CN107553764A - A kind of cell body of silicon wafer cut by diamond wire reaming groove - Google Patents

A kind of cell body of silicon wafer cut by diamond wire reaming groove Download PDF

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Publication number
CN107553764A
CN107553764A CN201710883632.0A CN201710883632A CN107553764A CN 107553764 A CN107553764 A CN 107553764A CN 201710883632 A CN201710883632 A CN 201710883632A CN 107553764 A CN107553764 A CN 107553764A
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China
Prior art keywords
tank body
inner tank
outer tank
silicon wafer
diamond wire
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CN201710883632.0A
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CN107553764B (en
Inventor
邵玉林
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Wuxi kunsheng Intelligent Equipment Co., Ltd
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Wuxi Kun Sheng Technology Co Ltd
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Abstract

A kind of cell body the invention discloses silicon wafer cut by diamond wire with reaming groove, including the inside and outside nested inner tank body set and outer tank body, the drainage set for being connected with outer tank body and extending to inner tank body upper end, the feeding device that is fixed in inner tank body and the cooling device for being arranged on outer tank body lower end;The drainage set includes catheter and the valve being arranged on catheter;The feeding device is fixed on inner tank body close to the side inwall upper end of connection flexible pipe, including liquid accumulating box and some spiral flow deflectors for being arranged on liquid accumulating box lower end;The cooling device includes refrigerator and the cooling water pipe being connected with refrigerator.The present invention is provided with the inside and outside inner tank body and outer tank body being nested, inner tank body can absorb amount of heat after being reacted with silicon chip, therefore the reduction of fluid temperature is realized by the circulation of liquid in inner tank body and outer tank body, overall construction design is reasonable, and space occupancy rate is small.

Description

A kind of cell body of silicon wafer cut by diamond wire reaming groove
Technical field
The present invention relates to a kind of silicon chip preparation cell body, the groove more particularly to a kind of silicon wafer cut by diamond wire with reaming groove Body.
Background technology
Photovoltaic power generation technology has obtained development at full speed as environmentally friendly renewable energy technologies in recent years, but how further to carry Rising the conversion efficiency of battery and reducing battery production cost turns into the subject matter that industry development faces.With Buddha's warrior attendant wire cutting The maturation of technology, diamond wire are cut silicon chip and introduced to the market, and silicon wafer cut by diamond wire compares traditional mortar wire cutting silicon chip cost Reduce a lot, but traditional process for etching can not be prepared with the matte for falling into light effect, black silicon skill on silicon wafer cut by diamond wire surface Art adds the absorption to light by preparing the pore space structure of micro-or nano size in silicon chip surface.
It is existing but when carrying out expanding treatment to silicon chip surface, uniformity and reaction temperature to decoction have high requirement Have that cell body structure design in technology is simple, it is difficult to meet condition needed for silicon chip processing, or in the case where meeting to adjust, space Occupancy is big, therefore the present invention develops a kind of cell body of silicon wafer cut by diamond wire reaming groove, to solve to exist in the prior art The problem of, through retrieval, do not find and the same or analogous technical scheme of the present invention.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the groove the invention provides a kind of silicon wafer cut by diamond wire with reaming groove Body, with solve the problems, such as structure space-consuming is big in the prior art, decoction cooling effect difference and decoction disperse it is uneven.
To reach above-mentioned purpose, the technical solution adopted for the present invention to solve the technical problems is:
A kind of cell body of silicon wafer cut by diamond wire reaming groove, it is characterised in that:Including the inside and outside nested inner tank body set and outside Cell body, the drainage set for being connected with outer tank body and extending to inner tank body upper end, the feeding device being fixed in inner tank body and setting Cooling device in outer tank body lower end;
A cylinder is fixed respectively on a pair of parallel lateral wall of the outer tank body;Respectively to extension at the side wall of the inner tank body upper end A base station for being supported on cylinder upper end is stretched, one end side wall lower ends have a liquid outlet, are bonded at the liquid outlet and set a both ends The baffle plate being fixed on outer tank body inwall;
The drainage set includes catheter and the valve that is arranged on catheter, the catheter lower end with water jacket body sidewall End connection, upper end is horizontally disposed in interior cell body upper end, and deviates the setting of inside groove body sidewall, under horizontal catheter Along the uniform some connection flexible pipes in axis direction on end face;
The feeding device is fixed on inner tank body close to the side inwall upper end of connection flexible pipe, including liquid accumulating box and is arranged on hydrops Some spiral flow deflectors of box lower end;The liquid accumulating box side wall is fixedly connected with connection flexible pipe end, and is connected with connection flexible pipe It is logical, there are some delivery holes on lower surface;The spiral flow deflector is arranged on delivery hole lower end, and is hinged on one on liquid accumulating box The rotating shaft at end is fixedly connected;
The cooling device includes refrigerator and the cooling water pipe being connected with refrigerator, the cooling water pipe are arranged in outer tank body Side lower end, both ends are connected through outer tank body with refrigerator.
Further, there is a guide groove set in circular arc, the guide groove lower end has one inside the base station The cavity being connected with guide groove, the cavity inner wall are in circular arc;The cylinder upper end connects a fixed block and and fixed block Connect the simultaneously nested slide bar being arranged in guide groove;The fixed block upper surface is in arc-shaped, and is in cavity.
Further, the internal diameter of the cavity is more than the external diameter of the fixed block.
Further, short-axis direction of the liquid outlet along inner tank body is set, and elongated structure.
Further, the cooling water pipe is set gradually in the S types of integrative-structure in the horizontal direction, and is set altogether two layers.
Due to the utilization of above-mentioned technical proposal, the present invention has following beneficial effect compared with prior art:
(1)The present invention is provided with the inside and outside inner tank body and outer tank body being nested, and inner tank body can absorb greatly after being reacted with silicon chip Calorimetric amount, therefore the reduction of fluid temperature is realized by the circulation of liquid in inner tank body and outer tank body, overall construction design is reasonable, And space occupancy rate is small;
(2)Inner tank body realizes lifting by the control of cylinder, so that liquid outlet and baffle plate stagger setting, you can realize inner tank body Interior liquid outflow, while the attachment structure of rational base station and cylinder upper end is devised, inner tank body is realized skewed, protect Demonstrate,prove the efficiency of decoction outflow;
(3)The internal diameter of cavity is more than the external diameter of the fixed block, facilitates the rotation of structure, ensures the reasonability of structure design;
(4)Short-axis direction of the liquid outlet along inner tank body is set, and elongated structure, enables what the liquid in inner tank body disperseed Fall, facilitate its cooling, improve cooling efficiency, avoid traditional structure from realizing that fixed point falls, cooling effect by Valve controlling Fruit is poor;
(5)Cooling water pipe is set gradually in the S types of integrative-structure in the horizontal direction, and is set altogether two layers, effectively improves decoction Rate of temperature fall.
Brief description of the drawings
Fig. 1 is the front view of structure of the present invention.
Front view when Fig. 2 is structured loop decoction of the present invention.
Fig. 3 is the structural representation of base station of the present invention and cylinder junction.
Fig. 4 is the positional structure schematic diagram of catheter upper end of the present invention and inner tank body.
Fig. 5 is the distributed architecture schematic diagram of cooling water pipe of the present invention in the horizontal direction.
1, outer tank body in figure, 2, inner tank body, 3, liquid outlet, 4, baffle plate, 5, cylinder, 6, base station, 7, catheter, 8, valve, 9th, connection flexible pipe, 10, liquid accumulating box, 11, rotating shaft, 12, spiral flow deflector, 13, refrigerator, 14, cooling water pipe, 15, guide groove, 16th, cavity, 17, fixed block, 18, slide bar.
Embodiment
With reference to specific embodiment, present disclosure is described in further detail:
As Figure 1-5, the cell body of a kind of silicon wafer cut by diamond wire reaming groove, it is characterised in that:Including inside and outside nested setting Inner tank body 2 and outer tank body 1, be connected with outer tank body 1 and extend to the drainage set of the upper end of inner tank body 2, be fixed in inner tank body 2 Feeding device and be arranged on the cooling device of the lower end of outer tank body 1.
Wherein, a cylinder 5 is fixed on a pair of parallel lateral wall of outer tank body 1 respectively;At the upper end side wall of inner tank body 2 respectively to Outer extension one is supported on the base station 6 of the upper end of cylinder 5, and one end side wall lower ends have a liquid outlet 3, are bonded at liquid outlet 3 and set one Both ends are fixed on the baffle plate 4 on the inwall of outer tank body 1, and short-axis direction of the liquid outlet 3 along inner tank body 2 is set, and elongated Structure.
Drainage set includes catheter 7 and the valve 8 being arranged on catheter 7, the lower end of catheter 7 and the side wall of outer tank body 1 Lower end connects, and upper end is horizontally disposed in the interior upper end of cell body 2, and deviates the setting of the side wall of inner tank body 2, horizontal drain Along the uniform some connection flexible pipes 9 in axis direction on the lower surface of pipe 7.
Feeding device is fixed on inner tank body 2 close to the side inwall upper end of connection flexible pipe 9, including liquid accumulating box 10 and is arranged on Some spiral flow deflectors 12 of the lower end of liquid accumulating box 10;The side wall of liquid accumulating box 10 is fixedly connected with the end of connection flexible pipe 9, and soft with being connected Pipe 9 is connected, and has some delivery holes on lower surface;Spiral flow deflector 12 is arranged on delivery hole lower end, and is hinged on product with one The rotating shaft 11 of the upper end of liquid box 10 is fixedly connected.
Cooling device includes refrigerator 13 and the cooling water pipe 14 being connected with refrigerator 13, cooling water pipe 14 are arranged on water jacket The inside lower end of body 1, and set gradually in the horizontal direction in the S types of integrative-structure, and set altogether two layers, outer tank body is run through at both ends 1 is connected with refrigerator 13.
As the further optimization of the present embodiment, the inside of base station 6 has a guide groove 15 set in circular arc, guide groove 15 lower ends have a cavity 16 being connected with guide groove 15, and the inwall of cavity 16 is in circular arc;The upper end of cylinder 5 connects a fixed block 17 and it is connected with fixed block 17 and the nested slide bar 18 being arranged in guide groove 15;The upper surface of fixed block 17 is in arc-shaped, and is located In cavity 16, the internal diameter of cavity 16 is more than the external diameter of fixed block 17.
During work, the lower surface of inner tank body 2 is horizontal, and is brought into close contact at liquid outlet 3 with baffle plate 4, and decoction is in inside groove The inside of body 2 is used to carry out processing reaction to silicon chip surface, and after a period of time, the heat of silicon chip release raises fluid temperature, this When a pair of cylinders 5 work simultaneously and inner tank body 2 is moved upwards, now liquid outlet 3 staggers with baffle plate 4, and decoction flows from liquid outlet 3 Go out, then the stop motion of side cylinder 5, opposite side cylinder 5 continues up a small distance, makes inner tank body 2 oblique Set, more facilitate the flowing of decoction;Effective temperature-reducing is realized in effect of the liquid through cooling water pipe 14 flowed out from inner tank body 2, and It is flow to again by catheter 7 in liquid accumulating box 10, the effect most afterwards through delivery hole and spiral flow deflector 12 is flow in inner tank body 2, Spiral deflector 12 can further improve the mixing uniformity of decoction;After circulating one end time, the cylinder 5 of the higher side of height Move downward, move to inner tank body 2 it is horizontal when, both sides cylinder 5 moves downward simultaneously, baffle plate 4 is at liquid outlet 3, then Catheter 7 continues to discharge decoction into inner tank body 2, and decoction now has realized enough coolings and uniformly, facilitates the place of silicon chip Reason, it is very reasonable to arrange structure design.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and be carried out, and it is not intended to limit the scope of the present invention, all according to the present invention The equivalent change or modification that Spirit Essence is made, it should all cover within the scope of the present invention.

Claims (5)

  1. A kind of 1. silicon wafer cut by diamond wire cell body of reaming groove, it is characterised in that:Including the inside and outside nested inner tank body set and Outer tank body, the drainage set for being connected with outer tank body and extending to inner tank body upper end, the feeding device being fixed in inner tank body and set Put the cooling device in outer tank body lower end;
    A cylinder is fixed respectively on a pair of parallel lateral wall of the outer tank body;Respectively to extension at the side wall of the inner tank body upper end A base station for being supported on cylinder upper end is stretched, one end side wall lower ends have a liquid outlet, are bonded at the liquid outlet and set a both ends The baffle plate being fixed on outer tank body inwall;
    The drainage set includes catheter and the valve that is arranged on catheter, the catheter lower end with water jacket body sidewall End connection, upper end is horizontally disposed in interior cell body upper end, and deviates the setting of inside groove body sidewall, under horizontal catheter Along the uniform some connection flexible pipes in axis direction on end face;
    The feeding device is fixed on inner tank body close to the side inwall upper end of connection flexible pipe, including liquid accumulating box and is arranged on hydrops Some spiral flow deflectors of box lower end;The liquid accumulating box side wall is fixedly connected with connection flexible pipe end, and is connected with connection flexible pipe It is logical, there are some delivery holes on lower surface;The spiral flow deflector is arranged on delivery hole lower end, and is hinged on one on liquid accumulating box The rotating shaft at end is fixedly connected;
    The cooling device includes refrigerator and the cooling water pipe being connected with refrigerator, the cooling water pipe are arranged in outer tank body Side lower end, both ends are connected through outer tank body with refrigerator.
  2. A kind of 2. cell body of silicon wafer cut by diamond wire reaming groove according to claim 1, it is characterised in that:The base station Inside has a guide groove set in circular arc, and the guide groove lower end has a cavity being connected with guide groove, described Cavity inner wall is in circular arc;The cylinder upper end connects a fixed block and be connected with fixed block and nesting is arranged in guide groove Slide bar;The fixed block upper surface is in arc-shaped, and is in cavity.
  3. A kind of 3. cell body of silicon wafer cut by diamond wire reaming groove according to claim 2, it is characterised in that:The cavity Internal diameter be more than the fixed block external diameter.
  4. A kind of 4. cell body of silicon wafer cut by diamond wire reaming groove according to claim 1, it is characterised in that:It is described go out liquid The short-axis direction of opening's edge inner tank body is set, and elongated structure.
  5. A kind of 5. cell body of silicon wafer cut by diamond wire reaming groove according to claim 1, it is characterised in that:The cooling Water pipe is set gradually in the S types of integrative-structure in the horizontal direction, and is set altogether two layers.
CN201710883632.0A 2017-09-26 2017-09-26 A kind of groove body of silicon wafer cut by diamond wire reaming slot Active CN107553764B (en)

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US20080093343A1 (en) * 2004-05-26 2008-04-24 Promos Tehcnologies Inc. Method for treating the etching solution
WO2008089733A3 (en) * 2007-01-22 2009-01-08 Gp Solar Gmbh Etching solution and etching method
US20100210110A1 (en) * 2004-04-20 2010-08-19 Kabushiki Kaisha Toshiba Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
WO2010136387A1 (en) * 2009-05-25 2010-12-02 Universität Konstanz Method for texturing a surface of a semiconductor substrate and device for carrying out the method
CN101967682A (en) * 2010-06-18 2011-02-09 常州亿晶光电科技有限公司 Polysilicon channel type wool making and cooling device
CN202268375U (en) * 2011-07-11 2012-06-06 苏州赤诚洗净科技有限公司 Fluff making device for solar battery silicon chip
CN103811374A (en) * 2012-11-06 2014-05-21 沈阳芯源微电子设备有限公司 Wafer immersion device
US20150318224A1 (en) * 2014-05-02 2015-11-05 Akrion Systems, Llc Correlation between conductivity and ph measurements for koh texturing solutions and additives
CN204825136U (en) * 2015-08-17 2015-12-02 山东科芯电子有限公司 Acidizing fluid cooling back installation
CN205355019U (en) * 2016-01-27 2016-06-29 无锡德鑫太阳能电力有限公司 Polycrystal making herbs into wool equipment liquid medicine cooling system
CN205755086U (en) * 2016-05-20 2016-11-30 信丰福昌发电子有限公司 A kind of pcb board de-smear device
CN205924490U (en) * 2016-04-18 2017-02-08 唐海涛 Chinese medicine production equipment
CN106400360A (en) * 2016-08-31 2017-02-15 海宁牛仔织造有限公司 Dye vat with waste liquid treatment device
CN106694437A (en) * 2017-01-10 2017-05-24 新疆通奥油田技术服务有限公司 Circular cleaning device

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100210110A1 (en) * 2004-04-20 2010-08-19 Kabushiki Kaisha Toshiba Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor device
US20080093343A1 (en) * 2004-05-26 2008-04-24 Promos Tehcnologies Inc. Method for treating the etching solution
WO2008089733A3 (en) * 2007-01-22 2009-01-08 Gp Solar Gmbh Etching solution and etching method
WO2010136387A1 (en) * 2009-05-25 2010-12-02 Universität Konstanz Method for texturing a surface of a semiconductor substrate and device for carrying out the method
CN101967682A (en) * 2010-06-18 2011-02-09 常州亿晶光电科技有限公司 Polysilicon channel type wool making and cooling device
CN202268375U (en) * 2011-07-11 2012-06-06 苏州赤诚洗净科技有限公司 Fluff making device for solar battery silicon chip
CN103811374A (en) * 2012-11-06 2014-05-21 沈阳芯源微电子设备有限公司 Wafer immersion device
US20150318224A1 (en) * 2014-05-02 2015-11-05 Akrion Systems, Llc Correlation between conductivity and ph measurements for koh texturing solutions and additives
CN204825136U (en) * 2015-08-17 2015-12-02 山东科芯电子有限公司 Acidizing fluid cooling back installation
CN205355019U (en) * 2016-01-27 2016-06-29 无锡德鑫太阳能电力有限公司 Polycrystal making herbs into wool equipment liquid medicine cooling system
CN205924490U (en) * 2016-04-18 2017-02-08 唐海涛 Chinese medicine production equipment
CN205755086U (en) * 2016-05-20 2016-11-30 信丰福昌发电子有限公司 A kind of pcb board de-smear device
CN106400360A (en) * 2016-08-31 2017-02-15 海宁牛仔织造有限公司 Dye vat with waste liquid treatment device
CN106694437A (en) * 2017-01-10 2017-05-24 新疆通奥油田技术服务有限公司 Circular cleaning device

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Address after: No.106, Xixian Road, Xinwu District, Wuxi City, Jiangsu Province

Patentee after: Wuxi kunsheng Intelligent Equipment Co., Ltd

Address before: 214000 No. 30 Wanquan Road, Xishan District, Jiangsu, Wuxi

Patentee before: WUXI KUNSHENG TECHNOLOGY Co.,Ltd.

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