CN107520023B - A kind of flexible base board scraps processing system and method - Google Patents
A kind of flexible base board scraps processing system and method Download PDFInfo
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- CN107520023B CN107520023B CN201710708564.4A CN201710708564A CN107520023B CN 107520023 B CN107520023 B CN 107520023B CN 201710708564 A CN201710708564 A CN 201710708564A CN 107520023 B CN107520023 B CN 107520023B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 86
- 239000002699 waste material Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 163
- 239000007789 gas Substances 0.000 claims description 53
- 238000002791 soaking Methods 0.000 claims description 20
- 230000004888 barrier function Effects 0.000 claims description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 239000001307 helium Substances 0.000 claims description 6
- 229910052734 helium Inorganic materials 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000013467 fragmentation Methods 0.000 abstract 2
- 238000006062 fragmentation reaction Methods 0.000 abstract 2
- 238000011946 reduction process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
- B02C19/186—Use of cold or heat for disintegrating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C2201/00—Codes relating to disintegrating devices adapted for specific materials
- B02C2201/06—Codes relating to disintegrating devices adapted for specific materials for garbage, waste or sewage
Landscapes
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Processing Of Solid Wastes (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Processing system and method are scrapped the present invention relates to a kind of flexible base board, to solve the problems, such as that the design of conventional breakers was not suitable for flexible base board scraps processing.The system includes: cooling system, for carrying out cooling processing to flexible base board, makes the temperature of flexible base board lower than the first preset temperature；Write-off equipment, for carrying out Mechanical Crushing processing to cooling treated flexible base board；Wherein, the first preset temperature is the minimum brittle temperature of flexible base material in flexible base board.Since flexible base material is brittle in flexible base board after cooling, the whole brittleness of flexible base board increases, it is handled again using Mechanical Crushing processing mode, it is then easy to make flexible base board fragmentation, flexible base board waste material after fragmentation does not bond, and can be detached from from equipment naturally, without the processing of other auxiliary equipment, it is scratched when can shorten the time for scrapping processing each time, and flexible base board can be sent to enter write-off equipment again to avoid subsequent movement equipment by remaining waste material.
Description
Technical Field
The invention relates to the technical field of display substrate scrapping treatment, in particular to a flexible substrate scrapping treatment system and method.
Background
At present, flexible display is the new technology of display industry, but there is not corresponding processing method to the flexible base plate that has scrapped, to the flexible production line of AMOLED, the flexible processing problem of flexible base plate is hardly solved to traditional breaker firm, the design of general traditional breaker still remains the processing mode to the rigid base plate, adopt mechanical crushing mode to carry out shredding to the flexible base plate promptly, however, this mechanical crushing mode is not suitable for to the flexible base plate that coats and has the polyimide film, simple mechanical processing takes place broken back, the flexible base plate that bonds very easily the card knot on equipment, can not break away from equipment completely automatically, need artifical manual handling, it is longer to consume time, and it is difficult to be complete broken with it. Therefore, it is necessary to provide a scrap handling process for flexible substrates.
Disclosure of Invention
The invention aims to provide a flexible substrate scrapping treatment system and a flexible substrate scrapping treatment method, which are used for solving the problem that the design of the traditional crusher is not suitable for scrapping treatment of flexible substrates at present.
The embodiment of the invention provides a flexible substrate scrapping treatment system, which comprises: cooling equipment and scrapping equipment;
the cooling equipment is used for cooling the flexible substrate to enable the temperature of the flexible substrate to be lower than a first preset temperature;
the scrapping equipment is used for mechanically crushing the flexible substrate subjected to the temperature reduction treatment;
the first preset temperature is the lowest embrittlement temperature of a flexible base material in the flexible substrate.
Preferably, the system further comprises: at least one mobile device;
the moving equipment is used for moving the flexible substrate subjected to cooling treatment to the scrapping equipment.
Preferably, the cooling device includes: a cooling chamber and an air supply source;
the cooling chamber is used for accommodating a flexible substrate to be subjected to cooling treatment;
and the gas supply source is used for providing gas for temperature reduction treatment for the temperature reduction chamber.
Preferably, the cool-down chamber includes: a first chamber and a second chamber; wherein,
the first chamber is used for carrying out pre-cooling treatment on the flexible substrate to enable the temperature of the flexible substrate to be gradually reduced to a second preset temperature;
the second chamber is used for continuously cooling the flexible substrate after the pre-cooling treatment, so that the temperature of the flexible substrate is not higher than the first preset temperature within a preset time;
wherein the second preset temperature is higher than the first preset temperature.
Preferably, the second chamber further comprises: a sealable steeping chamber, and a liquefied gas disposed in the steeping chamber;
the soaking chamber is used for soaking the flexible substrate subjected to the pre-cooling treatment and continuously cooling the flexible substrate;
the air supply source further includes: a gas liquefaction plant;
the gas liquefaction equipment is used for carrying out liquefaction treatment on the gas output from the gas supply source and conveying the liquefied gas obtained after the liquefaction treatment to the soaking chamber.
Preferably, the system further comprises: a first barrier door, a second barrier door and a third barrier door; wherein,
the first baffle door is used as a passage for the flexible substrate to enter the first chamber when being opened and enables the first chamber to be in a sealed state when being closed;
the second baffle door is used as a passage for moving the flexible substrate from the first chamber to the second chamber when being opened, and enables the first chamber and the second chamber to be in a sealing state when being closed;
the third baffle door is used as a channel for moving the flexible substrate from the second chamber to the scrapping equipment when the third baffle door is opened, and the second chamber is in a sealed state when the third baffle door is closed.
Preferably, the system further comprises: the waste material tank is arranged below the scrapping equipment;
and the waste tank is used for containing the flexible substrate waste falling after the mechanical crushing treatment.
The embodiment of the invention also provides a flexible substrate scrapping treatment method, which comprises the following steps:
cooling the flexible substrate to enable the temperature of the flexible substrate to be lower than a first preset temperature;
carrying out mechanical crushing treatment on the flexible substrate subjected to cooling treatment;
the first preset temperature is the lowest embrittlement temperature of a flexible base material in the flexible substrate.
Preferably, the cooling process for the flexible substrate includes:
carrying out pre-cooling treatment on the flexible substrate to gradually reduce the temperature of the flexible substrate to a second preset temperature;
continuing cooling the flexible substrate subjected to the pre-cooling treatment to enable the temperature of the flexible substrate to be lower than the first preset temperature within a preset time;
wherein the second preset temperature is higher than the first preset temperature.
Preferably, the gas for performing the temperature reduction treatment includes one or a combination of the following:
hydrogen, helium and nitrogen.
The invention has the following beneficial effects:
according to the flexible substrate scrapping treatment system and method provided by the embodiment of the invention, the flexible substrate can be subjected to cooling treatment through the cooling equipment, so that the temperature of the flexible substrate is lower than the lowest brittle temperature of the flexible base material, and after the cooling treatment, the flexible substrate is subjected to mechanical crushing treatment. Because the flexible base material has become brittle in the flexible substrate after cooling, the whole brittleness of the flexible substrate is increased, and the flexible substrate is processed by adopting a mechanical crushing treatment mode, so that the flexible substrate is easily crushed, the waste material of the crushed flexible substrate is not bonded and can be naturally separated from the equipment without adopting other auxiliary facilities for treatment, the time of each scrapping treatment can be shortened, and the phenomenon that the follow-up mobile equipment is scratched by the residual waste material when the flexible substrate is sent to the scrapping equipment again can be avoided.
Drawings
Fig. 1 is a schematic diagram of a basic structure of a flexible substrate discarding processing system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a abatement system including two chambers according to an embodiment of the present invention;
fig. 3 is a schematic view of an overall structure of a flexible substrate discarding processing system according to an embodiment of the present invention;
fig. 4 is a flowchart of a flexible substrate scrapping processing method according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for performing a cooling process on a flexible substrate according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The sizes and shapes of the structures in the drawings do not reflect the actual proportions, and are merely intended to schematically illustrate the present invention.
As shown in fig. 1, a schematic diagram of a basic structure of a flexible substrate discarding processing system according to an embodiment of the present invention is provided, where the system includes: a cooling device 1 and a scrapping device 2;
the cooling device 1 is used for cooling the flexible substrate 3 to enable the temperature of the flexible substrate to be lower than a first preset temperature;
the scrapping equipment 2 is used for mechanically crushing the flexible substrate 3 subjected to the temperature reduction treatment;
the first preset temperature is the lowest embrittlement temperature of the flexible base material in the flexible substrate.
In specific implementation, because a material (e.g., a polyimide material) of a flexible substrate in the flexible substrate has strong flexibility and is not easily broken, the scrapping processing system provided in the embodiment of the present invention first performs a temperature reduction process on the flexible substrate 3 through the temperature reduction device 1, so that the temperature of the flexible substrate 3 is lower than a first preset temperature, and the first preset temperature is a minimum embrittlement temperature of the flexible substrate material on the flexible substrate 3, so that after the temperature reduction process, the flexible substrate material is embrittled, and the overall brittleness of the flexible substrate is increased.
After the flexible substrate is cooled, the flexible substrate after being cooled is treated by adopting a mechanical crushing treatment mode, the flexible substrate is easily crushed, the waste materials of the crushed flexible substrate are not bonded and can be naturally separated from the equipment without adopting other auxiliary facilities for treatment, the time for each scrapping treatment can be shortened, and the phenomenon that the follow-up mobile equipment is scratched by residual waste materials when the flexible substrate is sent to the scrapping equipment again can be avoided.
Specifically, the first preset temperature is generally lower than-200 ℃, and when the flexible substrate is made of polyimide materials, the polyimide materials are organic polymer materials, so that the performance is stable, and the temperature range which can be generally borne is-200 ℃ to 300 ℃.
In addition, in order to better manage and control residues such as glass fragments and the like generated after mechanical crushing treatment, the scrapping equipment can be arranged in a chamber which can be sealed. Preferably, the scrapping equipment is arranged in a chamber capable of being sealed.
When the vacuum heat insulation device is specifically implemented, cooling equipment can be arranged as required, and the flexible substrate can be placed in the vacuum heat insulation chamber for improving the utilization rate of energy.
Preferably, the cooling device 1 comprises: a cooling chamber 11 and an air supply source 12;
the cooling chamber 11 is used for accommodating the flexible substrate 3 to be subjected to cooling treatment;
and a gas supply source 12 for supplying gas for performing a temperature reduction process to the temperature reduction chamber 11.
Specifically, the flexible substrate 3 to be scrapped may be placed in the cooling chamber, and in practical application, an objective table may be disposed in the cooling chamber for placing the flexible substrate, or a clamping device may be disposed to clamp the flexible substrate 3, or the flexible substrate may be directly placed in the cooling chamber, which is not limited herein. And then, conveying low-temperature gas into the cooling chamber through the gas supply source to perform cooling treatment on the flexible substrate.
In order to prevent the flexible substrate from bursting due to temperature shock during the temperature reduction process, the temperature reduction process may be performed in two steps, which will be described in detail below.
Fig. 2 is a schematic structural diagram of a abatement processing system including two temperature reduction chambers according to an embodiment of the present invention;
preferably, the cool-down chamber 11 includes: a first chamber 111 and a second chamber 112; wherein,
the first chamber 111 is configured to perform a pre-cooling process on the flexible substrate 3, so that the temperature of the flexible substrate 3 is gradually reduced to a second preset temperature;
the second chamber 112 is configured to continue cooling the flexible substrate 3 after the pre-cooling treatment, so that the temperature of the flexible substrate 3 is not higher than the first preset temperature within a preset time period;
wherein the second preset temperature is higher than the first preset temperature.
Specifically, the cooling chamber 11 may be divided into a first chamber 111 for performing pre-cooling and a second chamber 112 for continuously cooling, wherein the flexible substrate is pre-cooled first, so that the temperature of the flexible substrate can be gradually reduced, and the flexible substrate does not burst due to temperature quenching, when the temperature of the flexible substrate is reduced to a second preset temperature, the second preset temperature is generally higher than the first preset temperature, and at this time, the flexible substrate is moved into the second chamber for continuously cooling, so that the temperature of the flexible substrate in a preset time period is kept below the lowest brittle temperature of the flexible substrate, and thus the flexible substrate on the flexible substrate can be completely embrittled.
In addition, the cooling equipment is divided into the first cavity and the second cavity, the utilization rate of the scrapped processing system can also be improved, after the first flexible substrate is subjected to pre-cooling processing, the first flexible substrate can be moved into the second cavity to continue cooling processing, and at the moment, the first cavity can be reused for carrying out pre-cooling processing on the second flexible substrate, so that the utilization rate of the scrapped processing system is improved.
In specific implementation, in order to enable the flexible substrate subjected to the pre-cooling treatment to be capable of being rapidly cooled integrally, a soaking chamber can be arranged in the second chamber.
Preferably, the second chamber 112 further comprises: a sealable steeping chamber 112a, and a liquefied gas 112b disposed in the steeping chamber; and the soaking chamber 112a is used for soaking the flexible substrate subjected to the pre-cooling treatment and continuing cooling treatment on the flexible substrate.
Specifically, the soaking chamber is provided with cryogenic liquefied gas, so that the flexible substrate subjected to the pre-cooling treatment in the first chamber 111 can be moved into the soaking chamber 112a of the second chamber, the liquefied gas 112b in the soaking chamber is used for soaking the flexible substrate subjected to the pre-cooling treatment, and the cooling treatment is continued, so that the temperature of the flexible substrate is not higher than the first preset temperature within a preset time period. The periphery of the soaking cavity is subjected to heat insulation treatment by a vacuum second cavity so as to ensure temperature control and improve the utilization rate of energy.
When the gas supply device is specifically implemented, the gas supply source can provide low-temperature gas for the cooling chamber, the low-temperature gas can be directly used in the first chamber during cooling, the liquefied gas is required in the soaking chamber of the second chamber, at the moment, a gas liquefying device can be additionally arranged on the gas supply source according to needs, the gas liquefying device can be arranged according to actually provided gas, and specific limitation is not made here.
Preferably, the gas supply source 12 further comprises: a gas liquefaction plant 12 a; the gas liquefying device 12a is configured to liquefy the gas supplied from the gas supply source 12 and supply the liquefied gas obtained by the liquefaction to the soaking chamber 112 a.
And the gas for temperature reduction treatment provided by the specific gas supply source comprises one or a combination of hydrogen, helium and nitrogen. The temperature of the liquefied hydrogen and helium can reach-253 ℃, which is far lower than the lowest embrittlement temperature of the flexible base material in the flexible substrate, but the risk is high; the temperature of the liquefied helium can reach minus 268 ℃, which is far lower than the lowest embrittlement temperature of the flexible base material in the flexible substrate, so that the risk is low; the temperature of the liquefied nitrogen can reach-196 ℃, and is close to the lowest embrittlement temperature of the flexible base material in the flexible substrate, so that the risk is low.
In particular, in order to form a sealed heat preservation chamber in each chamber, a baffle door capable of allowing the flexible substrate to pass through can be correspondingly arranged in each chamber.
Preferably, the system further comprises: a first barrier door 4a, a second barrier door 4b and a third barrier door 4 c; wherein,
a first barrier door 4a for serving as a passage for the flexible substrate 3 to enter the first chamber 111 when opened and for sealing the first chamber 111 when closed;
a second barrier door 4b for serving as a passage for moving the flexible substrate 3 from the first chamber 111 into the second chamber 112 when opened, and for sealing the first chamber 111 and the second chamber 1112 when closed;
and a third barrier door 4c for serving as a passage for moving the flexible substrate 3 from the second chamber 112 to the discarding apparatus 2 when opened and for sealing the second chamber when closed.
In specific implementation, each chamber (the first chamber 111 and the second chamber 1112) may be isolated by a barrier door, and the flexible substrate is strictly controlled to enter and exit, so that each chamber can be closed by the barrier door when in use, thereby forming a heat-insulating chamber to control the temperature of the cooling process.
In specific implementation, the flexible substrate needs to be moved correspondingly in the processing process, as shown in fig. 3, which is a schematic view of the overall structure of the flexible substrate discarding processing system provided by the embodiment of the present invention; preferably, the system further comprises: at least one mobile device 5; and the moving device 5 is used for moving the flexible substrate 3 subjected to the temperature reduction treatment to the scrapping device 2.
Specifically, the moving device may be a simple movable device capable of carrying the flexible substrate as shown in fig. 3, or may be an existing robot arm, as long as the flexible substrate can be moved between each chamber and the scrapping device, one moving device may be provided as required, or one moving device may be provided in each chamber or device, which is not limited herein.
After the flexible substrate is mechanically broken, it is necessary to carry waste materials, and preferably, the system further includes: a waste material tank 6 arranged below the scrapping equipment; and the waste tank 6 is used for containing flexible substrate waste falling after mechanical crushing treatment.
Specifically, as shown in fig. 3, the waste tank may be disposed below the scrapped device, so that the dropped waste after mechanical crushing treatment may directly drop into the waste tank, and in order to manage and control the waste residue, a fourth blocking door 4d may be disposed above the waste tank, and when the scrapped device is used to mechanically crush the flexible substrate, the fourth blocking door 4d may be opened, so that the waste may directly drop into the waste tank; and when the scrapped equipment is not used, the fourth baffle door 4d can be closed, so that the waste material tank is sealed.
Based on the same inventive concept, the embodiment of the invention also provides a flexible substrate scrapping treatment method, which comprises the flexible substrate scrapping treatment system provided by the embodiment of the invention. The implementation of the discard processing method can be referred to any discard processing system embodiment, and repeated details are not repeated.
Fig. 4 is a flowchart of a flexible substrate discarding method according to an embodiment of the present invention. The method comprises the following steps:
step 401, cooling the flexible substrate to make the temperature of the flexible substrate lower than a first preset temperature;
step 401, performing mechanical crushing treatment on the flexible substrate after the temperature reduction treatment;
the first preset temperature is the lowest embrittlement temperature of the flexible base material in the flexible substrate.
Fig. 5 is a flowchart of a method for performing a cooling process on a flexible substrate according to an embodiment of the present invention. The method comprises the following steps:
step 4011, performing a pre-cooling treatment on the flexible substrate to gradually reduce the temperature of the flexible substrate to a second preset temperature;
step 4012, continuing cooling the flexible substrate after the pre-cooling treatment, so that the temperature of the flexible substrate is lower than a first preset temperature within a preset time;
wherein the second preset temperature is higher than the first preset temperature.
Preferably, the gas for performing the temperature reduction treatment includes one or a combination of the following:
hydrogen, helium and nitrogen.
In summary, the flexible substrate scrapping processing system and method provided in the embodiments of the present invention may first adopt a temperature reduction device for performing temperature reduction processing on the flexible substrate to make the temperature of the flexible substrate lower than the lowest brittle temperature of the flexible base material, and perform mechanical breaking processing on the flexible substrate after temperature reduction. Because the flexible base material has become brittle in the flexible substrate after cooling, the whole brittleness of the flexible substrate is increased, and the flexible substrate is processed by adopting a mechanical crushing treatment mode, so that the flexible substrate is easily crushed, the waste material of the crushed flexible substrate is not bonded and can be naturally separated from the equipment without adopting other auxiliary facilities for treatment, the time of each scrapping treatment can be shortened, and the phenomenon that the follow-up mobile equipment is scratched by the residual waste material when the flexible substrate is sent to the scrapping equipment again can be avoided.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. A flexible substrate scrap handling system, comprising: cooling equipment and scrapping equipment;
the cooling equipment is used for cooling the flexible substrate to enable the temperature of the flexible substrate to be lower than a first preset temperature;
the scrapping equipment is used for mechanically crushing the flexible substrate subjected to the temperature reduction treatment;
the first preset temperature is the lowest embrittlement temperature of a flexible base material in the flexible substrate;
wherein, cooling equipment includes: a cooling chamber and an air supply source;
the cooling chamber is used for accommodating a flexible substrate to be subjected to cooling treatment;
the gas supply source is used for providing gas for temperature reduction treatment for the temperature reduction chamber;
the cool down chamber includes: a first chamber and a second chamber; the gas supply source comprises a gas liquefaction plant;
the gas liquefaction equipment is used for carrying out liquefaction treatment on the gas output from the gas supply source;
the first chamber is used for carrying out pre-cooling treatment on the flexible substrate through the gas provided by the gas supply source, so that the temperature of the flexible substrate is gradually reduced to a second preset temperature;
the second chamber comprising: the device comprises a soaking chamber capable of being sealed and liquefied gas arranged in the soaking chamber, wherein the soaking chamber is used for soaking a flexible substrate subjected to pre-cooling treatment, and the flexible substrate is subjected to cooling treatment continuously, so that the temperature of the flexible substrate is not higher than the first preset temperature within a preset time period;
wherein the second preset temperature is higher than the first preset temperature.
2. The system of claim 1, wherein the system further comprises: at least one mobile device;
the moving equipment is used for moving the flexible substrate subjected to cooling treatment to the scrapping equipment.
3. The system of claim 1, wherein the second chamber further comprises: a sealable steeping chamber, and a liquefied gas disposed in the steeping chamber;
the soaking chamber is used for soaking the flexible substrate subjected to the pre-cooling treatment and continuously cooling the flexible substrate;
the air supply source further includes: a gas liquefaction plant;
the gas liquefaction equipment is used for carrying out liquefaction treatment on the gas output from the gas supply source and conveying the liquefied gas obtained after the liquefaction treatment to the soaking chamber.
4. The system of claim 3, wherein the system further comprises: a first barrier door, a second barrier door and a third barrier door; wherein,
the first baffle door is used as a passage for the flexible substrate to enter the first chamber when being opened and enables the first chamber to be in a sealed state when being closed;
the second baffle door is used as a passage for moving the flexible substrate from the first chamber to the second chamber when being opened, and enables the first chamber and the second chamber to be in a sealing state when being closed;
the third baffle door is used as a channel for moving the flexible substrate from the second chamber to the scrapping equipment when the third baffle door is opened, and the second chamber is in a sealed state when the third baffle door is closed.
5. The system of claim 1, wherein the system further comprises: the waste material tank is arranged below the scrapping equipment;
and the waste tank is used for containing the flexible substrate waste falling after the mechanical crushing treatment.
6. A flexible substrate scrapping treatment method is characterized by comprising the following steps:
cooling the flexible substrate to enable the temperature of the flexible substrate to be lower than a first preset temperature;
carrying out mechanical crushing treatment on the flexible substrate subjected to cooling treatment;
the first preset temperature is the lowest embrittlement temperature of a flexible base material in the flexible substrate;
carry out cooling treatment to flexible substrate, include:
carrying out pre-cooling treatment on the flexible substrate through low-temperature gas to gradually reduce the temperature of the flexible substrate to a second preset temperature;
the flexible substrate after the pre-cooling treatment is soaked in liquefied gas to continue cooling treatment, so that the temperature of the flexible substrate is lower than the first preset temperature within preset time;
the second preset temperature is higher than the first preset temperature.
7. The method of claim 6, wherein the gas used for the temperature reduction treatment comprises one or a combination of the following:
hydrogen, helium and nitrogen.
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| CN201710708564.4A CN107520023B (en) | 2017-08-17 | 2017-08-17 | A kind of flexible base board scraps processing system and method |
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| CN201710708564.4A CN107520023B (en) | 2017-08-17 | 2017-08-17 | A kind of flexible base board scraps processing system and method |
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| CN105597900A (en) * | 2016-01-05 | 2016-05-25 | 临沂奥星化工有限公司 | Chlorinated polyethylene smashing system |
| CN206008963U (en) * | 2016-08-30 | 2017-03-15 | 周易 | A kind of material two-stage pre-cooler |
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