CN107505843B - Active thermal control optimization method for space optical payload - Google Patents
Active thermal control optimization method for space optical payload Download PDFInfo
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Abstract
The invention relates to an active thermal control optimization method of a space optical payload, belonging to the technical field of aerospace, based on the way that a first temperature acquisition circuit of a first heating zone and a second temperature acquisition circuit of a second heating zone are mutually crossed and backed up, when a backup sensor is needed to carry out thermal control on the first heating zone, the active thermal control is carried out on the first heating zone by using the temperature value of the second heating zone corresponding to a second temperature acquisition value acquired by the second temperature acquisition circuit, similarly, when the backup sensor is needed to carry out thermal control on the second heating zone, the active thermal control is carried out on the second heating zone by using the temperature value of the first heating zone corresponding to the first temperature acquisition value acquired by the first temperature acquisition circuit, the efficient and reliable active thermal control on the space optical payload is realized by the way of mutually crossed backup, and no additional sensor is added, low cost and easy realization.
Description
Technical Field
The invention relates to the technical field of aerospace, in particular to an active thermal control optimization method for a space optical payload.
Background
The space optical payload is subjected to alternate heating and cooling of the sun, the planet and the space low-temperature heat sink for a long time in the in-orbit operation process, so that the periodic high and low temperature drastic change of the surface of the space optical payload is caused, and the temperature change can seriously affect the imaging quality of the space optical payload. Therefore, to ensure the temperature stability of the space optical payload during the on-track period, the space optical payload needs to be temperature-controlled by adopting an active thermal control technology. At present, in order to improve the reliability of active thermal control, a method is usually adopted to perform redundant backup on temperature measuring points of a heating area in a manner of using a main sensor and a backup sensor, when the main sensor fails, the temperature is measured by using the backup sensor value, and the heating area is thermally controlled by using the backup sensor value. However, the method of performing redundant backup by using the main and standby sensors has the problems of a large number of sensors, and excessive occupied space resources and hardware resources, and is not favorable for miniaturization and integration of space optical payloads.
Disclosure of Invention
Based on this, it is necessary to provide an active thermal control optimization method for a space optical payload, aiming at the problems of the existing active thermal control technology that the number of sensors is large, and the occupied space resources and hardware resources are excessive.
In order to solve the problems, the invention adopts the following technical scheme:
a method of active thermal control optimization of a space optical payload, comprising the steps of:
acquiring a first temperature acquisition value of a first heating area on a space optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating area on the space optical payload acquired by a second temperature acquisition circuit, wherein the first temperature acquisition circuit and the second temperature acquisition circuit respectively acquire synchronous data of the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state;
respectively carrying out temperature conversion on the first temperature acquisition value and the second temperature acquisition value to obtain a corresponding first temperature value and a corresponding second temperature value;
performing linear function fitting or polynomial function fitting according to the first temperature value and the second temperature value to obtain a fitting function;
acquiring a current first temperature acquisition value of the first heating zone acquired by the first temperature acquisition circuit, performing temperature conversion on the current first temperature acquisition value to acquire a corresponding current first temperature value, calculating a corresponding current second temperature value according to the current first temperature value and the fitting function, and controlling the second heating zone to heat according to the current second temperature value,
or
And acquiring a current second temperature acquisition value of the second heating area acquired by the second temperature acquisition circuit, performing temperature conversion on the current second temperature acquisition value to acquire a corresponding current second temperature value, calculating a corresponding current first temperature value according to the current second temperature value and the fitting function, and controlling the first heating area to heat according to the current first temperature value.
Correspondingly, the invention also provides an active thermal control optimization system of the space optical payload, which comprises an acquisition module, a conversion module, a fitting module and a thermal control module,
the acquisition module is used for acquiring a first temperature acquisition value of a first heating area on a space optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating area on the space optical payload acquired by a second temperature acquisition circuit, and the first temperature acquisition circuit and the second temperature acquisition circuit respectively acquire synchronous data of the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state;
the conversion module is used for respectively carrying out temperature conversion on the first temperature acquisition value and the second temperature acquisition value to obtain a corresponding first temperature value and a corresponding second temperature value;
the fitting module is used for performing linear function fitting or polynomial function fitting according to the first temperature value and the second temperature value to obtain a fitting function;
the acquisition module acquires a current first temperature acquisition value of the first heating zone acquired by the first temperature acquisition circuit, the conversion module performs temperature conversion on the current first temperature acquisition value to obtain a corresponding current first temperature value, the thermal control module is used for calculating a corresponding current second temperature value according to the current first temperature value and the fitting function and controlling the second heating zone to heat according to the current second temperature value,
or
The acquisition module acquires a current second temperature acquisition value of the second heating area acquired by the second temperature acquisition circuit, the conversion module performs temperature conversion on the current second temperature acquisition value to obtain a corresponding current second temperature value, and the thermal control module is used for calculating a corresponding current first temperature value according to the current second temperature value and the fitting function and controlling the first heating area to heat according to the current first temperature value.
The active thermal control optimization method and the optimization system of the space optical payload are based on a mode that a first temperature acquisition circuit of a first heating area and a second temperature acquisition circuit of a second heating area are in cross backup with each other, when a backup sensor is needed to perform thermal control on the first heating area, the active thermal control is performed on the first heating area according to the temperature value of the second heating area corresponding to the second temperature acquisition value acquired by the second temperature acquisition circuit, and similarly, when the backup sensor is needed to perform thermal control on the second heating area, the active thermal control is performed on the second heating area according to the temperature value of the first heating area corresponding to the first temperature acquisition value acquired by the first temperature acquisition circuit The invention ensures the reliability of thermal control on the space optical payload without increasing the number of sensors, further saves space resources and hardware resources, has low cost and is easy to realize.
Drawings
FIG. 1 is a schematic flow chart of a method for active thermal control optimization of a space optics payload according to one embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a first temperature acquisition circuit and a second temperature acquisition circuit according to one embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an active thermal control optimization system for a space optical payload according to one embodiment of the present invention;
fig. 4 is a schematic structural diagram of an active thermal control optimization system for a spatial optical payload according to one embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
In one embodiment, as shown in fig. 1, the method for active thermal control optimization of a space optical payload comprises the following steps:
s100, acquiring a first temperature acquisition value of a first heating area on the space optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating area on the space optical payload acquired by a second temperature acquisition circuit, and respectively carrying out synchronous data acquisition on the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state by the first temperature acquisition circuit and the second temperature acquisition circuit;
s200, respectively carrying out temperature conversion on the first temperature acquisition value and the second temperature acquisition value to obtain a corresponding first temperature value and a corresponding second temperature value;
s300, performing curve fitting according to the first temperature value and the second temperature value to obtain a fitting function;
s400, acquiring a current first temperature acquisition value of a first heating zone acquired by a first temperature acquisition circuit, performing temperature conversion on the current first temperature acquisition value to obtain a corresponding current first temperature value, calculating a corresponding current second temperature value according to the current first temperature value and a fitting function, controlling the second heating zone to heat according to the current second temperature value,
or
And acquiring a current second temperature acquisition value of a second heating area acquired by a second temperature acquisition circuit, performing temperature conversion on the current second temperature acquisition value to acquire a corresponding current second temperature value, calculating a corresponding current first temperature value according to the current second temperature value and a fitting function, and controlling the heating of the first heating area according to the current first temperature value.
Space optical payloads refer to optical devices, such as satellites, that observe and study space or the earth outside the atmosphere. In order to ensure the temperature stability of the space optical payload during the on-track period, the active thermal control technology is adopted to control the temperature of the space optical payload, so that a heating zone is arranged on the space optical payload and is heated under the control of a corresponding system, the temperature change of the space optical payload is reduced, and the temperature stability of the space optical payload is kept. Specifically, the first temperature acquisition circuit and the second temperature acquisition circuit are respectively used for acquiring the temperatures of a first heating area and a second heating area on the space optical payload, and respectively obtaining a corresponding first temperature acquisition value and a corresponding second temperature acquisition value, and the first temperature acquisition circuit and the second temperature acquisition circuit respectively perform synchronous data acquisition on the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state, that is, the first temperature acquisition value acquired by the first temperature acquisition circuit and the second temperature acquisition value acquired by the second temperature acquisition circuit are in one-to-one correspondence, so as to achieve mutual temperature calibration of the first heating area and the second heating area, calibrate corresponding temperature values of the first temperature acquisition circuit and the second temperature acquisition circuit in a temperature measurement range under the same temperature environment condition, and in step S100, the first temperature acquisition value and the second temperature acquisition value of the first heating area acquired by the first temperature acquisition circuit are obtained And a second temperature acquisition value of a second heating area acquired by the circuit.
After the first temperature collection value and the second temperature collection value are obtained, in step S200, the first temperature collection value and the second temperature collection value are respectively subjected to temperature conversion to obtain a corresponding first temperature value and a corresponding second temperature value. Because the temperature acquisition circuit utilizes the characteristics of temperature sensing elements such as thermistors to realize the change of output voltage, the temperature acquisition circuit cannot directly acquire or output the temperature value of a measured object, and therefore, in the step, a first temperature acquisition value and a second temperature acquisition value acquired by the first temperature acquisition circuit and the second temperature acquisition circuit are respectively converted into a corresponding first temperature value and a corresponding second temperature value, so that a data sample is provided for the determination of a fitting function.
In step S300, curve fitting is performed on the first temperature value and the second temperature value obtained after the temperature conversion, so as to obtain a fitting function. Curve fitting refers to a process of finding a mathematically describable curve (or function) according to measurement data, and when curve fitting is performed on a first temperature value and a second temperature value in this step, linear fitting or nonlinear fitting is performed according to the first temperature value and the second temperature value, for example, linear function fitting or polynomial function fitting is performed with the first temperature value as an x-axis, the second temperature value as a y-axis, or the first temperature value as a y-axis, so as to determine a fitting function, which can represent a relationship between two variables, namely the first temperature value and the second temperature value, so that when a numerical value of any one variable is known, a numerical value corresponding to the other variable can be determined according to the fitting function.
Finally, in step S400, when the second temperature acquisition circuit fails and active thermal control needs to be performed on the second heating area by using backup sensor data, at this time, the current temperature of the second heating area is determined according to the current temperature of the first heating area, so that active thermal control is performed on the second heating area according to the current temperature of the second heating area, specifically, a current first temperature acquisition value of the first heating area acquired by the first temperature acquisition circuit is obtained, a current first temperature value of the corresponding first heating area is obtained after temperature conversion is performed on the current first temperature acquisition value, a current second temperature value of the second heating area is calculated according to the current first temperature value and the obtained fitting function, and the second heating area is controlled to be heated according to the current second temperature value, so that active thermal control on the second heating area is achieved; similarly, when the first temperature acquisition circuit fails and active thermal control needs to be performed on the first heating area by using backup sensor data, the current temperature of the first heating area is determined according to the current temperature of the second heating area, so that active thermal control is performed on the first heating area according to the current temperature of the first heating area, specifically, a current second temperature acquisition value of the second heating area acquired by the second temperature acquisition circuit is obtained, after temperature conversion is performed on the current second temperature acquisition value, a corresponding current second temperature value of the second heating area is obtained, a current first temperature value of the first heating area is calculated according to the current second temperature value and the obtained fitting function, and the first heating area is controlled according to the current first temperature value to perform active thermal control on the first heating area.
The active thermal control optimization method for the space optical payload provided by this embodiment is based on a way that a first temperature acquisition circuit of a first heating area and a second temperature acquisition circuit of a second heating area are in cross backup with each other, when a backup sensor is needed to perform thermal control on the first heating area, active thermal control is performed on the first heating area by using a temperature value of the second heating area corresponding to a second temperature acquisition value acquired by the second temperature acquisition circuit, and similarly, when a backup sensor is needed to perform thermal control on the second heating area, active thermal control is performed on the second heating area by using a temperature value of the first heating area corresponding to the first temperature acquisition value acquired by the first temperature acquisition circuit, and by the way of the cross backup with each other, not only efficient and reliable active thermal control on the space optical payload can be realized, but also no additional sensor is added, the problems of large quantity of sensors, occupation of space resources and excessive hardware resources caused by increasing the quantity of the sensors to improve the reliability of active thermal control are solved, the reliability of thermal control on the space optical payload is guaranteed while the quantity of the sensors is not increased, the space resources and the hardware resources are further saved, and the method is low in cost and easy to realize.
As a specific implementation manner, when curve fitting is performed according to the first temperature value and the second temperature value, linear function fitting or polynomial function fitting is performed according to the first temperature value and the second temperature value, so as to obtain a fitting function. The linear function fitting has the advantages of simplicity and high efficiency, the polynomial function fitting is higher in accuracy, and when curve fitting is carried out according to the first temperature value and the second temperature value, the linear function fitting or the polynomial function fitting can be determined to be carried out on the first temperature value and the second temperature value according to actual conditions, so that the efficiency and the applicability of the curve fitting are improved.
To further illustrate the process of curve fitting in the present embodiment, a method for curve fitting according to the first temperature value and the second temperature value in the present embodiment is described in detail below by taking linear function fitting as an example. For the polynomial function fitting, a least square method in the art and the like can be adopted.
(1) The active thermal control depends on the temperature collected by the temperature collecting circuit in real time, the temperature is calibrated mutually when the first heating area and the second heating area are heated under different vacuum temperature conditions, the temperature values corresponding to the first temperature collecting circuit and the second temperature collecting circuit under the same temperature environment condition are calibrated, and the first temperature collecting value of the first heating area X collected by the first temperature collecting circuit M is assumed to be M1,m2,…,mnThe second temperature acquisition value of the second heating area Y acquired by the second temperature acquisition circuit N is s1,s2,…,snWherein N is the collection times of the first temperature collection circuit M and the second temperature collection circuit N;
(2) collecting a value m for the first temperature1,m2,…,mnAnd a second temperature acquisition value s1,s2,…,snCarrying out temperature conversion to obtain a corresponding first temperature value X1,X2,…,XnAnd a second temperature value Y1,Y2,…,YnFitting formulas (1) and (2) according to a linear function, and calculating to obtain values of a coefficient a and a coefficient b;
(3) during on-orbit active thermal control, when the second heating area Y adopts the backup sensor value to perform thermal control, the current first temperature acquisition value M of the first heating area X acquired by the first temperature acquisition circuit M is usedtFor reference, the current first temperature acquisition value mtThe corresponding current first temperature value is XtThe current temperature of the second heating zone Y is the current second temperature value YtCalculated according to the linear function formula (3), and further calculated according to the calculated current second temperature value YtControlling the temperature of the second heating area Y;
Y＝aX+b (3)
similarly, when the first heating zone X is thermally controlled using the backup sensor value, the current second temperature acquisition value s of the second heating zone Y acquired by the second temperature acquisition circuit N is usedtFor reference, the current second temperature acquisition value stThe corresponding current second temperature value is YtThe current temperature of the first heating area X is the current first temperature value XtCalculated according to the formula (4), and then the calculated current first temperature value XtThe temperature of the first heating zone X is controlled.
As a specific implementation manner, the first temperature acquisition circuit includes a first temperature measurement sensor disposed on the first heating area, the second temperature acquisition circuit includes a second temperature measurement sensor disposed on the second heating area, and both the first temperature measurement sensor and the second temperature measurement sensor are MF501 thermistors. As shown in fig. 2, in this embodiment, the first temperature acquisition circuit includes a first temperature sensor and a processing circuit, wherein the first temperature sensor is disposed on the first heating area, the processing circuit is configured to output a corresponding digital signal according to a change of a resistance of the first temperature sensor to obtain a corresponding first temperature acquisition value, similarly, the second temperature acquisition circuit includes a second temperature sensor and a processing circuit, wherein the second temperature sensor is disposed on the second heating area, the processing circuit is configured to output a corresponding digital signal according to a change of a resistance of the second temperature sensor to obtain a corresponding second temperature acquisition value, and the first temperature sensor and the second temperature sensor are both MF501 type thermistors. The MF501 thermistor is a typical thermistor for aerospace thermal tests, has the advantages of high sensitivity, small volume, short response time and the like, and is used as a temperature measuring sensor of the first temperature acquisition circuit and the second temperature acquisition circuit, so that the accuracy of the temperature acquisition circuits is improved. In fig. 2, the dashed arrows indicate that when the first heating area or the second heating area is controlled by using the backup sensor value, the corresponding active thermal control is performed by using the second temperature acquisition value acquired by the corresponding second temperature acquisition circuit and the first temperature acquisition circuit and the temperature corresponding to the first temperature acquisition value as the reference temperature.
Accordingly, in another embodiment of the present invention, an active thermal control optimization system for a spatial optical payload is provided, as shown in fig. 3, the system includes an obtaining module 100, a converting module 200, a fitting module 300, and a thermal control module 400, wherein the obtaining module 100 is configured to obtain a first temperature acquisition value of a first heating zone on the spatial optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating zone on the spatial optical payload acquired by a second temperature acquisition circuit, and the first temperature acquisition circuit and the second temperature acquisition circuit perform synchronous data acquisition on the first heating zone and the second heating zone respectively when the first heating zone and the second heating zone are simultaneously in a vacuum heating state; the conversion module 200 is configured to perform temperature conversion on the first temperature acquisition value and the second temperature acquisition value respectively to obtain a corresponding first temperature value and a corresponding second temperature value; the fitting module 300 is configured to perform curve fitting according to the first temperature value and the second temperature value to obtain a fitting function; the obtaining module 100 obtains a current first temperature collecting value of a first heating zone collected by the first temperature collecting circuit, the converting module 200 performs temperature conversion on the current first temperature collecting value to obtain a corresponding current first temperature value, the thermal control module 400 is configured to calculate a corresponding current second temperature value according to the current first temperature value and the fitting function and control the second heating zone to heat according to the current second temperature value, or the obtaining module 100 obtains a current second temperature collecting value of the second heating zone collected by the second temperature collecting circuit, the converting module 200 performs temperature conversion on the current second temperature collecting value to obtain a corresponding current second temperature value, and the thermal control module 400 is configured to calculate a corresponding current first temperature value according to the current second temperature value and the fitting function and control the first heating zone to heat according to the current first temperature value.
Space optical payloads refer to optical devices, such as satellites, that observe and study space or the earth outside the atmosphere. In order to ensure the temperature stability of the space optical payload during the on-track period, the active thermal control technology is adopted to control the temperature of the space optical payload, so that a heating zone is arranged on the space optical payload and is heated under the control of a corresponding system, the temperature change of the space optical payload is reduced, and the temperature stability of the space optical payload is kept. Specifically, the first temperature acquisition circuit and the second temperature acquisition circuit are respectively used for acquiring the temperatures of a first heating area and a second heating area on the space optical payload, and respectively obtain a corresponding first temperature acquisition value and a corresponding second temperature acquisition value, and the first temperature acquisition circuit and the second temperature acquisition circuit respectively perform synchronous data acquisition on the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state, that is, the first temperature acquisition value acquired by the first temperature acquisition circuit and the second temperature acquisition value acquired by the second temperature acquisition circuit are in one-to-one correspondence, so as to achieve mutual temperature calibration of the first heating area and the second heating area, calibrate corresponding temperature values of the first temperature acquisition circuit and the second temperature acquisition circuit in a temperature measurement range under the same temperature environment condition, and the acquisition module 100 acquires the first temperature acquisition value and the second temperature acquisition value of the first heating area acquired by the first temperature acquisition circuit And acquiring a second temperature acquisition value of a second heating area.
After the obtaining module 100 obtains the first temperature collecting value and the second temperature collecting value, the converting module 200 respectively performs temperature conversion on the obtained first temperature collecting value and the obtained second temperature collecting value to obtain a corresponding first temperature value and a corresponding second temperature value. Because the temperature acquisition circuit utilizes the characteristics of temperature sensing elements such as thermistors to realize the change of output voltage, and the temperature acquisition circuit cannot directly acquire or output the temperature value of a measured object, the conversion module 200 needs to convert the first temperature acquisition value and the second temperature acquisition value acquired by the first temperature acquisition circuit and the second temperature acquisition circuit into the corresponding first temperature value and second temperature value respectively, so as to provide a data sample for the determination of the fitting function.
The fitting module 300 performs curve fitting on the first temperature value and the second temperature value obtained after the temperature conversion to obtain a fitting function. The curve fitting refers to a process of finding a mathematically describable curve (or function) according to the measurement data, when the fitting module 300 performs curve fitting on the first temperature value and the second temperature value, the fitting module performs linear fitting or nonlinear fitting, for example, linear function fitting or polynomial function fitting, on the first temperature value and the second temperature value, with the first temperature value as an x axis, the second temperature value as a y axis, and the first temperature value as a y axis, according to the first temperature value and the second temperature value, so as to determine a fitting function, where the fitting function can represent a relationship between the two variables, i.e., the first temperature value and the second temperature value, so that when the value of any one variable is known, the value corresponding to the other variable can be determined according to the fitting function.
When the second temperature acquisition circuit fails and the thermal control module 400 needs to actively control the second heating area by using the backup sensor data, the thermal control module 400 now determines the current temperature of the second heating zone based on the current temperature of the first heating zone, therefore, the second heating area is actively controlled according to the current temperature of the second heating area, specifically, after the obtaining module 100 obtains the current first temperature collecting value of the first heating area collected by the first temperature collecting circuit, the conversion module 200 performs temperature conversion on the current first temperature acquisition value to obtain a current first temperature value of the corresponding first heating zone, the thermal control module 400 calculates a current second temperature value of the second heating zone according to the current first temperature value and the obtained fitting function, the second heating area is controlled to heat according to the current second temperature value, so that active thermal control on the second heating area is realized; similarly, when the first temperature acquisition circuit fails, the thermal control module 400 needs to actively thermally control the first heating zone using the backup sensor data, the thermal control module 400 now determines the current temperature of the first heating zone based on the current temperature of the second heating zone, therefore, the active thermal control is performed on the first heating area according to the current temperature of the first heating area, specifically, after the obtaining module 100 obtains the current second temperature collecting value of the second heating area collected by the second temperature collecting circuit, the conversion module 200 performs temperature conversion on the current second temperature acquisition value to obtain a current second temperature value of the corresponding second heating zone, the thermal control module 400 calculates a current first temperature value of the first heating zone according to the current second temperature value and the obtained fitting function, and controlling the first heating area to heat according to the current first temperature value, thereby realizing the active thermal control of the first heating area.
The active thermal control optimization system for the space optical payload provided in this embodiment is based on a manner that a first temperature acquisition circuit of a first heating area and a second temperature acquisition circuit of a second heating area are in cross backup with each other, when the thermal control module 400 needs to use a backup sensor to perform thermal control on the first heating area, the thermal control module 400 performs active thermal control on the first heating area according to a temperature value of the second heating area corresponding to a second temperature acquisition value acquired by the second temperature acquisition circuit, and similarly, when the thermal control module 400 needs to use the backup sensor to perform thermal control on the second heating area, the thermal control module 400 performs active thermal control on the second heating area according to a temperature value of the first heating area corresponding to the first temperature acquisition value acquired by the first temperature acquisition circuit, and by the manner of cross backup with each other, not only can the space optical payload be actively and reliably controlled, and extra sensors can not be added, so that the problems of large number of sensors, occupation of space resources and excessive hardware resources caused by improving the reliability of active thermal control by increasing the number of the sensors are solved.
As a specific implementation manner, when the fitting module performs curve fitting according to the first temperature value and the second temperature value, the fitting module performs linear function fitting or polynomial function fitting according to the first temperature value and the second temperature value to obtain a fitting function. The linear function fitting has the advantages of simplicity and high efficiency, the polynomial function fitting is higher in accuracy, and when the fitting module in the embodiment performs curve fitting according to the first temperature value and the second temperature value, the linear function fitting or the polynomial function fitting can be determined to be performed on the first temperature value and the second temperature value according to actual conditions, so that the efficiency and the applicability of the curve fitting are improved.
As a specific implementation manner, the first temperature acquisition circuit includes a first temperature measurement sensor disposed on the first heating area, the second temperature acquisition circuit includes a second temperature measurement sensor disposed on the second heating area, and both the first temperature measurement sensor and the second temperature measurement sensor are MF501 thermistors. As shown in fig. 2, in this embodiment, the first temperature acquisition circuit includes a first temperature sensor and a processing circuit, wherein the first temperature sensor is disposed on the first heating area, the processing circuit is configured to output a corresponding digital signal according to a change of a resistance of the first temperature sensor to obtain a corresponding first temperature acquisition value, similarly, the second temperature acquisition circuit includes a second temperature sensor and a processing circuit, wherein the second temperature sensor is disposed on the second heating area, the processing circuit is configured to output a corresponding digital signal according to a change of a resistance of the second temperature sensor to obtain a corresponding second temperature acquisition value, and the first temperature sensor and the second temperature sensor are both MF501 type thermistors. The MF501 thermistor is a typical thermistor for aerospace thermal tests, has the advantages of high sensitivity, small volume, short response time and the like, and is used as a temperature measuring sensor of the first temperature acquisition circuit and the second temperature acquisition circuit, so that the accuracy of the temperature acquisition circuits is improved. In fig. 2, the dashed arrows indicate that when the first heating area or the second heating area is controlled by using the backup sensor value, the corresponding active thermal control is performed by using the second temperature acquisition value acquired by the corresponding second temperature acquisition circuit and the first temperature acquisition circuit and the temperature corresponding to the first temperature acquisition value as the reference temperature.
As a specific implementation manner, as shown in fig. 4, the first temperature acquisition circuit and the second temperature acquisition circuit convert analog signals acquired by the first temperature measurement sensor and the second temperature measurement sensor into digital signals through a TLV2548 analog-to-digital converter, so as to obtain a first temperature acquisition value and a second temperature acquisition value. The TLV2548 analog-to-digital converter is a group of high-performance 12-bit low-power/high-speed (3.6 μ s) CMOS analog-to-digital converters produced by TI corporation, and has the advantages of high precision, small volume, multiple channels, flexible use, etc., and has a sample-and-hold function, and at the same time, 3 input terminals and a tri-state output terminal, which can provide a 4-wire interface for a Serial Port (SPI) of a microprocessor, and when the TLV2548 analog-to-digital converter is connected with a DSP, a frame synchronization signal (FS) can be used to indicate the start of a serial data frame. The TLV2548 analog-to-digital converter has very low power consumption when working, and the low power consumption characteristics are further enhanced by a software/hardware/automatic shutdown mode and a programmable switching speed, and simultaneously, the TLV2548 analog-to-digital converter also has a built-in switching clock (OSC) and a voltage reference, can adopt an external SCLK as a switching clock source to obtain higher switching speed (up to 3.6 mu s in the case of an SCLK with 20 MHz), and has two different internal reference voltages for selection.
As a specific embodiment, as shown in fig. 4, the thermal control module is a controller based on the DSP5416, and has the characteristics of high processing speed, high reliability, and the like.
The effectiveness of the active thermal control optimization system for space optical payloads provided by the present invention is verified with specific experimental data.
(1) Under the vacuum condition, the first heating area and the second heating area are both in a heating state, an MF501 type thermistor is used as a temperature measuring sensor of the first heating area and the second heating area, a TLV2548 analog-to-digital converter performs analog-to-digital conversion on the value of the temperature measuring sensor, and the acquisition value converted by the TLV2548 analog-to-digital converter is read through a synchronous serial port McBsp0 port of the DSP5416 to obtain a first temperature acquisition value corresponding to the first heating area and a second temperature acquisition value corresponding to the second heating area, as shown in Table 1;
(2) respectively converting the first temperature acquisition value and the second temperature acquisition value into corresponding first temperature value and second temperature value according to formulas (5) to (7),
V＝HEX2DEC(M) (5)
the function HEX2DEC is configured to convert 16-ary data into 10-ary data, M is an acquisition value converted by a TLV2548 analog-to-digital converter, V is decimal data corresponding to M, R is a resistance value of the MF501 thermistor, formula (7) is a temperature conversion formula of the MF501 thermistor, Y is a temperature value after temperature conversion, and a, b, and c are conversion coefficients, where a is-6.01188, b is 4622.53337, and c is-86421.72414, and temperature values obtained after temperature conversion are shown in table 2;
TABLE 1
TABLE 2
(3) Calculating coefficients a and b by using the formulas (1) and (2):
a＝0.979362，b＝1.036936
as can be seen from equations (3) and (4):
Y＝0.979362X+1.036936 (8)
X＝(Y-1.036936)/0.979362 (9)
and during rail temperature control, when the second heating area adopts the backup sensor value to carry out thermal control, the first temperature measuring sensor of the first heating area is used as a reference, if the current first temperature value of the first heating area measured by the first temperature measuring sensor is 15.00 ℃, the current second temperature value of the second heating area is calculated by using a formula (8), the calculation result is 15.73 ℃, and the thermal control module controls the second heating area to carry out heating according to the current second temperature value of 15.73 ℃. Similarly, when the first heating zone adopts the backup sensor value to perform thermal control, the second temperature measurement sensor of the second heating zone is used as a reference, and if the second temperature measurement sensor measures that the current second temperature value of the second heating zone is 15.00 ℃, the current first temperature value of the first heating zone is calculated by using the formula (9), and the calculation result is 14.26 ℃, and the thermal control module controls the first heating zone to perform heating according to the current first temperature value of 14.26 ℃.
From the verification process, the active thermal control optimization system for the space optical payload is a thermal control system using temperature measurement sensors with different heating areas for cross backup, can realize efficient and reliable active thermal control on the space optical payload, does not increase additional sensors, avoids the problems of large number of sensors, occupation of space resources and excessive hardware resources caused by improving the reliability of the active thermal control by increasing the number of the sensors, reduces the cost and is easy to realize.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A method for active thermal control optimization of a space optical payload, comprising the steps of:
acquiring a first temperature acquisition value of a first heating area on a space optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating area on the space optical payload acquired by a second temperature acquisition circuit, wherein the first temperature acquisition circuit and the second temperature acquisition circuit respectively acquire synchronous data of the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state;
respectively carrying out temperature conversion on the first temperature acquisition value and the second temperature acquisition value to obtain a corresponding first temperature value and a corresponding second temperature value;
performing linear function fitting or polynomial function fitting according to the first temperature value and the second temperature value to obtain a fitting function;
acquiring a current first temperature acquisition value of the first heating zone acquired by the first temperature acquisition circuit, performing temperature conversion on the current first temperature acquisition value to acquire a corresponding current first temperature value, calculating a corresponding current second temperature value according to the current first temperature value and the fitting function, and controlling the second heating zone to heat according to the current second temperature value,
or
And acquiring a current second temperature acquisition value of the second heating area acquired by the second temperature acquisition circuit, performing temperature conversion on the current second temperature acquisition value to acquire a corresponding current second temperature value, calculating a corresponding current first temperature value according to the current second temperature value and the fitting function, and controlling the first heating area to heat according to the current first temperature value.
2. The method for active thermal control optimization of a space optical payload of claim 1,
the first temperature acquisition circuit comprises a first temperature measurement sensor arranged on the first heating area, the second temperature acquisition circuit comprises a second temperature measurement sensor arranged on the second heating area, and the first temperature measurement sensor and the second temperature measurement sensor are both MF501 type thermistors.
3. An active thermal control optimization system for a spatial optical payload, comprising an acquisition module, a transformation module, a fitting module and a thermal control module,
the acquisition module is used for acquiring a first temperature acquisition value of a first heating area on a space optical payload acquired by a first temperature acquisition circuit and a second temperature acquisition value of a second heating area on the space optical payload acquired by a second temperature acquisition circuit, and the first temperature acquisition circuit and the second temperature acquisition circuit respectively acquire synchronous data of the first heating area and the second heating area when the first heating area and the second heating area are simultaneously in a vacuum heating state;
the conversion module is used for respectively carrying out temperature conversion on the first temperature acquisition value and the second temperature acquisition value to obtain a corresponding first temperature value and a corresponding second temperature value;
the fitting module is used for performing linear function fitting or polynomial function fitting according to the first temperature value and the second temperature value to obtain a fitting function;
the acquisition module acquires a current first temperature acquisition value of the first heating zone acquired by the first temperature acquisition circuit, the conversion module performs temperature conversion on the current first temperature acquisition value to obtain a corresponding current first temperature value, the thermal control module is used for calculating a corresponding current second temperature value according to the current first temperature value and the fitting function and controlling the second heating zone to heat according to the current second temperature value,
or
The acquisition module acquires a current second temperature acquisition value of the second heating area acquired by the second temperature acquisition circuit, the conversion module performs temperature conversion on the current second temperature acquisition value to obtain a corresponding current second temperature value, and the thermal control module is used for calculating a corresponding current first temperature value according to the current second temperature value and the fitting function and controlling the first heating area to heat according to the current first temperature value.
4. The active thermal control optimization system for space optical payloads of claim 3,
the first temperature acquisition circuit comprises a first temperature measurement sensor arranged on the first heating area, the second temperature acquisition circuit comprises a second temperature measurement sensor arranged on the second heating area, and the first temperature measurement sensor and the second temperature measurement sensor are both MF501 type thermistors.
5. The active thermal control optimization system for space optical payloads of claim 4,
the first temperature acquisition circuit and the second temperature acquisition circuit convert analog signals acquired by the first temperature measurement sensor and the second temperature measurement sensor into digital signals through TLV2548 analog-to-digital converters to obtain the first temperature acquisition value and the second temperature acquisition value.
6. The active thermal control optimization system for space optical payloads of claim 3,
the thermal control module is a DSP5416 based controller.
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