CN107447247A - A kind of pipeline system electroplating mechanism that - Google Patents
A kind of pipeline system electroplating mechanism that Download PDFInfo
- Publication number
- CN107447247A CN107447247A CN201710706295.8A CN201710706295A CN107447247A CN 107447247 A CN107447247 A CN 107447247A CN 201710706295 A CN201710706295 A CN 201710706295A CN 107447247 A CN107447247 A CN 107447247A
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- CN
- China
- Prior art keywords
- conveyer belt
- electroplating
- pipeline system
- transport mechanism
- splicing groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of pipeline system electroplating mechanism that, including electroplating bath, first transport mechanism and the second transport mechanism, first transport mechanism includes the first conveyer belt, second conveyer belt and the 3rd conveyer belt, first conveyer belt, second conveyer belt and the 3rd conveyer belt are set gradually from top to bottom, first conveyer belt, second conveyer belt and the 3rd conveyer belt is parallel is staggered, first conveyer belt is opposite with the direction of transfer of the second conveyer belt, second conveyer belt is opposite with the direction of transfer of the 3rd conveyer belt, first conveyer belt, second conveyer belt and the 3rd conveyer belt are in netted, second transport mechanism includes the 4th conveyer belt, 4th conveyer belt is obliquely installed, splicing groove is provided with below the upper end of 4th conveyer belt.The present invention completes plating when workpiece is by the first conveyer belt, the second conveyer belt and three conveyer belts, it is not necessary to manually holds electroplating time, operating efficiency is high, and electroplating time precise control, electroplating quality are good.
Description
Technical field
The present invention relates to a kind of electroplating device, more particularly to a kind of pipeline system electroplating mechanism that.
Background technology
Plating is to process coating in metal material surface, and workpiece is mainly placed in the electroplate liquid of electroplating bath by it, and
Conducting electric current on workpiece, so as to form layer of metal layer in workpiece surface, reach the purpose of protection workpiece surface, it is necessary to will plating
Liquid is stirred so that plating is uniform, improves electroplating quality.But all it is that multiple workpiece are stacked in one in existing electroplating bath
In holding tank, electroplating time is unmanageable, it is necessary to which people look in real time, and operating efficiency is low, and manual control has error, leads
It is of poor quality to send a telegraph plating.
The content of the invention
Instant invention overcomes the deficiencies in the prior art, there is provided a kind of pipeline system electroplating mechanism that simple in construction.
To reach above-mentioned purpose, the technical solution adopted by the present invention is:A kind of pipeline system electroplating mechanism that, including plating
Groove, the first transport mechanism and the second transport mechanism, first transport mechanism include the first conveyer belt, the second conveyer belt and the 3rd
Conveyer belt, first conveyer belt, the second conveyer belt and the 3rd conveyer belt are set gradually from top to bottom, first conveyer belt,
Second conveyer belt and the 3rd conveyer belt is parallel is staggered, the direction of transfer of first conveyer belt and the second conveyer belt on the contrary,
The direction of transfer of second conveyer belt and the 3rd conveyer belt is on the contrary, first conveyer belt, the second conveyer belt and the 3rd transmission
Band is in netted, and second transport mechanism includes the 4th conveyer belt, and the 4th conveyer belt is obliquely installed, the 4th transmission
Splicing groove is provided with below the upper end of band.
In a preferred embodiment of the present invention, a kind of pipeline system electroplating mechanism that further comprises setting in the electroplating bath
There is pin.
In a preferred embodiment of the present invention, a kind of pipeline system electroplating mechanism that further comprises the pin using soft
Material is made.
In a preferred embodiment of the present invention, a kind of pipeline system electroplating mechanism that further comprises the outside of the electroplating bath
Reinforcing plate is fixed with, the splicing groove is arranged in the reinforcing plate, and the side of the splicing groove is obliquely installed.
In a preferred embodiment of the present invention, a kind of pipeline system electroplating mechanism that further comprises setting in the splicing groove
There is reticular lamina.
In a preferred embodiment of the present invention, a kind of pipeline system electroplating mechanism that further comprises that the reticular lamina uses rubber
Glue material is made.
The present invention solves defect present in background technology, and the present invention is simple in construction, easy to use, by setting first
Conveyer belt, the second conveyer belt and the 3rd conveyer belt, when workpiece is by the first conveyer belt, the second conveyer belt and three conveyer belts
Complete plating, it is not necessary to manually hold electroplating time, operating efficiency is high, and electroplating time precise control, electroplating quality are good.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the preferred embodiments of the present invention;
In figure:2nd, electroplating bath, the 4, first conveyer belt, the 6, second conveyer belt, the 8, the 3rd conveyer belt, the 10, the 4th conveyer belt, 12, connect
Hopper, 14, pin, 16, reinforcing plate, 18, reticular lamina.
Embodiment
Presently in connection with drawings and examples, the present invention is further detailed explanation, and these accompanying drawings are simplified signal
Figure, only illustrate the basic structure of the present invention in a schematic way, therefore it only shows the composition relevant with the present invention.
As shown in figure 1, a kind of pipeline system electroplating mechanism that, including electroplating bath 2, the first transport mechanism and the second conveyer
Structure, the first transport mechanism include the first conveyer belt 4, the second conveyer belt 6 and the 3rd conveyer belt 8, the transmission of the first conveyer belt 4, second
The conveyer belt 8 of band 6 and the 3rd is set gradually from top to bottom, and the first conveyer belt 4, the second conveyer belt 6 are parallel with the 3rd conveyer belt 8 staggeredly
Set, the direction of transfer of the first conveyer belt 4 and the second conveyer belt 6 is on the contrary, the sender of the second conveyer belt 6 and the 3rd conveyer belt 8
To on the contrary, the first conveyer belt 4, the second conveyer belt 6 and the 3rd conveyer belt 8 are in netted so that each face of workpiece can soak
Profit improves electroplating quality in electroplate liquid, and the second transport mechanism includes the 4th conveyer belt 10, and the 4th conveyer belt 10 is obliquely installed,
Splicing groove 12 is provided with below the upper end of 4th conveyer belt 10.
Of the invention that pin 14 is preferably provided with electroplating bath 2, the both ends of pin 14 are arranged on the madial wall of electroplating bath 2,
Workpiece is avoided to fall out the 4th conveyer belt 10 so that workpiece is stable to drive rising on the 4th conveyer belt 10 by the 4th conveyer belt 10
Drop in splicing groove 12.
In order to avoid the damage to workpiece, the present invention preferably pin 14 is made of flexible material.
The outside of preferably electroplating bath 2 of the invention is fixed with reinforcing plate 16, and splicing groove 12 is arranged in reinforcing plate 16, splicing groove
12 side is obliquely installed, and so, when multiple workpiece depart from four conveyer belts 10, multiple workpiece can be along splicing groove 12
Inclined side is slowly slid to splicing groove 12, avoids the destruction to the coating of workpiece, it is ensured that the electroplating quality of workpiece.
It is of the invention to be preferably provided with reticular lamina 18 in splicing groove 12, it is easy to the recovery to electroplate liquid, reduces cost.
In order to avoid the destruction to workpiece coating, the present invention preferably reticular lamina 18 is made of elastomeric material.
In the use of the present invention, multiple workpiece are individually positioned on the first conveyer belt 4, multiple workpiece infiltrations are in electroplating bath
In 2 electroplate liquid, then multiple workpiece drop on the second conveyer belt 6, then drop on the 3rd conveyer belt 8, complete plating
Afterwards, multiple workpiece drop on the 4th conveyer belt 10, and the 4th conveyer belt 10 quickly drives multiple workpiece transfers into splicing groove 12,
Take out workpiece.
The desirable embodiment according to the present invention is enlightenment above, and by above-mentioned description, related personnel completely can be with
Without departing from the scope of the technological thought of the present invention', various changes and amendments are carried out.The technical scope of this invention
The content being not limited on specification, it is necessary to determine the technical scope according to the scope of the claims.
Claims (6)
- A kind of 1. pipeline system electroplating mechanism that, it is characterised in that:Including electroplating bath, the first transport mechanism and the second transport mechanism, First transport mechanism includes the first conveyer belt, the second conveyer belt and the 3rd conveyer belt, first conveyer belt, the second transmission Band and the 3rd conveyer belt are set gradually from top to bottom, and first conveyer belt, the second conveyer belt and the 3rd conveyer belt are parallel staggeredly Set, the direction of transfer of first conveyer belt and the second conveyer belt is on the contrary, the biography of second conveyer belt and the 3rd conveyer belt Send in the opposite direction, first conveyer belt, the second conveyer belt and the 3rd conveyer belt are in netted, and second transport mechanism includes 4th conveyer belt, the 4th conveyer belt are obliquely installed, and splicing groove is provided with below the upper end of the 4th conveyer belt.
- A kind of 2. pipeline system electroplating mechanism that according to claim 1, it is characterised in that:Gear is provided with the electroplating bath Bar.
- A kind of 3. pipeline system electroplating mechanism that according to claim 1, it is characterised in that:The pin uses flexible material It is made.
- A kind of 4. pipeline system electroplating mechanism that according to claim 1, it is characterised in that:The outside of the electroplating bath is fixed There is reinforcing plate, the splicing groove is arranged in the reinforcing plate, and the side of the splicing groove is obliquely installed.
- A kind of 5. pipeline system electroplating mechanism that according to claim 4, it is characterised in that:Net is provided with the splicing groove Shape plate.
- A kind of 6. pipeline system electroplating mechanism that according to claim 5, it is characterised in that:The reticular lamina uses rubber material Material is made.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710706295.8A CN107447247A (en) | 2017-08-17 | 2017-08-17 | A kind of pipeline system electroplating mechanism that |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710706295.8A CN107447247A (en) | 2017-08-17 | 2017-08-17 | A kind of pipeline system electroplating mechanism that |
Publications (1)
Publication Number | Publication Date |
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CN107447247A true CN107447247A (en) | 2017-12-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201710706295.8A Pending CN107447247A (en) | 2017-08-17 | 2017-08-17 | A kind of pipeline system electroplating mechanism that |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109666955A (en) * | 2019-02-18 | 2019-04-23 | 福建泰兴特纸有限公司 | Radium-shine working version nickel plating apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2202136Y (en) * | 1994-07-21 | 1995-06-28 | 陈月明 | Conveying eletroplating machinery |
CN201165549Y (en) * | 2007-12-29 | 2008-12-17 | 上海和达汽车配件有限公司 | Metal pipeline surface anticorrosive treatment apparatus |
TW201134987A (en) * | 2010-04-01 | 2011-10-16 | Foxconn Advanced Tech Inc | Plating apparatus |
CN102747410A (en) * | 2012-07-25 | 2012-10-24 | 张军 | Open chain belt type barrel plating machine |
CN203498497U (en) * | 2013-07-09 | 2014-03-26 | 深圳市奥美特科技有限公司 | Dual-channel electroplating device |
-
2017
- 2017-08-17 CN CN201710706295.8A patent/CN107447247A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2202136Y (en) * | 1994-07-21 | 1995-06-28 | 陈月明 | Conveying eletroplating machinery |
CN201165549Y (en) * | 2007-12-29 | 2008-12-17 | 上海和达汽车配件有限公司 | Metal pipeline surface anticorrosive treatment apparatus |
TW201134987A (en) * | 2010-04-01 | 2011-10-16 | Foxconn Advanced Tech Inc | Plating apparatus |
CN102747410A (en) * | 2012-07-25 | 2012-10-24 | 张军 | Open chain belt type barrel plating machine |
CN203498497U (en) * | 2013-07-09 | 2014-03-26 | 深圳市奥美特科技有限公司 | Dual-channel electroplating device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109666955A (en) * | 2019-02-18 | 2019-04-23 | 福建泰兴特纸有限公司 | Radium-shine working version nickel plating apparatus |
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SE01 | Entry into force of request for substantive examination | ||
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171208 |
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RJ01 | Rejection of invention patent application after publication |