CN107446135B

CN107446135B - Dynamic polymer with dynamic cross-linked structure

Info

Publication number: CN107446135B
Application number: CN201610382046.3A
Authority: CN
Inventors: 不公告发明人
Original assignee: Weng Qiumei
Current assignee: Xiamen Tiance Material Technology Co ltd
Priority date: 2016-06-01
Filing date: 2016-06-01
Publication date: 2020-04-10
Anticipated expiration: 2036-06-01
Also published as: CN107446135A; WO2017206671A1

Abstract

The invention discloses a dynamic polymer with a dynamic cross-linked structure, which contains organic boric acid silicone ester bonds on a polymer chain skeleton of a cross-linked network and/or a cross-linked link skeleton between polymer chains, wherein the organic boric acid silicone ester bonds are necessary conditions for forming/maintaining the dynamic polymer structure. The dynamic polymer has rich structure and various performances, and dynamic polymers with different properties can be prepared by regulating and controlling the structure of reactants. In addition, the polymer can show the functional characteristics of stimulus responsiveness, self-repairing property, recoverability and the like due to the strong dynamic reversibility of the organic boric acid silicon ester bond in the polymer; meanwhile, the existence of the organic boric acid silicon ester bond enables the polymer to have an energy absorption effect and can toughen the polymer material in a specific structure. The dynamic polymer can be used for manufacturing shock absorption buffer materials, impact resistance protection materials, self-repairing materials, toughness materials and the like.

Description

Dynamic polymer with dynamic cross-linked structure

Technical Field

The invention relates to the field of intelligent polymers, in particular to a dynamic polymer with a dynamic cross-linking structure, which is formed by dynamic reversible covalent bonds.

Background

Dynamic chemistry is a cross discipline developed combining dynamic covalent chemistry of supramolecular chemistry and covalent chemistry. Whereas conventional molecular chemistry focuses on stable covalent interactions, dynamic chemistry focuses on some relatively weak non-covalent interactions and reversible covalent bonds. Among them, supramolecular chemistry is based on non-covalent intermolecular interactions, which are generally weaker in bond energy and more influenced by thermodynamics than conventional covalent bonds, and the formed supramolecular structure is not a stable system to some extent, is easily destroyed, and imposes many limitations on its characterization, research and application. In the case of dynamic covalent chemistry, it has some characteristics similar to supramolecular chemistry, and reversible covalent bond "breaking" and "formation" can occur under appropriate conditions; compared with supermolecule chemistry, the bond energy of the dynamic covalent bond in the dynamic covalent chemistry is larger than the intermolecular interaction force, so that the dynamic covalent bond has certain strength and can form a stable molecular structure. The dynamic covalent bond well combines the reversibility of the supermolecule non-covalent interaction and the stability of the covalent bond, so that the supermolecule non-covalent interaction is widely applied, and plays an important role in the aspects of constructing functional molecules and materials, developing chemical sensors, regulating and controlling biomolecules, controlling intelligent molecular switches and machines and the like.

Dynamic polymers are a novel class of polymer systems formed by linkage of dynamic chemical bonds. The dynamic polymers can be classified into physical type dynamic polymers based on supramolecular interactions and covalent type dynamic polymers based on dynamic covalent bonds, depending on the dynamic chemical bonds linking the dynamic polymers. The covalent dynamic polymer constructed by the dynamic reversible covalent bond also has remarkable characteristics due to the special properties of the dynamic reversible covalent bond. Compared with a physical dynamic polymer, the dynamic reversible covalent polymer is more stable and often has more excellent mechanical properties; and the existence of the dynamic reversible covalent bond also ensures that the polymer can show the characteristics of stimulus responsiveness, self-repairability, recyclability, reworkability and the like under proper conditions.

However, the chemical equilibrium process in conventional dynamic polymers is often slow due to the cleavage and formation of covalent bonds, and often requires the addition of catalysts or external energy to accelerate the equilibrium process. In addition, some reversible covalent bonds have certain defects in the practical use process, and the defects limit the use environment and the application field of the dynamic polymer. For example, the conventional transesterification reaction is the reversible exchange reaction which is the earliest one to use, but the conditions of the transesterification reaction are harsh, and generally the reaction can be completed under the conditions of adding alkali and refluxing, and meanwhile, the dynamic activity of the conventional ester bond is poor, so that the application of the dynamic polymer constructed by using the transesterification reaction is limited; products based on the Diels-Alder cycloaddition reaction of furan-maleimide generally require dissociation reaction under high temperature condition, and the reaction process is slow in organic solvent; imine bonds formed by the reaction of primary amines with aldehydes, which are strongly affected by the basicity of the acid, make such imine bonds difficult to stabilize under normal conditions; the reversible exchange reaction of amino transfer can be carried out under the action of special protease; the dissociation reaction temperature of the dynamic reversible bond based on the alkoxy nitrogen group is usually up to 100-130 ℃, and meanwhile, carbon center free radicals generated by dissociation of the alkoxy nitrogen group are sensitive to oxygen and high temperature, so that irreversible bonding caused by the dissociation reaction can affect the performance of the material; the dynamic polymer containing trithio ester group can generate dynamic exchange reaction under the condition of ultraviolet irradiation; the disulfide bond in the dynamic covalent bond has good dynamic property, can perform exchange reaction at low temperature, but has poor stability of mercaptan, and can react with ambient air to generate continuous oxidation in the using process, so that the content of the mercaptan in a reversible system is continuously reduced, and the use of the material is influenced. Under such circumstances, the characteristics of the dynamic reversible covalent bond are difficult to be fully embodied under normal conditions, and it is necessary to develop a novel dynamic polymer, so that the dynamic reversible covalent bond in the system can simultaneously satisfy the conditions of high reversible reaction speed, mild reaction conditions and controllable reversible reaction, so as to solve the above-mentioned problems in the prior art.

Disclosure of Invention

The present invention is made in view of the above-mentioned background, and provides a dynamic polymer having a dynamic crosslinked structure, which contains organoborate silicone bonds on the backbone of the polymer chains of the crosslinked network and/or on the backbone of the crosslinked links between the polymer chains, based on organoborate silicone bonds. The dynamic polymer has good stability and strong dynamic reversibility, can not need to additionally add external additives such as a catalyst, an accelerant and the like, can also not need illumination and high temperature conditions, can have good dynamic reversibility under general mild conditions, and can embody the characteristics of plasticity, dilatancy, self-repairability, recoverability, reworkability, bionic mechanical property and the like.

The invention is realized by the following technical scheme:

a dynamic polymer having a dynamic cross-linked structure, which contains organoboronate silicone linkages on the backbone of the polymer chains of the cross-linked network and/or on the backbone of cross-links between the polymer chains. Wherein the organoborate silicone bond is present as a polymerization linkage point and/or a crosslinking linkage point of the dynamic polymer, and is a necessary condition for forming/maintaining a structure of the dynamic polymer.

The organic boric acid silicone ester bond contained in the crosslinking network has the following structure:

wherein at least one borosilicate silicone bond (B-O-Si) is formed between the boron atom and the silicon atom; at least one carbon atom in the structure is connected with a boron atom through a boron-carbon bond, at least one organic group is connected to the boron atom through the boron-carbon bond, and at least part of the organic borate silicon ester bond is connected into a crosslinking network through the boron-carbon bond;

refers to a linkage to a polymer chain, a crosslink or any other suitable group through which at least one of the boron atom and the silicon atom, respectively, is attached to the crosslinked network. The organic boric acid silicon ester bonds contained in the dynamic polymer can be connected through the following structures: single bonds, heteroatom linkers, divalent or multivalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or multivalent polymer chain residues having a molecular weight greater than 1000 Da.

In an embodiment of the invention, the organoborate silicone linkage is formed by reacting an organoboronate group and/or organoborate group with a silicon hydroxyl group and/or a silicon hydroxyl precursor.

The organic boric acid group refers to a structural unit (B-OH) consisting of a boron atom and a hydroxyl group connected with the boron atom, wherein the boron atom is connected with at least one carbon atom through a boron-carbon bond, and at least one organic group is connected to the boron atom through the boron-carbon bond. In the present invention, one hydroxyl group (-OH) in the organic boronic acid group is a functional group.

The organoborate group means a structural unit (B-OR, wherein R is a hydrocarbon group mainly composed of carbon and hydrogen atoms OR a silane group mainly composed of silicon and hydrogen atoms, which is bonded to an oxygen atom through a carbon atom OR a silicon atom) and is composed of a boron atom, an oxygen atom bonded to the boron atom, and a hydrocarbon group OR a silane group bonded to the oxygen atom, and wherein the boron atom is bonded to at least one carbon atom through a boron-carbon bond and at least one organic group is bonded to the boron atom through the boron-carbon bond. In the present invention, one ester group (-OR) of the organoborate groups is a functional group.

The silicon hydroxyl group in the present invention refers to a structural unit (Si-OH) composed of a silicon atom and a hydroxyl group bonded to the silicon atom, wherein the silicon hydroxyl group may be an organosilicon hydroxyl group (i.e., the silicon atom in the silicon hydroxyl group is bonded to at least one carbon atom through a silicon-carbon bond, and at least one organic group is bonded to the silicon atom through the silicon-carbon bond), or an inorganic silicon hydroxyl group (i.e., the silicon atom in the silicon hydroxyl group is not bonded to an organic group), preferably an organosilicon hydroxyl group. In the present invention, one hydroxyl group (-OH) of the silicon hydroxyl groups is a functional group.

The silicon hydroxyl precursor refers to a structural element (Si-X) consisting of a silicon atom and a group which can be hydrolyzed to obtain a hydroxyl group, wherein X is the group which can be hydrolyzed to obtain the hydroxyl group and can be selected from halogen, cyano, oxygen cyano, sulfur cyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, acylamino, ketoxime and alkoxide. In the present invention, one group (-X) in the silicon hydroxyl precursor, which can be hydrolyzed to obtain a hydroxyl group, is a functional group.

The dynamic polymer described in the present invention can be prepared by the following embodiments:

in a first preparation embodiment of the invention, the dynamic polymer is obtained by reacting at least the following components:

at least one organoboron compound (I) containing organoboronic acid groups and/or organoborate groups, at least one silicon-containing compound (II) containing silicon hydroxyl groups and/or silicon hydroxyl group precursors; wherein the organoboron compound (I) and the silicon-containing compound (II) have two or more functional groups, and at least one of the organoboron compound (I) or at least one of the silicon-containing compound (II) has three or more functional groups.

In a second embodiment of the invention, the dynamic polymer is obtained by reacting at least the following components to form organoboronate silicone bonds and conventional covalent bonds:

at least one organoboron compound (I) containing organoboronic acid groups and/or organoborate groups, at least one silicon-containing compound (II) containing silicon hydroxyl groups and/or silicon hydroxyl group precursors; wherein the organoboron compound (I) and the silicon-containing compound (II) contain one or more functional groups, and at least one of the organoboron compound (I) or at least one of the silicon-containing compounds (II) contain one or more other reactive groups.

In a third embodiment of the invention, the dynamic polymer is obtained by reacting at least the following components:

at least one compound (III) containing both organoboronic acid groups and/or organoboronate groups and silicon hydroxyl groups and/or silicon hydroxyl precursor(s), or with at least one organoboron compound (I) containing organoboronic acid groups and/or organoboronate groups and/or at least one silicon-containing compound (II) containing silicon hydroxyl groups and/or silicon hydroxyl precursor(s); wherein each of the compound (III), the organoboron compound (I) and the silicon-containing compound (II) has two or more functional groups, and at least one of the compound (III) or the organoboron compound (I) or the silicon-containing compound (II) has three or more functional groups.

In a fourth preparative embodiment of the invention, the dynamic polymer is obtained by reacting at least the following components to form organoboronate silicone linkages and conventional covalent linkages:

at least one compound (III) containing both organoboronic acid groups and/or organoboronate groups and silicon hydroxyl groups and/or silicon hydroxyl precursor(s), or with at least one organoboron compound (I) containing organoboronic acid groups and/or organoboronate groups and/or at least one silicon-containing compound (II) containing silicon hydroxyl groups and/or silicon hydroxyl precursor(s); wherein the compound (III) contains two or more functional groups, the organoboron compound (I) and the silicon-containing compound (II) contain one or more functional groups, and at least one of the compound (III) or at least one of the organoboron compound (I) or at least one of the silicon-containing compounds (II) contains one or more other reactive groups.

In the above-mentioned preparation embodiment, it is also possible to selectively introduce an appropriate amount of the monofunctional organoboron compound (I) and/or the monofunctional silicon-containing compound (II) component, and the dynamic cross-linked structure can be obtained by adjusting the formulation of the components. The monofunctional compound can play a role in adjusting crosslinking density, dynamic property, mechanical strength and the like.

In the preparation embodiments described above, the reaction of the other reactive groups can also be achieved together by introducing a compound component which is free of organoboronate and/or organoboronate groups, silylhydroxy and/or silylhydroxy precursors, organoboronate silyllinkages, but which contains other reactive groups. The compound containing only the other reactive group may be any suitable compound which can achieve the object of reacting with the other reactive group in the organoboron compound (I) and/or the silicon-containing compound (II) and/or the compound (III) to obtain a dynamic polymer having the "dynamic crosslinked structure".

In the above-described production embodiment, the compound (III) used for producing the dynamic polymer may be selected from the same compound (III) or may be selected from different compounds (III); when it is chosen from the same class of compounds (III), it is obtained by intramolecular and/or intermolecular reaction between the organoboronic and/or organoboronate groups and the silicon hydroxyl groups and/or silicon hydroxyl precursor(s).

Other reactive groups referred to in the present invention are those which are capable of undergoing derivatization, either spontaneously or under conditions of initiator or light, heat, radiation, catalysis, etc., or undergoing polymerization/crosslinking reactions to form common covalent bonds in addition to organoborate silicone linkages, suitable groups being exemplified by: hydroxyl group, phenolic hydroxyl group, carboxyl group, acyl group, amide group, acyloxy group, amino group, aldehyde group, sulfonic group, sulfonyl group, mercapto group, alkenyl group, alkynyl group, cyano group, oxazinyl group, oxime group, hydrazine group, guanidino group, halogen group, isocyanate group, acid anhydride group, epoxy group, acrylate group, acrylamide group, maleimide group, N-hydroxysuccinimide group, norbornene group, azo group, azide group, heterocyclic group, etc.; the other reactive groups are preferably hydroxyl, carboxyl, amino, mercapto, alkenyl, isocyanate, epoxy, acrylate, acrylamide groups.

The organoboron compound (I) containing an organoboronate group and/or organoboronate group described in the present invention can be represented by the following structure:

wherein A is a module containing an organic boric acid group and/or an organic boric acid ester group; m is the number of the modules A, and m is more than or equal to 1; l is a substituent group on a single module A, or a linking group between two or more modules A; p is the number of groups L, and p is more than or equal to 1.

The module A containing the organic boric acid group can be selected from any one or any several structures as follows:

wherein, K₁Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atom, heteroAn atomic group, a small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a polymer chain residue having a molecular weight greater than 1000 Da; the ring structure in A4 is a non-aromatic or aromatic boron heterocyclic group containing at least one organic boric acid group, the boron atom is placed in the ring structure, the ring structure can be a small molecular ring or a macromolecular ring, and the ring structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in A4 are each independently a carbon atom, a boron atom or other hetero atom, and at least one ring-forming atom is a boron atom and constitutes an organoboronic acid group, and at least one ring-forming atom is bonded to the group L; the hydrogen atoms on the respective ring-forming atoms of the cyclic structure in a4 may or may not be substituted; the cyclic structure in A4 can be a single-ring structure, a multi-ring structure, a spiro ring structure, a fused ring structure, a bridged ring structure or a nested ring structure;

represents a linkage to the group L; the boron atoms in the various structures are linked to at least one carbon atom by a boron-carbon bond, and at least one organic group is linked to the boron atom by the boron-carbon bond.

The organoborate group-containing module A can be selected from any one or any several of the following structures:

wherein, K₂Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not exceeding 1000Da, polymer chain residues with molecular weight greater than 1000 Da; r₁、R₂、R₃、R₄、R₆Is a monovalent organic group or a monovalent organosilicon group directly bonded to an oxygen atom through a carbon atom or a silicon atom, selected from any of the following structures: small hydrocarbon group with molecular weight not more than 1000Da, small silane group with molecular weight not more than 1000Da, and small silane group with molecular weight more than 1000DaA polymer chain residue; r₅Is a divalent organic or a divalent organosilicon radical directly bonded to two oxygen atoms, directly bonded to the oxygen atoms through carbon or silicon atoms, selected from any of the following structures: a divalent small molecule hydrocarbon group having a molecular weight of no more than 1000Da, a divalent small molecule silane group having a molecular weight of no more than 1000Da, and a divalent polymer chain residue having a molecular weight greater than 1000 Da; the ring structure in B5 is a non-aromatic or aromatic boron heterocyclic group containing at least one organic borate group, the boron atom is placed in the ring structure, the ring structure can be a small molecular ring or a macromolecular ring, and the ring structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in B5 are each independently a carbon atom, a boron atom or other heteroatom, and at least one ring-forming atom is a boron atom and constitutes an organoborate group, and at least one ring-forming atom is linked to the group L; the hydrogen atoms on each ring-forming atom of the cyclic structure in B5 may or may not be substituted; the ring structure in B5 can be a single ring structure, a multi-ring structure, a spiro ring structure, a fused ring structure, a bridged ring structure or a nested ring structure;

In the module A containing the organic boric acid group and/or the organic boric acid ester group, one boron atom can be simultaneously connected with one hydroxyl group and one ester group, and at least one boric hydroxyl group and at least one boric acid ester group can be simultaneously arranged in the same module.

In the present invention, when the block A containing an organoboronic acid group and/or organoboronate group is present in a polymer and there are two or more of the linkages, it may be linked to a polymer chain that is not cyclic or clustered, or to cyclic or clustered side groups/side chains; when there is only one such linkage, it may be attached at any position of the polymer chain.

When m is 1, p is 1 or 2, and L is a substituent on the single module a; when p ═ 2, L can be selected from the same structure or a plurality of different structures; the structure of the L can be selected from any one or more of the following: small hydrocarbon groups with molecular weight not exceeding 1000Da, and polymer chain residues with molecular weight greater than 1000 Da.

When m is greater than 1, the modules A can be selected from the same structure or a plurality of different structures, wherein p is more than or equal to 1, and L is a connecting group between two or more modules A; when p is more than or equal to 2, L can be selected from the same structure or a plurality of different structures; the structure of the L can be selected from any one or more of the following: single bonds, heteroatom linkers, divalent or polyvalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or polyvalent polymer chain residues having a molecular weight greater than 1000 Da.

The silicon-containing compound (II) containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor described in the present invention may be an organic silicon-containing compound or an inorganic silicon-containing compound, which may be represented by the following structure:

wherein G is a module containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor; n is the number of the modules G, and n is more than or equal to 1; j is a substituent group on a single module G, or a linking group between two or more modules G; q is the number of the groups J, and q is more than or equal to 1.

The module G containing the silicon hydroxyl can be selected from any one or any several structures of the following:

wherein, K₃、K₄、K₅、K₆、K₇Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atom, hetero atom group, small molecule alkyl with molecular weight not more than 1000Da, polymer chain residue with molecular weight more than 1000Da, molecular weight not more than 1Inorganic small molecular chain residue of 000Da and inorganic large molecular chain residue with molecular weight more than 1000 Da; wherein, the cyclic structure in C7, C8 and C9 is a non-aromatic or aromatic silicon heterocyclic group containing at least one silicon hydroxyl group, a silicon atom is placed in the cyclic structure, the cyclic structure can be a micromolecular ring or a macromolecular ring, and the cyclic structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, and more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in C7, C8, C9 are each independently a carbon atom, a silicon atom, or other hetero atom, and at least one ring-forming atom is a silicon atom and constitutes a silicon hydroxyl group, and at least one ring-forming atom is bonded to the group J; the hydrogen atoms on the ring-forming atoms of the cyclic structures in C7, C8, and C9 may or may not be substituted; the cyclic structure in C7, C8 and C9 can be a single-ring structure, a multi-ring structure, a spiro structure, a fused ring structure, a bridged ring structure or a nested ring structure;

represents a linkage to the group J.

The module G containing the silicon hydroxyl precursor can be selected from any one or any several structures of the following:

wherein, K₈、K₉、K₁₀、K₁₁、K₁₂Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecular hydrocarbon groups with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic small molecular chain residues with the molecular weight not more than 1000Da and inorganic large molecular chain residues with the molecular weight more than 1000 Da; x₁、X₂、X₃、X₄、X₅、X₆、X₇、X₈、X₉、X₁₀、X₁₁、X₁₂、X₁₃、X₁₄Is a hydrolyzable group directly bonded to the silicon atom, including but not limited to halogen, cyano, oxacyano, thiocyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, amido, ketoxime, alkoxide, preferably halogen, alkoxy; the cyclic structure of D7, D8 and D9 is a nonaromatic or aromatic silicon heterocyclic group containing at least one silicon hydroxyl precursor, the silicon atom is placed in the cyclic structure, the cyclic structure can be a micromolecular ring or a macromolecular ring, and the cyclic structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, and more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in D7, D8, D9 are each independently a carbon atom, a silicon atom or other hetero atom, and at least one of the ring-forming atoms is a silicon atom and constitutes a silicon hydroxyl group precursor, and at least one of the ring-forming atoms is bonded to the group J; the hydrogen atoms on the ring-forming atoms of the cyclic structures in D7, D8 and D9 may or may not be substituted; the cyclic structures in D7, D8 and D9 can be single-ring structures, multi-ring structures, spiro structures, fused ring structures, bridged ring structures and nested ring structures;

represents a linkage to the group J. In the above structures, rings may also be formed between suitable different groups K, different groups X, and between groups K and X.

In the invention, in the module G containing the silicon hydroxyl and/or the silicon hydroxyl precursor, at least one hydroxyl and at least one hydroxyl precursor can be simultaneously connected to one silicon atom, and at least one silicon hydroxyl precursor can be simultaneously connected in the same module.

In the present invention, when the module G containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor is present in a polymer and there are two or more of the linkages, it may be linked to a polymer chain that is not cyclic or not clustered, or to cyclic or clustered side groups/side chains; when there is only one such linkage, it may be attached at any position of the polymer chain.

When n is 1, q is 1,2 or 3, J is a substituent on the single module G; when q is 2 or 3, J may be selected from the same structure or a plurality of different structures; the J structure can be selected from any one or more of the following: hydrogen atoms, heteroatom groups, micromolecular hydrocarbon groups with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da and inorganic macromolecular chain residues with the molecular weight more than 1000 Da.

When n is greater than 1, the modules G can be selected from the same structure or a plurality of different structures, wherein q is more than or equal to 1, and J is a connecting group between two or more modules G; when q is more than or equal to 2, J can be selected from the same structure or a plurality of different structures; the J structure can be selected from any one or more of the following: a single bond, a heteroatom linking group, a divalent or polyvalent small molecule alkyl group with the molecular weight not more than 1000Da, a divalent or polyvalent polymer chain residue with the molecular weight more than 1000Da, a divalent or polyvalent inorganic small molecule chain residue with the molecular weight not more than 1000Da, and a divalent or polyvalent inorganic large molecule chain residue with the molecular weight more than 1000 Da.

The compound (III) containing both an organoboronate and/or organoboronate group and a silicon hydroxyl and/or silicon hydroxyl precursor as described in the present invention can be represented by the following structure:

wherein, A is a module containing an organoboronic acid group and/or an organoboronate group, and the specific definition thereof can refer to the definition of the module A in the organoboron compound (I), which is not described herein again; x is the number of the modules A, and x is more than or equal to 1; when x is larger than or equal to 2, the module A can be selected from the same structure or a plurality of different structures; g is a module containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor, and for specific definition, reference may be made to the definition of the module G in the silicon-containing compound (II), which is not described herein again; y is the number of the modules G, and y is more than or equal to 1; when y is more than or equal to 2, the module G can be selected from the same structure or a plurality of different structures; t is a connecting group between two or more A, or between two or more G, or between A and G, and the structure of T can be selected from any one or more of the following: single bonds, heteroatom linkers, divalent or multivalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or multivalent polymer chain residues having a molecular weight greater than 1000 Da; v is the number of groups T, and v is more than or equal to 1; when v.gtoreq.2, T can be selected from the same structure or a plurality of different structures.

In addition to the organoboron compound (I), the silicon-containing compound (II), and the compound (III), other reactive groups may be optionally contained.

In a fifth production embodiment of the present invention, the dynamic polymer is obtained at least from one or more compounds (IV) containing at least one organoboronate silicone bond and at least one other reactive group by polymerization/crosslinking reaction between the other reactive groups; or at least one or more compounds (IV) containing at least one organoboronate silicon ester bond and at least one other reactive group and compounds which do not contain organoboronate silicon ester bonds but contain at least one other reactive group are polymerized/crosslinked by the other reactive groups to obtain the dynamic polymer.

As the compound (IV), there are generally mentioned a monomer having an organoborate silicone bond, an oligomer having an organoborate silicone bond, and a prepolymer having an organoborate silicone bond.

The compound (IV) containing an organoboronate silicone bond and other reactive groups described in the present invention can be represented by the following structure:

wherein E is a module containing an organoborate silicone bond; u is the number of the modules E, and u is more than or equal to 1; y is a substituent group on a single module E, or a substituent group on a single module E and a linking group between two or more modules E, and at least one group Y is linked to a boron atom of an organoboronate silicone bond and at least one group Y is linked to a silicon atom of an organoboronate silicone bond; wherein at least one group Y contains at least one other reactive group, and the number of other reactive groups contained in all groups Y is 2 or more; r is the number of the groups Y, and r is more than or equal to 2.

The organic borate silicon ester bond-containing module E can be represented by the following structure:

wherein, K₁₃、K₁₆、K₂₀Are groups directly attached to the boron atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not more than 1000Da, and polymer chain residues with molecular weight more than 1000 Da; k₁₄、K₁₅、K₁₇、K₁₈、K₁₉、K₂₁Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, micromolecular hydrocarbyl with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da, and inorganic macromolecular chain residues with the molecular weight more than 1000 Da;

represents a linkage to the group Y. In the above structures, rings may also be formed between suitable different groups K, different groups Y, and between groups K and groups Y; the radical Y may be bonded to the boron atom via a Si-O bond or may be bonded to the silicon atom via a B-O bond.

When u is 1, r is 2,3, 4 or 5, Y is a substituent group on a single module E, Y may be selected from the same structure or a plurality of different structures, and the number and structure of the other reactive groups contained in Y must be such that the dynamic polymer can be obtained; the structure of Y can be selected from any one or more of the following: small hydrocarbon groups with molecular weight not exceeding 1000Da, and polymer chain residues with molecular weight greater than 1000 Da.

When u is greater than 1, the module E can be selected from the same structure or a plurality of different structures, wherein r is more than or equal to 2, Y is a substituent group on a single module E and a connecting group between two or more modules E, Y can be selected from the same structure or a plurality of different structures, and the number and the structure of other reactive groups contained in Y must ensure that the dynamic polymer can be obtained; the Y structure can be selected from any one or more of small molecular alkyl with the molecular weight not more than 1000Da, polymer chain residue with the molecular weight more than 1000Da, single bond, heteroatom linking group, bivalent or multivalent small molecular alkyl with the molecular weight not more than 1000Da, and bivalent or multivalent polymer chain residue with the molecular weight more than 1000 Da.

When a cyclic structure is formed between the group Y connected with the boron atom of the organoborate silicone bond and the group Y connected with the silicon atom of the organoborate silicone bond, a compound (IV) in which the organoborate silicone bond is located in the cyclic structure can be obtained, and under appropriate conditions, the dynamic crosslinked polymer can be obtained by utilizing the dynamic property of the organoborate silicone bond and the polymerization/crosslinking reaction of other reactive groups.

The dynamic polymer in the present invention is not limited to the preparation using the above embodiment. However, in the embodiment, the preparation of the dynamic polymer using the organic boron compound (I), the silicon-containing compound (II), the compound (III) and the compound (IV) as raw materials, in the form of a compound as a raw material for synthesis, or in the form of an intermediate product for synthesizing the polymer, which can be obtained according to the teaching of the present invention, is included in the scope of the present invention.

In summary, the dynamic polymer can be obtained by using at least one or more of the following compounds as raw materials:

an organoboron compound (I) containing organoboronic acid groups and/or organoborate groups; a silicon-containing compound (II) containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor; a compound (III) containing both an organoboronic acid group and/or organoboronate group and a silicon hydroxyl group and/or silicon hydroxyl group precursor; a compound (IV) containing organoborate silicone linkages and other reactive groups; wherein the organoboron compound (I), the silicon-containing compound (II), and the compound (III) each have at least one functional group; wherein, the organic boron compound (I), the silicon-containing compound (II) and the compound (III) can contain or not contain other reactive groups; wherein the organic boron compound (I) or the silicon-containing compound (II) is not used alone as a raw material for preparing the dynamic polymer.

The organoboron compound (I) and/or the organoboron compound (III) can form an organoborate silicone bond by a condensation reaction or a transesterification reaction of an organoboronic acid group and/or an organoboronate group with a silicon hydroxyl group (including a silicon hydroxyl group precursor capable of being converted to a silicon hydroxyl group) in the silicon-containing compound (II) and/or the compound (III), to obtain a dynamic polymer. In addition, the organoboron compound (I), the silicon-containing compound (II) and the compound (III) can also be commonly covalently linked by polymerization/crosslinking reaction optionally using other reactive groups, so that the organoboron group and/or organoborate group and the silicon hydroxyl group and/or silicon hydroxyl group precursor are jointly reacted to obtain the dynamic polymer.

The organoborate silicone bond-containing compound (IV) is generally obtained by the mutual reaction between other reactive groups contained in the compound (IV) or the mutual reaction between other reactive groups contained in the compound (IV) and other reactive groups contained in other compounds not containing organoborate silicone bonds.

In the preparation process of the dynamic polymer, some additive auxiliaries and fillers can be added for blending to jointly form the dynamic polymer, but the additives are not necessary.

The dynamic polymer has wide-range adjustable performance, can be applied to various fields, has wide application prospect, and has remarkable application effect in the fields of military and aerospace equipment, functional coatings and coatings, biomedicine, biomedical materials, energy, buildings, bionics, intelligent materials and the like. In particular, the material can be applied to the manufacture of products such as shock absorbers, buffer materials, impact-resistant protective materials, sports protective products, military police protective products, self-repairable coatings, self-repairable plates, self-repairable adhesives, tough materials, toys and the like.

Compared with the prior art, the invention has the following beneficial effects:

(1) the dynamic polymer has rich structure and various performances. The organic boron compound (I) containing organic boric acid groups and/or organic boric acid ester groups, the silicide (II) containing silicon hydroxyl groups and/or silicon hydroxyl precursor, the compound (III) containing both organic boric acid groups and/or organic boric acid ester groups and silicon hydroxyl groups and/or silicon hydroxyl precursor and the compound (IV) containing organic boric acid silicon ester bonds are used as reaction raw materials to prepare the dynamic polymer by formula combination, so that the advantage of structural diversity of the reaction raw materials is fully embodied. In the invention, dynamic polymers with different structures can be prepared by adjusting the number of functional groups, the molecular structure and the molecular weight in the raw material compound and/or introducing reactive groups, groups for promoting the dynamic property, groups with the functional property and/or adjusting the parameters of the raw material composition and the like in the raw material compound, so that the dynamic polymers can show various performances. The organic boron compound is beneficial to homogeneous reaction in the preparation process of the dynamic polymer, the reaction efficiency is improved in the reaction process, and the uniformity and the hydrolytic stability of the product are also improved. And some inorganic boric acid silicone ester bonds prepared from inorganic boron compounds are often single in structure, fixed in functional group number, and generally subjected to heterogeneous reaction, so that the prepared products are easy to absorb water and hydrolyze to lose efficacy, and thus the corresponding effects cannot be achieved.

(2) The dynamic polymer has strong dynamic reactivity and mild dynamic reaction conditions. Compared with other existing dynamic covalent systems, the organic boric acid silicone ester bond has good thermal stability and high dynamic reversibility, synthesis and dynamic reversibility of dynamic polymers can be realized under the conditions of no need of a catalyst, no need of high temperature, illumination or specific pH, preparation efficiency is improved, limitation of use environment is reduced, and application range of the polymers is expanded. In addition, by selectively controlling other conditions (such as adding auxiliary agents, adjusting reaction temperature and the like), the dynamic covalent chemical equilibrium can be accelerated or quenched to be in a required state under a proper environment, which is difficult to achieve in the existing supramolecular chemistry and dynamic covalent system.

(3) The dynamic reversibility of the organoborate silicone bond can also be regulated by adjusting the structure of the group adjacent to the organoborate silicone bond and the structure of the polymer chain. Compared with a common covalent bond and the existing common dynamic covalent bond, the organic boric acid silicone bond can be better used as an adjustable 'sacrificial bond' to generate reversible fracture and consume a large amount of energy when stressed, so that stress is mainly concentrated at the organic boric acid silicone bond to be dissipated, an energy absorption effect is achieved, and an excellent toughening effect is achieved in a specific structure; compared with the existing supermolecule interaction force, the covalent bond of the organic boric acid silicon ester bond in the invention has the advantages that the energy required for breaking is higher due to the nature of the covalent bond, so that more energy can be dissipated, and the energy absorption property and toughness of the material are better improved; compared with inorganic boric acid silicon ester bonds, the inorganic boric acid silicon ester bond has larger regulation and control freedom degree.

Detailed Description

The invention relates to a dynamic polymer with a dynamic cross-linked structure, which contains organic borate silicone bonds on the polymer chain skeletons of a cross-linked network and/or on the cross-linked chain skeletons between polymer chains. Wherein the organoborate silicone bond exists as a polymerization linkage point and/or a crosslinking linkage point of the dynamic polymer, which is a necessary condition for forming/maintaining a dynamic polymer structure; once the organoborate silicone bond contained in the dynamic polymer is dissociated, the polymer system can be decomposed into any one or more of the following units: monomers, polymer chain fragments, linear polymer units, non-crosslinked polymer units, polymer cluster units, and the like; meanwhile, the mutual conversion and dynamic reversibility can be realized between the dynamic polymer and the units through the bonding and the dissociation of the organic boric acid silicon ester bond.

The dynamic polymer may contain organoborate silicone bonds only on the polymer chain skeletons of the crosslinked network, may contain organoborate silicone bonds only on the crosslinked link skeletons between the polymer chains of the crosslinked network, or may contain organoborate silicone bonds both on the crosslinked link skeletons of the crosslinked network and on the crosslinked link skeletons between the polymer chains.

refers to a linkage to a polymer chain, a crosslink or any other suitable group through which at least one of the boron atom and the silicon atom, respectively, is attached to the crosslinked network. The organic boric acid silicon ester bonds contained in the dynamic polymer are connected through the following structures: single bonds, heteroatom linkers, divalent or polyvalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or polyvalent polymer chain residues having a molecular weight greater than 1000 Da.

The dynamic polymer has a cross-linked structure. The term "crosslinked structure" refers to a three-dimensional infinite network structure of a dynamic polymer, which is generally formed by homopolymerization or copolymerization of at least one monomer or prepolymer containing three or more functional groups/reactive groups capable of participating in a crosslinking reaction, or by a crosslinking reaction between linear or nonlinear polymer chains. In the crosslinked network, the polymer chain backbone is any segment present in the crosslinked network; the cross-linked links between polymer chains may be an atom, a single bond, a group, a segment, a cluster, etc., and thus the backbone of the cross-linked links between polymer chains may also be considered as the backbone of the polymer chains. In the present invention, since the organoboronate silicone bond is contained on the polymer chain skeleton of the crosslinked network and/or the crosslinked link skeleton between the polymer chains, and the disassembly and reconstruction of the polymer network structure can be achieved by the dissociation and bonding of the organoboronate silicone bond, the dynamic polymer has a "dynamic crosslinked structure".

In an embodiment of the invention, the organoborate silicone linkage is formed by reacting an organoboronate group and/or organoborate group with a silicon hydroxyl group and/or a silicon hydroxyl precursor. Where any suitable organoboronate group and/or organoboronate group may be used in combination with the silicon hydroxyl group and/or silicon hydroxyl group precursor to form the organoboronate silicone bond, preferably the organoboronate group is used in combination with the silicon hydroxyl group, and the organoboronate group is used in combination with the silicon hydroxyl group, more preferably the organoboronate group is used in combination with the silicon hydroxyl group, and even more preferably the organoboronate group is used in combination with the silicon hydroxyl group to form the organoboronate silicone bond.

The silicon hydroxyl precursor refers to a structural element (Si-X) consisting of a silicon atom and a group which can be hydrolyzed to obtain a hydroxyl group, wherein X is the group which can be hydrolyzed to obtain the hydroxyl group and can be selected from halogen, cyano, oxygen cyano, sulfur cyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, acylamino, ketoxime and alkoxide. Examples of suitable silicon hydroxyl precursors are: Si-Cl, Si-CN, Si-CNS, Si-CNO, Si-SO₄CH₃，Si-OB(OCH₃)₂，Si-NH₂，Si-N(CH₃)₂，Si-OCH₃，Si-COCH₃，Si-OCOCH₃，Si-CONH₂， Si-O-N＝C(CH₃)₂Si-ONa. In the present invention, one group (-X) in the silicon hydroxyl precursor, which can be hydrolyzed to obtain a hydroxyl group, is a functional group.

The functional groups in the present invention refer to the hydroxyl groups in the organoboronic acid groups, or the ester groups in the organoboronate groups, or the hydroxyl groups in the silicon hydroxyl groups, or the groups in the silicon hydroxyl precursors that can be hydrolyzed to give hydroxyl groups, or combinations thereof, unless otherwise specified.

In the present invention, the organoboronate group and the organoboronate group may be present in the same compound or may be present in different compounds; the silicon hydroxyl group and the silicon hydroxyl group precursor are generally present in different compounds, but may be present in the same compound when they may coexist; when the organoboronate and/or organoboronate groups may be present with the silicon hydroxyl and/or silicon hydroxyl precursor, they may also be present in the same compound. In the invention, the compound containing the organoboronate and/or organoboronate group but not containing the silicon hydroxyl group and/or silicon hydroxyl precursor is the organoboron compound (I) in the invention, which can be a small molecular compound with a molecular weight not exceeding 1000Da or a large molecular compound with a molecular weight larger than 1000 Da; the compound containing the silicon hydroxyl and/or the silicon hydroxyl precursor but not containing the organic boric acid group and/or the organic boric acid ester group is the silicon-containing compound (II) in the invention, and can be a small molecular compound with the molecular weight not more than 1000Da or a large molecular compound with the molecular weight more than 1000 Da; the compound containing the organic boric acid group and/or the organic borate group and the silicon hydroxyl group and/or the silicon hydroxyl group precursor is the compound (III) in the invention, and the compound can be a small molecular compound with the molecular weight not more than 1000Da or a large molecular compound with the molecular weight more than 1000 Da.

wherein, K₁Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not exceeding 1000Da, polymer chain residues with molecular weight greater than 1000 Da; wherein the cyclic structure in A4 is a non-aromatic ring containing at least one organic boronic acid groupA boron atom is placed in a ring structure, the ring structure can be a small molecular ring or a large molecular ring, and the ring structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, and more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in A4 are each independently a carbon atom, a boron atom or other hetero atom, and at least one ring-forming atom is a boron atom and constitutes an organoboronic acid group, and at least one ring-forming atom is bonded to the group L; the hydrogen atoms on the respective ring-forming atoms of the cyclic structure in a4 may or may not be substituted; the cyclic structure in A4 can be a single-ring structure, a multi-ring structure, a spiro ring structure, a fused ring structure, a bridged ring structure or a nested ring structure;

Wherein the cyclic structure in a4 may be selected from any one of the following groups, any unsaturated form, any substituted form, or any hybridized form: boracycloalkanes, borabenzenes, boranaphthalenes, boraxanthenes, boraphenanthrenes, boraarenes; preferred cyclic structures listed are borolane, borohexane, borohexene, borohexadiene, borocyclohexenone, and borobenzene. For example:

wherein, K₂Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atoms, hetero atom groups, small molecules with a molecular weight not exceeding 1000DaHydrocarbyl, polymer chain residue of molecular weight greater than 1000 Da; r₁、R₂、R₃、R₄、R₆Is a monovalent organic group or a monovalent organosilicon group directly bonded to an oxygen atom through a carbon atom or a silicon atom, selected from any of the following structures: a small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a small molecule silyl group having a molecular weight of no more than 1000Da, a polymer chain residue having a molecular weight greater than 1000 Da; r₅Is a divalent organic or a divalent organosilicon radical directly bonded to two oxygen atoms, directly bonded to the oxygen atoms through carbon or silicon atoms, selected from any of the following structures: a divalent small molecule hydrocarbon group having a molecular weight of no more than 1000Da, a divalent small molecule silane group having a molecular weight of no more than 1000Da, and a divalent polymer chain residue having a molecular weight greater than 1000 Da; the ring structure in B5 is a non-aromatic or aromatic boron heterocyclic group containing at least one organic borate group, the boron atom is placed in the ring structure, the ring structure can be a small molecular ring or a macromolecular ring, and the ring structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in B5 are each independently a carbon atom, a boron atom or other heteroatom, and at least one ring-forming atom is a boron atom and constitutes an organoborate group, and at least one ring-forming atom is linked to the group L; the hydrogen atoms on each ring-forming atom of the cyclic structure in B5 may or may not be substituted; the ring structure in B5 can be a single ring structure, a multi-ring structure, a spiro ring structure, a fused ring structure, a bridged ring structure or a nested ring structure;

Wherein the cyclic structure in B5 may be selected from any one of the following groups, any unsaturated form, any substituted form, or any hybridized form: boracycloalkanes, borabenzenes, boranaphthalenes, boraxanthenes, boraphenanthrenes, boraarenes; preferred cyclic structures listed are borolane, borohexane, borohexene, borohexadiene, borocyclohexenone, and borobenzene. For example:

in the present invention, in the module a containing an organic boronic acid group and/or an organic boronic acid ester group, a boron atom may be simultaneously connected with a hydroxyl group and an ester group, and the same module may also simultaneously contain at least one boronic hydroxyl group and at least one boronic acid ester group, for example:

the compound contains organic boric acid group and organic boric acid ester group, which is helpful to regulate and control the solubility, reaction rate, reaction degree and other parameters of the compound, and can be used for regulating and controlling the dynamic property and other properties of the dynamic polymer.

When m is 1, p is 1 or 2, and L is a substituent on the single module a; when p ═ 2, L can be selected from the same structure or a plurality of different structures; the structure of the L can be selected from any one or more of the following: small hydrocarbon groups with molecular weight not exceeding 1000Da, and polymer chain residues with molecular weight greater than 1000 Da. The structures of suitable organoboron compounds (I) formed are illustrated below:

wherein g, h and j are respectively and independently a fixed value or an average value, g is more than or equal to 1, h is more than or equal to 1, and j is more than or equal to 1.

The structures of the above-exemplified organoboron compounds (I) are only provided to better illustrate typical structures of organoboron compounds (I) under such conditions, and only some representative structures under such conditions are provided, not to limit the scope of the present invention.

When L is selected from single bonds, it may be selected from boron-boron single bonds, carbon-carbon single bonds, carbon-nitrogen single bonds, nitrogen-nitrogen single bonds, boron-carbon single bonds, boron-nitrogen single bonds; preferably a boron-boron single bond, a boron-carbon single bond, or a carbon-carbon single bond. The structures of suitable organoboron compounds (I) formed are illustrated below:

wherein g and h are respectively and independently a fixed value or an average value, g is more than or equal to 1, and h is more than or equal to 1.

When L is selected from a heteroatom linking group, it may be selected from any one or a combination of any of the following: an ether group, a sulfur group, a disulfide group, a divalent tertiary amine group, a trivalent tertiary amine group, a divalent silicon group, a trivalent silicon group, a tetravalent silicon group, a divalent phosphorus group, a trivalent phosphorus group, a divalent boron group, a trivalent boron group; the heteroatom linking group is preferably an ether group, a sulfide group, a divalent tertiary amine group, or a trivalent tertiary amine group. The structures of suitable organoboron compounds (I) formed are illustrated below:

When L is selected from the group consisting of small divalent or polyvalent hydrocarbyl radicals having a molecular weight of not more than 1000Da, which generally contain from 1 to 71 carbon atoms, the hydrocarbyl radical may have a valence of from 2 to 144, which may or may not contain a heteroatom group. In general terms, the divalent or multivalent small molecule hydrocarbon group may be selected from any of the following groups, an unsaturated form of any, a substituted form of any, or a hybridized form of any: two to one hundred forty-four valence C_1-71Alkyl, two to one hundred forty-four ring C_3-71Alkyl, di-to hexavalent phenyl, di-to octavalent benzyl, di-to one hundred forty tetravalent aromatic hydrocarbon radicals; l is preferably a di-to tetravalent methyl group, a di-to hexavalent ethyl group, a di-to octahedral propyl group, a di-to hexavalent cyclopropane group, a di-to octahedral cyclobutyl group, a di-to decavalent cyclopentyl group, a di-to dodecavalent cyclohexyl group, or a di-to hexavalent phenyl group. The structures of suitable organoboron compounds (I) formed are illustrated below:

When L is selected from the group consisting of divalent or polyvalent polymer chain residues having a molecular weight greater than 1000Da, it can be any suitable divalent or polyvalent polymer chain residue, including but not limited to divalent or polyvalent carbon chain polymer residues, divalent or polyvalent heterochain polymer residues, and divalent or polyvalent organic polymer residues, wherein the polymer can be a homopolymer, or a copolymer of any of several monomers, oligomers, or polymers, and the polymer chain can be a flexible chain or a rigid chain.

When L is selected from divalent or polyvalent carbon chain polymer residues, it may be any suitable polymer residue whose macromolecular backbone consists essentially of carbon atoms, which may be selected from any of the following groups, any unsaturated form, any substituted form, or any hybridized form: divalent or polyvalent polyolefin-based chain residue such as divalent or polyvalent polyethylene chain residue, divalent or polyvalent polypropylene chain residue, divalent or polyvalent polyisobutylene chain residue, divalent or polyvalent polystyrene chain residue, divalent or polyvalent polyvinyl chloride chain residue, divalent or polyvalent polyvinylidene chloride chain residue, divalent or polyvalent polyvinyl fluoride chain residue, divalent or polyvalent polytetrafluoroethylene chain residue, divalent or polyvalent polychlorotrifluoroethylene chain residue, divalent or polyvalent polyvinyl acetate chain residue, divalent or polyvalent polyvinyl alcohol chain residue, divalent or polyvalent polyvinyl alkyl ether chain residue, divalent or polyvalent polybutadiene chain residue, divalent or polyvalent polyisoprene chain residue, divalent or polyvalent polychloroprene chain residue, divalent or polyvalent polynorbornene chain residue and the like; a divalent or polyvalent polyacrylic chain residue such as a divalent or polyvalent polyacrylic chain residue, a divalent or polyvalent polyacrylamide chain residue, a divalent or polyvalent polymethyl acrylate chain residue, a divalent or polyvalent polymethyl methacrylate chain residue, or the like; divalent or polyvalent polyacrylonitrile chain residue, such as divalent or polyvalent polyacrylonitrile chain residue, etc. L is preferably a divalent or polyvalent polyethylene chain residue, a divalent or polyvalent polypropylene chain residue, a divalent or polyvalent polystyrene chain residue, a divalent or polyvalent polyvinyl chloride chain residue, a divalent or polyvalent polybutadiene chain residue, a divalent or polyvalent polyisoprene chain residue, a divalent or polyvalent polyacrylic chain residue, a divalent or polyvalent polyacrylamide chain residue, or a divalent or polyvalent polyacrylonitrile chain residue. The structures of suitable organoboron compounds (I) formed are exemplified below:

wherein g, h, i, j, k are each independently a fixed value or an average value, preferably g.gtoreq.36, h.gtoreq.36, i.gtoreq.36, j.gtoreq.12, k.gtoreq.12.

When L is selected from divalent or polyvalent heterochain polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of carbon atoms and heteroatoms such as nitrogen, oxygen, sulfur, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent polyether-based chain residues such as divalent or polyvalent paraformaldehyde chain residues, divalent or polyvalent polyethylene oxide chain residues, divalent or polyvalent polypropylene oxide chain residues, divalent or polyvalent polytetrahydrofuran chain residues, divalent or polyvalent epoxy resin chain residues, divalent or polyvalent phenol resin chain residues, divalent or polyvalent polyphenylene ether chain residues, and the like; divalent or polyvalent polyester chain residues such as divalent or polyvalent polycaprolactone chain residues, divalent or polyvalent polypentalactone chain residues, divalent or polyvalent polylactide chain residues, divalent or polyvalent polyethylene terephthalate chain residues, divalent or polyvalent unsaturated polyester chain residues, divalent or polyvalent alkyd resin chain residues, divalent or polyvalent polycarbonate chain residues, and the like; divalent or polyvalent polyamine-based chain residues such as divalent or polyvalent polyamide chain residues, divalent or polyvalent polyimide chain residues, divalent or polyvalent polyurethane chain residues, divalent or polyvalent polyurea chain residues, divalent or polyvalent urea-formaldehyde resin chain residues, divalent or polyvalent melamine resin chain residues, and the like; divalent or polyvalent polysulfide-like chain residues, such as divalent or polyvalent polysulfone chain residues, divalent or polyvalent polyphenylene sulfide chain residues, divalent or polyvalent polysulfide rubber chain residues, and the like. L is preferably a divalent or polyvalent polyoxymethylene chain residue, a divalent or polyvalent polyethylene oxide chain residue, a divalent or polyvalent polytetrahydrofuran chain residue, a divalent or polyvalent epoxy resin chain residue, a divalent or polyvalent polycaprolactone chain residue, a divalent or polyvalent polylactide chain residue, or a divalent or polyvalent polyamide chain residue. The structures of suitable organoboron compounds (I) formed are illustrated below:

When L is selected from divalent or polyvalent organic polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of heteroatoms of inorganic elements such as silicon, boron, aluminum, and the like, and heteroatoms of nitrogen, oxygen, sulfur, phosphorus, and the like, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent organosilicon-based polymer chain residues such as divalent or polyvalent polyorganosiloxane chain residues, divalent or polyvalent polyorganosiloxane sulfur chain residues, divalent or polyvalent polyorganophosiloxane chain residues, divalent or polyvalent polyorganopolysiloxane chain residues; divalent or polyvalent organoboron polymer chain residues such as divalent or polyvalent polyorganoborane chain residues, divalent or polyvalent polyorganoboroxane chain residues, divalent or polyvalent polyorganoborane sulfane chain residues, divalent or polyvalent polyorganoborophosphine chain residues, and the like; divalent or polyvalent organophosphorus-based polymer chain residues; divalent or polyvalent organolead-based polymer chain residues; divalent or polyvalent organotin-based polymer chain residues; divalent or polyvalent organoarsenic polymer chain residues; divalent or polyvalent organic antimony-based polymer chain residues. L is preferably a divalent or polyvalent polyorganosiloxane chain residue, a divalent or polyvalent organoborane chain residue. The structures of suitable organoboron compounds (I) formed are illustrated below:

wherein g, h, i, j, k and l are respectively and independently a fixed value or an average value, preferably g is more than or equal to 36, h is more than or equal to 36, i is more than or equal to 36, j is more than or equal to 36, k is more than or equal to 12 and l is more than or equal to 12.

wherein, K₃、K₄、K₅、K₆、K₇Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, micromolecular hydrocarbyl with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da, and inorganic macromolecular chain residues with the molecular weight more than 1000 Da; wherein, the cyclic structure in C7, C8 and C9 is a non-aromatic or aromatic silicon heterocyclic group containing at least one silicon hydroxyl group, a silicon atom is placed in the cyclic structure, the cyclic structure can be a micromolecular ring or a macromolecular ring, and the cyclic structure is preferably a 3-100-membered ring, more preferably a 3-50-membered ring, and more preferably a 3-10-membered ring; the ring-forming atoms of the cyclic structure in C7, C8, C9 are each independently a carbon atom, a silicon atom, or other hetero atom, and at least one ring-forming atom is a silicon atom and constitutes a silicon hydroxyl group, and at least one ring-forming atom is bonded to the group J; the hydrogen atoms on the ring-forming atoms of the cyclic structures in C7, C8, and C9 may or may not be substituted; the cyclic structure in C7, C8 and C9 can be a single-ring structure, a multi-ring structure, a spiro structure, a fused ring structure, a bridged ring structure or a nested ring structure;

represents a linkage to the group J.

Wherein the cyclic structure of C7, C8, C9 may be selected from any one of the following groups, any unsaturated form, any substituted form, or any hybridized form: silacycloalkane, cyclosiloxane, cyclosilazane, cyclosulfane, cyclosphosphane, cyclosilborane, silabenzene, silanaphthalene, silaanthracene, silaphenanthrene, silaarene; preferred cyclic structures listed are silacyclopentane, silacyclohexane, silacyclohexene, silacyclohexadiene, silacyclohexenone, silabenzene, cyclotrisiloxane, cyclotetrasiloxane, cyclohexasiloxane, cyclotrisilazane, cyclotetrasilazane and cyclohexasilazane. For example:

wherein, K₈、K₉、K₁₀、K₁₁、K₁₂Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecular hydrocarbon groups with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic small molecular chain residues with the molecular weight not more than 1000Da and inorganic large molecular chain residues with the molecular weight more than 1000 Da; x₁、X₂、X₃、X₄、X₅、X₆、X₇、X₈、X₉、X₁₀、X₁₁、X₁₂、X₁₃、X₁₄Is a hydrolyzable group directly bonded to the silicon atom, including but not limited to halogen, cyano, oxacyano, thiocyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, amido, ketoxime, alkoxide, preferably halogen, alkoxy; wherein the cyclic structure of D7, D8 and D9 is nonaromatic or aromatic silacyclic group containing at least one silicon hydroxyl precursor, the silicon atom is placed in the cyclic structure, and the cyclic structure can be small fractionThe subring can also be a macromolecular ring, preferably has 3-100 membered rings, more preferably has 3-50 membered rings, and more preferably has 3-10 membered rings; the ring-forming atoms of the cyclic structure in D7, D8, D9 are each independently a carbon atom, a silicon atom or other hetero atom, and at least one of the ring-forming atoms is a silicon atom and constitutes a silicon hydroxyl group precursor, and at least one of the ring-forming atoms is bonded to the group J; the hydrogen atoms on the ring-forming atoms of the cyclic structures in D7, D8 and D9 may or may not be substituted; the cyclic structures in D7, D8 and D9 can be single-ring structures, multi-ring structures, spiro structures, fused ring structures, bridged ring structures and nested ring structures;

represents a linkage to the group J. It is to be noted that in the above structures, rings may also be formed between the different groups K, between the different groups X, and between the groups K and X, as appropriate.

Wherein the cyclic structure in D7, D8, D9 may be selected from any one of the following groups, any unsaturated form, any substituted form, or any hybridized form: silacycloalkane, cyclosiloxane, cyclosilazane, cyclosulfane, cyclosphosphane, cyclosilborane, silabenzene, silanaphthalene, silaanthracene, silaphenanthrene, silaarene; preferred cyclic structures listed are silacyclopentane, silacyclohexane, silacyclohexene, silacyclohexadiene, silacyclohexenone, silabenzene, cyclotrisiloxane, cyclotetrasiloxane, cyclohexasiloxane, cyclotrisilazane, cyclotetrasilazane and cyclohexasilazane. For example:

in the invention, in the module G containing the silicon hydroxyl and/or the silicon hydroxyl precursor, at least one hydroxyl and at least one hydroxyl precursor can be simultaneously connected to one silicon atom, and the same module also can simultaneously contain at least one silicon hydroxyl and at least one silicon hydroxyl precursor. For example:

the compound contains silicon hydroxyl and a silicon hydroxyl precursor simultaneously, which is beneficial to regulating and controlling the parameters of the solubility, the reaction rate, the reaction degree and the like of the compound,

and can be used for regulating and controlling the dynamic property and other properties of the dynamic polymer.

When n is 1, q is 1,2 or 3, J is a substituent on the single module G; when q is 2 or 3, J may be selected from the same structure or a plurality of different structures; the J structure can be selected from any one or more of the following: hydrogen atoms, heteroatom groups, micromolecular hydrocarbon groups with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da and inorganic macromolecular chain residues with the molecular weight more than 1000 Da. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

The structure of the silicon-containing compound (II) exemplified above is only provided to better illustrate the typical structure of the silicon-containing compound (II) under the conditions, and only some representative structures under the conditions are provided, and the scope of the present invention is not limited.

When J is selected from a single bond, it may be selected from a silicon-silicon single bond, a carbon-carbon single bond, a carbon-nitrogen single bond, a nitrogen-nitrogen single bond, a silicon-carbon single bond, a silicon-nitrogen single bond; preferably a silicon-silicon single bond, a carbon-carbon single bond, or a silicon-carbon single bond. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from the heteroatom linking group, it may be selected from any one or a combination of any of the following: an ether group, a sulfur group, a disulfide group, a divalent tertiary amine group, a trivalent tertiary amine group, a divalent silicon group, a trivalent silicon group, a tetravalent silicon group, a divalent phosphorus group, a trivalent phosphorus group, a divalent boron group, a trivalent boron group; the heteroatom linking group is preferably an ether group, a sulfide group, a divalent tertiary amine group, or a trivalent tertiary amine group. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from the group consisting of small divalent or polyvalent hydrocarbyl radicals having a molecular weight of not more than 1000Da, which generally contain from 1 to 71 carbon atoms, the hydrocarbyl radical may have a valence of from 2 to 144, which may or may not contain a heteroatom group. In general terms, the divalent or multivalent small molecule hydrocarbon group may be selected from any of the following groups, an unsaturated form of any, a substituted form of any, or a hybridized form of any: two to one hundred forty-four valence C_1-71Alkyl, two to one hundred forty-four ring C_3-71Alkyl, di-to hexavalent phenyl, di-to octavalent benzyl, di-to one hundred forty tetravalent aromatic hydrocarbon radicals; j is preferably di-to tetravalent methyl, di-to hexavalent ethyl, di-to octahedral propyl, di-to hexavalent cyclopropane, di-to octahedral cyclobutyl, di-to decavalent cyclopentyl, di-to dodecavalent cyclohexyl, di-to hexavalent phenyl. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from divalent or polyvalent polymer chain residues having a molecular weight greater than 1000Da, it can be any suitable divalent or polyvalent polymer chain residue, including but not limited to divalent or polyvalent carbon chain polymer residues, divalent or polyvalent heterochain polymer residues, divalent or polyvalent elemental organic polymer residues. Wherein, the polymer can be a homopolymer, and can also be a copolymer formed by any several monomers, oligomers or polymers; the polymer chains may be flexible chains or rigid chains.

When J is selected from divalent or polyvalent carbon chain polymer residues, it may be any suitable polymer residue whose macromolecular backbone consists essentially of carbon atoms, which may be selected from any of the following groups, any unsaturated form, any substituted form, or any hybridized form: divalent or polyvalent polyolefin-based chain residue such as divalent or polyvalent polyethylene chain residue, divalent or polyvalent polypropylene chain residue, divalent or polyvalent polyisobutylene chain residue, divalent or polyvalent polystyrene chain residue, divalent or polyvalent polyvinyl chloride chain residue, divalent or polyvalent polyvinylidene chloride chain residue, divalent or polyvalent polyvinyl fluoride chain residue, divalent or polyvalent polytetrafluoroethylene chain residue, divalent or polyvalent polychlorotrifluoroethylene chain residue, divalent or polyvalent polyvinyl acetate chain residue, divalent or polyvalent polyvinyl alcohol chain residue, divalent or polyvalent polyvinyl alkyl ether chain residue, divalent or polyvalent polybutadiene chain residue, divalent or polyvalent polyisoprene chain residue, divalent or polyvalent polychloroprene chain residue, divalent or polyvalent polynorbornene chain residue and the like; a divalent or polyvalent polyacrylic chain residue such as a divalent or polyvalent polyacrylic chain residue, a divalent or polyvalent polyacrylamide chain residue, a divalent or polyvalent polymethyl acrylate chain residue, a divalent or polyvalent polymethyl methacrylate chain residue, or the like; divalent or polyvalent polyacrylonitrile chain residue, such as divalent or polyvalent polyacrylonitrile chain residue, etc. J is preferably a divalent or polyvalent polyethylene chain residue, a divalent or polyvalent polypropylene chain residue, a divalent or polyvalent polystyrene chain residue, a divalent or polyvalent polyvinyl chloride chain residue, a divalent or polyvalent polybutadiene chain residue, a divalent or polyvalent polyisoprene chain residue, a divalent or polyvalent polyacrylic acid chain residue, a divalent or polyvalent polyacrylamide chain residue, or a divalent or polyvalent polyacrylonitrile chain residue. Examples of suitable structures of the silicon-containing compound (II) formed are as follows:

When J is selected from divalent or polyvalent heterochain polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of carbon atoms and heteroatoms such as nitrogen, oxygen, sulfur, and the like, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent polyether-based chain residues such as divalent or polyvalent paraformaldehyde chain residues, divalent or polyvalent polyethylene oxide chain residues, divalent or polyvalent polypropylene oxide chain residues, divalent or polyvalent polytetrahydrofuran chain residues, divalent or polyvalent epoxy resin chain residues, divalent or polyvalent phenol resin chain residues, divalent or polyvalent polyphenylene ether chain residues, and the like; divalent or polyvalent polyester chain residues such as divalent or polyvalent polycaprolactone chain residues, divalent or polyvalent polypentalactone chain residues, divalent or polyvalent polylactide chain residues, divalent or polyvalent polyethylene terephthalate chain residues, divalent or polyvalent unsaturated polyester chain residues, divalent or polyvalent alkyd resin chain residues, divalent or polyvalent polycarbonate chain residues, and the like; divalent or polyvalent polyamine-based chain residues such as divalent or polyvalent polyamide chain residues, divalent or polyvalent polyimide chain residues, divalent or polyvalent polyurethane chain residues, divalent or polyvalent polyurea chain residues, divalent or polyvalent urea-formaldehyde resin chain residues, divalent or polyvalent melamine resin chain residues, and the like; divalent or polyvalent polysulfide-like chain residues, such as divalent or polyvalent polysulfone chain residues, divalent or polyvalent polyphenylene sulfide chain residues, divalent or polyvalent polysulfide rubber chain residues, and the like. J is preferably a divalent or polyvalent polyoxymethylene chain residue, a divalent or polyvalent polyethylene oxide chain residue, a divalent or polyvalent polytetrahydrofuran chain residue, a divalent or polyvalent epoxy resin chain residue, a divalent or polyvalent polyhexamethylene lactone chain residue, a divalent or polyvalent polylactide chain residue, or a divalent or polyvalent polyamide chain residue. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from divalent or polyvalent organic polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of heteroatoms of inorganic elements such as silicon, boron, aluminum, and the like, and heteroatoms of nitrogen, oxygen, sulfur, phosphorus, and the like, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent organosilicon-based polymer chain residues such as divalent or polyvalent polyorganosiloxane chain residues, divalent or polyvalent polyorganosiloxane sulfur chain residues, divalent or polyvalent polyorganophosiloxane chain residues, divalent or polyvalent polyorganopolysiloxane chain residues; divalent or polyvalent organoboron polymer chain residues such as divalent or polyvalent polyorganoborane chain residues, divalent or polyvalent polyorganoboroxane chain residues, divalent or polyvalent polyorganoborane sulfane chain residues, divalent or polyvalent polyorganoborophosphine chain residues, and the like; divalent or polyvalent organophosphorus-based polymer chain residues; divalent or polyvalent organolead-based polymer chain residues; divalent or polyvalent organotin-based polymer chain residues; divalent or polyvalent organoarsenic polymer chain residues; divalent or polyvalent organic antimony-based polymer chain residues. J is preferably a divalent or polyvalent polyorganosiloxane chain residue, or a divalent or polyvalent organoborane chain residue. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from the group consisting of divalent or polyvalent inorganic small molecular chain residues having a molecular weight of not more than 1000Da, it may be any suitable inorganic small molecular chain residue having a main molecular chain and side molecular chains both mainly composed of heteroatoms of inorganic elements such as silicon, boron, aluminum and the like and heteroatoms such as nitrogen, oxygen, sulfur, phosphorus and the like, and in general, the divalent or polyvalent inorganic small molecular chain residue may be selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: a divalent or polyvalent chain sulfur residue, a divalent or polyvalent silane chain residue, a divalent or polyvalent silicone compound chain residue, a divalent or polyvalent sulfur silicon compound chain residue, a divalent or polyvalent sulfur nitrogen compound chain residue, a divalent or polyvalent phosphazene compound chain residue, a divalent or polyvalent phosphorus oxide compound chain residue, a divalent or polyvalent borane chain residue, and a divalent or polyvalent boron oxide compound chain residue. J is preferably a divalent or polyvalent chain sulfur residue, a divalent or polyvalent silane chain residue, a divalent or polyvalent silicone compound chain residue, a divalent or polyvalent phosphazene compound chain residue, or a divalent or polyvalent borane chain residue. The structure of a suitable silicon-containing compound (II) formed is illustrated below:

When J is selected from bivalent or multivalent inorganic macromolecular chain residues with the molecular weight of more than 1000Da, the J can be any suitable inorganic macromolecular chain residue with the macromolecular main chain and the side chain mainly composed of inorganic element heteroatoms such as silicon, boron, aluminum and the like and heteroatoms such as nitrogen, oxygen, sulfur, phosphorus and the like.

Wherein J may be selected from any one of the following groups, an unsaturated form of any one, a substituted form of any one, or a hybridized form of any one: a divalent or polyvalent chain sulfur polymer residue, a divalent or polyvalent polysiloxane chain residue, a divalent or polyvalent polysulfide silicon chain residue, a divalent or polyvalent polysulfide nitrogen chain residue, a divalent or polyvalent polyphosphate chain residue, a divalent or polyvalent polyphosphazene chain residue, a divalent or polyvalent polychlorophosphazene chain residue, a divalent or polyvalent polyborane chain residue, a divalent or polyvalent polyboroxine chain residue. J is preferably a divalent or polyvalent chain sulfur polymer residue, a divalent or polyvalent polysiloxane chain residue, a divalent or polyvalent polyphosphazene chain residue, or a divalent or polyvalent polyborane chain residue. The structures of suitable silicon-containing compounds (II) formed are exemplified below:

wherein g, h, i are each independently a fixed value or an average value, preferably g ≧ 36, h ≧ 36, i ≧ 36.

J may also be selected from any of the following groups of residue-bearing inorganic macromolecules or any surface-modified residue-bearing inorganic macromolecule: zeolite-type molecular sieves, aluminum phosphate molecular sieves, zirconium phosphate molecular sieves, heteropolyacid salt molecular sieves, diamond, graphite, carbon fiber, white phosphorus, red phosphorus, phosphorus pentoxide, molybdenum sulfide, silica, silicon disulfide, silicon nitride, silicon carbide, talc, kaolin, montmorillonite, mica, asbestos, feldspar, cement, glass, quartz, ceramics, boron oxide, sulfur nitride, calcium silicide, silicates, glass fiber, beryllium oxide, magnesium oxide, mercury oxide, corundum borohydride, boron nitride, boron carbide, aluminum nitride, diaspore, gibbsite, titanium dioxide. J is preferably surface-modified graphite, surface-modified carbon fiber, surface-modified silicon dioxide, surface-modified silicon nitride, surface-modified silicon carbide, surface-modified silicate, surface-modified glass fiber, surface-modified boron nitride. Suitable silicon-containing compounds (II) formed are generally inorganic structures such as, for example: silicon nitride with silicon hydroxyl on the surface, silicon carbide with silicon hydroxyl on the surface, silicon dioxide with silicon hydroxyl on the surface, silicate with silicon hydroxyl on the surface and glass fiber with silicon hydroxyl on the surface.

wherein, A is a module containing an organoboronic acid group and/or an organoboronate group, and the specific definition thereof can refer to the definition of the module A in the organoboron compound (I), which is not described herein again, wherein A is preferably a module containing an organoboronate group; x is the number of the modules A, and x is more than or equal to 1; when x is larger than or equal to 2, the module A can be selected from the same structure or a plurality of different structures; g is a module containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor, and the specific definition of G can refer to the definition of module G in the silicon-containing compound (II), which is not described herein again, wherein G is preferably a module containing a silicon hydroxyl group precursor; y is the number of the modules G, and y is more than or equal to 1; when y is more than or equal to 2, the module G can be selected from the same structure or a plurality of different structures; t is a connecting group between two or more A, or between two or more G, or between A and G, and the structure of T can be selected from any one or more of the following: single bonds, heteroatom linkers, divalent or multivalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or multivalent polymer chain residues having a molecular weight greater than 1000 Da; v is the number of groups T, and v is more than or equal to 1; when v.gtoreq.2, T can be selected from the same structure or a plurality of different structures.

When T is selected from single bonds, it may be selected from carbon-carbon single bonds, carbon-nitrogen single bonds, nitrogen-nitrogen single bonds, boron-carbon single bonds, boron-nitrogen single bonds, borosilicate single bonds, silicon-silicon single bonds, silicon-carbon single bonds, silicon-nitrogen single bonds; preferably a carbon-carbon single bond, a silicon-silicon single bond, or a borosilicate single bond. The structures of suitable compounds (III) formed are exemplified below:

The structures of the compound (III) exemplified above are only provided to better illustrate typical structures of the compound (III) under the conditions, and only some representative structures under the conditions are provided, not to limit the scope of the present invention.

When T is selected from the heteroatom linking group, it may be selected from any one or a combination of any of the following: an ether group, a sulfur group, a disulfide group, a divalent tertiary amine group, a trivalent tertiary amine group, a divalent silicon group, a trivalent silicon group, a tetravalent silicon group, a divalent phosphorus group, a trivalent phosphorus group, a divalent boron group, a trivalent boron group; the heteroatom linking group is preferably an ether group, a sulfide group, a divalent tertiary amine group, or a trivalent tertiary amine group. The structures of suitable compounds (III) formed are exemplified below:

When T is selected from the group consisting of small divalent or polyvalent hydrocarbyl radicals having a molecular weight of not more than 1000Da, which generally contain from 1 to 71 carbon atoms, the hydrocarbyl radical may have a valence of from 2 to 144, which may or may not contain a heteroatom group. In general terms, the divalent or multivalent small molecule hydrocarbon group may be selected from any of the following groups, an unsaturated form of any, a substituted form of any, or a hybridized form of any: two to one hundred forty-four valence C_1-71Alkyl, two to one hundred forty-four ringC_3-71Alkyl, di-to hexavalent phenyl, di-to octavalent benzyl, di-to one hundred forty tetravalent aromatic hydrocarbon radicals; t is preferably a di-to tetravalent methyl group, a di-to hexavalent ethyl group, a di-to octahedral propyl group, a di-to hexavalent cyclopropane group, a di-to octahedral cyclobutyl group, a di-to decavalent cyclopentyl group, a di-to dodecavalent cyclohexyl group, a di-to hexavalent phenyl group. The structures of suitable compounds (III) formed are exemplified below:

When T is selected from divalent or polyvalent polymer chain residues having a molecular weight greater than 1000Da, it may be any suitable divalent or polyvalent polymer chain residue, including but not limited to divalent or polyvalent carbon chain polymer residues, divalent or polyvalent heterochain polymer residues, divalent or polyvalent elemental organic polymer residues. Wherein, the polymer can be a homopolymer, and can also be a copolymer formed by any several monomers, oligomers or polymers; the polymer chains may be flexible chains or rigid chains.

When T is selected from divalent or polyvalent carbon chain polymer residues, it may be any suitable polymer residue whose macromolecular backbone consists essentially of carbon atoms, which may be selected from any of the following groups, any unsaturated form, any substituted form, or any hybridized form: divalent or polyvalent polyolefin-based chain residue such as divalent or polyvalent polyethylene chain residue, divalent or polyvalent polypropylene chain residue, divalent or polyvalent polyisobutylene chain residue, divalent or polyvalent polystyrene chain residue, divalent or polyvalent polyvinyl chloride chain residue, divalent or polyvalent polyvinylidene chloride chain residue, divalent or polyvalent polyvinyl fluoride chain residue, divalent or polyvalent polytetrafluoroethylene chain residue, divalent or polyvalent polychlorotrifluoroethylene chain residue, divalent or polyvalent polyvinyl acetate chain residue, divalent or polyvalent polyvinyl alcohol chain residue, divalent or polyvalent polyvinyl alkyl ether chain residue, divalent or polyvalent polybutadiene chain residue, divalent or polyvalent polyisoprene chain residue, divalent or polyvalent polychloroprene chain residue, divalent or polyvalent polynorbornene chain residue and the like; a divalent or polyvalent polyacrylic chain residue such as a divalent or polyvalent polyacrylic chain residue, a divalent or polyvalent polyacrylamide chain residue, a divalent or polyvalent polymethyl acrylate chain residue, a divalent or polyvalent polymethyl methacrylate chain residue, or the like; divalent or polyvalent polyacrylonitrile chain residue, such as divalent or polyvalent polyacrylonitrile chain residue, etc. T is preferably a divalent or polyvalent polyethylene chain residue, a divalent or polyvalent polypropylene chain residue, a divalent or polyvalent polystyrene chain residue, a divalent or polyvalent polyvinyl chloride chain residue, a divalent or polyvalent polybutadiene chain residue, a divalent or polyvalent polyisoprene chain residue, a divalent or polyvalent polyacrylic chain residue, a divalent or polyvalent polyacrylamide chain residue, or a divalent or polyvalent polyacrylonitrile chain residue. Suitable structures of compound (III) formed are exemplified by the following:

wherein g, h, i, j, k and l are respectively and independently a fixed value or an average value, preferably g is more than or equal to 36, h is more than or equal to 36, i is more than or equal to 36, j is more than or equal to 12, k is more than or equal to 12 and l is more than or equal to 12.

When T is selected from divalent or polyvalent heterochain polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of carbon atoms and heteroatoms such as nitrogen, oxygen, sulfur, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent polyether-based chain residues such as divalent or polyvalent paraformaldehyde chain residues, divalent or polyvalent polyethylene oxide chain residues, divalent or polyvalent polypropylene oxide chain residues, divalent or polyvalent polytetrahydrofuran chain residues, divalent or polyvalent epoxy resin chain residues, divalent or polyvalent phenol resin chain residues, divalent or polyvalent polyphenylene ether chain residues, and the like; divalent or polyvalent polyester chain residues such as divalent or polyvalent polycaprolactone chain residues, divalent or polyvalent polypentalactone chain residues, divalent or polyvalent polylactide chain residues, divalent or polyvalent polyethylene terephthalate chain residues, divalent or polyvalent unsaturated polyester chain residues, divalent or polyvalent alkyd resin chain residues, divalent or polyvalent polycarbonate chain residues, and the like; divalent or polyvalent polyamine-based chain residues such as divalent or polyvalent polyamide chain residues, divalent or polyvalent polyimide chain residues, divalent or polyvalent polyurethane chain residues, divalent or polyvalent polyurea chain residues, divalent or polyvalent urea-formaldehyde resin chain residues, divalent or polyvalent melamine resin chain residues, and the like; divalent or polyvalent polysulfide-like chain residues, such as divalent or polyvalent polysulfone chain residues, divalent or polyvalent polyphenylene sulfide chain residues, divalent or polyvalent polysulfide rubber chain residues, and the like. T is preferably a divalent or polyvalent polyoxymethylene chain residue, a divalent or polyvalent polyethylene oxide chain residue, a divalent or polyvalent polytetrahydrofuran chain residue, a divalent or polyvalent epoxy resin chain residue, a divalent or polyvalent polycaprolactone chain residue, a divalent or polyvalent polylactide chain residue, or a divalent or polyvalent polyamide chain residue. The structures of suitable compounds (III) formed are exemplified below:

When T is selected from divalent or polyvalent organic polymer residues, it may be any suitable polymer residue whose macromolecular backbone is composed primarily of heteroatoms of inorganic elements such as silicon, boron, aluminum, and the like, and heteroatoms of nitrogen, oxygen, sulfur, phosphorus, and the like, which may be selected from any of the following groups, unsaturated forms of any, substituted forms of any, or hybridized forms of any: divalent or polyvalent organosilicon-based polymer chain residues such as divalent or polyvalent polyorganosiloxane chain residues, divalent or polyvalent polyorganosiloxane sulfur chain residues, divalent or polyvalent polyorganophosiloxane chain residues, divalent or polyvalent polyorganopolysiloxane chain residues; divalent or polyvalent organoboron polymer chain residues such as divalent or polyvalent polyorganoborane chain residues, divalent or polyvalent polyorganoboroxane chain residues, divalent or polyvalent polyorganoborane sulfane chain residues, divalent or polyvalent polyorganoborophosphine chain residues, and the like; divalent or polyvalent organophosphorus-based polymer chain residues; divalent or polyvalent organolead-based polymer chain residues; divalent or polyvalent organotin-based polymer chain residues; divalent or polyvalent organoarsenic polymer chain residues; divalent or polyvalent organic antimony-based polymer chain residues. T is preferably a divalent or polyvalent polyorganosiloxane chain residue, a divalent or polyvalent organoborane chain residue. The structures of suitable compounds (III) formed are exemplified below:

When the group L in the structure of the organoboron compound (I), the group J in the structure of the silicon-containing compound (II), and the group T in the structure of the compound (III) are selected from chain structures other than cyclic structures, the group A may be bonded to the end of L or may be bonded to any position in L; the group G can be connected to the terminal of J and can also be connected to any position in J; the groups A and G may be attached to the end of T, or may be attached at any position in T. When the group L in the structure of the organoboron compound (I), the group J in the structure of the silicon-containing compound (II), and the group T in the structure of the compound (III) are selected from two-dimensional or three-dimensional cluster structures, the cluster structures are generally formed by ordinary covalent bonds, and the organoboronate group and/or organoborate group and the silicon hydroxyl group and/or silicon hydroxyl group precursor in the cluster structures are generally dispersed at the periphery of the cluster and undergo dynamic polymerization/crosslinking reaction only at the periphery of the cluster. Therefore, the obtained dynamic polymer dissociates into cluster units after the dynamically reversible organoboronate silicon ester bonds contained therein are dissociated.

For the organoboron compound (I), the silicon-containing compound (II) and the compound (III), any one of hydroxyl groups in the organoboron group, any one of ester groups in the organoboron group, any one of hydroxyl groups in the silicon hydroxyl group and any one of groups in the silicon hydroxyl group precursor which can be hydrolyzed to obtain hydroxyl groups are all one functional group. For the organoboron compound (I), the silicon-containing compound (II) may be monofunctional, difunctional, trifunctional or polyfunctional, for example, in the case of the structures

The organic boron compound (I) is respectively a monofunctional group, a bifunctional group, a trifunctional group and a tetrafunctional group; as another example, for a structure of

The silicon-containing compound (II) of (1) is a monofunctional group, a bifunctional group, a trifunctional group or a tetrafunctional group; for compound (III), it may be a difunctional, trifunctional or multifunctional compound, for example, for structures

The compound (III) of (2) is bifunctional, trifunctional, tetrafunctional, or pentafunctional.

The other reactive groups mentioned in the invention refer to groups capable of reacting spontaneously or under the conditions of an initiator or light, heat, radiation, catalysis and the like to generate common covalent bonds except organic borate silicon bonds; suitable groups are for example: hydroxyl group, phenolic hydroxyl group, carboxyl group, acyl group, amide group, acyloxy group, amino group, aldehyde group, sulfonic group, sulfonyl group, mercapto group, alkenyl group, alkynyl group, cyano group, oxazinyl group, oximino group, hydrazino group, guanidino group, halogen group, isocyanate group, acid anhydride group, epoxy group, acrylate group, acrylamide group, maleimide group, N-hydroxysuccinimide group, norbornene group, azo group, azide group, heterocyclic group, etc.; the other reactive groups are preferably hydroxyl, carboxyl, amino, mercapto, alkenyl, isocyanate, epoxy, acrylate, acrylamide groups. By way of example, some suitable structures have been given in the foregoing examples.

The other reactive groups in the invention play a role in the system, namely, the derivatization reaction is carried out to prepare a functionalized dynamic polymer (with functional characteristics such as hydrophobicity, fluorescence, oxidation resistance and the like), and a common covalent bond is formed between the compound itself or other compounds or other reaction products through the reaction of the other reactive groups, so that the molecular weight of the compound and/or the reaction products thereof is increased/the functionality of the compound is increased, the formation of the dynamic polymer with a dynamic cross-linking structure is promoted, and/or the cross-linking density of the dynamic polymer is increased. In the invention, the common covalent link established by polymerization/crosslinking of other reactive groups must ensure that the crosslinking degree of the obtained polymer is lower than the gel point, so that when the organic boric acid silicone ester bond in the dynamic polymer is dissociated, the polymer system can be dissociated into smaller units, thereby achieving the purpose of recovery or reconstruction. It is to be noted that all "other reactive groups" present in the present invention are only used for derivatization and/or formation of common covalent linkages.

In the preparation embodiments described above, the reaction of the other reactive groups can also be achieved together by introducing a compound component which is free of organoboronate and/or organoboronate groups, silylhydroxy and/or silylhydroxy precursors, organoboronate silyllinkages, but which contains other reactive groups. The compound containing only the other reactive group may be any suitable compound which can achieve the object of reacting with the other reactive group in the organoboron compound (I) and/or the silicon-containing compound (II) and/or the compound (III) to obtain a dynamic polymer having a "dynamic crosslinked structure".

In the preparation process of the dynamic polymer, after the compounds as raw materials participate in reaction, the raw material components can be polymerized/crosslinked by taking organic boric acid silicon ester bonds or common covalent bonds as linking points, so as to obtain the dynamic polymer with higher molecular weight. Wherein the functional groups contained in the raw material components may be fully reacted or partially reacted, and wherein it is not required that all of the organoboronate groups and/or organoboronate groups and the silicon hydroxyl groups and/or silicon hydroxyl group precursors are fully reacted with each other to form organoboronate siloxane bonds, provided that the organoboronate siloxane bonds formed are sufficient to maintain a dynamic polymer structure.

In the invention, the preparation process for preparing the dynamic polymer by using the several embodiments is simple in steps, easy to operate and strong in controllability, so that the method is a preferred embodiment of the invention.

The dynamic polymer described in the present invention can also be prepared by the following embodiments:

Wherein the compound (IV) containing the organic borate silicon ester bond and other reactive groups can be a small molecular compound with the molecular weight not more than 1000Da or a large molecular compound with the molecular weight more than 1000 Da; the compound (IV) can also contain organic boric acid groups and/or organic boric acid ester groups, silicon hydroxyl groups and/or silicon hydroxyl group precursors; compounds which do not contain organoborate silicone linkages but contain other reactive groups may be small molecule compounds having a molecular weight of not more than 1000Da or large molecule compounds having a molecular weight of greater than 1000 Da.

represents a linkage to the group Y. It is to be noted that, in the above structure, rings may also be formed between the different groups K, between the different groups Y, and between the groups K and Y as appropriate; the radical Y may be bonded to the boron atom via a Si-O bond or may be bonded to the silicon atom via a B-O bond.

In the present invention, the module E containing organoboronate silicon ester bond can be obtained by condensation reaction or ester exchange reaction between organoboronate and/or organoboronate group and silicon hydroxyl and/or silicon hydroxyl precursor, and any one or any plurality of the modules A containing organoboronate and/or organoboronate group and any one or any plurality of the modules G containing silicon hydroxyl and/or silicon hydroxyl precursor.

When u is greater than 1, the module E can be selected from the same structure or a plurality of different structures, wherein r is more than or equal to 2, Y is a substituent group on a single module E and a connecting group between two or more modules E, Y can be selected from the same structure or a plurality of different structures, and the number and the structure of other reactive groups contained in Y must ensure that the dynamic polymer can be obtained; the structure Y can be selected from any one or more of small molecular alkyl with the molecular weight not more than 1000Da, polymer chain residue with the molecular weight more than 1000Da, single bond, heteroatom linking group, bivalent or multivalent small molecular alkyl with the molecular weight not more than 1000Da, and bivalent or multivalent polymer chain residue with the molecular weight more than 1000Da, and the specific definition can refer to the group L and the group T, which is not described any more.

For compounds (IV) containing organoboronate silicone linkages and other reactive groups, these are typically monomers containing organoboronate silicone linkages, oligomers containing organoboronate silicone linkages, prepolymers containing organoboronate silicone linkages. Compound (IV) can be prepared by any suitable method, including by suitable organoboron compounds (I) and silicon containing compounds (II). Preferably, the compound (IV) can be prepared by reacting at least one organoboron compound (I) containing other reactive groups with at least one silicon-containing compound (II) containing other reactive groups, by reacting at least one organoboron compound (I) containing other reactive groups with at least one silicon-containing compound (II) containing no other reactive groups, or by reacting at least one organoboron compound (I) containing no other reactive groups with at least one silicon-containing compound (II) containing other reactive groups; the compound (IV) can also be prepared by reacting at least one compound (III) containing other reactive groups or with the organoboron compound (I) and/or the silicon-containing compound (II).

Similarly, the compound which does not contain an organoboronate silicone bond but which contains other reactive groups may be any suitable compound which can react with other reactive groups in compound (IV) to obtain a dynamic polymer having the "dynamic crosslinked structure".

The compounds containing other reactive groups can react with each other to form common covalent links through the other reactive groups contained in the reaction process, so as to obtain the dynamic polymer with the dynamic cross-linked structure.

This embodiment is also a preferred embodiment of the invention in the context of the present invention, since it has certain advantages for the preparation of dynamic polymers in certain specific cases.

The dynamic polymer in the present invention is not limited to be prepared by using the above-mentioned several embodiments, but may be the above-mentioned several embodiments or a combination thereof with other embodiments. However, in the embodiment, the preparation of the dynamic polymer using the organoboron compound (I), the silicon-containing compound (II), the compound (III) and the compound (IV) as raw materials, in the form of a compound as a raw material for synthesis, or in the form of an intermediate product for synthesizing a polymer is included in the scope of the present invention since it can be obtained according to the teaching of the present invention. Likewise, those skilled in the art can reasonably utilize the above compounds to obtain the dynamic polymer according to the teachings of the present invention.

an organoboron compound (I) containing organoboronic acid groups and/or organoborate groups; a silicon-containing compound (II) containing a silicon hydroxyl group and/or a silicon hydroxyl group precursor; a compound (III) containing both an organoboronic acid group and/or organoboronate group and a silicon hydroxyl group and/or a silicon hydroxyl group precursor; a compound (IV) containing organoborate silicone linkages and other reactive groups; wherein the organoboron compound (I), the silicon-containing compound (II), and the compound (III) each have at least one functional group; wherein, the organic boron compound (I), the silicon-containing compound (II) and the compound (III) can contain or not contain other reactive groups; wherein the organic boron compound (I) or the silicon-containing compound (II) is not used as a raw material for preparing the dynamic polymer.

The heteroatom group referred to in the present invention may be any suitable heteroatom containing group which may be selected from any of the following groups: halogen, hydroxyl, thiol, carboxyl, nitro, primary amino, silicon, phosphorus, triazole, isoxazole, amide, imide, thioamide, enamine, carbonate, thiocarbonate, dithiocarbonate, trithiocarbonate, carbamate, thiocarbamate, dithiocarbamate, thioester, dithioester, orthoester, phosphate, phosphite, phosphinate, phosphoryl, phosphorylidene, hypophosphoryl, thiophosphoryl, thiophosphorous acyl, thiophosphoryl, phosphosilane, silane, carboxamide, thioamide, phosphoramidite, ifosfamide, thiophosphoryl, orthosilicic acid, metasilicic acid, silicic acid, boric acid, etc, Metaboric acid groups, aconityl acid groups, peptide bonds, acetals, cyclic acetals, mercaptals, azaacetals, azathioacetals, dithioacetals, hemiacetals, thiohemiacetals, azahemiacetals, ketals, thioketals, azaketals, thioketals, acylhydrazone bonds, oxime bonds, sulfoximine ether groups, hemicarbazone bonds, thiosemicarbazone bonds, hydrazine groups, hydrazide groups, thiocarbohydrazide groups, azocarbohydrazide groups, thioazodohydrazide groups, carbazate groups, carbazide groups, thiocarbcarbazide groups, azo groups, isoureido groups, isothioureido groups, allophanate groups, thioallophanate groups, guanidino groups, amidino groups, aminoamidino groups, imino groups, thioimino groups, nitroxyl groups, nitrosyl groups, sulfonic groups, sulfonamido groups, sulfonamide groups, thiohydrazone groups, thiosemicarbazide, Sulfenamide, sulfonyl hydrazine, sulfonyl urea, maleimide.

The small-molecule hydrocarbon radicals mentioned in the context of the present invention, which have a molecular weight of not more than 1000Da, generally contain from 1 to 71 carbon atoms and may or may not contain heteroatom groups. In general terms, the small molecule hydrocarbyl group may be selected from any of the following groups, any unsaturated form, any substituted form, or any hybridized form: c_1-71Alkyl, ring C_3-71Alkyl, phenyl, benzyl, aryl; the small-molecule hydrocarbon group is preferably methyl, ethyl, propyl, propylene, butyl, butylene, pentyl, hexyl, heptyl, octyl, nonyl, decyl, cyclohexyl, phenyl; more preferably methyl, ethyl, propyl, phenyl.

The polymer chain residues having a molecular weight of greater than 1000Da referred to in the present invention may be any suitable polymer chain residues including, but not limited to, carbon chain polymer residues, heterochain polymer residues, elemental organic polymer residues. Wherein, the polymer can be a homopolymer, and can also be a copolymer composed of any several monomers, oligomers or polymers; the polymer chains may be flexible chains or rigid chains.

Wherein the carbon chain polymer residue, which may be any suitable polymer residue having a macromolecular backbone consisting essentially of carbon atoms, may be selected from any of the following groups, any unsaturated form, any substituted form or any hybridized form: polyolefin-based chain residues such as polyethylene chain residues, polypropylene chain residues, polyisobutylene chain residues, polystyrene chain residues, polyvinyl chloride chain residues, polyvinylidene chloride chain residues, polyvinyl fluoride chain residues, polytetrafluoroethylene chain residues, polychlorotrifluoroethylene chain residues, polyvinyl acetate chain residues, polyvinyl alcohol chain residues, polyvinyl alkyl ether chain residues, polybutadiene chain residues, polyisoprene chain residues, polychloroprene chain residues, polynorbornene chain residues and the like; polyacrylic chain residues such as polyacrylic chain residues, polyacrylamide chain residues, polymethyl acrylate chain residues, polymethyl methacrylate chain residues, and the like; polyacrylonitrile chain residues such as polyacrylonitrile chain residues and the like; preferably polyethylene chain residues, polypropylene chain residues, polystyrene chain residues, polyvinyl chloride chain residues, polybutadiene chain residues, polyisoprene chain residues, polypropylene chain residues, polyacrylamide chain residues, polyacrylonitrile chain residues; the carbon chain polymer residue, which may be formed by a click reaction, such as the Diels-Alder reaction.

The heterochain polymer residue, which may be a polymer residue of any suitable macromolecular backbone consisting essentially of carbon atoms and heteroatoms such as nitrogen, oxygen, sulfur, and the like, may be selected from any of the following groups, any unsaturated form, any substituted form, or any hybridized form: polyether chain residues such as polyoxymethylene chain residues, polyethylene oxide chain residues, polypropylene oxide chain residues, polytetrahydrofuran chain residues, epoxy resin chain residues, phenol resin chain residues, polyphenylene ether chain residues, and the like; polyester chain residues such as polycaprolactone chain residues, polypentanolactone chain residues, polylactide chain residues, polyethylene terephthalate chain residues, unsaturated polyester chain residues, alkyd resin chain residues, polycarbonate chain residues, and the like; polyamine-based chain residues such as polyamide chain residues, polyimide chain residues, polyurethane chain residues, polyurea chain residues, urea-formaldehyde resin chain residues, melamine resin chain residues, and the like; polysulfide chain residues such as polysulfone chain residues, polyphenylene sulfide chain residues, polysulfide rubber chain residues, etc.; preferably a polyoxymethylene chain residue, a polyethylene oxide chain residue, a polytetrahydrofuran chain residue, an epoxy resin chain residue, a polycaprolactone chain residue, a polylactide chain residue, a polyamide chain residue; the heterochain polymer residues, which can be formed by click reactions, such as the Diels-Alder reaction, the CuAAC reaction, the thio-ene reaction.

The elemental organic polymer residue may be any suitable polymer residue having a macromolecular backbone consisting essentially of heteroatoms of inorganic elements such as silicon, boron, aluminum and the like, and heteroatoms of nitrogen, oxygen, sulfur, phosphorus and the like, selected from any one of the following groups, an unsaturated form of any one, a substituted form of any one or a hybridized form of any one: silicone-based polymer chain residues such as polyorganosiloxane chain residues, polyorganosiloxane borane chain residues, polyorganosiloxane nitrogen chain residues, polyorganosiloxane sulfur chain residues, polyorganopolysiloxane chain residues; organoboron-based polymer chain residues such as polyorganoborane chain residues, polyorganoboroxane chain residues, polyorganoborazine chain residues, polyorganoborasulfane chain residues, polyorganoboraphosphoalkane chain residues, and the like; an organophosphorus-based polymer chain residue; an organolead-based polymer chain residue; an organotin-based polymer chain residue; an organic arsenic-based polymer chain residue; an organic antimony-based polymer chain residue; preferably polyorganosiloxane chain residues, polyorganoborane chain residues.

The small-molecule silane group with the molecular weight not exceeding 1000Da can be any suitable small-molecule silane group with the main molecular chain mainly composed of silicon atoms and heteroatoms such as nitrogen, oxygen, sulfur, phosphorus and the like, and in general, the small-molecule silane group can be selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: a silicone chain residue, a siloxane chain residue, a thiosiloxane chain residue, a silazane chain residue; preferred are a silicone chain residue and a siloxane chain residue.

The inorganic small molecular chain residue with the molecular weight not exceeding 1000Da can be any suitable inorganic small molecular chain residue with the main chain and the side chain mainly composed of heteroatoms of inorganic elements such as silicon, boron, aluminum and the like and heteroatoms such as nitrogen, oxygen, sulfur, phosphorus and the like, and in general, the inorganic small molecular chain residue can be selected from any one of the following groups, unsaturated forms of any one, substituted forms of any one or hybridized forms of any one: chain sulfur residue, silane chain residue, silicon oxide chain residue, sulfur nitrogen compound chain residue, phosphazene compound chain residue, phosphorus oxide chain residue, borane chain residue, boron oxide chain residue; preferred are chain sulfur residues, silane chain residues, siloxane compound chain residues, phosphazene compound chain residues, and borane chain residues.

The inorganic macromolecular chain residue with molecular weight of more than 1000Da mentioned in the present invention can be any suitable inorganic macromolecular chain residue with main chain and side chain mainly composed of inorganic element heteroatoms such as silicon, boron, aluminum and the like and heteroatoms such as nitrogen, oxygen, sulfur, phosphorus and the like, and can be selected from any one of the following groups, unsaturated forms of any one, substituted forms of any one or hybridized forms of any one: chain sulfur polymer residues, polysiloxane chain residues, polysulfide silicon chain residues, polysulfide nitrogen chain residues, polyphosphate chain residues, polyphosphazene chain residues, polychlorophosphazene chain residues, polyborane chain residues, polyboroxine chain residues; or any inorganic macromolecule with residues and modified surfaces, which is selected from the following groups: zeolite-type molecular sieves, aluminum phosphate molecular sieves, zirconium phosphate molecular sieves, heteropolyacid salt molecular sieves, diamond, graphite, carbon fiber, white phosphorus, red phosphorus, phosphorus pentoxide, molybdenum sulfide, silica, silicon disulfide, silicon nitride, silicon carbide, talc, kaolin, montmorillonite, mica, asbestos, feldspar, cement, glass, quartz, ceramics, boron oxide, sulfur nitride, calcium silicide, silicates, glass fiber, beryllium oxide, magnesium oxide, mercury oxide, borohydride, boron nitride, boron carbide, aluminum nitride, diaspore, gibbsite, corundum, titanium dioxide; preferred are chain sulfur polymer residues, polysiloxane chain residues, polyphosphazene chain residues, polyborane chain residues, surface-modified graphite, surface-modified carbon fibers, surface-modified silica, surface-modified silicon nitride, surface-modified silicon carbide, surface-modified silicates, surface-modified glass fibers, surface-modified boron nitride.

The structures of the small molecule alkyl, the polymer chain residue, the small molecule silane chain residue, the inorganic small molecule chain residue and the inorganic large molecule chain residue are not particularly limited, and can be straight chain, branched chain, multi-arm structure, star, comb, dendritic, supermolecule, single ring, multi-ring, spiral ring, thick ring, bridge ring, chain with a ring structure, two-dimensional cluster and three-dimensional cluster; the polymer may contain a soft segment or a rigid segment in a small molecule hydrocarbon group, a polymer chain residue, a small molecule silane chain residue, an inorganic small molecule chain residue or an inorganic large molecule chain residue.

For simplicity of description, in the description of the present invention, the term "and/or" is used to indicate that the term may include three cases selected from the options described before the conjunction "and/or," or selected from the options described after the conjunction "and/or," or selected from the options described before and after the conjunction "and/or. For example, the term "and/or" in the specification of "a dynamic polymer having a dynamically crosslinked structure containing organoboronate silicone linkages on the backbone of the polymer chains of the crosslinked network and/or on the backbone of the crosslinked chains between the polymer chains" means that the dynamic polymer may contain organoboronate silicone linkages on the backbone of the polymer chains of the crosslinked network, or organoboronate silicone linkages on the backbone of the crosslinked links between the polymer chains of the crosslinked network, or both on the backbone of the polymer chains of the crosslinked network and on the backbone of the crosslinked links between the polymer chains; for another example, the term "in" and/or "in the specification," in which the organoborate silicone bond is present as a polymerization linkage point and/or a crosslinking linkage point of the dynamic polymer, means that the organoborate silicone bond may be present as a polymerization linkage point of the dynamic polymer, or as a crosslinking linkage point of the dynamic polymer, or as both a polymerization linkage point and a crosslinking linkage point of the dynamic polymer; for another example, in the specification, "A" is a module containing an organoboronic acid group and/or an organoboronate group "and/or" means that A is a module containing an organoboronic acid group, or a module containing an organoboronate group, or a module containing both an organoboronic acid group and an organoboronate group. The conjunction "and/or" appearing elsewhere in the specification of the invention is intended to be such meaning.

The "organic group" as used herein means a group mainly composed of a carbon element and a hydrogen element as a skeleton, and may be a small molecular group having a molecular weight of not more than 1000Da or a polymer chain residue having a molecular weight of more than 1000Da, and suitable groups include, for example: methyl, ethyl, vinyl, phenyl, benzyl, carboxyl, aldehyde, acetyl, acetonyl, and the like.

The "organosilicon group" as used herein means a group mainly composed of a silicon element and a hydrogen element as a skeleton, and may be a small molecule silyl group having a molecular weight of not more than 1000Da or a silicone-based polymer chain residue having a molecular weight of more than 1000Da, and suitable groups are, for example: silane groups, siloxane groups, silasulfanyl groups, silazane groups, and the like.

As used herein, the term "common covalent bond" refers to a covalent bond in the conventional sense other than a dynamic covalent bond, including but not limited to a carbon-carbon bond, a carbon-oxygen bond, a carbon-hydrogen bond, a carbon-nitrogen bond, a carbon-sulfur bond, a nitrogen-hydrogen bond, a nitrogen-oxygen bond, a hydrogen-oxygen bond, a nitrogen-nitrogen bond, and the like.

The term "molecular weight" as used herein refers to the relative molecular mass of a substance, and for small molecule compounds, small molecule groups, and certain macromolecular compounds and macromolecular groups having a fixed structure, the molecular weight is generally monodispersed, i.e., has a fixed molecular weight; and for oligomers, polymers, oligomer residues, polymer residues, and the like having a polydispersity molecular weight, the molecular weight generally refers to the average molecular weight. Wherein, the small molecular compound and the small molecular group in the invention refer to a compound or a group with the molecular weight not more than 1000 Da; the macromolecular compound and the macromolecular group refer to compounds or groups with molecular weight more than 1000 Da.

The term "polymerization", as used in the present invention, refers to a process in which a lower molecular weight reactant synthesizes a product having a higher molecular weight by the reaction form of polycondensation, addition polymerization, ring-opening polymerization, and the like. Among these, the reactant is generally a compound such as a monomer, oligomer, prepolymer, or the like, which has a polymerization ability (i.e., can be polymerized spontaneously or can be polymerized by an initiator or an external energy). The product resulting from the polymerization of one reactant is called a homopolymer. The product resulting from the polymerization of two or more reactants is referred to as a copolymer. It is to be noted that "polymerization" referred to in the present invention includes a linear growth process of a reactant molecular chain, a branching process of a reactant molecular chain, a ring formation process of a reactant molecular chain, but does not include a crosslinking process of a reactant molecular chain; that is, "polymerization" refers to a process of polymerization growth of molecular chains of reactants in addition to a process of crosslinking reaction.

The term "cross-linking" as used in the present invention refers to the process of forming a product having a three-dimensional infinite network type by chemical linkage of dynamic covalent bonds and optionally ordinary covalent bonds between and/or within reactant molecules. In the case of crosslinking with common covalent bonds, it is necessary to ensure that the degree of crosslinking of the common covalent crosslinks of the polymer is below the gel point, so that upon dissociation of the dynamically reversible silicone organoboronate bonds, the polymer system can dissociate into smaller, uncrosslinked and/or clustered units.

The term "heteroatom" as used herein refers to a nitrogen atom, an oxygen atom, a sulfur atom, a phosphorus atom, a silicon atom, a boron atom, and the like, which are common non-carbon atoms.

In the present invention, a compound in which a carbon atom at any position of a hydrocarbon is substituted with a heteroatom is collectively referred to as "heterohydrocarbon".

The term "alkyl" as used herein refers to a saturated hydrocarbon group having a straight or branched chain structure. The alkyl group may have the indicated number of carbon atoms, as appropriate, e.g. C_1-4An alkyl group including alkyl groups having 1,2,3, or 4 carbon atoms in a linear or branched arrangement. Examples of suitable alkyl groups include, but are not limited to, methyl, ethyl, propyl, n-butyl, isobutyl, tert-butyl, n-pentyl, 2-methylbutyl, 3-methylbutyl, 4-methylbutyl, n-hexyl, 2-methylpentyl, 3-methylpentyl, 4-methylpentyl, 5-methylpentyl, 2-ethylbutyl, 3-ethylbutyl, heptyl, octyl, nonyl, decyl.

The term "cycloalkyl" as used in the present invention refers to a saturated cyclic hydrocarbon. The cycloalkyl ring can include the indicated number of carbon atoms. For example, a 3 to 8 membered cycloalkyl group includes 3,4, 5, 6, 7 or 8 carbon atoms. Examples of suitable cycloalkyl groups include, but are not limited to, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, and cyclooctyl.

The term "aromatic hydrocarbon group" as used in the present invention means any stable monocyclic or polycyclic carbon ring of up to 7 atoms in each ring, wherein at least one ring is aromatic. Examples of such aryl groups include, but are not limited to, phenyl, biphenyl, naphthyl, binaphthyl, tetrahydronaphthyl, indanyl, anthracyl, bianthryl, phenanthryl, biphenanthryl.

The term "heteroaromatic hydrocarbyl" as used herein denotes a stable monocyclic or polycyclic ring of up to 7 atoms in each ring, wherein at least one ring is aromatic and at least one ring contains heteroatoms selected from O, N, S, P, Si, B, and the like. Heteroarylalkyl groups within the scope of this definition include, but are not limited to, acridinyl, carbazolyl, cinnolinyl, quinoxalinyl, quinazolinyl, pyrazolyl, indolyl, benzotriazolyl, furanyl, thienyl, thiophenyl, 3, 4-propylenedioxythiophenyl, benzothiophenyl, benzofuranyl, benzodioxan, benzodioxine, quinolinyl, isoquinolinyl, oxazolyl, isoxazolyl, imidazolyl, pyrazinyl, pyridazinyl, pyridyl, pyrimidinyl, pyrrolyl, tetrahydroquinoline, thiazolyl, isothiazolyl, 1,2, 4-triazolyl, 1,2, 3-triazolyl, 1,2, 4-oxadiazolyl, 1,2, 4-thiadiazolyl, 1,3, 5-triazinyl, 1,2,4, 5-tetrazinyl, and tetrazolyl.

The monocyclic structure mentioned in the cyclic structure of the present invention means that the cyclic structure contains only one ring, and examples thereof are:

the polycyclic structure referred to means that the cyclic structure contains two or more independent rings, such as:

the spiro ring structure refers to a cyclic structure containing two or more rings which are formed by sharing an atom with each other in the cyclic structure, for example:

reference to fused ring structures (which also includes bicyclic, aromatic and fused ring structures) is intended to include within the ring structure a ring structure made up of two or more rings sharing two adjacent atoms with one another, such as, for example:

the bridged ring structure mentioned above means a ring structure containing two or more rings which are constituted by sharing two or more adjacent atoms with each other in a ring structure, and has a three-dimensional cage structure, for example:

the nested ring structure refers to a ring structure comprising two or more rings connected or nested with each other, such as:

for simplicity, ranges of numbers of carbon atoms in a group are also indicated herein in subscripts of C in subscripts representing the number of carbon atoms the group has, e.g., C_1-10Denotes "having 1 to 10 carbon atoms", C_3-20Means "having 3 to 20 carbon atoms". "unsaturated C_3-20Hydrocarbyl "means C_3-20A compound having an unsaturated bond in a hydrocarbon group. "substituted C_3-20Hydrocarbyl "means C_3-20A compound obtained by substituting a hydrogen atom of a hydrocarbon group. "hybrid C_3-20Hydrocarbyl "means C_3-20A compound obtained by substituting a carbon atom in a hydrocarbon group with a heteroatom. When one group can be selected from C_1-10When hydrocarbyl, it may be selected from hydrocarbyl groups of any number of carbon atoms in the range indicated by the subscript, i.e., may be selected from C₁、C₂、C₃、C₄、C₅、C₆、C₇、C₈、C₉、C₁₀Any of hydrocarbon groups. In the present invention, unless otherwise specified, subscripts set forth as intervals each represent an integer selected from any one of the ranges, including both endpoints.

When the structure concerned has an isomer, any of the isomers may be used unless otherwise specified. If not specifically stated, alkyl means a hydrocarbon group formed by losing a hydrogen atom at any position. Specifically, for example, propyl means any of n-propyl and isopropyl, and propylene means any of 1, 3-propylene, 1, 2-propylene and isopropylene.

The term "substituted" as used herein means that any one or more hydrogen atoms at any position of the "substituted hydrocarbon group" may be substituted with any substituent, for example, a "substituted hydrocarbon group". The substituent is not particularly limited, and the like.

For a compound, a group or an atom, both substituted and hybridized, e.g. nitrophenyl for a hydrogen atom, also e.g. -CH₂-CH₂-CH₂-is replaced by-CH₂-S-CH(CH₃)-。

In the invention, for the organic boric acid group and the organic boric acid ester group which form the dynamic polymer organic boric acid silicon ester bond, the boron atom in the group has electron deficiency, so that the group is easy to be attacked by nucleophilic reagent containing unshared electron pair to generate bonding; for the silicon hydroxyl group (including the silicon hydroxyl precursor capable of obtaining the silicon hydroxyl group through conversion) forming the organic borate silicon ester bond, as the silicon hydroxyl oxygen atom contains an unshared electron pair and the silicon hydroxyl group has strong polarity and high activity, the reaction such as a rapid dehydration condensation reaction, an ester exchange reaction and the like can be carried out in the process of contacting with the organic borate group and/or the organic borate group to form the organic borate silicon ester bond, thereby forming the organic borate polymer. The invention utilizes the high reactivity of organic boric acid group and organic borate group with silicon hydroxyl and the strong dynamic reversibility of organic borate silicon ester bond to prepare the dynamic polymer which can show dynamic effect under mild condition. Meanwhile, the organic boric acid group and/or the organic borate group are used for forming the organic borate silicone bond, so that the components for forming the organic borate silicone bond are more abundant in selection, the regulation and control performance in the aspects of the structure, the dynamic reversibility, the mechanical property, the solvent resistance and the like of the dynamic polymer is greatly improved, and the application range of the polymer is expanded.

When the organoboron compound (I) containing the organoboronic acid group and/or the organoboronate group is mixed with the silicon-containing compound (II) containing the silicon hydroxyl group and/or the silicon hydroxyl precursor in a dissolved or molten state, the organoboronic acid group in the organoboron compound (I) can perform a rapid condensation reaction with the silicon hydroxyl group in the silicon-containing compound (II) to form an organoboronate silicate bond, so that a dynamic polymer is obtained; the organoborate group in the organoboron compound (I) can directly perform ester exchange reaction with the silicon hydroxyl in the silicon-containing compound (II) to form an organoborate silicon ester bond, or can form an organoborate silicon ester bond by performing condensation reaction with the silicon hydroxyl in the silicon-containing compound (II) after forming an organoborate group by hydrolysis, so as to obtain a dynamic polymer; the silicon hydroxyl precursor in the silicon-containing compound (II) can be directly subjected to condensation reaction with the organic boric acid group in the organic boron compound (I) through small molecule removal, or can be subjected to condensation reaction with the organic boric acid group in the organic boron compound (I) after being hydrolyzed to form a silicon hydroxyl group, or subjected to ester exchange reaction with the organic boric acid group in the organic boron compound (I) to form an organic silicon borate ester bond, so that the dynamic polymer is obtained. Among these, the dynamic polymer is preferably obtained by forming an organoborate silicone bond using the organoboron compound (I) containing an organoboronic acid group and the silicon-containing compound (II) containing a silicon hydroxyl group precursor, and the organoboron compound (I) containing an organoboronate group and the silicon-containing compound (II) containing a silicon hydroxyl group, and more preferably, the dynamic polymer is obtained by forming an organoborate silicone bond using the organoborate compound (I) containing an organoboronate group and the silicon-containing compound (II) containing a silicon hydroxyl group. When the reaction is carried out using the organoboron compound (I) containing organoborate groups or the silicon-containing compound (II) containing silicon hydroxyl group precursors, it is generally necessary to carry out the reaction at a relatively high temperature, or to carry out the condensation reaction after in situ hydrolysis of one of them. One polymerization system may contain both of the organoboron compound (I) and the silicon-containing compound (II).

For the compound (III) containing both an organoboronic acid group and/or organoboronate group and a silicon hydroxyl group and/or a silicon hydroxyl group precursor, it is generally required to react the organoboronic acid group in the compound (III) with the silicon hydroxyl group precursor contained in the same or different compound (III) by controlling the reaction conditions and adding a suitable reaction assistant to form an organoboronic acid silicon ester bond, or to react the organoboronic acid group in the compound (III) with the silicon hydroxyl group precursor contained in the same or different compound (III) after obtaining the organoboronic acid group by hydrolysis to form the organoboronic acid silicon ester bond, or the organoborate group in the compound (III) and the silicon hydroxyl group precursor contained in the same or different compounds (III) are firstly hydrolyzed to obtain the silicon hydroxyl group, and the condensation reaction is carried out to form the organoborate silicon ester bond, or the organoborate group and the silicon hydroxyl group precursor in the compound (III) are simultaneously hydrolyzed and then the condensation reaction is carried out to form the organoborate silicon ester bond, so that the dynamic polymer is obtained. A polymerization system may contain, in addition to one or more compounds (III), one or more organoboron compounds (I) and/or one or more silicon-containing compounds (II).

In addition to the reaction of the organic boric acid group and/or the organic borate group contained in the compound with the silicon hydroxyl group and/or the silicon hydroxyl precursor in the process of forming the dynamic polymer, the organic boric acid compound (I), the silicon-containing compound (II) and the compound (III) can also be selectively and commonly covalently linked by polymerization/crosslinking reaction with other reactive groups, so that the organic boric acid group and/or the organic borate group and the silicon hydroxyl group and/or the silicon hydroxyl precursor are jointly reacted to obtain the dynamic polymer.

The compound (IV) is generally a dynamic polymer containing an organoboronate silicone bond obtained by the mutual reaction between other reactive groups contained in the compound (IV) or the mutual reaction between other reactive groups contained in the compound (IV) and other reactive groups contained in other compounds.

For embodiments involving compounds containing other reactive groups, it may be possible to obtain dynamic polymers by reactions such as the following forms: an ester bond is formed by a condensation reaction of a hydroxyl group contained in the compound and a carboxyl group contained in the compound, thereby obtaining a dynamic polymer; performing condensation reaction on amino contained in the compound and carboxyl contained in the compound to form an amido bond, thereby obtaining a dynamic polymer; the epoxy group contained in the compound and the hydroxyl, amino and sulfhydryl contained in the compound are subjected to ring-opening reaction to form ether bond, secondary amine bond and thioether bond, so that the dynamic polymer is obtained; under the action of an initiator or external energy, carrying out free radical polymerization on olefin contained in the compound to obtain a dynamic polymer; under the action of an initiator or external energy, carrying out anionic/cationic polymerization on olefin contained in the compound to obtain a dynamic polymer; the ether bond is formed by ring-opening polymerization of epoxy group contained in the compound, thereby obtaining dynamic polymer; carrying out CuAAC reaction through an azide group contained in the compound and an alkynyl group contained in the compound under the catalysis of cuprous to obtain a dynamic polymer; carrying out thiol-ene click reaction on sulfydryl contained in the compound and olefin contained in the compound to obtain a dynamic polymer; a dynamic polymer or the like is obtained by an addition reaction between double bonds contained in the compound.

The organic boron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and other compounds containing other reactive groups for preparing the dynamic polymer can be gas, liquid, crystal, powder, particles, paste and the like.

In the preparation of the dynamic polymer, the organoboronic acids in the organoboron compound (I), the compound (III) and the organoboronic acids as raw materials may be present in the form of organoboronic acids or organoboronate esters. Wherein, the compound raw material existing in the form of organic boric acid ester is more stable, which is beneficial to transportation and storage; in addition, by using the raw material containing the organic borate, the parameters such as polymerization degree, crosslinking degree and dynamic property in the final dynamic polymer can be better regulated and controlled, so that the comprehensive performance of the polymer can be regulated and controlled.

In the preparation of the dynamic polymer, the silicon hydroxyl group in the silicon-containing compound (II), compound (III) as the raw material may be present in the form of a silicon hydroxyl group or a silicon hydroxyl group precursor. When the silicon hydroxyl group in the silicon-containing compound (II) or the compound (III) exists in the form of a silicon hydroxyl group precursor, water required for hydrolysis can be obtained from various sources in the process of hydrolyzing to form the silicon hydroxyl group, and the water can be artificially added, adsorbed on the surface of the raw material or the substrate, or water vapor contained in the atmosphere, or generated by a chemical reaction. In the hydrolysis process of the silicon-containing compound (II) and the compound (III), in order to avoid self-condensation of silicon hydroxyl, a small amount of condensation inhibitor can be selectively added, so that the reaction system is kept neutral as much as possible; or adding a proper amount of nonpolar inert solvent to dissolve the generated silanol in the organic solvent so as to reduce the interaction of the silanol in the aqueous medium; the condensation reaction can also be slowed down by adjusting the reaction temperature. The compound existing in the form of a silicon hydroxyl precursor is used as a raw material and is stable, transportation and storage are facilitated, and the synthesis process and performance parameters of the polymer can be regulated and controlled by utilizing different group activities.

During the synthesis and use of the silicon-containing compound (II) as a starting material, condensation inhibitors may optionally be added, generally in order to maintain the system at neutral or near neutral conditions, to avoid condensation of the silicon hydroxyl groups to siloxanes, and thus to enable high yields of silicon hydroxyl group-containing compounds to be obtained. In the using process of the silicon-containing compound (II), the synthesized or hydrolyzed silicon-containing compound (II) is ensured to be used as well as possible; it is more preferable that the silicon-containing compound (II) is synthesized or hydrolyzed and then subjected to condensation reaction with the organoboron compound (I) under controlled conditions to give a dynamic polymer. In the process of reacting the silicon-containing compound (II) with the organoboron compound (I), the organoboron compound (I) which is reacted with the silicon-containing compound (II) is added to the organoboron compound (I) in a form of slow addition or dropwise addition as far as possible under the condition that the organoboron compound (I) which is reacted with the silicon-containing compound (II) is in an excessive state.

When the raw material is selected from the compound (III), in order to ensure the stability of the raw material, the organic boric acid in the compound (III) is preferably in the form of organic boric acid ester, the silicon hydroxyl in the compound (III) is preferably in the form of silicon hydroxyl precursor, and a nonpolar inert solvent is used as a reaction solvent as much as possible in the preparation process of the compound (III), and the compound (III) is stored under the low-temperature condition; meanwhile, some condensation inhibitors are also needed to be added in the synthesis process of raw materials, and the compound (III) is ensured to be used as the compound. In the compound (III), the molar equivalent of the organoboronic acid group and/or organoborate group is generally larger than that of the silicon hydroxyl group and/or silicon hydroxyl precursor, and the silicon hydroxyl group and/or silicon hydroxyl precursor and the organoboronic acid group and/or organoborate group are fully reacted by controlling the conditions of temperature, pH and the like.

Considering that the mode and method adopted by the compound (III) in the preparation and preservation processes are relatively complicated, the raw material components for preparing the dynamic polymer are preferably selected from the organoboron compound (I) and the silicon-containing compound (II), but the compound (III) is also one of the important components of the dynamic polymer raw material, has specific advantages in certain specific cases and cannot be ignored.

When the organoboronate silicone bond-containing compound (IV) is used to prepare a dynamic polymer, the compound (IV) can be prepared by selecting an appropriate organoboron compound (I) and silicon-containing compound (II), and then subjecting the prepared compound (IV) to an appropriate polymerization/crosslinking method to obtain a dynamic polymer, or subjecting the prepared compound (IV) and an optional compound not containing an organoboronate silicone bond to an appropriate polymerization/crosslinking method to obtain a dynamic polymer.

Wherein, the suitable polymerization method can be carried out by any suitable polymerization reaction commonly used in the art, including but not limited to condensation polymerization, addition polymerization, ring-opening polymerization; the addition polymerization reaction includes, but is not limited to, radical polymerization, anionic polymerization, cationic polymerization, and coordination polymerization.

In particular embodiments, compound (IV), compounds containing other reactive groups, may be carried out by any suitable polymerization process commonly used in the art using any of the polymerization methods described above to obtain dynamic polymers. For example, when the compound (IV) or a compound having another reactive group is a dynamic polymer obtained by condensation polymerization, it can be carried out by a polymerization process such as melt polymerization, solution polymerization, or interfacial polymerization; for example, when the compound (IV) or the compound having another reactive group is a dynamic polymer obtained by radical polymerization, it can be carried out by a polymerization process such as bulk polymerization, solution polymerization, suspension polymerization, or emulsion polymerization; for example, when the compound (IV) or a compound having another reactive group is used in the form of an ionic polymer, it can be carried out by a polymerization process such as solution polymerization, slurry polymerization or gas phase polymerization.

The melt polymerization mentioned in the above polymerization process is usually carried out by polymerizing the compound (IV) and the compound containing other reactive groups in a molten state by using an initiator or under conditions of light, heat, irradiation, catalysis, etc. to obtain a dynamic polymer in a molten state; as mentioned, the solution polymerization is usually carried out by dissolving the compound (IV), the compound having other reactive groups, and the initiator in an appropriate solvent to carry out polymerization to obtain a dynamic polymer; the interfacial polymerization mentioned above is usually carried out by dissolving the compound (IV) and a compound having other reactive groups in two solvents which are immiscible with each other and carrying out polymerization at the interface of the solution (or at the side of the interfacial organic phase) to obtain a dynamic polymer; as mentioned, bulk polymerization is usually carried out by polymerizing the compound (IV), a compound having other reactive groups, and the like in a small amount of an initiator or under conditions of light, heat, irradiation, catalysis, and the like to obtain a dynamic polymer; as mentioned, the suspension polymerization is usually carried out by stirring the compound (IV) and the compound containing other reactive groups dissolved with the initiator into small droplets, and suspending the droplets in an aqueous medium to carry out polymerization to obtain a dynamic polymer; the emulsion polymerization mentioned above is usually carried out by dispersing the compound (IV) and a compound having other reactive groups in an aqueous medium in which an initiator is dissolved by the action of an emulsifier to form an emulsion and then carrying out polymerization to obtain a dynamic polymer; the slurry polymerization mentioned above is usually carried out by dissolving the compound (IV) and a compound containing other reactive groups in a suitable solvent, and the initiator is present in the solvent in the form of a dispersion to carry out the polymerization, and the resulting dynamic polymer is precipitated in the form of a precipitate; as the gas phase polymerization, a method of polymerizing the compound (IV) and a compound having other reactive groups in a gas phase by using an initiator or conditions of light, heat, irradiation, catalysis, etc. is generally carried out to obtain a dynamic polymer.

The suitable crosslinking method can be carried out by any suitable crosslinking reaction commonly used in the art.

In the specific implementation process, the compound (IV) and compounds containing other reactive groups can obtain dynamic polymers by physical crosslinking means such as thermal-initiated crosslinking, photo-initiated crosslinking, radiation-initiated crosslinking, plasma-initiated crosslinking and microwave-initiated crosslinking; the compound (IV) and compounds containing other reactive groups can also be used for obtaining dynamic polymers by chemical crosslinking means such as peroxide crosslinking, sulfide crosslinking, nucleophilic reagent substitution crosslinking, copolymerization crosslinking, ion complexing crosslinking and the like. The crosslinking process may be carried out in bulk, solution, emulsion, etc. To facilitate the dissociation of the dynamically reversible organoborate silicone bond, the polymer system may be broken down into any one or more of the following units: monomers, polymer chain fragments, linear polymer units, non-crosslinked polymer units, polymer cluster units, etc., it is necessary to ensure that the degree of crosslinking of the chemical crosslinks is below the gel point.

In embodiments of the invention, the other reactive groups in the organoboron compound (I), silicon containing compound (II), compound (III) may also form common covalent linkages between the compounds by the polymerization/crosslinking methods described above. The organoboron compound (I), the silicon-containing compound (II) and the compound (III) can also be prepared into dynamic polymers by a solution polymerization/crosslinking process or an emulsion polymerization/crosslinking process. The solution polymerization/crosslinking process and the emulsion polymerization/crosslinking process have the advantages of reducing system viscosity, facilitating mass and heat transfer, facilitating temperature control and avoiding local overheating, and the obtained solution and emulsion are convenient to concentrate or disperse, and are beneficial to coating, mixing and other operations.

In various embodiments of the invention, the dynamic polymer may be prepared by mixing a certain proportion of the starting materials by any suitable means of mixing the materials known in the art, which may be mixing in a batch, semi-continuous or continuous process; likewise, the dynamic polymer may be shaped in an alternative batch, semi-continuous or continuous process. The mixing method includes, but is not limited to, solution stirring mixing, melt stirring mixing, kneading, banburying, roll mixing, melt extrusion, ball milling, etc., wherein solution stirring mixing, melt stirring mixing and melt extrusion are preferred. The energy supply form in the material mixing process includes but is not limited to heating, illumination, radiation, microwave and ultrasound. The molding method includes, but is not limited to, extrusion molding, injection molding, compression molding, casting, calendaring, and casting.

The dynamic polymer can be blended with some additive auxiliary agent and filler to form dynamic polymer composite system in the preparation process of polymer, but these additives are not necessary.

The specific process for preparing dynamic polymers by stirring and mixing solutions is generally carried out by stirring and mixing the starting materials in dissolved or dispersed form in the respective solvents or in a common solvent in a reactor. Generally, the mixing reaction temperature is controlled to be 0 to 200 ℃, preferably 25 to 120 ℃, more preferably 25 to 80 ℃, and the mixing stirring time is controlled to be 0.5 to 12 hours, preferably 1 to 4 hours. The product obtained after mixing and stirring can be poured into a suitable mold and placed at a temperature of 0-150 ℃, preferably 25-80 ℃ for 0-48h to obtain a polymer sample. In the process, the solvent can be selectively retained to prepare a polymer sample in the form of solution, emulsion, suspension, paste, gel and the like, or the solvent can be selectively removed to prepare a solid polymer sample in the form of film, block and the like.

When the compound (IV) is used as a raw material to prepare a dynamic polymer by the method, it is usually necessary to add an initiator to a solvent as appropriate to initiate polymerization in a solution polymerization manner to obtain the dynamic polymer, or add a dispersant and an oil-soluble initiator to prepare a suspension to initiate polymerization in a suspension polymerization or slurry polymerization manner to obtain the dynamic polymer, or add an initiator and an emulsifier to prepare an emulsion to initiate polymerization in an emulsion polymerization manner to obtain the dynamic polymer. The methods employed for solution polymerization, suspension polymerization, slurry polymerization and emulsion polymerization are all polymerization methods which are well known and widely used by those skilled in the art and can be adapted to the actual situation and will not be described in detail here.

The solvent used in the above preparation method should be selected according to the actual conditions of the reactants, the products, the reaction process, etc., and includes, but is not limited to, any one of the following solvents or a mixture of any several solvents: deionized water, acetonitrile, acetone, butanone, benzene, toluene, xylene, ethyl acetate, diethyl ether, methyl tert-butyl ether, tetrahydrofuran, methanol, ethanol, chloroform, dichloromethane, 1, 2-dichloroethane, dimethyl sulfoxide, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, isopropyl acetate, N-butyl acetate, trichloroethylene, mesitylene, dioxane, Tris buffer, citric acid buffer, acetic acid buffer, phosphoric acid buffer, boric acid buffer, etc.; preferably deionized water, toluene, chloroform, dichloromethane, 1, 2-dichloroethane, tetrahydrofuran, dimethylformamide, phosphoric acid buffer solution.

In the above-mentioned production method, the concentration of the compound liquid to be prepared is not particularly limited depending on the structure, molecular weight, solubility and desired dispersion state of the selected reactant, and the concentration of the compound liquid is preferably 0.1 to 10mol/L, more preferably 0.1 to 1 mol/L.

The specific method for preparing dynamic polymer by melt-stirring mixing is usually to directly stir and mix the raw materials in a reactor or to stir and mix the raw materials after heating and melting, and this method is generally used in the case that the raw materials are gas, liquid or solid with a low melting point. Generally, the mixing reaction temperature is controlled to be 0 to 200 ℃, preferably 25 to 120 ℃, more preferably 25 to 80 ℃, and the mixing stirring time is controlled to be 0.5 to 12 hours, preferably 1 to 4 hours. The product obtained after mixing and stirring can be poured into a suitable mould and placed at a temperature of 0-150 ℃, preferably 25-80 ℃ for 0-48h to obtain a polymer sample.

When a dynamic polymer is produced by this method using the compound (IV) as a starting material, it is usually necessary to initiate the polymerization by melt polymerization or gas phase polymerization with the addition of a small amount of an initiator as the case may be. The methods of melt polymerization and gas phase polymerization, which are well known and widely used by those skilled in the art, can be adjusted according to the actual conditions and will not be described in detail herein.

The specific method for preparing dynamic polymer by melt extrusion mixing is to add raw materials into an extruder to carry out extrusion blending reaction, wherein the extrusion temperature is 0-280 ℃, and preferably 50-150 ℃. The reaction product can be directly cast and cut into proper size, or the obtained extruded sample is crushed and then is made into a sample by an injection molding machine or a molding press. The injection molding temperature is 0-280 ℃, preferably 50-150 ℃, and the injection molding pressure is preferably 60-150 MPa; the molding temperature is 0-280 deg.C, preferably 25-150 deg.C, more preferably 25-80 deg.C, the molding time is 0.5-60min, preferably 1-10min, and the molding pressure is preferably 4-15 MPa. The sample can be placed in a suitable mold at a temperature of 0-150 c, preferably 25-80 c, for 0-48h to obtain the final polymer sample.

In the preparation process of the dynamic polymer, the component selection and the formula proportion of the selected organic boron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and the compound containing other reactive groups can be flexibly grasped, but reasonable design and combination are carried out according to the target material performance, the structure of the selected compound, the number of the contained reactive groups and the molecular weight. Wherein the organic boron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and the compound containing other reactive groups are added in a manner that the molar equivalent ratio of the functional groups and/or other reactive groups in the reactant system is in a proper range. The molar equivalent ratio of the organoboron compound (I), the silicon-containing compound (II) or the organoborate group contained in the compound (III) to the silicon hydroxyl group and/or the silicon hydroxyl group precursor functional group is preferably in the range of 0.1 to 10, more preferably in the range of 0.3 to 3, and still more preferably in the range of 0.8 to 1.2, wherein the number of moles of the organoboron group and/or organoborate group functional group may be appropriately excessive. When the molar equivalent ratio of the functional groups contained in the organoboron compound (I), the silicon-containing compound (II) and the compound (III) is close to 1:1, a dynamic polymer with high reaction degree and good stability can be obtained; when the molar equivalent ratio of the functional groups contained in the organoboron compound (I), the silicon-containing compound (II) and the compound (III) deviates from 1:1, a dynamic polymer having good dynamic properties can be obtained. Similarly, when the compound (IV) or a compound containing another reactive group is used as a reaction component for producing a dynamic polymer, the molar equivalent ratio of the other reactive group in the reactant system is also in an appropriate range, and the molar equivalent ratio of the other reactive group to be subjected to polymerization/crosslinking reaction is preferably in a range of 0.1 to 10, more preferably in a range of 0.3 to 3, and still more preferably in a range of 0.8 to 1.2. In the actual preparation process, the skilled person can make adjustments according to the actual needs.

In the process of preparing the dynamic polymer containing the organoboron silicate bond by using the organoboron compound (I), the silicon-containing compound (II), the compound (III) and the compound (IV), organic structures such as functional groups, molecular chain segments with different structures, molecular chain segments with different molecular weights, reactive groups, functional groups and the like with different numbers can be introduced into compound raw materials according to needs through the design and adjustment of the structure of the compound, and the organic structures become structural components of the dynamic polymer through the preparation process, so that the regulation and control of the structure of the dynamic polymer can be realized in a larger range. The diversity of the dynamic polymer structure also enables the polymer to show various performances, and the polymer can be applied to different fields according to the performances of the polymer. More importantly, the structure and the performance of the polymer can be designed from the source according to the requirements of practical application by those skilled in the art; in this process, the organic structures (e.g., organoboron structures, organosilicon structures) used can become effective media for the skilled person to regulate and design dynamic polymer structures. The advantages and the characteristics are difficult to realize in the field of inorganic compounds, inorganic compounds (such as inorganic boric acid, inorganic borate and the like) are single in structure and fixed in functional group number, heterogeneous reaction is carried out, the general structure and the property of the polymer prepared by using the inorganic borate are the same, and the obtained inorganic borate silicon ester bond is easy to absorb water and hydrolyze, so that the use of the inorganic borate silicon ester bond is limited.

Wherein, by designing the functional group structures in the organic boron compound (I), the silicon-containing compound (II) and the compound (III), the dynamic polymers with different dynamic activities can be prepared. For example, a dynamic polymer is prepared by using a phenylboronic acid/phenylboronic acid ester structure with an aminomethyl group attached to the ortho position or a phenylboronic acid/phenylboronic acid ester structure with an amide group attached to the ortho position, wherein the aminomethyl group or the amide group at the ortho position can play a role in promoting the dynamic property; for example, after a strong electron-withdrawing group (such as a fluorine atom, an acetoxy group, a pyridyl group, a piperidyl group and the like) is connected to a boron atom in the organoboronic acid group and/or the organoboronic acid group, the reaction rate of the organoboronic acid group and/or the organoboronic acid group with a silicon hydroxyl group and/or a silicon hydroxyl group precursor is also greatly improved; the obtained dynamic polymer can show higher dynamic activity, so that the organic boric acid silicon ester bond in the polymer can show dynamic reversibility under a milder condition, and the dynamic polymer can be prepared and used under a milder condition, thereby expanding the application range of the polymer.

In the preparation process of the dynamic polymer, the dynamic polymer with different crosslinking degrees can be prepared by regulating the functional groups in the organoboron compound (I), the silicon-containing compound (II) and the compound (III), and the performance of the dynamic polymer is different along with the different crosslinking degrees. For materials made of dynamic polymers with low crosslinking degree, the materials are generally low in mechanical strength and mechanical modulus, excellent in toughness and ductility, poor in thermal stability and dimensional stability, soft in texture and low in surface hardness in macroscopic representation, and can be stretched in a large range; the modified epoxy resin can be generally used as a flexible film, an adhesive and a sealant, or can be prepared into a solution or an emulsion to be used as a coating and an impregnant. For the material made of the dynamic polymer with higher crosslinking degree, the mechanical strength and modulus are higher, the toughness, thermal stability, wear resistance and creep resistance are improved, but the ductility is reduced, and the material generally has colloid or solid with more excellent rebound resilience or rigidity in macroscopic expression; it is generally used as a film, fiber or bulk material having a certain strength.

In the present invention, a dynamic polymer having a dynamic cross-linked structure is prepared using at least one compound having a multifunctional number. When the bifunctional compound is simply utilized to form the dynamic polymer, the bifunctional compound has fewer active functional groups, and when the molecular weight of the compound is larger, the active functional groups are possibly embedded in a polymer chain due to the winding of molecular chains and cannot participate in reaction, so that the reaction efficiency between the organic boric acid group and/or organic borate group and the silicon hydroxyl group and/or silicon hydroxyl precursor functional group is reduced; meanwhile, a bifunctional compound is simply utilized to carry out dynamic polymerization reaction to prepare a linear dynamic polymer, and a material prepared from the polymer is generally low in mechanical strength and mechanical modulus, poor in thermal stability, dimensional stability and solvent resistance and limited in application. When the multifunctional compound is used for polymerization, the active points of dynamic polymerization reaction are increased, the dynamic crosslinking efficiency is improved, the dynamic crosslinking points in the polymer are increased, the utilization rate of dynamic covalent bonds in the dynamic polymer is improved, and the dynamic characteristics of the organic boric acid silicone bond are well reflected. Meanwhile, when the obtained dynamic polymer with the dynamic cross-linking structure is used as a material, compared with a linear dynamic polymer material, the dynamic cross-linking polymer material is improved in the aspects of mechanical property, thermal stability, wear resistance, solvent resistance, creep resistance and the like, so that the application range of the dynamic polymer is expanded.

In the preparation process of the dynamic polymer, the flexibility of molecular chains in the organoboron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and compounds containing other reactive groups is regulated, so that the dynamic polymer with different properties can be prepared, and the obtained dynamic polymer can have one or more glass transition temperatures. For a compound mainly composed of a flexible chain (such as a polyethylene chain, a polyethylene glycol chain, a polysiloxane chain, a polybutadiene chain, a polyacrylic acid chain, a polyester chain and the like) and/or a compound capable of being polymerized into the flexible chain, the dynamic polymer prepared from the compound is relatively easy to rotate in a molecular chain segment, generally has a lower glass transition temperature (generally not higher than 25 ℃) and a lower melting point (generally not higher than 100 ℃), and has good fluidity; the material generally has the macro-scale expression of high flexibility, low brittleness, stretching and bending, and good solubility, but has weak rigidity, heat resistance and dimensional stability, and can be generally used as gel, adhesive and elastic material. For compounds mainly composed of rigid chains (such as polyacetylene chains, polyaramid chains, polyphenylene ether chains, polybenzothiazole chains, and the like) and/or compounds capable of polymerizing into rigid chains, dynamic polymers prepared therefrom have relatively difficulty in rotation within molecular segments, generally have high glass transition temperatures (generally higher than 25 ℃) and high melting points (generally higher than 100 ℃), and have high melt viscosities; the material generally has larger rigidity and surface hardness, stronger dimensional stability, heat resistance and chemical resistance on the macroscopic scale, but has lower ductility, and can be generally used as a structural part. When a compound containing a flexible chain and a rigid chain and/or a compound capable of being polymerized into the flexible chain and the rigid chain are/is adopted at the same time, the prepared dynamic polymer generally has a plurality of glass transition temperatures with obvious differences, the polymer material has moderate rigidity, hardness and flexibility, the mechanical property of the polymer material can be adjusted according to different formulas, and the polymer material can be generally used as a film, a coating and a damping material. In the present invention, since the dynamic polymer having a flexible structure can exhibit more excellent dynamic reversibility and tensile toughness, it is preferable to prepare the dynamic polymer using the organoboron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV), and the compound containing another reactive group, which have a flexible structure and/or can be polymerized into a flexible chain.

In the preparation process of the dynamic polymer, the molecular weights of the organoboron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and compounds containing other reactive groups are regulated, so that the dynamic polymer with different crosslinking densities can be prepared, and the dynamic polymer also shows different property characteristics due to different crosslinking densities. The lower the crosslinking density of the dynamic polymer, the higher the molecular weight of the polymer chains between crosslinking points and vice versa. For dynamic polymers with low crosslinking density, the glass transition temperature and the melting point are generally low, the rigidity and the surface hardness are low, the mechanical strength is low, but the dynamic polymer can show good dynamic activity; for dynamic polymers with higher crosslinking density, the glass transition temperature and the melting point are generally higher, and the dynamic polymers can show better mechanical strength, toughness and elasticity, but the dynamic activity is reduced. The person skilled in the art can adjust the process according to the actual needs.

In addition, in the preparation process of the dynamic polymer, the performance of the dynamic polymer can be regulated and controlled by introducing functional groups into the organic boron compound (I), the silicon-containing compound (II), the compound (III), the compound (IV) and compounds containing other reactive groups. For example, hydrolysis resistance of dynamic polymers is improved by introducing hydrophobic groups; preparing a dynamic polymer with fluorescence by introducing a fluorescent group; the oxidation resistance of the dynamic polymer is improved by introducing an antioxidant group; the dynamic properties of the dynamic polymer are adjusted by introducing acidic groups or basic groups, and the like. For another example, when it is desired to blend the dynamic polymer with other polymers, the compatibility between the components can be improved by introducing structural components or coupling groups similar to those of other polymers.

For example, the above description is only an example of the part of the structure of the compound component as the raw material in the present invention that can regulate the performance of the dynamic polymer, and the design of the structure, performance and use of the dynamic polymer in the present invention has a wide adjustable range, often can also embody many unexpected practical effects, and is difficult to exhaust, and those skilled in the art can adjust the structure, performance and use according to the idea of the present invention.

In the preparation process of the dynamic polymer, some additive agents can be added, which can improve the preparation process of the polymer, improve the quality and the yield of the product, reduce the cost of the product or endow the product with certain specific application performance. The additive can be selected from any one or more of the following additives: the synthesis auxiliary agent comprises a catalyst and an initiator; stabilizing aids including antioxidants, light stabilizers, heat stabilizers; the auxiliary agent for improving the mechanical property comprises a cross-linking agent, a toughening agent and a coupling agent; the auxiliary agent for improving the processing performance comprises a lubricant and a release agent; softening and lightening auxiliaries including plasticizers and dynamic regulators; the auxiliary agents for changing the surface performance comprise an antistatic agent, an emulsifier and a dispersant; the color light changing auxiliary agent comprises a coloring agent, a fluorescent whitening agent and a delustering agent; flame retardant and smoke suppressant aids including flame retardants; other auxiliary agents include nucleating agents, rheological agents, thickening agents and leveling agents. It should be noted that the cross-linking agent in the additive can be used only when the common covalent linkage is formed between the same or different compounds by physical/chemical cross-linking means for preparing the dynamic polymer, such as the organic boric acid silicone bond or other chemical bond, the addition of such additive is not necessary, and the common covalent cross-linking formed must be below the gel point of the covalent cross-linking to obtain the dynamic cross-linked polymer.

The catalyst in the additive agent can accelerate the reaction rate of reactants in the reaction process by changing the reaction path and reducing the reaction activation energy. It includes, but is not limited to, any one or any of the following catalysts: sodium hydroxide, potassium hydroxide, calcium hydroxide, ethylenediamine, triethanolamine, triethylamine, pyridine, 4-dimethylaminopyridine, imidazole, diisopropylethylamine, sodium carbonate, sodium bicarbonate, acetic acid, sulfuric acid, phosphoric acid, carbonic acid, hypochlorous acid, hydrofluoric acid; among them, sodium hydroxide, triethylamine and acetic acid are preferable as the catalyst. The amount of the catalyst to be used is not particularly limited, and is generally 0.01 to 0.5 wt.%.

The initiator in the additive can cause the monomer molecules to be activated to generate free radicals in the polymerization reaction process, so as to improve the reaction rate and promote the reaction to proceed, and the initiator comprises any one or more of the following initiators: organic peroxides, such as lauroyl peroxide, Benzoyl Peroxide (BPO), diisopropyl peroxydicarbonate, dicyclohexyl peroxydicarbonate, bis (4-tert-butylcyclohexyl) peroxydicarbonate, tert-butyl peroxybenzoate, tert-butyl peroxypivalate, di-tert-butyl peroxide, diisopropylbenzene hydroperoxide; azo compounds, such as Azobisisobutyronitrile (AIBN), azobisisoheptonitrile; inorganic peroxides such as ammonium persulfate, potassium persulfate, and the like; among them, the initiator is preferably lauroyl peroxide, benzoyl peroxide, azobisisobutyronitrile, or potassium persulfate. The amount of the initiator used is not particularly limited, and is generally 0.1 to 1 wt.%.

The antioxidant in the additive can retard the oxidation process of the polymer sample and ensure that the material can be processed smoothly and has a prolonged service life, including but not limited to any one or more of hindered phenols such as 2, 6-di-tert-butyl-4-methylphenol, 1, 3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, pentaerythrityl tetrakis [ β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ], 2 ' -methylenebis (4-methyl-6-tert-butylphenol), sulfur-containing hindered phenols such as 4,4 ' -thiobis- [ 3-methyl-6-tert-butylphenol ], 2 ' -thiobis- [ 4-methyl-6-tert-butylphenol ], triazine-based hindered phenols such as 1,3, 5-bis [ β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionyl ] -hexahydro-triazine, polyisocyanates such as tris (3, 5-di-tert-butyl-4-hydroxybenzyl) -triphenyldiamine such as BHA, N-tert-butyl-4-hydroxyphenyl-butyl-4-phenyl phosphite, tris (N-butyl-4-tert-butyl-4-hydroxyphenyl) phosphite, bis (4-butyl-phenyl) phosphite), tris (N-phenyl) phosphite, N-4-tert-butyl-phenyl) phosphite, N-4-butyl-phenyl-4-phenyl phosphite, N-4-bis (4-phenyl) phosphite, N-butyl-phenyl) phosphite, N-phenyl phosphite, N-4-phenyl phosphite, N-butyl-phenyl phosphite, N-2-4-phenyl phosphite, N-bis (4-phenyl phosphite, N-4-phenyl phosphite, N.

The light stabilizer in the additive can prevent the polymer sample from photo-aging and prolong the service life of the polymer sample, and the additive comprises any one or more of the following light stabilizers: light-shielding agents such as carbon black, titanium dioxide, zinc oxide, calcium sulfite; ultraviolet absorbers such as 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-n-octyloxybenzophenone, 2- (2-hydroxy-3, 5-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2,4, 6-tris (2-hydroxy-4-n-butoxyphenyl) -1,3, 5-s-triazine, 2-ethylhexyl 2-cyano-3, 3-diphenylacrylate; precursor type ultraviolet absorbent such as p-tert-butyl benzoate salicylate and bisphenol A disalicylate; ultraviolet ray quenchers, such as bis (3, 5-di-tert-butyl-4-hydroxybenzylphosphonic acid monoethyl ester), 2' -thiobis (4-tert-octylphenoloxy) nickel; hindered amine light stabilizers such as bis (2,2,6, 6-tetramethylpiperidine) sebacate, 2,2,6, 6-tetramethylpiperidine benzoate, tris (1,2,2,6, 6-pentamethylpiperidyl) phosphite; other light stabilizers, such as 2, 4-di-tert-butyl-4-hydroxybenzoic acid (2, 4-di-tert-butylphenyl) ester, alkylphosphoramide, zinc N, N '-di-N-butyldithiocarbamate, nickel N, N' -di-N-butyldithiocarbamate, etc.; among them, carbon black and bis (2,2,6, 6-tetramethylpiperidine) sebacate (light stabilizer 770) are preferable as the light stabilizer. The amount of the light stabilizer to be used is not particularly limited, but is generally 0.01 to 0.5 wt.%.

The heat stabilizer in the additive can prevent the polymer sample from generating chemical changes due to heating in the processing or using process, or delay the changes to achieve the purpose of prolonging the service life, and the heat stabilizer comprises but is not limited to any one or more of the following heat stabilizers: lead salts, such as tribasic lead sulfate, dibasic lead phosphite, dibasic lead stearate, dibasic lead benzoate, tribasic lead maleate, basic lead silicate, lead stearate, lead salicylate, dibasic lead phthalate, basic lead carbonate, silica gel coprecipitated lead silicate; metal soaps: such as cadmium stearate, barium stearate, calcium stearate, lead stearate, zinc stearate; organotin compounds, such as di-n-butyltin dilaurate, di-n-octyltin dilaurate, di (n) -butyltin maleate, mono-octyl di-n-octyltin dimaleate, isooctyl di-n-octyltin dimercaptoacetate, tin C-102, isooctyl dimethyltin dimercaptoacetate, dimethyltin dimercaptoxide, and combinations thereof; antimony stabilizers such as antimony mercaptide, antimony thioglycolate, antimony mercaptocarboxylate, antimony carboxylate; epoxy compounds, such as epoxidized oils, epoxidized fatty acid esters, epoxy resins; phosphites, such as triaryl phosphites, trialkyl phosphites, triarylalkyl phosphites, alkyl-aryl mixed esters, polymeric phosphites; polyols, such as pentaerythritol, xylitol, mannitol, sorbitol, trimethylolpropane; composite heat stabilizers such as coprecipitated metal soaps, liquid metal soap composite stabilizers, organic tin composite stabilizers and the like; among them, barium stearate, calcium stearate, di-n-butyltin dilaurate, and di (n) -butyltin maleate are preferable as the heat stabilizer. The amount of the heat stabilizer used is not particularly limited, and is generally 0.1 to 0.5 wt.%.

The cross-linking agent in the additive can be used for forming non-cross-linked common covalent link or common covalent cluster, that is, for increasing the degree of non-cross-linked branching with common covalent link or forming small-sized cluster, and includes but is not limited to any one or any several of the following cross-linking agents: sulfur, benzoquinone dioxime, 4' -dibenzoyl-p-quinone dioxime, ethylenediamine, diethylenetriamine, triethylene tetramine, dimethylaminopropylamine, hexamethylenetetramine, m-phenylenediamine, phthalic anhydride, maleic anhydride, pyromellitic dianhydride, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, boron trifluoride complex, ethyl orthosilicate, methyl orthosilicate, p-toluenesulfonic acid, p-toluenesulfonyl chloride, 1, 4-butanediol diacrylate, ethylene glycol dimethacrylate, butyl acrylate, aluminum isopropoxide, zinc acetate, titanium acetylacetonate, aziridine, isocyanate, phenol resin, dicumyl peroxide, lauroyl peroxide, stearoyl peroxide, benzoyl peroxide, cyclohexanone peroxide, acetophenone peroxide, and mixtures thereof, Di-tert-butyl peroxide, di-tert-butyl phthalate, cumene hydroperoxide, etc.; among them, the crosslinking agent is preferably sulfur, dicumyl peroxide (DCP), Benzoyl Peroxide (BPO), Ethylenediamine (EDA), Diethylenetriamine (DETA), phthalic anhydride, or maleic anhydride. The amount of the crosslinking agent used is not particularly limited, and is generally 0.1 to 5 wt.%.

The toughening agent in the additive can reduce the brittleness of a polymer sample, increase the toughness and improve the bearing strength of the material, and the toughening agent comprises any one or more of the following toughening agents: methyl methacrylate-butadiene-styrene copolymer resin, chlorinated polyethylene resin, ethylene-vinyl acetate copolymer resin and its modified product, acrylonitrile-butadiene-styrene copolymer, acrylonitrile-butadiene copolymer, ethylene-propylene rubber, ethylene-propylene-diene monomer rubber, butadiene rubber, styrene-butadiene-styrene block copolymer, etc.; among them, the toughening agent is preferably ethylene-propylene rubber, acrylonitrile-butadiene-styrene copolymer (ABS), styrene-butadiene-styrene block copolymer (SBS), methyl methacrylate-butadiene-styrene copolymer resin (MBS) or chlorinated polyethylene resin (CPE). The amount of the toughening agent to be used is not particularly limited, and is generally 5 to 10 wt.%.

The coupling agent in the additive can improve the interface performance of a polymer sample and an inorganic filler or a reinforcing material, reduce the viscosity of a material melt in the plastic processing process, improve the dispersion degree of the filler to improve the processing performance, and further enable a product to obtain good surface quality and mechanical, thermal and electrical properties, wherein the coupling agent comprises any one or more of the following coupling agents: organic acid chromium complex, silane coupling agent, titanate coupling agent, sulfonyl azide coupling agent, aluminate coupling agent and the like; among them, gamma-aminopropyltriethoxysilane (silane coupling agent KH550) and gamma- (2, 3-glycidoxy) propyltrimethoxysilane (silane coupling agent KH560) are preferable as the coupling agent. The amount of the coupling agent used is not particularly limited, and is generally 0.5 to 2 wt.%.

The lubricant in the additive can improve the lubricity, reduce the friction and reduce the interfacial adhesion performance of the polymer sample, and comprises but is not limited to any one or any several of the following lubricants: saturated and halogenated hydrocarbons, such as paraffin wax, microcrystalline wax, liquid paraffin wax, low molecular weight polyethylene, oxidized polyethylene wax; fatty acids such as stearic acid, hydroxystearic acid; fatty acid esters such as fatty acid lower alcohol esters, fatty acid polyol esters, natural waxes, ester waxes and saponified waxes; aliphatic amides, such as stearamide or stearamide, oleamide or oleamide, erucamide, N' -ethylene bis stearamide; fatty alcohols and polyols, such as stearyl alcohol, cetyl alcohol, pentaerythritol; metal soaps such as lead stearate, calcium stearate, barium stearate, magnesium stearate, zinc stearate, etc.; among them, the lubricant is preferably paraffin wax, liquid paraffin wax, stearic acid, low molecular weight polyethylene. The amount of the lubricant used is not particularly limited, and is generally 0.5 to 1 wt.%.

The release agent in the additive can make the polymer sample easy to release, smooth and clean, and includes but not limited to any one or more of the following release agents: paraffin, soaps, dimethyl silicone oil, ethyl silicone oil, methyl phenyl silicone oil, castor oil, waste engine oil, mineral oil, molybdenum disulfide, polyethylene glycol, vinyl chloride resin, polystyrene, silicone rubber, polyvinyl alcohol and the like; among them, the release agent is preferably dimethyl silicone oil or polyethylene glycol. The amount of the release agent used is not particularly limited, and is generally 0.5 to 2 wt.%.

The plasticizer in the additive can increase the plasticity of a polymer sample, so that the hardness, modulus, softening temperature and brittle temperature of the polymer are reduced, and the elongation, flexibility and flexibility of the polymer are improved, and the plasticizer comprises but is not limited to any one or more of the following plasticizers: phthalic acid esters: dibutyl phthalate, dioctyl phthalate, diisooctyl phthalate, diheptyl phthalate, diisodecyl phthalate, diisononyl phthalate, butylbenzyl phthalate, butyl glycolate phthalate, dicyclohexyl phthalate, bis (tridecyl) phthalate, bis (2-ethyl) hexyl terephthalate; phosphoric acid esters such as tricresyl phosphate, diphenyl-2-ethyl hexyl phosphate; fatty acid esters such as di (2-ethyl) hexyl adipate, di (2-ethyl) hexyl sebacate; epoxy compounds, such as epoxyglycerides, epoxidized fatty acid monoesters, epoxidized tetrahydrophthalic acid esters, epoxidized soybean oil, epoxidized 2-ethylhexyl stearate, epoxidized 2-ethylhexyl soyate, 4, 5-epoxytetrahydrophthalic acid di (2-ethyl) hexyl ester, and methyl chrysene acetyl ricinoleate; glycol esters, e.g. C_5～9Acid ethylene glycol ester, C_5～9Triethylene glycol diacetate; chlorine-containing compounds such as greening paraffin, chlorinated fatty acid ester; polyesters such as 1, 2-propanediol-series ethanedioic acid polyester, 1, 2-propanediol sebacic acid polyester, phenyl petroleum sulfonate, trimellitate ester, citrate ester, pentaerythritol, dipentaerythritol ester and the like; among them, the plasticizer is preferably dioctyl phthalate (DOP), dibutyl phthalate (DBP), diisooctyl phthalate (DIOP), diisononyl phthalate (DINP), diisodecyl phthalate (DIDP), or tricresyl phosphate (TCP). The amount of the plasticizer to be used is not particularly limitedAnd usually 5-20 wt.%.

The dynamic regulator in the additive can improve the dynamics of regulating the organic boric acid silicon ester bond so as to obtain the optimized expected performance, and the dynamic regulator is generally a compound with free hydroxyl or free carboxyl, including but not limited to water, sodium hydroxide, alcohol (including silanol), carboxylic acid and the like. The amount of the dynamic regulator to be used is not particularly limited, and is usually 0.1 to 10 wt.%.

The antistatic agent in the additive can guide or eliminate harmful charges accumulated in polymer samples so as to cause no inconvenience or harm to production and life, and comprises any one or more of anionic antistatic agents such as alkyl sulfonate, sodium P-nonylphenoxypropane sulfonate, alkyl phosphate diethanol amine salt, alkylphenol polyoxyethylene ether sulfonate triethanolamine, potassium P-nonylphenyl ether sulfonate, alkyl polyoxyethylene ether sulfonate triethanolamine, phosphate derivatives, phosphate, polyethylene oxide alkyl ether phosphate, alkyl bis [ di (2-hydroxyethyl amine) ] phosphate, phosphate derivatives, fatty amine sulfonate, sodium butyrate sulfonate, cationic antistatic agents such as fatty ammonium hydrochloride, lauryl trimethyl ammonium chloride, N, N-cetyl-ethylmorpholine ethyl sulfate, stearamidopropyl (2-hydroxyethyl) dimethyl ammonium nitrate, alkyl hydroxyethyl dimethyl ammonium perchlorate, 2-alkyl-3, 3-dihydroxyethyl imidazoline, 2-heptadecyl-3-hydroxyethyl-4-carboxyethyl imidazoline, N, N, N-hydroxyethyl-bis (2-hydroxyethyl) dimethyl ammonium nitrate, N-polyoxyethylene lauryl dimethyl ammonium chloride, N-polyoxyethylene lauryl dimethyl ammonium sulfate, N-polyoxyethylene lauryl dimethyl ammonium chloride, N-polyoxyethylene lauryl dimethyl ammonium sulfate, N-polyoxyethylene lauryl dimethyl ammonium chloride, N-polyoxyethylene lauryl dimethyl ammonium sulfate, N-polyoxyethylene lauryl dimethyl ammonium chloride, N-polyoxyethylene lauryl dimethyl ammonium sulfate, N-polyoxyethylene lauryl dimethyl ammonium chloride, N-polyoxyethylene lauryl dimethyl ammonium chloride, polyoxyethylene lauryl.

The emulsifier in the additive can improve the surface tension between various constituent phases in the polymer mixed solution containing the additive to form a uniform and stable dispersion system or emulsion, and is preferably used for emulsion polymerization/crosslinking, and the emulsifier includes but is not limited to any one or more of the following emulsifiers: anionic type, such as higher fatty acid salts, alkylsulfonic acid salts, alkylbenzenesulfonic acid salts, sodium alkylnaphthalenesulfonate, succinic acid ester sulfonate, petroleum sulfonic acid salts, fatty alcohol sulfate salts, castor oil sulfate ester salts, sulfated butyl ricinoleate salts, phosphate ester salts, fatty acyl-peptide condensates; cationic, such as alkyl ammonium salts, alkyl quaternary ammonium salts, alkyl pyridinium salts; zwitterionic, such as carboxylate, sulfonate, sulfate, phosphate; nonionic type, such as fatty alcohol polyoxyethylene ether, alkylphenol polyoxyethylene ether, fatty acid polyoxyethylene ester, polypropylene oxide-ethylene oxide adduct, glycerin fatty acid ester, pentaerythritol fatty acid ester, sorbitol and sorbitan fatty acid ester, sucrose fatty acid ester, alcohol amine fatty acid amide, etc.; the emulsifier is preferably sodium dodecyl benzene sulfonate, sorbitan fatty acid ester, and triethanolamine stearate (emulsifier FM). The amount of emulsifier used is not particularly limited and is generally 1 to 5 wt.%.

The dispersing agent in the additive can disperse solid flocculation groups in the polymer mixed solution into fine particles to be suspended in the liquid, uniformly disperse solid and liquid particles which are difficult to dissolve in the liquid, and simultaneously can prevent the particles from settling and coagulating to form stable suspension, and the dispersing agent comprises any one or more of anionic dispersing agents, such as alkyl sulfate sodium salt, alkyl benzene sulfonate sodium and petroleum sodium sulfonate, cationic dispersing agents, nonionic dispersing agents, such as fatty alcohol polyoxyethylene ether and sorbitan fatty acid polyoxyethylene ether, inorganic dispersing agents, such as silicate and condensed phosphate, macromolecular dispersing agents, such as starch, gelatin, water-soluble glue, lecithin, carboxymethyl cellulose, hydroxyethyl cellulose, sodium alginate, lignosulfonate, polyvinyl alcohol, β -naphthalene sulfonic acid formaldehyde condensate, ethylene oxide condensate of alkyl phenol formaldehyde condensate, polycarboxylate and the like, wherein the dispersing agent is preferably sodium dodecyl benzene sulfonate, naphthalene methylene sulfonate (dispersing agent N) and fatty alcohol polyoxyethylene ether, the using amount of the dispersing agent is not particularly limited, and is generally 0.3-0.8 wt.%.

The colorant in the additive can make the polymer product present the required color, and increase the surface color, which includes but not limited to any one or several of the following colorants: inorganic pigments such as titanium white, chrome yellow, cadmium red, iron red, molybdenum chrome red, ultramarine, chrome green, carbon black; organic pigments, e.g. lithol rubine BK, lake Red C, perylene Red, Jia-base R Red, Phthalocyanine Red, permanent magenta HF3C, Plastic scarlet R and Clomomor Red BR, permanent orange HL, fast yellow G, Ciba Plastic yellow R, permanent yellow 3G, permanent yellow H₂G. Phthalocyanine blue B, phthalocyanine green, plastic purple RL and aniline black; organic dyes such as thioindigo red, vat yellow 4GF, Vaseline blue RSN, basic rose essence, oil-soluble yellow, etc.; the colorant is selected according to the color requirement of the sample, and is not particularly limited. The amount of the colorant used is not particularly limited, and is generally 0.3 to 0.8 wt.%.

The fluorescent whitening agent in the additive can enable the dyed material to obtain the fluorite-like flash luminescence effect, and the fluorescent whitening agent comprises any one or more of the following fluorescent whitening agents: stilbene type, coumarin type, pyrazoline type, benzoxazine type, phthalimide type, and the like; among the fluorescent whitening agents, sodium diphenylethylene disulfonate (fluorescent whitening agent CBS), 4-bis (5-methyl-2-benzoxazolyl) stilbene (fluorescent whitening agent KSN), 2- (4, 4' -distyryl) bisbenzoxazole (fluorescent whitening agent OB-1) are preferable. The amount of the fluorescent whitening agent used is not particularly limited, and is generally 0.002 to 0.03 wt.%.

The matting agent in the additive can diffuse reflection when incident light reaches the surface of the polymer, so that low-gloss matte and matte appearance is generated, and the matting agent comprises any one or more of the following matting agents: settling barium sulfate, silicon dioxide, hydrous gypsum powder, talcum powder, titanium dioxide, polymethyl urea resin and the like; among them, the matting agent is preferably silica. The amount of matting agent used is not particularly limited and is generally 2 to 5 wt.%.

The flame retardant in the additive can increase the flame resistance of the material, and includes but is not limited to any one or any several of the following flame retardants: phosphorus series such as red phosphorus, tricresyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyldiphenyl phosphate; halogen-containing phosphates such as tris (2, 3-dibromopropyl) phosphate, tris (2, 3-dichloropropyl) phosphate; organic halides such as high chlorine content chlorinated paraffins, 1,2, 2-tetrabromoethane, decabromodiphenyl ether, perchlorocyclopentadecane; inorganic flame retardants such as antimony trioxide, aluminum hydroxide, magnesium hydroxide, zinc borate; reactive flame retardants such as chlorendic anhydride, bis (2, 3-dibromopropyl) fumarate, tetrabromobisphenol A, tetrabromophthalic anhydride, and the like; among them, the flame retardant is preferably decabromodiphenyl ether, tricresyl phosphate, tolyldiphenyl phosphate, antimony trioxide. The amount of flame retardant used is not particularly limited, and is typically 1 to 20 wt.%.

The nucleating agent in the additive can accelerate the crystallization rate, increase the crystallization density and promote the grain size to be micronized by changing the crystallization behavior of the polymer, so as to achieve the purposes of shortening the molding period of the material and improving the physical and mechanical properties of the product, such as transparency, surface gloss, tensile strength, rigidity, heat distortion temperature, impact resistance, creep resistance and the like, and the nucleating agent comprises any one or more of the following nucleating agents: benzoic acid, adipic acid, sodium benzoate, talcum powder, sodium p-phenolsulfonate, silicon dioxide, dibenzylidene sorbitol and derivatives thereof, ethylene propylene rubber, ethylene propylene diene monomer and the like; among them, the nucleating agent is preferably silicon dioxide, dibenzylidene sorbitol (DBS) or ethylene propylene diene monomer. The amount of the nucleating agent used is not particularly limited, and is generally 0.1 to 1 wt.%.

The rheological agent in the additive can ensure that the polymer has good brushing property and proper coating thickness in the coating process, prevents the solid particles from settling during storage, and can improve the redispersibility, and the rheological agent comprises any one or more of the following rheological agents: inorganic species such as barium sulfate, zinc oxide, alkaline earth metal oxides, calcium carbonate, lithium chloride, sodium sulfate, magnesium silicate, fumed silica, water glass, colloidal silica; organometallic compounds such as aluminum stearate, aluminum alkoxides, titanium chelates, aluminum chelates; organic compounds such as organobentonite, hydrogenated castor oil/amide wax, cellulose derivatives, isocyanate derivatives, hydroxyl compounds, acrylic emulsion, acrylic copolymer, polyvinyl alcohol, polyethylene wax, cellulose ester, etc.; among them, the rheological agent is preferably organic bentonite, polyethylene wax, hydrophobically modified alkaline expandable emulsion (HASE), and alkaline expandable emulsion (ASE). The amount of the rheological agent used is not particularly limited, and is generally 0.1 to 1 wt.%.

The thickening agent in the additive can endow the polymer mixed solution with good thixotropy and proper consistency, thereby meeting the requirements of various aspects such as stability and application performance during production, storage and use, and the thickening agent comprises any one or more of the following thickening agents: low molecular substances such as fatty acid salts, fatty alcohol-polyoxyethylene ether sulfates, alkyldimethylamine oxides, fatty acid monoethanolamides, fatty acid diethanolamides, fatty acid isopropylamides, sorbitan tricarboxylates, glycerol trioleate, cocamidopropyl betaine, 2-alkyl-N-carboxymethyl-N-hydroxyethyl imidazoline, titanate coupling agents; high molecular substances such as bentonite, artificial hectorite, fine silica, colloidal aluminum, plant polysaccharides, microbial polysaccharides, animal proteins, celluloses, starches, alginic acids, polymethacrylates, methacrylic acid copolymers, maleic anhydride copolymers, crotonic acid copolymers, polyacrylamide, polyvinylpyrrolidone, polyvinyl alcohol, polyether, and polyvinylmethylether-urea alkyl polymers; among them, the thickener is preferably hydroxyethyl cellulose, coconut oil diethanolamide, and acrylic acid-methacrylic acid copolymer. The amount of the thickener used is not particularly limited, and is generally 0.1 to 1.5 wt.%.

The leveling agent in the additive can ensure the smoothness and the evenness of a polymer coating, improve the surface quality of the coating and improve the decoration, and the leveling agent comprises any one or more of the following leveling agents: polydimethylsiloxane, polymethylphenylsiloxane, cellulose acetate butyrate, polyacrylates, silicone resins, and the like; among them, the leveling agent is preferably polydimethylsiloxane or polyacrylate. The amount of the leveling agent used is not particularly limited, and is generally 0.5 to 1.5 wt.%.

In the preparation process of the dynamic polymer, the auxiliary agents which can be added are preferably initiators, antioxidants, light stabilizers, heat stabilizers, toughening agents, plasticizers, emulsifiers, dispersing agents, flame retardants and dynamic regulators.

① reduces shrinkage rate of a molded product, improves dimensional stability, surface smoothness, flatness or dullness of the product and the like, ② adjusts viscosity of the material, ③ meets different performance requirements, such as improvement of impact strength, compression strength, hardness, rigidity and modulus of the material, improvement of wear resistance, heat deformation temperature, improvement of electrical conductivity and thermal conductivity and the like, ④ improves coloring effect of a pigment, ⑤ endows the product with light stability and chemical corrosion resistance, ⑥ plays a role in compatibilization, cost can be reduced, and competitiveness of the product in the market is improved.

The additive filler can be selected from any one or any several of the following fillers: inorganic non-metal filler, metal filler and organic filler.

The inorganic non-metal filler which can be added comprises any one or any several of the following materials: calcium carbonate, china clay, barium sulfate, calcium sulfate and calcium sulfite, talcum powder, white carbon black, quartz, mica powder, clay, asbestos fiber, orthoclase, chalk, limestone, barite powder, gypsum, graphite, carbon black, graphene, carbon nanotubes, molybdenum disulfide, slag, flue dust, wood powder and shell powder, diatomite, red mud, wollastonite, silicon-aluminum carbon black, aluminum hydroxide, magnesium hydroxide, fly ash, oil shale powder, expanded perlite powder, conductive carbon black, vermiculite, iron mud, white mud, alkali mud, boron mud, glass microbeads, resin microbeads, foamed microspheres, glass powder, cement, glass fiber, carbon fiber, quartz fiber, carbon core boron fiber, titanium diboride fiber, calcium titanate fiber, carbon silicon fiber, ceramic fiber, whisker and the like.

The metal filler which can be added comprises, but is not limited to, any one or any several of the following: conductive metal fillers, metal particles, metal and alloy powders, carbon steel, stainless steel fibers, and the like.

The organic filler includes, but is not limited to, ① natural organic fillers such as fur, natural rubber, cotton linter, hemp, jute, flax, asbestos, cellulose acetate, shellac, chitin, chitosan, lignin, starch, protein, enzyme, hormone, lacquer, wood flour, shell flour, glycogen, xylose, silk, etc., ② synthetic resin fillers such as acrylonitrile-acrylate-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, cellulose acetate, polychlorotrifluoroethylene, chlorinated polyethylene, epoxy resin, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, high-density polyethylene, high-impact polystyrene, low-density polyethylene, medium-density polyethylene, melamine-formaldehyde resin, polyamide, polyacrylic acid, polyacrylamide, polyacrylonitrile, polyarylsulfone, polybenzimidazole, butylene terephthalate, polycarbonate, polydimethylsiloxane, polyvinyl chloride, polyacrylic acid, polysulfone, polyethersulfone, polyethylene terephthalate, phenolic resin, tetrafluoroethylene-propylene copolymer, polyacrylonitrile, polyvinyl chloride, polyvinyl acetal, polyvinyl chloride.

Wherein, the type of the added filler is not limited, and is mainly determined according to the required material performance, preferably calcium carbonate, barium sulfate, talcum powder, carbon black, graphene, glass beads, glass fiber, carbon fiber, natural rubber, chitosan, starch, protein, polyethylene, polypropylene, polyvinyl chloride, ethylene-vinyl acetate copolymer, polyvinyl alcohol, isoprene rubber, butadiene rubber, nitrile rubber, chloroprene rubber, butyl rubber, ethylene propylene rubber, silicone rubber, thermoplastic elastomer, polyamide fiber, polycarbonate fiber, polyvinyl alcohol fiber, polyester fiber, and polyacrylonitrile fiber; the amount of the filler used is not particularly limited, and is generally 1 to 30 wt.%.

In the preparation process of the dynamic polymer, the addition amount of each component raw material of the dynamic polymer is not particularly limited, and a person skilled in the art can adjust the addition amount according to the actual preparation condition and the target polymer performance.

For the raw materials of the components in the first and second preparation embodiments, the following weight portions can be referred to:

wherein, the more preferable weight part ratio of the raw materials of each component is as follows:

For the raw materials of the components in the third and fourth preparation embodiments, the following weight portions can be referred to:

for the raw materials of the components in the fifth preparation embodiment, the following weight portions can be referred to:

the dynamic polymer has wide-range adjustable performance, can be applied to various fields, has wide application prospect, and has remarkable application effect in the fields of military and aerospace equipment, functional coatings and coatings, biomedicine, biomedical materials, energy, buildings, bionics, intelligent materials and the like.

For example, by utilizing the dilatancy of the dynamic polymer, the polymer can be applied to the aspects of oil extraction of oil wells, fuel explosion prevention and the like; the polymer material can dissipate a large amount of energy to play a role in damping when being vibrated, thereby effectively easing the vibration of a vibrator; the stress responsiveness of the dynamic polymer can also be utilized to be used as an energy-absorbing buffer material to be applied to the aspects of buffer packaging materials, sports protection products, impact protection products, military and police protection materials and the like, so that the vibration and impact of articles or human bodies under the action of external force, including shock waves generated by explosion and the like, can be reduced; the stress-sensitive polymer material is prepared through the dynamic reversibility and stress rate dependence of the dynamic polymer, and part of the stress-sensitive polymer material can be applied to preparing toys and body-building materials with magic effects of fluidity and elasticity conversion, and can also be used for preparing speed lockers of roads and bridges.

For another example, the self-repairing property of the dynamic polymer is fully utilized, so that the adhesive with the self-repairing function can be prepared and applied to the adhesion of various materials; the method can also be used for preparing polymer plugging glue with good plasticity and capable of being recycled and repaired; based on the dynamic reversibility of the organic boric acid silicon ester bond, the scratch-resistant coating with the self-repairing function can be designed and prepared, so that the service life of the coating is prolonged, and long-acting anticorrosion protection on a matrix material is realized; through proper component selection and formula design, the polymer gasket or the polymer plate with the self-repairing function can be prepared, so that the principle of organism injury healing can be simulated, the material can carry out self-healing on internal or external injuries, hidden dangers are eliminated, the service life of the material is prolonged, and great application potential is shown in the fields of military industry, aerospace, electronics, bionics and the like.

For example, when an organoborate silicone bond is used as a sacrificial bond, it can absorb a large amount of energy under an external force to impart excellent toughness to a polymer material, and thus a polymer film, a fiber, or a sheet having excellent toughness can be obtained, and the organoborate silicone bond can be widely used in the fields of military, aerospace, sports, energy, construction, and the like.

The dynamic polymers of the present invention are further described below in connection with certain embodiments. The specific examples are intended to illustrate the present invention in further detail, and are not intended to limit the scope of the present invention.

Example 1

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecular organic boron compound (I) containing four functional groups and a small molecular silicon-containing compound (II) containing two functional groups.

Weighing a certain amount of organic boron compound (a) (prepared by taking AIBN as an initiator and triethylamine as a catalyst and performing thiol-ene click reaction on vinyl boric acid, dibutyl vinyl borate and 1, 6-hexanedithiol) and dissolving the organic boron compound (a) in a tetrahydrofuran solvent to prepare a 0.8mol/L solution; 40ml of tetrahydrofuran solution dissolved with organic boron compound is weighed and poured into a dry clean flask, 4ml of deionized water is added, a little acetic acid is dripped and mixed evenly, and 5.02g of silicon-containing compound (b) is slowly added into the mixture (prepared by taking dimethyl allyl chlorosilane and 1, 10-decanedithiol as raw materials, taking AIBN as an initiator and triethylamine as a catalyst and carrying out thiol-ene click reaction). Stirring the mixed solution continuously at 60 deg.C, increasing the viscosity of the solution with the stirring, stirring for 4 hr to obtain homogeneous dynamic polymer fluid, and measuring the maximum elastic modulus G 'of the polymer fluid with a rotary rheometer'_maxAnd minimum modulus of elasticity G'_minTesting is carried out, wherein the testing temperature is 25 ℃, the testing frequency range is 0.1-100 rad/s, and the maximum elastic modulus G 'of the polymer fluid is measured'_maxIs 8.91X 10³Pa, minimum elastic modulus G'_minAt 7.13Pa, the dynamic polymer imparts a "shear thickening" effect to the polymer fluid. The polymer can be applied to explosion prevention of flammable liquid, and after the polymer is added into the liquid, the flammable liquid is not easy to splash due to the increase of viscosity in the stirring use process, so that the safety is improved. Can also be applied to oil extraction engineering and increase the oil displacement processDisplacing the viscosity of the phase, thereby enhancing oil recovery.

Example 2

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecular organic boron compound (I) containing four functional groups and a macromolecular silicon-containing compound (II) containing two functional groups.

Adding 15ml of phenylboronic acid-terminated polyethylene glycol (a) (prepared by using polyethylene glycol 400 and 2-bromopropionyl bromide as raw materials and triethylamine as a catalyst) into a dry and clean three-neck flask, preparing double-bromine-terminated polyethylene glycol, carrying out a alkylation reaction on the double-bromine-terminated polyethylene glycol and 2-aminomethylphenylboronic acid to obtain a final product, heating to 80 ℃, a small amount of deionized water and acetic acid were added dropwise thereto, and then 42ml of methoxysilane-modified silicone oil (b) (obtained by hydrosilylation under Pt catalysis using dimethylvinylmethoxysilane and hydrogen-terminated silicone oil having a viscosity of about 2000mPa · s as raw materials) was added dropwise under stirring, stirring for 30min under a heating state to fully and uniformly mix all the components, adding 2ml of triethylamine, and continuously reacting for 2h to obtain the polymer fluid with certain viscosity. The apparent viscosity of the polymer fluid was measured using a rotational viscometer at 25 ℃ with a constant shear rate of 0.1s^-1The apparent viscosity of the polymer fluid was found to be 22,680 mPas. Maximum elastic modulus G 'of Polymer fluid Using rotational rheometer'_maxAnd minimum modulus of elasticity G'_minTesting is carried out, wherein the testing temperature is 25 ℃, the testing frequency range is 0.1-100 rad/s, and the maximum elastic modulus G 'of the polymer fluid is measured'_maxIs 7.78X 10⁴Pa, minimum elastic modulus G'_minIt was 31.78 Pa. The structured dynamic polymer fluid exhibits significant dynamic properties and "shear thickening" and can be applied to textiles or in foams to make impact resistant protective articles, for example, for use as athletic apparel or as athletic padding.

Example 3

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing four functional groups and a small molecular silicon-containing compound (II) containing two functional groups.

Adding 15ml of borate terminated polyether (a) (prepared by performing a alkylation reaction on diisopropyl (bromomethyl) borate and polyetheramine with the molecular weight of about 2000) into a dry and clean three-neck flask, heating to 90 ℃, adding 3ml of deionized water, dropwise adding a small amount of acetic acid, uniformly stirring, dropwise adding 21ml of methylhydroxy silicone oil (b) (with the viscosity of about 30mPa & s), fully mixing the components for 30min by stirring, adding 2ml of triethylamine, and continuously reacting for 3h under the condition of heating and stirring to obtain the dynamic polymer fluid with higher viscosity. The apparent viscosity of the polymer fluid was measured using a rotational viscometer, where the test temperature was 25 ℃ and the shear rate was constant at 0.1s^-1The apparent viscosity of the polymer fluid was found to be 51,400 mPas. Adding 80ml of deionized water, 0.8g of sodium dodecyl benzene sulfonate, 0.4g of hydroxyethyl cellulose, 0.2g of stearic acid and 0.2g of oleic acid into another beaker, after uniformly mixing by stirring, pouring 30ml of polymer fluid into a beaker, rapidly stirring and mixing, stirring and mixing for 30min to obtain milky white liquid with certain viscosity, adding 0.2g of ground titanium dioxide, ultramarine and soft carbon black mixed powder, 0.2g of organic bentonite, 0.2g of polydimethylsiloxane, 0.2g of dibutyltin dilaurate, trace fluorescent whitening agent KSN and 20mg of light stabilizer 770, stirring and uniformly mixing, standing at room temperature for 12h, the water-based emulsion coating composed of the dynamic polymer can be obtained, and after the coating is directly coated on the surface of a substrate and dried, a scratch-resistant strippable and renewable coating can be formed.

Example 4

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing four functional groups and a macromolecular silicon-containing compound (II) containing two functional groups.

15.1g of phenylboronic acid-terminated polytetrahydrofuran (a) (prepared by using 3-aminophenylboronic acid as a raw material and carrying out a alkylation reaction with dibromo-terminated polytetrahydrofuran (molecular weight: about 2000)) was weighed into a dry and clean three-neck flask, 8.5g of hydroxy-terminated methylphenyl silicone oil (b) (molecular weight: about 12,000) was weighed into the three-neck flask, the temperature was raised to 100 ℃ under stirring, mixing was carried out, 1ml of triethylamine was added, and the reaction was continued for 3 hours. And after the reaction is finished, obtaining a viscous sample with certain viscosity, pouring the polymer sample into a proper mould, placing the mould in an oven at 80 ℃ under a vacuum condition for continuously reacting for 4-6h, then cooling to room temperature and placing for 30min to finally obtain a colloidal polymer sample. The polymer sample can be stretched in a large range at a slow stretching rate, and creep occurs; however, when rapidly stretched, it exhibits elastic characteristics, and can be rapidly restored by pressing with a finger. The sample is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile test is carried out by a tensile tester, the tensile rate is 50mm/min, the measured tensile strength of the sample is 0.67 plus or minus 0.14MPa, the tensile modulus is 0.79 plus or minus 0.39MPa, and the elongation at break can reach 1003 plus or minus 312%. The material can be made into toys with different colors, magic elasticity and similar plasticine.

Example 5

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecule compound (IV) containing one organic boric acid silicon ester bond and other reactive groups and a small molecule compound containing two other reactive groups.

Weighing 0.1mol of silicon borate compound (a) (methyl vinyl boric acid is prepared by reacting methyl lithium, vinyl lithium and trimethyl borate, and then methyl vinyl boric acid and mercaptosuccinic acid are used as raw materials, and after an intermediate product is prepared by thiol-ene click reaction at 80 ℃, the raw materials and aminoethylaminoisobutyldimethyl methoxysilane are subjected to condensation reaction at 50 ℃, 0.01mol of 4-aminobutyric acid (b), 0.05mol of dicyclohexylcarbodiimide condensing agent and 5mmol of catalyst 4-dimethylaminopyridine are dissolved in 80ml of deionized water, and after stirring and mixing uniformly, the reaction is carried out for 5 hours under reflux condition. After the reaction is finished, filtering the generated dicyclohexylurea under normal pressure, removing the solvent by reduced pressure suction filtration to obtain white residue, and purifying the white residue to obtain the pasty solid dynamic polymer. The obtained dynamic polymer has soft surface, lower melt viscosity and higher thermal stability, can be used as an additive with a lubricating effect, and can improve the lubricating property of the material under the action of high shear.

Example 6

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecular organic boron compound (I) containing bifunctional groups and one other reactive group and a small molecular silicon-containing compound (II) containing trifunctional groups and one other reactive group.

A dry clean reaction flask was charged with 60ml of tetrahydrofuran solvent, sealed, then deoxygenated by bubbling with argon for 1h, then 0.3g of ethynylboronic acid pinacol ester (a), 0.66g of azide group-containing silane (b) (prepared by reacting 11-bromoundecyltrichlorosilane with sodium azide), 0.28ml of N, N-diisopropylethylamine, and 19mg of Cu (PPh)₃)₃Br into the reaction flask. The reaction flask was heated to 60 ℃ and reacted for 12h with stirring. After the reaction is finished, the reaction solution is filtered to remove the solvent to obtain a primary product, and the primary product is eluted by normal hexane/dichloromethane (3:1) to remove impurities and dried to obtain a final product. The product is dissolved in tetrahydrofuran, and a certain amount of methanol is added to obtain the gel with mechanical sensitivity, so that the gel can be applied to damping materials.

Example 7

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecular organic boron compound (I) containing three functional groups and two small molecular silicon-containing compounds (II) containing three functional groups.

Dissolving an organic boron compound (a) (which is prepared by taking 1-hydroxyboron heterocyclic propylene as a raw material and performing addition reaction on the raw material and hydrobromic acid to prepare 2-bromo-1-hydroxyboron heterocyclic propane, taking 1,3, 5-triacryloylhexahydro-1, 3, 5-triazine and 2-aminoethanethiol as raw materials, AIBN as an initiator and triethylamine as a catalyst, performing thiol-ene click reaction to prepare an intermediate product, and then performing alkylation reaction on the intermediate product and 2-bromo-1-hydroxyboron heterocyclic propane) in a tetrahydrofuran solvent to prepare a solution with the concentration of 0.4 mol/L; taking a certain amount of silicon-containing compound (b) (prepared by taking 1-chloro-1-methyl-silacyclopentane-3-ene as a raw material, performing addition reaction on the raw material and hydrobromic acid to prepare 3-bromo-1-chloro-1-methyl-silacyclopentane, taking triallylamine and 2-aminoethanethiol as raw materials, AIBN as an initiator and triethylamine as a catalyst, performing a thiol-ene click reaction to prepare an intermediate product, and performing a alkylation reaction on the intermediate product and 3-bromo-1-chloro-1-methyl-silacyclopentane) to dissolve in a tetrahydrofuran solvent to prepare a 0.2mol/L solution; meanwhile, a certain amount of silicon-containing compound (c) (prepared by taking trimethylolpropane tris (3-mercaptopropionate) and 1-chloro-vinyl-silacyclobutane as raw materials, AIBN as an initiator and triethylammonium as a catalyst through thiol-ene click reaction) is dissolved in a tetrahydrofuran solvent to prepare a 0.2mol/L solution. Adding 20ml of prepared organic boron compound solution and 6ml of deionized water into a dry and clean beaker, dropwise adding a small amount of acetic acid, dropwise adding 20ml of silicon-containing compound (b) solution and 20ml of silicon-containing compound (c) solution under a stirring state, stirring uniformly at 50 ℃, dropwise adding 3ml of triethylamine, continuing to react for 4 hours, and continuously increasing the viscosity of the solution in the reaction process until a polymer sample with certain viscosity is obtained after the reaction is finished. And pouring the viscous polymer sample into a proper mould, placing the mould in a vacuum oven at 50 ℃ for 24h for drying, cooling to room temperature, and standing for 30min to obtain the colloidal polymer sample which has certain elasticity and can be stretched in a certain range. The sample was prepared into a dumbbell-shaped specimen having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out using a tensile tester at a tensile rate of 50mm/min, whereby the tensile strength of the specimen was 1.28. + -. 0.52MPa, the tensile modulus was 1.79. + -. 0.89MPa, and the elongation at break was 392. + -. 73%. In addition, the prepared product has good plasticity, can be placed in moulds of different shapes according to actual needs, and can be molded into polymer products of different shapes according to the moulds by slightly applying certain stress under a certain temperature condition. In the embodiment, after the stretch-broken polymer sample is recovered, the fracture surface is attached (the fracture surface can be slightly wetted in the process), the sample is placed in a mold at 50 ℃ for 6-8h under a certain pressure, cracks at the attachment position of the sample disappear, and the polymer can be made into a gasket material again for use, so that the self-repairing property and the recyclability of the polymer material are reflected.

Example 8

Preparing a dynamic polymer with a dynamic cross-linking structure by using a small molecule compound (III) containing three functional groups, a small molecule organic boron compound (I) containing four functional groups, a small molecule silicon-containing compound (II) containing multiple functional groups and a small molecule silicon-containing compound (II) containing double functional groups.

8.28g of the compound (a) (obtained by a thiol-ene click reaction using vinyl pinacol ester of vinylboronic acid, 1, 10-decanedithiol, and dimethylvinylmethoxysilane as raw materials, AIBN as an initiator, and triethylamine as a catalyst), 15.92g of 4,4' -oxybis (1, 4-phenylene) diboronic acid (b) were charged into a dry and clean beaker, 60ml of DMF was added thereto, heating was carried out at 80 ℃ and the solid was dissolved in a solvent by stirring and mixed uniformly. 4ml of deionized water and a small amount of acetic acid were added under stirring, and after mixing uniformly, 2.64g of 1,1,3,3,5, 5-hexaethoxy-1, 3, 5-trisilacyclohexane (c) and 12.48g of tetradecyl-1, 11-dichlorohexasiloxane (d) were slowly added in this order. Stirring and mixing for 30min, adding 2.5ml of triethylamine, reacting at 110 ℃, continuously increasing the viscosity of the solution in the reaction process, heating and reacting for 4h, pouring the polymer solution into a proper mould, placing in a vacuum oven at 80 ℃ for 24h to remove the solvent, cooling to room temperature, and standing for 30min to finally obtain a blocky hard polymer sample, wherein the polymer has certain strength and rigidity but poor toughness and ductility. The sample is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile testing machine is used for tensile test, the tensile rate is 10mm/min, the tensile strength of the sample is 2.12 +/-0.34 MPa, the tensile modulus is 3.97 +/-1.12 MPa, the sample bar is placed in a mold with the temperature of 80 ℃ after being crushed for 12 hours to be reshaped, and the sample bar can be used as a substitute of a glass product by utilizing the recoverable property of the sample bar.

Example 9

Preparing a dynamic polymer with a dynamic cross-linking structure by using a micromolecule organic boron compound (I) containing a polyfunctional group and a macromolecular silicon-containing compound (II) containing a trifunctional group.

Adding 10.13g of silane modified polycaprolactam (b) (taking acryloyl chloride as an initiator and NaOH as a catalyst to initiate ring opening polymerization of caprolactam to prepare olefin single-ended polycaprolactam, then carrying out thiol-ene click reaction on the polycaprolactam and mercaptomethyltriethoxysilane by taking AIBN as an initiator and triethylamine as a catalyst to obtain a final product), 1.53g of organoboron compound (a) (prepared by heating diisopropyl propenyl borate and 1,3, 5-triazine-2, 4, 6-trithiol by taking AIBN as an initiator and triethylamine as a catalyst to carry out thiol-ene click reaction), 100ml of DMF solvent, heating to 80 ℃, stirring and dissolving, adding 10ml of deionized water, dropwise adding a little acetic acid, continuously stirring and mixing for 30min, adding 4ml of triethylamine, continuously stirring and reacting for 3h at 80 ℃, the solution viscosity rises continuously in the reaction process until the reaction is finished, and the polymer with certain viscosity is obtainedA fluid. Maximum elastic modulus G 'of Polymer fluids Using a rotational rheometer'_maxAnd minimum modulus of elasticity G'_minTesting is carried out, wherein the testing temperature is 25 ℃, the testing frequency range is 0.1-100 rad/s, and the maximum elastic modulus G 'of the polymer fluid is measured'_maxIs 4.49X 10⁴Pa, minimum elastic modulus G'_minThe viscosity of the dynamic polymer is 23.24Pa, the dynamic polymer has dilatancy, the viscosity is increased under the action of shear stress, the modulus is improved, and the polymer can be applied to oil extraction of oil wells or coated on the surface of a substrate to be used for preparing an energy-absorbing material.

Example 10

The dynamic polymer with a dynamic cross-linking structure is prepared by using a cyclic macromolecular compound (IV) containing an organic boric acid silicon ester bond and other reactive groups and a micromolecular compound containing two other reactive groups.

Adding 40ml of tetrahydrofuran solvent into a dry and clean three-neck flask, sealing, carrying out bubbling deoxygenation for 1h by using argon, then adding 3.4g of a cyclic organosilicon borate compound (a) (hydrolyzing 11-bromoundecyldimethylchlorosilane, then carrying out a condensation reaction with 2-bromoethylmethylboronic acid to obtain an organoborate silicate compound with two bromine ends, then reacting the organoborate silicate compound with sodium azide to obtain an organoborate silicate compound with two azide groups at two ends, carrying out an esterification reaction on a hydroxyl-terminated butadiene oligomer (the molecular weight is about 800) and 5-alkynyl caproic acid under the catalysis conditions of dicyclohexylcarbodiimide and 4-dimethylaminopyridine to obtain a butadiene oligomer with two alkyne groups at two ends, and then taking excessive tetrahydrofuran as a solvent together with the organoborate compound with two azide groups at two ends, prepared under the catalysis of cuprous iodide and N, N-diisopropylethylamine), 2ml of 20 percent acetic acid aqueous solution is heated to 50 ℃ under the protection of argon and placed for 30min, and then 0.05g of 1, 8-octanedithiol (b), 0.03g of photocatalyst DMPA and 0.2g of triethylamine are added. After the reactants are completely dissolved by stirring, the reaction is carried out for 2h under the stirring state, then the reaction is carried out for 10min under the irradiation of ultraviolet light, after the reaction is finished, the reaction solution is poured into a proper mould and placed in a vacuum oven at 50 ℃ for 24h for further reaction and solvent removal, finally, the viscous polymer colloid can be obtained, the surface strength and the hardness of the polymer colloid are low, but the polymer colloid can be stretched in a large range without breaking (the breaking elongation can reach 1500%). In this embodiment, it can be used as a super hot melt adhesive or a room temperature self-adhesive material, and when a defect occurs on the surface thereof, it can be repaired by heating, and can be recovered by dissociation of the organoboronate silicone bond (forming a non-crosslinkable branched polymer).

Example 11

The dynamic polymer with the dynamic cross-linking structure is prepared by utilizing a micromolecule organic boron compound (I) containing a multifunctional group, a micromolecule silicon-containing compound (II) containing a multifunctional group, a micromolecule organic boron compound (I) containing a tetrafunctional group and one other reactive group, a micromolecule silicon-containing compound (II) containing a tetrafunctional group and one other reactive group and a compound containing two other reactive groups.

Weighing a certain amount of a mixture of an organic boron compound (a) and an organic boron compound (c) (prepared by taking trimethylolpropane tris (3-mercaptopropionate) and diisopropyl propenyl borate as raw materials, AIBN as an initiator and triethylamine as a catalyst through a thiol-ene click reaction) and dissolving the mixture in a tetrahydrofuran solvent to prepare a 0.3mol/L solution; weighing a certain amount of a mixture of a silicon-containing compound (b) and a silicon-containing compound (d) (prepared by taking trimethylolpropane tris (3-mercaptopropionate) and methyl propenyl dichlorosilane as raw materials, AIBN as an initiator and triethylamine as a catalyst through a thiol-ene click reaction) and dissolving the mixture in a tetrahydrofuran solvent to prepare a 0.3mol/L solution. Under the protection of argon, 20ml of prepared organic boron compound solution is added into a dry and clean flask, a small amount of 20% acetic acid aqueous solution is dropwise added, the mixture is heated to 60 ℃, 20ml of silicon-containing compound solution is dropwise added under the stirring state, after the stirring is uniform, 3ml of triethylamine is dropwise added, after the reaction is carried out for 30min, 0.18g of allyl ether (e) and 0.05g of photocatalyst DMPA are added, after the reactants are completely dissolved through stirring, the reaction is carried out for 2h under the stirring state, then the reaction is carried out for 10min under the ultraviolet irradiation, then the reaction solution is poured into a proper mold, the mold is placed in a vacuum oven at 60 ℃ for 24h for further reaction and drying, and then the mold is cooled to room temperature and placed for 30 min. Finally, an agar-like polymer sample is obtained, the sample has certain elasticity and toughness, can be expanded within a certain range, and can quickly rebound when being pressed by fingers. The sample was prepared into a dumbbell-shaped specimen having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out using a tensile testing machine at a tensile rate of 50mm/min, whereby the tensile strength of the specimen was 2.13. + -. 0.61MPa, the tensile modulus was 2.94. + -. 1.05MPa, and the elongation at break was 327. + -. 46%. In addition, the prepared product has good plasticity, can be placed in moulds of different shapes according to actual needs, and can be molded into polymer products of different shapes according to the moulds by slightly applying certain stress under a certain temperature condition. In this embodiment, the polymer may be used in the form of a resilient washer and a resilient gasket.

Example 12

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing multiple functional groups and a macromolecular silicon-containing compound (II) containing multiple functional groups.

Adding 15g of pentenyl boric acid-methyl methacrylate-butyl acrylate copolymer (a) (obtained by emulsion polymerization by taking potassium persulfate as an initiator and 4-pentenyl boric acid, methyl methacrylate and butyl acrylate as raw materials) into a three-neck flask, heating 100ml of acetone solvent to 50 ℃, stirring and dissolving, adding 10ml of deionized water, dropwise adding a little acetic acid, slowly adding 2.5g of silane modified polycaprolactone (b) (obtained by taking allyl alcohol as an initiator and stannous octoate as a catalyst to initiate epsilon-caprolactone ring-opening polymerization to obtain olefin single-terminated polycaprolactone, esterifying the olefin single-terminated polycaprolactone with acrylic acid to obtain olefin double-terminated polycaprolactone, reacting the olefin double-terminated polycaprolactone with gamma-mercaptopropyl trimethoxysilane by taking AIBN as an initiator and triethylamine as a catalyst to obtain a final product through thiol-ene click reaction), after stirring and mixing for 30min, 2ml of triethylamine is added, and the reaction is continued to be stirred for 2h at the temperature of 50 ℃. After the reaction is finished, the solvent is removed by vacuum filtration to obtain a white residue, and the white residue is purified to obtain the dynamic polymer. 10g of polymer sample is dispersed in 40ml of deionized water, 0.4g of sodium dodecyl benzene sulfonate, 0.2g of hydroxyethyl cellulose, 0.1g of stearic acid and 0.1g of oleic acid are added, and after heating, stirring and mixing are carried out uniformly, polyacrylate emulsion with certain viscosity is obtained. The prepared dynamic polymer emulsion can be used as building exterior wall coating, can also be prepared into emulsion films with excellent adhesiveness, scrub resistance, solvent resistance and water resistance, can also be prepared into functional textile finishing agents and finishing agents, and can also be used as soft finishing agents of leather.

Example 13

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing trifunctional groups, a macromolecular silicon-containing compound (II) containing trifunctional groups and a macromolecular silicon-containing compound (II) containing trifunctional groups.

Reacting boric acid-terminated three-arm polysiloxane (a) (3-bromo-4- (bromomethyl) benzaldehyde is used as a raw material, reacting the boric acid-terminated three-arm polysiloxane with methyl triphenyl phosphorus bromide and potassium tert-butoxide at room temperature for 24h, heating to 100 ℃ to react in a water/dioxane mixed solvent for 24h, reacting the boric acid-terminated three-arm polysiloxane (a) with tert-butyldimethyl chlorosilane and imidazole in a DMF solvent for 20h, reacting the boric acid-terminated three-arm polysiloxane with methanol and methoxymethyl chloride in a tetrahydrofuran solvent for 4h, heating to 60 ℃ to react for 3h by using Mg as a catalyst, adding tributyl borate to react at room temperature for 8h, purifying to obtain 2- (hydroxymethyl) phenylboronic acid cyclic monoester ethylene, synthesizing the three-terminal hydrogen polysiloxane by using octamethylcyclotetrasiloxane and phenyltri (dimethylsiloxy) silane as raw materials and concentrated sulfuric acid as a catalyst through a ring-opening polymerization method, then dissolving the ethylene and 2- (hydroxymethyl) phenylboronic acid cyclic monoester ethylene under Pt catalysis condition through hydrosilylation reaction) in tetrahydrofuran solvent to prepare 0.2mol/L solution, taking 20ml of sample from the solution, adding the sample into a dry and clean flask, adding 4ml of deionized water, dropwise adding a small amount of acetic acid, and uniformly mixing; dissolving a certain amount of silane-terminated three-arm polypropylene oxide (b) (prepared by taking glycerol and propylene oxide as raw materials and boron trifluoride diethyl etherate as a catalyst, synthesizing hydroxyl-terminated three-arm polypropylene oxide through cationic ring-opening polymerization, performing esterification reaction on the hydroxyl-terminated three-arm polypropylene oxide and acrylic acid to obtain three-arm polypropylene oxide triacrylate, and performing thiol-ene click reaction on the three-arm polypropylene oxide triacrylate and 1, 2-ethanedithiol and dimethylvinylchlorosilane respectively) in a tetrahydrofuran solvent to prepare a solution with the concentration of 0.1mol/L, and adding 20ml of the solution into a flask; taking a certain amount of silane-terminated three-arm polysiloxane (c) (prepared by taking octamethylcyclotetrasiloxane and phenyl tri (dimethylsiloxane) silane as raw materials and concentrated sulfuric acid as a catalyst, synthesizing three-terminal hydrogen polysiloxane by an open-loop polymerization method, and then carrying out hydrosilylation reaction on the three-terminal hydrogen polysiloxane and dimethylvinylchlorosilane under the Pt catalysis condition), dissolving the three-terminal hydrogen polysiloxane in a tetrahydrofuran solvent to prepare a 0.2mol/L solution, and adding 20ml of the solution dropwise into a flask. Stirring the mixed solution at 50 ℃, adding 1.5ml of triethylamine, continuing to stir for 1h, then beginning to increase the viscosity of the solution, continuing to react for 1h, pouring the polymer solution with certain viscosity into a mould, placing the mould in a 50 ℃ oven for 24h for drying, then cooling to room temperature and standing for 30min, and finally obtaining a transparent film-shaped polymer sample. The specimen was cut into a dumbbell-shaped specimen having a size of 80.0X 10.0X (0.08. + -. 0.02) mm, and subjected to a tensile test using a tensile tester at a tensile rate of 50mm/min to obtain a specimen having a tensile strength of 2.14. + -. 0.35MPa, a tensile modulus of 2.83. + -. 1.34MPa and an elongation at break of 673. + -. 121%. A right-angle non-notch standard test sample is prepared according to the QB/T1130-91 plastic right-angle tearing performance test method for film tearing performance test, and the transverse tearing strength and the longitudinal tearing strength of the sample are measured to be 4.72 +/-0.38 MPa and 4.93 +/-0.52 MPa respectively. The polymer film has excellent comprehensive performance, certain tensile strength and good tear resistance, and can be stretched to a greater degree. After the polymer film is sheared, the section is placed in a die at 50 ℃ and attached for 2-4h, cracks on the section disappear, and the sample is formed into a film again and has a self-repairing function. Such dynamic polymers are useful in the preparation of functional films, or as cling films for automobiles and furniture, and also as stretch wrap films, which are scratch resistant and can be recycled and reused.

Example 14

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing multiple functional groups, a small molecular organic boron compound (I) containing multiple functional groups and a macromolecular silicon-containing compound (II) containing multiple functional groups.

Adding 22.4ml of organic borate terminated four-arm ester compound (a) (prepared by taking AIBN as an initiator and triethylamine as a catalyst through thiol-ene click reaction on isopropenyl pinacol borate and pentaerythritol tetra-3-mercaptopropionate), heating to 120 ℃ under a stirring state, adding 5mg of BHT antioxidant, then weighing 13.12g of boric acid terminated four-arm compound (b) (prepared by taking 2-formylphenylboronic acid and ammonia gas as raw materials and taking toluene as a solvent, synthesizing 2-aminomethylphenylboronic acid through a Petasis reaction, then carrying out a alkylation reaction on the 2-aminomethylphenylboronic acid and tetrabromo-quaternary amyl alcohol) into a three-neck flask, and uniformly mixing the mixture through stirring; then 29.6ml of four-arm polysiloxane (c) (prepared by taking octamethylcyclotetrasiloxane and tetra (dimethylsiloxy) silane as raw materials and concentrated sulfuric acid as a catalyst, synthesizing tetra-hydrosilyl polysiloxane through a ring-opening polymerization method, and hydrolyzing the tetra-hydrosilyl polysiloxane and methyl vinyl diethoxysilane after hydrosilylation reaction under the Pt catalysis condition) is dropwise added into the mixed solution; after uniformly mixing reactants, adding 2ml of triethylamine, reacting the mixed liquid at 120 ℃ for 1h under the protection of nitrogen, enabling the mixed liquid to have certain viscosity, adding 1g of titanium alloy powder, 1g of ceramic powder and 2g of calcium sulfate, stirring uniformly, continuing to react at 120 ℃ for 2h to obtain a viscous polymer sample, pouring the viscous polymer sample into a proper mould, placing the sample in a 100 ℃ vacuum oven for 4-6h to perform further reaction, and then cooling to room temperature and placing for 30 min. Finally, a blocky, hard and glossy polymer sample with a certain surface is obtained. The sample was prepared into a dumbbell-shaped sample having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out using a tensile tester at a tensile rate of 10mm/min to obtain a sample having a tensile strength of 5.21. + -. 0.88MPa and a tensile modulus of 10.76. + -. 1.37 MPa. The polymer sample has smooth surface and certain strength and rigidity. After being crushed, the mixture is placed in a mold at 100 ℃ for 6 to 8 hours, and then the sample can be pressed and molded again. The polymer material can be used for orthopedic treatment and used as orthopedic correction products and equipment.

Example 15

The dynamic polymer with a dynamic cross-linking structure is prepared by using a macromolecular organic boron compound (I) containing a polyfunctional group, a macromolecular silicon-containing compound (II) containing a bifunctional group and a macromolecular silicon-containing compound (II) containing a monofunctional group.

Taking a certain amount of dendritic organic boron compound (a) (DMPA is taken as a photoinitiator, ultraviolet light is taken as a light source, vinyl boric acid and 1, 2-ethanedithiol are subjected to thiol-ene click reaction to prepare mercaptoboric acid, DMPA is taken as a photoinitiator, ultraviolet light is taken as a light source, triallylamine and 1, 2-ethanedithiol are subjected to thiol-ene click reaction to prepare a primary intermediate product, then the primary intermediate product and triallylamine are subjected to thiol-ene click reaction to prepare a secondary intermediate product, then the tertiary intermediate product and 1, 2-ethanedithiol are subjected to thiol-ene click reaction to prepare a tertiary intermediate product, and the tertiary intermediate product and triallylamine are reacted to prepare a quaternary intermediate product, and finally the quaternary intermediate product and mercaptoboric acid are subjected to thiol-ene click reaction to prepare a final product) to be dissolved in a toluene solvent to prepare a solution of 0.1 mol/L; meanwhile, a certain amount of dimethyl hydroxyl silicone oil (b) (the molecular weight is about 4000) is taken to be heated and dissolved in a toluene solvent to prepare a 0.8mol/L solution; taking a certain amount of polyether modified silicone oil (c) (methyl hydrogen silicone oil with molecular weight of about 2000 and unsaturated polyether are subjected to hydrosilylation under Pt catalysis to prepare an intermediate product, and then the intermediate product and dimethylvinyl ethoxy silane are subjected to hydrosilylation to obtain a final product), heating and dissolving in a toluene solvent to prepare a 0.8mol/L solution. Respectively adding 20ml of organic boron compound solution and two silicon oil solutions into a dry clean flask, dropwise adding a small amount of 20% acetic acid aqueous solution, uniformly stirring at 80 ℃, then adding 2ml of triethylamine, and continuously stirring and reacting for 2 hours at 80 ℃. After the reaction is finished, pouring a polymer sample into a proper mold, placing the sample in an oven at 50 ℃ for 24h to remove the solvent, cooling to room temperature, and standing for 30min to finally obtain a transparent film-shaped polymer sample. The specimen was cut into a dumbbell-shaped specimen having a size of 80.0X 10.0X (0.08. + -. 0.02) mm, and subjected to a tensile test using a tensile tester at a tensile rate of 50mm/min to obtain a specimen having a tensile strength of 2.65. + -. 0.45MPa, a tensile modulus of 4.23. + -. 0.94MPa and an elongation at break of 864. + -. 157%. The film tearing performance test is carried out on a right-angle non-notch standard test sample prepared according to the QB/T1130-91 plastic right-angle tearing performance test method, and the transverse tearing strength and the longitudinal tearing strength of the sample are respectively 7.25 +/-1.01 MPa and 7.54 +/-1.69 MPa. The polymer film is soft, has certain tensile strength and modulus and good tear resistance, and simultaneously has excellent tensile toughness. After the polymer film is cut off, the section is placed in a die at 50 ℃ and is attached for 2-4h, cracks at the section disappear, and the sample is formed into a film again, so that the self-repairing property is embodied. The accessible carries out structural design to it, and the prefabricated air cushion buffering packaging material that becomes uses plays the buffering guard action to being packed the product to the material is also very convenient for retrieve.

Example 16

Taking a certain amount of acrylic acid-organic boric acid copolymer (a) (2-formylphenylboronic acid and allylamine are taken as raw materials, toluene is taken as a solvent, 2- (allylamine) methylphenylboronic acid is synthesized through a Petasis reaction, and then the 2- (allylamine) methylphenylboronic acid and acrylic acid are subjected to radical copolymerization under the initiation condition of AIBN) to be dissolved in deionized water to prepare a 0.4mol/L solution, and 40ml of the solution is taken out and added into a dry and clean beaker for later use. A certain amount of vinyl pyrrolidone-silane copolymer (b) (prepared by taking AIBN as an initiator and performing free radical copolymerization on vinyl pyrrolidone and vinyl triisopropoxysilane) is dissolved in deionized water to prepare a solution of 0.4mol/L, and 40ml of the solution is taken out and slowly added into a beaker filled with an acrylic acid-organic boric acid copolymer aqueous solution under the stirring state. After the solution is added, the mixed solution is stirred for 30min to uniformly mix the components, a small amount of triethylamine is added dropwise, and the mixture is placed in a water bath kettle at 50 ℃ for heating reaction. With the progress of the reaction, the viscosity of the mixture solution is continuously increased, and after the reaction is carried out for 30min, 3.2g of Fe subjected to surface modification by the silane coupling agent A151 is added₃O₄Subjecting the mixture to ultrasonic treatment with particles and 1.5g hydroxyethyl cellulose for 1min to obtain Fe₃O₄The particles are dispersed uniformly in the solution, and then the liquid is continuously stirred and reacted under the heating condition. After reacting for 90min, pouring the mixed solution into a proper mould, placing the mould in a 50 ℃ oven for 24h for drying and further reacting to finally obtain the Fe dispersed with the mixed solution₃O₄Magnetic dynamic polymer gels of particles. The sample is made into a dumbbell-type sample strip with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, and a tensile test is carried out by a tensile testing machine, wherein the tensile rate is 50mm/min, the tensile strength of the sample is 1.42 +/-0.34 MPa, the tensile modulus is 2.03 +/-0.92 MPa, and the elongation at break is 1031 +/-180%. The aminomethyl phenylboronic acid structure is introduced into a reactant, so that the prepared organic borate silicone bond has good dynamic reactivity, a stretch-broken polymer sample can be reshaped by only placing the stretch-broken polymer sample in a mold at 50 ℃ for 4-6 hours, and meanwhile, the polymer gel also shows excellent tensile toughness. In this example, the magnetic gel was preparedThe gel can show various deformation such as elongation, contraction or bending under the action of a magnetic field, and the network structure of the gel is not damaged due to the excellent toughness of the gel. The dynamic polymer gel can be widely applied to the fields of targeted drug release, cell separation and marking, protein adsorption and separation and the like by virtue of the unique flexibility and permeability.

Example 17

The macromolecular compound (III) containing multiple functional groups is used for preparing the dynamic polymer with a dynamic crosslinking structure.

60ml of organic boric acid-silane modified silicone oil (a) (prepared by taking methyl mercapto silicone oil with the molecular weight of about 60,000, dimethyl vinyl borate and methyl vinyl diethoxy silane as raw materials and DMPA as a photoinitiator through a thiol-ene click reaction under the condition of ultraviolet irradiation) is added into a three-neck flask, the temperature is increased to 80 ℃, after uniform mixing, 4ml of deionized water is added, a small amount of acetic acid is dripped, and polymerization reaction is carried out under the stirring state. During the polymerization process, the viscosity of the silicone oil is continuously increased, after the reaction is carried out for 90min, a polymer liquid with larger viscosity can be obtained, the polymer liquid is poured into a proper mould and placed in a vacuum oven at 80 ℃ for continuous reaction for 4h, then the reaction is cooled to room temperature and placed for 30min, and finally a transparent polymer sample with soft surface and larger viscosity is obtained. The polymer material has low surface strength and amorphous property, is easy to extend under the action of external force, shows good tensile toughness and can be stretched to a large extent without breaking (the elongation at break exceeds 2000%). When the surface of the film has defects, the film is placed in a vacuum oven at 60 ℃ to be heated for 2-4h, and the defects disappear. In the embodiment, the dynamic bond in the dynamic polymer is particularly resistant to hydrolysis, can keep a transparent state for a long time, can be used as super hot melt adhesive with self-repairing property or room temperature self-adhesive material, and can also be used as a medium of a speed locker for bridge and road construction.

Example 18

Weighing 25g of phenylboronic acid copolymerization modified isoprene rubber (a) (obtained by carrying out free radical copolymerization on isoprene and 3-vinylphenylboronic acid by taking AIBN as an initiator) and 4g of silane modified polysilsesquioxane (b) (obtained by taking mercaptopropyltriethoxysilane as a raw material and ferric trichloride and HCl as catalysts, carrying out hydrolytic condensation to obtain sulfydryl modified polysilsesquioxane, then adding the sulfydryl modified polysilsesquioxane, methyl vinyl dichlorosilane and vinyl cyclopropane into a small internal mixer to carry out mixing for 20min by taking DMPA as a photoinitiator and carrying out thiol-ene click reaction under the condition of ultraviolet irradiation, and then adding 5g of white carbon black, 6g of titanium dioxide, 0.05g of barium stearate and 0.15g of stearic acid to continue mixing for 20 min. And (3) after the additive and the sizing material are fully and uniformly mixed, taking out the mixed material, cooling, putting the mixture into a double-roller machine, pressing the mixture into a sheet, cooling at room temperature, and cutting the sheet. And soaking the prepared polymer sheet in 90 ℃ water for crosslinking, taking out, placing in a 80 ℃ vacuum oven for 6h for further reaction and drying, cooling to room temperature for 30min, taking out a sample from the die, and finally obtaining the rubbery dynamic polymer material which has good plasticity, can be prepared into products with different shapes according to the size of the die, can be stretched and extended in a larger range and shows excellent tensile toughness. The sample was prepared into a dumbbell-shaped specimen having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out by a tensile tester at a tensile rate of 50mm/min, whereby the tensile strength of the specimen was 1.02. + -. 0.31MPa, the tensile modulus was 1.52. + -. 0.44MPa, and the elongation at break was 1207. + -. 342%. After the surface of the polymer material is scratched by a blade, the scratch disappears after the polymer material is placed in a vacuum oven at 80 ℃ for 4-6h (the surface can be selected to be slightly wetted in the process), and the sample can be subjected to self-repairing. The polymer material can keep soft in a normal state, shows temporary rigidity when being impacted, returns to a normal flexible state after being impacted, and can be made into a rubber-based pressure sensitive pad for use by utilizing the stress response characteristic of a sample.

Example 19

The dynamic polymer with the dynamic cross-linking structure is prepared by utilizing a macromolecular organic boron compound (I) containing multiple functional groups, a macromolecular silicon-containing compound (II) containing multiple functional groups and a macromolecular compound (III) containing multiple functional groups.

Weighing 3.64g of phenylboronate modified ethylene propylene rubber (a) (taking low molecular weight ethylene propylene rubber as a raw material, using dibenzoyl peroxide as a cross-linking agent to react to form a small cluster structure, then grafting maleic anhydride on the surface of the cluster, adding 4-amino phenylboronic acid pinacol ester to prepare a final product through amidation reaction), adding the small cluster structure into a dry and clean beaker, pouring 40ml of a dimethylbenzene solvent to heat and stir, then adding 4ml of deionized water, dropwise adding a small amount of acetic acid, weighing 2.48g of silane modified ethylene propylene rubber (b) (taking low molecular weight ethylene propylene rubber as a raw material, using dibenzoyl peroxide as a cross-linking agent to react to form a small cluster structure, then grafting maleic anhydride on the surface of the cluster, then adding 3-aminopropyl methyl dimethoxysilane to prepare a final product through amidation reaction), 3.12g phenylboronic acid ester-silane modified ethylene-propylene rubber (c) (using low molecular weight ethylene-propylene rubber as raw material, using dibenzoyl peroxide as cross-linking agent to react to form small cluster structure, grafting maleic anhydride on the surface of the cluster, adding 4-aminophenylboronic acid pinacol ester and 3-aminopropyl methyl dimethoxysilane, and performing amidation reaction to obtain the final product), slowly adding into a beaker under stirring, heating to 80 deg.C, stirring and mixing for 30min, adding 1.0mg BHT antioxidant and 2ml triethylamine, stirring and reacting at 80 deg.C for 3 hr to obtain viscous polymer liquid, placing in proper mould, after the mixture was left in a vacuum oven at 80 ℃ for 24 hours to remove the solvent, the mixture was cooled to room temperature and left for 30 minutes, and the sample was taken out of the mold to finally obtain a rubbery dynamic polymer. The sample is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile testing machine is used for carrying out tensile testing, the tensile rate is 50mm/min, the tensile strength of the sample is 3.53 +/-0.69 MPa, the tensile modulus is 4.38 +/-1.34 MPa, and the elongation at break can reach 947 +/-274%. The polymer sample not only shows certain strength, but also shows very excellent toughness, and can be used as a sealing strip, a sealing ring or an elastic buffer gasket; in the using process, the material shows good viscoelasticity, has good vibration isolation and stress buffering effects, and simultaneously shows excellent hydrolysis resistance. When the surface of the material is damaged, the damaged part can be healed by heating so as to be reshaped, and the self-repairing and recycling of the material are realized.

Example 20

Preparing a dynamic polymer with a dynamic cross-linking structure by using a macromolecular organic boron compound (I) containing four functional groups and a macromolecular silicon-containing compound (II) containing multiple functional groups.

Respectively weighing 7.2g of boric acid ester modified polybutadiene (a) (prepared by taking amino-terminated 1, 3-polybutadiene and diisopropyl (bromomethyl) borate as raw materials and performing alkylation reaction) in a dry and clean beaker, adding 40ml of benzene solvent into 2.4g of silicon dioxide (b) with silicon hydroxyl on the surface, uniformly mixing the mixture at 50 ℃, adding 16mg of sodium dodecyl benzene sulfonate and 8mg of hydroxypropyl cellulose, heating to 70 ℃, continuing to react for 2h, and then placing the mixed solution with certain viscosity in a proper mould and drying in a vacuum oven at 50 ℃ for 24h to finally obtain the polybutadiene polymer dispersed with silicon dioxide. The sample was prepared into a dumbbell-shaped specimen having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out using a tensile tester at a tensile rate of 50mm/min, whereby the tensile strength of the specimen was 1.87. + -. 0.42MPa, the tensile modulus was 2.74. + -. 0.82MPa, and the elongation at break was 502. + -. 149%. The stretch broken polymer sample is recovered and then placed in a mold at 80 ℃ for 4-8h to be reshaped. In this embodiment, the polymer sample can be made into a sealant or a recyclable elastic ball toy for use, which can exhibit good toughness and elasticity, and can be pressed into products of different shapes and sizes as required, and the broken or no longer required sample can be recycled and made into a new product for use.

Example 21

Weighing 8.5g of boric acid modified polystyrene (a) (prepared by free radical copolymerization of styrene and 4-vinylphenylboronic acid by using AIBN as an initiator), adding the weighed polystyrene (a) into a dry and clean beaker, pouring 80ml of toluene solvent into the beaker, heating the beaker to 50 ℃ and dissolving the polystyrene (a) by stirring, adding 1.5g of glass microfiber (b) with silicon hydroxyl on the surface into the beaker, adding 6mg of silane coupling agent KH550 and 6mg of sodium dodecyl benzene sulfonate, continuously stirring for 30min, adding 4mg of hydroxypropyl cellulose, heating the beaker to 80 ℃ and continuously reacting for 3h, putting the mixed solution into a proper mould and drying the mixed solution in a 50 ℃ vacuum oven for 24h to finally obtain a massive polymer sample dispersed with the glass microfiber, wherein the massive polymer sample has higher surface hardness and certain mechanical strength, is hard in texture, poor in elasticity and toughness, and is knocked by a hammer, and then crushing the massive polymer sample, the glass micro-fibers in the matrix were observed to bond tightly to the matrix. The crushed material is put into a die to be heated to 180 ℃, and is molded for 5min under the pressure of 5MPa, the crushed material is made into a dumbbell-shaped sample strip with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0), a tensile test is carried out by a tensile testing machine, the tensile rate is 10mm/min, the tensile strength of the sample is 4.24 +/-1.73 MPa, the tensile modulus is 9.12 +/-3.08 MPa, the polymer material has good chemical resistance, and the polymer material can be used as a substitute of glass products, a rigid packaging box and a decorative plate.

Example 22

The dynamic polymer with a dynamic cross-linking structure is prepared by using a macromolecular compound (IV) containing a plurality of organoboronate silicon ester bonds and a plurality of other reactive groups, and a small molecular compound (IV) containing one organoboronate silicon ester bond and two other reactive groups.

Weighing 17.4g of silicon borate polymer (a) (taking benzoyl peroxide as an initiator, carrying out free radical polymerization on propylene and propylene-based diisopropyl borate at the temperature of 80 ℃ to obtain an intermediate product, dissolving the intermediate product and mercaptomethyl dimethylethoxysilane in a tetrahydrofuran/water mixed solvent, carrying out ester exchange reaction at the temperature of 80 ℃ by taking triethylamine as a catalyst to obtain a final product), 3.92g of silicon borate compound (b) (prepared by reacting methyllithium, vinyllithium and trimethyl borate to obtain methylvinylboric acid, taking methylvinylboric acid and 5-hexenyldimethylchlorosilane as raw materials, chloroform/water mixed solution as a solvent, and triethylamine as a catalyst, carrying out condensation reaction at the temperature of 50 ℃), 0.2g of plasticizer DOP and 0.05g of dimethyl silicone oil are added into a dry and clean three-neck flask, heating to 100 ℃ under the protection of nitrogen, stirring to melt, uniformly mixing, adding 0.04g of AIBN and 0.5g of triethylamine, and reacting for 4 hours under the protection of nitrogen at 100 ℃. After the reaction is finished, pouring the mixture into a proper mould, putting the mixture into a vacuum oven at 80 ℃ under a vacuum condition for continuing to react for 4 to 6 hours, then cooling to room temperature and standing for 30min to finally obtain a hard gelatinous polymer sample. The polymer samples have a certain strength and compressibility that allows stretching within a certain range. The sample is made into a dumbbell-shaped sample strip with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, and a tensile testing machine is used for carrying out tensile testing, wherein the tensile rate is 50mm/min, the tensile strength of the sample is 3.84 +/-0.88 MPa, the tensile modulus is 6.03 +/-1.42 MPa, and the elongation at break is 473 +/-46%. The fractured sample applies stress on the fracture surface (the fracture surface can be selected to be slightly wetted in the process), and the fracture surface can be bonded again after being heated in a mold at the temperature of 80 ℃ for 6-8h, so that the material has self-repairing performance, and the material can be reshaped according to the molds with different shapes. The material can be used as a stress bearing material in a fine die, has certain deformability while playing a role of bearing stress, plays a role of buffering, and can be repaired by heating when cracks or damages appear.

Example 23

The dynamic polymer with a dynamic cross-linking structure is prepared by utilizing a macromolecular compound (III) containing a multifunctional group and a plurality of other reactive groups and a small molecular silicon-containing compound (II) containing a bifunctional group and one other reactive group.

25g of phenylboronate-silane modified polybutadiene epoxy resin (a) (prepared by taking polybutadiene epoxy resin with molecular weight of about 2000 as a raw material and performing ring opening reaction with 4-aminobenzeneboronic acid pinacol ester and methylaminopropyldimethylmethoxysilane respectively) is added into a three-neck flask, the temperature is increased to 80 ℃, 0.5g of triethylamine is added after nitrogen is introduced for heat preservation for 1h, 1.8g of gamma-mercaptopropylmethyldimethoxysilane (b) is slowly added under stirring, after reaction for 2h, a small amount of 20% acetic acid aqueous solution is dropwise added, and crosslinking reaction is performed under stirring. During the reaction, the viscosity of the liquid is increased continuously, after 2h of reaction, a viscous yellow polymer sample is obtained, and then the viscous yellow polymer sample is poured into a suitable mould and placed in a vacuum oven at 80 ℃ for further reaction for 4h, and then cooled to room temperature and placed for 30min, and finally a maltose-like polymer sample is obtained, which has lower strength, higher viscosity and very good tensile toughness, and can be stretched to a greater extent without breaking (the elongation at break can reach 1000%). In the embodiment, the polymer can be used as an electronic packaging material or an adhesive, and can be recycled in the using process, so that the polymer sample has a long service life.

Example 24

Weighing 23g of organic boric acid modified silicone rubber (a) (prepared by taking methyl mercapto silicone rubber and vinyl boric acid as raw materials and DMPA as a photoinitiator through a thiol-ene click reaction under the condition of ultraviolet irradiation), 10g of silanol modified silicone rubber (b) (prepared by taking methyl vinyl silicone rubber and gamma-mercaptopropyl methyldimethoxysilane as raw materials and DMPA as a photoinitiator through a thiol-ene click reaction under the condition of ultraviolet irradiation), adding 2g of methyl silicone rubber particles into a small internal mixer, mixing for 20min, adding 10g of silicon dioxide, 12g of titanium dioxide, 1.75g of ferric oxide and 0.035g of silicone oil, continuously mixing for 30min to obtain an additive, fully and uniformly mixing the additive and the rubber, taking out the rubber, placing the rubber into a double-roll machine, pressing to prepare a sheet, cooling at room temperature, and cutting the sheet. And soaking the prepared polymer sheet in water at 90 ℃ for crosslinking, taking out, placing in a vacuum oven at 80 ℃ for 6h for further reaction and drying, cooling to room temperature, placing for 30min, taking out a sample from a mold, and finally obtaining the soft rubber-like dynamic plugging rubber. The sample is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile testing machine is used for carrying out tensile test, the tensile rate is 50mm/min, the tensile strength of the sample is 2.33 +/-0.27 MPa, the tensile modulus is 3.04 +/-0.52 MPa, and the elongation at break is 843 +/-264%. The polymer sample not only shows excellent tensile toughness, but also has good plasticity and rebound resilience; the product of different shapes can be prepared according to the size of the mould, the concave part can be quickly recovered after the surface of the product is pressed, and when the surface of the product is damaged, the product can be remolded through heating, so that the product can be recycled. The obtained silicon rubber products can be made into various sealing elements, or the silicon rubber products can be made into rubber sleeper pad accessories by utilizing the good shock absorption and insulation properties of the silicon rubber products for railway traffic.

Example 25

The dynamic polymer with a dynamic cross-linking structure is prepared by using a macromolecular organic boron compound (I) containing multiple functional groups and a macromolecular silicon-containing compound (II) containing multiple functional groups.

Weighing 5.28g of acrylamide-boric acid copolymer (a) (3- (allylamino) propyl) boric acid is prepared by taking 3-bromopropylboric acid and allylamine as raw materials through a alkylation reaction in a dry and clean beaker, then carrying out free radical polymerization on the obtained product and N, N-dimethylacrylamide by taking AIBN as an initiator to obtain a final product), adding 40ml of deionized water into the obtained product, continuously stirring and dissolving the obtained product at 50 ℃, and after complete dissolution, dropwise adding a small amount of 1mol/L NaOH solution into the obtained product; 5.20g of acrylamide-silane copolymer (b) (prepared by taking 2-acrylic acid-3- (diethoxymethylsilyl) propyl ester as a raw material and AIBN as an initiator and carrying out free radical polymerization with N, N-dimethylacrylamide) is slowly added into the acrylamide-boric acid copolymer solution, the acrylamide-boric acid copolymer solution is dissolved and mixed by continuous stirring in the process, 1.08g of graphene powder and 0.05g of sodium dodecyl benzene sulfonate are sequentially added after complete dissolution, the mixture is stirred for 30min at the temperature of 50 ℃, 0.02g of hydroxyethyl cellulose is added, and then the mixed solution is placed at the temperature of 50 ℃ for continuous reaction. And (3) with the progress of the reaction, the viscosity of the solution is continuously increased, after the heating reaction is carried out for 2.5 hours, a viscous polymer sample is obtained, the viscous polymer sample is placed in a 50 ℃ oven for 24 hours to be dried and remove the solvent, then the dried sample is placed in a mould, and the mould is pressed and formed at 80 ℃. The sample is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, and a tensile test is carried out by a tensile testing machine, wherein the tensile rate is 50mm/min, the tensile strength of the sample is 2.08 +/-0.56 MPa, the tensile modulus is 2.83 +/-1.22 MPa, and the elongation at break is 434 +/-87%. The polymer sample which is broken by pulling can be recovered and then placed in a mold at 80 ℃ for 6-8h for reshaping. In this embodiment, the polymer sample can be made into a graphene composite dynamic polymer heat conduction gasket for use, the heat conduction gasket can be pressed into products with different shapes and sizes according to needs, and damaged or no longer needed samples can be recycled to be made into new products for use.

Example 26

Taking a certain amount of boric acid modified polynorbornene (a) (prepared by taking vinyl boric acid and cyclopentadiene as raw materials and performing Diels-Alder reaction to prepare boric acid modified norbornene, then heating and dissolving the boric acid modified norbornene and norbornene in an o-dichlorobenzene solvent by taking a metallocene catalyst/methylaluminoxane as a catalytic system and performing addition polymerization reaction to prepare a 0.8mol/L solution, taking 50ml of the solution from the solution, adding the solution into a dry and clean flask, dropwise adding a small amount of deionized water and acetic acid, and uniformly stirring for later use. Taking a certain amount of silane modified polynorbornene (b) (prepared by taking methyl vinyl diethoxy silane and cyclopentadiene as raw materials, preparing silane modified norbornene through a Diels-Alder reaction, then heating and dissolving the silane modified norbornene and norbornene in an o-dichlorobenzene solvent by taking a metallocene catalyst/methylaluminoxane as a catalytic system through an addition polymerization reaction) to prepare a 0.8mol/L solution, taking 50ml of the solution, slowly adding the solution into the prepared boric acid modified polynorbornene mixed solution, and in the whole adding process, keeping the solution in a water bath heating condition of 80 ℃ and continuously stirring to uniformly mix the mixed solution. After the solution is added, stirring is continued for 30min, then 4ml of triethylamine is added, the temperature is heated to 100 ℃, and stirring reaction is carried out for 3h, so as to obtain the dynamic polymer solution. By utilizing an electrostatic spinning technology, a needle tube filled with a dynamic polymer solution is used as an anode, a round aluminum plate is used as a cathode, the distance between electric fields is adjusted, voltage is applied, liquid drops of a needle head are changed into a spindle shape from a spherical shape through adjustment and form a jet flow, a solvent is partially volatilized in the spinning process, polymer fibers are obtained on a receiving screen, and then the fibers are placed in a vacuum oven at 60 ℃ for drying for 12 hours, so that a dynamic polymer fiber product is obtained. The diameter of the fiber is observed by a microscope, and the diameter of the obtained polymer fiber is found to be in the range of 1-2 mu m. The prepared polynorbornene fiber can be used for manufacturing human organs, electronic packaging materials or corrosion-resistant materials of silicon integrated circuits, and has huge application prospects in the aspects of nano-tubes, optical fibers and integrated circuits.

Example 27

Taking 30g of borate-ethylene copolymer (a) (prepared by randomly copolymerizing isopropenylpinacol borate and ethylene at 80 ℃ by taking AIBN as an initiator), 15g of silane-ethylene copolymer (b) (prepared by randomly copolymerizing methyl vinyl diethoxysilane and ethylene at 80 ℃ by taking AIBN as an initiator), 5g of polyethylene, 1g of flame retardant TPP, 0.5g of antimony trioxide, 0.5g of stearic acid, 0.05g of antioxidant 168, 0.1g of antioxidant 1010, 0.1g of di-n-butyltin dilaurate and 0.25g of dimethyl silicone oil, uniformly mixing, adding into a small extruder for extrusion blending, wherein the extrusion temperature is 140 and 160 ℃, granulating the obtained extruded sample strips, preparing the sample by using a small injection molding machine, wherein the injection temperature is 140 and 160 ℃, then placing the prepared thin slice sample strips into 90 ℃ water for crosslinking, and then taking out, placing in a mold, and placing for 4-6h under the nitrogen protection condition at 120 ℃ for drying and further reacting to finally obtain the dynamic polymer sample with flame retardant property. The sample is made into a dumbbell-shaped sample strip with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile testing machine is utilized to carry out tensile test, the tensile rate is 50mm/min, the tensile strength of the sample is 5.98 +/-1.23 MPa, the tensile modulus is 9.51 +/-2.13 MPa, the elongation at break is 147 +/-36 percent, and the sample has certain mechanical property and good flame retardance. In addition, the prepared sample also has good plasticity, and can be molded into polymer products with different appearances according to molds with different shapes. In this embodiment, the polymer sample can be made into a flame-retardant sheet for use, and can be recycled.

Example 28

Taking 60g of vinyl chloride-borate copolymer (a) (prepared by taking AIBN as an initiator and carrying out free radical polymerization on vinyl chloride and diisopropyl propenyl borate), 30g of vinyl chloride-silane copolymer (b) (prepared by taking AIBN as an initiator and carrying out free radical polymerization on propenyl trichlorosilane and vinyl chloride), 10g of polyvinyl chloride, 20g of dioctyl phthalate, 10g of MBS toughening agent, 1g of stearic acid, 0.1g of antioxidant 168, 0.2g of antioxidant 1010, 0.2g of di-n-butyltin dilaurate and 0.5g of dimethyl silicone oil, uniformly mixing, adding into a small extruder for extrusion blending, wherein the extrusion temperature is 120-, and then taking out, placing in a mold, and placing for 4-6h under the protection of nitrogen at 100 ℃ for drying and further reacting to finally obtain a toughened dynamic polymer sample. The polymer is made into a dumbbell-shaped sample bar with the size of 80.0 multiplied by 10.0 multiplied by (2.0-4.0) mm, a tensile testing machine is used for carrying out tensile test, the tensile rate is 50mm/min, the tensile strength of the sample is 10.49 +/-1.22 MPa, the tensile modulus is 15.94 +/-2.17 MPa, the elongation at break is 773 +/-106 percent, and the polymer sample has good flexibility and can be stretched in a large range. In addition, the prepared product has good plasticity and can be molded into polymer products with different appearances according to molds with different shapes. In this example, the polymer sample was used as a bend-resistant hose material, which was recycled after breakage.

Example 29

The method comprises the steps of preparing a dynamic polymer with a dynamic cross-linking structure by utilizing a small molecular organic boron compound (I) containing four functional groups, a macromolecular organic boron compound (I) containing multiple functional groups, a small molecular silicon-containing compound (II) containing bifunctional groups and a macromolecular silicon-containing compound (II) containing multiple functional groups.

Weighing a certain amount of 2, 5-diboronic acid thiophene (a) and dissolving in a toluene solvent to prepare a 0.2mol/L solution; weighing a certain amount of chloropropene-phenylboronic acid copolymer (b) (prepared by taking chloropropene and 4-vinylphenylboronic acid as raw materials and AIBN as an initiator through free radical polymerization) and dissolving in a toluene solvent to prepare a 0.05mol/L solution; respectively adding 20ml of two organic boron compound solutions into a dry and clean beaker, adding 4ml of deionized water and a small amount of acetic acid, adding 10mg of BHT antioxidant, uniformly mixing, sequentially and slowly adding 1.72g of diphenyl silanediol (c) and 4.70g of chloropropene-silane copolymer (d) (prepared by free radical polymerization by taking chloropropene and styrene ethyl trimethoxy silane as raw materials and AIBN as an initiator) under a stirring state, heating to 80 ℃, slowly stirring the mixed solution, dissolving and uniformly mixing all components, and dropwise adding 2ml of triethylamine to continue stirring reaction. The viscosity of the solution continuously rises along with the stirring, a pasty polymer sample is obtained after the mixing reaction is carried out for 2 hours, then the pasty polymer sample is poured into a proper mould, the mould is placed in a vacuum oven at 50 ℃ for drying for 24 hours, then the mould is cooled to room temperature for placing for 30 minutes, and the finally obtained polymer sample in the shape of similar agar can be pressed on the surface of the sample by fingers, so that the sample can rebound quickly, shows good elasticity, and can be extended within a certain range. The sample was prepared into a dumbbell-shaped specimen having a size of 80.0X 10.0X (2.0 to 4.0) mm, and a tensile test was carried out using a tensile tester at a tensile rate of 50mm/min, whereby the tensile strength of the specimen was 2.97. + -. 0.36MPa, the tensile modulus was 4.77. + -. 1.43MPa, and the elongation at break was 576. + -. 137%. In this embodiment, the polymer sample can be made into a sealant or a recyclable elastic ball for use, which can exhibit good toughness and elasticity, and can be pressed into products of different shapes and sizes as required, and the damaged or no longer required sample can be recycled and made into a new product for use.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A dynamic polymer having a dynamic crosslinked structure, characterized in that it contains organoboronate silicone bonds on the polymer chain skeleton of the crosslinked network, or on the crosslinked linking skeleton between the polymer chains, or on both the polymer chain skeleton and the crosslinked linking skeleton between the polymer chains; wherein, the organic boric acid silicon ester bond has the following structure:

wherein at least one borate silicone bond is formed between the boron atom and the silicon atom, at least one carbon atom in the structure is connected with the boron atom through the boron-carbon bond, at least one organic group is connected to the boron atom through the boron-carbon bond, and at least part of the organic borate silicone bond is connected into a crosslinking network through the boron-carbon bond;

represents a linkage to a polymer chain, a crosslink or any other suitable group through which at least one of the boron atom and the silicon atom, respectively, is attached to the crosslinked network; the organic boric acid silicon ester bond is used as a polymerization linking point or a crosslinking linking point of the dynamic polymerOr both as polymeric and crosslinking linkage points, is a necessary condition for forming/maintaining a dynamic polymer structure.

2. The dynamic polymer having a dynamic cross-linked structure according to claim 1, wherein the other any suitable group is selected from the group consisting of a hydrogen atom, a hetero atom group, a small molecule hydrocarbon group having a molecular weight of not more than 1000Da, a polymer chain residue having a molecular weight of more than 1000Da, an inorganic small molecule chain residue having a molecular weight of not more than 1000Da, an inorganic large molecule chain residue having a molecular weight of more than 1000Da, a single bond, a hetero atom linking group, a divalent or polyvalent small molecule hydrocarbon group having a molecular weight of not more than 1000Da, a divalent or polyvalent polymer chain residue having a molecular weight of more than 1000Da, a divalent or polyvalent inorganic small molecule chain residue having a molecular weight of not more than 1000Da, and a divalent or polyvalent inorganic large molecule chain residue having a molecular weight of more than 1000 Da.

3. The dynamic polymer having a dynamic crosslinked structure according to claim 1, which contains a dynamic regulator for regulating the dynamics of the organoborate silicone bond.

4. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 3, wherein the dynamic regulator is selected from compounds having a free hydroxyl group or a free carboxyl group.

5. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 4, wherein the dynamic adjusting agent is selected from the group consisting of water, sodium hydroxide, alcohol, and carboxylic acid.

6. The dynamic polymer having a dynamic crosslinked structure according to claim 1, wherein the organoboronate silicone bonds contained in the dynamic polymer are connected to each other by the following structures: single bonds, heteroatom linkers, divalent or polyvalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or polyvalent polymer chain residues having a molecular weight greater than 1000 Da.

7. The dynamic polymer having a dynamic cross-linked structure as set forth in claim 1, wherein at least a part of the silicon atoms in the organoborate silicon bond are linked to the silicon atoms in another organoborate silicon bond by any one or any of the following structures: a divalent or polyvalent small molecule alkyl group with the molecular weight not more than 1000Da, a divalent or polyvalent carbon chain polymer residue with the molecular weight more than 1000Da, a divalent or polyvalent heterochain polymer residue with the molecular weight more than 1000Da, a divalent or polyvalent element organic polymer residue with the molecular weight more than 1000Da, a divalent or polyvalent inorganic small molecule chain residue with the molecular weight not more than 1000Da, and a divalent or polyvalent inorganic large molecule chain residue with the molecular weight more than 1000 Da.

8. The dynamic polymer having a dynamic crosslinked structure according to claim 1, wherein at least a part of the boron atoms in the organoborate silicone bond are linked to the boron atoms in another organoborate silicone bond through a boron-carbon bond linked thereto.

9. The dynamic polymer having a dynamic cross-linked structure as set forth in claim 1, wherein at least a part of the boron atoms in the organoborate silicone bond are linked to silicon atoms in another organoborate silicone bond through a boron-carbon bond linked thereto.

10. The dynamic polymer having a dynamic crosslinked structure according to claim 1, wherein the boron atom in at least one of the organoborate silicone bonds is bonded to at least one of the following structures: phenyl with aminomethyl at ortho position, and phenyl with amido at ortho position.

11. The dynamic polymer having a dynamic cross-linked structure according to claim 1, which is obtained by using at least one or more of the following compounds as a raw material:

an organoboron compound (I) containing an organoboronic acid group, or an organoboronate group, or a combination of an organoboronic acid group and an organoboronate group; a silicon-containing compound (II) containing a silicon hydroxyl group, or a silicon hydroxyl group precursor, or a combination of a silicon hydroxyl group and a silicon hydroxyl group precursor; a compound (III) containing both an organoboronic acid group, or an organoborate group, or a combination of an organoboronic acid group and an organoborate group, and a silicon hydroxyl group, or a silicon hydroxyl group precursor, or a combination of a silicon hydroxyl group and a silicon hydroxyl group precursor; a compound (IV) containing organoborate silicone linkages and other reactive groups; wherein the organoboron compound (I), the silicon-containing compound (II), and the compound (III) each have at least one functional group; wherein the organoboron compound (I) or the silicon-containing compound (II) is not separately used as a raw material for preparing the dynamic polymer;

wherein, the organic boric acid group contained in the compound raw material refers to a structural element consisting of a boron atom and a hydroxyl group connected with the boron atom, the boron atom is connected with at least one carbon atom through a boron-carbon bond, and at least one organic group is connected to the boron atom through the boron-carbon bond;

wherein, the organic borate group contained in the compound raw material refers to a structural unit consisting of a boron atom, an oxygen atom connected with the boron atom and a hydrocarbyl or silyl group connected with the oxygen atom, wherein the boron atom is connected with at least one carbon atom through a boron-carbon bond, and at least one organic group is connected to the boron atom through the boron-carbon bond;

wherein, the silicon hydroxyl contained in the compound raw material refers to a structural element consisting of a silicon atom and a hydroxyl connected with the silicon atom;

wherein, the silicon hydroxyl precursor contained in the compound raw material refers to a structural element consisting of a silicon atom and a group which can be hydrolyzed to obtain hydroxyl and is connected with the silicon atom, wherein the group which can be hydrolyzed to obtain hydroxyl is selected from halogen, cyano, oxygen cyano, sulfur cyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, acylamino, ketoxime and alkoxide;

wherein, the functional group contained in the compound raw material refers to a hydroxyl group in an organic boric acid group, an ester group in an organic borate group, a hydroxyl group in a silicon hydroxyl group, a group which can be hydrolyzed to obtain a hydroxyl group in a silicon hydroxyl precursor, or a combination of the hydroxyl group and the group; wherein, one hydroxyl in the organic boric acid group is a functional group, one ester group in the organic borate group is a functional group, one hydroxyl in the silicon hydroxyl is a functional group, and one group in the silicon hydroxyl precursor can be hydrolyzed to obtain the hydroxyl which is a functional group;

wherein, the other reactive groups contained in the compound raw material refer to groups capable of undergoing derivatization reaction or undergoing polymerization/crosslinking reaction to generate common covalent bonds except for organic borate silicon ester bonds, and are selected from hydroxyl, phenolic hydroxyl, carboxyl, acyl, acylamino, acyloxy, amino, aldehyde group, sulfonic group, sulfonyl, sulfydryl, alkenyl, alkynyl, cyano, oxazinyl, oximino, hydrazino, guanidino, halogen, isocyanate group, anhydride group, epoxy group, acrylate group, acrylamide group, maleimide group, N-hydroxysuccinimide group, norbornene group, azo group, azide group and heterocyclic group.

12. The dynamic polymer having a dynamic crosslinked structure according to claim 11, wherein the organoboron compound (I) is represented by the following structure:

wherein A is a module containing an organic boric acid group, an organic borate group and an organic borate group; m is the number of the modules A, and m is more than or equal to 1; l is a substituent group on a single module A, or a connecting group between two or more modules A, and is selected from any one or more of the following structures: a small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a polymer chain residue having a molecular weight of greater than 1000Da, a single bond, a heteroatom linking group, a divalent or multivalent small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a divalent or multivalent polymer chain residue having a molecular weight of greater than 1000 Da; wherein, when m is 1, L is a substituent group on a single module A, and is selected from any one or more of a small molecular alkyl with the molecular weight not more than 1000Da and a polymer chain residue with the molecular weight more than 1000 Da; when m is greater than 1, L is a connecting group between two or more modules A, and is selected from any one or more of a single bond, a heteroatom connecting group, a divalent or polyvalent small molecule alkyl group with the molecular weight not more than 1000Da, and a divalent or polyvalent polymer chain residue with the molecular weight more than 1000 Da; p is the number of groups L, and p is more than or equal to 1.

13. The dynamic polymer having a dynamic crosslinked structure according to claim 12, wherein the organoboron compound (I) is selected from the group consisting of phenylboronic acids or phenylboronic acid esters having aminomethyl groups attached to the ortho-positions thereof, and phenylboronic acids or phenylboronic acid esters having amide groups attached to the ortho-positions thereof.

14. The dynamic polymer having a dynamic crosslinking structure according to claim 11, wherein the silicon-containing compound (II) is represented by the following structure:

wherein G is a module containing a silicon hydroxyl group, or a silicon hydroxyl group precursor, or a silicon hydroxyl group and a silicon hydroxyl group precursor; n is the number of the modules G, and n is more than or equal to 1; j is a substituent group on a single module G, or a connecting group between two or more modules G, and is selected from any one or more of the following structures: hydrogen atoms, heteroatom groups, small molecular hydrocarbon groups with molecular weight not more than 1000Da, polymer chain residues with molecular weight more than 1000Da, inorganic small molecular chain residues with molecular weight not more than 1000Da, inorganic large molecular chain residues with molecular weight more than 1000Da, single bonds, heteroatom connecting groups, divalent or multivalent small molecular hydrocarbon groups with molecular weight not more than 1000Da, divalent or multivalent polymer chain residues with molecular weight more than 1000Da, divalent or multivalent inorganic small molecular chain residues with molecular weight not more than 1000Da, and divalent or multivalent inorganic large molecular chain residues with molecular weight more than 1000 Da; when n is 1, J is a substituent group on a single module G, and is selected from any one or more of hydrogen atoms, heteroatom groups, small molecular hydrocarbon groups with the molecular weight of not more than 1000Da, polymer chain residues with the molecular weight of more than 1000Da, inorganic small molecular chain residues with the molecular weight of not more than 1000Da, and inorganic large molecular chain residues with the molecular weight of more than 1000 Da; when n is greater than 1, J is a connecting group between two or more modules G, and is selected from any one or more of a single bond, a heteroatom connecting group, a divalent or polyvalent small molecular hydrocarbon group with the molecular weight not more than 1000Da, a divalent or polyvalent polymer chain residue with the molecular weight more than 1000Da, a divalent or polyvalent inorganic small molecular chain residue with the molecular weight not more than 1000Da, and a divalent or polyvalent inorganic large molecular chain residue with the molecular weight more than 1000 Da; q is the number of the groups J, and q is more than or equal to 1.

15. The dynamic polymer having a dynamic cross-linked structure according to claim 11, wherein the compound (III) is represented by the following structure:

wherein A is a module containing an organic boric acid group, an organic borate group and an organic borate group; x is the number of the modules A, and x is more than or equal to 1; g is a module containing a silicon hydroxyl group, a silicon hydroxyl group precursor, or a silicon hydroxyl group and a silicon hydroxyl group precursor; y is the number of the modules G, and y is more than or equal to 1; t is a connecting group between two or more A, two or more G, or A and G, and is selected from any one or any several structures of the following: single bonds, heteroatom linkers, divalent or multivalent small molecule hydrocarbyl groups having a molecular weight of no more than 1000Da, and divalent or multivalent polymer chain residues having a molecular weight greater than 1000 Da; v is the number of groups T, and v is more than or equal to 1.

16. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 11, wherein the compound (IV) is represented by the following structure:

wherein E is a module containing an organoborate silicone bond; u is the number of the modules E, and u is more than or equal to 1; y is a substituent group on a single module E, or a substituent group on a single module E and a linking group between two or more modules E, and at least one group Y is linked to a boron atom of an organoboronate silicone bond and at least one group Y is linked to a silicon atom of an organoboronate silicone bond; wherein at least one group Y contains at least one other reactive group, and the number of other reactive groups contained in all groups Y is 2 or more; the group Y is selected from any one or any several structures of the following structures: a small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a polymer chain residue having a molecular weight of greater than 1000Da, a single bond, a heteroatom linking group, a divalent or multivalent small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a divalent or multivalent polymer chain residue having a molecular weight of greater than 1000 Da; when u is 1, Y is a substituent group on a single module E, and is selected from any one or more of a small molecular alkyl group with the molecular weight not more than 1000Da and a polymer chain residue with the molecular weight more than 1000 Da; u >1, Y is a substituent group on a single module E and a connecting group between two or more modules E, and is selected from any one or more of a small molecule alkyl with the molecular weight not more than 1000Da, a polymer chain residue with the molecular weight more than 1000Da, and any one or more of a single bond, a heteroatom connecting group, a divalent or polyvalent small molecule alkyl with the molecular weight not more than 1000Da, and a divalent or polyvalent polymer chain residue with the molecular weight more than 1000 Da; r is the number of the groups Y, and r is more than or equal to 2.

17. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 12 and 14 to 16, wherein the module a containing an organic boronic acid group is selected from any one or more of the following structures:

wherein, K₁Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not exceeding 1000Da, polymer chain residues with molecular weight greater than 1000 Da; wherein, the cyclic structure in A4 is a non-aromatic or aromatic boron heterocyclic group containing at least one organic boric acid group; the ring-forming atoms of the cyclic structure in A4 are each independently a carbon atom, a boron atom or other hetero atom, and at least one ring-forming atom is a boron atom and constitutes an organoboronic acid group, and at least one ring-forming atom is bonded to the group L or the group T;

represents a linkage to a group L or a group T; the boron atoms in the various structures are connected with at least one carbon atom through a boron-carbon bond, and at least one organic group is connected to the boron atoms through the boron-carbon bond;

the organic borate ester group-containing module A is selected from any one or any several structures of the following:

wherein, K₂Is a group directly attached to the boron atom and selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not exceeding 1000Da, polymer chain residues with molecular weight greater than 1000 Da; r₁、R₂、R₃、R₄、R₆Is a monovalent organic group or a monovalent organosilicon group directly bonded to an oxygen atom through a carbon atom or a silicon atom, selected from any of the following structures: a small molecule hydrocarbyl group having a molecular weight of no more than 1000Da, a small molecule silyl group having a molecular weight of no more than 1000Da, a polymer chain residue having a molecular weight greater than 1000 Da; r₅Is a divalent organic or divalent organosilicon group directly attached to two oxygen atoms, directly attached to the oxygen atoms through a carbon or silicon atom, selected from any of the following structures: molecular weightA divalent small molecule hydrocarbon group of no more than 1000Da, a divalent small molecule silane group of molecular weight no more than 1000Da, a divalent polymer chain residue of molecular weight greater than 1000 Da; wherein the cyclic structure in B5 is a non-aromatic or aromatic boracic group containing at least one organoboronate group; the ring-forming atoms of the cyclic structure in B5 are each independently a carbon atom, a boron atom, or other heteroatom, and at least one ring-forming atom is a boron atom and constitutes an organoborate group, and at least one ring-forming atom is linked to the group L or the group T;

the module G containing the silicon hydroxyl is selected from any one or any several structures of the following:

wherein, K₃、K₄、K₅、K₆、K₇Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, micromolecular hydrocarbyl with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da, and inorganic macromolecular chain residues with the molecular weight more than 1000 Da; wherein, the cyclic structure in C7, C8 and C9 is a nonaromatic or aromatic silacyclic group containing at least one silicon hydroxyl group; the ring-forming atoms of the cyclic structure in C7, C8, C9 are each independently a carbon atom, a silicon atom, or other hetero atom, and at least one ring-forming atom is a silicon atom and constitutes a silicon hydroxyl group, and at least one ring-forming atom is bonded to the group J or the group T;

represents a group J or a group TThe connection of (1);

the module G containing the silicon hydroxyl precursor is selected from any one or any several structures of the following:

wherein, K₈、K₉、K₁₀、K₁₁、K₁₂Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, micromolecular hydrocarbyl with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da, and inorganic macromolecular chain residues with the molecular weight more than 1000 Da; x₁、X₂、X₃、X₄、X₅、X₆、X₇、X₈、X₉、X₁₀、X₁₁、X₁₂、X₁₃、X₁₄Is a hydrolyzable group directly bonded to the silicon atom selected from the group consisting of halogen, cyano, oxacyano, thiocyano, alkoxy, amino, sulfate, borate, acyl, acyloxy, amido, ketoxime, alkoxide; wherein, the cyclic structure in D7, D8 and D9 is a nonaromatic or aromatic silacyclic group containing at least one silicon hydroxyl precursor; the ring-forming atoms of the cyclic structure in D7, D8, D9 are each independently a carbon atom, a silicon atom, or other hetero atom, and at least one of the ring-forming atoms is a silicon atom and constitutes a silicon hydroxyl group precursor, and at least one of the ring-forming atoms is bonded to a group J or a group T;

represents a linkage to a group J or a group T;

the module E containing the organic borate silicon ester bond is selected from any one or any several structures of the following:

wherein, K₁₃、K₁₆、K₂₀Are groups directly attached to the boron atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, small molecule hydrocarbon groups with molecular weight not exceeding 1000Da, polymer chain residues with molecular weight greater than 1000 Da; k₁₄、K₁₅、K₁₇、K₁₈、K₁₉、K₂₁Are groups directly attached to the silicon atom, each independently selected from any of the following structures: hydrogen atoms, heteroatom groups, micromolecular hydrocarbyl with the molecular weight not more than 1000Da, polymer chain residues with the molecular weight more than 1000Da, inorganic micromolecular chain residues with the molecular weight not more than 1000Da, and inorganic macromolecular chain residues with the molecular weight more than 1000 Da;

represents a linkage to the group Y.

18. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 2 and 14, wherein the hetero atom group is selected from any one of the following groups: halogen, hydroxyl, thiol, carboxyl, nitro, primary amino, silicon, phosphorus, triazole, isoxazole, amide, imide, thioamide, enamine, carbonate, thiocarbonate, dithiocarbonate, trithiocarbonate, carbamate, thiocarbamate, dithiocarbamate, thioester, dithioester, orthoester, phosphate, phosphite, phosphinate, phosphonate, phosphoryl, phosphoramidite, hypophosphoryl, thiophosphoryl, thiophosphorous acyl, phosphosilane, silane, carboxamide, thioamide, phosphoramidite, pyrophosphoro, cyclophosphamide, ifosfamide, thiophosphoryl, orthosilicic acid, metasilicic acid, silicic acid, boric acid, metaboric acid, boric acid, sodium, potassium, magnesium, aconitoyl, peptide bond, acetal, cyclic acetal, mercaptal, azaacetal, azathioacetal, azathioketal, dithioacetal, hemiacetal, thiohemiacetal, azahemiacetal, ketal, thioketal, azaketal, azathioketal, thioketal, acylhydrazone bond, oxime bond, thiooxime ether group, semicarbazone bond, thiosemicarbazone bond, hydrazine group, hydrazide group, thiocarbohydrazide group, azocarbohydrazide group, thioazohydrazide group, hydrazonoformate group, hydrazonothiocarbamate group, carbazepine group, thiocarbhydrazide, azo group, isourea group, isothiourea group, allophanate group, thioallophanate group, guanidino group, amidino group, aminoguanidino group, imido group, thioester group, nitroxyl group, nitrosyl group, sulfonic acid ester group, sulfinic acid ester group, sulfonamide group, sulfenamide group, sulfonylhydrazide group, hydrazono group, thiosemicarbazide group, guanidyl group, aminoguanidino group, thiosemicarbaz, Sulfonylurea groups, maleimides.

19. The dynamic polymer with a dynamic cross-linked structure according to any one of claims 2,6, 7, 12, 14 to 16, characterized in that the small hydrocarbon groups with a molecular weight not exceeding 1000Da are selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: c_1-71Alkyl, ring C_3-71Alkyl, phenyl, benzyl, aromatic hydrocarbon.

20. A dynamic polymer having a dynamic cross-linked structure according to any one of claims 2,6, 12, 14 to 16, wherein said polymer chain residues having a molecular weight greater than 1000Da are selected from the group consisting of carbon chain polymer residues, heterochain polymer residues, elemental organic polymer residues in homo-or co-polymeric form.

21. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 20, wherein said carbon chain polymer residue is selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: polyethylene chain residue, polypropylene chain residue, polyisobutylene chain residue, polystyrene chain residue, polyvinyl chloride chain residue, polyvinylidene chloride chain residue, polyvinyl fluoride chain residue, polytetrafluoroethylene chain residue, polychlorotrifluoroethylene chain residue, polyvinyl acetate chain residue, polyvinyl alcohol chain residue, polyvinyl alkyl ether chain residue, polybutadiene chain residue, polyisoprene chain residue, polychloroprene chain residue, polynorbornene chain residue, polyacrylic acid chain residue, polyacrylamide chain residue, polymethyl acrylate chain residue, polymethyl methacrylate chain residue, polyacrylonitrile chain residue.

22. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 20, wherein the heterochain polymer residue is selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: polyoxymethylene chain residues, polyethylene oxide chain residues, polypropylene oxide chain residues, polytetrahydrofuran chain residues, epoxy resin chain residues, phenolic resin chain residues, polyphenylene ether chain residues, polycaprolactone chain residues, polypentanolactone chain residues, polylactide chain residues, polyethylene terephthalate chain residues, unsaturated polyester chain residues, alkyd resin chain residues, polycarbonate chain residues, polyamide chain residues, polyimide chain residues, polyurethane chain residues, polyurea chain residues, urea-formaldehyde resin chain residues, melamine resin chain residues, polysulfone chain residues, polyphenylene sulfide chain residues, polysulfide rubber chain residues.

23. The dynamic polymer having a dynamic cross-linked structure according to claim 20, wherein the elemental organic polymer residue is selected from any one of the following groups, an unsaturated form of any one, a substituted form of any one, or a hybridized form of any one: polyorganosiloxane chain residue, polyorganosiloxane borane chain residue, polyorganosiloxane nitrogen chain residue, polyorganosiloxane sulfane chain residue, polyorganophosphosiloxane chain residue, polyorganometallosiloxane chain residue, polyorganoorganoborane chain residue, polyorganoborosilazane chain residue, polyorganoborophosphosiloxane chain residue, organophosphorous polymer chain residue, organolead polymer chain residue, organotin polymer chain residue, organoarsenic polymer chain residue, and organoantimony polymer chain residue.

24. The dynamic polymer with a dynamic cross-linked structure according to claim 17, wherein the small-molecule silane groups with a molecular weight of not more than 1000Da are selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: a silane chain residue, a siloxane chain residue, a silasulfane chain residue, and a silazane chain residue.

25. The dynamic polymer with a dynamic cross-linked structure as claimed in any one of claims 2, 7 and 14, wherein the inorganic small molecular chain residue with a molecular weight of not more than 1000Da is selected from any one of the following groups, any unsaturated form, any substituted form or any hybridized form: chain sulfur residue, silane chain residue, silicon oxide chain residue, sulfur nitrogen compound chain residue, phosphazene compound chain residue, phosphorus oxide chain residue, borane chain residue, boron oxide chain residue.

26. Dynamic polymer with a dynamic cross-linked structure according to any of claims 2, 7, 14, characterized in that the residues of inorganic macromolecular chains with a molecular weight higher than 1000Da are selected from any of the following groups, unsaturated forms of any, substituted forms of any or hybridized forms of any: chain sulfur polymer residues, polysiloxane chain residues, polysulfide silicon chain residues, polysulfide nitrogen chain residues, polyphosphate chain residues, polyphosphazene chain residues, polychlorophosphazene chain residues, polyborane chain residues, polyboroxine chain residues; or any inorganic macromolecule with residues and residues, which is selected from the following groups, and is subjected to surface modification: zeolite-type molecular sieves, aluminum phosphate molecular sieves, zirconium phosphate molecular sieves, heteropolyacid salt molecular sieves, diamond, graphite, carbon fiber, white phosphorus, red phosphorus, phosphorus pentoxide, molybdenum sulfide, silica, silicon disulfide, silicon nitride, silicon carbide, talc, kaolin, montmorillonite, mica, asbestos, feldspar, cement, glass, quartz, ceramics, boron oxide, sulfur nitride, calcium silicide, silicates, glass fiber, beryllium oxide, magnesium oxide, mercury oxide, borohydride, boron nitride, boron carbide, aluminum nitride, diaspore, gibbsite, corundum, titanium dioxide.

27. The dynamic polymer having a dynamic cross-linked structure as claimed in any one of claims 2,6, 12, 14 to 16, wherein the single bond is selected from the group consisting of boron-boron single bond, carbon-carbon single bond, carbon-nitrogen single bond, nitrogen-nitrogen single bond, boron-carbon single bond, boron-nitrogen single bond, boron-silicon single bond, silicon-carbon single bond, and silicon-nitrogen single bond.

28. The dynamic polymer with a dynamic cross-linked structure as claimed in any one of claims 2,6, 12, 14 to 16, wherein the heteroatom linking group is selected from any one or a combination of any several of the following groups: an ether group, a sulfur group, a disulfide group, a sulfide group, a divalent tertiary amine group, a trivalent tertiary amine group, a divalent silicon group, a trivalent silicon group, a tetravalent silicon group, a divalent phosphorus group, a trivalent phosphorus group, a divalent boron group, and a trivalent boron group.

29. The dynamic polymer having a dynamic cross-linked structure as claimed in claim 11, wherein the raw material components constituting the dynamic polymer further include any one or two of the following additives: auxiliary agent and filler;

wherein, the additive which can be added is selected from any one or more of the following additives: catalyst, initiator, antioxidant, light stabilizer, heat stabilizer, cross-linking agent, toughening agent, coupling agent, lubricant, mold release agent, plasticizer, antistatic agent, emulsifier, dispersant, colorant, fluorescent brightener, delustering agent, flame retardant, nucleating agent, rheological agent, thickener and flatting agent;

wherein, the filler which can be added is selected from any one or more of the following fillers: inorganic non-metal filler, metal filler and organic filler.

30. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 16, which is obtained by reacting at least the following components to form an organoboronate silicone bond:

at least one organoboron compound (I), at least one silicon-containing compound (II); wherein the organoboron compound (I) and the silicon-containing compound (II) have two or more functional groups, and at least one of the organoboron compound (I) or at least one of the silicon-containing compounds (II) has three or more functional groups.

31. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 16, which is obtained by reacting at least the following components to form an organoboronate silicone bond and a common covalent bond:

at least one organoboron compound (I), at least one silicon-containing compound (II); wherein the organoboron compound (I) and the silicon-containing compound (II) contain one or more functional groups, and at least one of the organoboron compound (I) or at least one of the silicon-containing compounds (II) contain one or more other reactive groups.

32. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 16, which is obtained by reacting at least the following components to form an organoboronate silicone bond: at least one compound (III); wherein the compound (III) has two or more functional groups.

33. The dynamic polymer having a dynamic cross-linked structure as set forth in claim 32, wherein the compound component participating in the reaction to form the organoboronate silicone bond further comprises:

at least one organoboron compound (I), or at least one silicon containing compound (II), or a combination of at least one organoboron compound (I) and at least one silicon containing compound (II);

wherein the organoboron compound (I) and the silicon-containing compound (II) have two or more functional groups, and at least one of the compound (III) or at least one of the organoboron compound (I) and the silicon-containing compound (II) has three or more functional groups.

34. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 16, which is obtained by reacting at least the following components to form an organoboronate silicone bond and a common covalent bond: at least one compound (III); wherein the compound (III) has two or more functional groups.

35. The dynamic polymer having a dynamic cross-linked structure of claim 34, wherein the compound components that participate in the reaction to form the organoboronate silicone linkages and the common covalent bonds further comprise:

wherein the organoboron compound (I), the silicon-containing compound (II) contain one or more functional groups, and at least one compound (III) or at least one organoboron compound (I) or at least one silicon-containing compound (II) contain one or more other reactive groups.

36. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 11 to 16, which is obtained by reacting at least the following components to form a common covalent bond:

at least one compound (IV) containing at least one organoboronate silicone linkage and at least one other reactive group.

37. The dynamic polymer having a dynamic cross-linked structure according to claim 36, wherein the compound component participating in the reaction to form a common covalent bond further comprises:

at least one compound which does not contain organoborate silicone linkages but which contains at least one other reactive group; wherein the other reactive group contained in the compound (IV) is capable of participating in a reaction with the other reactive group contained in the compound (IV).

38. The dynamic polymer having a dynamic cross-linked structure according to any one of claims 1 to 16 and 29, which is applied to the following articles: the shock absorber comprises a shock absorber, a buffer material, an anti-impact protective material, a motion protective product, a military police protective product, a self-repairable coating, a self-repairable plate, a self-repairable binder, a tough material and a toy.