CN107512698B - 一种中心支撑准悬浮式mems芯片封装结构的制作方法 - Google Patents
一种中心支撑准悬浮式mems芯片封装结构的制作方法 Download PDFInfo
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- CN107512698B CN107512698B CN201710702647.2A CN201710702647A CN107512698B CN 107512698 B CN107512698 B CN 107512698B CN 201710702647 A CN201710702647 A CN 201710702647A CN 107512698 B CN107512698 B CN 107512698B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
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CN201710702647.2A CN107512698B (zh) | 2017-08-16 | 2017-08-16 | 一种中心支撑准悬浮式mems芯片封装结构的制作方法 |
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CN201710702647.2A CN107512698B (zh) | 2017-08-16 | 2017-08-16 | 一种中心支撑准悬浮式mems芯片封装结构的制作方法 |
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CN107512698A CN107512698A (zh) | 2017-12-26 |
CN107512698B true CN107512698B (zh) | 2019-06-04 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108358160B (zh) * | 2018-04-18 | 2023-08-01 | 中国兵器工业集团第二一四研究所苏州研发中心 | 吊装式可释放应力的mems器件封装结构 |
CN109752604B (zh) * | 2019-01-30 | 2021-07-27 | 中国科学院电子学研究所 | 一种电场传感器的封装组件、封装方法及电场传感器 |
CN110143565A (zh) * | 2019-05-07 | 2019-08-20 | 清华大学 | 一种用于mems器件的封装应力隔离微结构 |
CN111422820B (zh) * | 2020-03-30 | 2023-07-25 | 歌尔微电子股份有限公司 | 传感器的封装结构及封装方法 |
US11702335B2 (en) | 2020-12-04 | 2023-07-18 | Analog Devices, Inc. | Low stress integrated device package |
Citations (5)
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CN102435776A (zh) * | 2011-10-20 | 2012-05-02 | 中北大学 | 单片集成八梁臂三轴加速度计 |
CN102482072A (zh) * | 2009-08-26 | 2012-05-30 | 飞思卡尔半导体公司 | 具有应力隔离的mems器件及其制造方法 |
CN103193198A (zh) * | 2013-04-22 | 2013-07-10 | 安徽北方芯动联科微系统技术有限公司 | 通过背面图形化降低mems芯片封装应力的方法 |
CN104817051A (zh) * | 2015-05-06 | 2015-08-05 | 歌尔声学股份有限公司 | 一种应力隔离的mems惯性传感器 |
CN105293419A (zh) * | 2015-10-15 | 2016-02-03 | 华东光电集成器件研究所 | 一种防止悬浮层刻蚀损伤的mems器件 |
Family Cites Families (1)
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US20140374912A1 (en) * | 2013-06-24 | 2014-12-25 | Palo Alto Research Center Incorporated | Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures |
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- 2017-08-16 CN CN201710702647.2A patent/CN107512698B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102482072A (zh) * | 2009-08-26 | 2012-05-30 | 飞思卡尔半导体公司 | 具有应力隔离的mems器件及其制造方法 |
CN102435776A (zh) * | 2011-10-20 | 2012-05-02 | 中北大学 | 单片集成八梁臂三轴加速度计 |
CN103193198A (zh) * | 2013-04-22 | 2013-07-10 | 安徽北方芯动联科微系统技术有限公司 | 通过背面图形化降低mems芯片封装应力的方法 |
CN104817051A (zh) * | 2015-05-06 | 2015-08-05 | 歌尔声学股份有限公司 | 一种应力隔离的mems惯性传感器 |
CN105293419A (zh) * | 2015-10-15 | 2016-02-03 | 华东光电集成器件研究所 | 一种防止悬浮层刻蚀损伤的mems器件 |
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Address after: 233040 No.10 Caiyuan Road, Bengbu City, Anhui Province Patentee after: Anhui North Microelectronics Research Institute Group Co.,Ltd. Address before: 233040 No.10 Caiyuan Road, Bengbu City, Anhui Province Patentee before: NORTH ELECTRON RESEARCH INSTITUTE ANHUI Co.,Ltd. |
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Correction item: Patentee Correct: NORTH ELECTRON RESEARCH INSTITUTE ANHUI Co.,Ltd. False: Anhui North Microelectronics Research Institute Group Co.,Ltd. Number: 11-02 Volume: 39 |
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