CN107531550A - The glass component of chemical enhanced alkali aluminium pyrex with low-k - Google Patents
The glass component of chemical enhanced alkali aluminium pyrex with low-k Download PDFInfo
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- CN107531550A CN107531550A CN201580077196.7A CN201580077196A CN107531550A CN 107531550 A CN107531550 A CN 107531550A CN 201580077196 A CN201580077196 A CN 201580077196A CN 107531550 A CN107531550 A CN 107531550A
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- Prior art keywords
- glass
- chemical enhanced
- aluminium borosilicate
- alkali aluminium
- ion
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
Abstract
A kind of glass component for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k, and a kind of method for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k.The chemical enhanced alkali aluminium borosilicate glass is suitable for the high intensity cover glass, solar cell cover glass and stacked safe glass of touch control display.The low-k of glass improves sensitiveness, response time, power dissipation rates and accuracy.
Description
Technical field
The present invention is on a kind of glass group for being used for the chemical enhanced alkali aluminium borosilicate glass with low-k
Into thing, and a kind of method for being used to manufacture the chemical enhanced alkali alumina silicate glass with low-k, and with low
The application and use of the chemical enhanced alkali alumina silicate glass of dielectric constant.
Background technology
Chemically reinforced glass to manufacture the chemical enhanced technique of the glass normally due to glass component and all compare
Annealed glass is significantly stronger.This chemical enhanced technique can be used to strengthen the glass of all size and dimensions, without producing optics
Distortion, it makes it possible to production can not be by thin, the small and complex-shaped glass sample of heat tempering.These characteristics causing
Learn strengthened glass (more particularly chemical enhanced alkali alumina silicate glass) and turn into and be used for consumer mobile electronic device (such as intelligence
Can phone, tablet personal computer and notepad) it is a kind of welcome and be widely used selection.
Chemical enhanced technique generally comprises ion-exchange process.In this ion-exchange process, glass is positioned at melting
Melt in salt, fuse salt contains the bigger ion of ion that ratio of ionic radii is present in glass so that be present in glass compared with
Small ion can be by the larger ionic compartmentation in heated solution.In general, the potassium ion in fuse salt can substitute presence
Less sodium ion in glass.It is this to be led by substitution of the larger potassium ion to smaller sodium ion in glass in heated solution
Cause to form a compressive stress layers in glass both side surface and form the central tension area being clipped between compressive stress layers.
The tensile stress (CT, usually being represented with MPa (MPa)) in central tension area and compressive stress layers compression stress (CS, typically
Represented with MPa) and it is relevant with the compression stress layer depth (DOL) represented by following equation：
CT=CS × DOL/ (t-2DOL)
Wherein t is the thickness of glass.
To be used as touch control display cover glass, it is necessary to increase repellence of the glass to scratch and impact failure.This
It can reach by the depth of increase compression stress and compressive stress layers.However, in order that the tensile stress of central stressed zone is kept
In an acceptable scope, the increase of both compression stress and compressive stress layers thickness can all disadvantageously result in thickness of glass
Increase.
At the same time, it is desirable to be that cover glass will be as far as possible to be thin.However, because the tensile stress in central tension area can be with glass
Thickness is reduced and increased, and therefore, it is difficult to maintain the acceptable tensile stress in central tension area while maintain high compression stress and height again
Compression stress layer depth.In these examples, being typically necessary makes the compression stress be as far as possible to layer depth ratio (CS/DOL)
It is high.
In addition, the dielectric constant of glass can influence sensitiveness, response time, power dissipation rates and the analogy of touch control device
Signal False Rate, and cause long response time.In general, dielectric constant is lower, sensitiveness, response time, power dissipation rates and essence
Exactness is better.
The dielectric constant of current commercially available chemical enhanced alkali alumina silicate glass is (to be in frequency between 7.1 to 7.8
Measured under 1MHz).With non-alkali alumina silicate glass (such as Thin Film Transistor-LCD glass (TFT-LCD glass)) phase
Than the ratio that glass forms material is relative to be low, and the ratio of conductive ionic compound is then relative for height.It is general and
Speech, TFT-LCD glass is non-alkali aluminium borosilicate glass, and its dielectric constant is about 5.2 to about 6.0.
The dielectric constant of the glass substrate material used in touch control display is lower, and sensitiveness is higher.Have in exploitation
During the glass ingredient of low-k, it should maintain to provide the machinery and physical property of chemical strength simultaneously.Therefore, it is necessary to a kind of tool
There is the glass of high intensity and low-k.
The content of the invention
In several illustrative embodiments, being used to manufacture the invention provides one kind has low-k and high intensity
Chemical enhanced alkali aluminium borosilicate glass the commutative glass component of ion.It is described according to several illustrative embodiments
Constituent has higher boron oxide compound content and good melting behaviour, and it enables sheet glass shape in overflow down draw technique
Into.According to several illustrative embodiments, the constituent has the sodium oxide molybdena of high content, and it can be suitably used for the constituent
Ion-exchange process.According to several illustrative embodiments, there is provided a kind of sial na oxide glass for being easy to melting.
By the amount for improving glass formation material, glass dielectric constant is effectively improved.For oxide glass, glass
It is mainly silica, boron oxide compound, phosphorous oxides and beryllium oxide to form material.Beryllium oxide is poisonous, and from consumption
Give up in property electronic product.Phosphorous oxides is not suitable for overflow down draw technique, because it can produce corrosion to noble metal equipment
Destroy.In general, the boron oxide compound in TFT-LCD glass substrates can reach 6 to 11 weight percents.But current boron
Oxide is fresh to be used less, or is controlled as being less than 2 weight percents in chemical enhanced cover glass.
The present invention provides a kind of chemical enhanced alkali aluminium borosilicic acid with low-k and increased boron oxide compound content
Salt glass component.In several illustrative embodiments, dielectric constant is below about 6.0, and it shows less than presently commercially available touch-control
The dielectric constant of the alumina silicate glass of device.The dielectric constant of glass can be by silica and boron oxide compound in increase glass
Content and reduce conductive ions compound (such as sodium oxide molybdena, potassium oxide, magnesia and calcium oxide) ratio and reduce.
The ratio regular meeting of different glass constituent influences the property of glass.To ensure that glass component is adapted to by overflow down draw
Technique forms glass, can be carried out by overflow down draw technique by ion exchange chemical enhanced, and has after ion exchange
There is high intensity, to add the aluminum oxide and sodium oxide molybdena of proper proportion., can to ensure that glass has low melting glass and operability
Add the magnesia of appropriate amount.Compared to the ratio of increase metal oxide (such as calcium oxide, potassium oxide and zinc oxide), increase
Magnesia is a good selection, because it can reduce the proportion of glass and increase the intensity of glass.
In several illustrative embodiments, for manufacturing the chemical enhanced alkali aluminoborosilicate glass with low-k
The commutative glass component of ion of glass includes：
Silica (the SiO of about 60.0 to about 70.0 molar percentages (mol%)2)；
About 6.0 to about 10.0mol% alundum (Al2O3) (Al2O3)；
About 5.0 to about 10.0mol% sodium oxide molybdena (Na2O)；
About 15.0 to about 25.0mol% diboron trioxide (B2O3)；
About 0 to about 5.0mol% potassium oxide (K2O)；And
About 0 to about 3.0mol% magnesia (MgO).
It is described to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass includes about 60.0 to about 70.0mol% silica (SiO2).Silica
It is the maximum single component in alkali alumina silicate glass, and the matrix of glass is formed together with diboron trioxide.Silica
The structural coordination agent of glass is also served as, and contributes to the formability, rigidity and chemical resistance of glass.When concentration is higher than
During 70.0mol%, silica can improve the melting temperature of glass component, thus melten glass can become to be very difficult to locate
Reason, result in the degree of difficulty of glass.When concentration is less than 60.0mol%, silica can poorly tend to make glass
Liquidus temperature substantially increases, and particularly in the sodium oxide molybdena or the glass component of magnesia with high concentration, and can be inclined to
Vitreous is lost in causing glass.
It is described to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass includes about 6.0 to about 10.0mol% aluminum oxide (Al2O3).When concentration is between about
When 6.0 to about 10.0mol%, the alumina lift intensity of alkali alumina silicate glass, and promote sodium ion in glass with it is molten
Melt the ion exchange between the potassium ion in salt.As alumina content increases, dielectric constant can be because of glass network cyclic structure
Increasing and increase.The amount of aluminum oxide represents glass property (such as dielectric constant, ion exchange depth and glass is strong in glass
Degree) between compromise.
It is described to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass includes about 5.0 to about 10.0mol% sodium oxide molybdena (Na2O).Alkali metal oxide
As the adjuvant that reach low liquidus temperature and low melting point.In the situation of sodium oxide molybdena, Na2O be carry out successfully from
Son exchanges.For that can carry out the strength of glass that sufficient ion exchange is substantially lifted to produce, sodium oxide molybdena with above-mentioned concentration by comprising
In constituent.Meanwhile in order to increase the probability of ion exchange between sodium ion and potassium ion, it is embodied according to several illustrate
Example, the commutative glass component of ion for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Including with the potassium oxide (K between about 0 to about 5.0mol%2O)。
It is described to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass includes about 15.0 to about 25.0mol% diboron trioxide (B2O3).Three oxidations two
Boron is as fluxing agent and glass blender.Meanwhile glass melting temperature and dielectric constant are tended to diboron trioxide
Concentration increase and reduce.And between sodium ion and potassium ion ion exchange direction can because diboron trioxide concentration increase and
Affect adversely.Therefore, with the increase of diboron trioxide concentration, between the dielectric constant of glass and the ion-exchange capacity of glass
It there are choice.
It is described to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass includes about 0 to about 3.0mol% magnesia (MgO).Illustrated specifically in fact several
Apply in example, the commutative glass group of ion for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Include about 1.0 to about 2.0mol% magnesia into thing.Compared to such as calcium oxide (CaO), strontium oxide strontia (SrO) and barium monoxide
(BaO) other basic anhydride such as, magnesia are also believed the intensity that can increase glass and the proportion for reducing glass.
It is commutative according to the above-mentioned ion for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Several illustrative embodiments of glass component, the glass are (first at this temperature with least about 750 DEG C of liquidus temperature
First it was observed that crystal).According to the above-mentioned ion for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Several illustrative embodiments of commutative glass component, the glass have at least about 800 DEG C of liquidus temperature.According to upper
State the number of the commutative glass component of ion for manufacturing the chemical enhanced alkali aluminium borosilicate glass with low-k
Individual illustrative embodiment, the glass have at least about 850 DEG C of liquidus temperature.There is low dielectric for manufacturing according to above-mentioned
Several illustrative embodiments of the commutative glass component of ion of the chemical enhanced alkali aluminium borosilicate glass of constant, it is described
Glass has at least about 900 DEG C of liquidus temperature.It is used to manufacture the chemical enhanced alkali aluminium boron with low-k according to above-mentioned
Several illustrative embodiments of the commutative glass component of ion of silicate glass, the glass have about 750 DEG C to about
900 DEG C of liquidus temperature.
According to several illustrative embodiments, the chemical enhanced alkali with low-k is manufactured the invention provides a kind of
The method of aluminium borosilicate glass.According to several illustrative embodiments, methods described includes：
Mixing and fusing composition, to form homogeneous glass melt, it includes：
The glass is shaped using selected from overflow downdraw, floating method method in combination；
Anneal the glass；And
The chemical enhanced glass by ion exchange.
According to several illustrative embodiments, there is the manufacture of the chemical enhanced alkali aluminium borosilicate glass of low-k
It can be implemented using conventional outflow glass tube down-drawing, it, which belongs in the field, has known by usual those skilled in the art, and generally includes straight
Connect or the noble metal systems of indirectly heat, its reduced by homogenization device, by clarification the equipment (clarifier) of bubble content,
The equipment of cooling and thermally homogenising, dispersing apparatus and other equipment form.In conventional manner, floating method includes floating melten glass
In molten metal bed (being usually tin), this produces glass very flat and with uniform thickness.
According to the several of the above-mentioned method for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Illustrative embodiment, the commutative glass component of ion are to be melted at about 450 DEG C at most about 8 hours.According to above-mentioned
For the several illustrative embodiments for the method for manufacturing the chemical enhanced alkali aluminium borosilicate glass with low-k, institute
It is to be melted at about 450 DEG C at most about 16 hours to state the commutative glass component of ion.There is low Jie for manufacturing according to above-mentioned
Several illustrative embodiments of the method for the chemical enhanced alkali aluminium borosilicate glass of electric constant, the commutative glass of ion
Constituent is to be melted at about 450 DEG C at most about 24 hours.
According to the several of the above-mentioned method for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Illustrative embodiment, the commutative glass component of ion are annealed with about 0.5 DEG C/h of speed, Zhi Daoqi
Untill reaching room temperature (or about 21 DEG C).
It is above-mentioned to be used to manufacture the chemical enhanced alkali aluminium borosilicic acid with low-k according to several illustrative embodiments
The commutative glass component of ion of salt glass carries out chemical enhanced according to conventional ion give-and-take conditions.It is used to manufacture according to above-mentioned
Several illustrative embodiments of the method for chemical enhanced alkali aluminium borosilicate glass with low-k, ion exchange work
Skill is betided in molten salt bath.In several illustrative embodiments, the fuse salt is potassium nitrate (KNO3)。
According to the several of the above-mentioned method for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Illustrative embodiment, ion-exchange treatment are occurred under about 390 DEG C to about 450 DEG C of temperature range.According to above-mentioned
There are several illustrative embodiments of the method for the chemical enhanced alkali aluminium borosilicate glass of low-k for manufacture, from
Sub- exchange processing is occurred at a temperature of about 450 DEG C.It is used to manufacture the chemical enhanced alkali with low-k according to above-mentioned
Several illustrative embodiments of the method for aluminium borosilicate glass, ion-exchange treatment are at a temperature of at least about 450 DEG C
Occur.According to the above-mentioned several illustrations for being used to manufacture the method for the chemical enhanced alkali aluminium borosilicate glass with low-k
Specific embodiment, ion-exchange treatment are occurred at a temperature of at most about 450 DEG C.
According to the several of the above-mentioned method for being used to manufacture the chemical enhanced alkali aluminium borosilicate glass with low-k
Illustrative embodiment, ion-exchange treatment are carried out within about 4 hours.It is used to manufacture the change with low-k according to above-mentioned
Several illustrative embodiments of the method for reinforced alkaline aluminium borosilicate glass are learned, it is small that ion-exchange treatment system is carried out within about 8
When.Had according to the above-mentioned several illustrations for being used to manufacture the method for the chemical enhanced alkali aluminium borosilicate glass with low-k
Body embodiment, ion-exchange treatment system are carried out within about 16 hours.It is used to manufacture the chemistry with low-k according to above-mentioned
Several illustrative embodiments of the method for reinforced alkaline aluminium borosilicate glass, ion-exchange treatment were carried out of about 24 hours.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass has surface compression stressor layers, and it has at least about 100MPa compression stress.Have low dielectric normal according to above-mentioned
Several illustrative embodiments of several chemical enhanced alkali aluminium borosilicate glass, the glass have surface compression stressor layers,
It has at least about 150MPa compression stress.According to the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Several illustrative embodiments, the glass has surface compression stressor layers, and it has at least about 200MPa compression stress.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k, the glass
With surface compression stressor layers, it has at least about 250MPa compression stress.According to the above-mentioned chemistry with low-k
Several illustrative embodiments of reinforced alkaline aluminium borosilicate glass, the glass have surface compression stressor layers, and it, which has, is situated between
Compression stress in about 100MPa to about 250MPa.According to the above-mentioned chemical enhanced alkali aluminoborosilicate glass with low-k
Several illustrative embodiments of glass, the glass have surface compression stressor layers, and it has between about 140MPa to about
260MPa compression stress.Had according to several illustrations of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Body embodiment, the glass have surface compression stressor layers, and it has the compression stress between about 150MPa to about 250MPa.Root
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k, the glass tool
There are surface compression stressor layers, it has the compression stress between about 160MPa to about 240MPa.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass has surface compression stressor layers, and it has at least about 16.0 μm of depth.According to above-mentioned with low-k
Several illustrative embodiments of chemical enhanced alkali aluminium borosilicate glass, the glass have surface compression stressor layers, and it has
There is at least about 17.0 μm of depth.According to several examples of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Show specific embodiment, the glass has surface compression stressor layers, and it has at least about 20.0 μm of depth.Had according to above-mentioned
Several illustrative embodiments of the chemical enhanced alkali aluminium borosilicate glass of low-k, the glass have surface compression
Stressor layers, it has at least about 27.0 μm of depth.According to the above-mentioned chemical enhanced alkali aluminoborosilicate with low-k
Several illustrative embodiments of glass, the glass have surface compression stressor layers, and it has between about 15.0 μm to about
35.0 μm of depth.It is specifically real according to several illustrations of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Example is applied, the glass has surface compression stressor layers, and it has the depth between about 17.0 μm to about 28.0 μm.According to above-mentioned tool
There are several illustrative embodiments of the chemical enhanced alkali aluminium borosilicate glass of low-k, the glass has surface pressure
Stress under compression layer, it has the depth between about 20.0 μm to about 30.0 μm.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass has the dielectric constant between about 5.0 to about 6.5 (at 25 DEG C, 1MHz, 5V).Have low dielectric normal according to above-mentioned
Several illustrative embodiments of several chemical enhanced alkali aluminium borosilicate glass, the glass have between about 5.3 to about 6.0
Dielectric constant (at 25 DEG C, 1MHz, 5V).According to the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Several illustrative embodiments, the dielectric constant system that the glass has is less than 6.0 (at 25 DEG C, 1MHz, 5V).
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass has at most about 2.29g/cm3Density and the linear expansion coefficient α between about 53.0 to about 70.025-300 10-7/
℃.It is described according to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k
Glass, which has, is below about 2.3g/cm3Density.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass by carrying out ion-exchange treatment at a temperature of about 390 DEG C to about 450 DEG C of about 2 hours to about 8 hours and
It is chemical enhanced, and the glass has：(1) compression stress is at least about 150MPa surface compression stressor layers, and surface compression
The depth of stressor layers is at least about 17.0 μm, and (2) are less than 6.0 dielectric constant.According to the above-mentioned change with low-k
Learn reinforced alkaline aluminium borosilicate glass several illustrative embodiments, the glass by carried out at a temperature of about 450 DEG C from
Son exchange processing is chemical enhanced of about 8 hours, and the glass has：(1) compression stress is to about between about 150MPa
250MPa surface compression stressor layers, and the depth of surface compression stressor layers is between about 17.0 μm to about 28.0 μm, and (2) between
The dielectric constant of about 5.3 to about 6.0.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k,
The glass can be normally used as the protective glass in the application apparatus such as solar panels, refrigerator doors and other household appliances.
According to several illustrative embodiments of the above-mentioned chemical enhanced alkali aluminium borosilicate glass with low-k, the glass
The protective glass of TV can be normally used as, as the safety glass of Automatic Teller Machine, and other electronic products.According to above-mentioned tool
There are several illustrative embodiments of the chemical enhanced alkali aluminium borosilicate glass of low-k, the glass can be used as
For the cover glass of consumer electronics device (such as smart phone, tablet PC and notepad).The glass can also be made
In application for such as automobile windshields, and it is used as substrate form building intelligence window.Have low dielectric normal according to above-mentioned
Several illustrative embodiments of several chemical enhanced alkali aluminium borosilicate glass, the glass system can be made because of its high intensity
It is used as Touch Screen or contact panel.
Following examples illustrate as above-mentioned constituent and method.
Describe in detail
Prepare that a kind of commutative glass component of ion is as follows, and it includes composition as shown in Table 1 below：
Table 1
| Oxide | Mol% |
| SiO2 | 62.3 |
| Al2O3 | 7.09 |
| Na2O | 6.07 |
| B2O3 | 19.26 |
| K2O | 3.33 |
| MgO | 1.95 |
Batch material as shown in table 2 is before 2 liters of plastic containers are added to through weighing and mixing.Used batch
Secondary material all has the quality of chemical reagent grade.
Table 2
| Batch raw material | Batch weight (gm) |
| Sandstone | 300.9 |
| Alumina | 86.0 |
| Soda ash | 64.0 |
| Borax | 229.7 |
| Potassium carbonate potassium | 66.7 |
| Magnesia | 6.58 |
The particle size of sandstone is between 0.045 and 0.25mm.Carry out mixed material using roller, to produce homogeneous batch
And crush soft glutinous polymers.The batch of mixing is transferred to 800 milliliters of platinum-rhodium alloy crucibles from plastic containers and carries out glass melting.
Platinum-rhodium crucible is placed in alumina support, and is loaded into the high temperature furnace equipped with MoSi heating components, and it is 900
Run at a temperature of DEG C.Furnace temperature is gradually increased to 1620 DEG C, and to hold temperature 4 at this temperature small for platinum-rhodium crucible and its supporter
When.Then it is poured into by by molten bath material from platinum-rhodium crucible on stainless steel plate to form glass cake material.In glass cake material still
When being so heat, it is transferred to an annealing device, and holds at a temperature of 500 DEG C temperature 2 hours, then with 0.5 DEG C/minute
Speed is cooled to 430 DEG C.Afterwards, sample is naturally cooled to room temperature (21 DEG C).
Then by the glass sample is positioned in fuse salt bath carry out it is chemical enhanced, wherein, composition in glass
Potassium ion of the sodium ion with outside supply under 450 DEG C (it is less than the strain point of glass) was swapped up to 8 hours.By this side
Method, glass sample are strengthened by ion exchange, to produce compressive stress layers at the processing surface.
The depth of the measurement of compression stress and compressive stress layers (according to double refraction) utilizes polarized light microscopy at glass surface
Mirror (bayesian complementary color device) sight glass section determines.The compression stress of glass surface is to be from hypothesis stress-optical constant
0.30 measured birefringence (nm*cm/N) (Scholze, H., Nature, Structure and Properties,
Springer-Verlag, 1988, p.260) calculate and obtain.
The middle explanation of the field " Ex.1 " in table 3 below of the result of constituent shown in upper table 1.The field of table 3 " Ex.2 " to " Ex.10 "
Other shown constituents with above-mentioned Ex.1 represented by the similar fashion of constituent prepared.
Table 3
Symbol definition proposed in table 3 is as follows：
·d：Density (g/ml), it is measured with Archimedian method (ASTM C693)；
·nD：Refractive index, it is measured by refractometer；
·α：Thermal coefficient of expansion (CTE), it is the rectilinear direction variable quantity from 50 to 300 DEG C, is measured with dilatometric method；
·TFusing：It is 10 in viscosity2Fusion temperature when (poise) is moored, as measured by high temperature cylinder viscosimeter；
·TOperation：It is 10 in viscosity4Glass operation temperature when (poise) is moored, as measured by high temperature cylinder viscosimeter；
·TLiquid phase：Liquidus temperature, observed at said temperatures in gliding temperature heating furnace (ASTM C829-81) interior boat body
To first crystallization, the general test of crystallization is carried out 24 hours；
·TSoftening：It is 10 in viscosity7.6Glass transition temperature when (poise) is moored, lengthening method by fiber measures；
·TAnnealing：It is 10 in viscosity13Annealing Temperature of Glass when (poise) is moored, lengthening method by fiber measures；
·TStrain：It is 10 in viscosity14.5Glass strain temperature when (poise) is moored, lengthening method by fiber measures；
·k：Dielectric constant, measure, measured with SJ/T 11043-1996, wherein frequency is under 25 DEG C, 1MHz and 5V
1MHz；
● loss tangent：Loss angle tangent, measure, measured with SJ/T 11043-1996, wherein frequency under 1MHz and 5V
For 1MHz；
Young's modulus：Single shaft linear stress is measured to the ratio of linear strain with ASTM E1876 response methods；
Poisson's ratio：Ratio of the cross-direction shrinkage strain in force direction to Longitudinal extending strain is stretched, with ASTM E1876
Response method measures；
Shear modulus：Shear stress is measured to the ratio of shearing strain with ASTM E1876 response methods；
·CS：Compression stress after being carried out at 450 DEG C chemical enhanced 8 hours (tends to atom in compressive surfaces
Coplanar stress)；
·DOL：Layer depth, after its representative carries out chemical enhanced 8 hours at 450 DEG C, arrive under the surface closest to zero
The compression depth of stress plane；And
·CT：The central tension after chemical enhanced 8 hours is carried out at 450 DEG C.
Though the present invention is illustrated with some specific embodiments, so it is familiar with the art person and will be understood that, can such as
Change in the spirit and scope of attached claims to implement the present invention.
All reference terms spatially, for example, " on ", " under ", " top ", " lower section ", " between ", " bottom ", " perpendicular
Directly ", " level ", " inclination ", " upward ", " downward ", " and adjacent ", " left-to-right ", "left", "right", " right-to-left ", " the top bottom of to
Portion ", " bottom to top ", " top ", " bottom ", " bottom up ", " top down " etc., all merely for the purpose of illustration, without
Limit specific orientation or the position of said structure.
The present invention is illustrated with certain specific embodiments.Be familiar with the art person read it is disclosed
It is clearly understood that its improvement or modification are all fallen within the spirit and scope of the present invention after content.It should be understood that several modification examples, change
Example with alternative is all that foregoing disclosure is included, and in some circumstances, and some features of the invention can be in not corresponding to
Using being applied under other features.Therefore, such as attached claims are widely explained and in a manner of consistent with scope
Explained it is appropriate.
Claims (39)
1. a kind of commutative glass component of ion for being used to manufacture chemical enhanced alkali aluminium borosilicate glass, including：
About 60.0 to about 70.0mol% SiO2；
About 6.0 to about 10.0mol% Al2O3；
About 5.0 to about 10.0mol% Na2O；
About 15.0 to about 25.0mol% B2O3；
About 0 to about 5.0mol% K2O；And
About 0 to about 3.0mol% MgO.
2. the commutative glass component of ion according to claim 1, wherein the glass component has at least about 750
DEG C liquidus temperature.
3. the commutative glass component of ion according to claim 2, wherein the glass component has at least about 800
DEG C liquidus temperature.
4. the commutative glass component of ion according to claim 3, wherein the glass component has at least about 850
DEG C liquidus temperature.
5. the commutative glass component of ion according to claim 4, wherein the glass component has at least about 900
DEG C liquidus temperature.
6. the commutative glass component of ion according to claim 1, wherein the glass component has about 750 DEG C extremely
About 850 DEG C of liquidus temperature.
7. a kind of alkali aluminium borosilicate glass chemical enhanced made of glass component, including：
About 60.0 to about 70.0mol% SiO2；
About 6.0 to about 10.0mol% Al2O3；
About 5.0 to about 10.0mol% Na2O；
About 15.0 to about 25.0mol% B2O3；
About 0 to about 5.0mol% K2O；And
About 0 to about 3.0mol% MgO；
Wherein described glass has the dielectric constant of about 5.0 to about 6.5；And
Wherein described glass component has surface compression stressor layers and central tension area through ion exchange.
8. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the dielectric constant of the glass
It is about 5.3 to about 6.0.
9. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the dielectric constant of the glass
Below about 6.0.
10. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the surface compression stressor layers have
At least about 100MPa compression stress.
11. chemical enhanced alkali aluminium borosilicate glass according to claim 10, wherein the surface compression stressor layers have
There is at least about 150MPa compression stress.
12. chemical enhanced alkali aluminium borosilicate glass according to claim 11, wherein the surface compression stressor layers have
There is at least about 200MPa compression stress.
13. chemical enhanced alkali aluminium borosilicate glass according to claim 12, wherein the surface compression stressor layers have
There is at least about 250MPa compression stress.
14. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the surface compression stressor layers have
About 100MPa to about 250MPa compression stress.
15. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the surface compression stressor layers have
About 140MPa to about 260MPa compression stress.
16. chemical enhanced alkali aluminium borosilicate glass according to claim 15, wherein the surface compression stressor layers have
There is about 150MPa to about 250MPa compression stress.
17. chemical enhanced alkali aluminium borosilicate glass according to claim 15, wherein the surface compression stressor layers have
There is about 160MPa to about 240MPa compression stress.
18. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the depth of the surface compression stressor layers
Spend at least about 16.0 μm.
19. chemical enhanced alkali aluminium borosilicate glass according to claim 18, wherein the surface compression stressor layers
Depth is at least about 17.0 μm.
20. chemical enhanced alkali aluminium borosilicate glass according to claim 19, wherein the surface compression stressor layers
Depth is at least about 20.0 μm.
21. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the depth of the surface compression stressor layers
Degree is about 15.0 μm to about 35.0 μm.
22. chemical enhanced alkali aluminium borosilicate glass according to claim 21, wherein the surface compression stressor layers
Depth is about 17.0 μm to about 28.0 μm.
23. chemical enhanced alkali aluminium borosilicate glass according to claim 21, wherein the surface compression stressor layers
Depth is about 20.0 μm to about 30.0 μm.
24. chemical enhanced alkali aluminium borosilicate glass according to claim 7, it is below about wherein the glass has
2.3g/cm3Density.
25. chemical enhanced alkali aluminium borosilicate glass according to claim 7, wherein the glass has about 53.0 to about
70.0 linear expansion coefficient (α25-300 10-7/℃)。
26. a kind of method for manufacturing chemical enhanced alkali aluminium borosilicate glass, including：
Mixing and fusing component of glass raw material, to form homogeneous glass melt, it includes：
About 60.0 to about 70.0mol% SiO2；
About 6.0 to about 10.0mol% Al2O3；
About 5.0 to about 10.0mol% Na2O；
About 15.0 to about 25.0mol% B2O3；
About 0 to about 5.0mol% K2O；And
About 0 to about 3.0mol% MgO；
The glass is shaped using selected from overflow downdraw, floating method method in combination；
Anneal the glass；And
By the ion exchange 2 to 24 hours at a temperature of about 390 DEG C to about 450 DEG C and the chemical enhanced glass.
27. according to the method for claim 26, wherein the component of glass raw material is melted at a temperature of about 450 DEG C
It is more about 8 hours.
28. according to the method for claim 27, wherein the component of glass raw material is melted at a temperature of about 450 DEG C
It is more about 16 hours.
29. according to the method for claim 28, wherein the component of glass raw material is melted at a temperature of about 450 DEG C
It is more about 24 hours.
30. according to the method for claim 26, wherein the glass is annealed with about 0.5 DEG C/h of speed.
31. according to the method for claim 26, wherein the glass is chemical by being exchanged in molten salt bath intermediate ion
Strengthen.
32. according to the method for claim 31, wherein the fuse salt is KNO3。
33. according to the method for claim 26, wherein the glass is by the progress ion friendship at a temperature of about 450 DEG C
Change and chemical enhanced.
34. according to the method for claim 26, wherein the glass be by carried out at a temperature of at least about 450 DEG C from
Son exchange and it is chemical enhanced.
35. according to the method for claim 26, wherein the glass carries out ion by a temperature of at most about 450 DEG C
Exchange and it is chemical enhanced.
36. according to the method for claim 26, wherein the glass is chemical enhanced of about 4 hours by ion exchange.
37. according to the method for claim 26, wherein the glass is chemical enhanced of about 8 hours by ion exchange.
38. according to the method for claim 26, wherein the glass is chemical enhanced of about 16 hours by ion exchange.
39. according to the method for claim 26, wherein the glass is chemical enhanced of about 24 hours by ion exchange.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/075528 WO2016154901A1 (en) | 2015-03-31 | 2015-03-31 | Glass composition for chemically strengthened alkali-aluminoborosilicate glass with low dielectric constant |
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| CN107531550A true CN107531550A (en) | 2018-01-02 |
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| CN201580077196.7A Pending CN107531550A (en) | 2015-03-31 | 2015-03-31 | The glass component of chemical enhanced alkali aluminium pyrex with low-k |
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| Country | Link |
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| CN (1) | CN107531550A (en) |
| TW (1) | TWI677481B (en) |
| WO (1) | WO2016154901A1 (en) |
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| CN108383378A (en) * | 2018-06-04 | 2018-08-10 | 中建材蚌埠玻璃工业设计研究院有限公司 | A kind of glass with low dielectric constant |
| CN110240419A (en) * | 2019-06-06 | 2019-09-17 | 深圳市东丽华科技有限公司 | Lithium aluminosilicate glass, lithium aluminium chemistry of silicones strengthened glass and the preparation method and application thereof |
| CN111847872A (en) * | 2019-04-30 | 2020-10-30 | 重庆鑫景特种玻璃有限公司 | Low-dielectric-constant glass capable of being used for chemical strengthening and strengthened glass |
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| CN110691761B (en) * | 2017-04-04 | 2022-03-29 | 康宁股份有限公司 | Multilayer structure and method for manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016154901A1 (en) | 2016-10-06 |
| TWI677481B (en) | 2019-11-21 |
| TW201702200A (en) | 2017-01-16 |
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