CN107462954A - A kind of mini micro electronmechanical adjustable optical attenuator - Google Patents
A kind of mini micro electronmechanical adjustable optical attenuator Download PDFInfo
- Publication number
- CN107462954A CN107462954A CN201710795510.6A CN201710795510A CN107462954A CN 107462954 A CN107462954 A CN 107462954A CN 201710795510 A CN201710795510 A CN 201710795510A CN 107462954 A CN107462954 A CN 107462954A
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- Prior art keywords
- contact pin
- central shaft
- hole
- bases
- metal platform
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/264—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting
- G02B6/266—Optical coupling means with optical elements between opposed fibre ends which perform a function other than beam splitting the optical element being an attenuator
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The present invention relates to optics field, discloses a kind of mini micro electronmechanical adjustable optical attenuator, solves the problems, such as that existing MEMS VOA are complicated, production cost is high.The present invention includes TO bases and MEMS chip, and MEMS chip is arranged on TO bases, and TO bases include metal platform and contact pin, and metal platform is provided with through hole, and contact pin includes the first contact pin and the second contact pin；The lower end of first contact pin and metal platform connects, and the second contact pin passes through the through hole, and insulating materials is filled between the second contact pin and the through hole；Second contact pin includes epimere portion and hypomere portion, wherein, the center overlapping of axles of the central shaft in hypomere portion and the through hole, the central shaft of the central shaft in epimere portion and the through hole deviates.The present invention is applied to optical fiber transmission control.
Description
Technical field
The present invention relates to optics field；More particularly to a kind of mini micro electronmechanical adjustable optical attenuator (MINI MEMS
VOA)。
Background technology
Adjustable optical attenuator, i.e. VOA, it is a kind of important optical transmission apparatus in intelligent Optical Network, is that composition light is put
The critical component of big device, plays a part of power-balance, and be widely used in wavelength-division multiplex system in fiber optic communication systems
WDM/DWDM channel gain balance and light receiving element protection.It can be with light wavelength division multiplexing WDM, spectroscopic detectors TAP
The optical devices such as PD, erbium-doped optical fiber amplifier EDFA form ROADM ROADM, preequalization wave multiplexer VMUX, increased
The modules such as the flat EDFA of benefit.
Adjustable optical attenuator is made a distinction including tradition machinery type, waveguide type, liquid crystal type, micro electronmechanical according to manufacturing process
MEMS-type etc..Wherein, waveguide type and liquid crystal type light energy equalizer techniques are still immature, and commercial product is few.Mechanical type develops
It is most ripe, but its volume is big, complicated, operation inconvenience.Such as Patent No. CN02136828.7 patent《Electromagnetic drive position
Shift micromachine variable light attenuator》Ti Chu ー kinds are using electromagnetic actuation force and elastomer control optical fiber dislocation displacement, so as to real
The method of existing optical attenuator.This apparatus structure needs the mechanical parts such as movable platform, locating slot and elastomer, so structure is answered
It is miscellaneous, and elastomer easily produces mechanical fatigue, influences device performance, shortens device lifetime.
MEMS VOA implementation method mainly has two kinds：Finger-like structure based on diffraction principle and turn based on principle of reflection
Mirror structure, particularly the latter are more conventional.MEMS VOA based on tilting mirror structure, its realization principle are：Light is from double-fiber tail optical fiber
An optical fiber send, through collimated, incide on speculum, the light being reflected back converges through lens, is coupled into double-fiber tail
Another optical fiber in fibre, the driving voltage by adjusting MEMS chip realizes the consecutive variations of mirror angle, so that coupling
The light intensity closed into output optical fibre changes, and then realizes the tunable of decay.
In current MEMS VOA, the contact pin of base is arranged to axis with the through hole of base and overlapped by Normal practice, root
The MEMS chip of suitable size is chosen according to MEMS VOA overall dimensions, if the MEMS VOA for needing to produce small size are usually to the greatest extent
Amount simplifies overall structure and reduced the size, and because the metal platform of base is small-sized, can only select the MEMS chip of small size, by
It is more expensive in the smaller price of MEMS chip sizes, therefore the MEMS chip of small size can increase the production cost of enterprise.
The content of the invention
The technical problem to be solved in the present invention is：A kind of MINI MEMS VOA simple in construction, inexpensive are provided, solved
The problem of production cost is high in existing MEMS VOA.
To solve the above problems, the technical solution adopted by the present invention is：A kind of MINI MEMS VOA, including TO bases and
MEMS chips, MEMS chip are arranged on TO bases, and TO bases include metal platform and contact pin, and metal platform is provided with through hole, contact pin
Including the first contact pin and the second contact pin；The lower end of first contact pin and metal platform connects, and the second contact pin passes through the through hole, and the
Insulating materials is filled between two contact pins and the through hole；Characterized in that, the second contact pin includes epimere portion and hypomere portion, and under
The central shaft in section portion and the central shaft in epimere portion deviate, using technical scheme, can flexibly select chip species with
And the gold thread of appropriate length, so as to reduce cost.
Generally, we can be by the center overlapping of axles of the central shaft in hypomere portion and the through hole, the center in epimere portion
The central shaft of axle and the through hole deviates：If the central shaft in epimere portion deviates towards the direction of the central point away from metal platform, due to
Bigger space can be reserved among metal platform after central point away from metal platform deviates, therefore can be used more on metal platform
Large-sized MEMS chip, reduces cost；If the central shaft in epimere portion deviates towards the direction of the central point close to metal platform, by
In towards close to metal platform central point direction deviate after, epimere portion from a distance from the MEMS chip at metal platform center closer to,
The electrode distance of upper end and MEMS chip is promoted to become closer to so as to what is used between upper end and the electrode of MEMS chip
Gold thread is shorter, therefore can reduce gold thread usage amount, reduces production cost.
Further, in addition to pipe cap, branch sleeve, optical fiber collimator and external package pipe；TO bases are connected with pipe cap, light
Fine collimater is located at the front of pipe cap, and pipe cap is entangled in branch sleeve one end, and the other end entangles optical fiber collimator, and external package pipe will
TO bases, MEMS chip, pipe cap, branch sleeve, optical fiber collimator are encapsulated in inside it.
Further, pipe cap front end offers window, and transparent window film is provided with window, and optical fiber collimator is located at window
Front.
Further, the transparent window film is glass window.
The beneficial effects of the invention are as follows：The epimere portion of second contact pin and hypomere portion are arranged to not in same axis by the present invention
On, wherein, the center overlapping of axles of the central shaft in hypomere portion and the through hole, the central shaft in epimere portion is designed using eccentric, i.e., on
The central shaft of through hole on the central shaft and metal platform in section portion deviates；When epimere portion central shaft towards away from metal platform central point
Direction when deviateing, can reserve bigger space among metal platform after deviateing due to the central point away from metal platform, therefore can
Larger sized MEMS chip can be used on metal platform, reduce cost；When the central shaft in epimere portion is towards in metal platform
When the direction of heart point is deviateed, after deviateing towards the central point direction of close metal platform, MEMS of the epimere portion from metal platform center
The distance of chip is closer to promoting the electrode distance of upper end and MEMS chip to become closer to so as to upper end and MEMS cores
The gold thread used between the electrode of piece is shorter, therefore can reduce gold thread usage amount, reduces production cost.
Simultaneously as the present invention does not use glass tube in optical fiber collimator, pipe cap passes through branch sleeve with optical fiber collimator
To protect and transfer, thus it is simple in construction, it is easy to minimize.
Brief description of the drawings
Fig. 1 is the explosive view of the present invention；
Fig. 2 is the stereogram of TO bases of the present invention；
Fig. 3 is the top view of TO bases of the present invention；
Fig. 4 is Fig. 3 A-A profiles；
Fig. 5 is the structure chart of pipe cap of the present invention.
Numbered in figure：1 is TO bases, and 2 be MEMS chip, and 3 be pipe cap, and 4 be branch sleeve, and 5 be external package pipe, and 6 be optical fiber
Collimater, 11 be metal platform, and 12 be the second contact pin, and 12A is the epimere portion of the second contact pin, and 12B is the hypomere portion of the second contact pin, 13
It is through hole for the first contact pin, 14,15 be insulating materials, and 31 be the window of pipe cap.
Embodiment
Embodiment provides a kind of MINI MEMS VOA, as Figure 1-5, including TO bases 1, MEMS chip 2, pipe cap 3,
Branch sleeve 4, optical fiber collimator 6 and external package pipe 5；MEMS chip 2 is arranged on TO bases 1, and TO bases 1 are connected with pipe cap 3,
The front end of pipe cap 3 offers window 31, and transparent window film is provided with window 31, and optical fiber collimator 6 is located at the front of window 31, even
Pipe cap 3 is entangled in the one end of female connector cylinder 4, and the other end entangles optical fiber collimator 6, external package pipe 5 by TO bases 1, MEMS chip 2, pipe
Cap 3, branch sleeve 4, optical fiber collimator 6 are encapsulated in inside it.
As shown in Figure 2,3, 4, TO bases 1 include metal platform 11 and contact pin, and metal platform 11 is provided with through hole 14, and contact pin includes
First contact pin 13 and the second contact pin 12；First contact pin 13 is connected and electrically conducted with the lower end of metal platform 11, the second contact pin 12
Through the through hole 14, and insulating materials 15 is filled between the second contact pin 12 and the through hole 14, the insulating materials is general
It is glass weldering glue；Second contact pin 12 includes epimere portion 12A and hypomere portion 12B, wherein, epimere portion 12A passes through gold thread and MEMS cores
Piece 2 electrically conducts, the center overlapping of axles of hypomere portion 12B central shaft and the through hole 14, epimere portion 12A central shaft with it is described
The central shaft of through hole 14 deviates, and epimere portion 12A central shaft deviates towards the direction of the central point away from metal platform 11, embodiment
Larger sized MEMS chip 2 can be used on metal platform 11, thus can effectively reduce Miniature MEMS VOA chip into
This.
The operation principle of embodiment is as follows：
Light enters optical fiber collimator 6 by input optical fibre line, and the light after optical fiber collimator 6 enters pipe cap by window 31
3 inside simultaneously reaches MEMS chip 2, and light is coupled between MEMS chip 2 and the lens of optical fiber collimator 6, passes through regulation
The driving voltage of MEMS chip 2 realizes the consecutive variations of mirror angle, so that the light intensity for being coupled into output optical fibre becomes
Change, and then realize the tunable of decay；Light after the reflection of MEMS chip 2, then return to output optical fibre by optical fiber collimator 6 is defeated
In line.
The general principle of the present invention and main feature are the foregoing described, the description of specification simply illustrates the original of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes and improvements
It all fall within the protetion scope of the claimed invention.
Claims (6)
1. a kind of mini micro electronmechanical adjustable optical attenuator, including TO bases and MEMS chip, MEMS chip are arranged on TO bases
On, TO bases include metal platform and contact pin, and metal platform is provided with through hole, and contact pin includes the first contact pin and the second contact pin；First inserts
The lower end of pin and metal platform connects, and the second contact pin passes through the through hole, and filled with exhausted between the second contact pin and the through hole
Edge material；Characterized in that, the second contact pin includes epimere portion and hypomere portion, the central shaft and the central shaft in epimere portion in hypomere portion are inclined
From.
A kind of 2. mini micro electronmechanical adjustable optical attenuator as claimed in claim 1, it is characterised in that the central shaft in hypomere portion
With the center overlapping of axles of the through hole, the central shaft of the central shaft in epimere portion and the through hole deviates.
A kind of 3. mini micro electronmechanical adjustable optical attenuator as claimed in claim 2, it is characterised in that the central shaft in epimere portion
Deviate towards the direction of the central point away from metal platform.
4. a kind of mini micro electronmechanical adjustable optical attenuator as claimed in claim 3, it is characterised in that also including pipe cap, even
Female connector cylinder, optical fiber collimator and external package pipe；TO bases are connected with pipe cap, and optical fiber collimator is located at the front of pipe cap, adapter sleeve
Pipe cap is entangled in cylinder one end, and the other end entangles optical fiber collimator, and external package pipe is by TO bases, MEMS chip, pipe cap, adapter sleeve
Cylinder, optical fiber collimator are encapsulated in inside it.
5. a kind of mini micro electronmechanical adjustable optical attenuator as claimed in claim 1, it is characterised in that pipe cap front end offers
Window, transparent window film is provided with window, optical fiber collimator is located at the front of window.
6. mini micro electronmechanical adjustable optical attenuator as claimed in claim 4 a kind of, it is characterised in that the transparent window film is
Glass window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795510.6A CN107462954B (en) | 2017-09-06 | 2017-09-06 | A kind of mini micro electronmechanical adjustable optical attenuator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710795510.6A CN107462954B (en) | 2017-09-06 | 2017-09-06 | A kind of mini micro electronmechanical adjustable optical attenuator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107462954A true CN107462954A (en) | 2017-12-12 |
| CN107462954B CN107462954B (en) | 2019-06-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710795510.6A Active CN107462954B (en) | 2017-09-06 | 2017-09-06 | A kind of mini micro electronmechanical adjustable optical attenuator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110346871A (en) * | 2018-04-03 | 2019-10-18 | 光联通讯有限公司 | Multi-core optical fiber attenuator |
| CN111290081A (en) * | 2018-12-07 | 2020-06-16 | 福州高意通讯有限公司 | Miniaturized high-performance variable attenuator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2550806Y (en) * | 2001-12-07 | 2003-05-14 | 鸿富锦精密工业（深圳）有限公司 | Adjustable light attenuator |
| CN1508589A (en) * | 2002-12-17 | 2004-06-30 | 台达电子工业股份有限公司 | Adjustable light attenuator for micro electromechanical system and manufacturing method thereof |
| US20060284877A1 (en) * | 1999-10-05 | 2006-12-21 | Miles Mark W | Photonic mems and structures |
| CN201892787U (en) * | 2010-05-12 | 2011-07-06 | 深圳市易飞扬通信技术有限公司 | Adjustable optical attenuator based on micro electromechanical system |
| WO2015138694A2 (en) * | 2014-03-14 | 2015-09-17 | Board Of Trustees Of Michigan State University | Variable optical attenuator with integrated control based on strongly correlated materials |
| CN106154540A (en) * | 2016-06-30 | 2016-11-23 | 武汉光迅科技股份有限公司 | A kind of rotary mirror type MEMS variable optical attenuator |
-
2017
- 2017-09-06 CN CN201710795510.6A patent/CN107462954B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060284877A1 (en) * | 1999-10-05 | 2006-12-21 | Miles Mark W | Photonic mems and structures |
| CN2550806Y (en) * | 2001-12-07 | 2003-05-14 | 鸿富锦精密工业（深圳）有限公司 | Adjustable light attenuator |
| CN1508589A (en) * | 2002-12-17 | 2004-06-30 | 台达电子工业股份有限公司 | Adjustable light attenuator for micro electromechanical system and manufacturing method thereof |
| CN201892787U (en) * | 2010-05-12 | 2011-07-06 | 深圳市易飞扬通信技术有限公司 | Adjustable optical attenuator based on micro electromechanical system |
| WO2015138694A2 (en) * | 2014-03-14 | 2015-09-17 | Board Of Trustees Of Michigan State University | Variable optical attenuator with integrated control based on strongly correlated materials |
| CN106154540A (en) * | 2016-06-30 | 2016-11-23 | 武汉光迅科技股份有限公司 | A kind of rotary mirror type MEMS variable optical attenuator |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110346871A (en) * | 2018-04-03 | 2019-10-18 | 光联通讯有限公司 | Multi-core optical fiber attenuator |
| CN110346871B (en) * | 2018-04-03 | 2020-12-15 | 光联通讯有限公司 | Multi-core optical fiber attenuator |
| CN111290081A (en) * | 2018-12-07 | 2020-06-16 | 福州高意通讯有限公司 | Miniaturized high-performance variable attenuator |
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| Publication number | Publication date |
|---|---|
| CN107462954B (en) | 2019-06-07 |
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