CN107555968B - High-temperature-resistant wave-absorbing wedge and preparation method thereof - Google Patents
High-temperature-resistant wave-absorbing wedge and preparation method thereof Download PDFInfo
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Abstract
The wave-absorbing wedge comprises a substrate layer and a high-temperature resistance coating which is uniformly coated and sintered on the surface of the substrate layer, wherein the substrate layer is made of alumina or mullite fiber reinforced mullite, and the high-temperature resistance coating is made of Bi2O3‑Al2O3‑SiO2Glass as a binder phase, RuO2Is a conductive phase. The preparation method comprises the following steps: (1) preparing a regular rectangular pyramid substrate layer with a hollow structure by using alumina or mullite fiber reinforced mullite; (2) preparing resistance paste, and printing the resistance paste on the surface of the substrate layer prepared in the step (1) by adopting screen printing; (3) and (3) sintering the substrate layer printed with the resistance paste in the step (2) at a high temperature to obtain the high-temperature-resistant wave-absorbing wedge. The wave-absorbing wedge has excellent broadband wave-absorbing performance, and the wave-absorbing frequency band can cover 2-18 GHz.
Description
Technical Field
The invention mainly relates to a wave-absorbing material and a preparation process thereof, in particular to a wave-absorbing wedge and a preparation method thereof.
Background
With the development of communication technology, stealth technology, simulation test technology and various electronic equipment, a microwave darkroom and a wave-absorbing material are rapidly developed and widely applied to the fields of communication, microwave technology, aerospace and the like. Along with the rapid development of electronization and informatization, higher requirements are put forward on the performance of a microwave darkroom, and the performance of the microwave darkroom depends on the wave-absorbing wedge to a great extent. With the development of high-power microwave devices and the requirement of electromagnetic property test of high-temperature wave-absorbing materials, higher requirements are put forward on the temperature resistance of the wave-absorbing wedge.
The existing commonly used wave-absorbing wedge mainly adopts a carburized polyurethane foam material which is an organic material and has limited temperature resistance which is generally not more than 150 ℃. Corresponding work is done by researchers in the aspect of improving the temperature resistance of the wave-absorbing wedge. Chinese patent document No. CN1286474A (application No. 00109462.9) discloses a foam glass wave-absorbing material, which is prepared by adding mineral materials, chemical materials and electromagnetic absorbers into foam glass, or coating an absorbent on the bottom surface of the foam glass, so that the foam glass wave-absorbing material has a wave-absorbing effect on radar waves, the temperature resistance of the adopted glass matrix is obviously improved relative to organic matrixes such as polyurethane, but the wave-absorbing performance of the glass matrix in the frequency band range of 2-18 GHz can only reach-8 to-25 dB, and the wave-absorbing performance is poor. Chinese patent document No. CN101985551A (application No. 201010259819.1) discloses a wave-absorbing material prepared by adding zinc powder and manganese dioxide into borosilicate foam glass and a preparation method thereof, wherein the wave-absorbing material has good temperature resistance, but the wave-absorbing performance can only reach-7 to-12 dB within the frequency range of 8-13 GHz, and the wave-absorbing performance is poor. Chinese patent publication No. CN104369498A (application No. 20140631078.3) discloses a wave-absorbing wedge composed of a fiber-reinforced resin-based composite material, a conductive coating and a resin protective coating, which has good wave-absorbing performance but poor temperature resistance.
The current wave-absorbing wedge can be found to be a blank wave-absorbing material wedge which can be used at high temperature and can resist high-power microwave radiation.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects and shortcomings in the background art, provide a wave-absorbing wedge with high temperature resistance and good wave-absorbing performance, and correspondingly provide a preparation method thereof. In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the wave-absorbing wedge comprises a substrate layer and a high-temperature-resistant resistance coating which is uniformly coated and sintered on the surface of the substrate layer, wherein the substrate layer is made of alumina or mullite fiber reinforced mullite, and the high-temperature-resistant resistance coating is made of Bi2O3-Al2O3-SiO2Glass as binder phase, RuO2Is a conductive phase.
In the high-temperature-resistant wave-absorbing wedge, preferably, the length of the bottom side of the regular rectangular pyramid is a, the thickness of the side plate is t, and the vertical height of the side plate is h, wherein the range of a is controlled to be 15-40 mm, the range of t is controlled to be 1-2 mm, and the range of h is controlled to be 100-400 mm.
In the high-temperature-resistant wave-absorbing wedge, preferably, the square resistance range of the high-temperature-resistant resistance coating is controlled to be 100-200 omega/□.
As a general technical concept, the invention also provides a preparation method of the high temperature resistant wave-absorbing wedge, which comprises the following steps:
(1) preparing a regular rectangular pyramid substrate layer with a hollow structure by using alumina or mullite fiber reinforced mullite;
(2) preparing resistance paste, and printing the resistance paste on the surface of the substrate layer prepared in the step (1) by adopting screen printing;
(3) and (3) sintering the substrate layer printed with the resistance paste in the step (2) at a high temperature to obtain the high-temperature-resistant wave-absorbing wedge.
In the above preparation method, preferably, in the step (1), the specific steps of preparing the regular rectangular pyramid substrate layer by using alumina are as follows: injecting the prepared alumina powder slurry into a mold by adopting a slurry injection process, drying, demolding, and sintering at high temperature to obtain a hollow alumina regular rectangular pyramid rough blank, fixing the rough blank in a special processing tool, and processing the hollow alumina regular rectangular pyramid to a required size by adopting a grinding machine; the method for preparing the regular rectangular pyramid substrate layer by using the mullite fiber reinforced mullite comprises the following specific steps: the method comprises the steps of firstly preparing a mullite fiber reinforced mullite flat plate by adopting a slurry forming and sintering process, then processing four triangular panels with wave-absorbing wedges according to size requirements, punching holes on two side edges of the triangular panels, fixing the punched triangular panels on the surface of a special tool, sewing the four triangular panels into a whole by adopting mullite sewing yarns, then processing and forming the four triangular panels into a hollow regular quadrangular pyramid shape by adopting a multi-time sol-gel process by taking mullite sol as a raw material, and finally grinding the mullite sewing yarns on the surface to obtain the mullite fiber reinforced mullite regular quadrangular pyramid substrate layer.
In the above manufacturing method, preferably, in the step (2), the manufacturing of the resistor paste includes the steps of: firstly, uniformly mixing and smelting glass raw material powder, quenching the molten glass in water to obtain glass slag, crushing the glass slag to obtain glass powder, and then mixing the glass powder with RuO2And mixing to obtain mixed powder, and finally mixing the mixed powder with an organic carrier to prepare the resistance paste. The specific process is as follows:
① glass melting, the glass melting furnace contains Bi2O3、Al2O3、SiO2、CaO、MgO、B2O3The glass raw materials are uniformly mixed, put into a platinum crucible, then placed into a box-type furnace for high-temperature smelting, and the molten glass melt is poured into deionized water for quenching to obtain the required glass slag; preferably, the technological parameters of the high-temperature smelting process are as follows: the smelting temperature is 1400-1450 ℃, and the smelting heat preservation time is 1-3 h;
②, crushing glass, namely ball-milling the prepared glass slag in an agate ball-milling tank, taking acetone as a ball-milling medium, drying and sieving to obtain glass powder with a certain particle size, wherein the ball-milling process parameters are preferably that the ball-material ratio is (2-3) 1, the ball-milling rotation speed is 380 r/min-450 r/min, the ball-milling time is 6 h-12 h, and the sieving refers to sieving with a 200-400-mesh sieve;
③ mixing the glass powder after being crushed and sieved with RuO2Uniformly mixing in a planetary gravity mixer according to a certain mass ratio; preferably, the process parameters of the planetary gravity mixer are as follows: the revolution speed is 1280-1500 rpm, the rotation speed is 30-60%, and the stirring time is 60-120 min;
④ rolling the slurry, namely mixing the mixed powder prepared in the step ③ with an organic carrier according to a ratio, and mixing the mixture by a three-roll grinder to obtain the resistance slurry, wherein the organic carrier mainly comprises 80-90% of tributyl citrate (solvent), 2-5% of cellulose nitrate (thickening agent) and 5-18% of lecithin (surfactant) by mass, and the organic carrier mainly acts as dispersed mixed powder to enable the slurry to have a printable characteristic, the rotation speed of the three-roll grinder is preferably 250-450 r/min, and the grinding and mixing time is preferably 1-2 h.
In the above preparation method, preferably, the glass raw materials respectively comprise the following components in percentage by mass:
in the above preparation method, preferably, the glass frit and RuO2RuO in mixing2The addition amount of (A) is glass powder and RuO249-55% of the total mass, and the addition amount of the mixed powder when the mixed powder is mixed with the organic carrier accounts for 75-80% of the total mass of the mixed powder and the organic carrier.
In the preparation method, preferably, when the resistance paste is printed on the surface of the substrate layer, the mesh number of the silk screen is 200-350 meshes, the drying temperature of the paste is preferably 150-200 ℃, and the time is 30-60 min.
In the preparation method, the viscosity of the resistance paste is preferably 140-250 pa · s.
In the preparation method, preferably, in the step (3), the sintering temperature of the high-temperature sintering is 850-1000 ℃, the heating rate is 15-20 ℃/min, and the sintering time is 10-30 min.
According to the invention, the alumina or mullite fiber reinforced mullite is used as a material of the substrate, so that the substrate can bear higher temperature while having higher mechanical strength, and the ruthenium dioxide glass-based resistance coating is used as a high-temperature resistance coating, so that the wave-absorbing wedge has the advantages of high temperature resistance and stable resistance property.
Compared with the prior art, the invention has the advantages that:
1. the base body and the resistance coating of the wave-absorbing wedge are prepared from materials with excellent temperature resistance, the resistance coating is a ruthenium dioxide glass-based resistance coating with high resistance, the maximum using temperature of the wave-absorbing wedge can reach over 1000 ℃, and the wave-absorbing wedge has good high temperature resistance and oxidation resistance.
2. The wave-absorbing wedge has a wedge structure and a wave-absorbing resistance coating, and the wedge structure and the wave-absorbing resistance coating have synergistic effect, so that the wave-absorbing wedge has excellent broadband wave-absorbing performance, and the wave-absorbing frequency band can cover 2-18 GHz.
3. The wave-absorbing wedge has a simple structure, is easy to prepare, can be prepared into wave-absorbing wedges with different specifications and shapes according to requirements, and can meet the requirements of different occasions.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a structural size diagram of a wedge unit of the high temperature resistant wave-absorbing material of the invention.
Fig. 2 is a photo of a hollow alumina wave-absorbing wedge in example 1 of the present invention.
Fig. 3 is a photo of a hollow mullite fiber reinforced mullite wave-absorbing wedge in embodiment 2 of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of the invention is not limited to the specific embodiments below.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present invention.
Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or can be prepared by existing methods.
Example 1:
a high temperature resistant wave absorbing material wedge as shown in figures 1 and 2 is a regular rectangular pyramid with a hollow structure, and comprises a substrate layer and a high temperature resistant resistance coating which is uniformly coated and sintered on the surface of the substrate layer, wherein the substrate layer is a hollow alumina regular rectangular pyramid, and the resistance coating is Bi2O3-Al2O3-SiO2Glass as a binder phase, RuO2Is a conductive phase. The bottom side length a of the regular rectangular pyramid is 20mm, the side plate thickness t is 1.5mm, the side plate vertical height h is 150mm, and the sheet resistance average value of the resistance coating is about 190 omega/□.
The preparation method of the wedge of the high-temperature-resistant wave-absorbing material comprises the following steps:
(1) preparing a hollow alumina regular rectangular pyramid substrate layer: injecting the prepared alumina powder slurry into a mold by adopting a slurry injection process, drying, demolding, and sintering at high temperature to obtain a hollow alumina regular rectangular pyramid rough blank, fixing the rough blank in a special processing tool, and processing the hollow alumina regular rectangular pyramid to a required size by adopting a grinding machine;
(2) preparing resistance paste: resistor paste with RuO2As a conductive phase, with Bi2O3-Al2O3-SiO2The preparation process of the resistance paste comprises glass smelting, glass crushing, material mixing and paste rolling processes, and specifically comprises the following steps:
① glass melting, the glass melting furnace contains Bi2O3、Al2O3、SiO2、CaO、MgO、B2O3The glass raw material powder is uniformly mixed, put into a platinum crucible, then put into a high-temperature box type furnace together, heated to 1400 ℃ at the speed of 20 ℃/min, and kept for 3 hours, and then the melted glass melt is poured into deionized water for quenching to obtain the required glass slag;
the glass raw material powder in this example comprises the following components in parts by mass:
②, crushing glass, namely ball-milling the glass slag obtained by smelting in an agate ball-milling tank, taking acetone as a ball-milling medium, performing ball-material ratio of 2:1, rotating speed of 450r/min, performing ball-milling for 8 hours, drying for 1 hour at 100 ℃ after ball-milling is completed, and sieving with a 400-mesh sieve to obtain glass powder with the required particle size;
③ mixing the glass powder after being crushed and sieved with RuO2Mixing the powder in a planetary gravity mixer according to the mass ratio of 51% to 49%, wherein the revolution speed of the mixer is 1460rpm, the rotation speed is 30%, and the time is 120 min;
④ rolling slurry, namely preparing an organic carrier from tributyl citrate, cellulose nitrate and lecithin according to the mass ratio of 80:5:15, and then mixing the glass prepared in the step ③ with RuO2Mixing the mixed powder and an organic carrier according to a mass ratio of 75:25, grinding and mixing the materials in a three-roll grinder at a rotating speed of 300r/min for 1.5h to obtain resistance slurry, wherein the viscosity of the slurry is 220 Pa.s;
(3) fixing the hollow alumina regular rectangular pyramid substrate layer prepared in the step (1) in a special tool, printing the prepared resistance paste on one surface of the substrate layer by adopting a 300-mesh silk screen and utilizing a printing process, drying the substrate layer in an oven at 150 ℃ for 60min, and then repeating the step (3) to finish printing the resistance paste on each surface of the substrate layer one by one;
(4) and (4) placing the substrate layer of the resistance paste printed in the step (3) in a box-type furnace, and sintering at a high temperature of 850 ℃ for 10min at a heating rate of 15 ℃/min to prepare the high-temperature-resistant wave-absorbing wedge in the embodiment.
The prepared wave-absorbing wedge array is placed, the reflectivity of 2-18 GHz is tested under the normal incidence condition of electromagnetic waves, and the experimental results are shown in Table 1. As can be seen from table 1, the wave-absorbing wedge prepared in this embodiment has excellent broadband wave-absorbing performance.
Table 1: wave absorbing performance test result of wave absorbing wedge in example 1
| frequency/GHz | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| reflectivity/dB | -19.52 | -22.51 | -23.06 | -49.68 | -36.82 | -39.33 | -37.93 | -37.71 | -41.22 |
| frequency/GHz | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | |
| reflectivity/dB | -33.37 | -41.29 | -37.86 | -33.83 | -31.19 | -50.04 | -34.96 | -32.97 |
Example 2:
a high-temperature resistant wave-absorbing material wedge as shown in figures 1 and 3 is a hollow regular rectangular pyramid and comprises a substrate layer and a high-temperature resistant resistance coating which is uniformly coated and sintered on the surface of the substrate layer, wherein the substrate layer is a hollow mullite fiber reinforced mullite regular rectangular pyramid, and the resistance coating is Bi2O3-Al2O3-SiO2Glass as a binder phase, RuO2Is a conductive phase. The bottom side length a of the regular rectangular pyramid is 30mm, the side plate thickness t is 2mm, the side plate vertical height h is 300mm, and the sheet resistance average value of the resistance coating is about 150 omega/□.
The preparation method of the wedge of the high-temperature-resistant wave-absorbing material comprises the following steps:
(1) preparing a hollow mullite fiber reinforced mullite regular rectangular pyramid substrate layer: firstly, preparing a mullite fiber reinforced mullite flat plate through a slurry forming and sintering process, then processing four wedge-shaped triangular panels according to the size requirement, punching holes on two side edges of the triangular panels, fixing the punched triangular panels on the surface of a special tool, sewing the four triangular panels into a whole by adopting mullite sewing yarns, then forming the four triangular panels into a hollow quadrangular pyramid shape by adopting a multi-time sol-gel process by taking mullite sol as a raw material, and finally grinding the mullite sewing yarns on the surface to obtain a hollow mullite fiber reinforced mullite regular quadrangular pyramid substrate layer;
(2) preparing resistance paste: resistor paste with RuO2As a conductive phase, with Bi2O3-Al2O3-SiO2The preparation process of the resistance paste comprises glass smelting, glass crushing, material mixing and paste rolling processes, and specifically comprises the following steps:
① glass melting, the glass melting furnace contains Bi2O3、Al2O3、SiO2、CaO、MgO、B2O3The glass raw material powder is uniformly mixed, put into a platinum crucible, then put into a high-temperature box type furnace together, heated to 1450 ℃ at the speed of 20 ℃/min, and kept warm for 1h, and then the melted glass melt is poured into deionized water for quenching to obtain the required glass slag;
the glass raw material powder in this example comprises the following components in parts by mass:
②, crushing glass, namely ball-milling the glass slag obtained by smelting in an agate ball-milling tank, taking acetone as a ball-milling medium, wherein the ball-material ratio is 3:1, the rotating speed is 400r/min, the ball-milling time is 12 hours, drying for 1 hour at 100 ℃ after the ball-milling is finished, and sieving with a 300-mesh sieve to obtain glass powder with the required particle size;
③ mixing the glass powder after being crushed and sieved with RuO2Mixing the powder in a planetary gravity mixer according to the mass ratio of 49% to 51%, wherein the revolution speed of the mixer is 1280rpm, the rotation speed is 45%, and the time is 120 min;
④ rolling slurry, namely preparing an organic carrier by tributyl citrate, cellulose nitrate and lecithin according to the mass ratio of 85:5:10,then the glass prepared in the step ③ is mixed with RuO2Mixing the mixed powder and an organic carrier according to a mass ratio of 80:20, and then grinding and mixing the materials in a three-roll grinder at a rotating speed of 300r/min for 2h to obtain resistance slurry, wherein the viscosity of the slurry is 250 Pa.s;
(3) fixing the hollow mullite fiber reinforced mullite regular rectangular pyramid substrate layer prepared in the step (1) in a special tool, printing the prepared resistance paste on one surface of the substrate layer by adopting a 200-mesh silk screen and a printing process, drying the substrate layer in an oven at 200 ℃ for 30min, and then repeating the step (3) to finish printing the resistance paste on each surface of the substrate layer one by one;
(4) and (4) placing the substrate layer printed with the resistance paste in the step (3) in a box-type furnace, and sintering at a high temperature of 1000 ℃ for 20min at a heating rate of 20 ℃/min to prepare the high-temperature-resistant wave-absorbing wedge in the embodiment.
The prepared wave-absorbing wedge array is placed, the reflectivity of 2-18 GHz is tested under the normal incidence condition of electromagnetic waves, and the experimental results are shown in Table 2. As can be seen from table 2, the wave-absorbing wedge prepared in this embodiment has excellent broadband wave-absorbing performance.
Table 2: wave absorbing performance test result of wave absorbing wedge in example 2
| frequency/GHz | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
| reflectivity/dB | -31.74 | -27.55 | -21.89 | -33.00 | -36.95 | -40.44 | -36.05 | -35.98 | -38.39 |
| frequency/GHz | 11 | 12 | 13 | 14 | 15 | 16 | 17 | 18 | |
| reflectivity/dB | -34.28 | -37.39 | -38.00 | -36.23 | -32.39 | -35.55 | -34.69 | -38.19 |
Claims (8)
1. The wave-absorbing wedge is a regular rectangular pyramid with a hollow structure and is characterized by comprising a substrate layer and a high-temperature-resistant resistance coating which is uniformly coated and sintered on the surface of the substrate layer, wherein the substrate layer is made of alumina or mullite fiber reinforced mullite, and the high-temperature-resistant resistance coating is made of Bi2O3-Al2O3-SiO2Glass as a binder phase, RuO2Is a conductive phase;
the sheet resistance range of the high-temperature resistance coating is controlled to be 100-200 omega/□;
the Bi2O3-Al2O3-SiO2The raw material of the glass comprises Bi2O3、Al2O3、SiO2、CaO、MgO、B2O3The glass raw materials respectively comprise the following components in percentage by mass:
Bi2O340%~60%；
Al2O310%～25%；
SiO215%～25%；
CaO 2%～5%；
MgO 1%～5%；
B2O32~6%。
2. the wedge of claim 1, wherein the regular rectangular pyramid has a bottom side length a, a side plate thickness t, and a vertical height h, wherein a is controlled to be 15-40 mm, t is controlled to be 1-2 mm, and h is controlled to be 100-400 mm.
3. A method for preparing the high temperature resistant wave absorbing wedge of claim 1 or 2, comprising the following steps:
(1) preparing a regular rectangular pyramid substrate layer with a hollow structure by using alumina or mullite fiber reinforced mullite;
(2) preparing resistance paste, and printing the resistance paste on the surface of the substrate layer prepared in the step (1) by adopting screen printing;
(3) and (3) sintering the substrate layer printed with the resistance paste in the step (2) at a high temperature to obtain the high-temperature-resistant wave-absorbing wedge.
4. The method according to claim 3, wherein in the step (1), the specific steps for preparing the regular rectangular pyramid substrate layer from alumina are as follows: injecting the prepared alumina powder slurry into a mold by adopting a slurry injection process, drying, demolding, and sintering at high temperature to obtain a hollow alumina regular rectangular pyramid rough blank, fixing the rough blank in a special processing tool, and processing the hollow alumina regular rectangular pyramid to a required size by adopting a grinding machine; the method for preparing the regular rectangular pyramid substrate layer by using the mullite fiber reinforced mullite comprises the following specific steps: the method comprises the steps of firstly preparing a mullite fiber reinforced mullite flat plate by adopting a slurry forming and sintering process, then processing four triangular panels with wave-absorbing wedges according to size requirements, punching holes on two side edges of the triangular panels, fixing the punched triangular panels on the surface of a special tool, sewing the four triangular panels into a whole by adopting mullite sewing yarns, then processing and forming the four triangular panels into a hollow regular quadrangular pyramid shape by adopting a multi-time sol-gel process by taking mullite sol as a raw material, and finally grinding the mullite sewing yarns on the surface to obtain the mullite fiber reinforced mullite regular quadrangular pyramid substrate layer.
5. The manufacturing method according to claim 3, wherein in the step (2), the manufacturing of the electrical resistance paste includes the steps of: firstly, mixing and smelting glass raw materials uniformly, quenching the molten glass melt in water to obtain glass slag, crushing the glass slag to obtain glass powder,then mixing the glass powder with RuO2And mixing to obtain mixed powder, and finally mixing the mixed powder with an organic carrier to prepare the resistance paste.
6. The method of claim 5, wherein the glass frit is mixed with RuO2RuO in mixing2The addition amount of (A) is glass powder and RuO249-55% of the total mass, and the adding amount of the mixed powder when the mixed powder is mixed with the organic carrier accounts for 75-80% of the total mass of the mixed powder and the organic carrier.
7. The method according to claim 5, wherein the viscosity of the resistor paste is 140 to 250 pa-s.
8. The preparation method according to claim 3, wherein in the step (3), the sintering temperature of the high-temperature sintering is 850-1000 ℃, the heating rate is 15-20 ℃/min, and the sintering time is 10-30 min.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09307268A (en) * | 1996-05-13 | 1997-11-28 | Tohoku Kako Kk | Radio wave absorbing material |
| CN202156067U (en) * | 2011-02-24 | 2012-03-07 | 南京南大波平电子信息有限公司 | Polyurethane foam wedge wave absorbing material |
| CN104369498A (en) * | 2014-11-11 | 2015-02-25 | 中国人民解放军国防科学技术大学 | Composite wave absorbing wedge and preparation method thereof |
| CN106007804A (en) * | 2016-05-18 | 2016-10-12 | 中国人民解放军国防科学技术大学 | Radar wave-absorbing material with high-temperature-resistant and high-impedance surface and preparation method of radar wave-absorbing material |
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- 2017-08-30 CN CN201710761969.4A patent/CN107555968B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09307268A (en) * | 1996-05-13 | 1997-11-28 | Tohoku Kako Kk | Radio wave absorbing material |
| CN202156067U (en) * | 2011-02-24 | 2012-03-07 | 南京南大波平电子信息有限公司 | Polyurethane foam wedge wave absorbing material |
| CN104369498A (en) * | 2014-11-11 | 2015-02-25 | 中国人民解放军国防科学技术大学 | Composite wave absorbing wedge and preparation method thereof |
| CN106007804A (en) * | 2016-05-18 | 2016-10-12 | 中国人民解放军国防科学技术大学 | Radar wave-absorbing material with high-temperature-resistant and high-impedance surface and preparation method of radar wave-absorbing material |
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