CN107516572A - SMD power inductor and its manufacture method - Google Patents
SMD power inductor and its manufacture method Download PDFInfo
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- CN107516572A CN107516572A CN201710915334.5A CN201710915334A CN107516572A CN 107516572 A CN107516572 A CN 107516572A CN 201710915334 A CN201710915334 A CN 201710915334A CN 107516572 A CN107516572 A CN 107516572A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 92
- 238000005273 aeration Methods 0.000 claims abstract description 15
- 230000004907 flux Effects 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000004512 die casting Methods 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 230000032683 aging Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/085—Cooling by ambient air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Induction Heating (AREA)
Abstract
The invention provides a kind of SMD power inductor to include magnetic conductor, coil and end pole piece, and the coil is flat wire coil, including coil main body and lead-out wires of coil；Be formed in one structure between the magnetic conductor and the coil；The material tight for forming the magnetic conductor is coated on the coil main body；The lead-out wires of coil reaches the outside electrode for forming the inductor of the magnetic conductor；The end pole piece being close to magnetic conductor is welded with the electrode；At least provided with two interconnected heat emission holes on the magnetic conductor, to form aeration structure；At least one through hole and/or blind hole are set along the axis direction of the coil main body on the magnetic conductor among the coil main body.Air is taken away heat from magnetic conductor internal circulation, improve radiating efficiency；Meanwhile the through hole and/or blind hole increase the magnetic flux leakage of inductor, the anti-saturation ability of inductor is improved.The invention provides a kind of manufacture method of SMD power inductor.
Description
Technical field
The present invention relates to field of electrical components, more particularly to a kind of SMD power inductor and its manufacture method.
Background technology
SMD inductor can be divided into small power electric sensor and the class of high power inductors two.Small power electric sensor is mainly used in
Video and communication aspects (such as frequency selection circuit, oscillating circuit)；High power inductors are mainly used in DC/DC converters and (are such as used as
Energy-storage travelling wave tube or LC filter elements).The SMD inductor of small-power has 3 kinds of structures：Winding-type chip inductor, multiple field sheet
Inductor, high-frequency type chip inductor, and high power inductors are all winding-type structures.Existing integral type power inductor because
Magnetic conductor is cast into a regular and close entirety with coil, and it is primarily present following both sides shortcoming：
1. heat dispersion is bad, easily make coil aging, reliability reduces；
2. anti-saturation poor performance, easily there is high current and burn device.
The content of the invention
Based on above-mentioned, there is provided a kind of SMD power inductor.
In addition, also provide a kind of manufacture method of SMD power inductor.
A kind of SMD power inductor, including magnetic conductor, coil and end pole piece, the coil is flat wire coil, bag
Include coil main body and lead-out wires of coil；Be formed in one structure between the magnetic conductor and the coil；Form the magnetic conductor
Material tight be coated on the coil main body；The lead-out wires of coil reaches the outside of the magnetic conductor and forms the inductor
Electrode；The end pole piece being close to magnetic conductor is welded with the electrode；
At least provided with two interconnected heat emission holes on the magnetic conductor；
On the magnetic conductor among the coil main body at least one is set along the axis direction of the coil main body
Individual through hole and/or blind hole.
In one of the embodiments, the heat emission hole is arranged on upper surface and/or the lateral surface of the magnetic conductor, and logical
Cross the magnetic conductor connection of the coil main body outside or inside.
The heat emission hole is arranged on the magnetic conductor of the coil main body periphery, and is arranged on the upper of the magnetic conductor
Surface and/or lateral surface.
In one of the embodiments, the connection form of the heat emission hole includes any one in following three kinds：
Two that are arranged on the magnetic conductor upper surface and more than two heat emission holes are interconnected；
Two that are arranged on the magnetic conduction outside and more than two heat emission holes are interconnected；
It is arranged on the heat emission hole of the magnetic conductor upper surface and is arranged on the radiating of the magnetic conduction outside
Hole is interconnected.
In one of the embodiments, the center line of the interconnected heat emission hole or axis intersect, and angle is in 0-
In 180 degree.
In one of the embodiments, the shape of cross section of the heat emission hole, the through hole and the blind hole is circular, ellipse
Any one in circular or polygon.
A kind of manufacture method of SMD power inductor, including paint is prepared according to the opering characteristic of electric apparatus for the inductor to be manufactured
Envelope curve coil, and prepare the powder for forming magnetic conductor；The coil main body is put into a die casting chamber, the coil
Lead-out wire is then reached outside the die casting chamber；The powder is added in the die casting chamber, and carries out die casting processing, makes the powder
Expect tightly packed to be coated in the inside of the coil main body and closely the outside of the coil main body；The lead-out wires of coil is stretched
Go out to the magnetic conductor outside formed to be formed the electrode of the inductor by the powder pressing；The electricity is taken out from the die casting chamber
Sensor blank and bending to the bottom surface for being close to the magnetic conductor, is burn-on on electrode respectively by the lead-out wire of the inductor blank
Baking processing is carried out after the pole piece of end；
Two interconnected heat emission holes are at least drilled out or suppressed on the magnetic conductor, to form aeration structure；
Drill out or suppress along the axis direction of the coil main body on the magnetic conductor among the coil main body
Go out at least one through hole and/or blind hole, for increasing magnetic flux leakage and area of dissipation.
In one of the embodiments, the heat emission hole is arranged on to upper surface and/or the lateral surface of the magnetic conductor, and
Connected by the magnetic conductor of the coil main body outside or inside.
In one of the embodiments, the interconnected heat emission hole of two and two or more is arranged at described lead
The upper surface of magnet；
Or the interconnected heat emission hole of two and two or more is arranged to the lateral surface of the magnetic conductor；
Or at least one upper surface for being arranged on the magnetic conductor of the heat emission hole that will be interconnected, at least one setting
In the lateral surface of the magnetic conductor.
In one of the embodiments, the center line or axis for setting the interconnected heat emission hole intersect, and angle
In 0-180 degree.
In one of the embodiments, the shape of cross section for setting the heat emission hole, the through hole and the blind hole is circle
Any one in shape, ellipse or polygon.
A kind of SMD power inductor and its manufacture method, pass through the appearance of the SMD power inductor in integral type
Face sets interconnected heat emission hole, to form aeration structure, while the edge on the magnetic conductor among the coil main body
The axis direction for the coil main body drills out or suppressed at least one through hole and/or blind hole, for increasing magnetic flux leakage and dissipating
Hot area.So that the SMD power inductor of integral type obtains following beneficial effect：
1. interconnected heat emission hole constitutes aeration structure, on the one hand allow air from heat emission hole internal circulation band
Heat is walked, on the other hand also increases the area of dissipation of inductor, improves the radiating efficiency of inductor, and then improves inductance
The working temperature environment of coil so that inductance coil is non-aging, extends the life-span；
2. through hole is set along the axis direction of the coil main body on the magnetic conductor among the coil main body
And/or blind hole, equivalent to the material that two different magnetic conductivities are provided with the intensive core portion of the magnetic line of force, increase inductor
Magnetic flux leakage so that inductor is not easy saturation, improves the anti-saturation ability of inductor.
Brief description of the drawings
Fig. 1 is plan structure perspective diagram when heat emission hole is arranged at inductor upper surface；
Fig. 2 is A-A cross-sectional views when heat emission hole is arranged at inductor upper surface；
Fig. 3 is plan structure perspective diagram when heat emission hole is arranged at inductor outer surface；
Fig. 4 is B-B cross-sectional views when heat emission hole is arranged at inductor lateral surface；
Fig. 5 is the plan structure perspective diagram that heat emission hole individually connects on adjacent surface at inductor seamed edge；
Fig. 6 is the C-C cross-sectional views that heat emission hole individually connects on adjacent surface at inductor seamed edge；
Fig. 7 is the plan structure perspective diagram that heat emission hole connects jointly on adjacent surface at inductor seamed edge；
Fig. 8 is the D-D cross-sectional views that heat emission hole connects jointly on adjacent surface at inductor seamed edge；
Fig. 9 is the plan structure perspective diagram that heat emission hole connects jointly on inductor outer surface；
Figure 10 is the E-E cross-sectional views that heat emission hole connects jointly on inductor outer surface；
Figure 11 is that all heat emission holes on inductor lateral surface connect and share the plan structure of one heat emission hole in upper surface
Perspective diagram；
Figure 12 is that all heat emission holes on inductor lateral surface connect and share the F-F section knots of the heat emission hole of upper surface one
Structure schematic diagram.
Description of reference numerals：100. magnetic conductor；110. heat emission hole；120. heat emission hole；130. through hole；200. coil；210.
Coil main body；220. lead-out wires of coil；300. end pole pieces.
Embodiment
In this patent document, the various implementations of Fig. 1-12 discussed below and principle or method for describing the disclosure
Example is served only for illustrating, and should not be construed as in any way and limit the scope of the present disclosure.It should be understood by those skilled in the art that
, the principle or method of the disclosure can be realized in any inductor suitably arranged.Refer to the attached drawing, the preferred reality of the disclosure
Example is applied to will be described below.In the following description, the detailed description of well-known function or configuration will be omitted, in order to avoid with
The theme of the unnecessary unnecessary details disclosure.Moreover, term used herein will define according to the function of the present invention.Cause
This, the term may according to the purpose or usage of user or operator difference.Therefore, term used herein is necessary
Understood based on the description made herein.
A kind of SMD power inductor, as shown in figs. 1-12, including magnetic conductor 100, coil 200 and end pole piece 300, institute
It is flat wire coil to state coil 200, including coil main body 210 and lead-out wires of coil 220；The magnetic conductor 100 and the coil
Be formed in one structure between 200；The material tight for forming the magnetic conductor 100 is coated on the coil main body 210；The line
Circle lead-out wire 220 reaches the outside electrode for forming the inductor of the magnetic conductor 100；It is welded with the electrode and magnetic conduction
The end pole piece 300 that body is close to；It is similar to form at least provided with two interconnected heat emission holes on the magnetic conductor 100
The aeration structure of " stove ", improve radiating rate；Along the line on the magnetic conductor 100 among the coil main body 210
The axis direction for enclosing main body 210 sets at least one through hole 130 and/or blind hole, for increasing magnetic flux leakage and area of dissipation, improves
The anti-saturation ability of inductor and the working environment for improving the coil main body 200, extend the coil main body 200 and use the longevity
Life.
As shown in figs. 1-12, the heat emission hole is arranged on upper surface and/or the lateral surface of the magnetic conductor 100, and passes through
The magnetic conductor 100 of the outside or inside of coil main body 200 connects.It is arranged such, air can be made to be passed through the magnetic conduction
Exchanged heat inside body 100, and taken away heat by air flow, the radiating efficiency of magnetic conductor 100 is improved so as to reach
Purpose.
The connection form of the heat emission hole can be any one in following three kinds：
The connection form one of the heat emission hole, as shown in Fig. 1 Fig. 2, be arranged on two of the upper surface of magnetic conductor 100 and
More than two heat emission holes 110 are interconnected；This setup is raised curved surface mainly for inductor upper surface
Applied during shape structure；When the upper surface of the inductor is the curved surface of plane or indent, at least one described heat emission hole 110
Center line or axis and the angle of upper surface be less than 90 degree.
The connection form two of the heat emission hole, as shown in Fig. 3 Fig. 4, be arranged on two of the lateral surface of magnetic conductor 100 and
More than two heat emission holes 120 are interconnected；When the inductor is prism-shaped, two and it is more than two it is described dissipate
Hot hole 120 is typically at least provided with both faces, and in particular cases, when two and more than two heat emission holes 120 are set
In a plane, the center line or axis of at least one heat emission hole 120 are less than 90 degree with the angle of the plane；Work as institute
When the lateral surface for stating inductor is arc surface, answer center of serve line/axis intersecting or in two of space intersection and two or more
The heat emission hole 120 is interconnected.
The connection form three of the heat emission hole, as shown in Fig. 5 to Figure 12, it is arranged on the institute of the upper surface of magnetic conductor 100
State heat emission hole 110 and be interconnected with being arranged on the heat emission hole 120 of the lateral surface of magnetic conductor 100.This kind of set-up mode is fitted
The inductor of arbitrary shape is closed, and in this kind of set-up mode, the heat emission hole 110 is partial to place vertically, and the heat emission hole
120 are partial to be horizontally disposed with, this aeration structure similar to " stove ", contribute to natural circulation during air heats, improve and dissipate
The thermal efficiency.
In content described above, the center line or axis of the interconnected heat emission hole intersect, and angle is in 0-180
In degree.Wherein, the center line of heat emission hole described in two and two or more or axis are intersecting primarily to interconnected radiating
The connection area in hole is bigger, reduces the local losses of air flow, and the center line or axis of the interconnected heat emission hole
Angle it is bigger, then the local losses of air flow is smaller.
The shape of cross section of the heat emission hole, the through hole 130 and the blind hole is in circular, ellipse or polygon
Any one.
In one of the embodiments, the opening of the heat emission hole 110 is arranged on the upper surface of magnetic conductor 100, and perpendicular
It is straight to set；The opening of the heat emission hole 120 is arranged on the lateral surface of magnetic conductor 100, and horizontally disposed；So as to be interconnected
The heat emission hole 110 forms the aeration structure of similar " stove ", adapts to the wind field that air heats rise nature flowing.
In one of the embodiments, along the coil on the magnetic conductor 100 among the coil main body 210
The axis direction of main body 210 sets a through hole 130, and the axis weight of the axis of the through hole 130 and the coil main body 210
Close.
A kind of SMD power inductor, set by the outer surface of the SMD power inductor in integral type and mutually interconnected
Logical heat emission hole, to form aeration structure, while along the coil master on the magnetic conductor among the coil main body
The axis direction of body sets at least one through hole and/or blind hole, for increasing magnetic flux leakage and area of dissipation.So that the patch of integral type
Slice power inductance device obtains following beneficial effect：
1. interconnected heat emission hole constitutes aeration structure, on the one hand allow air from heat emission hole internal circulation band
Heat is walked, on the other hand also increases the area of dissipation of inductor, improves the radiating efficiency of inductor, and then improves inductance
The working temperature environment of coil so that inductance coil is non-aging, extends the life-span；
2. through hole is set along the axis direction of the coil main body on the magnetic conductor among the coil main body
And/or blind hole, equivalent to the material that two different magnetic conductivities are provided with the intensive core portion of the magnetic line of force, increase inductor
Magnetic flux leakage so that inductor is not easy saturation, improves the anti-saturation ability of inductor.
According to content described above, this programme additionally provides the manufacture method of SMD inductor described above, including：Root
Enamel wire coil 200 is prepared according to the opering characteristic of electric apparatus for the inductor to be manufactured, and prepares the powder for forming magnetic conductor 100；Will
The coil main body 210 is put into a die casting chamber, and the lead-out wire 220 of the coil is then reached outside the die casting chamber；Institute
State and the powder is added in die casting chamber, and carry out die casting processing, make the powder tightly packed in the coil main body 210
Portion and the outside for being closely coated on the coil main body 210；The lead-out wires of coil 220 reaches to be formed by the powder pressing
The outside of magnetic conductor 100 form the electrode of the inductor；The inductor blank is taken out from the die casting chamber and by the electricity
Bending to the bottom surface for being close to the magnetic conductor 100, is carried out the lead-out wire of sensor blank after end pole piece 300 of being burn-on on electrode respectively
Baking is handled.Two interconnected heat emission holes are at least drilled out or suppressed on the magnetic conductor 100, to form ventilation knot
Structure；Drilled out on the magnetic conductor 100 among the coil main body 210 along the axis direction of the coil main body 210 or
At least one through hole and/or blind hole are suppressed, for increasing magnetic flux leakage and area of dissipation.
The heat emission hole is arranged on to upper surface and/or the lateral surface of the magnetic conductor 100, and passes through the coil main body
The magnetic conductor 100 of 210 outside or inside connects.This set method, it is simple to operate, it is easy to implement, and composition can be made
The magnetic conductor 100 of the inductor improves the radiating efficiency of inductor from outwardly and inwardly radiating simultaneously, improves the line
The working environment of main body 210 is enclosed, improves the service life of inductor.
This programme additionally provides three kinds of main methods to set up between the heat emission hole：
As shown in Fig. 1 Fig. 2, the interconnected heat emission hole 110 of two and two or more is arranged at described lead
The upper surface of magnet 100；Applied when this setup is mainly for the curved structure that inductor upper surface is projection；Work as institute
State the upper surface of inductor for the curved surface of plane or indent when, the center line or axis of at least one heat emission hole 110 with
The angle of upper surface is less than 90 degree, so that the heat emission hole 110 can realize connection.
Or as shown in Fig. 3 Fig. 4, the interconnected heat emission hole 120 of two and two or more is arranged at described
The lateral surface of magnetic conductor 100；When the inductor is prism-shaped, two and more than two heat emission holes 120 are general extremely
It is few to set on both faces, in particular cases, when when two and more than two heat emission holes 120 are arranged on a plane,
The center line or axis of at least one heat emission hole 120 are less than 90 degree with the angle of the plane；When outside the inductor
When side is arc surface, answer center of serve line/axis intersecting or in heat emission hole 120 described in two of space intersection and two or more
It is interconnected, to enable air to by the free flow of heat emission hole 120.
Or as shown in Fig. 5 to Figure 12, the magnetic conductor is arranged on by the interconnected heat emission hole is at least one
Upper surface, at least one lateral surface for being arranged on the magnetic conductor.This kind of set-up mode is adapted to the inductor of arbitrary shape, and should
In kind set-up mode, the heat emission hole 110 is partial to place vertically, and the heat emission hole 120 is partial to be horizontally disposed with, this species
The aeration structure of " stove " is similar to, the wind field structure to circulate naturally when meeting air heats, radiating efficiency can be improved.
In addition, in the manufacture method of SMD power inductor described above, the interconnected radiating is set
The center line or axis in hole intersect, and angle is in 0-180 degree.Wherein, the center line of heat emission hole described in two and two or more
Or axis is intersecting primarily to the connection area of interconnected heat emission hole is bigger, reduces the local losses of air flow, and
The center line of the interconnected heat emission hole or the angle of axis are bigger, then the local losses of air flow is smaller.
The shape of cross section for setting the heat emission hole, the through hole 130 and the blind hole is circular, ellipse or polygon
In any one.It is arranged such, primarily to convenient production and processing and guarantee wind field circulation are smooth.
In one of the embodiments, the opening of the heat emission hole 110 is arranged on the upper surface of magnetic conductor 100, and
It is vertically arranged；The opening of the heat emission hole 120 is arranged on the lateral surface of magnetic conductor 100, and it is horizontally disposed；So as to mutually interconnect
The logical heat emission hole 110 forms the aeration structure of similar " stove ", adapts to the wind field that air heats rise nature flowing.
In one of the embodiments, along the coil on the magnetic conductor 100 among the coil main body 210
The axis direction of main body 210 sets a through hole 130, and the axis weight of the axis of the through hole 130 and the coil main body 210
Close.
A kind of manufacture method of SMD power inductor, passes through the outer surface of the SMD power inductor in integral type
Interconnected heat emission hole is drilled out or suppresses, to form aeration structure, while the magnetic conduction among the coil main body
At least one through hole and/or blind hole are drilled out or suppressed on body along the axis direction of the coil main body, for increasing leakage field
Amount and area of dissipation.SMD power inductor that can be after being integrally formed realizes that this programme can also be in inductance by drilling
This programme is realized by the compacting of mould in the forming process of device.Method is simple, easy to operation and mass production.
, will be mutual below by taking the inductor of four prism type as an example in order to more clearly illustrate the content of the present invention program
At least one upper surface for being arranged on the magnetic conductor of the heat emission hole of connection, it is at least one to be arranged on the outer of the magnetic conductor
The situation of side, that is, it is arranged on the heat emission hole 110 of the upper surface of magnetic conductor 100 and is arranged on outside the magnetic conductor 100
The interconnected situation of the heat emission hole 120 of side illustrates.It should be pointed out that the description of the part is more specific
With it is detailed, but can not therefore and be construed as limiting the scope of the patent, for the person of ordinary skill of the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
Enclose.
Embodiment one
The heat emission hole individually connected is set on the adjacent surface at the seamed edge of inductor, one is coaxially disposed with coil main body
Through hole.
As shown in Fig. 5 Fig. 6, the heat emission hole is arranged on the adjacent plane on rib both sides, and as shown in figure 5, in seamed edge
One, place, one heat emission hole 120 of connection of the heat emission hole 110；A heat emission hole 110 can connect one around the corner
Individual or two heat emission holes 120, to form the aeration structure similar to " stove ".It is as shown in Figure 6, the heat emission hole 110 with
The heat emission hole 120 is vertical setting.This setup, mainly for the inductor of small volume, method to set up is simple, holds
It is easy to operate, directly it can punch to be formed using short distance drill bit.Wherein, the heat emission hole 110 and described 120 draught area or section
Shape can be set to identical, can also be arranged to it is different, its draught area size need can ensure that air can in hole
Viscous force is overcome to circulate naturally.
Centre in the inductor drills out or suppressed a through hole 130, the axis of the through hole 130 with it is described
The axis of coil main body 210 overlaps.The cross-sectional area of the through hole 130 is bigger, and magnetic flux leakage will be bigger, and the inductor resists
Saturability is stronger, but magnetic resistance also increases simultaneously, iron loss increase, is unfavorable for the improvement of other performance parameters of inductor.So
The cross section size of the through hole 130 should be according to the parameters synthetic setting of the inductor.
Embodiment two
Compared with above-described embodiment one, the difference is that embodiment two is provided with the adjacent surface at the seamed edge of inductor
The heat emission hole connected jointly.
As shown in Fig. 7 Fig. 8, the heat emission hole is arranged on the adjacent plane on rib both sides, and at the seamed edge described in one
Heat emission hole 110 connects multiple or the whole heat emission holes 120 and the heat emission hole 110 jointly, to form similar to the logical of " stove "
Wind structure.This setup, method is simple, and easily operation, directly can punch to be formed using drill bit.
In addition, on the one hand so setting can interconnect each heat emission hole of setting, the ground for making caloric value big can
Cooled down using the air of surrounding, improve the uniformity of the inductor radiating；On the other hand, in this kind of set-up mode, one
The individual heat emission hole 110 has at least corresponded to the heat emission hole 120 in three directions so that corresponding to each heat emission hole 110
Incoming air area increases, and windage reduces, and is advantageous to the natural circulation after air heats.
Embodiment three
Compared with above-described embodiment two, unlike embodiment three be on adjacent surface at the seamed edge of inductor and rib
The heat emission hole connected jointly is provided with the outer surface of post.
As shown in Fig. 9 Figure 10, the heat emission hole is covered with prism outer surface, and each heat emission hole 110 is corresponded to and connected
Multiple or the whole heat emission holes 120 and the heat emission hole 110 are led to, to form the aeration structure similar to " stove ".It is this to set
Mode is put, method is simple, and easily operation, directly can punch to be formed using drill bit.
In addition, so setting can interconnect each heat emission hole of setting, the big place of caloric value is set to utilize week
The air enclosed is cooled down, the radiating requirements at each position of equalizer inductor；Simultaneously so that each correspondence of heat emission hole 110
Incoming air area increase, windage reduce, be advantageous to the natural circulation after air heats.
Example IV
As shown in Figure 11 Figure 12, compared with above-described embodiment one to three, the difference is that example IV only sets a ventilation
The larger heat emission hole 110 of area, and all heat emission holes 120 on the inductor lateral surface with the heat emission hole
110 directly or indirectly connect, i.e., it is described scattered that all heat emission holes 120 on described inductor lateral surface share upper surface one
Hot hole 110.It is arranged such, mainly for the less inductor of upper surface area, the institute larger by sharing a draught area
Heat emission hole 110 is stated, the heat emission hole can be made to reduce the viscosity resistance of air, the speed that air heats flow naturally is improved, carries
High cooling efficiency.
In addition, the heat emission hole 120 can use elongated hole, further to reduce viscosity resistance of the heat emission hole to air.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of SMD power inductor, including magnetic conductor, coil and end pole piece, the coil is flat wire coil, including
Coil main body and lead-out wires of coil；Be formed in one structure between the magnetic conductor and the coil；Form the magnetic conductor
Material tight is coated on the coil main body；The lead-out wires of coil reaches the outside formation inductor of the magnetic conductor
Electrode；The end pole piece being close to magnetic conductor is welded with the electrode；It is characterized in that：
At least provided with two interconnected heat emission holes on the magnetic conductor；
On the magnetic conductor among the coil main body be set along the axis direction of the coil main body at least one lead to
Hole and/or blind hole.
2. SMD power inductor according to claim 1, it is characterised in that：The heat emission hole is arranged on the magnetic conduction
The upper surface of body and/or lateral surface, and connected by the magnetic conductor of the coil main body outside or inside.
3. SMD power inductor according to claim 2, it is characterised in that：The connection form of the heat emission hole includes
Any one in three kinds below：
Two that are arranged on the magnetic conductor upper surface and more than two heat emission holes are interconnected；
Two that are arranged on the magnetic conduction outside and more than two heat emission holes are interconnected；
The heat emission hole of the magnetic conductor upper surface is arranged on being arranged on the heat emission hole phase of the magnetic conduction outside
It is intercommunicated.
4. SMD power inductor according to claim 1, it is characterised in that：In the interconnected heat emission hole
Heart line or axis intersect, and angle is in 0-180 degree.
5. SMD power inductor according to claim 1, it is characterised in that：The heat emission hole, the through hole and institute
The shape of cross section for stating blind hole is any one in circular, ellipse or polygon.
6. a kind of manufacture method of SMD power inductor, including enamel-cover is prepared according to the opering characteristic of electric apparatus for the inductor to be manufactured
Line coil, and prepare the powder for forming magnetic conductor；The coil main body is put into a die casting chamber, the coil draws
Outlet is then reached outside the die casting chamber；The powder is added in the die casting chamber, and carries out die casting processing, makes the powder
It is tightly packed to be coated in the inside of the coil main body and closely the outside of the coil main body；The lead-out wires of coil stretches out
The electrode of the inductor is formed outside to the magnetic conductor formed by the powder pressing；The inductance is taken out from the die casting chamber
Device blank and bending is to the bottom surface for being close to the magnetic conductor respectively by the lead-out wire of the inductor blank, end of being burn-on on electrode
Baking processing is carried out after pole piece；Characterized in that, methods described also includes：
Two interconnected heat emission holes are at least drilled out or suppressed on the magnetic conductor, to form aeration structure；
Along the axis direction of the coil main body drill out or suppress on the magnetic conductor among the coil main body to
A few through hole and/or blind hole, for increasing magnetic flux leakage and area of dissipation.
7. the manufacture method of SMD power inductor according to claim 6, it is characterised in that
The heat emission hole is arranged on to upper surface and/or the lateral surface of the magnetic conductor, and by outside the coil main body or
Internal magnetic conductor connection.
8. the manufacture method of SMD power inductor according to claim 7, it is characterised in that methods described also includes
Set-up mode between the heat emission hole, including：
The interconnected heat emission hole of two and two or more is arranged to the upper surface of the magnetic conductor；
Or the interconnected heat emission hole of two and two or more is arranged to the lateral surface of the magnetic conductor；
Or at least one upper surface for being arranged on the magnetic conductor of the heat emission hole that will be interconnected, it is at least one to be arranged on institute
State the lateral surface of magnetic conductor.
9. the manufacture method of SMD power inductor according to claim 6, it is characterised in that methods described is also wrapped
Include：
The center line or axis for setting the interconnected heat emission hole intersect, and angle is in 0-180 degree.
10. the manufacture method of SMD power inductor according to claim 6, it is characterised in that methods described is also wrapped
Include：
The shape of cross section for setting the heat emission hole, the through hole and the blind hole is appointing in circular, ellipse or polygon
Meaning is a kind of.
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| CN201710915334.5A CN107516572A (en) | 2017-09-30 | 2017-09-30 | SMD power inductor and its manufacture method |
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