CN107437579A - The Fast Sintering preparation method of the superconducting thin films of Tl 2212 - Google Patents
The Fast Sintering preparation method of the superconducting thin films of Tl 2212 Download PDFInfo
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- 238000005245 sintering Methods 0.000 title claims abstract description 94
- 238000002360 preparation method Methods 0.000 title claims abstract description 60
- 239000010409 thin film Substances 0.000 title claims abstract description 39
- 239000010408 film Substances 0.000 claims abstract description 109
- 239000001301 oxygen Substances 0.000 claims abstract description 87
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 87
- 239000002243 precursor Substances 0.000 claims abstract description 71
- 229910052716 thallium Inorganic materials 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 53
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims abstract description 49
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052786 argon Inorganic materials 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000007858 starting material Substances 0.000 claims abstract description 27
- 238000010304 firing Methods 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 86
- 229910021645 metal ion Inorganic materials 0.000 claims description 33
- 238000004544 sputter deposition Methods 0.000 claims description 31
- 229910052791 calcium Inorganic materials 0.000 claims description 24
- 229910052788 barium Inorganic materials 0.000 claims description 20
- 239000007789 gas Substances 0.000 claims description 18
- 238000005477 sputtering target Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 12
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 10
- 229910052746 lanthanum Inorganic materials 0.000 claims description 9
- -1 lanthanum aluminate Chemical class 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004549 pulsed laser deposition Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000003980 solgel method Methods 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 229910002076 stabilized zirconia Inorganic materials 0.000 claims description 2
- 239000012300 argon atmosphere Substances 0.000 claims 1
- 125000002524 organometallic group Chemical group 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 20
- 239000002245 particle Substances 0.000 abstract description 10
- 239000000843 powder Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000002474 experimental method Methods 0.000 abstract description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000011575 calcium Substances 0.000 description 50
- 239000010949 copper Substances 0.000 description 32
- 239000010453 quartz Substances 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- 239000013589 supplement Substances 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 4
- 230000001502 supplementing effect Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 108010025899 gelatin film Proteins 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000004310 lactic acid Substances 0.000 description 2
- 235000014655 lactic acid Nutrition 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229910004247 CaCu Inorganic materials 0.000 description 1
- 206010021143 Hypoxia Diseases 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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Abstract
本发明公开了一种Tl‑2212超导薄膜的快速烧结制备方法,使用银箔或金箔将含铊的非晶态先驱膜与含铊的陪烧靶密封包裹,并在密封氩气或流氧环境中烧结。本发明包括先驱膜的制备、铊源陪烧靶的制备、先驱膜在氩/氧环境下的快速升温烧结、初级样品的补氧热处理等四项工艺。与传统的烧结方法相比,采用该技术生长Tl‑2212薄膜的烧结条件不受先驱膜的沉积方法、铊源陪烧靶的起始材料的粉体颗粒大小及其制备方法的影响,避免了由于更换厂家原料和先驱膜沉积方法而需要重新长时间对烧结工艺的探索过程。同时,该方法还极大地减少了铊源陪烧靶的用量,缩短了升降温时间和恒温时间,降低生产成本,提高了实验的重复性。
The invention discloses a rapid sintering preparation method of Tl-2212 superconducting thin film. Silver foil or gold foil is used to seal and wrap the amorphous precursor film containing thallium and the burning target containing thallium, and the Sintering in the environment. The invention includes four processes including the preparation of a precursor film, the preparation of a thallium source accompanying firing target, the rapid temperature-raising sintering of the precursor film in an argon/oxygen environment, and the oxygen-supplementing heat treatment of a primary sample. Compared with the traditional sintering method, the sintering conditions for growing Tl‑2212 thin films using this technology are not affected by the deposition method of the precursor film, the powder particle size of the starting material of the thallium source accompanying firing target and its preparation method, avoiding the Due to the replacement of the manufacturer's raw materials and the pioneering film deposition method, it is necessary to re-explore the sintering process for a long time. At the same time, the method also greatly reduces the amount of the thallium source accompanying the burning target, shortens the heating and cooling time and constant temperature time, reduces the production cost, and improves the repeatability of the experiment.
Description
技术领域technical field
本发明涉及铊系超导薄膜材料领域。更具体地说,本发明涉及一种Tl-2212超导薄膜的快速烧结制备方法。The invention relates to the field of thallium superconducting thin film materials. More specifically, the present invention relates to a rapid sintering preparation method of Tl-2212 superconducting thin film.
背景技术Background technique
Tl2Ba2CaCu2O8(Tl-2212)超导薄膜具有较高的临界温度(Tc可达110K)、较高的临界电流密度、以及较强的抗潮湿能力等优点,是开发高性能高温超导电子器件的重要材料。Tl 2 Ba 2 CaCu 2 O 8 (Tl-2212) superconducting thin film has the advantages of high critical temperature (T c can reach 110K), high critical current density, and strong moisture resistance. An important material for high-performance high-temperature superconducting electronic devices.
在目前Tl-2212薄膜的合成研究中,制备先驱膜的主要方法包括磁控溅射、脉冲激光沉积、Aerosol、MOCVD、Sol-gel等。这些研究的烧结工艺共同点:(1)需要提供铊源陪烧靶与先驱膜一起烧结;(2)烧结设备升温速度低,通常为1~10℃/min,即0.017~0.16℃/s。采用这种烧结方法,通过探索研究,可以制备出高质量的Tl-2212薄膜。但是,这种烧结工艺受先驱膜的沉积方法、铊源陪烧靶的起始材料的粉体颗粒大小及其制备方法的影响很大。更换原材料的厂家、以及先驱膜的沉积方法,就必须花费大量时间重新探索其制备工艺。其原因是:(1)先驱膜制备方法不同,原材料的厂家不同,先驱膜和陪烧靶的非晶态颗粒的大小也不同,因此Tl2O3的挥发温度就相差很大;(2)要制备高质量的Tl-2212薄膜,在高温烧结过程中先驱膜的Tl挥发与陪烧靶提供的Tl补充要形成一个动态平衡;(3)挥发温度的差异造成了烧结工艺的巨大改变,这需要较长时间的探索。In the current research on the synthesis of Tl-2212 thin films, the main methods for preparing precursor films include magnetron sputtering, pulsed laser deposition, Aerosol, MOCVD, Sol-gel, etc. The sintering processes of these studies have the following common points: (1) It is necessary to provide a thallium source to accompany the firing target to be sintered together with the precursor film; (2) The heating rate of the sintering equipment is low, usually 1-10°C/min, that is, 0.017-0.16°C/s. Using this sintering method, through exploration and research, high-quality Tl-2212 films can be prepared. However, this sintering process is greatly affected by the deposition method of the precursor film, the powder particle size of the starting material of the thallium source and firing target, and its preparation method. Changing the manufacturer of raw materials and the deposition method of the precursor film requires a lot of time to re-explore its preparation process. The reasons are: (1) The preparation method of the precursor film is different, the manufacturer of the raw material is different, and the size of the amorphous particles of the precursor film and the burning target is also different, so the volatilization temperature of Tl 2 O 3 is very different; (2) In order to prepare high-quality Tl-2212 films, a dynamic balance must be formed between the Tl volatilization of the precursor film and the Tl supplement provided by the burner target during the high-temperature sintering process; (3) the difference in volatilization temperature caused a huge change in the sintering process, which It takes a long time to explore.
发明内容Contents of the invention
本发明的一个目的是解决至少上述问题,并提供至少后面将说明的优点。It is an object of the present invention to solve at least the above-mentioned problems and to provide at least the advantages which will be described later.
本发明还有一个目的是提供一种Tl-2212超导薄膜的快速烧结制备方法,所制备出的纯相Tl-2212薄膜,具有良好的超导特性,本方法具有升降温时间和恒温时间短、生产成本低、烧结工艺不受先驱膜的沉积方法和铊源陪烧靶的起始材料的粉体颗粒大小影响的等优点。Another object of the present invention is to provide a method for preparing T1-2212 superconducting film by rapid sintering. The prepared pure phase T1-2212 film has good superconducting properties, and the method has short heating and cooling time and constant temperature time. , low production cost, and the sintering process is not affected by the deposition method of the precursor film and the powder particle size of the starting material of the thallium source and firing target.
为了实现根据本发明的这些目的和其它优点,提供了一种Tl-2212超导薄膜的快速烧结制备方法,使用银箔或金箔将含铊的非晶态先驱膜与含铊的陪烧靶密封包裹,并在密封氩气或流氧环境中烧结:In order to achieve these objects and other advantages according to the present invention, a rapid sintering preparation method of Tl-2212 superconducting thin film is provided, using silver foil or gold foil to seal the amorphous precursor film containing thallium with the burnt target containing thallium Wrapped and sintered in a sealed argon or flowing oxygen environment:
氩气环境中:在0~350℃温区,升温速度0.5~5℃/s,在350~650℃温区,升温速度1~10℃/s,在650~780℃温区,升温速度10~40℃/s,在烧结温度730~780℃恒温10~60min,在冷却循环水作用下降至室温,即得;或In argon environment: in the temperature range of 0-350°C, the heating rate is 0.5-5°C/s; in the temperature range of 350-650°C, the heating rate is 1-10°C/s; in the temperature range of 650-780°C, the heating rate is 10 ~40°C/s, keep the sintering temperature at 730-780°C for 10-60 minutes, and cool down to room temperature under the action of cooling circulating water; or
流氧环境中:在0~350℃温区,升温速度0.5~5℃/s,在350~650℃温区,升温速度1~10℃/s,在650~860℃温区,升温速度10~40℃/s,在烧结温度810~860℃恒温10~30min,在冷却循环水作用下降至室温,即得;In the oxygen flow environment: in the temperature zone of 0-350℃, the heating rate is 0.5-5℃/s; in the temperature zone of 350-650℃, the heating rate is 1-10℃/s; in the temperature zone of 650-860℃, the heating rate is 10 ~40°C/s, keep the sintering temperature at 810-860°C for 10-30 minutes, and cool down to room temperature under the action of cooling circulating water, that is to say;
其中,含铊的非晶态先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为2.5~3.5:2:1:2.2~2.6;Wherein, the metal ion molar ratio of Tl, Ba, Ca, and Cu in the amorphous precursor film containing thallium is 2.5-3.5:2:1:2.2-2.6;
含铊的陪烧靶由金属离子摩尔比为Tl:Ba:Ca:Cu=1~2.6:2:2:3的Ba、Ca、Cu的氧化物与Tl2O3烧结制得。The thallium-containing burner target is made by sintering the oxides of Ba, Ca and Cu with the molar ratio of metal ions Tl:Ba:Ca:Cu=1~2.6:2:2:3 and Tl 2 O 3 .
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,含铊的非晶态先驱膜与含铊的陪烧靶在氩气环境中烧结后还包括补氧热处理:将氩气环境中烧结制备的样品冷却后转移至流氧环境中,以速度1~5℃/s升温至350℃,然后以速度1~40℃/s升温至400~710℃温区恒温20~60min,冷却,即得。Preferably, in the method for preparing the Tl-2212 superconducting thin film by rapid sintering, after sintering the thallium-containing amorphous precursor film and the thallium-containing sintering target in an argon environment, oxygen supplement heat treatment is also included: The sample prepared by sintering in the environment is cooled and then transferred to the flowing oxygen environment, and the temperature is raised to 350°C at a speed of 1-5°C/s, and then heated to 400-710°C at a speed of 1-40°C/s. The temperature zone is kept at a constant temperature for 20-60min. Let cool and serve.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,含铊的陪烧靶的制备方法为:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的Ba、Ca、Cu的氧化物为起始材料混合研磨,在流氧环境中890~940℃下恒温4~8h,冷却后粉碎再研磨,在流氧环境中890~940℃下恒温4~8h,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1~2.6:2,在流氧环境中840~860℃下恒温1~2h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3~4h,得到陪烧靶。Preferably, in the preparation method of rapid sintering of the Tl-2212 superconducting thin film, the preparation method of the thallium-containing burner target is as follows: the metal ion molar ratio is Ba:Ca:Cu=2:2:3 Ba, The oxides of Ca and Cu are mixed and ground as the starting materials, kept at a constant temperature of 890-940°C for 4-8 hours in a flowing oxygen environment, crushed and then ground after cooling, kept at a constant temperature of 890-940°C for 4-8 hours in a flowing oxygen environment, and added Tl 2 O 3 is mixed and ground into tablets, so that the molar ratio of Tl and Ba is Tl:Ba=1~2.6:2, keep the temperature at 840~860°C for 1~2h in the flow oxygen environment, crush and grind after cooling, In an oxygen environment, keep the temperature at 840-860°C for 3-4 hours to obtain the burning target.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,含铊的非晶态先驱膜的制备方法采用离子溅射沉积法、脉冲激光沉积法、金属有机物沉积法或溶胶-凝胶法。Preferably, in the preparation method of rapid sintering of the Tl-2212 superconducting thin film, the preparation method of the amorphous precursor film containing thallium adopts ion sputtering deposition method, pulsed laser deposition method, metal organic deposition method or sol-gel glue method.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,含铊的非晶态先驱膜的制备方法采用离子溅射沉积法:Preferably, the rapid sintering preparation method of the Tl-2212 superconducting thin film, the preparation method of the amorphous precursor film containing thallium adopts the ion sputtering deposition method:
S1、将金属离子摩尔比为Ba:Ca:Cu=2.3~2.6:1:2.1~2.4的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温4~8h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.2~3:1,在流氧环境中840~860℃下恒温3~6h,冷却后得到溅射靶;S1. Mix and grind BaO 2 or BaO, CaO or CaCO 3 and CuO with the molar ratio of metal ions Ba:Ca:Cu=2.3~2.6:1:2.1~2.4 as the starting material, in the flow oxygen environment 890~940 Keep the temperature at ℃ for 4-8 hours, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl and Ca is Tl:Ca=2.2-3:1, keep the temperature at 840-860 ℃ for 3-6 hours in the oxygen flow environment, After cooling, the sputtering target is obtained;
S2、对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为30~60W。S2. Use radio frequency magnetron sputtering for the sputtering target, the sputtering gas is high-purity Ar or Ar/O 2 mixed gas, the sputtering pressure is 2.2-6Pa, and the sputtering power is 30-60W.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧、蓝宝石、氧化镁、钇稳定氧化锆或有织构的金属衬底材料合金。Preferably, in the rapid sintering preparation method of the Tl-2212 superconducting thin film, the substrate is lanthanum aluminate, sapphire, magnesium oxide, yttrium-stabilized zirconia or textured metal substrate material alloy.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,氩气或流氧环境中烧结时,氩气或氧气压力为1atm。Preferably, in the rapid sintering preparation method of the Tl-2212 superconducting thin film, when sintering in an argon or oxygen flow environment, the argon or oxygen pressure is 1 atm.
优选的是,所述的Tl-2212超导薄膜的快速烧结制备方法,制成的Tl-2212超导薄膜的厚度为10nm~2.5μm。Preferably, in the method for preparing the Tl-2212 superconducting thin film by rapid sintering, the thickness of the prepared Tl-2212 superconducting thin film is 10nm-2.5μm.
本发明至少包括以下有益效果:The present invention at least includes the following beneficial effects:
第一、本发明采用三段升温工艺,避免了薄膜裂纹的产生,克服了传统的低速升温烧结工艺受先驱膜的沉积方法、铊源陪烧靶的起始材料的粉体颗粒大小影响的问题,制备的Tl-2212超导薄膜具有光滑的表面、以及较好的超导电性;First, the present invention adopts a three-stage heating process, which avoids the generation of film cracks and overcomes the problem that the traditional low-speed heating sintering process is affected by the deposition method of the precursor film and the powder particle size of the starting material of the thallium source accompanying firing target , the prepared Tl-2212 superconducting film has a smooth surface and good superconductivity;
第二、本发明极大地缩短了升降温时间和恒温时间,具有工艺简单、单个样品制备时间短(含三段升温、降温、补氧等过程约4h)、陪烧靶用量少、生产成本低等优点;Second, the present invention greatly shortens the heating and cooling time and constant temperature time, and has the advantages of simple process, short preparation time of a single sample (about 4 hours including three stages of heating, cooling, and oxygen supplementation), less consumption of burning targets, and low production cost. inferior merit;
第三、本发明的陪烧靶为本发明的先驱膜补充Tl元素,先驱膜中Tl含量可以在较大范围变化,烧结后均可得到超导特性较好的Tl-2212薄膜;陪烧靶中Tl含量变化范围大、单次烧结的成品率高;Third, the burner target of the present invention supplements the Tl element for the precursor film of the present invention, and the Tl content in the precursor film can vary in a wide range, and after sintering, a Tl-2212 film with good superconducting properties can be obtained; the burner target The content of Tl in the medium varies widely, and the yield of single sintering is high;
第四、本发明制备纯相Tl-2212超导薄膜具有较高的结晶质量,晶粒生长更加完整,排列更加有序,薄膜具有较好的c轴取向,Tl-2212超导薄膜表面光滑,且无裂纹。Fourth, the pure phase Tl-2212 superconducting thin film prepared by the present invention has higher crystallization quality, more complete grain growth, more orderly arrangement, better c-axis orientation of the thin film, smooth surface of the Tl-2212 superconducting thin film, And no cracks.
本发明的其它优点、目标和特征将部分通过下面的说明体现,部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。Other advantages, objectives and features of the present invention will partly be embodied through the following descriptions, and partly will be understood by those skilled in the art through the study and practice of the present invention.
附图说明Description of drawings
图1为实施例3在补氧前的Tl-2212超导薄膜的V-T图;Fig. 1 is the V-T figure of the T1-2212 superconducting thin film of embodiment 3 before supplementary oxygen;
图2为实施例6在补氧后的Tl-2212超导薄膜的XRD图;Fig. 2 is the XRD pattern of the T1-2212 superconducting thin film of embodiment 6 after supplementing oxygen;
图3为实施例6在补氧后的Tl-2212超导薄膜的SEM扫描图;Fig. 3 is the SEM scanning figure of the T1-2212 superconducting thin film of embodiment 6 after supplementing oxygen;
图4为实施例6在补氧后的Tl-2212超导薄膜的V-T图;Fig. 4 is the V-T figure of the T1-2212 superconducting thin film of embodiment 6 after supplementing oxygen;
图5为实施例9在流氧环境下的Tl-2212超导薄膜的XRD图;Fig. 5 is the XRD pattern of the T1-2212 superconducting thin film of embodiment 9 under flowing oxygen environment;
图6为实施例9在流氧环境下的Tl-2212超导薄膜的V-T图。Fig. 6 is the V-T diagram of the Tl-2212 superconducting thin film of embodiment 9 under the flowing oxygen environment.
具体实施方式detailed description
下面结合实施例对本发明做进一步的详细说明,以令本领域技术人员参照说明书文字能够据以实施。The present invention will be further described in detail below in conjunction with the embodiments, so that those skilled in the art can implement it with reference to the description.
需要说明的是,下述实施方案中所述实验方法,如无特殊说明,均为常规方法,所述试剂和材料,如无特殊说明,均可从商业途径获得。It should be noted that the experimental methods described in the following embodiments, unless otherwise specified, are conventional methods, and the reagents and materials, unless otherwise specified, can be obtained from commercial sources.
<实施例1><Example 1>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为CeO2/蓝宝石,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is CeO 2 / sapphire, comprising:
步骤一、采用溶胶-凝胶法制备含铊的非晶态先驱膜:以铊、钡、钙、铜的乙酸盐为起始原料,以丙酸、乳酸、二乙烯三胺、甲醇等为络合剂及溶剂制备溶胶;以此溶胶在具有CeO2隔离层的蓝宝石基片上制备凝胶膜,通过干燥及热分解工艺,得到先驱膜,制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为2.5:2:1:2.2;Step 1. Preparation of thallium-containing amorphous precursor film by sol-gel method: starting materials of thallium, barium, calcium, copper acetate, propionic acid, lactic acid, diethylenetriamine, methanol, etc. A complexing agent and a solvent are used to prepare a sol ; a gel film is prepared from the sol on a sapphire substrate with a CeO2 isolation layer, and a precursor film is obtained through drying and thermal decomposition processes. The Tl, Ba, Ca, and Cu of the prepared precursor film are The molar ratio of metal ions is 2.5:2:1:2.2;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温4h,冷却后粉碎再研磨,在流氧环境中890~940℃下恒温4h,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1:2,在流氧环境中840~860℃下恒温1h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 4 hours, after cooling, pulverize and then grind, and keep the temperature at 890~940℃ for 4 hours in the flowing oxygen environment, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl and Ba is Tl:Ba=1:2, Keep the temperature at 840-860°C for 1 hour in a flowing oxygen environment, crush and grind after cooling, and keep the temperature at 840-860°C in a flowing oxygen environment for 3 hours to obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:使用银箔或金箔把先驱膜与陪烧靶密封包裹,放入快速热处理设备的密闭石英管内,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: use silver foil or gold foil to seal and wrap the precursor film and the accompanying firing target, put them into the closed quartz tube of the rapid heat treatment equipment, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度0.5℃/s,在350~650℃温区,升温速度1℃/s,在650~780℃温区,升温速度40℃/s,在烧结温度730~780℃恒温10min,在冷却循环水作用下降至室温,得到初级样品;In argon environment: in the temperature range of 0-350°C, the heating rate is 0.5°C/s; in the temperature range of 350-650°C, the heating rate is 1°C/s; in the temperature range of 650-780°C, the heating rate is 40°C/s. Keep the sintering temperature at 730-780°C for 10 minutes, and cool down to room temperature under the action of cooling circulating water to obtain primary samples;
步骤四、补氧热处理:将步骤三制备的样品在流氧环境中,以速度1℃/s升温至350℃,然后以1℃/s升温至400~710℃温区恒温20min,在冷却循环水作用下降至室温,即得Tc为104K的Tl-2212纯相薄膜。Step 4. Oxygen supplement heat treatment: heat the sample prepared in step 3 to 350°C at a rate of 1°C/s in a flowing oxygen environment, and then raise the temperature to 400-710°C at a rate of 1°C/s for 20 minutes at a constant temperature in the cooling cycle. The effect of water drops to room temperature, and Tl-2212 pure phase film with Tc of 104K is obtained.
<实施例2><Example 2>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为CeO2/蓝宝石,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is CeO 2 / sapphire, comprising:
步骤一、采用溶胶-凝胶法制备含铊的非晶态先驱膜:以铊、钡、钙、铜的乙酸盐为起始原料,以丙酸、乳酸、二乙烯三胺、甲醇等为络合剂及溶剂制备溶胶;以此溶胶在具有CeO2隔离层的蓝宝石基片上制备凝胶膜,通过干燥及热分解工艺,得到先驱膜,制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3.5:2:1:2.6;Step 1. Preparation of thallium-containing amorphous precursor film by sol-gel method: starting materials of thallium, barium, calcium, copper acetate, propionic acid, lactic acid, diethylenetriamine, methanol, etc. A complexing agent and a solvent are used to prepare a sol ; a gel film is prepared from the sol on a sapphire substrate with a CeO2 isolation layer, and a precursor film is obtained through drying and thermal decomposition processes. The Tl, Ba, Ca, and Cu of the prepared precursor film are The molar ratio of metal ions is 3.5:2:1:2.6;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温8h,冷却后粉碎再研磨,在流氧环境中890~940℃下恒温8h,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=2.6:2,在流氧环境中840~860℃下恒温2h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温4h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 8 hours, after cooling, pulverize and grind again, keep the temperature at 890-940℃ for 8 hours in the flowing oxygen environment, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl and Ba is Tl:Ba=2.6:2, Keep the temperature at 840-860°C for 2 hours in a flowing oxygen environment, crush and grind after cooling, and keep the temperature at 840-860°C for 4 hours in a flowing oxygen environment to obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:使用银箔或金箔把先驱膜与陪烧靶密封包裹,放入快速热处理设备的密闭石英管内,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: use silver foil or gold foil to seal and wrap the precursor film and the accompanying firing target, put them into the closed quartz tube of the rapid heat treatment equipment, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度5℃/s,在350~650℃温区,升温速度10℃/s,在650~780℃温区,升温速度10℃/s,在烧结温度730~780℃恒温60min,在冷却循环水作用下降至室温,得到初级样品;In argon environment: in the temperature range of 0-350°C, the heating rate is 5°C/s; in the temperature range of 350-650°C, the heating rate is 10°C/s; in the temperature range of 650-780°C, the heating rate is 10°C/s. Keep the sintering temperature at 730-780°C for 60 minutes, and cool down to room temperature under the action of cooling circulating water to obtain primary samples;
步骤四、补氧热处理:将步骤三制备的样品在流氧环境中,以速度5℃/s升温至350℃,然后以40℃/s升温至400~710℃温区恒温60min,在冷却循环水作用下降至室温,即得Tc为104K的Tl-2212纯相薄膜。Step 4. Oxygen supplement heat treatment: heat the sample prepared in step 3 to 350°C at a rate of 5°C/s in a flowing oxygen environment, and then raise the temperature to 400-710°C at a rate of 40°C/s for 60 minutes at a constant temperature in the cooling cycle. The effect of water drops to room temperature, and Tl-2212 pure phase film with Tc of 104K is obtained.
<实施例3><Example 3>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.4:1:2.2的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温6h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.6:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温4.5h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为45W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3:2:1:2.4;Step 1, preparing an amorphous precursor film containing thallium: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.4:1:2.2 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 6 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl and Ca is Tl:Ca=2.6:1, put them into a sealed crucible, and place them together in a sealed In the quartz tube, keep the constant temperature at 840-860°C for 4.5 hours in a flowing oxygen environment, and obtain the sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/ O2 mixed gas, the sputtering pressure is 2.2-6Pa, and the sputtering power is 45W; the molar ratio of Tl, Ba, Ca, and Cu metal ions in the prepared precursor film is 3:2:1:2.4;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温6h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1.8:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温1.5h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3.5h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 6h, after cooling, pulverize and then grind, repeat sintering once, add Tl 2 O 3 to mix and grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=1.8:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 1.5h in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C for 3.5h in the flowing oxygen environment, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:将先驱膜与陪烧靶密封包裹,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: seal and wrap the precursor film and the accompanying firing target, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度2.5℃/s,在350~650℃温区,升温速度5℃/s,在650~780℃温区,升温速度25℃/s,在烧结温度730~780℃恒温35min,在冷却循环水作用下降至室温,即得Tc为100K的Tl-2212纯相薄膜,如图1所示。In argon environment: in the temperature range of 0-350°C, the heating rate is 2.5°C/s; in the temperature range of 350-650°C, the heating rate is 5°C/s; in the temperature range of 650-780°C, the heating rate is 25°C/s. Keep the sintering temperature at 730-780°C for 35 minutes, cool down to room temperature under the action of cooling circulating water, and obtain a Tl-2212 pure-phase film with a Tc of 100K, as shown in Figure 1.
由图1可知,未经过补氧热处理的超导薄膜,其临界转变温度只有100K,这是在高温氩气下烧结,造成薄膜中出现氧缺失,需要进行补氧处理,从而提高其临界转变温度。It can be seen from Figure 1 that the critical transition temperature of the superconducting thin film without oxygen supplement heat treatment is only 100K. This is due to sintering under high temperature argon, which causes oxygen deficiency in the film, and oxygen supplement treatment is required to increase its critical transition temperature. .
<实施例4><Example 4>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.3:1:2.1的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温4h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.2:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温3h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为30W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为2.5:2:1:2.2;Step 1, preparing an amorphous precursor film containing thallium: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.3:1:2.1 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 4 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl to Ca is Tl:Ca=2.2:1, put them into a sealed crucible, and place them together in a sealed In a quartz tube, keep the constant temperature at 840-860°C for 3 hours in a flowing oxygen environment, and obtain a sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/O 2 mixed gas , the sputtering pressure is 2.2~6Pa, the sputtering power is 30W; the metal ion molar ratio of Tl, Ba, Ca and Cu of the prepared precursor film is 2.5:2:1:2.2;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温4h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温1h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 4 hours, crush and grind after cooling, repeat sintering once, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=1:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 1 hour in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C in the flowing oxygen environment for 3 hours, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:将先驱膜与陪烧靶密封包裹,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: seal and wrap the precursor film and the accompanying firing target, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度0.5℃/s,在350~650℃温区,升温速度1℃/s,在650~780℃温区,升温速度40℃/s,在烧结温度730~780℃恒温10min,在冷却循环水作用下降至室温;In argon environment: in the temperature range of 0-350°C, the heating rate is 0.5°C/s; in the temperature range of 350-650°C, the heating rate is 1°C/s; in the temperature range of 650-780°C, the heating rate is 40°C/s. Keep the sintering temperature at 730-780°C for 10 minutes, and cool down to room temperature under the action of cooling circulating water;
步骤四、补氧热处理:将步骤三制备的样品在流氧环境中,以速度1℃/s升温至350℃,然后以1℃/s升温至400~710℃温区恒温20min,在冷却循环水作用下降至室温,即得Tc为106.8K的Tl-2212纯相薄膜。Step 4. Oxygen supplement heat treatment: heat the sample prepared in step 3 to 350°C at a rate of 1°C/s in a flowing oxygen environment, and then raise the temperature to 400-710°C at a rate of 1°C/s for 20 minutes at a constant temperature in the cooling cycle. The effect of water dropped to room temperature, and Tl-2212 pure phase film with Tc of 106.8K was obtained.
<实施例5><Example 5>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.6:1:2.4的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温8h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=3:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温6h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为60W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3.5:2:1:2.6;Step 1. Preparation of thallium-containing amorphous precursor film: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.6:1:2.4 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 8 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl and Ca is Tl:Ca=3:1, put them into a sealed crucible, and put them together in a sealed In a quartz tube, keep the constant temperature at 840-860°C for 6 hours in a flowing oxygen environment, and obtain a sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/O 2 mixed gas , the sputtering pressure is 2.2~6Pa, the sputtering power is 60W; the metal ion molar ratio of Tl, Ba, Ca and Cu of the prepared precursor film is 3.5:2:1:2.6;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温8h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=2.6:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温2h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温4h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Constant temperature at ℃ for 8h, after cooling, pulverize and then grind, repeat sintering once, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=2.6:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 2 hours in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C in the flowing oxygen environment for 4 hours, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:将先驱膜与陪烧靶密封包裹,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: seal and wrap the precursor film and the accompanying firing target, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度5℃/s,在350~650℃温区,升温速度10℃/s,在650~780℃温区,升温速度10℃/s,在烧结温度730~780℃恒温60min,在冷却循环水作用下降至室温;In argon environment: in the temperature range of 0-350°C, the heating rate is 5°C/s; in the temperature range of 350-650°C, the heating rate is 10°C/s; in the temperature range of 650-780°C, the heating rate is 10°C/s. Keep the sintering temperature at 730-780°C for 60 minutes, and cool down to room temperature under the action of cooling circulating water;
步骤四、补氧热处理:将步骤三制备的样品在流氧环境中,以速度5℃/s升温至350℃,然后以40℃/s升温至400~710℃温区恒温60min,在冷却循环水作用下降至室温,即得Tc为106.8K的Tl-2212纯相薄膜。Step 4. Oxygen supplement heat treatment: heat the sample prepared in step 3 to 350°C at a rate of 5°C/s in a flowing oxygen environment, and then raise the temperature to 400-710°C at a rate of 40°C/s for 60 minutes at a constant temperature in the cooling cycle. The effect of water dropped to room temperature, and Tl-2212 pure phase film with Tc of 106.8K was obtained.
<实施例6><Example 6>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.4:1:2.2的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温6h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.6:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温4.5h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为45W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3:2:1:2.4;Step 1, preparing an amorphous precursor film containing thallium: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.4:1:2.2 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 6 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl and Ca is Tl:Ca=2.6:1, put them into a sealed crucible, and place them together in a sealed In the quartz tube, keep the constant temperature at 840-860°C for 4.5 hours in a flowing oxygen environment, and obtain the sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/ O2 mixed gas, the sputtering pressure is 2.2-6Pa, and the sputtering power is 45W; the molar ratio of Tl, Ba, Ca, and Cu metal ions in the prepared precursor film is 3:2:1:2.4;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温6h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1.8:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温1.5h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3.5h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 6h, after cooling, pulverize and then grind, repeat sintering once, add Tl 2 O 3 to mix and grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=1.8:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 1.5h in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C for 3.5h in the flowing oxygen environment, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:将先驱膜与陪烧靶密封包裹,并在密封氩气环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: seal and wrap the precursor film and the accompanying firing target, and sinter in a sealed argon environment:
氩气环境中:在0~350℃温区,升温速度2.5℃/s,在350~650℃温区,升温速度5℃/s,在650~780℃温区,升温速度25℃/s,在烧结温度730~780℃恒温35min,在冷却循环水作用下降至室温;In argon environment: in the temperature range of 0-350°C, the heating rate is 2.5°C/s; in the temperature range of 350-650°C, the heating rate is 5°C/s; in the temperature range of 650-780°C, the heating rate is 25°C/s. Keep the sintering temperature at 730-780°C for 35 minutes, and cool down to room temperature under the action of cooling circulating water;
步骤四、补氧热处理:将步骤三制备的样品在流氧环境中,以速度3℃/s升温至350℃,然后以20℃/s升温至400~710℃温区恒温40min,在冷却循环水作用下降至室温,即得Tc为106.8K的Tl-2212纯相薄膜,如图2、3、4所示。图2可以看出:薄膜除了Tl-2212超导相的(00l)衍射峰和基片峰外,没有其它取向的晶粒,薄膜为c轴取向生长;图3可以看出:薄膜表面具有层状生长结构、且无裂纹,表面有些小颗粒及少量小孔,这些小孔没有延伸到底部,对薄膜的超导性能影响较小;图4可以看出:薄膜的超导转变温度为106.8K。Step 4. Oxygen supplement heat treatment: heat the sample prepared in step 3 to 350°C at a rate of 3°C/s in a flowing oxygen environment, and then raise the temperature to 400-710°C at a rate of 20°C/s for 40 minutes at a constant temperature in the cooling cycle. The effect of water drops to room temperature, and the Tl-2212 pure phase film with Tc of 106.8K is obtained, as shown in Figures 2, 3, and 4. It can be seen from Figure 2 that except for the (00l) diffraction peak and the substrate peak of the Tl-2212 superconducting phase, the film has no grains of other orientations, and the film grows in the c-axis orientation; it can be seen from Figure 3 that there are layers on the surface of the film Shaped growth structure without cracks, some small particles and a small number of small holes on the surface, these small holes do not extend to the bottom, and have little effect on the superconducting properties of the film; Figure 4 shows that the superconducting transition temperature of the film is 106.8K .
<实施例7><Example 7>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.3:1:2.1的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温4h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.2:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温3h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为30W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为2.5:2:1:2.2;Step 1, preparing an amorphous precursor film containing thallium: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.3:1:2.1 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 4 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl to Ca is Tl:Ca=2.2:1, put them into a sealed crucible, and place them together in a sealed In a quartz tube, keep the constant temperature at 840-860°C for 3 hours in a flowing oxygen environment, and obtain a sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/O 2 mixed gas , the sputtering pressure is 2.2~6Pa, the sputtering power is 30W; the metal ion molar ratio of Tl, Ba, Ca and Cu of the prepared precursor film is 2.5:2:1:2.2;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温4h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温1h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 4 hours, crush and grind after cooling, repeat sintering once, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=1:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 1 hour in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C in the flowing oxygen environment for 3 hours, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:使用银箔或金箔将先驱膜与陪烧靶密封包裹,放入快速热处理设备的密闭石英管内,并在流氧环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: use silver foil or gold foil to seal and wrap the precursor film and the accompanying firing target, put them into the closed quartz tube of the rapid heat treatment equipment, and sinter in the flowing oxygen environment:
流氧环境中:氧气压力为1atm,在0~350℃温区,升温速度0.5℃/s,在350~650℃温区,升温速度1℃/s,在650~860℃温区,升温速度40℃/s,在烧结温度810~860℃恒温10min,在冷却循环水作用下降至室温,即得Tc为104K的Tl-2212纯相薄膜。In the oxygen flow environment: the oxygen pressure is 1 atm, the temperature rise rate is 0.5°C/s in the temperature range of 0-350°C, the temperature rise rate is 1°C/s in the temperature range of 350-650°C, and the temperature rise rate is 1°C/s in the temperature range of 650-860°C. 40°C/s, keep the sintering temperature at 810-860°C for 10 minutes, and cool down to room temperature under the action of cooling circulating water to obtain a Tl-2212 pure phase film with a Tc of 104K.
<实施例8><Embodiment 8>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.6:1:2.4的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温8h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=3:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温6h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为60W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3.5:2:1:2.6;Step 1. Preparation of thallium-containing amorphous precursor film: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.6:1:2.4 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 8 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl and Ca is Tl:Ca=3:1, put them into a sealed crucible, and put them together in a sealed In a quartz tube, keep the constant temperature at 840-860°C for 6 hours in a flowing oxygen environment, and obtain a sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/O 2 mixed gas , the sputtering pressure is 2.2~6Pa, the sputtering power is 60W; the metal ion molar ratio of Tl, Ba, Ca and Cu of the prepared precursor film is 3.5:2:1:2.6;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温8h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=2.6:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温2h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温4h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Constant temperature at ℃ for 8h, after cooling, pulverize and then grind, repeat sintering once, add Tl 2 O 3 to mix, grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=2.6:2, seal it with a crucible and place it in a sealed quartz In the tube, keep the constant temperature at 840-860°C for 2 hours in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C in the flowing oxygen environment for 4 hours, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:使用银箔或金箔将先驱膜与陪烧靶密封包裹,放入快速热处理设备的密闭石英管内,并在流氧环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: use silver foil or gold foil to seal and wrap the precursor film and the accompanying firing target, put them into the closed quartz tube of the rapid heat treatment equipment, and sinter in the flowing oxygen environment:
流氧环境中:氧气压力为1atm,在0~350℃温区,升温速度5℃/s,在350~650℃温区,升温速度10℃/s,在650~860℃温区,升温速度10℃/s,在烧结温度810~860℃恒温30min,在冷却循环水作用下降至室温,即得Tc为104K的Tl-2212纯相薄膜。In the oxygen flow environment: the oxygen pressure is 1atm, in the temperature range of 0-350°C, the heating rate is 5°C/s; in the temperature range of 350-650°C, the heating rate is 10°C/s; 10°C/s, keep the sintering temperature at 810-860°C for 30 minutes, and cool down to room temperature under the action of cooling circulating water to obtain a Tl-2212 pure phase film with a Tc of 104K.
<实施例9><Example 9>
一种Tl-2212超导薄膜的快速烧结制备方法,衬底为铝酸镧,包括:A kind of rapid sintering preparation method of Tl-2212 superconducting film, substrate is lanthanum aluminate, comprising:
步骤一、制备含铊的非晶态先驱膜:将金属离子摩尔比为Ba:Ca:Cu=2.4:1:2.2的BaO2或BaO、CaO或CaCO3和CuO为起始材料混合研磨,在流氧环境中890~940℃温度下恒温6h,加入Tl2O3混合研磨压片,使Tl与Ca的摩尔比为Tl:Ca=2.6:1,放入密封坩埚内,一起置于密封的石英管中,在流氧环境中840~860℃下恒温4.5h,冷却后得到溅射靶;对溅射靶采用射频磁控溅射,溅射气体为高纯Ar、或Ar/O2混合气,溅射气压为2.2~6Pa,溅射功率为45W;制得的先驱膜的Tl、Ba、Ca、Cu的金属离子摩尔比为3:2:1:2.4;Step 1, preparing an amorphous precursor film containing thallium: BaO 2 or BaO, CaO or CaCO 3 and CuO with a metal ion molar ratio of Ba:Ca:Cu=2.4:1:2.2 are mixed and ground as starting materials, and the Keep the temperature at 890-940°C for 6 hours in a flowing oxygen environment, add Tl 2 O 3 to mix, grind and press tablets, so that the molar ratio of Tl and Ca is Tl:Ca=2.6:1, put them into a sealed crucible, and place them together in a sealed In the quartz tube, keep the constant temperature at 840-860°C for 4.5 hours in a flowing oxygen environment, and obtain the sputtering target after cooling; use radio frequency magnetron sputtering for the sputtering target, and the sputtering gas is high-purity Ar or Ar/ O2 mixed gas, the sputtering pressure is 2.2-6Pa, and the sputtering power is 45W; the molar ratio of Tl, Ba, Ca, and Cu metal ions in the prepared precursor film is 3:2:1:2.4;
步骤二、制备含铊的陪烧靶:将金属离子摩尔比为Ba:Ca:Cu=2:2:3的BaO2、CaO和CuO为起始材料混合研磨,在流氧环境中890~940℃下恒温4~8h,冷却后粉碎再研磨,重复烧结一次,加入Tl2O3混合研磨压片,使Tl与Ba的摩尔比为Tl:Ba=1.8:2,用坩埚密封后置于密封的石英管内,在流氧环境中840~860℃下恒温1.5h,冷却后粉碎再研磨,在流氧环境中840~860℃下恒温3.5h,得到陪烧靶;Step 2. Preparation of thallium-containing burner target: Mix and grind BaO 2 , CaO and CuO with a metal ion molar ratio of Ba:Ca:Cu=2:2:3 as starting materials. Keep the temperature at ℃ for 4-8 hours, cool down, pulverize and then grind, repeat sintering once, add Tl 2 O 3 to mix and grind and press into tablets, so that the molar ratio of Tl to Ba is Tl:Ba=1.8:2, seal with a crucible and place in a sealed In the quartz tube, keep the constant temperature at 840-860°C for 1.5h in the flowing oxygen environment, crush and grind after cooling, keep the constant temperature at 840-860°C for 3.5h in the flowing oxygen environment, and obtain the burning target;
步骤三、先驱膜与陪烧靶快速烧结:使用银箔或金箔将先驱膜与陪烧靶密封包裹,放入快速热处理设备的密闭石英管内,并在流氧环境中烧结:Step 3. Rapid sintering of the precursor film and the accompanying firing target: use silver foil or gold foil to seal and wrap the precursor film and the accompanying firing target, put them into the closed quartz tube of the rapid heat treatment equipment, and sinter in the flowing oxygen environment:
流氧环境中:氧气压力为1atm,在0~350℃温区,升温速度2.5℃/s,在350~650℃温区,升温速度5℃/s,在650~860℃温区,升温速度25℃/s,在烧结温度810~860℃恒温20min,在冷却循环水作用下降至室温,即得Tc为104K的Tl-2212纯相薄膜,如图5和图6所示。In the oxygen flow environment: the oxygen pressure is 1 atm, the temperature rise rate is 2.5°C/s in the temperature range of 0-350°C, the temperature rise rate is 5°C/s in the temperature range of 350-650°C, and the temperature rise rate is 5°C/s in the temperature range of 650-860°C. 25°C/s, keep the sintering temperature at 810-860°C for 20 minutes, cool down to room temperature under the action of cooling circulating water, and obtain a Tl-2212 pure phase film with a Tc of 104K, as shown in Figure 5 and Figure 6.
<对比例1><Comparative example 1>
同实施例6,不同的是,未采用三段升温工艺,步骤三、步骤四的烧结工艺为改为一段升温工艺,即在室温下以大于25℃/s的速度直接升温至780℃,然后恒温10~60min。采用这种方法制备得到的超导薄膜,其表面有明显的裂纹,影响薄膜的超导性能。The same as in Example 6, the difference is that the three-stage heating process is not used, and the sintering process of steps 3 and 4 is changed to a one-stage heating process, that is, the temperature is directly raised to 780 °C at a rate greater than 25 °C/s at room temperature, and then Constant temperature 10 ~ 60min. The superconducting film prepared by this method has obvious cracks on the surface, which affects the superconducting performance of the film.
<对比例2><Comparative example 2>
同实施例6,不同的是,未采用三段升温工艺,步骤三、步骤四的烧结工艺改为传统的一段低速升温烧结工艺:即在室温下以0.5~10℃/s的速度直接升温至730~780℃,然后恒温10~60min。Same as Example 6, the difference is that the three-stage heating process is not adopted, and the sintering process of steps 3 and 4 is changed to a traditional one-stage low-speed heating sintering process: that is, the temperature is directly raised to 730~780℃, then keep the temperature for 10~60min.
对比例1制备的超导薄膜出现裂纹,说明在一段升温工艺中,如果升温速度太快(大于25℃/s),将使薄膜内微区所受应力不均,造成薄膜开裂,严重降低薄膜的超导性能。Cracks appeared in the superconducting thin film prepared in Comparative Example 1, indicating that in a heating process, if the heating rate is too fast (greater than 25°C/s), the stress on the micro-regions in the thin film will be uneven, resulting in cracking of the thin film and seriously reducing the thickness of the thin film. superconducting properties.
对比例2,采用传统的一段低速升温烧结工艺制备Tl-2212超导薄膜,这种烧结工艺受先驱膜的沉积方法、铊源陪烧靶的起始材料的粉体颗粒大小及其制备方法的影响很大。更换原材料的厂家、以及先驱膜的沉积方法,就必须花费大量时间重新探索其制备工艺。其原因是:(1)先驱膜制备方法不同,原材料的厂家不同,先驱膜和陪烧靶的非晶态颗粒的大小也不同,因此Tl2O3的挥发温度就相差很大;(2)而要制备高质量的Tl-2212薄膜,在高温烧结过程中先驱膜的Tl挥发与陪烧靶提供的Tl补充要形成一个动态平衡;(3)挥发温度的差异造成了烧结工艺的巨大改变,这需要较长时间的探索。比如,如果制备陪烧靶的粉体颗粒大于先驱膜的颗粒,则陪烧靶中Tl2O3的挥发温度就大于先驱膜的挥发温度,使得先驱膜在低速升温至恒温温度前就部分挥发或完全挥发了,这样得到的薄膜是混合相薄膜,其临界温度很低或不超导。Comparative example 2, a Tl-2212 superconducting thin film was prepared by a traditional one-stage low-speed heating sintering process. This sintering process is affected by the deposition method of the precursor film, the powder particle size of the starting material of the thallium source accompanying firing target, and its preparation method. great influence. Changing the manufacturer of raw materials and the deposition method of the precursor film requires a lot of time to re-explore its preparation process. The reasons are: (1) The preparation method of the precursor film is different, the manufacturer of the raw material is different, and the size of the amorphous particles of the precursor film and the burning target is also different, so the volatilization temperature of Tl 2 O 3 is very different; (2) In order to prepare high-quality Tl-2212 films, a dynamic balance must be formed between the Tl volatilization of the precursor film and the Tl supplement provided by the burner target during the high-temperature sintering process; (3) the difference in volatilization temperature caused a huge change in the sintering process, This requires a longer exploration. For example, if the powder particles of the prepared burner target are larger than the particles of the precursor film, the volatilization temperature of Tl 2 O 3 in the burner target is higher than that of the precursor film, so that the precursor film will be partially volatilized before the temperature is raised to a constant temperature at a low speed. Or completely volatilized, the film obtained in this way is a mixed phase film, and its critical temperature is very low or not superconducting.
与传统烧结工艺相比较,实施例6单个样品的制备时间约4h,传统烧结工艺单个样品的制备时间约20h,实施例6缩短了制备时间、降低了电能消耗。Compared with the traditional sintering process, the preparation time of a single sample in Example 6 is about 4 hours, and the preparation time of a single sample in the traditional sintering process is about 20 hours. Example 6 shortens the preparation time and reduces the power consumption.
<对比例3><Comparative example 3>
同实施例6,不同的是,步骤二中传统陪烧靶的制备工艺一般为:所使用陪烧靶的组分比分别为Tl:Ba:Ca:Cu=2~2.5:2:2:3。The same as Example 6, the difference is that the preparation process of the traditional burning target in step 2 is generally: the component ratios of the burning target used are respectively Tl:Ba:Ca:Cu=2~2.5:2:2:3 .
很明显,实施例6的单个陪烧靶Tl含量变化范围更大,增加了成品率;其使用量可以减少一半,降低了制备成本(陪烧靶的成本主要由Tl含量来决定)。同时,实施例6由于采用了快速升温烧结和样品完全密封,单个陪烧靶的有效使用次数为传统方法的5~6倍,结合这两个方面,将使材料成本降低10多倍。Obviously, the single burning target Tl content variation range of embodiment 6 is larger, has increased yield; Its usage can be reduced by half, has reduced preparation cost (the cost of burning target is mainly determined by Tl content). At the same time, due to the rapid heating sintering and complete sealing of the sample in Example 6, the effective use times of a single burner target is 5-6 times that of the traditional method. Combining these two aspects will reduce the material cost by more than 10 times.
这里说明的设备数量和处理规模是用来简化本发明的说明的。对本发明的应用、修改和变化对本领域的技术人员来说是显而易见的。The number of devices and processing scales described here are used to simplify the description of the present invention. Applications, modifications and variations to the present invention will be apparent to those skilled in the art.
尽管本发明的实施方案已公开如上,但其并不仅仅限于说明书和实施方式中所列运用,它完全可以被适用于各种适合本发明的领域,对于熟悉本领域的人员而言,可容易地实现另外的修改,因此在不背离权利要求及等同范围所限定的一般概念下,本发明并不限于特定的细节和这里示出与描述的实施例。Although the embodiment of the present invention has been disclosed as above, it is not limited to the use listed in the specification and implementation, it can be applied to various fields suitable for the present invention, and it can be easily understood by those skilled in the art Therefore, the invention is not limited to the specific details and embodiments shown and described herein without departing from the general concept defined by the claims and their equivalents.
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