CN107541684A - A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof - Google Patents
A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof Download PDFInfo
- Publication number
- CN107541684A CN107541684A CN201710937848.0A CN201710937848A CN107541684A CN 107541684 A CN107541684 A CN 107541684A CN 201710937848 A CN201710937848 A CN 201710937848A CN 107541684 A CN107541684 A CN 107541684A
- Authority
- CN
- China
- Prior art keywords
- alumina
- thermal conductivity
- high thermal
- base material
- matrix plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
The invention discloses a kind of alumina-base material formula of high thermal conductivity aluminum matrix plate, the alumina-base material ingredients principle of the high thermal conductivity aluminum matrix plate is：Magnesium 1 4%, zinc 0 3%, magnesia 0 3%, potassium oxide 0.2 4%, barium monoxide 0.1 3%, tetraethyl orthosilicate 0.2 0.4%, carbon fiber 0.1 0.3%, alumina fibre 0.2 0.4%, remaining is aluminium, the aluminium base of preparation has good heat conduction effect, cost is low, the characteristics of convenient production and processing, it is worth promoting.
Description
Technical field
The invention belongs to aluminium base technical field, more specifically, more particularly to a kind of aluminium base of high thermal conductivity aluminum matrix plate
Material formula and preparation method thereof.
Background technology
As electronic product develops to light, thin, small, high density, multifunction, element packing density and integrated on wiring board
More and more higher is spent, power consumption is increasing, and also more and more higher is required to the heat dispersion of substrate.If the thermal diffusivity of substrate is not
It is good, the component overheat on wiring board is may result in, substantially reduces overall reliability.Therefore, it is reliably high to study performance
Heat-conducting metal substrate is extremely urgent.
Metal substrate generally comprises three-decker, is that conductive layer (being used as circuit), insulating barrier and metal-based layer (are used for respectively
Heat conduction).Wherein insulating barrier is one layer of low thermal resistance, the heat-conducting insulation material of high-k, primarily serves connection, insulation and heat conduction
Effect, be metal substrate core technology where.In power electronic, integrated circuit, LED illumination, heat dissipation problem is seriously made
About its efficiency and life-span.With the continuous rising of semiconductor die package power, the heat power consumption of chip unit area is increasing,
Higher requirement is proposed to the heat conductivility of the aluminium base of bearing semiconductor component, therefore using Heat Conduction Material as filler
High thermal conductivity aluminum matrix plate is prepared to arise at the historic moment.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of high thermal conductivity aluminum matrix plate proposed
Alumina-base material formula and preparation method thereof.
To achieve the above object, the present invention provides following technical scheme：
A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate, it is characterised in that：The alumina-base material of the high thermal conductivity aluminum matrix plate
It is formulated by following components：Magnesium, aluminium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber, aluminum oxide are fine
Dimension, the alumina-base material ingredients principle of the high thermal conductivity aluminum matrix plate are：Magnesium 1-4%, zinc 0-3%, magnesia 0-3%, potassium oxide
0.2-4%, barium monoxide 0.1-3%, tetraethyl orthosilicate 0.2-0.4%, carbon fiber 0.1-0.3%, alumina fibre 0.2-
0.4%, remaining is aluminium.
A kind of alumina-base material preparation method of high thermal conductivity aluminum matrix plate, the alumina-base material preparation method tool of the high thermal conductivity aluminum matrix plate
Body step is as follows：
S1：Commercial-purity aluminium is added in the furnace chamber of crucible furnace, aluminium ingot fusing is warming up to 450-500 DEG C, is protected using argon gas
Shield；
S2：Magnesium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber and alumina fibre material are added
Fully it is pulverized and mixed in spheroidal graphite pulverizer；
S3：The mixture crushed in S2 is added in crucible furnace, is warming up to 750-800 DEG C, adds carbon dioxide gas
Body, aluminum melt is set fully to melt；
S4：Scum silica frost in aluminum melt is removed；
S5：Aluminum melt is poured into mould, after the 4h that annealed at 200 DEG C, taking-up, which is put under natural environment, cools down 12h,
Prepare high thermal conductivity aluminum matrix plate；
S6：High thermal conductivity aluminum matrix plate is cut into a diameter of 20cm square piece, deburring of polishing, then aluminium sheet is entered in polishing fluid
Row mirror finish；
S7：Using 0.3mol/L oxalic acid solution as aluminium sheet anodic oxidation electrolyte, the control of cooling system circularly cooling
Anodizing temperature is constant at 0 DEG C, and constant oxidate current is 1.3A/dm2, aoxidize 5-30min；
S8：By the sample after the completion of oxidation through washing, drying, 60min is incubated at 250 DEG C, immerses acrylic acid under negative pressure
30min in monomer, 5min then is soaked in 100 DEG C of pure water, then be washed with deionized water, dried；
S9：Circuit etching：Dry film exposure, development, using etchant respectively to layers of copper, NiCr alloy-layer step-etchings；
S10：Welding resistance, upper tin.
Preferably, the grinding time is 3h.
Preferably, the polishing fluid is silicon materials polishing fluid.
The technique effect and advantage of the present invention：A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate provided by the invention and its
Preparation method, compared with conventional art, good heat conduction effect of the present invention, cost is low, convenient production and processing.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with specific embodiment, to this
Invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, not
For limiting the present invention.Based on the embodiment in the present invention, those of ordinary skill in the art are not before creative work is made
The every other embodiment obtained is put, belongs to the scope of protection of the invention.
Embodiment 1
A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate, it is characterised in that：The alumina-base material of the high thermal conductivity aluminum matrix plate
It is formulated by following components：Magnesium, aluminium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber, aluminum oxide are fine
Dimension, the alumina-base material ingredients principle of the high thermal conductivity aluminum matrix plate are：Magnesium 1%, zinc 1%, magnesia 1%, potassium oxide 0.2%, oxygen
Change barium 0.1%, tetraethyl orthosilicate 0.2%, carbon fiber 0.1%, alumina fibre 0.2%, remaining is aluminium.
A kind of alumina-base material preparation method of high thermal conductivity aluminum matrix plate, the alumina-base material preparation method tool of the high thermal conductivity aluminum matrix plate
Body step is as follows：
S1：Commercial-purity aluminium is added in the furnace chamber of crucible furnace, aluminium ingot fusing is warming up to 450 DEG C, is protected using argon gas；
S2：Magnesium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber and alumina fibre material are added
Fully it is pulverized and mixed in spheroidal graphite pulverizer；
S3：The mixture crushed in S2 is added in crucible furnace, is warming up to 750 DEG C, carbon dioxide is added, makes
Aluminum melt fully melts；
S4：Scum silica frost in aluminum melt is removed；
S5：Aluminum melt is poured into mould, after the 4h that annealed at 200 DEG C, taking-up, which is put under natural environment, cools down 12h,
Prepare high thermal conductivity aluminum matrix plate；
S6：High thermal conductivity aluminum matrix plate is cut into a diameter of 20cm square piece, deburring of polishing, then aluminium sheet is entered in polishing fluid
Row mirror finish；
S7：Using 0.3mol/L oxalic acid solution as aluminium sheet anodic oxidation electrolyte, the control of cooling system circularly cooling
Anodizing temperature is constant at 0 DEG C, and constant oxidate current is 1.3A/dm2, aoxidize 15min；
S8：By the sample after the completion of oxidation through washing, drying, 60min is incubated at 250 DEG C, immerses acrylic acid under negative pressure
30min in monomer, 5min then is soaked in 100 DEG C of pure water, then be washed with deionized water, dried；
S9：Circuit etching：Dry film exposure, development, using etchant respectively to layers of copper, NiCr alloy-layer step-etchings；
S10：Welding resistance, upper tin.
Specifically, the grinding time is 3h.
Specifically, the polishing fluid is silicon materials polishing fluid.
Embodiment 2
A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate, it is characterised in that：The alumina-base material of the high thermal conductivity aluminum matrix plate
It is formulated by following components：Magnesium, aluminium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber, aluminum oxide are fine
Dimension, the alumina-base material ingredients principle of the high thermal conductivity aluminum matrix plate are：Magnesium 2%, zinc 2%, magnesia 2%, potassium oxide 2.2%, oxygen
Change barium 1.5%, tetraethyl orthosilicate 0.3%, carbon fiber 0.2%, alumina fibre 0.3%, remaining is aluminium.
A kind of alumina-base material preparation method of high thermal conductivity aluminum matrix plate, the alumina-base material preparation method tool of the high thermal conductivity aluminum matrix plate
Body step is as follows：
S1：Commercial-purity aluminium is added in the furnace chamber of crucible furnace, aluminium ingot fusing is warming up to 475 DEG C, is protected using argon gas；
S2：Magnesium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber and alumina fibre material are added
Fully it is pulverized and mixed in spheroidal graphite pulverizer；
S3：The mixture crushed in S2 is added in crucible furnace, is warming up to 780 DEG C, carbon dioxide is added, makes
Aluminum melt fully melts；
S4：Scum silica frost in aluminum melt is removed；
S5：Aluminum melt is poured into mould, after the 4h that annealed at 200 DEG C, taking-up, which is put under natural environment, cools down 12h,
Prepare high thermal conductivity aluminum matrix plate；
S6：High thermal conductivity aluminum matrix plate is cut into a diameter of 20cm square piece, deburring of polishing, then aluminium sheet is entered in polishing fluid
Row mirror finish；
S7：Using 0.3mol/L oxalic acid solution as aluminium sheet anodic oxidation electrolyte, the control of cooling system circularly cooling
Anodizing temperature is constant at 0 DEG C, and constant oxidate current is 1.3A/dm2, aoxidize 15min；
S8：By the sample after the completion of oxidation through washing, drying, 60min is incubated at 250 DEG C, immerses acrylic acid under negative pressure
30min in monomer, 5min then is soaked in 100 DEG C of pure water, then be washed with deionized water, dried；
S9：Circuit etching：Dry film exposure, development, using etchant respectively to layers of copper, NiCr alloy-layer step-etchings；
S10：Welding resistance, upper tin.
Specifically, the grinding time is 3h.
Specifically, the polishing fluid is silicon materials polishing fluid.
Embodiment 3
A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate, it is characterised in that：The alumina-base material of the high thermal conductivity aluminum matrix plate
It is formulated by following components：Magnesium, aluminium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber, aluminum oxide are fine
Dimension, the alumina-base material ingredients principle of the high thermal conductivity aluminum matrix plate are：Magnesium 4%, zinc 1%, magnesia 0.1%, potassium oxide 0.5%,
Barium monoxide 3%, tetraethyl orthosilicate 0.4%, carbon fiber 0.3%, alumina fibre 0.4%, remaining is aluminium.
A kind of alumina-base material preparation method of high thermal conductivity aluminum matrix plate, the alumina-base material preparation method tool of the high thermal conductivity aluminum matrix plate
Body step is as follows：
S1：Commercial-purity aluminium is added in the furnace chamber of crucible furnace, aluminium ingot fusing is warming up to 500 DEG C, is protected using argon gas；
S2：Magnesium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber and alumina fibre material are added
Fully it is pulverized and mixed in spheroidal graphite pulverizer；
S3：The mixture crushed in S2 is added in crucible furnace, is warming up to 800 DEG C, carbon dioxide is added, makes
Aluminum melt fully melts；
S4：Scum silica frost in aluminum melt is removed；
S5：Aluminum melt is poured into mould, after the 4h that annealed at 200 DEG C, taking-up, which is put under natural environment, cools down 12h,
Prepare high thermal conductivity aluminum matrix plate；
S6：High thermal conductivity aluminum matrix plate is cut into a diameter of 20cm square piece, deburring of polishing, then aluminium sheet is entered in polishing fluid
Row mirror finish；
S7：Using 0.3mol/L oxalic acid solution as aluminium sheet anodic oxidation electrolyte, the control of cooling system circularly cooling
Anodizing temperature is constant at 0 DEG C, and constant oxidate current is 1.3A/dm2, aoxidize 30min；
S8：By the sample after the completion of oxidation through washing, drying, 60min is incubated at 250 DEG C, immerses acrylic acid under negative pressure
30min in monomer, 5min then is soaked in 100 DEG C of pure water, then be washed with deionized water, dried；
S9：Circuit etching：Dry film exposure, development, using etchant respectively to layers of copper, NiCr alloy-layer step-etchings；
S10：Welding resistance, upper tin.
Specifically, the grinding time is 3h.
Specifically, the polishing fluid is silicon materials polishing fluid.
Good heat conduction effect of the present invention, cost is low, convenient production and processing.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic,
Within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., it should be included in the present invention's
Within protection domain.
Claims (5)
- A kind of 1. alumina-base material formula of high thermal conductivity aluminum matrix plate, it is characterised in that：The alumina-base material of the high thermal conductivity aluminum matrix plate by Following components is formulated：Magnesium, aluminium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber, alumina fibre.
- A kind of 2. alumina-base material formula of high thermal conductivity aluminum matrix plate according to claim 1, it is characterised in that：The high heat conduction The alumina-base material ingredients principle of aluminium base is：Magnesium 1-4%, zinc 0-3%, magnesia 0-3%, potassium oxide 0.2-4%, barium monoxide 0.1-3%, tetraethyl orthosilicate 0.2-0.4%, carbon fiber 0.1-0.3%, alumina fibre 0.2-0.4%, remaining is aluminium.
- A kind of 3. alumina-base material preparation method of high thermal conductivity aluminum matrix plate according to claim 2, it is characterised in that：The height is led The alumina-base material preparation method of hot aluminium base comprises the following steps that：S1：Commercial-purity aluminium is added in the furnace chamber of crucible furnace, aluminium ingot fusing is warming up to 450-500 DEG C, is protected using argon gas；S2：Magnesium, zinc, magnesia, potassium oxide, barium monoxide, tetraethyl orthosilicate, carbon fiber and alumina fibre material are added to ball Fully it is pulverized and mixed in black pulverizer；S3：The mixture crushed in S2 is added in crucible furnace, is warming up to 750-800 DEG C, carbon dioxide is added, makes Aluminum melt fully melts；S4：Scum silica frost in aluminum melt is removed；S5：Aluminum melt is poured into mould, after the 4h that annealed at 200 DEG C, taking-up, which is put under natural environment, cools down 12h, prepares Go out high thermal conductivity aluminum matrix plate；S6：High thermal conductivity aluminum matrix plate is cut into a diameter of 20cm square piece, deburring of polishing, then aluminium sheet is subjected to mirror in polishing fluid Mirror polish；S7：Using 0.3mol/L oxalic acid solution as aluminium sheet anodic oxidation electrolyte, cooling system circularly cooling control anode Oxidizing temperature is constant at 0 DEG C, and constant oxidate current is 1.3A/dm2, aoxidize 5-30min；S8：By the sample after the completion of oxidation through washing, drying, 60min is incubated at 250 DEG C, immerses acrylic monomers under negative pressure Middle 30min, 5min then is soaked in 100 DEG C of pure water, then be washed with deionized water, dried；S9：Circuit etching：Dry film exposure, development, using etchant respectively to layers of copper, NiCr alloy-layer step-etchings；S10：Welding resistance, upper tin.
- 4. alumina-base material formula of a kind of high thermal conductivity aluminum matrix plate according to claim 3 and preparation method thereof, its feature exists In：The grinding time is 3h.
- 5. alumina-base material formula of a kind of high thermal conductivity aluminum matrix plate according to claim 3 and preparation method thereof, its feature exists In：The polishing fluid is silicon materials polishing fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710937848.0A CN107541684A (en) | 2017-10-11 | 2017-10-11 | A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710937848.0A CN107541684A (en) | 2017-10-11 | 2017-10-11 | A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107541684A true CN107541684A (en) | 2018-01-05 |
Family
ID=60967302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710937848.0A Pending CN107541684A (en) | 2017-10-11 | 2017-10-11 | A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107541684A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164536A2 (en) * | 1984-06-15 | 1985-12-18 | Toyota Jidosha Kabushiki Kaisha | Composite material with carbon reinforcing fibers and magnesium alloy matrix metal including zinc |
| CN101098975A (en) * | 2005-01-14 | 2008-01-02 | 本田技研工业株式会社 | Aluminum-based composite material and method for production thereof |
| CN103628005A (en) * | 2013-11-22 | 2014-03-12 | 江苏大学 | Carbon fiber reinforced aluminum base composite material for brake disc and preparation method of composite material |
| CN103757567A (en) * | 2013-11-04 | 2014-04-30 | 吴雅萍 | Aluminum based composite material and manufacture method thereof |
| CN103757568A (en) * | 2013-11-04 | 2014-04-30 | 吴雅萍 | Manufacture method of aluminum based composite material |
| CN104213056A (en) * | 2014-09-15 | 2014-12-17 | 河南科技大学 | Carbon fiber-reinforced aluminum-magnesium alloy composite material and preparation method thereof |
| CN104726749A (en) * | 2015-03-19 | 2015-06-24 | 苏州欢颜电气有限公司 | Aluminum alloy conductor material |
| CN105177472A (en) * | 2015-06-29 | 2015-12-23 | 安徽越天特种车桥有限公司 | Reinforced composite aluminum alloy automobile part mixed with alumina fibers and casting technology of reinforced composite aluminum alloy automobile part |
| CN105648363A (en) * | 2016-01-20 | 2016-06-08 | 浙江农业商贸职业学院 | Light-weight composite material for automobile |
| CN106191722A (en) * | 2016-07-13 | 2016-12-07 | 安徽祈艾特电子科技股份有限公司 | A kind of automotive electronics encapsulation carbon nano-fiber strengthens antistatic hydronalium and preparation method thereof |
| CN106756651A (en) * | 2016-12-01 | 2017-05-31 | 重庆擎模具制造有限公司 | The auto parts and components and its casting technique of a kind of enhanced Al-alloy casting |
-
2017
- 2017-10-11 CN CN201710937848.0A patent/CN107541684A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0164536A2 (en) * | 1984-06-15 | 1985-12-18 | Toyota Jidosha Kabushiki Kaisha | Composite material with carbon reinforcing fibers and magnesium alloy matrix metal including zinc |
| CN101098975A (en) * | 2005-01-14 | 2008-01-02 | 本田技研工业株式会社 | Aluminum-based composite material and method for production thereof |
| CN103757567A (en) * | 2013-11-04 | 2014-04-30 | 吴雅萍 | Aluminum based composite material and manufacture method thereof |
| CN103757568A (en) * | 2013-11-04 | 2014-04-30 | 吴雅萍 | Manufacture method of aluminum based composite material |
| CN103628005A (en) * | 2013-11-22 | 2014-03-12 | 江苏大学 | Carbon fiber reinforced aluminum base composite material for brake disc and preparation method of composite material |
| CN104213056A (en) * | 2014-09-15 | 2014-12-17 | 河南科技大学 | Carbon fiber-reinforced aluminum-magnesium alloy composite material and preparation method thereof |
| CN104726749A (en) * | 2015-03-19 | 2015-06-24 | 苏州欢颜电气有限公司 | Aluminum alloy conductor material |
| CN105177472A (en) * | 2015-06-29 | 2015-12-23 | 安徽越天特种车桥有限公司 | Reinforced composite aluminum alloy automobile part mixed with alumina fibers and casting technology of reinforced composite aluminum alloy automobile part |
| CN105648363A (en) * | 2016-01-20 | 2016-06-08 | 浙江农业商贸职业学院 | Light-weight composite material for automobile |
| CN106191722A (en) * | 2016-07-13 | 2016-12-07 | 安徽祈艾特电子科技股份有限公司 | A kind of automotive electronics encapsulation carbon nano-fiber strengthens antistatic hydronalium and preparation method thereof |
| CN106756651A (en) * | 2016-12-01 | 2017-05-31 | 重庆擎模具制造有限公司 | The auto parts and components and its casting technique of a kind of enhanced Al-alloy casting |
Non-Patent Citations (2)
| Title |
|---|
| 王勇涛等: ""高导热阳极氧化铝陶瓷膜铝基板的研制"", 《绝缘材料》 * |
| 龚雪薇: ""LTCC中玻璃/陶瓷复合基板材料的热性能研究"", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107675028A (en) | A kind of single-layer graphene/aluminium composite material and preparation method thereof | |
| CN107022698A (en) | A kind of high heat conduction pack alloy and preparation method thereof | |
| CN104896343A (en) | LED bulb | |
| CN106929733A (en) | A kind of compound liquid metal thermal interface material of foamed aluminium | |
| CN106028764A (en) | Heat pipe type radiator and production process thereof | |
| CN103035831B (en) | The manufacture method of LED aluminum base plate insulating barrier | |
| CN201269692Y (en) | High-efficiency aluminum alloy melting and heat preservation stove with low oxidization burning loss and high molten aluminum quality | |
| CN103280565A (en) | Aluminium alloy anode material and preparation method thereof | |
| CN107541684A (en) | A kind of alumina-base material formula of high thermal conductivity aluminum matrix plate and preparation method thereof | |
| CN104240841A (en) | Base metal conductor paste preparation method | |
| CN110014718A (en) | A method of gallium base thermal interface material applications are enhanced into interface heat transfer in aluminium substrate | |
| CN103068151A (en) | Heat dissipation base material | |
| CN106702454B (en) | The surface treatment method and wear-resisting shuttle of weaving aluminium alloy shuttle | |
| CN104313645A (en) | Device and process for preparing scandium-containing aluminum alloy material | |
| CN204151433U (en) | The preparation facilities of Mo-bearing granitoid material | |
| CN208008940U (en) | A kind of solar energy quartz crucible firm banking | |
| CN108878631A (en) | LED substrate of patterned insulation layer and its preparation method and application | |
| CN102746014A (en) | Corundum cooling medium, related preparation method thereof and application thereof | |
| CN209544556U (en) | A kind of battery using phase-transition heat-storage | |
| CN201018182Y (en) | CO2 laser tube lens radiator | |
| CN206216053U (en) | A kind of new electric spark shaping mill based on multi-protective device | |
| CN218277231U (en) | Device for reducing temperature of ferrite transformer of LED driving power supply | |
| JP6271979B2 (en) | Method for producing alumina powder for filler of printed circuit board | |
| CN108878627A (en) | LED substrate and its preparation method and application | |
| CN218994019U (en) | Low energy consumption type aluminum water heating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180105 |