CN107525053B - Closed heat dissipation piece - Google Patents
Closed heat dissipation piece Download PDFInfo
- Publication number
- CN107525053B CN107525053B CN201710906896.3A CN201710906896A CN107525053B CN 107525053 B CN107525053 B CN 107525053B CN 201710906896 A CN201710906896 A CN 201710906896A CN 107525053 B CN107525053 B CN 107525053B
- Authority
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- China
- Prior art keywords
- outer side
- heat dissipation
- heat
- led lamp
- hole
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Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 25
- 238000009423 ventilation Methods 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 3
- 241000258971 Brachiopoda Species 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a closed heat dissipation part, which comprises: the heat dissipation device comprises an upper surface for absorbing heat and supporting an external part, an outer side surface for radiating heat outwards and an inner side surface arranged in the center of a heat dissipation part, wherein the inner side surface and the upper surface are combined to form an air channel for air circulation, the edge of the upper surface is connected with the outer side surface, a through hole is formed in the center of the upper surface, the through hole is inwards sunken and connected with the inner side surface, the outer side surface and the inner side surface are both surrounded to form a ring-shaped structure with a closed side wall, the other side relative to the upper surface is an outer side surface and an inner side surface to form an open lower surface, and the whole hollow three-dimensional ring with an open bottom is formed; the LED lamp heat dissipation device is applied to the inside of an LED lamp as a radiator, and a cold and hot air convection channel is constructed, so that the heat dissipation can be effectively realized, the internal heat accumulation can be reduced, and the service life of the LED lamp can be prolonged.
Description
Technical Field
The invention relates to the technical field of LED lamp heat dissipation, in particular to a closed heat dissipation piece.
Background
At present, most of the radiators of the LED lamps are designed in a fin mode, but the fin type radiators are difficult to install in the small LED lamps due to structural reasons, the small LED lamps are exposed through a metal shell or are directly canceled from radiating design, and most of the lamps are only installed with the fin type radiators without considering radiating convection, and the lamp structure cannot form effective convection with the outside, so that radiating effect is poor, the LED lamp beads in the small LED lamps are in a high-temperature state for a long time, and service life is shortened.
Disclosure of Invention
In order to solve the above problems, the present invention is directed to a sealed heat dissipating member, which can construct a heat dissipating channel and a uniform heat dissipating surface inside a lamp to effectively dissipate heat.
The invention solves the problems by adopting the following technical scheme:
A closed heat sink comprising:
The LED lamp panel comprises an upper surface for absorbing heat and supporting an LED lamp panel, an outer side surface for radiating heat outwards and an inner side surface arranged in the center of a radiating piece, wherein the inner side surface and the upper surface are combined to form an air channel for ventilation;
The novel solar cell module is characterized by further comprising an open lower surface, wherein the edge of the upper surface is connected with the outer side surface, a through hole is formed in the center of the upper surface, the through hole is recessed inwards and connected with the inner side surface, the outer side surface and the inner side surface are both encircling to form a ring-shaped structure with a closed side wall, and the other side of the upper surface is the outer side surface and the inner side surface to form the open lower surface.
Further, a plurality of supporting points for supporting the LED lamp panel are arranged on the upper surface, the supporting points are distributed on the surface formed by the upper surface, the outer side surface and the inner side surface, and the surface not only has a supporting function, but also is used for being in contact with the heating body to transfer heat to the two side surfaces.
Further, the junction of upper surface and lateral surface is the smooth connection that is the arc, the junction of upper surface and medial surface is the smooth connection that is the arc.
Further, the upper surface and the lower surface are circular, and the outer side surface and the inner side surface are three-dimensional circular.
The beneficial effects of the invention are as follows: the LED lamp panel where the LED luminous unit is located is in direct contact with the radiating piece, heat is transferred to the outer side face and the inner side face through the upper surface, convection is formed by utilizing temperature difference, hot air exchanges with external cold air through an air convection channel formed by the inner side face, heat is effectively taken away, heat accumulation in the LED lamp is prevented, and the service life of the LED lamp is prolonged.
Drawings
The invention is further described below with reference to the drawings and examples.
FIG. 1 is a top view of a heat sink according to the present invention;
FIG. 2 is a front view of a heat sink according to the present invention;
FIG. 3 is a schematic representation of an embodiment of the present invention;
Detailed Description
Referring to fig. 1 and 2, a sealed heat sink includes:
An upper surface 33 for absorbing heat and supporting the LED lamp panel,
An outer side 35 for radiating heat to the outside,
An inner side 32 arranged in the center of the heat sink 3 and combined with the upper surface 33 to form an air channel for ventilation,
The upper surface 33 and the inner side surface 32 are connected in an arc-shaped smooth manner, the through hole 31 is arranged in the center of the upper surface 33 and is recessed inwards and connected with the inner side surface 32, the outer side surface 35 and the inner side surface 32 are both surrounded to form a side wall-closed annular structure, the other side of the upper surface 33 is an outer side surface 35 and the inner side surface 32 form the open type lower surface 34, the upper surface 33 and the lower surface 34 are both annular, the outer side surface 35 and the inner side surface 32 are both three-dimensional annular, and the whole body is a hollow three-dimensional annular with an open bottom.
The upper surface 33 is provided with four supporting points 36 for supporting external components, the supporting points 36 are distributed on the surface formed by the upper surface 33, the outer side surface 35 and the inner side surface 32, and the supporting points are slightly recessed downwards and used for supporting a circuit board which is arranged above the upper surface 33 and is used for bearing LED lamp beads.
Referring to fig. 3, an LED lamp using the above-mentioned sealed heat sink includes: the LED lamp comprises a light-transmitting lamp shade 1 with a first through hole 11 at the center, an LED light-emitting module with a fourth through hole 21 at the center, a heat dissipation piece 3 with a second through hole 31 at the center, a lamp housing 4 with a third through hole 41 and a lamp base 5, and further comprises a heat dissipation fan 6, wherein the LED light-emitting module, the heat dissipation piece 3 and the heat dissipation fan 6 are sequentially connected and installed inside the lamp housing 4, the light-transmitting lamp shade 1, the lamp housing 4 and the lamp base 5 are sequentially connected to form a lamp, and the first through hole 11, the fourth through hole 21, the second through hole 31 and the third through hole 41 are sequentially communicated to form a vertical airflow channel.
The LED light emitting module comprises an LED circuit substrate 2 and a power supply drive 7, wherein the LED circuit substrate 2 is arranged on the upper side of the heat dissipation piece 3, the front face of the LED circuit substrate faces the light-transmitting lampshade 1, a fourth through hole 21 is arranged in the center of the LED circuit substrate 2, the aperture of the fourth through hole 21 is the same as that of the second through hole 31, and the power supply drive 7 is arranged on the lower side of the heat dissipation fan 6.
The bottom of the lamp housing 4 gradually contracts towards the central shaft and is funnel-shaped, and the tail end of the bottom is provided with a thread installation position 42 which is matched with the internal thread of the lamp base 5.
Meanwhile, the power supply drive 7 carries out automatic output power adjustment according to the temperature inside the LED lamp. When the temperature reaches the preset upper limit, the power supply drive 7 automatically controls output, and the output power is intelligently reduced, so that the temperature of the internal working element is reduced, and the service life of the lamp is prolonged.
The LED circuit board 2 is a main heating component of the LED lamp, directly contacts with the upper surface 33 of the heat sink 3 to transfer heat, and meanwhile, the heat dissipation fan 6 is utilized to forcedly accelerate the convection of internal hot air, and the heat dissipation fan 6 can select air draft or air supply according to the installation scene of the LED lamp.
The following sets the radiator fan 6 to be used for describing the radiating working mode of the LED lamp by downwards exhausting the light-transmitting lampshade 1: the first through hole 11 of the light-transmitting shell 1, the fourth through hole 21 of the LED circuit substrate 2, the second through hole 31 of the heat dissipation piece 3 and the third through hole 41 of the lamp shell 4 form an air convection channel which vertically penetrates through the LED lamp, and the heat dissipation fan 6 is arranged on the lower side of the heat dissipation piece 3 to accelerate air flow; the heat generation amount is mainly concentrated on the LED circuit substrate 2, the heat is absorbed by the heat dissipation part 3 which is in direct contact with the LED circuit substrate 2, cold air is sucked from the first through hole 11 of the light-transmitting lampshade 1 in the convection channel, the heat distributed in the heat dissipation part 3 is taken away through the fourth through hole 21 of the LED circuit substrate 2 and the second through hole 31 of the heat dissipation part 3, and finally the heat is discharged in the third through hole 41 of the lamp shell 4, and the forced air convection of the fan is added, so that the heat dissipation of the LED lamp with the heat dissipation structure is effectively completed, the heat accumulation in the lamp is reduced, and the service life of LED lamp beads is prolonged.
The present invention is not limited to the above embodiments, but is merely preferred embodiments of the present invention, and the present invention should be construed as being limited to the above embodiments as long as the technical effects of the present invention are achieved by the same means.
Claims (3)
1. A sealed heat sink, comprising: the LED lamp panel comprises an upper surface (33) for absorbing heat and supporting the LED lamp panel, an outer side surface (35) for radiating heat outwards and an inner side surface (32) arranged in the center of the radiating piece, wherein the inner side surface (32) and the upper surface (33) are combined to form an air channel for ventilation;
The novel solar cell module is characterized by further comprising an open lower surface (34), wherein the edge of the upper surface (33) is connected with the outer side surface (35), a through hole (31) is formed in the center of the upper surface (33), the through hole (31) is inwards recessed and connected with the inner side surface (32), the outer side surface (35) and the inner side surface (32) are both surrounded to form a ring-shaped structure with a closed side wall, and the other side of the upper surface (33) is provided with the open lower surface (34) formed by the outer side surface (35) and the inner side surface (32); the upper surface (33) is provided with a plurality of supporting points (36) for supporting the external part, and the supporting points (36) are distributed on the surface formed by the upper surface (33), the outer side surface (35) and the inner side surface (32); the connecting part of the upper surface (33) and the outer side surface (35) is in arc-shaped smooth connection, and the connecting part of the upper surface (33) and the inner side surface (32) is in arc-shaped smooth connection.
2. A closed heat sink according to claim 1, wherein: the upper surface (33) and the lower surface (34) are annular, and the outer side surface (35) and the inner side surface (32) are three-dimensional annular.
3. A closed heat sink according to claim 1 or 2, wherein: the inner side (32) has a constant pore size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710906896.3A CN107525053B (en) | 2017-09-29 | 2017-09-29 | Closed heat dissipation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710906896.3A CN107525053B (en) | 2017-09-29 | 2017-09-29 | Closed heat dissipation piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107525053A CN107525053A (en) | 2017-12-29 |
| CN107525053B true CN107525053B (en) | 2024-06-11 |
Family
ID=60683879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710906896.3A Active CN107525053B (en) | 2017-09-29 | 2017-09-29 | Closed heat dissipation piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107525053B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3169380U (en) * | 2011-05-17 | 2011-07-28 | 奇▲こう▼科技股▲ふん▼有限公司 | Heat sink structure for LED lamp |
| CN102691908A (en) * | 2011-09-30 | 2012-09-26 | 杨东佐 | LED (light emitting diode) lamp |
| KR101286698B1 (en) * | 2013-04-26 | 2013-07-23 | 이온나이스 유한회사 | Led lamp improved radiant heat |
| CN203309855U (en) * | 2013-07-03 | 2013-11-27 | 岑彪 | Novel active convection luminaire for industrial use |
| KR101391584B1 (en) * | 2013-03-19 | 2014-05-27 | 주식회사 남영전구 | Led flood lighting |
| CN104633464A (en) * | 2013-11-13 | 2015-05-20 | 海洋王（东莞）照明科技有限公司 | Portable LED lamp |
| CN204829525U (en) * | 2015-07-31 | 2015-12-02 | 东莞市闻誉实业有限公司 | LED lamps and lanterns |
| CN105674105A (en) * | 2016-03-10 | 2016-06-15 | 成都科创城科技有限公司 | Efficient lighting lamp for smart home |
| CN206207073U (en) * | 2016-09-30 | 2017-05-31 | 江门市卡迪光电科技有限公司 | A kind of birdcage LED light source lamp |
| CN207455547U (en) * | 2017-09-29 | 2018-06-05 | 江门市创亚照明电器有限公司 | A kind of closed radiating piece |
-
2017
- 2017-09-29 CN CN201710906896.3A patent/CN107525053B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3169380U (en) * | 2011-05-17 | 2011-07-28 | 奇▲こう▼科技股▲ふん▼有限公司 | Heat sink structure for LED lamp |
| CN102691908A (en) * | 2011-09-30 | 2012-09-26 | 杨东佐 | LED (light emitting diode) lamp |
| KR101391584B1 (en) * | 2013-03-19 | 2014-05-27 | 주식회사 남영전구 | Led flood lighting |
| KR101286698B1 (en) * | 2013-04-26 | 2013-07-23 | 이온나이스 유한회사 | Led lamp improved radiant heat |
| CN203309855U (en) * | 2013-07-03 | 2013-11-27 | 岑彪 | Novel active convection luminaire for industrial use |
| CN104633464A (en) * | 2013-11-13 | 2015-05-20 | 海洋王（东莞）照明科技有限公司 | Portable LED lamp |
| CN204829525U (en) * | 2015-07-31 | 2015-12-02 | 东莞市闻誉实业有限公司 | LED lamps and lanterns |
| CN105674105A (en) * | 2016-03-10 | 2016-06-15 | 成都科创城科技有限公司 | Efficient lighting lamp for smart home |
| CN206207073U (en) * | 2016-09-30 | 2017-05-31 | 江门市卡迪光电科技有限公司 | A kind of birdcage LED light source lamp |
| CN207455547U (en) * | 2017-09-29 | 2018-06-05 | 江门市创亚照明电器有限公司 | A kind of closed radiating piece |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107525053A (en) | 2017-12-29 |
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