CN107548224B - Component shell and PCB - Google Patents

Abstract

The invention relates to a component shell and a PCB (printed circuit board), and belongs to the technical field of heat dissipation. Wherein, this components and parts casing includes: the casing main part, mounting and radiator. The shell body comprises a binding surface used for being bound with the PCB, and the binding surface comprises a first part and a second part. The radiator is fixed in through the mounting the first part of binding face, works as when the components and parts casing is installed on the PCB board, the radiator stretches into in the radiating groove of PCB board, and the second part of binding face and the laminating of PCB board. Compared with the prior art, because the radiator is fixed in on the casing main part, can with casing main part in close contact with, can not only go out the heat conduction on casing main part surface effectively, the radiator is the snap-on in the casing main part in addition, need not mutual extrusion, and then has avoided the poor problem of reliability of casing main part and PCB board crimping installation, has improved the stability of casing main part and PCB board crimping.

Description

Component shell and PCB

Technical Field

The invention belongs to the technical field of heat dissipation, and particularly relates to a component shell and a PCB.

Background

With the development of science and technology, more and more integrated and miniaturized components are provided, and although the size and the weight of the components are reduced to a great extent, the conflict between the integrated design and the heat dissipation design of the components is more and more obvious. The requirements of integration, miniaturization and the like of components are met, and meanwhile more requirements on the performance, heat dissipation and the like of the components are provided. At present, most of components are radiated by means of radiating holes and radiating air channels on a shell of the components and by means of air convection and the like, and the radiating modes can only be suitable for components with low radiating requirements but cannot meet the components with high radiating requirements. In addition, a heat dissipation mode of coating a heat conduction material is adopted, the mode utilizes the heat conduction material to conduct out heat generated by the components, heat dissipation is carried out by cooling air, and the heat dissipation mode cannot meet the requirement of the components with high heat dissipation requirements. Therefore, a heat dissipation method with good heat dissipation effect, strong applicability and simple structure is needed to solve the defects of the existing heat dissipation method.

Disclosure of Invention

In view of the above, the present invention provides a component housing and a PCB to effectively solve the above problems.

In one aspect, an embodiment of the present invention provides a component casing, where the component casing is configured to accommodate a component, and the component casing includes: the casing main part, mounting and radiator. The shell body comprises a binding surface used for being bound with the PCB, and the binding surface comprises a first part and a second part. The radiator is fixed on the first part of the binding surface through the fixing piece. When the component shell is installed on the PCB, the radiator extends into the radiating groove of the PCB, and the second part of the joint surface of the shell body of the component shell is jointed with the PCB.

In a preferred embodiment of the present invention, the fixing member is an elastic fixing member.

In a preferred embodiment of the present invention, the fixing member includes a first elastic sheet, a second elastic sheet and at least one transverse plate, the first elastic sheet and the second elastic sheet are connected by the at least one transverse plate, the transverse plate is in contact with the heat dissipation plate of the heat sink through a gap between the heat dissipation fins of the heat sink, and the first elastic sheet and the second elastic sheet respectively press against two sides of the housing to fix the heat sink to the attachment surface.

In a preferred embodiment of the present invention, each of the horizontal plates is provided with a recess portion recessed toward the heat dissipation plate, and a bottom portion of each of the recess portions is in contact with the heat dissipation plate.

In a preferred embodiment of the present invention, a contact window is disposed on a first portion of the abutting surface of the housing main body, the heat sink is fixed at an edge of the contact window by the fixing member, and at least a portion of the heat sink passes through the contact window to contact a component in the component housing.

In a preferred embodiment of the present invention, both sides of the heat sink are provided with a limiting member, and the limiting member is located on one side of the edge of the contact window, which is far away from the component.

In another aspect, an embodiment of the present invention further provides a PCB, including: PCB board main part and foretell components and parts casing, be provided with the radiating groove in the PCB board main part, the components and parts casing install in the PCB board main part, during the installation, the radiator of components and parts stretches into in the radiating groove of PCB board, just the second part of the binding face of casing with the laminating of PCB board.

In a preferred embodiment of the present invention, the heat dissipation groove is a hollow area, and the heat sink extends into the hollow area.

In a preferred embodiment of the present invention, the heat sink includes a plurality of heat dissipation fins, the heat dissipation slot includes heat dissipation through holes corresponding to the plurality of heat dissipation fins, and the plurality of heat dissipation fins extend into the plurality of heat dissipation through holes.

In a preferred embodiment of the present invention, the component is an optical module, and the component housing is an optical module housing.

Compared with the prior art, the component shell and the PCB provided by the embodiment of the invention have the advantages that the radiator is fixed on the shell main body and is tightly contacted with the shell main body into a whole, so that the heat on the surface of the shell main body can be effectively conducted out, and the radiator is directly fixed on the shell main body without mutual extrusion, so that the problem of poor reliability of press-connection installation of the shell main body and the PCB is avoided, and the press-connection stability of the shell main body and the PCB is improved. In addition, when this components and parts casing crimping was installed on the PCB board, the radiator was installed on the PCB board as a whole with the casing main part, and the radiator stretches into in the radiating groove of PCB board, just the second part of the binding face of casing main part with the laminating of PCB board has further improved the stability of casing main part with PCB board crimping.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings. Like reference numerals refer to like parts throughout the drawings. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 shows a schematic structural diagram of a heat dissipation structure of an optical module.

Fig. 2 shows a schematic structural diagram of a component housing according to a first embodiment of the present invention.

Fig. 3 shows a schematic view of the structure of the heat sink in fig. 2.

Fig. 4 is a schematic structural diagram illustrating a first viewing angle of a component housing according to a second embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a second viewing angle of a component housing according to a second embodiment of the present invention.

Fig. 6 shows a schematic view of the construction of the fixing in fig. 5.

Fig. 7 shows a schematic structural diagram of a heat sink in a second embodiment of the present invention.

Fig. 8 shows a schematic structural view of another heat sink in a second embodiment of the present invention.

Fig. 9 shows a schematic structural diagram of a PCB board according to an embodiment of the present invention.

FIG. 10 is a schematic diagram of the heat sink of FIG. 9 in one embodiment.

FIG. 11 is a schematic diagram of another embodiment of the heat sink of FIG. 9.

Fig. 12 shows a schematic structural diagram of an electronic product according to an embodiment of the present invention.

Icon: 21-a housing body; 211-a faying surface; 213-pin; 215-contact window; 217-a first catch; 219-a second clasp; 23-a heat sink; 231-a heat dissipation plate; 232-radiating fins; 233-a limit piece; 25-a fixing member; 251-a first spring plate; 2511-a first card slot; 252-a second spring plate; 2521-a second card slot; 253-transverse plate; 2531-a depression; 200A-a component shell; 200B-a component housing; 20-a component; 40-a PCB board; 41-PCB board body; 42-heat sink; 421-heat dissipation through holes; 50-an electronic product; 51-a chassis.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the embodiments of the present invention, it should be noted that the terms "middle", "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are usually placed when the products of the present invention are used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements to be referred to must have specific orientations, be constructed in specific orientations, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In order to enhance the heat dissipation effect of the components, for example, the heat dissipation effect of the optical module, the heat dissipation block may be used as an optical module housing (Cage) for heat dissipation. The heat dissipation principle of the optical module heat dissipation structure 10 shown in fig. 1 will be described as an example. The method comprises the steps of forming heat dissipation holes 13 in positions, corresponding to optical module housings 12, of a circuit board 11, mounting the optical module housings 12 on the circuit board 11, coating heat conduction paste 14 on the optical module housings 12 through the heat dissipation holes 13 of the circuit board 11, placing the optical module housings 12 on one sides, away from the optical module housings 12, of the heat dissipation paste 14, and extruding heat dissipation blocks 15 to enable the heat dissipation blocks 15 to be in contact with the optical module housings 12 to dissipate heat generated by the optical modules. Because the groove is completely formed on one side of the circuit board 11 in contact with the optical module shell 12, the support strength of the optical module shell 12 is insufficient; in addition, the heat dissipation block 15 has no assembly relationship with the optical module housing 12, and needs to be pressed against each other to be in close contact with the optical module housing 12, and accordingly the optical module housing 12 may be pushed upward, and even the optical module housing 12 may be pushed out from the circuit board 11, which causes problems such as poor reliability of the pressure welding pin of the optical module housing 12, poor stability of the optical module housing 12 and the circuit board 11, and the like.

First embodiment

In view of this, the first embodiment of the present invention provides a component housing 200A including a housing main body 21 for carrying a component 20, a heat sink 23, and a fixing member 25, as shown in fig. 2. The component 20 is provided in the case body 21, and the component 20 may be a component that requires heat dissipation processing, and may be an optical module, for example, without limitation. The heat sink 23 is used for dissipating heat of the component 20. The heat sink 23 is fixed to the case main body 21 by a fixing member 25.

The housing body 21 is used to mount a component 20 (e.g., an optical module), and the configuration thereof may be determined according to the type of the component 20 to be mounted, and for clarity, the housing body 21 is used to mount an optical module in the present embodiment. It should be noted that the housing main body 21 may be used for carrying other components 20 besides the optical module, and the structure thereof may be determined according to the type of the carried component 20, and therefore, the structure of the housing main body 21 shown in the embodiment should not be construed as limiting the present invention.

The housing main body 21 includes: and the joint surface 211 is used for jointing with the PCB. Preferably, the abutting surface 211 comprises a first portion and a second portion. The first portion is used for fixing the heat sink 23, and the second portion is used for being attached to the PCB in a crimping manner. A plurality of pin legs 213 for press-connecting with the PCB are spaced on the attaching surface 211 of the housing main body 21, and the number of the pin legs can be determined according to the area of the attaching surface 211 and the actual press-connecting requirement. The structure of the housing main body 21 may be various, and for example, may be single-layered, double-layered, or multi-layered. In the present embodiment, only the case body 21 having a double-layer structure is taken as an example for description, and the principle of the case body 21 having a single-layer or multi-layer structure is similar thereto, and therefore, in order to avoid redundancy, description will not be given by way of example. The shape of the housing main body 21 can be various, and in this embodiment, the shape of the housing main body 21 can be rectangular.

The heat sink 23 is fixed to a first portion of the attachment surface 211 of the housing main body 21 by a fixing member 25, and the heat sink 23 is used for dissipating heat of the component 20 mounted in the housing main body 21, for example, heat of an optical module mounted in the housing main body 21. Preferably, as shown in fig. 3, the heat sink 23 includes a heat dissipation plate 231 and a plurality of heat dissipation fins 232 disposed on the heat dissipation plate 231. When the heat sink 23 is fixed to the case body 21, the heat radiation plate 231 of the heat sink 23 is fixed to the first portion of the contact surface 211 of the case body 21.

The shape of the heat dissipation plate 231 may be various, and in this embodiment, the shape of the heat dissipation plate 231 may be rectangular. The heat sink 231 is made of a metal material having high thermal conductivity, for example, red copper, aluminum, or the like; the heat conductive material may be made of other non-metallic materials having high heat conductivity, for example, graphite.

The shape of the heat dissipation fins 232 may be various, and in this embodiment, preferably, the shape of the heat dissipation fins 232 may be a columnar structure. The plurality of heat dissipation fins 232 are disposed on the heat dissipation plate 231 at intervals, and a heat dissipation gap exists between adjacent heat dissipation fins 232, so that air convection can be performed, and a better heat dissipation effect can be obtained. The heat sink fins 232 are made of a metal material with high thermal conductivity, such as copper or aluminum; the heat conductive material may be made of other non-metallic materials having high heat conductivity, for example, graphite. It is understood that the number of the heat sinks 23 may be determined according to the number of the component accommodating spaces on the housing main body 21 and the actual use requirement, for example, when the housing main body 21 has a double-layer structure, and each layer includes two component accommodating spaces, the number of the heat sinks 23 may be 2.

The fixing member 25 may be various, and may be, for example, an adhesive, a solder, a screw, a rivet, or the like.

In one embodiment, the heat sink 23 is preferably soldered to the first portion of the attachment surface 211 of the housing main body 21, and when the component housing 200A is mounted on a PCB, all or a portion of the heat sink 23 extends into a heat sink of the PCB (as shown in fig. 10), and the second portion of the attachment surface 211 of the housing main body 21 is attached to the PCB. When the heat sink is mounted, the housing body 21 and the heat sink 23 are integrally mounted on the PCB, so that the heat dissipation effect of the heat sink 23 can be enhanced, and the problem of poor reliability of the press-fit mounting of the housing body 21 and the PCB is avoided.

Second embodiment

Referring to fig. 4 and 5, a second embodiment of the invention provides a component housing 200B, which is different from the first embodiment in that a heat sink 23 is fixed to a first portion of an attachment surface 211 of a housing main body 21 by an elastic fixing member 25. The elastic fixing member 25 may have various kinds and structures, for example, the fixing member 25 may be an elastic band, or may have other structures.

In this embodiment, as shown in fig. 6, preferably, the fixing member 25 includes a first elastic sheet 251, a second elastic sheet 252, and at least one transverse plate 253.

The first elastic sheet 251 and the second elastic sheet 252 are disposed opposite to each other, and are connected through at least one transverse plate 253. The shapes of the first resilient tab 251 and the second resilient tab 252 may be various, and in this embodiment, the shape of the first resilient tab 251 is preferably the same as that of the second resilient tab 252, for example, the first resilient tab may be rectangular. The first resilient plate 251 and the second resilient plate 252 may be made of an elastic material, such as spring steel, beryllium copper, phosphor copper, etc.

The horizontal plate 253 spans between the first elastic sheet 251 and the second elastic sheet 252, one end of the horizontal plate 253 is connected with the first elastic sheet 251, and the other end of the horizontal plate 253 is connected with the second elastic sheet 252. The connection mode may be various, for example, the connection mode may be a mode of welding, bonding, and the like, or may be an integral molding mode, or other connection modes. In this embodiment, preferably, the transverse plate 253, the first elastic piece 251 and the second elastic piece 252 are integrally formed. When the heat sink 23 is fixed to the first portion of the attachment surface 211 of the housing body 21 by the elastic fixing member 25, the horizontal plate 253 contacts the heat dissipation plate 231 of the heat sink 23 through the gaps between the heat dissipation fins 232 of the heat sink 23, and the first elastic piece 251 and the second elastic piece 252 respectively press against two sides of the housing body 21, so as to fix the heat sink 23 to the attachment surface 211 of the housing body 21.

In the present embodiment, the number of the horizontal plates 253 is only three for example, and the principle and the operation manner of the other numbers of the horizontal plates 253 are similar thereto. Preferably, three transverse plates 253 are arranged on the first elastic sheet 251 and the second elastic sheet 252 at intervals. Further preferably, each of the horizontal plates 253 is provided with a recess 2531 recessed into the heat dissipation plate 231, and when the horizontal plate 253 is fixed, the horizontal plate 253 contacts the heat dissipation plate 231 through the bottom of the recess 2531 through the gaps between the heat dissipation fins 232 of the heat sink 23.

The number of the concave portions 2531 may be one, two, or more, and is not limited herein.

When the heat sink 23 is fixed to the first portion of the attachment surface 211 of the housing main body 21 by the fixing element 25, the heat sink 23 may be fixed only by the pressing force generated by the first elastic sheet 251 and the second elastic sheet 252 respectively pressing the two sides of the housing main body 21; the heat sink 23 may also be fixed by the way that the first elastic sheet 251 is clamped with one side of the housing main body 21, and the second elastic sheet 252 is clamped with the other side of the housing main body 21, as shown in fig. 4; the heat sink 23 may also be fixed by other fixing means, which are not listed here.

If the first elastic piece 251 and the second elastic piece 252 are respectively connected to two sides of the housing main body 21 in a clamping manner, preferably, the first elastic piece 251 is further provided with a first clamping groove 2511, and the second elastic piece 252 is further provided with a second clamping groove 2521. The number of the first card slot 2511 and the second card slot 2521 may be one, two, or more than two. For example, in this embodiment, the number of the first card slots 2511 and the second card slots 2521 is three, three first card slots 2511 are disposed on the first resilient piece 251 at intervals, and three second card slots 2521 are disposed on the second resilient piece 252 at intervals. Accordingly, a first locking member 217 matching with the first locking slot 2511 is correspondingly disposed at a position corresponding to the first locking slot 2511 on one side of the housing main body 21, and a second locking member 219 matching with the second locking slot 2521 is correspondingly disposed at a position corresponding to the second locking slot 2521 on the other side of the housing main body 21.

Referring to fig. 5, in order to facilitate heat dissipation of the component 20 in the housing main body 21 to improve the heat dissipation effect, preferably, a contact window 215 is disposed on a first portion of the attachment surface 211 of the housing main body 21, and the heat sink 23 is fixed at an edge of the contact window 215. When the fixing member 25 is an elastic fixing member, the heat sink 23 is fixed at the edge of the contact window 215 by the fixing member 25, and the heat sink 23 at least partially passes through the contact window 215 to contact the component 20 in the housing main body 21. The heat generated by the components 20 in the housing main body 21 can be easily conducted out, so as to improve the heat dissipation effect. The heat sink 23 is not disposed in the contact window 215, but a part of the heat sink 23 passes through the contact window 215 to contact the component 20 in the housing main body 21, so that the weight of the component 20 pressed by the heat sink 23 is reduced, the service life of the component is prolonged, and the stability of the operation of the component is improved. Among them, preferably, at least a portion of the heat sink 23 may be a middle at least portion of the heat dissipation plate 231. That is, the heat sink 231 is brought into contact with the component 20 in the case main body 21 by the pressing of the fixing member 25.

Referring to fig. 7 and 8, in order to prevent the heat spreader 23 from falling into the contact window 215 during movement or use, it is preferable that both sides of the heat spreader 23 are provided with a limiting member 233, and the limiting member 233 is located on a side of the edge of the contact window 215 away from the component 20. The limiting member 233 can effectively prevent the heat sink 23 from falling into the contact window 215 during movement or use, so as to reduce the weight of the component 20 extruded by the heat sink 23, prolong the service life of the component, and improve the operation stability of the component.

As an embodiment, as shown in fig. 7, the limiting member 233 may be a block structure having a certain width and disposed on both sides of the heat dissipation plate 231 of the heat sink 23. In order to simplify the process flow, preferably, the component housing 200A and the heat dissipation plate 231 may be an integrally formed structure, that is, at least a portion of both sides of the heat dissipation plate 231 is widened outward to form a block structure protruding out of the side surface, so as to limit the heat dissipation plate to fall into the contact window 215 during movement or use.

As another embodiment, as shown in fig. 8, the stoppers 233 may be stopper surfaces disposed on both sides of the heat dissipation plate 231 of the heat sink 23. In other words, the corners of the heat sink 231 are replaced by the limiting surfaces, so that the width of the heat sink 231 is gradually reduced from the side where the heat sink fins 232 are disposed to the other side, and the cross section of the heat sink 231 has an inverted trapezoidal structure. Preferably, the minimum width of the heat dissipation plate 231 on the inverted trapezoid cross section is smaller than the width of the contact window 215, and the maximum width of the heat dissipation plate 231 on the inverted trapezoid cross section is larger than the width of the contact window 215, so as to achieve the purpose of limiting the heat sink 23 from falling into the contact window 215 during movement or use.

Further, the shape of the contact window 215 may be various, and preferably, the shape of the contact window 215 may be a rectangle. Preferably, the contact window 215 is matched to the heat sink 23. The number of the contact windows 215 may be determined according to the number of the component accommodating spaces on the housing main body 21 and the actual use requirement. For example, when the housing main body 21 has a double-layer structure, and each layer includes two component accommodation spaces, the number of the contact windows 215 may be 2.

The number of the heat sinks 23 may be determined according to the number of the component accommodating spaces on the housing main body 21 and the actual use requirement, for example, when the housing main body 21 is a double-layer structure, and each layer includes two component accommodating spaces, the number of the heat sinks 23 may be 2.

It should be understood that the present invention only shows the case that the heat sink 23 is fixed to the first portion of the attaching surface 211 of the housing main body 21, and whether the heat sink 23 is disposed on the other side of the housing main body 21 is not limited herein, and therefore, besides disposing the heat sink 23 on the first portion of the attaching surface 211 of the housing main body 21, the case that the heat sink 23 is disposed on the other side of the housing main body 21 is included in the framework of the principle of the present invention and falls within the protection scope of the present invention.

As shown in fig. 9, an embodiment of the present invention further provides a PCB 40, including: a PCB board body 41, a component 20, and a component case 200A shown in the first embodiment described above. Be provided with radiating groove 42 on the PCB board main part 41, components and parts casing 200A integral erection in on the PCB board main part 41, during the installation, radiator 23 stretches into in the radiating groove 42 of PCB board main part 41, just the second part of the binding face 211 of the casing main part 21 of components and parts casing 200A with the laminating of PCB board main part 41. Referring to fig. 10, in an embodiment, the heat dissipation slot 42 is a hollow area, and the size of the hollow area matches with the size of the heat sink 23, so that all the heat dissipation fins 232 of the heat sink 23 pass through the heat dissipation slot 42, or all the heat dissipation fins 232 of the heat sink 23 pass through the heat dissipation slot 42 and the heat dissipation plate 231 extends into the heat dissipation slot 42. In order to make the second portion of the attaching surface 211 of the housing main body 21 closely attached to the PCB main body 41, the shape of the heat dissipation groove 42 is preferably matched with the shape of the heat dissipation plate 231 of the heat sink 23, for example, in the present embodiment, the shape of the heat dissipation groove 42 may be rectangular.

It should be understood that the component housing 200A in the PCB 40 may also be replaced by the component housing 200B shown in the second embodiment, and the heat dissipation principle is the same as that of the component housing 200A in the first embodiment, which is not described herein again.

Referring to fig. 11, in another embodiment, the heat sink 42 includes a plurality of heat dissipating through holes 421 corresponding to the plurality of heat dissipating fins 232 of the heat sink 23, and the plurality of heat dissipating fins 232 of the heat sink 23 extend into the plurality of heat dissipating through holes 421. It is understood that if the heat dissipating plate 231 of the heat sink 23 is provided directly on the PCB main body 41 with a relatively thin heat dissipating through hole 421; if the heat dissipation plate 231 has a certain thickness, in order to make the second portion of the attaching surface 211 of the housing body 21 closely attached to the PCB main body 41, the heat dissipation groove 42 may further include a recessed end portion having a size matched with that of the heat dissipation plate 231, and the heat dissipation through hole 421 is disposed at the bottom of the recessed end portion.

The component 20 is preferably an optical module, and in this case, the component case 200A is an optical module case.

As shown in fig. 12, the embodiment of the present invention provides an electronic product 50, which includes a housing 51 and the PCB 40 disposed in the housing 51.

In summary, the embodiment of the invention provides a component housing and a PCB. Compared with the prior art, the radiator in the component shell is a first part fixed on the joint surface of the shell body and is tightly contacted with the shell body into a whole. The heat sink may be welded to the housing main body, or may be fixed to the housing main body by a fixing member. The fixing member may be a screw, a rivet, or the like, or may be an elastic fixing member. No matter what kind of mode is fixed, radiator and casing main part all regard as a whole, can not only go out the heat conduction on casing main part surface effectively, and the radiator is the snap-on in the casing main part moreover, need not mutual extrusion, and then has avoided the poor problem of reliability of casing main part and PCB board crimping installation, has improved the stability of casing main part and PCB board crimping, has strengthened the radiating effect.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a components and parts casing, its characterized in that, components and parts casing is used for holding components and parts, components and parts casing includes:

the PCB comprises a shell body and a PCB body, wherein the shell body comprises a binding surface used for binding with the PCB, and the binding surface comprises a first part and a second part;

a fixing member; the radiator is fixed on the first part of the binding face through the fixing piece, during installation, the shell body and the radiator are installed on the PCB as a whole, when the component shell is installed on the PCB, the radiator extends into a radiating groove of the PCB, and the second part of the binding face is attached to the PCB.

2. A component housing as claimed in claim 1, wherein the securing member is a resilient securing member.

3. A component casing as claimed in claim 2, wherein the fixing member includes a first resilient sheet, a second resilient sheet, and at least one transverse plate, the first resilient sheet and the second resilient sheet are connected by at least one transverse plate, the transverse plate is in contact with the heat dissipation plate of the heat sink through a gap between the heat dissipation fins of the heat sink, and the first resilient sheet and the second resilient sheet respectively press against two sides of the casing to fix the heat sink to the attachment surface.

4. A component casing as claimed in claim 3, wherein each of the horizontal plates is provided with a recess recessed toward the heat dissipation plate, and a bottom of each of the recesses is in contact with the heat dissipation plate.

5. A component casing as claimed in claim 1, wherein the first portion of the abutting surface of the casing body is provided with a contact window, the heat sink is fixed at an edge of the contact window by the fixing member, and the heat sink at least partially penetrates through the contact window to contact a component in the component casing.

6. A component casing as claimed in claim 5, wherein both sides of the heat sink are provided with a stop at a side of the edge of the contact window away from the component.

7. A PCB board, comprising: PCB board main part, components and parts and the components and parts casing of any one of claims 1-6, be provided with the radiating groove in the PCB board main part, the components and parts casing install in the PCB board main part, the radiator of components and parts casing stretches into in the radiating groove of PCB board, just the second part of the binding face of the casing main part of components and parts casing with the laminating of PCB board.

8. The PCB board of claim 7, wherein the heat sink is a hollowed-out area, and the heat sink extends into the hollowed-out area.

9. The PCB of claim 7, wherein the heat sink includes a plurality of heat fins, wherein the heat sink includes heat dissipating through holes corresponding to the plurality of heat fins, and wherein the plurality of heat fins extend into the plurality of heat dissipating through holes.

10. The PCB board of claim 7, wherein the component is an optical module and the component housing is an optical module housing.

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