CN107438333A - Substrate and its manufacture method with double-deck line layer - Google Patents

Substrate and its manufacture method with double-deck line layer Download PDF

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Publication number
CN107438333A
CN107438333A CN201610352399.9A CN201610352399A CN107438333A CN 107438333 A CN107438333 A CN 107438333A CN 201610352399 A CN201610352399 A CN 201610352399A CN 107438333 A CN107438333 A CN 107438333A
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CN
China
Prior art keywords
layer
electrode layer
line
alloy
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610352399.9A
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Chinese (zh)
Inventor
许国诚
苏建豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHEESHIN TECHNOLOGY Co Ltd
Original Assignee
CHEESHIN TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHEESHIN TECHNOLOGY Co Ltd filed Critical CHEESHIN TECHNOLOGY Co Ltd
Priority to CN201610352399.9A priority Critical patent/CN107438333A/en
Publication of CN107438333A publication Critical patent/CN107438333A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention discloses a kind of substrate and its manufacture method with double-deck line layer, and the substrate includes：One plastic base of tool two-layer electrode layer is provided, wherein, a transparent electrode layer of the two-layer electrode layer is configured above the plastic base, and a metal electrode layer is configured above the transparent electrode layer；The two-layer electrode layer is cut with a laser, to form a first line area and one second line areas.The manufacture method includes：A protective layer is formed above second line areas；An etching material of the etchable metal electrode layer is coated with above the protective layer and the first line area, to etch the metal electrode layer in the first line area, makes the transparent electrode layer in the first line area exposed；And remove the protective layer.

Description

Substrate and its manufacture method with double-deck line layer
Technical field
The present invention is on a kind of substrate, especially in regard to a kind of substrate and its manufacture method with double-deck line layer.
Background technology
At present, the product of contact panel class, it is required for using transparency electrode.In addition to transparency electrode, it is also necessary to use side The metal electrode (edge circuit) of edge, to be used as the electrical connection with the external world.And in order to electronic product persistently move towards slimming with it is light The purpose of quantization, the substrate of contact panel, plastic base has also been gradually adopted to allow as base material and form transparency electrode thereon.
At present, in a manner of making transparency electrode and edge circuit by plastic base, mostly using following making side Formula：It is first that the electrode fabrication of transparency electrode is good, then carry out the making of edge circuit.Such a preparation method, it can be produced two parts Raw problem：First, after the making of transparency electrode, can be because of the high temperature (being higher than 150 DEG C) when subsequently making edge circuit, and produce The deformation of raw plastic base (is attached with the plastic base of transparency electrode and the plastic base part without transparency electrode, because of high temperature There is pyrocondensation situation difference, and then form the ghost of clathrate).Second, the manufacturing process use printing of edge circuit/laser carved Processing procedure, can be because laser carved process produces metal dust, and pollutes the transparency electrode made.
Therefore, how to allow the method for preparing substrate of the two-layer electrode with transparency electrode is simple, cost is reduced, and can changed Kind plastic base deforms and caused ghost problem, also, is avoided that pollution, turns into the institute of manufacturer with laser carved processing procedure The technique direction made great efforts to develop.
The content of the invention
For the above-mentioned purpose, the present invention provides a kind of substrate and its manufacture method with double-deck line layer, and it has system Journey is simple, it is low to produce plastic base ghost, equipment cost and is avoided that the spies such as laser carved caused metal dust pollution Different technical effect.
The present invention provides a kind of manufacture method of the substrate with double-deck line layer, including：
One plastic base of tool two-layer electrode layer is provided, wherein, a transparent electrode layer of the two-layer electrode layer is configured at the plastics Surface, a metal electrode layer are configured above the transparent electrode layer；
The two-layer electrode layer is cut with a laser, to form a first line area and one second line areas；
A protective layer is formed above second line areas；
Coating can etch an etching material of the metal electrode layer above the protective layer and the first line area, should with etching The metal electrode layer in first line area, make the transparent electrode layer in the first line area exposed；And
Remove the protective layer.
Wherein the material of the metal electrode layer is selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium Or titanium alloy.
The wherein metal electrode layer is multilayer metallic electrode layer, the material of each layer metal electrode layer be selected from copper, copper alloy, Silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium or titanium alloy.
Also include：
The plastic base of pre- baking equipment two-layer electrode layer, make the transparent electrode layer pre-crystallized.
The protective layer of wherein second line areas covers second line areas in a manner of whole face.
Wherein the protective layer is a photoresist layer or an ink layer.
Wherein second line areas is formed at the edge of the plastic base.
The present invention also provides a kind of substrate with double-deck line layer with made by the manufacture method, comprising：
One plastic base；
One first line area, it is configured on the plastic base and is formed by a transparent electrode layer；And
One second line areas, it is made up of a metal electrode layer of the transparent electrode layer and the side of being configured thereon that.
Wherein the material of the metal electrode layer is selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium Or titanium alloy.
Wherein the metal electrode series of strata are multilayer metallic electrode layer, and the material system of each layer metal electrode layer is selected from copper, copper conjunction Gold, silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium or titanium alloy.
Wherein second line areas is formed at the edge of the plastic base.
Brief description of the drawings
Figure 1A-Fig. 1 D are the section and top view before and after the making of the substrate with double-deck line layer of the present invention.
Fig. 2A-Fig. 2 G figures system is illustrated for the processing procedure section of the manufacture method of the substrate with double-deck line layer of the present invention Figure.
Fig. 3 is the flow chart of the manufacture method of the substrate with double-deck line layer of the present invention.
In figure：
2 is local；
3 first line areas；
4 second line areas；
10 plastic bases；
20 transparent electrode layers；
21st, 22 transparency electrode circuit；
23rd, 24,25 gap；
30 metal electrode layers；
31st, 32 metal electrode circuit；
40 protective layers；
50 etching materials；
90 laser cutting heads；
91 laser beams；
Step 101：One plastic base of tool two-layer electrode layer is provided, wherein, the transparent electrode layer configuration of the two-layer electrode layer Above the plastic base, a metal electrode layer is configured above the transparent electrode layer；
Step 102：The two-layer electrode layer is cut with laser, to form a first line area and one second line areas；
Step 103：A protective layer is formed above second line areas；
Step 104：An etching material of the etchable metal electrode layer is coated with above the protective layer and the first line area, with The metal electrode layer in the first line area is etched, makes the transparent electrode layer in the first line area exposed；
Step 105：Remove the protective layer.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
According to an embodiment of the invention, the present invention uses laser carved processing procedure, by the good tool double-layer electric of pre-production The plastic base of pole layer (substrate+transparent electrode layer+metal electrode layer), two are disposably made with laser carved processing procedure Line areas, then the metal etch process by low temperature, by upper strata should not metal electrode layer etch away and retain edge circuit Area, and then processing procedure is simple, it is low to produce plastic base ghost, equipment cost and is avoided that laser carved caused gold Belong to the special technique effects such as powder pollution.Hereinafter, embodiment will be enumerated to illustrate the specific practice of the present invention.
First, refer to Figure 1A-Figure 1B, its for the present invention the substrate with double-deck line layer making before section and Top view；Fig. 1 C- Fig. 1 D be after the making of the substrate with double-deck line layer of the present invention on regard and profile.It can send out Existing, pre-crystallized transparent of process has been got well in the plastic base 10 for the tool two-layer electrode layer that the present invention is used, its top pre-production Electrode layer 20, the top of transparency electrode 20 have then been pre-formed metal electrode layer 30.It is pre-crystallized due to passing through, so, plastic base 10 have already passed through high-temperature process, generate deformation, follow-up manufacturing process, will not allow to be also easy to produce deformation.
In Fig. 1 C, Fig. 1 D, the substrate with double-deck line layer made, it will be apparent that only remaining first line area 3 with Second line areas 4, wherein, the circuit among the second line areas 4, it is made up of transparency electrode circuit 22 and metal electrode circuit 32, (it is local 2 profile in Fig. 1 C) as shown in figure iD.And the gap 23,24,25 between circuit, then carved with laser Quarter is made.First line area 3 then contains only the part of transparency electrode circuit 21, that is, the portion as touching electrode Point.
Then, Fig. 2A-Fig. 2 G are refer to, it is Fig. 1 C local 2 section Making programme figure, asks reference synchronization Fig. 3's Explanation.Fig. 3 is the substrate with double-deck line layer of the present invention and its specific embodiment of manufacture method, includes following step Suddenly：
Step 101：One plastic base 10 of tool two-layer electrode layer is provided, wherein, a transparent electrode layer 20 of the two-layer electrode layer The top of plastic base 10 is configured at, a metal electrode layer 30 is configured at the top of transparent electrode layer 20, as shown in Figure 2 A.Its In, the material of plastic base 10 can be used as PET (PET), PI (pi), PEN are (poly- to naphthalene two The fat resin of formic acid second two) etc. flexible base plate material.The material of metal electrode layer 30 is selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium Alloy, nickel, nickel alloy, titanium, titanium alloy, the mixing alloy of various metals.Transparent electrode layer be may be selected from, and oxygen (nitrogen) compound is transparent to be led Electric material：In2O3、SnO2、ZnO、CdO、TiN；Doping oxide transparent conductive material：In2O3:Sn (ITO)、ZnO:In (IZO)、ZnO:Ga (GZO)、ZnO:Al (AZO)、SnO2:F、TiO2:Ta；Mixed oxide transparent conductive material：In2O3- ZnO、CdIn2O4、Cd2SnO4、Zn2SnO4。
In addition, before step 101, the plastic base 10 of pre- baking equipment two-layer electrode layer can be carried out, makes transparent electrode layer 20 It is pre-crystallized, and plastic base 10 is shunk in advance.
Step 102：The two-layer electrode layer is cut with laser, to form a first line area 3 and one second line areas 4, such as Shown in Fig. 2 B, by adjusting the intensity of laser beam 91 caused by laser cutting head 90, with synchronous cutting metal electrode layer 30 and thoroughly Prescribed electrode layer 20.After completing, i.e., as shown in Figure 2 C, gap 23,24,25 is cut by laser beam 91, and forms first Metal electrode circuit 31, transparency electrode circuit 21 among line areas 3, metal electrode circuit 32 among the second line areas 4, thoroughly Prescribed electrode circuit 22.Wherein, laser cuts the line-spacing (it is, gap 23) of the second line areas 4 more than 10 microns.
Step 103：A protective layer 40 is formed above second line areas 4, as shown in Figure 2 D.Protective layer 40 is directly formed In the whole face of the second line areas 4, metal electrode circuit 32 and its gap 23 of the second line areas 4 are completely covered.It is another Kind mode is that protective layer 40 in a manner of the width of metal electrode circuit 32 for being wider than the second line areas 4 to form, with etching material 50 surface tension, allow it not penetrate into gap 23, and prevent metal electrode circuit 32 to be etched.Wherein, protective layer 40 is One photoresist layer or an ink layer.Micro-photographing process can be used with photoresist layer, printing process can be used with ink layer.
Step 104：An etching material 50 of the etchable metal electrode layer 30 is coated with the protective layer 40 and the First Line The top of road area 3, to etch the metal electrode layer (metal electrode circuit 31) in the first line area 3, makes the first line area 3 The transparent electrode layer (transparency electrode circuit 21) is exposed.Fig. 2 E, Fig. 2 F are refer to, because protective layer 40 covers the second line areas 4 metal electrode circuit 32, so, metal electrode circuit 32 is isolated with etching material 50 (etching paste as etched metal), Therefore, the metal electrode circuit 31 for only touching etching material 50 is etched, as shown in Figure 2 F.On the implementation, can be Thickness is widened in the part that the outermost of two line areas 4 may contact with etching material 50, to prevent the situation of lateral erosion from occurring.
Step 105：The protective layer 50 is removed, that is, completes whole Making programme, as shown in Figure 2 G.Fig. 2 G be Fig. 1 D into Product figure.
In whole process, although with laser processing procedure, its caused metal dust, by by follow-up etching material 50 Etched away, therefore, do not have the pollution problem of metal dust.In addition, whole process, does not have and is produced because of high temperature process The problem of 10 deformation of plastic base.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention Enclose not limited to this.The equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention Protection domain within.Protection scope of the present invention is defined by claims.

Claims (11)

  1. A kind of 1. manufacture method of the substrate with double-deck line layer, it is characterised in that including：
    One plastic base of tool two-layer electrode layer is provided, wherein, a transparent electrode layer of the two-layer electrode layer is configured at the plastics Surface, a metal electrode layer are configured above the transparent electrode layer；
    The two-layer electrode layer is cut with a laser, to form a first line area and one second line areas；
    A protective layer is formed above second line areas；
    Coating can etch an etching material of the metal electrode layer above the protective layer and the first line area, should with etching The metal electrode layer in first line area, make the transparent electrode layer in the first line area exposed；And
    Remove the protective layer.
  2. 2. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that the wherein metal The material of electrode layer is selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium or titanium alloy.
  3. 3. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that the wherein metal Electrode layer is multilayer metallic electrode layer, the material of each layer metal electrode layer be selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, Nickel, nickel alloy, titanium or titanium alloy.
  4. 4. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that also include：
    The plastic base of pre- baking equipment two-layer electrode layer, make the transparent electrode layer pre-crystallized.
  5. 5. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that wherein this second The protective layer of line areas covers second line areas in a manner of whole face.
  6. 6. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that the wherein protection Layer is a photoresist layer or an ink layer.
  7. 7. the manufacture method of the substrate according to claim 1 with double-deck line layer, it is characterised in that wherein this second Line areas is formed at the edge of the plastic base.
  8. A kind of 8. substrate with double-deck line layer made by manufacture method with claim 1, it is characterised in that bag Contain：
    One plastic base；
    One first line area, it is configured on the plastic base and is formed by a transparent electrode layer；And
    One second line areas, it is made up of a metal electrode layer of the transparent electrode layer and the side of being configured thereon that.
  9. 9. the substrate according to claim 8 with double-deck line layer, it is characterised in that the wherein material of the metal electrode layer Material is selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, nickel, nickel alloy, titanium or titanium alloy.
  10. 10. the substrate according to claim 8 with double-deck line layer, it is characterised in that the wherein metal electrode series of strata For multilayer metallic electrode layer, the material system of each layer metal electrode layer be selected from copper, copper alloy, silver, silver alloy, aluminium, aluminium alloy, nickel, Nickel alloy, titanium or titanium alloy.
  11. 11. the substrate according to claim 10 with double-deck line layer, it is characterised in that wherein the second line areas shape Into in the edge of the plastic base.
CN201610352399.9A 2016-05-25 2016-05-25 Substrate and its manufacture method with double-deck line layer Withdrawn CN107438333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610352399.9A CN107438333A (en) 2016-05-25 2016-05-25 Substrate and its manufacture method with double-deck line layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610352399.9A CN107438333A (en) 2016-05-25 2016-05-25 Substrate and its manufacture method with double-deck line layer

Publications (1)

Publication Number Publication Date
CN107438333A true CN107438333A (en) 2017-12-05

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838656A (en) * 1980-10-06 1989-06-13 Andus Corporation Transparent electrode fabrication
CN1309320A (en) * 2000-02-18 2001-08-22 精工爱普生株式会社 Base board for display device and its mfg. method, liquid crystal device and electronic apparatus
US20060110547A1 (en) * 2004-11-23 2006-05-25 Advantech Global, Ltd Patterning of indium-tin oxide (ITO) for precision-cutting and aligning a liquid crystal display (LCD) panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838656A (en) * 1980-10-06 1989-06-13 Andus Corporation Transparent electrode fabrication
CN1309320A (en) * 2000-02-18 2001-08-22 精工爱普生株式会社 Base board for display device and its mfg. method, liquid crystal device and electronic apparatus
US20060110547A1 (en) * 2004-11-23 2006-05-25 Advantech Global, Ltd Patterning of indium-tin oxide (ITO) for precision-cutting and aligning a liquid crystal display (LCD) panel

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Application publication date: 20171205

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