CN107515089A - A kind of temperature stress efficiently excites the reliability development test method of failure - Google Patents

A kind of temperature stress efficiently excites the reliability development test method of failure Download PDF

Info

Publication number
CN107515089A
CN107515089A CN201710618162.5A CN201710618162A CN107515089A CN 107515089 A CN107515089 A CN 107515089A CN 201710618162 A CN201710618162 A CN 201710618162A CN 107515089 A CN107515089 A CN 107515089A
Authority
CN
China
Prior art keywords
temperature
stress
failure
testpieces
test method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710618162.5A
Other languages
Chinese (zh)
Inventor
赵晓东
樊西龙
张蕊
梁力
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Aircraft Design and Research Institute of AVIC
Original Assignee
Xian Aircraft Design and Research Institute of AVIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Aircraft Design and Research Institute of AVIC filed Critical Xian Aircraft Design and Research Institute of AVIC
Priority to CN201710618162.5A priority Critical patent/CN107515089A/en
Publication of CN107515089A publication Critical patent/CN107515089A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00Vibration-testing of structures; Shock-testing of structures
    • G01M7/02Vibration-testing by means of a shake table
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00Vibration-testing of structures; Shock-testing of structures
    • G01M7/08Shock-testing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00Subject matter not provided for in other groups of this subclass
    • G01M99/002Thermal testing

Abstract

The invention discloses a kind of reliability development test method that temperature stress efficiently excites failure, belong to aviation reliability engineering technique field.Methods described includes choosing testing stand according to testpieces feature first;Secondly, testpieces temperature parameter and vibration parameters are obtained;Carry out low temperature step stress test, high temperature step stress test and fast temperature change experiment respectively afterwards, to the high temperature of product, low temperature and temperature change characteristic progress failure excites and resistance to temperature extremes is known the real situation, in the case where not changing the precondition of product bug mechanism, solves the engineering roadblock of short time raising product reliability level.

Description

A kind of temperature stress efficiently excites the reliability development test method of failure
Technical field
The invention belongs to aviation reliability engineering technique field, and in particular to what a kind of temperature stress efficiently excited failure can By property development test method.
Background technology
Reliability test work is an important process project during military secret is developed, normally only before airborne equipment identification, According to GJB899A-2009《Reliability determination and acceptance test》Specified in method examined, with electronic equipment day increasingly Fast developing steps, also more and more higher, the index of many products already exceed thousands of hours, adopted the reliability level of electronic product Directly examined with traditional reliability compliance test, either the test period, or experiment funds are all difficult to meet Project R&D Requirement.In order to effectively solve the contradiction between modern electronic equipment reliability and complexity, improve reliability test efficiency, most The reduction electronic equipment Life Cycle Cost of big degree, it is great property to carry out reliability development test in the development stage of product Valency than test method.
In traditional Reliability Engineering, life-span of electronic equipment is considered as that " unlimited " (is far longer than equipment Service phase), while think that the failure of electronic equipment is random " accidental " generation, can not chase after and trace sth. to its source and stress relation.Closely Nian Lai, with the development of reliability engineering, the reliability theory based on faulty physical has been received by Reliability Engineers, everybody Think " accidental " failure be due in product there is caused by potential design and craft defect, over time can must So occur, carry out reliability development test initial stage in product development, be the experiment side of the optimal reliability level for improving product Formula.
In traditional reliability test method, the requirement to failure is generally, and is out of order in experiment, should be stopped first Experiment, after carrying out accident analysis, zero, carry on experiment, i.e., the test method that a failure one is zeroed, this test method The test period will greatly be increased, reduce test efficiency.
The content of the invention
In order to solve the above problems, overcome prior art to carry out reliability test cycle length for airborne equipment, excite event The shortcomings that barrier efficiency is low, and a failure one is zeroed, a kind of searching design deficiency of product is proposed, with Curve guide impeller, raising product is consolidated There is the reliability development test method of reliability level.
Temperature stress of the present invention efficiently excites the reliability development test method of failure, including:
Step 1: testing stand is chosen according to testpieces feature;
Step 2: obtain testpieces temperature parameter and vibration parameters;
Step 3: low temperature step stress test is carried out, when temperature is down to -80 DEG C in a stepping manner, in each temperature section Carry out electric stress loading;
Step 4: high temperature step stress test is carried out, when temperature rises to 110 DEG C in a stepping manner, in each temperature section Carry out electric stress loading;
Step 5: carrying out fast temperature change experiment, carrying out electricity within the cycle that continuous high temperature and consecutive low temperature are formed should Power loads.
Preferably, in the step 1, selected according to the volume of airborne equipment, weight, installation direction and environment extreme value Suitable testing stand is taken, the testing stand includes impact type vibration mechine and electromagnetic vibration test platform.
Preferably, in the step 2, the temperature parameter includes the focus situation and heat distribution liter inside testpieces Tender feeling condition, the vibration parameters include the resonance point and stress accumulation point of testpieces.
It is preferably, described that Step 3: in step 4 and step 5, the electric stress loading, which includes being powered three times, to be started, And after last time is powered, electric stress loading is kept, for carrying out functional test, the duration of the holding is not less than 30min, The temperature variability is not less than 30 DEG C/min.
Preferably, in the step 3, when the temperature is down to -80 DEG C in a stepping manner, including use 10 DEG C for Step-length is cooled to -55 DEG C, and uses 5 DEG C to be cooled to -80 DEG C from -55 DEG C for step-length;In the step 4, the temperature is with step When the mode entered rises to 110 DEG C, including use 10 DEG C to be cooled to 70 DEG C for step-length, and use 5 DEG C to be heated up for step-length from 70 DEG C To 110 DEG C.
Preferably, in the step 5, continuous high temperature is included at -5 DEG C of the testpieces hot operation limit, continues 30min, Consecutive low temperature is included at+5 DEG C of the testpieces low-temperature working limit, continues 30min.
Preferably, in step 2, further comprise being directed to thermally sensitive testpieces, using micro environment control, institute Stating micro environment control is included by the way that ventilation tracheae is fixed into testpieces detected part.
Preferably, step 3 is into step 5, when testpieces finds failure or during to working limit, and now tests temperature When degree does not reach test objective also, including the method for temperature protection is taken to protect the weak spot of discovery, to ensure rear Continue product in further harsher stress and remain to normal work.
Novelty of the invention proposes a kind of reliability development test side for repeatedly exciting failure, primary fault to be zeroed Method, to the high temperature of product, low temperature and temperature change characteristic progress failure excites and resistance to temperature extremes is known the real situation, and is not changing product bug machine Under the precondition of reason, solves the engineering roadblock of short time raising product reliability level.
Brief description of the drawings
Fig. 1 is the low of a preferred embodiment of the reliability development test method that temperature stress of the present invention efficiently excites failure The stress of warm step stress test applies schematic diagram.
Fig. 2 is that the stress of the high temperature step stress test of embodiment illustrated in fig. 1 of the present invention applies schematic diagram.
Fig. 3 is that the stress for carrying out fast temperature change experiment of embodiment illustrated in fig. 1 of the present invention applies schematic diagram.
Embodiment
To make the purpose, technical scheme and advantage that the present invention is implemented clearer, below in conjunction with the embodiment of the present invention Accompanying drawing, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from beginning to end or class As label represent same or similar element or the element with same or like function.Described embodiment is the present invention Part of the embodiment, rather than whole embodiments.The embodiments described below with reference to the accompanying drawings are exemplary, it is intended to uses It is of the invention in explaining, and be not considered as limiting the invention.Based on the embodiment in the present invention, ordinary skill people The every other embodiment that member is obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.Under Embodiments of the invention are described in detail with reference to accompanying drawing for face.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", "front", "rear", The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " is based on accompanying drawing institutes The orientation or position relationship shown, it is for only for ease of the description present invention and simplifies description, rather than instruction or the dress for implying meaning Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that the present invention is protected The limitation of scope.
The present invention proposes a kind of reliability development test method that temperature stress efficiently excites failure, mainly includes:
Step 1: testing stand is chosen according to testpieces feature;
Step 2: obtain testpieces temperature parameter and vibration parameters;
Step 3: low temperature step stress test is carried out, when temperature is down to -80 DEG C in a stepping manner, in each temperature section Carry out electric stress loading;
Step 4: high temperature step stress test is carried out, when temperature rises to 110 DEG C in a stepping manner, in each temperature section Carry out electric stress loading;
Step 5: carrying out fast temperature change experiment, carrying out electricity within the cycle that continuous high temperature and consecutive low temperature are formed should Power loads.
In the present embodiment, in the step 1, according to the volume of airborne equipment, weight, installation direction and environment extreme value come Suitable testing stand is chosen, the domestic testing stand currently used for reliability development test is mainly impact type vibration mechine (three Axle six degree of freedom) and two kinds of electromagnetic vibration test platform (routine test platform), the major parameter of two kinds of testing stands is as follows.
Impact type vibration mechine Electromagnetic vibration test platform
Temperature -100℃-200℃ -70℃-180℃
Temperature becomes 50 DEG C/more than s 15 DEG C/below s
Vibration force 100g 30g
Vibration frequency 0-10000Hz 5-2000Hz
Volume It is small It is adjustable
In the present embodiment, in the step 2, the temperature investigation of reply tested products, heat distribution point is carried out to tested products Analysis, understand focus situation and heat distribution ramp case inside tested products, be temperature sensor in reliability development test Arrangement provides reference;Will also be to tested products Vibration Survey, in terms of carrying out the vibratory response of low vibration magnitude to tested products Investigation, the preliminary resonance point and stress accumulation point for understanding tested products, is carried for the arrangement of reliability development test vibrating sensor For reference.
In the present embodiment, described Step 3: in step 4 and step 5, the electric stress loading, which includes being powered three times, opens It is dynamic, and after last time is powered, electric stress loading is kept, for carrying out functional test, the duration of the holding is not less than 30min, the temperature variability are not less than 30 DEG C/min.
Fig. 1 is that the stress of low temperature step stress test applies schematic diagram.Before temperature is down to more safe temperature, examination Test step-length may be selected it is larger;After more safe temperature, experiment step-length is optional smaller, in favor of being exactly found temperature Weak spot.It is step-length with -5 DEG C for example, after temperature reaches -55 DEG C, and with -10 DEG C is being before step-length.
Temperature sensor is arranged on the low temperature focus inside tested products (multiple spot as far as possible, to determine the temperature of product Spend stable state).Low temperature cut-off condition should select the product low temperature damage limit or subscribe test objective, airborne equipment selection -80 DEG C to fix one's aim in advance.
Fig. 2 is that the stress of high temperature step stress test applies schematic diagram.
Before temperature rises to more safe temperature, experiment step-length may be selected larger;More than more safe temperature it Afterwards, it is optional smaller to test step-length, in favor of being exactly found temperature weak spot.For example, after temperature reaches 70 DEG C, with 5 DEG C For step-length, and before with 10 DEG C for step-length.
Temperature sensor is arranged on the high temperature focus inside tested products (multiple spot as far as possible, to determine the temperature of product Spend stable state).High temperature cut-off condition should select the product high temperature limit or subscribe test objective, and airborne equipment suggestion is selected 110 DEG C are to fix one's aim in advance.
Fig. 3 is to carry out the stress application schematic diagram that fast temperature change is tested, and in the step 5, continuous high temperature includes examination Test at -5 DEG C of the part hot operation limit, continue 30min, consecutive low temperature is included at+5 DEG C of the testpieces low-temperature working limit, continues 30min.Using normal temperature as fast temperature, the beginning of change circulation, rate temperature change are not less than 30 DEG C/min, and temperature range is + 5 DEG C of the low-temperature working limit~-5 DEG C of the hot operation limit (such as:The tested products low-temperature working limit is -60 DEG C, hot operation The limit is 100 DEG C, if without particular/special requirement, fast temperature change trial temperature range is -55 DEG C~95 DEG C).
In order to strengthen humid test effect, ensureing the temperature of airborne equipment each several part can transmit as early as possible, and the present embodiment needs Hollow out cabinet is made to carry out temperature classes experiment, the design of hollow out cabinet should meet the installation of product original cabinet and intensity is set Meter requires.
In the present embodiment step 2, further comprise being directed to thermally sensitive testpieces, it is described using micro environment control Micro environment control includes passing through is fixed to testpieces detected part by ventilation tracheae, for ensureing the temperature of airborne equipment each several part Can accurately it control.
In the present embodiment, step 3 is into step 5, when testpieces finds failure or during to working limit, and now tests When temperature does not reach test objective also, including the method for temperature protection is taken to protect the weak spot of discovery, to ensure Subsequently further product remains to normal work in harsher stress.
There is microenvironment temperature control safeguard measure, it is possible in a certain temperature step because working machine occurs for some device During failure in case, using safeguard measure so that continue to next step stress, miscellaneous part is excited.Deng sharp When hair stress reaches test objective, Analysis on Mechanism, failure zero are carried out together to the failure of multiple devices, so as to greatly improve Test efficiency.
Novelty of the invention proposes a kind of reliability development test side for repeatedly exciting failure, primary fault to be zeroed Method, using measures such as hollow out cabinet, microenvironment temperature protections, characteristic progress failure is become to the high temperature of product, low temperature and temperature and excited And resistance to temperature extremes is known the real situation, in the case where not changing the precondition of product bug mechanism, solves short time raising product reliability Horizontal engineering roadblock.
It is last it is to be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations.To the greatest extent The present invention is described in detail with reference to the foregoing embodiments for pipe, it will be understood by those within the art that:It is still Technical scheme described in foregoing embodiments can be modified, or which part technical characteristic is equally replaced Change;And these modifications or replacement, the essence of appropriate technical solution is departed from the essence of various embodiments of the present invention technical scheme God and scope.

Claims (8)

1. a kind of temperature stress efficiently excites the reliability development test method of failure, it is characterised in that including:
Step 1: testing stand is chosen according to testpieces feature;
Step 2: obtain testpieces temperature parameter and vibration parameters;
Step 3: carrying out low temperature step stress test, when temperature is down to -80 DEG C in a stepping manner, carried out in each temperature section Electric stress loads;
Step 4: carrying out high temperature step stress test, when temperature rises to 110 DEG C in a stepping manner, carried out in each temperature section Electric stress loads;
Step 5: carrying out fast temperature change experiment, carrying out electric stress within the cycle that continuous high temperature and consecutive low temperature are formed adds Carry.
2. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that institute State in step 1, suitable testing stand is chosen according to the volume of airborne equipment, weight, installation direction and environment extreme value, it is described Testing stand includes impact type vibration mechine and electromagnetic vibration test platform.
3. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that institute State in step 2, the temperature parameter includes the focus situation and heat distribution ramp case inside testpieces, the vibration parameters Resonance point and stress accumulation point including testpieces.
4. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that institute To state Step 3: in step 4 and step 5, the electric stress loading, which includes being powered three times, to be started, and after last time is powered, Electric stress loading is kept, for carrying out functional test, the duration of the holding is not less than 30min, and the temperature variability is not less than Less than 30 DEG C/min.
5. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that institute State in step 3, when the temperature is down to -80 DEG C in a stepping manner, including use 10 DEG C to be cooled to -55 DEG C for step-length, and 5 DEG C are used to be cooled to -80 DEG C from -55 DEG C for step-length;In the step 4, when the temperature rises to 110 DEG C in a stepping manner, Including using 10 DEG C to be cooled to 70 DEG C for step-length, and 5 DEG C are used to be warming up to 110 DEG C from 70 DEG C for step-length.
6. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that institute State in step 5, continuous high temperature is included at -5 DEG C of the testpieces hot operation limit, continues 30min, and consecutive low temperature includes testpieces At+5 DEG C of the low-temperature working limit, continue 30min.
7. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that step In rapid two, further comprise being directed to thermally sensitive testpieces, using micro environment control, the micro environment control includes passing through Ventilation tracheae is fixed to testpieces detected part.
8. temperature stress as claimed in claim 1 efficiently excites the reliability development test method of failure, it is characterised in that step Rapid three into step 5, and when testpieces finds failure or during to working limit, and now test temperature does not reach test objective also When, including take the method for temperature protection to protect the weak spot of discovery, with ensure it is subsequently further harsher should Product remains to normal work in power.
CN201710618162.5A 2017-07-26 2017-07-26 A kind of temperature stress efficiently excites the reliability development test method of failure Pending CN107515089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710618162.5A CN107515089A (en) 2017-07-26 2017-07-26 A kind of temperature stress efficiently excites the reliability development test method of failure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710618162.5A CN107515089A (en) 2017-07-26 2017-07-26 A kind of temperature stress efficiently excites the reliability development test method of failure

Publications (1)

Publication Number Publication Date
CN107515089A true CN107515089A (en) 2017-12-26

Family

ID=60722784

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710618162.5A Pending CN107515089A (en) 2017-07-26 2017-07-26 A kind of temperature stress efficiently excites the reliability development test method of failure

Country Status (1)

Country Link
CN (1) CN107515089A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110412497A (en) * 2019-06-11 2019-11-05 国网重庆市电力公司电力科学研究院 A kind of intelligent electric energy meter weak links of reliability localization method and device
CN114442593A (en) * 2022-01-21 2022-05-06 中国科学院苏州生物医学工程技术研究所 High-temperature stress reliability strengthening test method for electric control system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1492492A (en) * 2003-09-24 2004-04-28 北京工业大学 Quick evaluation method for microelectronic device reliability
CN102495307A (en) * 2011-11-28 2012-06-13 四川长虹电器股份有限公司 Flat panel television reliability test method
CN103018027A (en) * 2012-12-07 2013-04-03 西安航空制动科技有限公司 Method for exciting faults of airplane brake valve
CN103852672A (en) * 2014-03-31 2014-06-11 中国航天科工运载技术研究院北京分院 Environmental stress screening method of electronic device by using stepping stress
CN104459408A (en) * 2014-12-11 2015-03-25 中国电子科技集团公司第二十研究所 Method for verifying product reliability through temperature-stress-increased accelerated lift test
CN105572498A (en) * 2015-12-11 2016-05-11 中国航空工业集团公司西安飞机设计研究所 Reliability acceleration test method of electronic products

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1492492A (en) * 2003-09-24 2004-04-28 北京工业大学 Quick evaluation method for microelectronic device reliability
CN102495307A (en) * 2011-11-28 2012-06-13 四川长虹电器股份有限公司 Flat panel television reliability test method
CN103018027A (en) * 2012-12-07 2013-04-03 西安航空制动科技有限公司 Method for exciting faults of airplane brake valve
CN103852672A (en) * 2014-03-31 2014-06-11 中国航天科工运载技术研究院北京分院 Environmental stress screening method of electronic device by using stepping stress
CN104459408A (en) * 2014-12-11 2015-03-25 中国电子科技集团公司第二十研究所 Method for verifying product reliability through temperature-stress-increased accelerated lift test
CN105572498A (en) * 2015-12-11 2016-05-11 中国航空工业集团公司西安飞机设计研究所 Reliability acceleration test method of electronic products

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
冯帅 等: "可靠性强化试验及其在某型机载吊舱关键模块的应用", 《火力与指挥控制》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110412497A (en) * 2019-06-11 2019-11-05 国网重庆市电力公司电力科学研究院 A kind of intelligent electric energy meter weak links of reliability localization method and device
CN114442593A (en) * 2022-01-21 2022-05-06 中国科学院苏州生物医学工程技术研究所 High-temperature stress reliability strengthening test method for electric control system
CN114442593B (en) * 2022-01-21 2023-05-12 中国科学院苏州生物医学工程技术研究所 High-temperature stress reliability strengthening test method for electric control system

Similar Documents

Publication Publication Date Title
CN105416609B (en) A kind of multi- scenarios method pilot system and test method
CN107064665B (en) Electronic product combined stress strenuous test method
CN101131417B (en) Battery monitoring system
CN104813182B (en) The steady state detection of abnormal charge event in the cell device being connected in series
CN108146260B (en) The test method that vehicle feedback braking electric current influences lithium ion battery service life
CN103326076B (en) A kind of electrokinetic cell recycling method
CN103512716B (en) A kind of method of antiskid braking control box highly accelerated stress screen
CN105203965A (en) Energy storage battery detection method
CN107515089A (en) A kind of temperature stress efficiently excites the reliability development test method of failure
CN104615517A (en) Method for detecting server products through using HALT
CN105738829A (en) Method for identifying equivalent circuit model parameters of power lithium battery
CN104813183B (en) The Transient detection of abnormal charge event in the cell device being connected in series
CN104883112A (en) Asynchronous motor parameter offline identification method
CN106501297A (en) A kind of NMR measuring system for the detection of composite insulator degree of aging
CN110412497A (en) A kind of intelligent electric energy meter weak links of reliability localization method and device
US20230022649A1 (en) Method, apparatus and program product for predicting multiaxial fatigue life
CN104849073B (en) The experimental rig and test method of ride-control durability
Roedig et al. Simulation of transient heat loads on high heat flux materials and components
CN203275628U (en) High voltage battery pack external characteristic simulator
CN103728487B (en) Method for metering real radio frequency detonating energy of electric initiating explosive device
CN110146214A (en) Battery modules copper bar bolt best torque measuring method and device
CN109188304A (en) A kind of power battery pack system SOC method for testing precision
CN108918106A (en) A kind of method for testing fatigue of the pneumatic equipment bladess loaded stage by stage
CN107465206A (en) A kind of anti-isolated island recognition methods of wind power plant based on harmonic impedance matrix and its system
CN111475930A (en) Fan switching test system and method

Legal Events

Date Code Title Description
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171226

RJ01 Rejection of invention patent application after publication