CN107477515A - A kind of LED chip packaging body - Google Patents

A kind of LED chip packaging body Download PDF

Info

Publication number
CN107477515A
CN107477515A CN201710704492.6A CN201710704492A CN107477515A CN 107477515 A CN107477515 A CN 107477515A CN 201710704492 A CN201710704492 A CN 201710704492A CN 107477515 A CN107477515 A CN 107477515A
Authority
CN
China
Prior art keywords
electromagnet
luminescence chips
led luminescence
led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710704492.6A
Other languages
Chinese (zh)
Inventor
王俊华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong LCLED Lighting Co Ltd
Original Assignee
Guangdong LCLED Lighting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong LCLED Lighting Co Ltd filed Critical Guangdong LCLED Lighting Co Ltd
Priority to CN201710704492.6A priority Critical patent/CN107477515A/en
Publication of CN107477515A publication Critical patent/CN107477515A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S10/00Lighting devices or systems producing a varying lighting effect
    • F21S10/06Lighting devices or systems producing a varying lighting effect flashing, e.g. with rotating reflector or light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V14/00Controlling the distribution of the light emitted by adjustment of elements
    • F21V14/02Controlling the distribution of the light emitted by adjustment of elements by movement of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

The invention discloses a kind of LED chip packaging body, including substrate, support column is provided with substrate, the LED luminescence chips to swing are hinged with support column, the both sides of LED luminescence chips are provided with lighttight baffle plate, photic zone is provided with above LED luminescence chips, post iron plate in the bottom of LED luminescence chips, substrate is provided with the electromagnet for producing suction to iron plate, the oscillating circuit for providing pulse voltage to electromagnet is provided with below substrate, LED luminescence chips and oscillating circuit are connected respectively to power supply.The present invention changes brightness by changing the rising angle of LED luminescence chips, the brightness of light changes with the rising angle of LED luminescence chips, because rising angle is consecutive variations, the brightness of light also consecutive variations, will not be flickering as the flicker of traditional approach, flicker effect is more natural.

Description

A kind of LED chip packaging body
Technical field
The present invention relates to a kind of LED chip packaging body, it is particularly a kind of by change the rising angle of LED luminescence chips come Change the LED chip packaging body of brightness.
Background technology
LED is a kind of semiconductor electronic component that can convert electrical energy into luminous energy.This electronic component went out early in 1962 It is existing, the feux rouges of low luminosity can only be sent in early days, develops other monochromatic versions afterwards, and the light that can be sent even to this day is time And visible ray, infrared ray and ultraviolet, luminosity also bring up to suitable luminosity.And purposes also by being used as indicator lamp, display at the beginning Plate etc.;With the continuous progress of technology, light emitting diode has been widely used in display, television set daylighting decoration and shone It is bright.LED sometimes needs to build a kind of effect of flicker, at present universal method be allow luminescence chip opened by certain frequency and Close, or but so flicker when open, or close, brightness change too greatly, the stage of middle neither one transition, Seem not natural enough.
The content of the invention
To solve the above problems, it is an object of the invention to provide a kind of LED chip packaging body, lighted by changing LED The rising angle of chip changes brightness, and flicker effect is more natural.
Technical scheme is used by the present invention solves its problem:A kind of LED chip packaging body, including substrate, on substrate Support column is provided with, is hinged with the LED luminescence chips to swing on support column, the both sides of LED luminescence chips are provided with impermeable The baffle plate of light, photic zone is provided with above LED luminescence chips, iron plate is posted in the bottom of LED luminescence chips, and substrate is provided with use The oscillating circuit for providing pulse voltage to electromagnet, LED are provided with below the electromagnet that suction is produced to iron plate, substrate Luminescence chip and oscillating circuit are connected respectively to power supply.
Further, the electromagnet includes the first electromagnet and the second electromagnet with being powered during the first electromagnet difference, First electromagnet and the second electromagnet are symmetrically disposed on the both sides of support column.It is of the invention that two electromagnet are so set with setting One electromagnet is compared, and the rising angle of LED luminescence chips changes faster, and the flicker effect of light is also more preferable, and flicker is more certainly So.
Further, the first electromagnet is directly connected to the output end U0 of oscillating circuit, and the second electromagnet passes through a NOT gate It is connected to the output end U0 of oscillating circuit.During the first electromagnet high level of the present invention, the second electromagnet low level, the first electromagnetism During iron low level, the second electromagnet high level, the first electromagnet and the second electromagnet cooperate so that LED luminescence chips have Rule and rapidly progress rising angle change, the flicker effect of light is also more preferable, and flicker is more natural.
Further, support column is internally provided with wire, and LED luminescence chips are connected by wire with power supply.The present invention is this Wire laying mode is not only clean succinct, and wire is arranged in support column can effectively fix wire, avoids wire because of LED Luminescence chip is frequently rocked and loosened, and causes loose contact.
The beneficial effects of the invention are as follows:The present invention is a kind of LED chip packaging body, and support column is provided with substrate, support It is hinged with the LED luminescence chips to swing on post, the both sides of LED luminescence chips are provided with lighttight baffle plate, and LED lights core Photic zone is provided with above piece, iron plate is posted in the bottom of LED luminescence chips, and substrate is provided with for producing suction to iron plate Electromagnet, substrate lower section are provided with the oscillating circuit for providing pulse voltage to electromagnet, LED luminescence chips and oscillating circuit It is connected respectively to power supply.The present invention changes brightness by changing the rising angle of LED luminescence chips, the brightness of light with The rising angle change of LED luminescence chips, because rising angle is consecutive variations, the brightness of light also consecutive variations will not Flickering as the flicker of traditional approach, flicker effect is more natural.
Brief description of the drawings
The invention will be further described with example below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the circuit block diagram of the present invention;
Fig. 3 is the pulse voltage figure of the first electromagnet and the second electromagnet.
Embodiment
Fig. 1 is the structural representation of the present invention, and Fig. 2 is the circuit block diagram of the present invention, and Fig. 3 is the first electromagnet 8 and second The pulse voltage figure of electromagnet 9, as shown in Figure 1 to Figure 3, a kind of LED chip packaging body, including substrate 1, it is provided with substrate 1 Support column 2, is hinged with the LED luminescence chips 3 to swing on support column 2, and the both sides of LED luminescence chips 3 are provided with light tight Baffle plate 4, the top of LED luminescence chips 3 is provided with photic zone 5, and iron plate 6 is posted in the bottom of LED luminescence chips 3, and substrate 1 is set There is the electromagnet for producing suction to iron plate 6, the lower section of substrate 1 is provided with the concussion electricity for providing pulse voltage to electromagnet Road 7, LED luminescence chips 3 and oscillating circuit 7 are connected respectively to power supply.Beam angle of the invention by changing LED luminescence chips 3 Spend to change brightness, the brightness of light changes with the rising angle of LED luminescence chips 3, because rising angle is consecutive variations , the brightness of light also consecutive variations will not be flickering as the flicker of traditional approach, and flicker effect is more natural.Institute Oscillating circuit is stated to form using 555 time base circuits.
Preferably, electromagnet of the invention include the first electromagnet 8 and it is different from the first electromagnet 8 when the second electricity for being powered Magnet 9, the first electromagnet 8 and the second electromagnet 9 are symmetrically disposed on the both sides of support column 2.It is of the invention that two electricity are so set Compared with setting an electromagnet, the rising angle of LED luminescence chips 3 changes faster magnet, and the flicker effect of light is also more Good, flicker is more natural.First electromagnet 8 is directly connected to the output end U0 of oscillating circuit 7, and the second electromagnet 9 is non-by one Door is connected to the output end U0 of oscillating circuit 7.During the first 8 high level of electromagnet of the present invention, the low level of the second electromagnet 9, the During one 8 low level of electromagnet, the high level of the second electromagnet 9, the first electromagnet 8 and the second electromagnet 9 cooperate so that LED Luminescence chip 3 is regular and rapidly carries out rising angle change, and the flicker effect of light is also more preferable, and flicker is more natural.Support Post 2 is internally provided with wire, and LED luminescence chips 3 are connected by wire with power supply.The not only clean letter of this wire laying mode of the present invention It is clean, and wire is arranged in support column 2 can effectively fix wire, wire is avoided because LED luminescence chips 3 frequently rock And loosen, cause loose contact.
It is described above, simply presently preferred embodiments of the present invention, the invention is not limited in above-mentioned embodiment, as long as It reaches the technique effect of the present invention with identical means, should all belong to protection scope of the present invention.

Claims (4)

  1. A kind of 1. LED chip packaging body, it is characterised in that:Including substrate, support column is provided with substrate, is hinged with support column The LED luminescence chips to swing, the both sides of LED luminescence chips are provided with lighttight baffle plate, set above LED luminescence chips Photic zone is equipped with, iron plate is posted in the bottom of LED luminescence chips, and substrate is provided with the electromagnet for producing suction to iron plate, base The oscillating circuit for providing pulse voltage to electromagnet is provided with below plate.
  2. A kind of 2. LED chip packaging body according to claim 1, it is characterised in that:The electromagnet includes the first electromagnetism Iron and the second electromagnet with being powered during the first electromagnet difference, the first electromagnet and the second electromagnet are symmetrically disposed on support The both sides of post.
  3. A kind of 3. LED chip packaging body according to claim 2, it is characterised in that:First electromagnet is directly connected to shake The output end U0 of circuit is swung, the second electromagnet is connected to the output end U0 of oscillating circuit by a NOT gate.
  4. A kind of 4. LED chip packaging body according to any one of claims 1 to 3, it is characterised in that:Support column is internally provided with Wire, LED luminescence chips are connected by wire with power supply.
CN201710704492.6A 2017-08-16 2017-08-16 A kind of LED chip packaging body Pending CN107477515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710704492.6A CN107477515A (en) 2017-08-16 2017-08-16 A kind of LED chip packaging body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710704492.6A CN107477515A (en) 2017-08-16 2017-08-16 A kind of LED chip packaging body

Publications (1)

Publication Number Publication Date
CN107477515A true CN107477515A (en) 2017-12-15

Family

ID=60599835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710704492.6A Pending CN107477515A (en) 2017-08-16 2017-08-16 A kind of LED chip packaging body

Country Status (1)

Country Link
CN (1) CN107477515A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111365663A (en) * 2020-04-10 2020-07-03 绍兴权电科技有限公司 Light column type magnetic control curved surface semiconductor lighting source
CN114110531A (en) * 2020-08-07 2022-03-01 苹果公司 Electronic device with visual feedback

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11281925A (en) * 1998-03-26 1999-10-15 Nec Corp Laser pointing device
US20070195442A1 (en) * 2006-02-09 2007-08-23 Samsung Electro-Mechanics Co., Ltd. Actuator
CN102147095A (en) * 2011-04-19 2011-08-10 广东亚一照明科技有限公司 LED candle lamp
CN103322500A (en) * 2013-06-28 2013-09-25 伍尚强 Electronic light-emitting device capable of simulating true fire
CN205227190U (en) * 2015-10-30 2016-05-11 南通亚泰蜡业工艺品有限公司 Swinging electronic candle
CN207162407U (en) * 2017-08-16 2018-03-30 广东聚科照明股份有限公司 A kind of LED chip packaging body

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11281925A (en) * 1998-03-26 1999-10-15 Nec Corp Laser pointing device
US20070195442A1 (en) * 2006-02-09 2007-08-23 Samsung Electro-Mechanics Co., Ltd. Actuator
CN102147095A (en) * 2011-04-19 2011-08-10 广东亚一照明科技有限公司 LED candle lamp
CN103322500A (en) * 2013-06-28 2013-09-25 伍尚强 Electronic light-emitting device capable of simulating true fire
CN205227190U (en) * 2015-10-30 2016-05-11 南通亚泰蜡业工艺品有限公司 Swinging electronic candle
CN207162407U (en) * 2017-08-16 2018-03-30 广东聚科照明股份有限公司 A kind of LED chip packaging body

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111365663A (en) * 2020-04-10 2020-07-03 绍兴权电科技有限公司 Light column type magnetic control curved surface semiconductor lighting source
CN114110531A (en) * 2020-08-07 2022-03-01 苹果公司 Electronic device with visual feedback

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Application publication date: 20171215

RJ01 Rejection of invention patent application after publication