are not to be construed as two methyl, and two singly-bounds are merely representative of M1、M2And M3Side base is connected by P atoms.M can be with
The phosphorus atoms of same position are connected, the phosphorus atoms of diverse location can also be connected.
Preferably, M includes at least 50wt% phosphonitrile base M of ring three1, at most 48wt% the phosphonitrile base M of ring more than four2And
At most 48wt% non-annularity polyphosphazene base M3。
In the present invention, M1Content is at least 50wt%, i.e. M1Content can be 50wt~100wt%, M1For main body into
Point.Work as M1When content is 100wt%, then M is not contained2And M3.The typical but non-limiting M of the present invention1Content can be
50wt%, 51wt%, 55wt%, 58wt%, 60wt%, 65wt%, 70wt%, 74wt%, 75wt%, 80wt%, 85wt%,
90wt%, 92wt%, 95wt%, 98wt% or 100wt%.
In the present invention, M2Content is at most 48wt%, that is, is referred to, M2Content can be 0~48wt%.Work as M2Content is
During 0wt%, that is, refer to, do not contain M2.The typical but non-limiting M of the present invention2Content can be 0wt%, 2wt%, 5wt%,
8wt%, 11wt%, 14wt%, 17wt%, 20wt%, 23wt%, 26wt%, 29wt%, 32wt%, 35wt%, 38wt%,
42wt%, 45wt% or 48wt%.
In the present invention, M3Content is at most 48wt%, that is, is referred to, M3Content can be 0~48wt%.Work as M3Content is
During 0wt%, that is, refer to, do not contain M3.The typical but non-limiting M of the present invention3Content can be 0wt%, 2wt%, 5wt%,
8wt%, 11wt%, 14wt%, 17wt%, 20wt%, 23wt%, 26wt%, 29wt%, 32wt%, 35wt%, 38wt%,
42wt%, 45wt% or 48wt%.
In the present invention, if M1Content is less than 50wt%, or M2More than 48wt%, then with the reacted life of epoxy resin
Heat resistance, water resistance and mechanical performance can be damaged in use into thing.If M3Content is more than 48%, then is reacted with epoxy resin
Product afterwards would be possible to cause inconvenient for use because viscosity is excessive in use, and because molecular weight is excessive make its performance
The bad result such as suffer damage.
In the present invention, the phosphazene compound be the phosphazene compound with following structure in any one or extremely
Few two kinds mixture：
Ph-O-(S-CH2-SH)5、(Ph-O)2-(S-CH2-SH)4、(Ph-O)3-(S-CH2-SH)3、(Ph-O)4-(S-CH2-
SH)2。
The reactive phosphorus nitrile compound of the present invention is by phosphonitrile chloride is carried out into nucleophilic substitution institute with nucleopilic reagent
Obtain.
Phosphonitrile chloride refers to (R)a——M——(Cl)b, nucleopilic reagent refers to：HS-R2-R1-H；Pay attention to, above-mentioned R1、R2、M、
A, b is in the structural formula of non-reacted phosphazene compound.
In the nucleophilic substitution, chlorine is substituted by nucleopilic reagent, produces hydrogen chloride.Nucleophilic can use well known in the art
Prepared by method, such as refer to " progress of polyphosphazene, Zhang Hongwei etc., material Leader 2010 year the 7th phase of volume 24 ".Parent
The instantiation of the catalyst of nuclear reaction has the metal chlorides such as zinc chloride, magnesium chloride, aluminium chloride, boron trifluoride and its complexing
The lewis bases such as thing, sodium hydroxide.These catalyst can one or more be used in mixed way, the present invention in have no special rule
It is fixed.Phosphonitrile chloride can use the most commonly used hexachlorocyclotriph,sphazene in source.First it can be carried out using the nucleopilic reagent containing R
Nucleophilic displacement of fluorine, nucleophilic displacement of fluorine is then carried out using the nucleopilic reagent containing S again, nucleopilic reagent is commercially available or passes through prior art
Obtain.
Another aspect of the invention provides a kind of curing agent of epoxy resin, the epoxy resin cure obtained using the curing agent
Thing has good flame-retardance, heat resistance, a good mechanical performance, and concrete scheme is as follows：
A kind of curing agent of epoxy resin, its part or be fully above-mentioned flame-retardant compound.
Above-mentioned flame-retardant compound contains-OH, it is used as the curing agent of epoxy resin.
The curing agent of the present invention is limited without special flame-retardant compound content, such as the curing agent can be only above-mentioned
Flame-retardant compound, in addition, the curing agent in addition to above-mentioned flame-retardant compound, can also contain other curing agent.Used for example, working as
Nucleopilic reagent when being benzenediol, obtain phenylol phosphorus-nitrogen compound, in such cases, the reactive group reacted with same epoxy resin
Equivalents is meter, and the mass percent that flame-retardant compound as described above accounts for all curing agent quality is more than 30%, especially excellent
55%~100% is elected as, not including 100%.It is understood that " all curing agent " fire-retardant chemical combination i.e. as described above
Thing and other epoxy curing agents.Term " the reactive group equivalents reacted using same epoxy resin as count " refers to phenylol phosphorus
The relative usage of both nitrogen compound, other curing agent is with both reactive group equivalents that each contained same epoxy resin reacts
Number is the benchmark calculated.
When the curing agent is in addition to above-mentioned flame-retardant compound, other curing agent can also be contained, other described curing agent can
Using epoxy curing agent known in the art, the instantiation of the curing agent is：It is not phosphorous to be free of the more phenolic group chemical combination of nitrogen
Thing, nitrogenous more phenol-based compounds, phosphorous more phenol-based compounds, nitrogenous phosphorous more phenol-based compounds, amine compound, benzoxazine
In resin, acid anhydrides, polyacid and boron trifluoride and its complex compound any one or at least two combination.Here, it is aminated
Compound is fatty amine or aromatic amine, such as dicyandiamide, diethyl triamine, MDA, diaminodiphenylsulfone；More phenolic group
Compound is one kind in bisphenol-A, Bisphenol F, bisphenol S, linear phenolic resin, o-cresol urea formaldehyde or bisphenol A phenolic resin
Or at least two combination.
Another aspect of the invention provides a kind of with good flame-retardance, heat resistance, the epoxy resin of good mechanical performance
Composition.
A kind of composition epoxy resin, include epoxy resin, and the curing agent of above-mentioned epoxy resin.
The present invention provides to the specific species of composition epoxy resin epoxy resin without special, as long as containing epoxy radicals
Compound be epoxy resin.Such as epoxy resin generally in the art can be used, such as with liquid bisphenol A type ring oxygen trees
Fat, liquid bisphenol F types epoxy resin, solid-state bisphenol A type epoxy resin fat, solid-state bisphenol f type epoxy resin fat, bisphenol S type epoxy tree
Fat, two functional epoxy resins that biphenyl type epoxy resin is representative, with solid-state, liquid or semisolid novolac type asphalt mixtures modified by epoxy resin
Fat, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, acyclic isoprenoid type epoxy resin for representative trifunctional with
Upper epoxy resin.Herein, it will be readily appreciated by those skilled in the art that when being necessary certainly, ester ring type ring can also be used
The relatively low epoxy resin of ratio of viscosities such as oxygen tree fat, chain type aliphatic type epoxy resin or ester formula epoxy resin, these epoxy resin
Can be used alone can also two or more be used together, the present invention has no special regulation to this, and the present invention is to this
The amount of a little epoxy resin proportionings is also not specially provided, is ensured with reaching on the premise of safe and environment-friendly and required performance
To purpose thing.
In the composition epoxy resin, the dosage of epoxy resin and curing agent is so that epoxy resin is fully cured is defined.
In composition epoxy resin, can also according to being actually needed, comprising curing accelerator, solvent, supporting material, filler,
Auxiliary agent, fire-retarded epoxy resin, single aromatic ring phenolic group phosphorus nitrogen epoxy resin, phenolic resin, benzoxazine colophony and maleimide
Resin etc..
The addition of curing accelerator is for rapid curing.The present invention is to used curing accelerator without special rule
It is fixed, use common epoxy resin curing accelerator, such as imidazoles, triphenylphosphine and its derivative species, tertiary amines, season
The General Catalyst of the epoxy curing agent curing reaction such as amine salt, boron trifluoride and its derivative species, these promotions
Agent both can be used alone, can also two or more be used in mixed way, the number of usage amount can be as needed, with safety, ring
Guarantor obtains purpose thing and is defined, of the invention and not specially provided.Usually, the epoxy resin in curing system is contrasted, with 0.001%
~2.5% is proper, and more suitably scope is between 0.03%~1.2%.
Solvent is primarily to the components such as the curing agent in composition epoxy resin and epoxy resin are disperseed, it may be such that
The pre-impregnated sheet and bonding sheet of high quality are obtained using epoxy composite.For the type and quantity using solvent, the present invention has no
Special regulation, such as acetone, butanone, DMF, DMAC, ethanol, methanol, cyclohexanone, Isosorbide-5-Nitrae-dioxane, petroleum solvent, first
The organic solvents such as benzene, dimethylbenzene, dichloromethane, dimethyl carbonate, ensure safe and environment-friendly and required performance to reach
On the premise of obtain purpose thing.Preferably, have that good dissolubility, toxicity is strong, boiling from each composition such as such as butanone
The more moderate organic solvent of point；, can be with if the material not readily dissolved in epoxy resin ingredient containing crystallinity such as dicyandiamides
Use the organic solvents such as part or all of nitrogenous class such as DMF, DMAC.It is understood that in solidification process solvent be can
To improve the speed of volatilization by heating.
Purpose of the supporting material based on the mechanical property for improving final solidfied material, such as glass fibre, carbon fiber and polyester
Any one or any two or more combinations of fiber.
Filler be in order to increase its some function, property or reduce cost, can be added into curing system as silica,
The inorganic fillers such as diatomite, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, aluminium hydroxide and pps powder
It can be used alone with organic filler, these inorganic fillers and organic fillers such as polyphenylene ether powders, can also be two kinds or several mixed
Close and use.
Auxiliary agent can be added into system according to being actually needed.Auxiliary agent can be it is general or special, as defoamer,
The materials such as coupling agent, toughener, levelling agent, releasing agent or toughener, the present invention are not done to the species and addition of adding auxiliary agent
Special regulation, can be as needed, is defined by the safe and environment-friendly purpose thing that obtains.
In order to improve the fire resistance of composition epoxy resin, single aromatic ring polyphenol can be increased in composition epoxy resin
Base phosphorus nitrogen epoxy resin and other kinds of fire-retarded epoxy resin.Other kinds of fire-retarded epoxy resin content of halogen is preferred
But it is not limited to the epoxy resin not higher than 0.2wt%.The instantiation of other kinds of fire-retarded epoxy resin is DOPO types
Epoxy resin, phosphorous type epoxy resin, nitrogenous type epoxy resin, nitrogenous phosphorous type epoxy resin, phosphorus-containing phenolic aldehyde epoxy resin, contain
Nitrogen novolac epoxy resin containing phosphorous, silicon-contained type epoxy resin and one kind in sulfur-type epoxy resin or at least two.More phenolic group
Phosphorus nitrogen epoxy resin is generated by the flame-retardant compound with epoxy resin by condensation reaction, in view of the concrete technology of condensation reaction will
It is described below.
Further aspect of the present invention provides a kind of with good flame-retardance, heat resistance, more phenolic group phosphorus of good mechanical performance
Nitrogen epoxy resin.
A kind of more phenolic group phosphorus nitrogen epoxy resin, it is in epoxy by non-halogen epoxy resin and flame-retardant compound as described above
Under conditions of resin functionality's surplus, the epoxy resin product that is obtained by polycondensation reaction.
" epoxy resin functional group is superfluous " refers to that the epoxide equivalent with epoxy resin product is in below 3585g/eq
Standard, more preferably in below 1520g/eq.
In above-mentioned polycondensation reaction, the temperature of reaction is typically in 40~250 DEG C of scope, more preferably in 60~180 DEG C of model
Enclose, the present invention does not do special regulation, on the premise of ensuring safety and environmental protection, obtains purpose thing selection and is defined.As for the contracting
Poly- reaction, can be carried out under catalyst or without catalysts conditions.Catalyst is added in generally requiring to reaction system, the present invention
Species and addition to catalyst number have no special regulation, usually such as imidazoles, triphenylphosphine and its derivative
The General Catalyst that the epoxy resin such as class, tertiary amines, quaternary ammonium salts react with aldehydes matter can use, and these catalyst were both
Can be used alone, can also two or more be used in mixed way, usage amount reactive material typically in contrast system all exists
Between 100~20000ppm, it is more typically between 200~5000ppm.As for the medium of reaction, it can be solvent-free or have a solvent.
Special regulation, such as the ketones solvent such as acetone, butanone, cyclohexanone, benzene,toluene,xylene, mixing two are had no to reaction dissolvent
The aromatic solvents such as toluene, dichloromethane, chloroform, chlorobenzene etc. contain chlorinated solvents, ether, butyl ether, glycol monoethyl ether
Deng ethers or ether alcohols solvent, petroleum solvent naphtha, alcohols solvent such as butanol, isobutanol etc. can use, and these solvents can
Be used alone, can also two kinds or it is several be used in mixed way, usage amount number, can be determined according to actual conditions, generally
The dosage that more phenolic group phosphorus nitrogen epoxy resin solid contents are 5~100% can be made, particularly preferred is that can make more phenolic group phosphorus nitrogen epoxy resin
Solid content is 20~100% dosage.In view of the general principle of polycondensation reaction has been known technology, will not be repeated here.
Special regulation is had no to non-halogen epoxy resin in the present invention, " non-halogen epoxy resin ", which refers to, here is free of
There are the epoxy resin of halogen atom, or the epoxy resin that content of halogen is very low.Such as with liquid bisphenol A types epoxy resin, liquid
Bisphenol f type epoxy resin, solid-state bisphenol A type epoxy resin fat, solid-state bisphenol f type epoxy resin fat, bisphenol-s epoxy resin, biphenyl
Type epoxy resin is two functional epoxy resins of representative, with solid-state, liquid or semisolid novolac type epoxy resin, adjacent methyl
Novolac epoxy resin, bisphenol-A phenolic epoxy resin, the trifunctional above asphalt mixtures modified by epoxy resin that acyclic isoprenoid type epoxy resin is representative
Fat.Herein, it will be readily appreciated by those skilled in the art that when being necessary certainly, alicyclic epoxy resin, chain can also be used
The relatively low epoxy resin of the ratio of viscosities such as formula aliphatic type epoxy resin or ester formula epoxy resin, these epoxy resin can individually make
With can also two or more be used together, the present invention special regulation is had no to this.Above-mentioned epoxy resin both can be with one
Reaction is partially or mostly first participated in, question response adds the epoxy resin ginseng of other compositions again to a certain extent or completely after reaction
With reaction, can also all required epoxy resin segmentation input reactions or disposable input reaction, the present invention does not do special
Regulation, with ensure it is safe and environment-friendly on the premise of obtain purpose thing.
Another aspect of the invention provides a kind of with good flame-retardance, heat resistance, the flame retardant combination of good mechanical performance
Thing.
A kind of fire-retardant combination, include more phenolic group phosphorus nitrogen epoxy resin described above.
Polyphenol base epoxy can be comprised only in above-mentioned fire-retardant combination, can also add others has flame retardant resin,
Such as DOPO types epoxy resin, phosphorous type epoxy resin, nitrogenous type epoxy resin, nitrogenous phosphorous type epoxy resin, phosphorus-containing phenolic aldehyde
Resin, nitrogenous phenolic resin containing phosphorous, silicon-contained type epoxy resin and sulfur-type epoxy resin.Certainly can also be as needed, add
Curing agent, auxiliary agent, the filler of curing accelerator and halogen-free flame-retardance.
Curing agent has no special regulation in the present invention, and the material for being typically used as epoxy curing agent can be employed as this hair
The curing agent of bright epoxy resin composition.Instantiation can be amino-compound, such as dicyandiamide, diethyl triamine, diamino
The fatty amines such as base diphenyl-methane, diaminodiphenylsulfone or aromatic amine；Can also be two or more phenol-based compounds or
Contain in mixture, such as a molecule such as bisphenol-A, Bisphenol F, bisphenol S, linear phenolic resin, bisphenol A phenolic resin, benzo
Oxazine resin, acid anhydrides, polyacid, boron trifluoride and its complex compound etc., these epoxy curing agents can be used alone, also may be used
With two kinds or it is several be used in mixed way, usage amount generally contrast epoxy resin equivalent proportion 0.4~1.5 (eq) between.
For rapid curing, it is often necessary to add curing accelerator.The present invention is to used curing accelerator without special
Regulation, using the usually used curing accelerator of epoxy resin, for example, imidazoles, triphenylphosphine and its derivative species,
The General Catalyst of the epoxy curing agent curing reaction such as tertiary amines, quaternary ammonium salts, boron trifluoride and its derivative species,
These accelerator both can be used alone, can also two or more be used in mixed way, the number of usage amount can be as needed,
It is defined by the safe and environment-friendly purpose thing that obtains, it is of the invention and not specially provided, usually, contrast the epoxy resin in curing system
Composition, proper with 0.001wt%~2.5wt%, more suitably scope is between 0.03wt%~1.2wt%.
Filler be in order to increase its some function, property or reduce cost, can be added into curing system as silica,
The inorganic fillers such as diatomite, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, aluminium hydroxide, these inorganic fillers can be with
Be used alone, can also two kinds or it is several be used in mixed way, usage amount is typically with the 500phr (phr no more than epoxy resin ingredient
Represent the number contained by per hectogram) it is advisable.
In above-mentioned fire-retardant combination, it is general or special as disappeared that some can be added into system according to being actually needed
The materials such as infusion, coupling agent, toughener, levelling agent, the present invention do not do special regulation to the species and addition of adding auxiliary agent,
Can be as needed, it is defined by the safe and environment-friendly purpose thing that obtains.
A kind of pre-impregnated sheet, it is impregnated with or is coated on base material by fire-retardant combination described above and forms.Base material can be glass
Fiber base material, polyester base material, polyimide base material, ceramic base material or carbon fiber base material etc..Here, it is impregnated with or is coated with specific
Process conditions are not particularly limited." bonding sheet " that " pre-impregnated sheet " is also well known to those skilled in the art.
A kind of composite metal substrate, it include more than one as above-mentioned pre-impregnated sheet carry out successively surface metal-clad it is overlapping,
Pressing forms.Here, the material of surface metal-clad is the alloy of aluminium, copper, iron and its any combination.The tool of composite metal substrate
Body example has CEM-1 copper-clad plates, CEM-3 copper-clad plates, FR-4 copper-clad plates, FR-5 copper-clad plates, CEM-1 aluminium bases, CEM-3 aluminium bases
Plate, FR-4 aluminium bases or FR-5 aluminium bases.
A kind of wiring board, formed in the Surface Machining circuit of above-mentioned composite metal substrate.
The raw material of flame-retardant composition or composition epoxy resin is formed with good by being solidificated on composite metal substrate
The coating of good fire resistance, wiring board, such as electronic industry, electric, Electric Industrial, communications and transportation, Aero-Space, object for appreciation can be improved
Tool industry etc. needs the extensive use of the industries such as the machine of wiring board, equipment, instrument, instrument.
A kind of plastic packaging material, it is by above-mentioned composition epoxy resin or such as above-mentioned fire-retardant combination.Can according to being actually needed,
Conventional functional stuffing is selected to be added according to the dosage of routine into above-mentioned composition epoxy resin or above-mentioned fire-retardant combination
To be configured to plastic packaging material.
Above-mentioned term " ××× base or group ", which refers to, sloughs one or more hydrogen atoms in ××× molecular structure of compounds
Or remaining part after other atoms or atomic group.
In the present invention, Ph represents phenyl.
It has good anti-flammability to phosphazene compound containing sulfydryl of the invention, and its solidfied material has good heat resistance, resistance to
Water-based, cohesiveness and mechanical performance, electrical property, it is a kind of fire retardant matter also with larger economy and environmentally friendly friendly.
The Tg of the copper-clad plate obtained using the fire-retardant compound can reach 155 DEG C and more than, T- peel strengths can reach 2.1kg/mm2
More than and, interlaminar strength can reach 1.80kg/mm2More than and, saturated water absorption can reach less than 0.25%, thermal decomposition temperature
Degree can reach 403 DEG C and more than, bending strength can reach 12.1kg/mm2More than and, flammability (UL-94) reaches V-0 ranks,
Dielectric constant is that dielectric loss is.
Embodiment
Technical scheme is further illustrated with reference to embodiment.
Embodiment 1
Phosphazene compound structural formula is as follows：
Ph-O-M-(S-CH2CH2-SH)5
The phosphorus cyanogen 1mol of chlordene ring three, acetone 250ml, benzene are put into three mouthfuls of 2000ml glass reactors with agitating device
Phenol 1mol and dithioglycol 5mol, stir, lead to nitrogen, while being warming up to 60 DEG C, 20% hydrogen-oxygen is instilled with 60min
Change sodium solution 621g, kept for 60 DEG C of temperature, 15 hours of stirring reaction.After reaction, with the moisture in physical method removal system,
The insoluble matter in removal system is refiltered, distills solvent in system, this purpose product is named as A.
The low dielectric phosphazene compound of modification to obtaining carries out proton nmr spectra sign, as a result as follows：
1H NMR(CDCl3,500MHz):6.6~6.7,6.8~7.0,7.1~7.2 (benzene ring hydrogens), 2.8~2.9
(hydrogen on ethylidene), 1.5 (hydrogen on sulfydryl).
The position of infrared spectrum characteristic peak：The characteristic absorption peak 1217cm of P=N keys in phosphazene backbone-1, P- in phosphazene backbone
N 874cm-1, P-O-C key absworption peaks 1035cm-1, 1500~1600cm of phenyl ring skeleton vibrations-1, methylene stretching vibration peak
2850cm-1。
Using above-mentioned 150g A materials and 140.5g epoxide equivalents, the linear phenolic resin as 105g/eq is curing agent, with
The novolac ring that the liquid bisphenol A epoxy resin and 50g epoxide equivalents that 200.0g epoxide equivalents are 187g/eq are 120g/eq
Oxygen tree fat is epoxy resin, and the 2-methylimidazole and appropriate butanone for adding 0.08g stir homogeneous wiring solution-forming, are named as group
The equivalent proportion of compound -1, epoxy resin and curing agent is 1.Then using composition -1 according to general copper-clad plate production process system
The standard copper-clad plate sample of the standards such as national standard, UL must be met, be named as a copper-clad plates, test the performance of a copper-clad plates, its result exists
Represented in table -1.
Embodiment 2
Phosphazene compound has following structure：
(Ph-O)2-M-(S-Ph-SH)4
The phosphorus cyanogen 1mol of chlordene ring three, acetone 250ml, benzene are put into three mouthfuls of 2000ml glass reactors with agitating device
Phenol 2mol and to diphenyl disulfide phenol 4mol, stirs, leads to nitrogen, while being warming up to 60 DEG C, 20% hydrogen is instilled with 60min
Sodium hydroxide solution 405g, kept for 60 DEG C of temperature, 15 hours of stirring reaction.After reaction, with the water in physical method removal system
Point, the insoluble matter in removal system is refiltered, distills solvent in system.This purpose product is named as B.
The low dielectric phosphazene compound of modification to obtaining carries out proton nmr spectra sign, as a result as follows：
1H NMR(CDCl3,500MHz):6.6~6.7,6.8~7.0,7.1~7.2 (benzene ring hydrogens), 1.5 (on sulfydryl
Hydrogen).
The position of infrared spectrum characteristic peak：The characteristic absorption peak 1217cm of P=N keys in phosphazene backbone-1, P- in phosphazene backbone
N 874cm-1, P-O-C key absworption peaks 1035cm-1, 1500~1600cm of phenyl ring skeleton vibrations-1。
Using above-mentioned 130g B substances and 117.3g epoxide equivalents, the linear phenolic resin as 105g/eq is curing agent, with
The novolac ring that the liquid bisphenol A epoxy resin and 50g epoxide equivalents that 200.0g epoxide equivalents are 187g/eq are 120g/eq
Oxygen tree fat is epoxy resin, is adding 0.08g 2-methylimidazole and the homogeneous wiring solution-forming of appropriate butanone stirring, is being named as
Composition -2.Then the standard for meeting the standards such as national standard, UL is made according to general copper-clad plate production process using composition -2
Copper-clad plate sample, b copper-clad plates are named as, test the performance of b copper-clad plates, its result represents in table -1.
Embodiment 3
Phosphazene compound has following structure：
(CH3-Ph-O)3-M-(S-CH2-Ph-CH2-SH)3
The phosphorus cyanogen 1mol of chlordene ring three, acetone 250ml, benzyl are put into three mouthfuls of 2000ml glass reactors with agitating device
Alcohol 3mol and thiopurine methyltransferase beneze methane thiol 3mol, stir, lead to nitrogen, while being warming up to 60 DEG C, instilled with 60min
20% sodium hydroxide solution 621g, kept for 60 DEG C of temperature, 15 hours of stirring reaction.After reaction, system is removed with physical method
In moisture, refilter the insoluble matter in removal system, distill solvent in system.This purpose product is named as C.
The low dielectric phosphazene compound of modification to obtaining carries out proton nmr spectra sign, as a result as follows：
1H NMR(CDCl3,500MHz):6.6~6.7,6.8~7.0,7.1~7.2 (benzene ring hydrogens), 2.8~2.9
(hydrogen on ethylidene), 1.5 (hydrogen on sulfydryl), 1.60~1.70 (hydrogen on methyl).
The position of infrared spectrum characteristic peak：The characteristic absorption peak 1217cm of P=N keys in phosphazene backbone-1, P- in phosphazene backbone
N 874cm-1, P-O-C key absworption peaks 1035cm-1, 1500~1600cm of phenyl ring skeleton vibrations-1, methyl stretching vibration peak
2850cm-1。
Using above-mentioned 120g C materials and 99.8g epoxide equivalents, the linear phenolic resin as 105g/eq is curing agent, with
The novolac ring that the liquid bisphenol A epoxy resin and 50g epoxide equivalents that 200.0g epoxide equivalents are 187g/eq are 120g/eq
Oxygen tree fat is epoxy resin, is adding 0.08g 2-methylimidazole and the homogeneous wiring solution-forming of appropriate butanone stirring, is being named as
Composition -3.Then the standard for meeting the standards such as national standard, UL is made according to general copper-clad plate production process using composition -3
Copper-clad plate sample, c copper-clad plates are named as, test the performance of c copper-clad plates, its result represents in table -1.
Comparative example 1
Epoxide equivalent is 200g/eq o-cresol formaldehyde epoxy resin 200g, adds the line that phenolic hydroxyl equivalent is 105g/eq
Type phenolic resin curative 105g and hexaphenoxycyclotriphosphazene 70g and 0.2g as fire retardant 2-methylimidazole, system
Standby composition epoxy resin.Then it is made using the composition epoxy resin according to general copper-clad plate production process and meets state
The standard copper-clad plate sample d of the standards such as mark, UL, the properties for covering copper d represent in table -1.
Comparative example 2
Epoxide equivalent is 200g/eq o-cresol formaldehyde epoxy resin 200g, and adding has such as the resinification of formula (1) structure
Compound 220g, ester equivalent are 220g/eq and hexaphenoxycyclotriphosphazene 70g and 0.2g as fire retardant pyridine azoles, are made
Standby composition epoxy resin.Then it is made using the composition epoxy resin according to general copper-clad plate production process and meets state
The standard copper-clad plate sample e of the standards such as mark, UL.The properties for covering copper e represent in table -1.
Embodiment and the test result of comparative example are as shown in following table -1：
The performance comparision of the various copper-clad plates of table -1
Table -1
Method of testing：
(1) water absorption rate
100mm × 100mm × 1.6mm sheet materials are placed in 105 DEG C of baking oven and dry 1h, weighs and is placed on after cooling
Boiling 120min under 105kPa vapour pressure, finally dries and weighs and calculate water absorption rate.
(2) glass transition temperature Tg
The width for preparing test sample is about 8-12mm, length 60mm, and measurement is set on the resistance to DMA Q800 that speed of Germany
Pattern is beam mode, scanning temperature be room temperature to 200 DEG C, read loss tangent maximum when corresponding temperature be the sample
Glass transition temperature Tg.
(3) bending strength
25.4mm × 63.5m sample is prepared, using its thickness of vernier caliper measurement, by the test of material universal testing machine
Pattern is adjusted to crooked test pattern, and setting spacing is 15.9mm, test speed 0.51mm/min, takes the flat of 3 parallel testings
Average, test temperature are respectively room temperature and 180 DEG C.
(4) peel strength determines
Copper-clad laminated board is cut into 100mm × 3mm test film, using anti-stripping instrument experimental rig, with speed 50.8mm/
Min carries out stripping layering to copper foil, tests the peel strength of copper foil and resin, the bonding between the bigger explanation resin of numerical value and copper foil
Power is better.
(5) flammability is tested according to standard ANSL UL94-1985.
The test data of above table, show fire-retardant compound and its derivative of the present invention when use is consolidated in epoxy resin
When in change system and other systems, there is good anti-flammability, its solidfied material has good heat resistance, water resistance, cohesiveness
With mechanical performance, electrical property.The fire-retardant compound of the present invention belongs to that low cost, raw material sources are abundant, properties are good
The environment-friendly type flame-retardant material of the novel environmental friendly of energy-saving and emission-reducing.
Applicant states that the present invention illustrates the detailed process equipment of the present invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, it is above-mentioned detailed not mean that the present invention has to rely on
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
The addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, selection of concrete mode etc., all fall within the present invention's
Within the scope of protection domain and disclosure.
Claims (11)
1. a kind of phosphazene compound containing sulfydryl, it is characterised in that it has the molecular structure as shown in formula (I)：
In formula (I), R is inertia nucleophilic group, R1For-O- ,-NR '-or-S- in any one, R ' is arbitrary organic group,
R2For arbitrary organic group, M is the phosphonitrile base M of ring three1, the phosphonitrile base M of ring more than four2Or non-annularity polyphosphazene base M3In one kind
Or its at least two combination；
A is the integer more than or equal to zero, and b is the integer more than or equal to 1, a and b sums are 2 times of number of phosphorus atoms in M.
2. phosphazene compound as claimed in claim 1, it is characterised in that R ' is hydrogen atom, substituted or unsubstituted straight chain alkane
Base or branched alkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted aralkyl, substituted or unsubstituted aryl take
Any one in generation or unsubstituted heteroaryl or its at least two combination；
Preferably, R2It is sub- that expression is each independently selected from substituted or unsubstituted straight chain alkylene group, substituted or unsubstituted side chain
Alkyl, substituted or unsubstituted arylene；It is preferred that C1~C30Substituted or unsubstituted straight chain alkylene group, C1~C30Substitution or
Unsubstituted branched alkylene, C6~C30Substituted or unsubstituted arylene；Further preferred C1~C10Substitution or do not take
Straight chain alkylene group, the C in generation1~C10Substituted or unsubstituted branched alkylene, C6~C16Substituted or unsubstituted arylene；It is special
Not preferred phenylene, methylphenylene, dimethylphenylene, ethylphenylene,Methylene,
Ethylidene, propylidene, middle propyl group, sub- normal-butyl or isopropylidene；
Preferably, R is selected from-OR14、-SR15、-C≡C-R6、-O-NO2,-I orIn any one or at least two combination；
R14、R15、R3、R4、R5、R6、R13、R16、R11And R12Independently be substituted or unsubstituted straight chained alkyl or branched alkyl,
It is substituted or unsubstituted cycloalkyl, substituted or unsubstituted aralkyl, substituted or unsubstituted alkoxy, substituted or unsubstituted
Alkyl sulfenyl, substituted or unsubstituted cycloalkyloxy, substituted or unsubstituted aralkoxy, substituted or unsubstituted alkyl virtue oxygen
Base, substituted or unsubstituted carbonate group, substituted or unsubstituted sulfonate group, substituted or unsubstituted phosphonate group, substitution
Or in unsubstituted aryl or substituted or unsubstituted heteroaryl any one or at least two combination；
Preferably, the phosphazene compound is any one in the phosphazene compound with following structure or at least two
Mixture：
Ph-O-M-(S-CH2-SH)5、(Ph-O)2-M-(S-CH2-SH)4、(Ph-O)3-M-(S-CH2-SH)3、(Ph-O)4-M-(S-
CH2-SH)2；
Preferably, M1Structure is：
M2Structure is：
Wherein, x is more than or equal to 4；
M3Structure is：
Wherein, y is more than or equal to 3.
3. phosphazene compound containing sulfydryl according to claim 1, it is characterised in that M includes at least 50wt%M1, at most
30wt%M2And at most 45wt%M3；
Preferably, b is more than or equal to 2.
A kind of 4. curing agent of epoxy resin, it is characterised in that what it was formed be partially or fully as claim 1~
One of 3 reactive phosphorus nitrile compounds.
Preferably, for the reactive group equivalents reacted using same epoxy resin to count, the reactive phosphorus nitrile compound accounts for curing agent
More than 30%, preferably 55%~100%；
Preferably, the curing agent also includes other curing agent, selected from not phosphorous without the more phenol-based compounds of nitrogen, nitrogenous more phenolic group
It is compound, phosphorous more phenol-based compounds, nitrogenous phosphorous more phenol-based compounds, amine compound, benzoxazine colophony, acid anhydrides, more
First acid and boron trifluoride and its one kind in complex compound or at least two combination；
Preferably, the amine compound is in dicyandiamide, diethyl triamine, MDA or diaminodiphenylsulfone
Any one or at least two combination；
Preferably, more phenol-based compounds are bisphenol-A, Bisphenol F, bisphenol S, linear phenolic resin, o-cresol aldehyde tree or double
One kind or at least two combination in phenol A phenolic resin.
5. a kind of composition epoxy resin, it is characterised in that include epoxy resin, and curing agent as claimed in claim 4；
Preferably, the epoxy resin is two functions or two function above epoxy resin；
Preferably, two functional epoxy resins are liquid bisphenol A types epoxy resin, liquid bisphenol F types epoxy resin, solid-state bisphenol-A
Type epoxy resin, solid-state bisphenol f type epoxy resin fat and one kind in bisphenol-s epoxy resin, biphenyl type epoxy resin or at least
Two kinds of combination；
Preferably, epoxy resin more than two functions is phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic
One kind or at least two combination of epoxy resin and acyclic isoprenoid type epoxy resin；
Preferably, also include and given birth to as the flame-retardant compound as described in one of claim 1-3 with epoxy resin by condensation reaction
Into more phenolic group phosphorus nitrogen epoxy resin, and other kinds of fire-retarded epoxy resin；
Preferably, the other kinds of fire-retarded epoxy resin content of halogen is not higher than 0.2%；
Preferably, the other kinds of fire-retarded epoxy resin is DOPO types epoxy resin, phosphorous type epoxy resin, nitrogenous type
Epoxy resin, nitrogenous phosphorous type epoxy resin, phosphorus-containing phenolic aldehyde epoxy resin, nitrogenous novolac epoxy resin containing phosphorous, siliceous type ring
Oxygen tree fat and one kind in sulfur-type epoxy resin or at least two combination；
Preferably, also comprising curing accelerator；
Preferably, the curing accelerator is imidazoles, triphenylphosphine and its derivative species, tertiary amines, quaternary ammonium salts and trifluoro
Change boron and its one kind in derivative species or at least two；
Preferably, the dosage of the curing accelerator is account for epoxy resin gross mass 0.001~2.5%, more preferably
0.03~1.2%；
Preferably, the composition epoxy resin also includes supporting material and filler；
Preferably, the supporting material is one kind in glass fibre, carbon fiber and polyester fiber or at least two combination；
Preferably, the filler is silica, diatomite, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, hydrogen-oxygen
Change one kind in aluminium or at least two combination；
Preferably, the dosage of the filler is no more than 500 times of epoxy resin gross mass；
Preferably, the composition epoxy resin also includes auxiliary agent, and the auxiliary agent is defoamer, coupling agent, toughener and levelling
One kind in agent or at least two.
A kind of 6. sulfur-bearing phosphonitrile epoxy resin, it is characterised in that be by non-halogen epoxy resin and as claims 1 to 3 it
The one reactive phosphorus nitrile compound is given birth under conditions of the epoxy radicals surplus of epoxy resin by reacting obtained epoxy resin
Into thing；
Preferably, the epoxide equivalent of the epoxy resin product is in below 3585g/eq；More preferably in below 1520g/eq；
Preferably, the reaction is carried out under conditions of catalyst without catalyst or have；
Preferably, the catalyst is in imidazoles, triphenylphosphine and its derivative species, tertiary amines and quaternary ammonium salts catalyst
One kind is used alone or a variety of is used in mixed way；
Preferably, the dosage of the catalyst is relative to the 0.01~2.5% of reactive phosphorus nitrile compound, is more preferably
0.02%~0.5%；
Preferably, the temperature of the reaction is 40~250 DEG C, more preferably 60~180 DEG C.
Preferably, the reaction is solvent-free or have and carry out under conditions of solvent, and the solvent is that ketones solvent, aromatics are molten
Agent, chlorinated solvents, ether solvent, ether alcohols solvent, alcohols solvent and one kind in petroleum solvent naphtha or at least two；
Preferably, the dosage of the solvent enters one for that can make the dosage for being 5~100% with sulfur-bearing phosphonitrile epoxy resin solid content
Step is preferably the dosage that sulfur-bearing phosphonitrile epoxy resin solid content is 20~100%；
Preferably, the non-halogen epoxy resin is epoxy resin more than two functions or two functions；
Preferably, the epoxy resin of two functions is liquid bisphenol A types epoxy resin, liquid bisphenol F types epoxy resin, solid-state bis-phenol
A types epoxy resin, solid-state bisphenol f type epoxy resin fat and one kind in bisphenol-s epoxy resin, biphenyl type epoxy resin or at least
Two kinds；
Preferably, epoxy resin more than two functions is phenol aldehyde type epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic
One kind or at least two of epoxy resin and acyclic isoprenoid type epoxy resin.
7. a kind of fire-retardant combination, it is characterised in that include sulfur-bearing phosphonitrile epoxy resin as claimed in claim 6；
Preferably, the epoxy fat resin with anti-flammability, curing agent, auxiliary agent, curing accelerator and halogen-free flame-retardance are also included
Filler；
Preferably, the epoxy resin with anti-flammability is DOPO types epoxy resin, phosphorous type epoxy resin, nitrogenous type ring oxygen
Resin, nitrogenous phosphorous type epoxy resin, phosphorus-containing phenolic aldehyde epoxy resin, nitrogenous novolac epoxy resin containing phosphorous, silicon-contained type asphalt mixtures modified by epoxy resin
Fat and one kind in sulfur-type epoxy resin or at least two；
Preferably, the curing agent is more phenol-based compounds, amine compound, benzoxazine colophony, acid anhydrides, polyacid and trifluoro
Change boron and its one kind in complex compound or at least two；
Preferably, the amine compound is the fat such as dicyandiamide, diethyl triamine, MDA, diaminodiphenylsulfone
Fat amine or aromatic amine；
Preferably, more phenol-based compounds be bisphenol-A, it is Bisphenol F, bisphenol S, linear phenolic resin, o-cresol urea formaldehyde, double
One kind or at least two in phenol A phenolic resin；
Preferably, the dosage of the curing agent and the equivalent proportion of epoxy resin 0.4~1.5；
Preferably, the curing accelerator is imidazoles, triphenylphosphine and its derivative species, tertiary amines, quaternary ammonium salts and trifluoro
Change boron and its one kind in derivative species or at least two；
Preferably, the dosage of the curing accelerator is account for epoxy resin gross mass 0.001~2.5%, more preferably
0.03~1.2%；
Preferably, the filler is in silica, kaolin, calcium carbonate, mica, titanium dioxide, magnesium hydroxide, aluminium hydroxide
One kind or at least two；
Preferably, the dosage of the filler is below the 500phr of epoxy resin gross mass；
Preferably, the auxiliary agent is the one or more in defoamer, coupling agent, toughener and levelling agent.
8. a kind of pre-impregnated sheet, it is characterised in that it is by composition epoxy resin as claimed in claim 5 or such as claim 7
The fire-retardant combination is impregnated with or is coated on base material and forms；
Preferably, the base material is fiberglass substrate, polyester base material, polyimide base material, ceramic base material or carbon fiber base material.
9. a kind of composite metal substrate, it is characterised in that it includes more than more than one pre-impregnated sheet as claimed in claim 8 successively
Carry out surface metal-clad, overlapping, pressing forms；
Preferably, the material of the surface metal-clad is the alloy of aluminium, copper, iron and its any combination；
Preferably, the composite metal substrate is but is not limited to CEM-1 copper-clad plates, CEM-3 copper-clad plates, FR-4 copper-clad plates, FR-5
Copper-clad plate, CEM-1 aluminium bases, CEM-3 aluminium bases, FR-4 aluminium bases or FR-5 aluminium bases.
10. a kind of wiring board, it is characterised in that formed in the Surface Machining circuit of the composite metal substrate described in claim 9.
11. a kind of plastic packaging material, it is characterised in that comprising composition epoxy resin as claimed in claim 5 or such as claim 7
The fire-retardant combination.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610523586.9A CN107573487A (en) | 2016-07-05 | 2016-07-05 | Phosphazene compound containing sulfydryl, curing agent and the epoxy resin of phosphonitrile containing sulfydryl |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610523586.9A CN107573487A (en) | 2016-07-05 | 2016-07-05 | Phosphazene compound containing sulfydryl, curing agent and the epoxy resin of phosphonitrile containing sulfydryl |
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| CN107573487A true CN107573487A (en) | 2018-01-12 |
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|---|---|---|---|
| CN201610523586.9A Pending CN107573487A (en) | 2016-07-05 | 2016-07-05 | Phosphazene compound containing sulfydryl, curing agent and the epoxy resin of phosphonitrile containing sulfydryl |
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| Country | Link |
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Application publication date: 20180112 |
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| RJ01 | Rejection of invention patent application after publication |