CN107553765B - Silicon wafer cutting and falling-preventing blanking device - Google Patents
Silicon wafer cutting and falling-preventing blanking device Download PDFInfo
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- CN107553765B CN107553765B CN201711038180.2A CN201711038180A CN107553765B CN 107553765 B CN107553765 B CN 107553765B CN 201711038180 A CN201711038180 A CN 201711038180A CN 107553765 B CN107553765 B CN 107553765B
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- silicon wafer
- falling
- loading platform
- blanking device
- telescopic arms
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 66
- 239000010703 silicon Substances 0.000 title claims abstract description 66
- 239000013078 crystal Substances 0.000 claims abstract description 5
- 239000004677 Nylon Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000013016 damping Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 37
- 238000007599 discharging Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Transmission Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application belongs to the technical field of silicon wafer cutting. The silicon wafer cutting anti-falling blanking device comprises a base, an upright post and a supporting cantilever, wherein the upright post is fixedly arranged on the base, a sliding rail is arranged on the upright post, sliding blocks are arranged in the sliding rail in a matching manner, and a lifting mechanism for driving the sliding blocks is arranged on the upright post; the silicon wafer loading platform is characterized in that the supporting cantilever is fixedly arranged on the sliding block, a silicon wafer loading platform is arranged at the lower part of the supporting cantilever, at least two groups of parallel connecting rods are pivoted between the silicon wafer loading platform and the supporting cantilever, a swinging mechanism for driving the silicon wafer loading platform to swing back and forth is arranged on the sliding block, and the silicon wafer is fixedly arranged on the silicon wafer loading platform through crystal support matching and clamping; and the support cantilever is also provided with an anti-falling sheet component. The application not only can effectively improve the safety performance of the silicon wafer in the loading and unloading process, but also is convenient to operate, and in addition, the application can realize the damping and buffering effects, so that the silicon wafer is conveyed more stably.
Description
Technical Field
The application belongs to the technical field of silicon wafer cutting, and particularly relates to a silicon wafer cutting anti-falling discharging device.
Background
The silicon wafer is subjected to linear cutting, the silicon wafer is required to be fed and discharged through the crystal support and the feeding and discharging device, the feeding and discharging of the silicon wafer is difficult due to the influence of workshop environment, the operation is inconvenient, a large amount of manpower and material resources are consumed by a traditional feeding and discharging method, the risk of falling the silicon wafer exists, and irrecoverable loss is easily caused.
Disclosure of Invention
The application aims to solve the problems and the defects, and provides the silicon wafer cutting and falling-preventing blanking device which has reasonable structural design and good stability, can greatly improve the safety of silicon wafer loading and blanking and can prevent falling of silicon wafers.
In order to achieve the above purpose, the technical scheme adopted is as follows:
a piece unloader is prevented falling in silicon chip cutting includes: the device comprises a base and an upright post, wherein the upright post is fixedly arranged on the base, a sliding rail is arranged on the upright post, a sliding block is arranged in the sliding rail in a matching manner, and a lifting mechanism for driving the sliding block is arranged on the upright post; the silicon wafer loading platform is fixedly arranged on the sliding block, at least two groups of parallel connecting rods are pivoted between the silicon wafer loading platform and the supporting cantilever, a swinging mechanism for driving the silicon wafer loading platform to swing back and forth is arranged on the sliding block, and the silicon wafer is fixedly arranged on the silicon wafer loading platform through wafer support matching and clamping; the support cantilever is further provided with an anti-falling piece assembly, the anti-falling piece assembly comprises two groups of telescopic arms pivoted on two sides of the support cantilever, a stay bar arranged at the lower end part of the telescopic arms and a rotating mechanism arranged at the upper end of the telescopic arms, the rotating mechanism drives the telescopic arms to rotate and swing, after the silicon wafer is cut, the stay bar is pulled downwards, the telescopic arms are prolonged, and the stay bar props against the lower side of the silicon wafer to prevent falling pieces.
The rotating mechanism is a reset spring arranged between the two groups of telescopic arms.
The rotating mechanism comprises a driven gear ring coaxially arranged with the pivot shaft of the telescopic arms, a driving gear ring arranged between the two groups of telescopic arms and a driving motor for driving the driving gear ring, wherein the driven gear ring and the telescopic arms are of an integrated structure, and the driving motor is connected with a rotating shaft of the driving gear ring through bevel gear transmission.
The telescopic arm comprises an outer sleeve, a middle sleeve and an inner sleeve, corresponding limiting edges are arranged between two adjacent sleeves in a staggered mode, and a telescopic spring is arranged between the outer sleeve and the inner sleeve.
The support rod is pivoted on the telescopic arm, a protection support is sleeved on the outer side of the support rod, at least one plane is arranged on the protection support, and when the silicon wafer is supported by the support rod, the plane side of the protection support is attached to the silicon wafer.
The protection support is made of rubber or nylon.
An extension spring is arranged between the parallel connecting rod and the supporting cantilever, an elastic limit column is arranged at the rear end of the feeding table, a supporting table corresponding to the elastic limit column is arranged on the supporting cantilever, and the elastic limit column can be a spring or other telescopic columns with elastic expansion.
A damper is pivoted between the supporting cantilever and the feeding table.
The swing mechanism is a take-up pulley arranged on the sliding block, and the stretching end of the take-up pulley is connected with the rear end of the feeding table.
The lifting mechanism comprises a winch and a pulley, the steel wire rope end of the winch is connected with the sliding block, and the pulley is arranged at the top of the upright post.
By adopting the technical scheme, the beneficial effects are that:
the application has reasonable structural design, can effectively improve the safety performance of the silicon wafer in the loading and unloading process, is convenient to operate, and can effectively realize the shock absorption and buffering effects through the structural arrangement of the extension spring, the damper and the elastic limiting column, so that the silicon wafer is conveyed more stably; the parallel connecting rod and the swinging mechanism are arranged, so that the positioning adjustment of feeding and discharging can be realized, the stability is good, the positioning is accurate, the operation is convenient, the single person can finish the operation quickly, and the device has great practicability.
Drawings
Fig. 1 is a schematic structural view of the present application.
Fig. 2 is a schematic view of the stay bar of the present application in use.
Fig. 3 is a schematic structural view of the rotating mechanism.
FIG. 4 is a second schematic structural view of the rotating mechanism.
Fig. 5 is a schematic structural view of the telescopic arm.
Number in the figure: 100 is a base, 101 is a roller, 200 is a column, 201 is a pushing handle, 202 is a pulley, 203 is a sliding block, 300 is a supporting cantilever, 301 is a parallel connecting rod, 302 is an extension spring, 303 is an elastic limit column, 304 is a supporting table, 305 is a damper, 400 is a loading table, 401 is a wire take-up pulley, 402 is a crystal bracket, 403 is a telescopic arm, 4031 is an outer sleeve, 4032 is a middle sleeve, 4033 is an inner sleeve, 4034 is a limit edge, 4035 is a telescopic spring, 404 is a supporting rod, 405 is a rotating mechanism, 4051 is a reset spring, 4052 is a driven gear ring, 4053 is a driving gear ring, 4054 is a driving motor, 4055 is a bevel gear and 406 is a protection bracket.
Detailed Description
The following describes the embodiments of the present application in detail with reference to the drawings.
Referring to fig. 1-5, the application relates to a silicon wafer cutting anti-falling sheet blanking device, which comprises a base 100, an upright post 200 and a supporting cantilever 300, wherein the upright post 200 is fixedly arranged on the base 100, a sliding rail is arranged on the upright post 200, a sliding block 203 is arranged in the sliding rail in a matching way, and a lifting mechanism for driving the sliding block 203 is arranged on the upright post 200; the support cantilever 300 is fixedly arranged on the sliding block 203, a silicon wafer loading table 400 is arranged at the lower part of the support cantilever 300, at least two groups of parallel connecting rods 301 are pivoted between the silicon wafer loading table 400 and the support cantilever 300, a swinging mechanism for driving the silicon wafer loading table 400 to swing back and forth is arranged on the sliding block 203, and a silicon wafer is fixedly arranged on the silicon wafer loading table 400 through matching and clamping of a crystal support 402; the support cantilever 300 is further provided with an anti-falling piece assembly, the anti-falling piece assembly comprises two groups of telescopic arms 403 pivoted on two sides of the support cantilever 300, a stay bar 404 arranged at the lower end part of the telescopic arms 403 and a rotating mechanism arranged at the upper end of the telescopic arms 403, the rotating mechanism drives the telescopic arms 403 to rotate and swing, after the silicon wafer is cut, the stay bar is pulled downwards, the telescopic arms are extended, and the stay bar props the lower side of the silicon wafer to prevent falling pieces.
The rotation mechanism 405 in this embodiment may be a return spring 4051 disposed between two sets of telescoping arms.
Alternatively, the rotation mechanism 405 includes a driven gear 4052 coaxially disposed with the pivot shaft of the telescopic arm 403, a driving gear 4053 disposed between the two sets of telescopic arms, and a driving motor 4054 for driving the driving gear, where the driven gear 4052 and the telescopic arm 4045 are in an integral structure, and the driving motor 4054 is in transmission connection with the rotation shaft of the driving gear 4053 through a bevel gear 4055.
The telescopic arm 403 in this embodiment includes an outer sleeve 4031, a middle sleeve 4032 and an inner sleeve 4033, corresponding limiting edges 4034 are arranged between two adjacent sleeves in a staggered manner, and a telescopic spring 4035 is arranged between the outer sleeve 4031 and the inner sleeve 4033.
Further, in order to ensure that the support between the stay bar and the silicon wafer is attached stably, the stay bar 404 is pivoted on the telescopic arm 403, and the outer side of the stay bar 404 is sleeved with the protection support 406, the protection support 406 is provided with at least one plane, and when the silicon wafer is supported, the plane side of the protection support 406 is attached to the silicon wafer for supporting, so as to avoid damage to the silicon wafer, the protection support 406 is made of rubber or nylon.
In order to improve the buffering performance, the silicon wafer is prevented from falling due to vibration, an extension spring 302 is arranged between the parallel connecting rod 301 and the supporting cantilever 300, an elastic limiting column 303 is arranged at the rear end of the feeding table, a supporting table 304 corresponding to the elastic limiting column is arranged on the supporting cantilever, and the elastic limiting column can be a spring or other telescopic columns with elastic expansion. Meanwhile, a damper 305 is pivotally provided between the support cantilever 300 and the loading table 400.
The swing mechanism of the application can be any mechanism capable of driving the feeding table to move back and forth, and the embodiment adopts the take-up pulley 401 arranged on the sliding block, and the stretching end of the take-up pulley 401 is connected with the rear end of the feeding table 400. The lower part of the base is provided with the roller, the upright post 200 is provided with the pushing handle 201, the lifting mechanism in the application can be any power mechanism capable of driving the sliding block to move up and down, the lifting mechanism in the embodiment comprises a winch and a pulley 202, the steel wire rope end of the winch is connected with the sliding block, and the pulley is arranged at the top of the upright post.
The application has reasonable structural design, can effectively improve the safety performance of the silicon wafer in the loading and unloading process, is convenient to operate, and can effectively realize the shock absorption and buffering effects through the structural arrangement of the extension spring, the damper and the elastic limiting column, so that the silicon wafer is conveyed more stably; the parallel connecting rod and the swinging mechanism are arranged, so that the positioning adjustment of feeding and discharging can be realized, the stability is good, the positioning is accurate, the operation is convenient, the single person can finish the operation quickly, and the device has great practicability.
The foregoing has shown and described the basic principles, principal features and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made therein without departing from the spirit and scope of the application, which is defined by the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.
Claims (8)
1. Piece unloader is prevented falling in silicon chip cutting, its characterized in that includes:
a base;
the upright post is fixedly arranged on the base, a sliding rail is arranged on the upright post, a sliding block is arranged in the sliding rail in a matching manner, and a lifting mechanism for driving the sliding block is arranged on the upright post;
the silicon wafer loading platform is fixedly arranged on the sliding block, a silicon wafer loading platform is arranged at the lower part of the supporting cantilever, at least two groups of parallel connecting rods are pivoted between the silicon wafer loading platform and the supporting cantilever, a swinging mechanism for driving the silicon wafer loading platform to swing back and forth is arranged on the sliding block, and the silicon wafer is fixedly arranged on the silicon wafer loading platform through crystal support matching and clamping;
the support cantilever is also provided with an anti-falling piece assembly, the anti-falling piece assembly comprises two groups of telescopic arms pivoted on two sides of the support cantilever, a stay bar arranged at the lower end part of the telescopic arms and a rotating mechanism arranged at the upper end of the telescopic arms, the rotating mechanism drives the telescopic arms to rotate and swing, after the silicon wafer is cut, the stay bar is pulled downwards, the telescopic arms are prolonged, and the stay bar props the lower side of the silicon wafer to prevent falling pieces;
an extension spring is arranged between the parallel connecting rod and the supporting cantilever, an elastic limit column is arranged at the rear end of the feeding table, and a supporting table corresponding to the elastic limit column is arranged on the supporting cantilever; a damper is pivoted between the supporting cantilever and the feeding table.
2. The silicon wafer cutting and falling-preventing blanking device according to claim 1, wherein the rotating mechanism is a return spring arranged between two groups of telescopic arms.
3. The silicon wafer cutting and falling-preventing blanking device according to claim 1, wherein the rotating mechanism comprises a driven gear ring coaxially arranged with a pivot shaft of the telescopic arms, a driving gear ring arranged between the two groups of telescopic arms, and a driving motor for driving the driving gear ring, the driven gear ring and the telescopic arms are of an integrated structure, and the driving motor is connected with a rotating shaft of the driving gear ring through bevel gears.
4. The silicon wafer cutting and falling-preventing blanking device according to claim 1, wherein the telescopic arm comprises an outer sleeve, a middle sleeve and an inner sleeve, corresponding limiting edges are arranged between two adjacent sleeves in a staggered mode, and a telescopic spring is arranged between the outer sleeve and the inner sleeve.
5. The silicon wafer cutting and falling preventing blanking device according to claim 1, wherein the supporting rod is pivoted on the telescopic arm, a protection support is sleeved on the outer side of the supporting rod, at least one plane is arranged on the protection support, and when the silicon wafer is supported by the supporting rod, the plane side of the protection support is attached to the silicon wafer.
6. The silicon wafer cutting and falling preventing blanking device according to claim 5, wherein the protective support is made of rubber or nylon.
7. The silicon wafer cutting and falling-preventing blanking device according to claim 1, wherein the swinging mechanism is a take-up pulley arranged on the sliding block, and the stretching end of the take-up pulley is connected with the rear end of the feeding platform.
8. The silicon wafer cutting and falling-preventing blanking device according to claim 1, wherein rollers are arranged at the lower portion of the base, pushing hands are arranged on the upright posts, the lifting mechanism comprises a winch and pulleys, the steel wire rope end of the winch is connected with the sliding blocks, and the pulleys are arranged at the tops of the upright posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711038180.2A CN107553765B (en) | 2017-10-31 | 2017-10-31 | Silicon wafer cutting and falling-preventing blanking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711038180.2A CN107553765B (en) | 2017-10-31 | 2017-10-31 | Silicon wafer cutting and falling-preventing blanking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107553765A CN107553765A (en) | 2018-01-09 |
| CN107553765B true CN107553765B (en) | 2023-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711038180.2A Active CN107553765B (en) | 2017-10-31 | 2017-10-31 | Silicon wafer cutting and falling-preventing blanking device |
Country Status (1)
| Country | Link |
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| CN (1) | CN107553765B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN217837386U (en) * | 2022-03-22 | 2022-11-18 | 天津市环智新能源技术有限公司 | Feeding buffer storage table |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11179225A (en) * | 1997-12-25 | 1999-07-06 | Nkk Corp | Rod carrying device of rod mill |
| CN2823199Y (en) * | 2005-02-06 | 2006-10-04 | 中国国际海运集装箱(集团)股份有限公司 | Tunnel stacker and goods storing raceway table mated with same |
| CN102328827A (en) * | 2011-06-15 | 2012-01-25 | 湖南红太阳光电科技有限公司 | Graphite boat trolley for plasma enhanced chemical vapor deposition (PECVD) automatic wafer loading and unloading system |
| CN202964940U (en) * | 2012-09-24 | 2013-06-05 | 衡水英利新能源有限公司 | Device for preventing silicon wafers falling from solar cell cutting machine |
| CN204622359U (en) * | 2015-05-04 | 2015-09-09 | 邢台晶龙电子材料有限公司 | Silicon rod handler |
| CN105819238A (en) * | 2016-04-05 | 2016-08-03 | 青阳县恒远机械制造有限责任公司 | Material drop preventing device of loading machine |
| CN106429400A (en) * | 2016-11-30 | 2017-02-22 | 广西玉柴机器股份有限公司 | Device capable of automatically preventing falling |
| CN207344888U (en) * | 2017-10-31 | 2018-05-11 | 河南省博宇新能源有限公司 | Silicon chip cuts anti-lost slice baiting apparatus |
-
2017
- 2017-10-31 CN CN201711038180.2A patent/CN107553765B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11179225A (en) * | 1997-12-25 | 1999-07-06 | Nkk Corp | Rod carrying device of rod mill |
| CN2823199Y (en) * | 2005-02-06 | 2006-10-04 | 中国国际海运集装箱(集团)股份有限公司 | Tunnel stacker and goods storing raceway table mated with same |
| CN102328827A (en) * | 2011-06-15 | 2012-01-25 | 湖南红太阳光电科技有限公司 | Graphite boat trolley for plasma enhanced chemical vapor deposition (PECVD) automatic wafer loading and unloading system |
| CN202964940U (en) * | 2012-09-24 | 2013-06-05 | 衡水英利新能源有限公司 | Device for preventing silicon wafers falling from solar cell cutting machine |
| CN204622359U (en) * | 2015-05-04 | 2015-09-09 | 邢台晶龙电子材料有限公司 | Silicon rod handler |
| CN105819238A (en) * | 2016-04-05 | 2016-08-03 | 青阳县恒远机械制造有限责任公司 | Material drop preventing device of loading machine |
| CN106429400A (en) * | 2016-11-30 | 2017-02-22 | 广西玉柴机器股份有限公司 | Device capable of automatically preventing falling |
| CN207344888U (en) * | 2017-10-31 | 2018-05-11 | 河南省博宇新能源有限公司 | Silicon chip cuts anti-lost slice baiting apparatus |
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| CN107553765A (en) | 2018-01-09 |
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