CN107433777A - Jet head liquid and liquid injection apparatus - Google Patents
Jet head liquid and liquid injection apparatus Download PDFInfo
- Publication number
- CN107433777A CN107433777A CN201710384419.5A CN201710384419A CN107433777A CN 107433777 A CN107433777 A CN 107433777A CN 201710384419 A CN201710384419 A CN 201710384419A CN 107433777 A CN107433777 A CN 107433777A
- Authority
- CN
- China
- Prior art keywords
- chip
- ink
- spray
- head
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/1433—Structure of nozzle plates
Abstract
The present invention provides the jet head liquid and liquid injection apparatus that situation about can be mixed to the ink to be spued from each head module in spit face is suppressed.Specifically, possess：Head chip, it is respectively formed with the discharge passage for being filled ink, and is set up in parallel along Y-direction；Nozzle plate (32), it is fixed on each head chip, and the nozzle bore (131A~131D) connected formed with the passage with each head chip together；And second bonding region (151), it is located on the Z-direction end face of nozzle plate (32), and will separate between second nozzle hole (131B) and second nozzle hole (131C).
Description
Technical field
The present invention relates to jet head liquid and liquid injection apparatus.
Background technology
All the time, as the ink to the printing medium discharge droplet-like such as recording sheet, to be recorded to printing medium
The device of image, character, the ink-jet printer for possessing ink gun be present.Ink gun is, for example, as multiple head moulds corresponding with colors
Block is equipped on balladeur train and formed (for example, following patent literature 1).
Above-mentioned head module possesses a chip, and this chip is formed with the passage for being filled ink.Nozzle plate is engaged in above-mentioned
Head chip.
In ink gun, changed by volume in passage, the ink in passage passes through the nozzle bore that is formed in nozzle plate
And spued.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2015-120265 publications.
The content of the invention
The invention problem to be solved
Accordingly, there exist in above-mentioned ink gun, nozzle bore corresponding with each head module is formed at a piece of nozzle plate, and will be a piece of
The situation that nozzle plate engages together relative to the head chip of multiple head modules.Think according to this composition, with nozzle plate is connect respectively
Compared together in the situation of each head module, it is possible to increase the positional precision of the nozzle bore between each head module.
But in the above-described configuration, exist among the ink to be spued from each head module, be attached to nozzle plate spit face
The risk that the ink in (face that nozzle bore is open) mixes in spit face.
The present invention allows for such a situation and completed, can be to the ink that is spued from each head module its object is to provide
The jet head liquid and liquid injection apparatus that the situation that water mixes in spit face is suppressed.
The solution used to solve the problem
In order to solve the above problems, the jet head liquid involved by of the invention mode possesses：First chip and
Two chips, first chip and second chip are respectively formed with the passage for being filled liquid, and along first party
To being set up in parallel；Spray orifice plate, it is fixed on first chip and second chip together, and formed with
First spray-hole of the passage connection of first chip and connect with the passage of second chip
Second spray-hole；And lattice, its direction and first chip and described second among the injection orifice plate
On the jet face of the opposite side of head chip, it will separate between first spray-hole and second spray-hole.
According to this composition, the liquid of jet face of injection orifice plate is attached between the first spray-hole and the second spray-hole
Blocked by lattice.Thereby, it is possible to suppress spraying from the liquid of the first spray-hole injection and from the liquid of the second spray-hole injection
Situation about mixing and escaping to outside jet head liquid is penetrated on face.As a result, the jet head liquid of excellent reliability can be provided.
In aforesaid way, the injection orifice plate can also be bonded and fixed to first chip and described second
Chip, the part among the injection orifice plate between first spray-hole and second spray-hole, formed with edge
Slit of the normal direction of the jet face through the injection orifice plate.
According to aforesaid way, after injection orifice plate is pasted on into a chip, when injection orifice plate solidifies with bonding agent
Temperature change and during dilation, expanded by slit and reduced, the deformation of injection orifice plate can be absorbed.Thereby, it is possible to ensure
The positional precision relative to head chip of orifice plate is sprayed, and can suppress to spray stripping of orifice plate etc..
In aforesaid way, can also have：Base unit, it is to first chip and second chip
It is supported, and is adhesively fixed with the injection orifice plate；And spray-hole protector, it is formed with making first spray-hole
And the exposed hole that second spray-hole exposes, and the opposite side of the injection orifice plate from the base unit is clipped between
The injection orifice plate is covered, and the lattice is the base unit and the spray-hole protector to be fixed by the slit
Bonding agent.
According to aforesaid way, base unit and spray-hole protector are bonded by slit, so as to injection orifice plate
In the case that jet face implements water repellent processing, spray-hole protector can be also bonded.Further, since base unit and injection
Hole protector is connected by bonding agent, therefore can be reliably suppressed from the liquid of the first spray-hole injection and from the second spray-hole
The situation that the liquid of injection mixes on jet face.
In aforesaid way, can also possess：First manifold, it is relative to first chip in the first direction
On adjacently configure, support first chip using the supporting surface towards the first direction, and with it is described
The liquid flow path of passage connection；First driving substrate, it is supported by the supporting surface of first manifold, and with described the
One chip electrical connection；Second manifold, it is adjacently configured in said first direction relative to second chip, is utilized
Second chip is supported towards the supporting surface of the first direction, and with the liquid flow connected with the passage
Road；And the second driving substrate, it is supported by the supporting surface of second manifold, and is electrically connected with second chip
Connect.
According to aforesaid way, head chip and driving substrate are supported by the supporting surface of the manifold with liquid flow path.Therefore,
Such as with using the two of the first direction of manifold face come branch fastener chip respectively, drive substrate composition compared with, can realize
The miniaturization of jet head liquid in a first direction.
Further, since head chip and driving substrate by manifold support, therefore head chip, driving substrate in caused heat
Outside is rejected heat to via manifold.Thereby, it is possible to ensure a chip and drive the heat dispersion of substrate.
A chip and driving substrate are additionally, since by the manifold support with liquid flow path, therefore can be utilized in head core
Produced in piece, driving substrate and be transferred to the discharge heat of manifold to be heated to the liquid flowed in liquid flow path.By
This, can obtain outstanding lettering characteristic with the correct chip supply liquid of desired temperature (viscosity).
Liquid injection apparatus involved by the mode of the present invention possesses the jet head liquid involved by aforesaid way.
According to aforesaid way, using the teaching of the invention it is possible to provide the liquid injection apparatus of excellent reliability.
Invention effect
According to the mode of the present invention, using the teaching of the invention it is possible to provide the feelings that can be mixed to the ink to be spued from each head module in spit face
Condition is suppressed, and the jet head liquid and liquid injection apparatus of excellent reliability.
Brief description of the drawings
Fig. 1 is the summary pie graph of the ink-jet printer involved by embodiment；
Fig. 2 is the stereogram of the ink gun involved by embodiment；
Fig. 3 is the stereogram of state for showing to unload a part for the ink gun involved by embodiment；
Fig. 4 is the stereogram of the first head module involved by embodiment；
Fig. 5 is the exploded perspective view of the head chip involved by embodiment；
Fig. 6 is the exploded perspective view of the manifold involved by embodiment；
Fig. 7 is the exploded perspective view of substrate parts involved by embodiment, nozzle plate and nozzle guard part；
Fig. 8 is the portion bottom surface figure of the ink gun involved by embodiment in terms of -Z direction；
Fig. 9 is the sectional view of the ink gun involved by the variation of embodiment.
Embodiment
Hereinafter, with reference to the accompanying drawings of embodiment involved in the present invention.In the following embodiments, lift and utilize ink
Illustrated exemplified by the ink-jet printer (hreinafter referred to as printer) that (liquid) is recorded to printing medium.In addition,
In the accompanying drawing used in the following description, in order that each part is the size that can be identified, the ratio of each part is suitably changed
Chi.
[printer]
Fig. 1 is the summary pie graph of printer 1.
As shown in figure 1, the printer 1 of present embodiment possesses a pair of conveyers 2,3, ink supplying mechanism 4, ink gun
5A, 5B and sweep mechanism 6.In addition, in the following description, said as needed using X, Y, Z orthogonal coordinate system
It is bright.In this case, X-direction is consistent with printing medium P (for example, paper etc.) carriage direction (sub-scanning direction).Y-direction
(first direction) is consistent with the scanning direction (main scanning direction) of sweep mechanism 6.Z-direction (normal direction) represent with X-direction with
And the short transverse that Y-direction is orthogonal.In the following description, among X-direction, Y-direction and Z-direction, by arrow side in figure
To as just (+) direction, illustrated the direction opposite with arrow as negative (-) direction.
Conveyer 2,3 transports printing medium P along +X direction.Specifically, conveyer 2 possesses extends along Y-direction
The grid roller (grid roller) 11 of setting, with grid roller 11 extend parallel to set pinch roll (pinch roller) 12,
And make the drive mechanisms (not shown) such as the motor that grid roller 11 is pivoted.Similarly, conveyer 3 possesses prolongs along Y-direction
The grid roller 13 of setting is stretched, the pinch roll 14 of setting is extended parallel to grid roller 13 and makes what grid roller 13 was pivoted
Drive mechanism (not shown).
Ink supplying mechanism 4 possesses the ink storage tank 15 that accommodates ink and by ink storage tank 15 and ink gun 5A, 5B
The ink pipe arrangement 16 of connection.
In the present embodiment, ink storage tank 15 is arranged with multiple in X direction.In each ink storage tank 15, such as distinctly
Ground accommodates Huang, fuchsin, green grass or young crops, the ink of this black four color.
Ink pipe arrangement 16 is, for example, the flexible hose with pliability.Ink pipe arrangement 16 is by each ink storage tank 15 and each ink-jet
Connected between head 5A, 5B.
Sweep mechanism 6 makes ink gun 5A, 5B along Y-direction shuttle-scanning.Specifically, scanning element 6 possesses prolongs along Y-direction
Stretch setting a pair of guide rails 21,22, the balladeur train 23 that is supported by a pair of guide rails 21,22 in a manner of it can move and make balladeur train
23 drive mechanisms 24 moved along Y-direction.
Drive mechanism 24 is configured between guide rail 21,22 in the X direction.Drive mechanism 24 possesses separate in the Y direction between
A pair of pulleys 25 every ground configuration, 26, the endless belt 27 that is wound between a pair of pulleys 25,26 and make a pulley 25
Carry out the drive motor 28 of rotation driving.
Balladeur train 23 is linked to endless belt 27.Multiple ink gun 5A, 5B are equipped on balladeur train in the state of being arranged along Y-direction
23.Each ink gun 5A, 5B are formed in a manner of each ink gun 5A, 5B can spue double-colored ink.Thus, in this embodiment party
In the printer 1 of formula, the ink for the mutually different two kinds of colors that spued respectively by each ink gun 5A, 5B, with can spue it is yellow,
Fuchsin, green grass or young crops, the mode of this black four chromatic ink are formed.
<Ink gun>
Fig. 2 is ink gun 5A stereogram.In addition, ink gun 5A, 5B are equal in addition to the color for the ink being supplied to
Composition.Therefore, in the following description, ink gun 5A is illustrated, and omits ink gun 5B explanation.
As shown in Fig. 2 the ink gun 5A of present embodiment is head module 30A~30D, buffer 31, nozzle plate (spray-hole
Plate) 32, nozzle guard part (spray-hole protector) 33 etc. is equipped on substrate parts (base unit) 38 and forms.In addition,
In Fig. 2, the diagram of the lid of covering head module 30A~30D, buffer 31 etc. etc. is eliminated.
(substrate parts)
Fig. 3 is the stereogram of state for showing to unload an ink gun 5A part.
As shown in figure 3, substrate parts 38 are formed as using Z-direction as thickness direction, and using X-direction as longer direction
Tabular.Substrate parts 38 have to each head module 30A~30D module maintaining parts 41 kept and for by basal part
Part 38 is fixed on the balladeur train fixed part 42 of balladeur train 23 (reference picture 1).In addition, in the present embodiment, substrate parts 38 are by metal
Material is integrally formed.
Module maintaining part 41 is formed as frame-shaped in the plan view in terms of Z-direction.That is, the XY among module maintaining part 41
Central portion in plane, formed with the mounting opening 44 for running through substrate parts 38 along Z-direction.In the middle position of module maintaining part 41
In a pair of short edges portion 45 of X-direction both sides, insertion groove 46 is respectively formed with.The insertion groove 46 of present embodiment will be in each short leg
Insertion groove 46 opposite in the X direction is with each other as one group among 45 insertion grooves 46 formed, and interval shape in the Y direction
Into having multigroup (for example, four groups).
Each insertion groove 46 is recessed in X direction relative to the inner peripheral surface of short leg 45, and runs through short leg 45 along Z-direction.
That is, insertion groove 46 connects with mounting opening 44.Head module 30A~30D is able to insertion, and opposite each group is inserted in the X direction
Enter in groove 46.Among each group insertion groove 46, the inner surface of an insertion groove 46, the first work is configured with towards another insertion groove 46
With part (not shown), first functional component acts on head module 30A~30D towards the side of X-direction.In present embodiment
In, the first functional component is formed as leaf spring like.
The +Z direction end of the slave module maintaining part 41 of balladeur train fixed part 42 is stretched out to X/Y plane.In balladeur train fixed part 42, shape
Into having for substrate parts 38 to be installed on to mounting hole of balladeur train 23 (reference picture 1) etc..
(head module)
As shown in Fig. 2 head module 30A~30D is with can be by the ink supplied from ink storage tank 15 (reference picture 1) towards being recorded Jie
The mode that matter P spues is formed.Head module 30A~30D is equipped with multiple on substrate parts 38 along Y-direction interval.At this
In embodiment, the first head module 30A, the second head module 30B, the 3rd head module 30C and the 4th head module 30D this four head
Module is mounted on substrate parts 38.
In the ink gun 5A of present embodiment, among four head module 30A~30D, with two head modules discharges one
The ink of kind color.Specifically, the first head module 30A and the second head module 30B are in a manner of the same chromatic ink that can spue
Form, the 3rd head module 30C and the 4th head module 30D are formed in a manner of the same chromatic ink that can spue.In addition, it is mounted in base
The quantity of head module 30A~30D on bottom parts 38, can be suitably from head module 30A~30D species of ink etc. to spue
Change.Further, since each head module 30A~30D includes corresponding composition respectively, therefore in the following description, by the first head mould
Block 30A is illustrated as an example.
Fig. 4 is the first head module 30A stereogram.
As shown in figure 4, the first head module 30A mainly possesses a chip 51, manifold 52 and driving substrate 53.
(head chip)
Fig. 5 is the exploded perspective view of a chip 51.
As shown in figure 5, head chip 51 is from bearing of trend (Z-direction) end discharge ink of aftermentioned discharge passage 57,
Type (edge shoot type) is penetrated on so-called side.Specifically, head chip 51 by activation plate 55 and cover plate 56 along Y-direction weight
Close and form.
Activation plate 55 is that polarised direction through-thickness (Z-direction) is set as unidirectional so-called unipolar basic plate.In addition, promote
The ceramic substrate such as including PZT (lead zirconate titanate) is preferably used in dynamic plate 55.In addition, activation plate 55 will can also polarize
Direction in the Y direction different two panels piezoelectric substrate stackings and formed (so-called chevron (chevron) type).
Towards the face (hereinafter referred to as " surface ") of +Y direction among activation plate 55, interval is set up in parallel in X direction
There are multiple passages 57,58.Each passage 57,58 is formed as linear along Z-direction respectively.- Z of each passage 57,58 in activation plate 55
The upper shed of direction end face, and in the +Z direction end terminal of activation plate 55.In addition, each passage 57,58 can also be relative to Z side
To obliquely extending.
Above-mentioned multiple passages 57,58 are to be filled the discharge passage 57 of ink and be not filled the non-discharge of ink to lead to
Road 58.Discharge passage 57 and non-discharge passage 58 are alternately arranged configuration in the X direction.Each passage 57,58 is by by activation plate
The 55 driving walls 61 formed separate in X direction respectively.In addition, in the inner surface of passage 57,58, electricity is driven formed with (not shown)
Pole.
Cover plate 56 is formed as rectangular shape in the front view in terms of Y-direction.Cover plate 56 is in+Z the sides for making activation plate 55
The surface of activation plate 55 is engaged in the state of prominent to end.
Cover plate 56 have formed towards the face of +Y direction (hereinafter referred to as " surface ") common ink chamber 62, Yi Ji
The multiple slits 63 formed towards the face (hereinafter referred to as " back side ") of -Y direction.
Common ink chamber 62 is formed in the position equal with the +Z direction end of discharge passage 57 in z-direction.Common ink
Hydroecium 62 is recessed from the surface of cover plate 56 towards -Y direction, and is extended in X direction.Ink is flowed into altogether by above-mentioned manifold 52
Logical ink chamber 62.
Slit 63 is formed among common ink chamber 62 and the opposite position in the Y direction of discharge passage 57.Slit 63 will
With being connected severally in each discharge passage 57 in common ink chamber 62.On the other hand, non-discharge passage 58 not with common ink chamber
Connected in 62.
As shown in figure 4, biography is installed towards the face (hereinafter referred to as " back side ") of -Y direction among above-mentioned activation plate 55
Hot plate 65.Heat transfer plate 65 is formed by the outstanding material of heat conductivity (for example, aluminium etc.).Heat transfer plate 65 the back side of activation plate 55 with
The mode for covering the four corner of each passage 57,58 is set.In addition, the size of heat transfer plate 65, position can be changed suitably.
(manifold)
As shown in figure 3, manifold 52 has the ink flow path 71 (reference picture 6) that ink circulates towards above-mentioned head chip 51.Manifold 52 is whole
The bodily form turns into the tabular using Y-direction as thickness direction.Manifold 52 is opposite in the X direction among above-mentioned insertion groove 46 by inserting
One group of insertion groove 46 in and kept in the state of being erected to +Z direction by substrate parts 38.As shown in figure 4, in manifold 52
-Z direction end, at the both ends of X-direction, provided with the second functional component 70.Second functional component 70 is in insertion groove 46
Acted between the inner surface and manifold 52 of insertion groove 46, and by the first head module 30A to -Y direction.In present embodiment
In, the second functional component 70 is formed as leaf spring like.
Fig. 6 is the exploded perspective view of manifold 52.
As shown in fig. 6, manifold 52 has channel member 72 and coincides with the liquid cover 73 of channel member 72 in the Y direction.
Channel member 72 is integrally formed by the outstanding material of heat conductivity.In the present embodiment, in channel member 72
Material in, it is preferred to use metal material (for example, aluminium etc.).
Channel member 72 possesses stream plate 75 and flows into port 76.
Stream plate 75 is formed as the rectangular plate-like using Y-direction as thickness direction.Towards -Y direction among stream plate 75
Face, formed with ink flow path 71.Ink flow path 71 is formed as the channel-shaped being recessed to +Y direction.Specifically, ink flow path 71
With sinuous portion 79 and interconnecting part 80.
Wriggle and extend along Z-direction in X direction in sinuous portion 79.The +Z direction end in sinuous portion 79 connects with flowing into port 76
It is logical.On the other hand, the -Z direction end in sinuous portion 79 connects at the X-direction central portion of stream plate 75 with interconnecting part 80.In addition,
If wriggle portion 79 sinuous direction with relative to by sinuous portion 79 and flow into port 76 connected component and the and of sinuous portion 79
The elongated mode of the straight line that links between the connected component of interconnecting part 80 is wriggled, then can suitably be changed.For example, portion 79 of wriggling
It can also be the composition wriggled along Z-direction and extended in X direction.
Interconnecting part 80 extends in X direction in the -Z direction end of stream plate 75.Interconnecting part 80 is from the front in terms of Y-direction
Formed and the equal shape of common ink chamber 62 in view.
In the first head module 30A, the end that port 76 is located at -X direction among the +Z direction end face of stream plate 75 is flowed into
Portion.Flow into the tubular that port 76 is formed as being provided projectingly from stream plate 75 towards +Z direction.Flow into port 76 -Z direction end with
Above-mentioned sinuous portion 79 connects.
Liquid cover 73 has the profile equal with stream plate 75 in the front view in terms of Y-direction, and is formed as Y side
To the thin rectangular plate-like of thickness ratio stream plate 75.Liquid cover 73 is fixed among stream plate 75 towards the face of -Y direction, with from-
Y-direction closes above-mentioned ink flow path 71.The position overlapped among liquid cover 73 in terms of Y-direction with interconnecting part 80, formed with making
The unlimited intercommunicating pore 82 of interconnecting part 80.Intercommunicating pore 82 is formed and the equal shape of interconnecting part 80 in the front view in terms of Y-direction
Shape.
In addition, in the present embodiment, liquid cover 73 is by the outstanding metal material of heat conductivity (for example, stainless steel etc.) shape
Into.In addition, though in the present embodiment, the situation that channel-shaped ink flow path 71 is only formd in channel member 72 is said
It is bright, but be not limited only to this composition, at least channel member 72 and liquid cover 73 at least one of form ink flow path and be
Can.In this case, for example can also form groove portion respectively in channel member 72 and liquid cover 73, and make channel member 72 and
The groove portion of liquid cover 73 is overlapped to form ink flow path.
In the face towards -Y direction of liquid cover 73, provided with insulating trip 86.Insulating trip 86 is from the front view in terms of Y-direction
In be formed as frame-shaped.Insulating trip 86 is surrounded around intercommunicating pore 82 at the face towards -Y direction of liquid cover 73.Insulating trip 86
The face towards -Y direction of liquid cover 73 is fixed on by bonding etc..In addition, in the present embodiment, insulating trip 86 is for example excellent
Selection of land uses polyimides.But if the material of insulating trip 86 is by with the characteristic (dielectric that can fully reduce stray capacitance
Constant (Lure Electricity rates) low material, material that dielectric constant reduces etc. can be made by small space length), it is resistance to ink
(resistance to stripping property), and material (such as the resin material, elastomeric material) shape of more soft (Young's modulus (ヤ Application グ rates) is small)
Into then can suitably changing.
Here, as shown in Fig. 4, Fig. 6, above-mentioned head chip 51 by insulating trip 86 be clipped between be fixed on the court of liquid cover 73
To on the face (supporting surface) of -Y direction.Specifically, head chip 51 is by surface (forward surface with manifold 52) court of cover plate 56
Insulating trip 86 is fixed on by bonding etc. in the state of to insulating trip 86.Now, the common ink chamber 62 of cover plate 56 passes through company
Through hole 82 connects with interconnecting part 80.Thus, the ink of circulation is supplied to chip 51 to the end in ink flow path 71.In addition, head core
Piece 51 is prominent to -Z direction relative to manifold 52 in the state of manifold 52 is fixed on.In addition, in the example shown in Figure 4, head
The length of the X-direction of chip 51 is short compared with the length of the X-direction of manifold 52.
As shown in Fig. 2 configure having heaters 85 towards the face of +Y direction among channel member 72 (stream plate 75).Add
Hot device 85 by channel member 72 to being heated in ink flow path 71, so as to the ink of circulation keep in the ink flow path 71
(insulation) is within the scope of set temperature.
As shown in figure 4, driving substrate 53 be so-called flexible printed board, be equipped with basilar memebrane wiring pattern,
Various electronic units and form.Driving substrate 53 has by module control unit 88 that manifold 52 supports and controls module
The chip connecting portion 89 that portion 88 and head chip 51 connect.In addition, if the driving at least chip connecting portion 89 of substrate 53 is by flexible base board
Form, then rigid substrates can also be used in module control unit 88.
Module control unit 88 is formed as rectangular shape in the front view in terms of Y-direction.The electronic units such as driver IC
It is assemblied in module control unit 88.Module control unit 88 is at the face towards -Y direction of liquid cover 73, relative to head chip 51
Support plate 90 is clipped between positioned at the part of +Z direction and is fixed on manifold 52.In addition, support plate 90 is outstanding by heat conductivity
Material (for example, metal material) formation.In addition it is also possible to it is not provided with support plate 90.That is, it can also be that module control unit 88 is direct
It is fixed on the composition of manifold 52.
As shown in Fig. 2 driving substrate 53 electrically connects via slave module control unit 88 to the lead division 91 that +Z direction is drawn
In external connection substrate 92.External connection substrate 92 is to pair from the main control substrate output (not shown) for being equipped on printer 1
The control signal of each head module 30A~30D (driver IC), driving voltage are relayed.Moreover, driving substrate 53 is based on utilizing
Control signal that external connection substrate 92 relays, driving voltage are driven a chip 51.
As shown in figure 4, the slave module in the state of gap is separated in the Y direction relative to liquid cover 73 of chip connecting portion 89
Control unit 88 is extended to -Z direction.Above-mentioned activation plate is fixed in the -Z direction end of chip connecting portion 89 by crimping etc.
55 +Z direction end.Thus, the driving electrodes for driving substrate 53 and head chip 51 are electrically connected.
Driving substrate 53 possesses the sensor attachment portion 93 that the +X direction end of slave module control unit 88 is drawn.Sensor connects
Socket part 93 is extended to the position overlapped in terms of Y-direction with above-mentioned heat transfer plate 65.In the leading section of sensor attachment portion 93, assembling
There is the temperature sensor 94 (for example, thermal resistor etc.) of ink temperature in detection discharge passage 57.Temperature sensor 94 is promoting
The back side of dynamic plate 55 configures in the case of heat transfer plate 65 is clipped between.
As shown in figure 3, the first head module 30A quilts in the state of manifold 52 as described above is inserted into insertion groove 46
Insert in mounting opening 44.Now, the first head module 30A with head chip 51 towards -Y direction, and the -Z direction of head chip 51
End face and the mode of the -Z direction end face of substrate parts 38 (module maintaining part 41) are kept by substrate parts 38.
As shown in Figure 2 and Figure 3, the second head module 30B is inserted relative to the first head module 30A manifold 52 being inserted into
In the state of in the insertion groove 46 that the insertion groove 46 entered abuts in the-y direction, mounting opening 44 is inserted into.Now, second
Module 30B is protected in the state of head chip 51 makes the first head module 30A head chip 51 opposite in the Y direction by substrate parts 38
Hold.In addition, the first head module 30A and the second head module 30B inflow port 76 configures in equal position in the X direction.
In addition, head chip of the second head module 30B head chip (first chip) 51 relative to the first head module 30A
51, arrange to half of spacing of arrangement spacing deviation (staggered) of discharge passage 57.Thus, by the first head module 30A and
Second head module 30B head chip 51 collaboratively spues a kind of ink of color, can realize the word for being recorded in printing medium P
Symbol, the high density recording of image.In addition, in the first head module 30A and the second head module 30B, the discharge of head chip 51
The arrangement spacing of passage 57 can be changed suitably.
In addition, as shown in Fig. 2 the 3rd head module 30C and the 4th head module 30D makes respective head chip (second
Chip) 51 face in the state of, by the method same with above-mentioned first head module 30A, the second head module 30B by substrate parts
38 keep.In addition, each head module 30A~30D via from substrate parts 38 to +Z direction erect set pillar (not shown) and
It is fixed on substrate parts 38.In addition, the 3rd head module 30C and the 4th head module 30D inflow port 76 is relative to first
Module 30A and the second head module 30B inflow port 76 is located at the opposite side (end of the +X direction of stream plate 75 of X-direction
Portion).
(buffer)
Buffer 31 in +Z direction, is arranged in correspondence with relative to head module 30A~30D with the color of ink.That is, this embodiment party
The buffer 31 of formula is provided with one to each two head module (for example, head module 30A, 30B).Each buffer 31 is arranged in the Y direction
Row are set.In addition, each buffer 31 is all equal composition in addition to the color for the ink being supplied to.Therefore, following
In explanation, a buffer 31 (head module 30A, 30B buffer) is illustrated, omits saying for another buffer 31
It is bright.
Buffer 31 is via being fixed on the pillars (not shown) of substrate parts 38 relative to head module 30A, 30B in +Z direction
Upper installation.Buffer 31 has ingress port 100, pressure buffer portion 101 and outlet port 102.In addition, buffer 31 is also
It can be provided separately with ink gun 5A.
Ingress port 100 is formed as the tubular being provided projectingly from pressure buffer portion 101 towards +Z direction.Above-mentioned ink pipe arrangement 16
(reference picture 1) is connected to ingress port 100.Ink in ink storage tank 15 is by flowing into ingress port 100 in ink pipe arrangement 16.
Pressure buffer portion 101 is formed as box.Pressure buffer portion 101 is formed by storing movable film etc. inside it.
Pressure buffer portion 101 is configured between ink storage tank 15 (Fig. 1) and head module 30A, 30B, right by ingress port 100 to absorb
The pressure oscillation for the ink that buffer 31 supplies.
Outlet port 102 is formed as the tubular being provided projectingly from pressure buffer portion 101 towards -X direction.From pressure buffer portion
The ink of discharge is flowed into outlet port 102 in 101.
Filter unit 110 is connected to outlet port 102.Filter unit 110 is accommodated with mistake (not shown) inside it
Filter.Filter unit 110 removes the bubble contained in the ink discharged from buffer 31, foreign matter etc. by filter.
Filter unit 110 has the branch 111,112 for make it that branch is divided into two from the ink that buffer 31 is discharged.One point
Branch 111 is connected to the first head module 30A inflow port 76 via connecting tube 113.Another branch 112 is via connecting tube
114 are connected to the second head module 30B inflow port 76.In addition, filter unit 110 is fixed on via pillar (not shown)
Substrate parts 38.In addition, it is configured with said external connecting substrate 92 between opposite each buffer 31 in the Y direction.
Fig. 7 is the exploded perspective view of substrate parts 38, nozzle plate 32 and nozzle guard part 33.
As shown in fig. 7, among above-mentioned substrate parts 38 module maintaining part 41 -Z direction end face, be fixed with distance piece
(base unit) 120.Distance piece 120 is formed by polyimides etc..Distance piece 120 is adhered to module guarantor using soft bonding agent
Hold the -Z direction end face in portion 41.In addition, as soft bonding agent, it is preferred to use silicone-based bonding agent is (for example, ThreeBond
(ス リ ー ボ Application De) company's production：1211) etc..
Distance piece 120 is from the -Z direction end face of -Z direction overlay module maintaining part 41.From Z-direction among distance piece 120
The position of the head chip 51 together in each head module 30A~30D is valued, formed with the distance piece for making a chip 51 expose to -Z direction
Opening portion 121.In the present embodiment, distance piece opening portion 121 makes a chip 51 distinguish by each color (for example, the first head mould
Block 30A and the second head module 30B head chip 51) expose together.In addition, distance piece opening portion 121 can make each head module
30A~30D head chip 51 exposes together, and each head chip 51 can also be made to expose respectively.
(nozzle plate)
Said nozzle plate 32 is formed by resin materials such as polyimides.The +Z direction end face of nozzle plate 32 is (with substrate parts 38
Forward surface) the -Z direction end face of above-mentioned distance piece 120, head chip 51 is fixed on by hard splicing agent.Hard splicing agent by
For example formed compared with above-mentioned soft bonding agent according to the material of Shore hardness hard.As such a material, it is preferred to use ring
Oxygen tree lipid bonding agent is (for example, Ablestik (エ イ Block Le ス テ ィ ッ Network) company produces：931-1T1N1) etc..In addition, nozzle plate
32 can also directly be adhered to substrate parts 38 using soft bonding agent.
As shown in Fig. 2, Fig. 7, nozzle plate 32 covers each head module 30A~30D head chip 51 from -Z direction together.Edge
Multiple nozzle rows (first jet row 130A~the 4th nozzle rows 130D) of X-direction extension are formed at spaced intervals along Y-direction
Nozzle plate 32.
Each nozzle rows 130A~130D is respectively formed at the head core with corresponding head module 30A~30D among nozzle plate 32
The opposite position in z-direction of piece 51.
Fig. 8 is the portion bottom surface figure of the ink gun 5A in terms of -Z direction.
As shown in figure 8, each nozzle rows 130A~130D has the nozzle bore (first jet for running through nozzle plate 32 along Z-direction
The nozzle bore 131D of hole 131A~the 4th).For example, first jet hole 131A formed severally among nozzle plate 32 with the first head mould
The discharge passage 57 of head chip 51 in block 30A opposite position in z-direction.That is, by multiple first jet hole 131A along X
Direction is formed as linear at spaced intervals, constitutes first jet row 130A.
In addition, second nozzle hole (the first spray-hole) 131B, the 3rd nozzle bore (the second spray-hole) 131C and the 4th spray
Nozzle aperture 131D is same with above-mentioned first jet hole 131A, formed severally among nozzle plate 32 with corresponding head module 30B~
The discharge passage 57 of head chip 51 in 30D opposite position in z-direction.
As shown in fig. 7, among nozzle plate 32 in the Y direction positioned at second nozzle row 130B and the 3rd nozzle rows 130C it
Between part, formed with along Z-direction run through nozzle plate 32 slit 135.In the present embodiment, slit 135 separates along Y-direction
Two row are alternately formed.Slit 135 extends parallel to nozzle rows 130A~130D in X direction.In addition, slit 135 is in X side
Upward length is longer than nozzle rows 130A~130D.But if the length of slit 135 is shorter than the X-direction length of nozzle plate 32,
Can suitably it change.In addition, the quantity of slit 135 is not limited to two row, can suitably change.
In addition, nozzle plate 32 is not limited to resin material, metal material (stainless steel etc.) formation can also be used, can also be used
The lit-par-lit structure of resin material and metal material.But nozzle plate 32 is preferably to have the thermal expansion system equal with distance piece 120
Several materials.In addition, in the -Z direction end face (jet face) of nozzle plate 32, liquid repellent processing is implemented with.Although in present embodiment
In, each head module 30A~30D compositions covered together are illustrated a piece of nozzle plate 32, but be not limited only to the structure
Into can also be the composition for individually being covered each head module 30A~30D with multi-disc nozzle plate 32.
(nozzle guard part)
Nozzle guard part 33 to sheet material stainless steel such as by implementing punch process to be formed.Nozzle guard part 33 is protected to module
Portion 41 is held to be covered from -Z direction in the state of between being clipped in nozzle plate 32, distance piece 120.
Among nozzle guard part 33 with said nozzle row 130A~130D opposite positions in z-direction, formed with making
Nozzle rows 130A~130D is exposed to the exposed hole 141 of outside.Exposed hole 141 is formed as running through nozzle guard part 33 along Z-direction,
And the slit-shaped extended in X direction.The exposed hole 141 of present embodiment is with spuing with nozzle rows 130A~130D of chromatic ink
Accordingly along Y-direction interval formed with two row.That is, an exposed hole 141 makes first jet row 130A and second nozzle
Row 130B is exposed to outside.In addition, another exposed hole 141 is exposed to the 3rd nozzle rows 130C and the 4th nozzle rows 130D
It is outside.
As shown in figure 8, nozzle guard part 33 is fixed on above-mentioned distance piece 120 by bonding etc..Specifically, nozzle is prevented
Guard 33 is adhered among distance piece 120 part for being located at outside compared with nozzle plate 32 in the plan view in terms of Z-direction
(hereinafter referred to as " the first bonding region 150 ").First bonding region 150 is set as surrounding nozzle plate 32 weeks throughout whole surrounding
The frame-shaped enclosed.In addition, if the first bonding region 150 is at least adhered to distance piece 120 in the outside of nozzle plate 32, can also glue
It is connected to the outer peripheral edge of nozzle plate 32.
In addition, nozzle guard part 33 is adhered among distance piece 120 by the above-mentioned slit 135 of nozzle plate 32 to expose
Partly (hereinafter referred to as " the second bonding region (lattice) 151 ").That is, the second bonding region 151 in X direction with nozzle rows
130A~130D is extended parallel to.Thus, the second bonding region 151 is by the spray of different colours among each nozzle rows 130A~130D
Separate between mouth row (between second nozzle row 130B and the 3rd nozzle rows 130C).
[method of work of printer]
Then, the method to printing medium P record informations using above-mentioned printer 1 is illustrated.
If as shown in figure 1, operating printer 1, the grid roller 11,13 of conveyer 2,3 rotates, so as in these grid
Between lattice roller 11,13 and pinch roll 12,14 printing medium P is transported to +X direction.In addition, at the same time, drive motor 28
Rotate pulley 26 so that endless belt 27 moves.Thus, the one side of balladeur train 23 is guided by guide rail 21,22, and an edge Y-direction is reciprocal
It is mobile.
During this period, in each ink gun 5A, 5B, the driving electrodes of correct chip 51 apply driving voltage.Thus, drive is made
Dynamic wall 61 produces thickness sliding deformation, to produce pressure wave in the ink being filled in discharge passage 57.Pass through the pressure
Reeb, the internal pressure of discharge passage 57 uprise, to pass through nozzle bore 131A~131D discharge inks.Then, hit in by ink
On printing medium P and by various information records on printing medium P.
Here, in the present embodiment, such as in the first head module 30A, using head chip 51 and driving substrate 53
The composition supported by the manifold 52 with ink flow path 71.
According to this composition, branch fastener chip 51 and drive substrate 53 part and ink flow path 71 be integrated in
The manifold 52 of side in the Y direction is configured relative to head chip 51.Thus, with being respectively relative to a chip in the past in the Y direction
Side configure the part that correct chip and driving substrate are supported, and match somebody with somebody relative to the opposite side of head chip in the Y direction
The composition for putting the part with ink flow path is compared, and the first module 30A can be sought small-sized on (main scanning direction) in the Y direction
Change.Thereby, it is possible to realize the miniaturizations of ink gun 5A in the Y direction.
In addition, caused heat is rejected heat to outside via manifold 52 in head chip 51, driving substrate 53.Thus, energy
Enough ensure a chip 51 and drive the heat dispersion of substrate 53.
It is additionally, since a chip 51 and driving substrate 53 is supported by the manifold 52 with ink flow path 71, therefore being capable of profit
Produce in head chip 51, driving substrate 53 and be transferred to the discharge heat of manifold 52 come to being flowed in ink flow path 71
Ink is heated (insulation).Thereby, it is possible to supply ink with the correct chip 51 of desired temperature (viscosity), can obtain outstanding
Lettering characteristic.
Moreover, in the present embodiment, due to that can realize the miniaturizations of head module 30A~30D in the Y direction, therefore energy
It is enough that in each head chip 51, manifold 52 is set respectively.Therefore, with order to seek high density recording and a head module 30A~
The composition that 30D carries more head chips 51 is compared, it can be ensured that the heat dispersion of each head chip 51.
In the present embodiment, because buffer 31 is configured in +Z direction relative to manifold 52, thus with buffer 31 and discrimination
Composition of the pipe 52 along Y-direction spread configuration is compared, and can seek the miniaturizations of ink gun 5A in the Y direction.
In the present embodiment, due to ink flow path 71 it is sinuous extend, therefore can be by head chip 51, driving substrate 53
Discharge heat is effectively transmitted to the ink in ink flow path 71.Thereby, it is possible to the correct chip 51 of desired temperature (viscosity)
Ink is supplied, outstanding lettering characteristic can be obtained.
In the present embodiment, using among manifold 52 towards +Y direction face (with to driving substrate 53 be supported
Face be opposite side face) configuration having heaters 85 composition.
According to this composition, in ink flow path 71 ink of circulation except head chip 51, drive the heat extraction of substrate 53 in addition to,
It can also be heated by heater 85, it is thus possible to which with desired temperature, reliably correct chip 51 supplies ink.
In the present embodiment, because insulating trip 86 is between head chip 51 and manifold 52, therefore a chip can be reduced
Stray capacitance between 51 and manifold 52.Thereby, it is possible to suppress to be driven caused electrical noise, energy in correct chip 51
Enough ensure ink gun 5A functional reliability.
In addition, by using polyimides etc. that there is resistance to ink material in insulating trip 86, insulating trip can be suppressed
86 because of ink the situation of dissolution, with suppress spue it is bad.
Moreover, by using the soft materials such as polyimides in insulating trip 86, can relax because of head chip 51 and manifold
The difference of 52 thermal coefficient of expansion and act on the stress of a chip 51 and manifold 52.Thus, such as a chip 51 can be suppressed
Breakage, the situation about being peeled off from manifold 52 of head chip 51.
In the present embodiment, configured using nozzle plate 32 on the -Z direction end face of substrate parts 38, nozzle plate 32 has
There is nozzle rows 130A~130D corresponding with each head module 30A~30D composition.
According to this composition, compared with the composition of nozzle plate 32 is installed respectively in each head module 30A~30D, can seek to spray
Nozzle aperture 131A~131D positional precision improves.
In the present embodiment, because distance piece 120 is between nozzle plate 32 and substrate parts 38, thus can relax because
The difference of the thermal coefficient of expansion of nozzle plate 32 and substrate parts 38 and act on the stress of nozzle plate 32 and substrate parts 38.
Moreover, in the present embodiment, because distance piece 120 using soft bonding agent is adhered to substrate parts 38, therefore
Distance piece 120 and base are acted on the difference that the thermal coefficient of expansion because of distance piece 120 and substrate parts 38 can reliably be relaxed
The stress of bottom parts 38.
Thereby, it is possible to suppress the situation that from the beginning chip 51 is peeled off of nozzle plate 32.
In the present embodiment, the first bonding region 150 of nozzle guard part 33 and distance piece 120 is used to surround nozzle
The composition that mode around plate 32 configures.
According to this composition, the ink on the -Z direction end face of nozzle plate 32, nozzle guard part 33 is attached to is intended to pass through spray
In the case that the gap of mouth plate 32 and nozzle guard part 33 enters in ink gun 5A, it can be blocked using the first bonding region 150
Ink.Thereby, it is possible to suppress ink into the situation inside ink gun 5A.
In the present embodiment, configured using the second bonding region 151 of nozzle guard part 33 and distance piece 120 in each spray
Composition among mouth row 130A~130D between nozzle rows 130B, 130C of discharge different colours ink.
According to this composition, being attached to the inks of the first-class different colours in -Z direction end face of nozzle plate 32, to be utilized second viscous
Region 151 is connect to block.Thereby, it is possible to suppress the ink (ink to be spued from nozzle rows 130B, 130C) of different colours in nozzle
The situation for mixing and escaping to outside ink gun 5A on the -Z direction end face of plate 32.
In the present embodiment, using between nozzle rows 130B, 130C among nozzle plate 32 formed with slit 135
Composition.
According to this composition, after nozzle plate 32 is pasted on into a chip 51, distance piece 120, in nozzle plate 32 with viscous
Temperature change when connecing agent solidification and during dilation, expanded by slit 135 and reduced, be capable of the deformation of absorption nozzle plate 32.
Thereby, it is possible to ensure the positional precision relative to head chip 51 of nozzle plate 32, and the stripping of nozzle plate 32 can be suppressed etc..
In the present embodiment, distance piece 120 and nozzle guard part 33 are bonded by (the second bonding region by slit 135
151), also can be by nozzle guard part 33, so that in the case where implementing water repellent processing to the -Z direction end face of nozzle plate 32
Bonding.Further, since distance piece 120 and nozzle guard part 33 is connected by bonding agent, therefore can be reliably suppressed different face
The situation that the ink of color mixes on the -Z direction end face of nozzle plate 32.
In the present embodiment, using by substrate parts 38 and head module 30A~30D towards the side of X-direction and Y-direction
Composition of the first functional component and the second functional component 70 of effect between substrate parts 38 and head module 30A~30D.
According to this composition, head module 30A~30D is in the state of by the side ejection towards X-direction and Y-direction by substrate
Part 38 is kept.Therefore, it is possible to accurately position head module 30A~30D relative to substrate parts 38.Thereby, it is possible to improve
Head module 30A~30D is fixed on to assembleability during substrate parts 38 via pillar etc. afterwards.
In the present embodiment, because temperature sensor 94 is configured at the back side of activation plate 55, thus with by temperature sensor
94 configurations are compared from the situation for the position that activation plate 55 separates, and can correctly detect the ink temperature of discharge passage 57.
Especially, in the present embodiment, between temperature sensor 94 and activation plate 55, to cover each passage 57,58
The mode of four corner be provided with heat transfer plate 65.Therefore, it is possible to detect the average ink temperature of all discharge passages 57.
Moreover, in the printer 1 of present embodiment, due to possessing above-mentioned ink gun 5A, therefore it can provide and not only seek
The miniaturization of Y-direction, and the printer 1 of excellent reliability.
(variation)
Next, illustrate the variation of above-mentioned embodiment.Fig. 9 is the sectional view of the ink gun 205 involved by variation.
Same with above-mentioned embodiment in the ink gun 205 shown in Fig. 9, nozzle plate 32 and each head chip 51 are by hard
Matter bonding agent B1 and be bonded, distance piece 120 and substrate parts 38 are bonded by soft bonding agent B2.Nozzle guard part 33 is upper
State in the first bonding region 150 and distance piece 120 and nozzle plate 32 are adhered to by soft bonding agent B3.Moreover, nozzle is prevented
Guard 33 is adhered to nozzle plate 32 by soft bonding agent B4 in above-mentioned second bonding region 151 by slit 135.But
It is that the combination of bonding agent can be changed suitably.
Moreover, although in the above-described embodiment, the situation that resin material is used in distance piece 120 is said
It is bright, but this composition is not limited only to, ink gun 205 that can also be as shown in Figure 9 is such, and metal material is used in distance piece 120
(for example, thin plate of stainless steel etc.).
According to this composition, it can be ensured that the rigidity of distance piece 120, thus for example in distance piece 120 and substrate parts 38
During bonding, the bonding of distance piece 120 and nozzle guard part 33 when, the deflection deformation of distance piece 120 can be suppressed.Thereby, it is possible to
Improve assembleability.
In addition, though in the above-described embodiment, composition of the slit 135 formed with two row is illustrated, but as this
So, slit 135 can also be a row to variation.
In addition, the technical scope of the present invention is not limited to above-mentioned embodiment, the model of present subject matter can not departed from
It is subject to various changes in enclosing.
Although for example, in the above-described embodiment, as one of liquid injection apparatus, enter exemplified by act ink-jet printer 1
Go explanation, but be not limited to printer.For example, it is also possible to it is facsimile machine, printing on demand machine etc..
Although the composition in the above-described embodiment, being equipped on to four head module 30A~30D on substrate parts 38 is carried out
Explanation, but it is not limited only to this composition.It can also be multiple that the quantity for being equipped on the head module of substrate parts 38, which can be one,.
Although in the above-described embodiment, to being said with a kind of two compositions of the ink of color of head modules discharge
It is bright, but this composition is not limited only to, can also be spued a kind of ink of color with more than three multiple head modules, can also use one
A kind of ink of color of individual head module discharge.
Although the head chip that in the above-described embodiment, opposite side is penetrated is illustrated, not limited to this.For example, it is also possible to
The present invention is applied to penetrate type (side shoot from the so-called side of the bearing of trend central portion discharge ink of discharge passage
Type head chip).
Furthermore it is also possible to it is suitable for the direction of pressure for making to put on ink and the discharge direction of ink droplet by the present invention
Type (roof shoot type) head chip is penetrated on unidirectional so-called top.
Although in the above-described embodiment, to the situation by bonding agent (for example, soft bonding agent B4) formation lattice
It is illustrated, but is not limited to this composition, lattice can also be separately set outside nozzle plate 32, nozzle plate 33 etc..
Although in the above-described embodiment, the composition that lattice continuously configures in X direction is illustrated, not only
It is limited to this composition, can also intermittently configures in X direction.In addition, lattice is not limited to linearly.
Although in the above-described embodiment, to will be separated using lattice between the head chip 51 of discharge different colours ink
Composition be illustrated, but be not limited only to this composition, lattice can also be utilized by the head chip of discharge same color ink
Separate between 51.
In addition, if the bonding agent used in the bonding of nozzle plate 32, nozzle guard part 33, distance piece 120 etc. has phase
For the corrosion resistance of ink, then thermmohardening type is not limited to, can also be pressure-sensitive type etc..
Although the composition that in the above-described embodiment, correct chip 51 and driving substrate 53 are supported by the same face of manifold
It is illustrated, but is not limited only to this composition.For example, head chip 51 and driving substrate 53 can also be by the different faces of manifold 52
(for example, two faces towards Y-direction) support.
Although the composition in the above-described embodiment, being fixed on substrate parts 38 across distance piece 120 to nozzle plate 32 is entered
Go explanation, but be not limited only to this composition, nozzle plate 32 can also be directly fixed on substrate parts 38.
In addition, without departing from the scope of the subject in the invention, can be suitably by the inscape in above-mentioned embodiment
Known inscape is replaced with, furthermore it is also possible to which above-mentioned each variation is combined as.
(1) a kind of jet head liquid, it is characterised in that relative to first manifold and second manifold described
The side opposite with the injection orifice plate, is configured with buffer in the normal direction of jet face, and the buffer is connected to described
Liquid flow path, and absorb the pressure oscillation for the liquid for being fed into the liquid flow path.
(2) a kind of jet head liquid, it is characterised in that the liquid flow path extends sinuously.
(3) a kind of jet head liquid, it is characterised in that among the manifold in said first direction with the support
Face is the face of opposite side, configures having heaters.
(4) a kind of jet head liquid, it is characterised in that the first insulating trip is between first manifold and first core
Between piece, and the second insulating trip is between second manifold and second chip.
(5) a kind of jet head liquid, it is characterised in that the base unit possesses to first chip and described
The substrate parts that second chip is supported and the distance piece between the substrate parts and the injection orifice plate.
(6) a kind of jet head liquid, it is characterised in that the distance piece is adhered to the basal part using soft bonding agent
Part, the nozzle orifice plate utilize by the hard splicing agent that the material of the hard compared with the soft bonding agent is formed and are adhered to institute
State distance piece.
(7) a kind of jet head liquid, it is characterised in that the injection orifice plate is from the plan view in terms of the normal direction
The middle profile ninor feature than the distance piece into, the spray-hole protector in the plan view in terms of the normal direction
Compared with the injection orifice plate distance piece is adhered at the region in outside, the spray-hole protector and the distance piece
Bonding portion is surrounded around the injection orifice plate.
Symbol description
1 ink-jet printer (liquid injection apparatus)
5A, 5B ink gun (jet head liquid)
32 nozzle plates (injection orifice plate)
33 nozzle guard parts (spray-hole protector)
38 substrate parts (base unit)
51 chips (first chip, second chip)
52 manifolds (the first manifold, the second manifold)
53 driving substrates (the first driving substrate, the second driving substrate)
57 discharge passages
71 ink flow paths (liquid flow path)
120 distance pieces (base unit)
131B second nozzles hole (the first spray-hole)
The nozzle bores of 131C the 3rd (the second spray-hole)
135 slits
141 exposed hole
151 second bonding regions (lattice)
The soft bonding agents of B4 (lattice)
Claims (5)
1. a kind of jet head liquid, it is characterised in that possess：
First chip and second chip, first chip and second chip are respectively formed with and are filled liquid
Passage, and be set up in parallel in the first direction；
Orifice plate is sprayed, it is fixed on first chip and second chip together, and formed with described the
First spray-hole of the passage connection of one chip and the second spray connected with the passage of second chip
Perforation；And
Lattice, it is among the injection orifice plate towards opposite with first chip and second chip
On the jet face of side, it will separate between first spray-hole and second spray-hole.
2. jet head liquid according to claim 1, it is characterised in that
The injection orifice plate is bonded and fixed to first chip and second chip,
The part between first spray-hole and second spray-hole among the injection orifice plate, formed with along institute
State slit of the normal direction through the injection orifice plate of jet face.
3. jet head liquid according to claim 2, it is characterised in that have：
Base unit, it is supported to first chip and second chip, and is adhesively fixed with described
Spray orifice plate；And
Spray-hole protector, its formed with the exposed hole for exposing first spray-hole and second spray-hole, and
Between clip the injection orifice plate and cover the injection orifice plate from the opposite side of the base unit,
The lattice is the bonding agent for being fixed the base unit and the spray-hole protector by the slit.
4. the jet head liquid according to any one of claim 1 to claim 3, it is characterised in that possess：
First manifold, it is adjacently configured in said first direction relative to first chip, using towards described
The supporting surface in one direction supports first chip, and with the liquid flow path connected with the passage；
First driving substrate, it is supported by the supporting surface of first manifold, and is electrically connected with first chip；
Second manifold, it is adjacently configured in said first direction relative to second chip, using towards described
The supporting surface in one direction supports second chip, and with the liquid flow path connected with the passage；And
Second driving substrate, it is supported by the supporting surface of second manifold, and is electrically connected with second chip.
5. a kind of liquid injection apparatus, it is characterised in that possess described in claim 1 to any one of claim 3
Jet head liquid.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-106238 | 2016-05-27 | ||
| JP2016106238 | 2016-05-27 | ||
| JP2016252720A JP6882888B2 (en) | 2016-05-27 | 2016-12-27 | Liquid injection head and liquid injection device |
| JP2016-252720 | 2016-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107433777A true CN107433777A (en) | 2017-12-05 |
| CN107433777B CN107433777B (en) | 2020-05-12 |
Family
ID=60458390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710384419.5A Active CN107433777B (en) | 2016-05-27 | 2017-05-26 | Liquid ejecting head and liquid ejecting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107433777B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111284135A (en) * | 2018-12-06 | 2020-06-16 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
| CN111347794A (en) * | 2018-12-20 | 2020-06-30 | 精工电子打印科技有限公司 | Pressure damper, liquid ejecting head, and liquid ejecting recording apparatus |
| CN112848686A (en) * | 2019-11-28 | 2021-05-28 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741906A (en) * | 2003-01-28 | 2006-03-01 | 惠普开发有限公司 | Fluid ejection head |
| CN1743178A (en) * | 2004-08-30 | 2006-03-08 | 精工爱普生株式会社 | Working method for forming minute holes, tool used in the method, method and apparatus for manufacturing liquid ejecting head |
| CN101119847A (en) * | 2005-02-18 | 2008-02-06 | 惠普开发有限公司 | High resolution inkjet printer |
| CN101563231A (en) * | 2006-12-21 | 2009-10-21 | 伊斯曼柯达公司 | Insert molded printhead substrate |
| EP2133204A1 (en) * | 2008-06-10 | 2009-12-16 | SII Printek Inc | Head chip, liquid jet head, and liquid jet device |
| CN103240995A (en) * | 2012-02-13 | 2013-08-14 | 佳能株式会社 | Liquid discharging recording head |
| US20160009087A1 (en) * | 2014-07-11 | 2016-01-14 | Seiko Epson Corporation | Liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head |
-
2017
- 2017-05-26 CN CN201710384419.5A patent/CN107433777B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1741906A (en) * | 2003-01-28 | 2006-03-01 | 惠普开发有限公司 | Fluid ejection head |
| CN1743178A (en) * | 2004-08-30 | 2006-03-08 | 精工爱普生株式会社 | Working method for forming minute holes, tool used in the method, method and apparatus for manufacturing liquid ejecting head |
| CN101119847A (en) * | 2005-02-18 | 2008-02-06 | 惠普开发有限公司 | High resolution inkjet printer |
| CN101563231A (en) * | 2006-12-21 | 2009-10-21 | 伊斯曼柯达公司 | Insert molded printhead substrate |
| EP2133204A1 (en) * | 2008-06-10 | 2009-12-16 | SII Printek Inc | Head chip, liquid jet head, and liquid jet device |
| CN103240995A (en) * | 2012-02-13 | 2013-08-14 | 佳能株式会社 | Liquid discharging recording head |
| US20160009087A1 (en) * | 2014-07-11 | 2016-01-14 | Seiko Epson Corporation | Liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111284135A (en) * | 2018-12-06 | 2020-06-16 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
| CN111284135B (en) * | 2018-12-06 | 2022-10-04 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
| CN111347794A (en) * | 2018-12-20 | 2020-06-30 | 精工电子打印科技有限公司 | Pressure damper, liquid ejecting head, and liquid ejecting recording apparatus |
| CN112848686A (en) * | 2019-11-28 | 2021-05-28 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
| CN112848686B (en) * | 2019-11-28 | 2023-11-17 | 精工电子打印科技有限公司 | Head chip, liquid ejecting head, and liquid ejecting recording apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107433777B (en) | 2020-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105142908B (en) | Fluid ejection device and the method for manufacturing it | |
| CN107433772A (en) | Jet head liquid and liquid injection apparatus | |
| CN105313465B (en) | Flow path features, liquid ejecting head and liquid injection apparatus | |
| CN104772987B (en) | Jet head liquid, liquid ejecting head unit, liquid injection line head and liquid injection apparatus | |
| CN103213397B (en) | Liquid ejecting head module and liquid ejecting apparatus | |
| CN102161268B (en) | Liquid ejection head wiring member,liquid ejection head, and liquid ejection device | |
| CN107433777A (en) | Jet head liquid and liquid injection apparatus | |
| US20160221341A1 (en) | Printbar and method of forming same | |
| CN104417050B (en) | Jet head liquid and liquid injection apparatus | |
| CN107878023A (en) | Jet head liquid and fluid jet recording apparatus | |
| US9487005B2 (en) | Liquid jet head and liquid jet apparatus | |
| CN102218917B (en) | Liquid ejecting head, liquid ejecting head unit, and liquid ejecting apparatus | |
| CN104582972A (en) | Liquid jetting device | |
| EP3147122A1 (en) | Liquid ejecting device | |
| US9604455B2 (en) | Liquid ejecting head and liquid ejecting apparatus | |
| CN107443905A (en) | Jet head liquid and liquid injection apparatus | |
| CN104339857B (en) | Liquid ejecting head and liquid ejecting apparatus | |
| CN102161267B (en) | Liquid ejection head wiring member and liquid ejection head | |
| CN100436139C (en) | Fluid ejection assembly | |
| JP6856375B2 (en) | Liquid injection head and liquid injection device | |
| CN103561958B (en) | Print head chip | |
| CN102233733A (en) | Liquid ejecting head, liquid ejecting head unit and liquid ejecting apparatus | |
| CN101961955B (en) | Liquid ejecting head and liquid ejecting apparatus | |
| CN107443896A (en) | Jet head liquid and liquid injection apparatus | |
| CN101163592B (en) | Fluid ejection assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |