CN107479148A - A kind of light module package structure and preparation method - Google Patents
A kind of light module package structure and preparation method Download PDFInfo
- Publication number
- CN107479148A CN107479148A CN201710748723.3A CN201710748723A CN107479148A CN 107479148 A CN107479148 A CN 107479148A CN 201710748723 A CN201710748723 A CN 201710748723A CN 107479148 A CN107479148 A CN 107479148A
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- Prior art keywords
- face
- pinboard
- flexible board
- optical
- top surface
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
Abstract
The invention discloses a kind of light module package structure, including：Pinboard, the pinboard have top surface, the bottom surface relative with top surface and the first through hole through top surface and bottom surface, and the top surface of the pinboard, which has, reroutes structure and one or more first pads；Optical chip, the optical chip are arranged on the top surface of the pinboard, and relative with the first through hole；Flexible board, the flexible board has the rewiring layer and o pads, the conductive through hole through flexible board of rewiring layer and the second pad, setting on the second surface of the first face, second face relative with the first face, setting on the first face, for forming electrical connection between the first face and second face, wherein described flexible board can be bent, and at least one first pad at the top of the pinboard is electrically connected to the second pad on the face of flexible board first.Embodiments of the invention realize that optical module socket and chip are perpendicular by soft board, so as to avoid vertical routing.
Description
Technical field
The present invention relates to encapsulation field, more particularly to a kind of light module package structure and preparation method.
Background technology
With optical communication, the popularization of optical transport, traditional micro-optical device is just by integrated optics, integrated optoelectronic device institute's generation
Replace.On the basis of the trend of optical interconnection is built upon away from being balanced between discrete data rate in communication network industry.With data
The growth of rate, in long range information transfer, optical fiber instead of copper cash, because the signal of more high speed is hardly decayed.
It is exactly the concept that this trend has inspired " optical fiber to chip ", the ultrahigh speed electric signal between microchip and the external world is taken by optical signal
Generation.Microchip is still used as full electric treatment unit, and optical fiber is as the high speed number for sending or receiving from it data to microchip
According to final passage.
At present, optical chip have been able to electricity encapsulate in fiber coupling.More High Data Rate and bigger total bandwidth are wanted
Ask the development for having guided the hydrid integrated circuit including optical chip, electrical chip and driving chip to encapsulate.This mixed method is direct
Optical signal is brought into the silicon microchip inside encapsulation, a large amount of designs and manufacture for thus alleviating high-speed electrical signals transmission are brought
Challenge.Current hydrid integrated circuit encapsulation often relies on the processing of silicon based opto-electronicses pinboard and optical module.However, at present
Silicon based opto-electronicses pinboard and optical module processing technology are complicated, process controllability is poor, processing yield is low, in the requirement of silicon chamber side wall routing
Height, routing yield are low, poor reliability.
Therefore, this area needs a kind of improved hydrid integrated circuit encapsulating structure or method, passes through this structure or side
Method solves technical problem present in prior art at least in part.
The content of the invention
For problems of the prior art, one embodiment of the present of invention provides a kind of light module package structure, bag
Include：Pinboard, the pinboard have top surface, the bottom surface relative with top surface and the first through hole through top surface and bottom surface, institute
Stating the top surface of pinboard has rewiring structure and one or more first pads；Optical chip, the optical chip are arranged on described
The top surface of pinboard, and it is relative with the first through hole；Optical fiber, the optical fiber is by first through hole optically coupling to the smooth core
Piece；Flexible board, the flexible board have the first face, second face relative with the first face, the rewiring layer of setting on the first face
With the second pad, set on the second surface reroute layer and o pads, the conductive through hole through flexible board, for first
Electrical connection is formed between face and the second face, wherein the flexible board can be bent, and at least one the at the top of the pinboard
One pad is electrically connected to the second pad on the face of flexible board first.
In one embodiment of the invention, the light module package structure also includes electrical chip, and the electrical chip is arranged on
On the top surface of the pinboard or the flexible board.
In one embodiment of the invention, the light module package structure also includes fibre-optical fixator, and the optical fiber is fixed
Utensil has the second through hole through top surface and bottom surface, and second through hole is aligned with first through hole, so as to allow optical fiber through the
One through hole and the second through hole are fixed on the fibre-optical fixator optically coupling to the optical chip, the pinboard and the flexible board
Top surface on；Support plate, the side of the fibre-optical fixator is fixedly mounted on the surface of the support plate, and the flexible board leads to
Cross bending to be fixed on the support plate so that the o pads on the face of flexible board second are fixed on the surface of support plate.
In one embodiment of the invention, the o pads on the face of flexible board second and the second weldering on first face
Disk is substantially vertical.
In one embodiment of the invention, the first face at the first end of flexible board is adhered to the bottom of the pinboard
Face, the second face at the first end of the flexible board are adhered to the top surface in the fibre-optical fixator, and the second of the flexible board
The first face at end is adhered on the surface of the support plate, and the o pads are on the second face at the second end.
In one embodiment of the invention, the bottom surface of pinboard is adhered to the top surface in the fibre-optical fixator,
The second face at the first end of the flexible board is adhered to the top surface in the fibre-optical fixator, at the second end of the flexible board
The first face be adhered on the surface of the support plate, the o pads are on the second face at the second end.
In one embodiment of the invention, the bottom surface of pinboard, which has, reroutes structure and the weldering of one or more the 3rd
Disk, the pinboard also includes the conductive through hole through the pinboard, for forming electrical connection between top surface and bottom surface, its
Described in one or more 3rd pads the second pad on the face of flexible board first is welded to by solder.
In one embodiment of the invention, support plate be metal support plate, polymer support plate, glass support plate, quartzy support plate or
Semiconductor carrier plate.
An alternative embodiment of the invention provides a kind of manufacture method of light module package structure, including：Optical chip is pacified
On the top surface of pinboard, wherein the pinboard has top surface, the bottom surface relative with top surface and through top surface and bottom surface
First through hole, the top surface of the pinboard, which has, reroutes structure and one or more first pads, the optical chip and institute
It is relative to state first through hole；The pinboard is fixed on the first face of soft board, the flexible board has the first face and the first face
Relative the second face, rerouting layer and the second pad, setting rewiring layer on the second surface and defeated on the first face is set
Go out pad, the conductive through hole through flexible board, for forming electrical connection between the first face and second face；In the pinboard and
Electrical connection is formed between the flexible board；The pinboard and flexible board are arranged on fibre-optical fixator；The optical fiber is consolidated
Determine device to be fixed on support plate；And the optical fiber is arranged in the through hole of the pinboard through fibre-optical fixator.
In one embodiment of the invention, this method also include by electrical chip be arranged on the pinboard top surface on or
On the flexible board.
Various embodiments of the present invention are processed using inexpensive silicon based opto-electronicses pinboard, and utilize low cost, high reliability
Optical module process, it is not necessary on orthogonal two faces of silicon substrate pinboard simultaneously routing, it is not required that in silicon substrate pinboard
Metallized simultaneously on orthogonal two faces, switching board machining process is simple, reliability is high, yields is high, chip attachment
Technique is simple, realizes that optical module socket and chip are perpendicular by soft board, so as to avoid vertical routing.
Brief description of the drawings
For the above and other advantages and features of each embodiment that the present invention is furture elucidated, refer to the attached drawing is presented
The more specifically description of various embodiments of the present invention.It is appreciated that these accompanying drawings only describe the exemplary embodiments of the present invention, therefore
It is restriction on its scope to be not to be regarded as.In the accompanying drawings, in order to cheer and bright, identical or corresponding part will use identical or class
As mark represent.
Fig. 1 shows the side schematic view of optical module hydrid integrated circuit encapsulating structure 100.
Fig. 2 shows the enlarged drawing of the first pinboard 130.
Fig. 3 shows the cross section signal of optical module hydrid integrated circuit encapsulating structure 300 according to an embodiment of the invention
Figure.
Fig. 4 shows the horizontal stroke of optical module hydrid integrated circuit encapsulating structure 400 according to one example embodiment
Schematic cross-section.
Fig. 5 shows the optical module hydrid integrated circuit encapsulating structure 500 of another example embodiment according to the present invention
Cross-sectional view.
Fig. 6 shows the optical module hydrid integrated circuit encapsulating structure 600 of another example embodiment according to the present invention
Cross-sectional view.
Fig. 7 A to Fig. 7 E show to form optical module hydrid integrated circuit encapsulating structure according to one embodiment of present invention
The cross-sectional view of process.
Fig. 8 shows to form the flow chart of optical module hydrid integrated circuit encapsulating structure according to one embodiment of present invention.
Embodiment
In the following description, with reference to each embodiment, present invention is described.However, those skilled in the art will recognize
Know can in the case of neither one or multiple specific details or with it is other replacement and/or addition method, material or component
Implement each embodiment together.In other situations, it is not shown or known structure, material or operation is not described in detail in order to avoid making this
The aspects of each embodiment of invention is obscure.Similarly, for purposes of explanation, specific quantity, material and configuration are elaborated, with
Comprehensive understanding to embodiments of the invention is just provided.However, the present invention can be implemented in the case of no specific detail.This
Outside, it should be understood that each embodiment shown in accompanying drawing is illustrative expression and is not drawn necessarily to scale.
In this manual, the reference to " one embodiment " or " embodiment " means to combine embodiment description
Special characteristic, structure or characteristic are included at least one embodiment of the invention.In the short of this specification middle appearance everywhere
Language is not necessarily all referring to the same embodiment " in one embodiment ".
It should be noted that processing step is described with particular order for embodiments of the invention, but this is simply
Convenience distinguishes each step, and is not the sequencing for limiting each step, in different embodiments of the invention, can be according to work
Skill is adjusted to adjust the sequencing of each step.
Fig. 1 shows the side schematic view of optical module hydrid integrated circuit encapsulating structure 100.As shown in figure 1, the encapsulating structure
100 include support plate 110, the optical fiber blocks 120 being arranged on the first face 110a of support plate 110, the first face for being arranged on support plate 110
110a is upper and the first pinboard 130 with the optical coupling of optical fiber blocks 120, is arranged on the first face 130a of the first pinboard 130
Optical chip 140, the second pinboard 150 for being arranged on the first face 110a of support plate 110 and be arranged on the second pinboard 150
The first face on the second chip 160.Optical fiber blocks 120 can be standard mouth optical fiber blocks.First pinboard 130 can be silicon substrate light
Electric pinboard, optical chip 140 are arranged on the first face 130a of the first pinboard 130, the second face 130b of the first pinboard 130
With the contacts side surfaces of optical fiber blocks 120.First pinboard 130, which has from the first face 130a, extends to the second face 130b through hole (not
Show).Optical chip 140 is arranged on the first face 130a of the first pinboard 130 of via regions.Optical fiber 121 passes through optical fiber blocks
120 and the first through hole in pinboard 130 be coupled to optical chip 140.The 3rd face 130c and fourth face of first pinboard 130
130d is relative and vertical with the first face 130a and the second face 130b.3rd face 130c is fixed on the first face 110a of support plate 110
On.There is the rewiring layer being electrically connected to each other on the first face 130a and fourth face 130d of first pinboard 130.Fig. 2 shows
The enlarged drawing of one pinboard 130.Optical chip 140 is inverted on the rewiring layer on the first face 130a, and electrical chip 160 passes through lead
Bonding electrically connects with the rewiring layer on fourth face 130d, so as to realize the interconnection of optical chip 140 and electrical chip 160, wherein drawing
The length of line is less than 1mm, so as to improve overall transmission rate.
For the optical module hydrid integrated circuit encapsulating structure 100 shown in Fig. 1 and Fig. 2, it is necessary in the phase of the first pinboard 130
Mutually metallize and connect up simultaneously on two vertical faces, this causes packaging technology to complicate.Because traditional pinboard technique is only
It is related on two faces relative to each other and carries out the techniques such as through hole, wiring.
In order to simplify the manufacturing process of optical module hydrid integrated circuit encapsulating structure, some embodiments of the present invention provide one
Kind realizes the optical module hydrid integrated circuit encapsulating structure of optical module socket and Chip Vertical by flexible board.Fig. 3 shows basis
The cross-sectional view of the optical module hydrid integrated circuit encapsulating structure 300 of embodiments of the invention.As shown in figure 3, the encapsulation
Structure 300 includes pinboard 310 and flexible board 320.Pinboard 310 has top surface 310a, the bottom surface relative with top surface 310a
310b and the through hole 311 through top surface 310a and bottom surface 310b.Have on the top surface 310a of pinboard 310 and reroute layer
(not shown) and one or more connection pads 312.
Optical chip 330 is arranged on the top surface 310a of pinboard 310.In some embodiments of the invention, optical chip 330
It is inverted on connection pad 312, optical fiber 350 is by through hole 311 optically coupling to optical chip 330.Optical chip 330 can be light transmitting
The optical chip such as device or optical receiver.
Electrical chip 340 is arranged on the top surface 310a of pinboard 310.In some embodiments of the invention, electrical chip 340
Electrically connected by wire bonding with being connected pad 312.In other embodiments of the invention, electrical chip 340 is inverted in connection weldering
On disk 312.Optical chip 330 is formed by the rewiring layer being connected under pad 312 with electrical chip 340 and is electrically interconnected.Electrical chip 340 can
To be the circuit chips such as optical-electrical converter or driver.
Flexible board 320 has the first face 320a, the second face 320b relative with the first face 320a.Flexible board 320 may include
The rewiring layer (not shown) being arranged on the first face 320a and connection pad 321, the rewiring being arranged on the second face 320b
Layer (not shown) and o pads 322.Flexible board 320 may also include the conductive through hole (not shown) through flexible board, for inciting somebody to action
Connection pad 321 is connected to corresponding o pads 322.
In the first end of flexible board 320, the bottom surface 310b of pinboard 310 can be attached to by tack coat or binding agent soft
First face 320a of property plate 320, and electrically connected the connection pad 312 on the top surface 310a of pinboard 310 by lead 313
Connection pad 321 onto the first face 320a of flexible board 320, and then led to by the rewiring layer on flexible board 320 and conduction
Hole is connected to the o pads 322 at the second end of flexible board 320.Because flexible board 320 can be bent, therefore can realize
O pads 322 and the interface of optical chip 310 are into special angle, for example, 90 degree.
In some embodiments of the invention, encapsulating structure 300 may also include fibre-optical fixator 360.Fibre-optical fixator 360
For fixing optical fiber 350.Fibre-optical fixator 360 has the through hole through top surface 360a and bottom surface 360b, and through hole and through hole 311 are right
Standard, so as to allow optical fiber through through hole and through hole 311 optically coupling to optical chip 330.
In some embodiments of the invention, encapsulating structure 300 may also include support plate 370.Can be by encapsulating structure 300
Each component is fixedly mounted on support plate 370.Support plate 370 can be metal support plate, such as copper coin, aluminium sheet, alloy sheets, multiple layer metal
Composite plate；Polymer support plate；Glass support plate；Quartzy support plate；Semiconductor carrier plate etc..For example, in an embodiment as illustrated in figure 3,
The side of fibre-optical fixator 360 is arranged on support plate 370, the second face 320b at the first end of flexible board 320 by adhesive layer or
Adhesive is fixed on the top surface 360a of fibre-optical fixator 360.Second end of flexible board 320 is fixed on support plate 370 by bending
On, so as to realize the first end of flexible board 320 and the second end into special angle, such as 90 degree.Pinboard 310 and fibre-optical fixator
360 and support plate 370 be not directly contacted with.Pinboard 310 is fixed to fibre-optical fixator 360 by flexible board 320.Implement shown in Fig. 3
Silicon substrate pinboard technique is simple used by example, assembling is simple, yields is high.Orthogonal two are avoided in silicon substrate pinboard
On face simultaneously metallization and routing and caused by process complications.
However, pinboard 310, flexible board 320, optical chip 330, electrical chip 340, fibre-optical fixator 360, the phase of support plate 370
The example shown in Fig. 3 is not limited to position and layout.
Fig. 4 shows optical module hydrid integrated circuit encapsulating structure 400 according to one example embodiment
Cross-sectional view.Similar with encapsulating structure shown in Fig. 3, the encapsulating structure 400 includes pinboard 410, flexible board 420, light
Chip 430, electrical chip 440, optical fiber 450, fibre-optical fixator 460, support plate 470.In order to simplify description, omit with Fig. 3 shown in
The description of similar portions in encapsulating structure.It is with the difference of structure shown in Fig. 3, pinboard 410, flexible board 420 and light
Mounting means of the fine fixator 460 on support plate 470 is different.In the embodiment shown in fig. 4, pinboard 410 and flexible board 420
Do not overlap each other, and fibre-optical fixator 460 is attached to by adhesive layer or adhesive respectively.The side of pinboard 410 can be with load
Plate 470 contacts, also can not be with the contacts side surfaces of support plate 470.
Fig. 5 shows the optical module hydrid integrated circuit encapsulating structure of another example embodiment according to the present invention
500 cross-sectional view.It is similar with encapsulating structure shown in Fig. 3, the encapsulating structure 500 include pinboard 510, flexible board 520,
Optical chip 530, electrical chip 540, optical fiber 550, fibre-optical fixator 560, support plate 570.In order to simplify description, omit with Fig. 3 shown in
Encapsulating structure in similar portions description.It is with the difference of structure shown in Fig. 3, electrical chip 540 is arranged on flexible board
On 420.In the embodiment shown in fig. 5, the connection pad 512 on the top surface of pinboard 510 is electrically connected to flexibility by lead 513
Connection pad 521 on first face of plate 520, so that optical chip 530 passes through pinboard 510 and flexibility with electrical chip 540
The rewiring layer on the surface of plate 520, which is formed, to be electrically interconnected.
Fig. 6 shows the optical module hydrid integrated circuit encapsulating structure of another example embodiment according to the present invention
600 cross-sectional view.It is similar with encapsulating structure shown in Fig. 3, the encapsulating structure 600 include pinboard 610, flexible board 620,
Optical chip 630, electrical chip 640, optical fiber 650, fibre-optical fixator 660, support plate 670.In order to simplify description, omit with Fig. 3 shown in
Encapsulating structure in similar portions description.It is with the difference of structure shown in Fig. 3, the top surface 610a of pinboard 610 and bottom
Face 610b is respectively provided with rewiring structure, and top surface 610a and bottom surface 610b rewiring structure pass through the conduction through pinboard 610
Through hole (not shown) connects.In the embodiment shown in fig. 6, electrical chip 640 is inverted in the top surface 610a of pinboard 610
On, there are one or more pads 614, pad 614 passes through solder and flexible board 620 first on the bottom surface 610b of pinboard 610
Pad on face forms electrical connection.Therefore, in the embodiment shown in fig. 6, without being carried out to pinboard 610 and flexible board 620
Routing connects, and further improves the stability and reliability of technique.
One of the preparation method of optical module hydrid integrated circuit encapsulating structure is described with reference to Fig. 7 A to Fig. 7 E and Fig. 8
Embodiment.Fig. 7 A to Fig. 7 E show to form the mistake of optical module hydrid integrated circuit encapsulating structure according to one embodiment of present invention
The cross-sectional view of journey.Fig. 8 shows to form optical module hydrid integrated circuit encapsulating structure according to one embodiment of present invention
Flow chart.
In step 810, there is provided pinboard.As shown in Figure 7 A, pinboard 710 has top surface 710a, relative with top surface 710a
Bottom surface 710b and the through hole 711 through top surface 710a and bottom surface 710b.Have on the top surface of pinboard 710 and reroute layer
(not shown) and one or more connection pads 712.
In step 820, optical chip 730 and electrical chip 740 are arranged on the top surface 710a of pinboard 710, such as Fig. 7 B institutes
Show.In some embodiments of the invention, optical chip 730 can be fixed on pinboard 710 by flip chip bonding, and electrical chip 740 can
It is fixed on by wire bonding or flip chip bonding on pinboard 710.
In step 830, pinboard 710 is fixed on to one end of soft board 720, as seen in figure 7 c.Specific fixed form can be with
The methods of including being bonded, welding, flexible board 720 have the first face 720a, the second face 720b relative with the first face 720a.It is flexible
The rewiring layer (not shown) and connect pad 721, be arranged on second surface that plate 720 may include to be arranged on the first face 720a
Rewiring layer (not shown) and o pads 722 on 720b.Flexible board 720 may also include the conductive through hole of through-silicon support plate
(not shown), for connection pad 721 to be connected into corresponding o pads 722.
In step 840, electrical connection is formed between pinboard 710 and flexible board 720.As illustrated in fig. 7d, lead can be passed through
It is bonded between connection pad 712 and connection pad 721 and forms electrical connection.In other embodiments of the invention, can be by falling
Welding equipment forms electrical connection between pinboard 710 and flexible board 720.
In step 850, pinboard 710 and flexible board 720 are arranged on fibre-optical fixator 760, and they are fixed on
On support plate 770, then optical fiber installation is carried out, as seen in figure 7e.
Finally, in step 860, carry out the bending of flexible board 720 and fix, realize o pads 722 and the interface of optical chip 710 into
Special angle, for example, 90 degree.
Various embodiments of the present invention are processed using inexpensive silicon based opto-electronicses pinboard, and utilize low cost, high reliability
Optical module process, it is not necessary on orthogonal two faces of silicon substrate pinboard simultaneously routing, it is not required that in silicon substrate pinboard
Metallized simultaneously on orthogonal two faces, switching board machining process is simple, reliability is high, yields is high, chip attachment
Technique is simple, realizes that optical module socket and chip are perpendicular by soft board, so as to avoid vertical routing.
Although described above is various embodiments of the present invention, however, it is to be understood that they are intended only as example to present
, and without limitation.For those skilled in the relevant art it is readily apparent that various groups can be made to each embodiment
Conjunction, variations and modifications are without departing from the spirit and scope of the present invention.Therefore, the width of the invention disclosed herein and scope be not
It should be limited, and should determine according only to appended claims and its equivalent substitution by above-mentioned disclosed exemplary embodiment
Justice.
Claims (9)
1. a kind of light module package structure, including：
Pinboard, the pinboard have top surface, the bottom surface relative with top surface and the first through hole through top surface and bottom surface, institute
Stating the top surface of pinboard has rewiring structure and one or more first pads；
Optical chip, the optical chip are arranged on the top surface of the pinboard, and relative with the first through hole；
Optical fiber, the optical fiber is by first through hole optically coupling to the optical chip；
Flexible board, the flexible board have the first face, second face relative with the first face, the rewiring layer of setting on the first face
With the second pad, set on the second surface reroute layer and o pads, the conductive through hole through flexible board, for first
Electrical connection is formed between face and the second face,
Wherein described flexible board can be bent, and at least one first pad at the top of the pinboard is electrically connected to the flexibility
The second pad on the face of plate first.
2. light module package structure as claimed in claim 1, it is characterised in that also including electrical chip, the electrical chip installation
On the top surface or the flexible board of the pinboard.
3. light module package structure as claimed in claim 1, it is characterised in that also include：
Fibre-optical fixator, the fibre-optical fixator have the second through hole through top surface and bottom surface, second through hole and first
Through-hole alignment, so as to allow optical fiber through first through hole and the second through hole optically coupling to the optical chip, the pinboard and institute
Flexible board is stated to be fixed on the top surface of the fibre-optical fixator；
Support plate, the side of the fibre-optical fixator are fixedly mounted on the surface of the support plate, and the flexible board pass through it is curved
Folding is fixed on the support plate so that the o pads on the face of flexible board second are fixed on the surface of support plate.
4. light module package structure as claimed in claim 3, it is characterised in that the o pads on the face of flexible board second
It is substantially vertical with the second pad on first face.
5. light module package structure as claimed in claim 3, it is characterised in that the first face at the first end of the flexible board
It is adhered to the bottom surface of the pinboard, the second face at the first end of the flexible board is adhered on the top of the fibre-optical fixator
Face, the first face at the second end of the flexible board are adhered on the surface of the support plate, and the o pads are at the second end
The second face on.
6. light module package structure as claimed in claim 3, it is characterised in that the bottom surface of the pinboard be adhered to it is described
The top surface of the fibre-optical fixator, the second face at the first end of the flexible board are adhered on the top of the fibre-optical fixator
Face, the first face at the second end of the flexible board are adhered on the surface of the support plate, and the o pads are at the second end
The second face on.
7. light module package structure as claimed in claim 3, it is characterised in that the support plate is metal support plate, polymer supported
Plate, glass support plate, quartzy support plate or semiconductor carrier plate.
8. a kind of manufacture method of light module package structure, including：
By optical chip be arranged on pinboard top surface on, wherein the pinboard have top surface, the bottom surface relative with top surface and
First through hole through top surface and bottom surface, the top surface of the pinboard, which has, reroutes structure and one or more first pads,
The optical chip is relative with the first through hole；
The pinboard is fixed on the first face of soft board, the flexible board has the first face, relative with the first face second
Face, rewirings layer on the first face and the second pad, setting rewiring layer on the second surface and o pads are set, run through
The conductive through hole of flexible board, for forming electrical connection between the first face and second face；
Electrical connection is formed between the pinboard and the flexible board；
The pinboard and flexible board are arranged on fibre-optical fixator；
The fibre-optical fixator is fixed on support plate；And
The optical fiber is arranged in the through hole of the pinboard through fibre-optical fixator.
9. method as claimed in claim 8, it is characterised in that also include being arranged on electrical chip on the top surface of the pinboard
Or on the flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748723.3A CN107479148B (en) | 2017-08-28 | 2017-08-28 | Optical module packaging structure and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710748723.3A CN107479148B (en) | 2017-08-28 | 2017-08-28 | Optical module packaging structure and manufacturing method |
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| CN107479148A true CN107479148A (en) | 2017-12-15 |
| CN107479148B CN107479148B (en) | 2019-12-31 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111239935A (en) * | 2020-03-19 | 2020-06-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113141549A (en) * | 2021-04-23 | 2021-07-20 | 航天新通科技有限公司 | Photoelectric hybrid co-packaged switching chip architecture |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090285580A1 (en) * | 2008-05-15 | 2009-11-19 | Hiroki Yasuda | Optical-Electrical Transceiver Module |
| CN202995100U (en) * | 2012-12-31 | 2013-06-12 | 深圳市易飞扬通信技术有限公司 | Laser optical fiber coupling component including flexible printed circuit board |
| CN104166188A (en) * | 2013-05-16 | 2014-11-26 | 鸿富锦精密工业（深圳）有限公司 | Optical communication apparatus |
-
2017
- 2017-08-28 CN CN201710748723.3A patent/CN107479148B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090285580A1 (en) * | 2008-05-15 | 2009-11-19 | Hiroki Yasuda | Optical-Electrical Transceiver Module |
| CN202995100U (en) * | 2012-12-31 | 2013-06-12 | 深圳市易飞扬通信技术有限公司 | Laser optical fiber coupling component including flexible printed circuit board |
| CN104166188A (en) * | 2013-05-16 | 2014-11-26 | 鸿富锦精密工业（深圳）有限公司 | Optical communication apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111239935A (en) * | 2020-03-19 | 2020-06-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113141549A (en) * | 2021-04-23 | 2021-07-20 | 航天新通科技有限公司 | Photoelectric hybrid co-packaged switching chip architecture |
| CN113141549B (en) * | 2021-04-23 | 2022-02-22 | 航天新通科技有限公司 | Photoelectric hybrid co-packaged switching chip architecture |
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