CN107484101A - A kind of earphone processing technology - Google Patents
A kind of earphone processing technology Download PDFInfo
- Publication number
- CN107484101A CN107484101A CN201710799797.XA CN201710799797A CN107484101A CN 107484101 A CN107484101 A CN 107484101A CN 201710799797 A CN201710799797 A CN 201710799797A CN 107484101 A CN107484101 A CN 107484101A
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- China
- Prior art keywords
- earphone
- poles
- pcb board
- welding
- separated time
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention discloses a kind of earphone processing technology, comprise the following steps：S1：The welding of connector and transition part pcb board；S2：The welding of earphone cord and each part；S3：Each connecting portion injection of earphone cord；S4：Shell assembles.The present invention disclosure satisfy that the special process requirements of earphone, and the earphone for making to produce has more preferable pull resistance, prevent that earphone from being pulled bad, and processing technology science, rationally, by increasing capacitance it is possible to increase the product quality of earphone, improve production efficiency.
Description
Technical field
The invention belongs to earphone production field, more particularly it relates to a kind of earphone processing technology.
Background technology
With the development of personal communication devices, large high-definition screen, high-fidelity audio etc. wording have allowed mobile phone, tablet personal computer
Become the multi-medium intelligent terminal that we carry with Deng electronic product.Selection is put on earphone and used when more people go out
The electronic product carried with plays music, enjoys personal music space.And people are outside special for the profile of earphone, texture etc.
Sign and the tonequality of earphone, sound style etc. have different demands, and the earphone cord of existing earphone institute band makes according to its difference
Lead core with what demand needed to use varying number, if simply it is simple be used for listening to if, earphone only needs to connect the two of loudspeaker
Core conductor, if if needing to allow earphone to possess sound control function on the basis of listening to, then needed to use with four cores
The earphone of conductor, use of the existing Headphone structure to four core conductors are all to be wrapped in shape in an external protection together using four cores
Into earphone, if necessary to do transparency process to earphone outer layer, quad intolerant to see, it is in disorder, and quad is fabricated to earphone
Cost is high, manufacture is inconvenient；Because sound control is all unilateral, will result in Headphone structure is two cores, while be four cores, left
The outward appearance of right two earphones is inconsistent, and the line footpath of four core Headphone structures is thicker, and ear can be uncomfortable when user wears.And pass
The earphone of system is formed using some enamel-covered wires mostly, and the Conductor Impedance of this enamel-covered wire is big, and the transmission to sound, which exists, loses
Situation, the existing earphone cord such as true are easier to be torn, it is therefore desirable to have a kind of earphone production technology to can solve the problem that to produce
State the earphone of problem.
The content of the invention
The present invention proposes a kind of earphone processing technology, and the manufacturing process makes the earphone produced, possesses good tension
Property, fastness and appearance property.
The technical solution adopted in the present invention is：
A kind of earphone processing technology, comprises the following steps：
S1：The welding of connector and transition part pcb board, will be corresponding on corresponding connector and transition part pcb board
Conductive contact blade is welded；
S2：The welding of earphone cord and each part, the step include following：
S201：The welding of earphone main line and headset plug, four conductors on earphone main line are welded to earphone and inserted
L poles, R poles, G poles and M poles on head；
S202：The welding of earphone main line and joint portion pcb board, the other end of four conductors of earphone main line are accordingly distinguished
L poles, R poles, G poles and the M poles being welded on the pcb board of joint portion；
S203：The welding of the left separated time of earphone and earphone sound control portion pcb board, by the inside of two coaxial configuration earphone cords of hypomere
Conductor is welded to the M poles of earphone sound control portion pcb board and L poles, external conductor are welded to G poles on earphone sound control portion pcb board；
The rump electron line of epimere two is welded to the G poles and L poles of earphone sound control portion pcb board；
S204：The welding of earphone separated time and joint portion pcb board, including the welding of the right separated time of earphone and joint portion pcb board with
And the welding of the left separated time of earphone and joint portion pcb board：
S2041：The welding of the right separated time of earphone and joint portion pcb board, 2 core conductors of the right separated time lower end of earphone are welded to
The R poles and G poles of joint portion pcb board；
S2042：The welding of the left separated time of earphone and joint portion pcb board, two coaxial configuration earphones of the left separated time lower end of earphone
The inner conductor of line is welded to the L poles of joint portion pcb board and M poles, external conductor are welded to the G poles of joint portion pcb board；
S205：The welding of earphone separated time and transition part pcb board, including the welding of the right separated time of earphone and transition part pcb board with
And the welding of the left separated time of earphone and transition part pcb board：
S2051：The welding of the right separated time of earphone and transition part pcb board, 2 core conductors of the right separated time upper end of earphone are welded to
The R/L poles and G poles of transition part pcb board；
S2052：The welding of the left separated time of earphone and transition part pcb board, 2 core conductors of the left separated time upper end of earphone are welded to
The R/L poles and G poles of transition part pcb board；
S3：Each connecting portion injection of earphone cord, to the weld part of connector weldability position, separated time position and headset plug
Position carries out injection molding；
S4：Shell assembles：Headset plug shell is assembled, and headset plug protective case made from metal material is fixed；Separated time
The assembling of portion's shell and connecting portion shell.
Further, in the S1, welded using welding equipment, the operating temperature of welding equipment is 260 DEG C~330
DEG C, weld interval is 1 second~10 seconds.
Further, in the S2, welded using welding equipment, the operating temperature of welding equipment is 260 DEG C~330
DEG C, weld interval is 1 second~10 seconds.
Further, in the S3, used material is polypropylene during injection, and material melts temperature is 200~240
DEG C, it is 3~20 seconds to project the time.
Further, in the S4, the fixed form of the headset plug shell be using instant glue hydropexis, it is described
Material used in separated time portion shell and the connecting portion shell is that clear polycarbonate or acrylonitrile-butadiene-styrene (ABS) are total to
Polymers, its fixed form are using ultrasonic fusing, and welding pressure is 100~500KPa, and the time is 0.1~0.5 second, and frequency is
20KHz。
After adopting the above technical scheme, the present invention disclosure satisfy that the special process requirements of earphone, make the earphone produced
With more preferable pull resistance, prevent that earphone from being pulled bad, and processing technology science, rationally, by increasing capacitance it is possible to increase the product quality of earphone,
Improve production efficiency.
Brief description of the drawings
Fig. 1 is a kind of schematic flow sheet of earphone processing technology of the present invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.Following examples are only used for more clear
Illustrate to Chu technical scheme, and can not be limited the scope of the invention with this.
A kind of earphone processing technology, process chart is as shown in figure 1, comprise the steps of：
S1：The welding of connector and transition part pcb board, will be corresponding on corresponding connector and transition part pcb board
Conductive contact blade is welded, and is welded using welding equipment, and the operating temperature of welding equipment is 260 DEG C~330 DEG C, during welding
Between be 1 second~10 seconds；
S2：The welding of earphone cord and each part, in S2, is welded, the work temperature of welding equipment using welding equipment
Spend for 260 DEG C~330 DEG C, weld interval is 1 second~10 seconds, and the step includes following：
S201：The welding of earphone main line and headset plug, four conductors on earphone main line are welded to earphone and inserted
L poles, R poles, G poles and M poles on head；
S202：The welding of earphone main line and joint portion pcb board, the other end of four conductors of earphone main line are accordingly distinguished
L poles, R poles, G poles and the M poles being welded on the pcb board of joint portion；
S203：The welding of the left separated time of earphone and earphone sound control portion pcb board, by the inside of two coaxial configuration earphone cords of hypomere
Conductor is welded to the M poles of earphone sound control portion pcb board and L poles, external conductor are welded to G poles on earphone sound control portion pcb board；
The rump electron line of epimere two is welded to the G poles and L poles of earphone sound control portion pcb board；
S204：The welding of earphone separated time and joint portion pcb board, including the welding of the right separated time of earphone and joint portion pcb board with
And the welding of the left separated time of earphone and joint portion pcb board：
S2041：The welding of the right separated time of earphone and joint portion pcb board, 2 core conductors of the right separated time lower end of earphone are welded to
The R poles and G poles of joint portion pcb board；
S2042：The welding of the left separated time of earphone and joint portion pcb board, two coaxial configuration earphones of the left separated time lower end of earphone
The inner conductor of line is welded to the L poles of joint portion pcb board and M poles, external conductor are welded to the G poles of joint portion pcb board；
S205：The welding of earphone separated time and transition part pcb board, including the welding of the right separated time of earphone and transition part pcb board with
And the welding of the left separated time of earphone and transition part pcb board：
S2051：The welding of the right separated time of earphone and transition part pcb board, 2 core conductors of the right separated time upper end of earphone are welded to
The R/L poles and G poles of transition part pcb board；
S2052：The welding of the left separated time of earphone and transition part pcb board, 2 core conductors of the left separated time upper end of earphone are welded to
The R/L poles and G poles of transition part pcb board；
S3：Each connecting portion injection of earphone cord, to the weld part of connector weldability position, separated time position and headset plug
Position carries out injection molding, and the purpose being molded is to strengthen fastness while preventing welding position from aoxidizing, and is adopted during injection
Material is polypropylene, and material melts temperature is 200~240 DEG C, and it is 3~20 seconds to project the time；
S4：Shell assembles：Headset plug shell is assembled, and headset plug protective case made from metal material is fixed, fixed
Mode uses instant glue hydropexis；The assembling of separated time portion shell and connecting portion shell, separated time portion shell and connecting portion shell are made
Material is clear polycarbonate, acrylonitrile-butadiene-styrene copolymer etc., and its fixed form is to be melted using ultrasonic wave
Connect, welding pressure is 100~500KPa, and the time is 0.1~0.5 second, frequency 20KHz.
Employ above-mentioned technique and production is processed to earphone, disclosure satisfy that the special process requirements of earphone, make to produce
Come earphone there is more preferable pull resistance, prevent that earphone from being pulled bad, and processing technology science, rationally, by increasing capacitance it is possible to increase earphone
Product quality, improve production efficiency.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention,
Although the present invention is described in detail with reference to the foregoing embodiments, for those skilled in the art, it still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic.
Within the spirit and principles of the invention, any modification, equivalent substitution and improvements made etc., it should be included in the present invention's
Within protection domain.
Claims (5)
1. a kind of earphone processing technology, it is characterised in that comprise the following steps：
S1：The welding of connector and transition part pcb board, by conduction corresponding on corresponding connector and transition part pcb board
Contact is welded；
S2：The welding of earphone cord and each part, the step include following：
S201：The welding of earphone main line and headset plug, four conductors on earphone main line are welded on headset plug
L poles, R poles, G poles and M poles；
S202：The welding of earphone main line and joint portion pcb board, the other end of four conductors of earphone main line are accordingly respectively welded
L poles, R poles, G poles and M poles on to joint portion pcb board；
S203：The welding of the left separated time of earphone and earphone sound control portion pcb board, by the inner conductor of two coaxial configuration earphone cords of hypomere
It is welded to the M poles of earphone sound control portion pcb board and L poles, external conductor is welded to G poles on earphone sound control portion pcb board；Will be upper
Two rump electron lines of section are welded to the G poles and L poles of earphone sound control portion pcb board；
S204：The welding of earphone separated time and joint portion pcb board, include welding and the ear of the right separated time of earphone and joint portion pcb board
The welding of the left separated time of machine and joint portion pcb board：
S2041：The welding of the right separated time of earphone and joint portion pcb board, 2 core conductors of the right separated time lower end of earphone are welded to combination
The R poles and G poles of portion's pcb board；
S2042：The welding of the left separated time of earphone and joint portion pcb board, two coaxial configuration earphone cords of the left separated time lower end of earphone
Inner conductor is welded to the L poles of joint portion pcb board and M poles, external conductor are welded to the G poles of joint portion pcb board；
S205：The welding of earphone separated time and transition part pcb board, include welding and the ear of the right separated time of earphone and transition part pcb board
The welding of the left separated time of machine and transition part pcb board：
S2051：The welding of the right separated time of earphone and transition part pcb board, 2 core conductors of the right separated time upper end of earphone are welded to transition
The R/L poles and G poles of portion's pcb board；
S2052：The welding of the left separated time of earphone and transition part pcb board, 2 core conductors of the left separated time upper end of earphone are welded to transition
The R/L poles and G poles of portion's pcb board；
S3：Each connecting portion injection of earphone cord, enters to the welding position of connector weldability position, separated time position and headset plug
Row injection molding；
S4：Shell assembles：Headset plug shell is assembled, and headset plug protective case made from metal material is fixed；Outside separated time portion
The assembling of shell and connecting portion shell.
A kind of 2. earphone processing technology according to claim 1, it is characterised in that：In the S1, entered using welding equipment
Row welding, the operating temperature of welding equipment is 260 DEG C~330 DEG C, and weld interval is 1 second~10 seconds.
A kind of 3. earphone processing technology according to claim 1, it is characterised in that：In the S2, entered using welding equipment
Row welding, the operating temperature of welding equipment is 260 DEG C~330 DEG C, and weld interval is 1 second~10 seconds.
A kind of 4. earphone processing technology according to claim 1, it is characterised in that：It is used during injection in the S3
Material is polypropylene, and material melts temperature is 200~240 DEG C, and it is 3~20 seconds to project the time.
A kind of 5. earphone processing technology according to claim 1, it is characterised in that：In the S4, outside the headset plug
The fixed form of shell is that material used in separated time portion shell and the connecting portion shell is poly- using instant glue hydropexis
Carbonic ester or acrylonitrile-butadiene-styrene copolymer, its fixed form is that welding pressure is 100 using ultrasonic fusing~
500KPa, time are 0.1~0.5 second, frequency 20KHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710799797.XA CN107484101B (en) | 2017-09-07 | 2017-09-07 | Earphone processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710799797.XA CN107484101B (en) | 2017-09-07 | 2017-09-07 | Earphone processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107484101A true CN107484101A (en) | 2017-12-15 |
| CN107484101B CN107484101B (en) | 2020-05-26 |
Family
ID=60583807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710799797.XA Expired - Fee Related CN107484101B (en) | 2017-09-07 | 2017-09-07 | Earphone processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484101B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109660902A (en) * | 2019-01-14 | 2019-04-19 | 宁波知豆电子科技有限公司 | A kind of segmented earphone cable and its production and assembly technique |
| CN111866657A (en) * | 2020-08-31 | 2020-10-30 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
| CN112919060A (en) * | 2021-04-17 | 2021-06-08 | 东莞理工学院 | Lean optimization method for production line |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3940151B2 (en) * | 2005-04-28 | 2007-07-04 | ミネベア株式会社 | Speaker, speaker diaphragm, and method for manufacturing speaker diaphragm |
| CN202455509U (en) * | 2012-02-13 | 2012-09-26 | 深圳市雅乐电子有限公司 | Drive-by-wire earphone |
-
2017
- 2017-09-07 CN CN201710799797.XA patent/CN107484101B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109660902A (en) * | 2019-01-14 | 2019-04-19 | 宁波知豆电子科技有限公司 | A kind of segmented earphone cable and its production and assembly technique |
| CN111866657A (en) * | 2020-08-31 | 2020-10-30 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
| CN111866657B (en) * | 2020-08-31 | 2023-08-29 | 惠州市品能新能源有限公司 | Production method of universal bone conduction Bluetooth headset |
| CN112919060A (en) * | 2021-04-17 | 2021-06-08 | 东莞理工学院 | Lean optimization method for production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107484101B (en) | 2020-05-26 |
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Granted publication date: 20200526 Termination date: 20210907 |
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| CF01 | Termination of patent right due to non-payment of annual fee |