CN107425403A - A kind of laser TEC devices and laser - Google Patents
A kind of laser TEC devices and laser Download PDFInfo
- Publication number
- CN107425403A CN107425403A CN201710791890.6A CN201710791890A CN107425403A CN 107425403 A CN107425403 A CN 107425403A CN 201710791890 A CN201710791890 A CN 201710791890A CN 107425403 A CN107425403 A CN 107425403A
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- tec
- laser
- light path
- communication interface
- path case
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Abstract
The embodiment of the invention discloses a kind of laser TEC devices and laser.TEC devices include power supply box and light path case in the embodiment of the present invention, and power supply box is connected with light path case by electric power data line.Exist in the embodiment of the present invention before laser TEC installation's power sources case and light path case without optical fiber, the separation of two such casing can, transport and easy for installation.The Temperature Quantity of simulation will not be transmitted between power supply box and light path case simultaneously so that laser TEC devices gather and regulation temperature stabilization is reliable.
Description
Technical field
The present invention relates to field of laser device technology, more particularly to a kind of laser TEC devices and laser.
Background technology
Diode pumped solid state laser (English full name：Diode Pump Solid State Laser), it is in recent years
It is with fastest developing speed in the world, the wider new laser of application.The laser of the type is swashed using the semiconductor for exporting fixed wave length
Light device instead of traditional krypton lamp or xenon lamp to carry out pumping to laser crystal, so as to achieve brand-new development, be referred to as the
The laser in two generations.This is a kind of high efficiency, long-life, beam quality height, the second generation of good, the compact-sized miniaturization of stability
Novel solid laser, handled in space communication, fiber optic communication, atmospheric research, environmental science, medicine equipment, optical image,
The high-tech areas such as laser printer have the application prospect to show unique characteristics.
It can be used in solid state laser and arrive seed source laser, because solid state laser needs at a constant temperature
Can wavelength stabilization, at present in solid state laser substantially be required for using semiconductor cooler (Thermo Electric Cooler,
TEC) module.The TEC structures of current current solid state laser generally comprise three kinds, and the first is as shown in figure 1, second such as figure
Shown in 2, the third before power supply box and light path case as shown in figure 3, wherein, optical fiber is had in the TEC structures of laser shown in Fig. 1
In the presence of two such casing is just inseparable, transport and installation trouble.In the TEC structures of laser shown in Fig. 2 master control system and
The Temperature Quantity of simulation can be transmitted between TEC drivings, the analog quantity long-distance transmissions and around pwm signal and high current can be by
Cause to gather to interference and to adjust temperature unstable.It can be transmitted between TEC drivings and TEC in the TEC structures of laser shown in Fig. 3
The Temperature Quantity of simulation, the analog quantity long-distance transmissions and around high current, can be interfered causes to gather and adjusts temperature not
It is stable.
The content of the invention
The embodiments of the invention provide a kind of laser TEC devices and laser, with solve power supply box in the prior art and
Optical fiber presence is had before light path case, two such casing is just inseparable, transport and installation trouble.
In a first aspect, the application provides a kind of laser TEC devices, the TEC devices include power supply box and light path case, institute
Power supply box is stated to connect by electric power data line with light path case.
Further, master control system and the first communication interface are provided with the power supply box, the power supply box is also by described
First communication interface connects the light path case.
Further, it is provided with pump laser in the light path case.
Further, TEC modules are provided with the pump laser.
Further, micro-control unit and TEC drive modules are additionally provided with the light path case, the pump laser
TEC modules connect the TEC drive modules, micro-control unit described in the TEC drive connections.
Further, the second communication interface is additionally provided with the light path case, second communication interface is logical with described first
Believe the communication interface that interface is same type, the micro-control unit connects second communication interface, and first communication connects
Mouth connects the communication interface of light second.
Further, cavity is provided with the light path case, the cavity passes through pumping laser in optical fiber and the light path case
Device connects.
Further, the micro-control unit is used for the instruction that master control system is received by second communication interface, and
The TEC modules in pump laser are controlled to work by the TEC drive modules, to control the work temperature of the pump laser
Degree.
Further, first communication interface and second communication interface are RS485 interfaces.
Second aspect, the present invention also provide a kind of laser, and the laser is included as described in any in first aspect
Laser TEC devices.
As can be seen from the above technical solutions, the embodiment of the present invention has advantages below：
Laser TEC devices include power supply box and light path case in the embodiment of the present invention, and power supply box and light path case pass through power supply
Data wire connects.There is no optical fiber presence in the embodiment of the present invention between the power supply box and light path case of laser TEC devices, such two
Individual casing can separation, is transported and easy for installation.The Temperature Quantity of simulation will not be transmitted between power supply box and light path case simultaneously, is made
Obtain the collection of laser TEC devices and regulation temperature stabilization is reliable.
Brief description of the drawings
Fig. 1 is a schematic diagram of the TEC structures of solid state laser in the prior art；
Fig. 2 is another schematic diagram of the TEC structures of solid state laser in the prior art；
Fig. 3 is another schematic diagram of the TEC structures of solid state laser in the prior art；
Fig. 4 is a schematic diagram of laser TEC devices in the embodiment of the present invention.
Embodiment
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
The (if present)s such as term " first ", " second " in description and claims of this specification and above-mentioned accompanying drawing
It is for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that the number so used
According to can exchange in the appropriate case, so as to the embodiments described herein can with except the content for illustrating or describing herein with
Outer order is implemented.In addition, term " comprising " and " having " and their any deformation, it is intended that cover non-exclusive bag
Contain, for example, containing the process of series of steps or unit, method, system, product or equipment is not necessarily limited to what is clearly listed
Those steps or unit, but may include not listing clearly or intrinsic for these processes, method, product or equipment
Other steps or unit.
Referring to Fig. 4, in the embodiment of the present invention laser TEC devices for one embodiment, laser TEC device bags
Power supply box and light path case are included, the power supply box is connected with light path case by electric power data line.
Laser TEC devices include power supply box and light path case in the embodiment of the present invention, and power supply box and light path case pass through power supply
Data wire connects.Exist in the embodiment of the present invention before laser TEC installation's power sources case and light path case without optical fiber, two such
Casing can separates, and transports and easy for installation.The Temperature Quantity of simulation will not be transmitted between power supply box and light path case simultaneously so that
Laser TEC devices gather and regulation temperature stabilization is reliable.
Further, master control system and the first communication interface are provided with the power supply box, the power supply box is also by described
First communication interface connects the light path case.
Further, it is provided with pump laser in the light path case.
Further, TEC modules are provided with the pump laser.
Further, micro-control unit and TEC drive modules are additionally provided with the light path case, the pump laser
TEC modules connect the TEC drive modules, micro-control unit described in the TEC drive connections.
Further, the second communication interface is additionally provided with the light path case, second communication interface is logical with described first
Believe the communication interface that interface is same type, the micro-control unit connects second communication interface, and first communication connects
Mouth connects the communication interface of light second.
Further, cavity is provided with the light path case, the cavity passes through pumping laser in optical fiber and the light path case
Device connects.
Further, the micro-control unit is used for the instruction that master control system is received by second communication interface, and
The TEC modules in pump laser are controlled to work by the TEC drive modules, to control the work temperature of the pump laser
Degree.
Further, first communication interface and second communication interface are RS485 interfaces.
A kind of laser is also provided in the embodiment of the present invention, the laser includes the as above laser described in any embodiment
Device TEC devices.
It should be noted that the laser described in the embodiment of the present invention is diode pumped solid state laser.
In several embodiments provided herein, it should be understood that disclosed system, apparatus and method can be with
Realize by another way.For example, device embodiment described above is only schematical, for example, the unit
Division, only a kind of division of logic function, can there is other dividing mode, such as multiple units or component when actually realizing
Another system can be combined or be desirably integrated into, or some features can be ignored, or do not perform.It is another, it is shown or
The mutual coupling discussed or direct-coupling or communication connection can be the indirect couplings by some interfaces, device or unit
Close or communicate to connect, can be electrical, mechanical or other forms.
The unit illustrated as separating component can be or may not be physically separate, show as unit
The part shown can be or may not be physical location, you can with positioned at a place, or can also be distributed to multiple
On NE.Some or all of unit therein can be selected to realize the mesh of this embodiment scheme according to the actual needs
's.
Described above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Embodiment is stated the present invention is described in detail, it will be understood by those within the art that：It still can be to preceding
State the technical scheme described in each embodiment to modify, or equivalent substitution is carried out to which part technical characteristic；And these
Modification is replaced, and the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
- A kind of 1. laser TEC devices, it is characterised in that the TEC devices include power supply box and light path case, the power supply box and Light path case is connected by electric power data line.
- 2. TEC devices according to claim 1, it is characterised in that master control system and first is provided with the power supply box and is led to Believe interface, the power supply box also connects the light path case by first communication interface.
- 3. TEC devices according to claim 1, it is characterised in that pump laser is provided with the light path case.
- 4. TEC devices according to claim 3, it is characterised in that TEC modules are provided with the pump laser.
- 5. TEC devices according to claim 4, it is characterised in that be additionally provided with micro-control unit and TEC in the light path case Drive module, the TEC modules of the pump laser connect the TEC drive modules, microcontroller described in the TEC drive connections Unit.
- 6. TEC devices according to claim 5, it is characterised in that the second communication interface, institute are additionally provided with the light path case State the communication interface that the second communication interface and first communication interface are same type, the micro-control unit connection described the Two communication interfaces, first communication interface connect the communication interface of light second.
- 7. TEC devices according to claim 6, it is characterised in that cavity is provided with the light path case, the cavity passes through Optical fiber is connected with pump laser in the light path case.
- 8. TEC devices according to claim 7, it is characterised in that the micro-control unit is used for logical by described second Believe the instruction of interface master control system, and control the TEC modules in pump laser to work by the TEC drive modules, To control the operating temperature of the pump laser.
- 9. laser TEC devices according to claim 6, it is characterised in that first communication interface and described second Communication interface is RS485 interfaces.
- 10. a kind of laser, it is characterised in that the laser includes the laser as described in any in claim 1 to 9 TEC devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791890.6A CN107425403A (en) | 2017-09-05 | 2017-09-05 | A kind of laser TEC devices and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791890.6A CN107425403A (en) | 2017-09-05 | 2017-09-05 | A kind of laser TEC devices and laser |
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| Publication Number | Publication Date |
|---|---|
| CN107425403A true CN107425403A (en) | 2017-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710791890.6A Pending CN107425403A (en) | 2017-09-05 | 2017-09-05 | A kind of laser TEC devices and laser |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527424A (en) * | 2008-03-03 | 2009-09-09 | 北京中视中科光电技术有限公司 | Laser light source |
| CN202797596U (en) * | 2012-03-28 | 2013-03-13 | 上海科乃特激光科技有限公司 | High-power pump wavelength controller |
| CN103022868A (en) * | 2012-12-25 | 2013-04-03 | 中国电子科技集团公司第十一研究所 | Pulse optical fiber laser |
| CN103368051A (en) * | 2013-07-12 | 2013-10-23 | 北京信息科技大学 | Semiconductor laser driving system used for fiber laser pump |
| CN103606811A (en) * | 2013-12-11 | 2014-02-26 | 北京信息科技大学 | Pulse fiber laser driven power control system based on CPLD (Complex Programmable Logic Device) |
| CN207625065U (en) * | 2017-09-05 | 2018-07-17 | 深圳市杰普特光电股份有限公司 | A kind of laser TEC devices and laser |
-
2017
- 2017-09-05 CN CN201710791890.6A patent/CN107425403A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101527424A (en) * | 2008-03-03 | 2009-09-09 | 北京中视中科光电技术有限公司 | Laser light source |
| CN202797596U (en) * | 2012-03-28 | 2013-03-13 | 上海科乃特激光科技有限公司 | High-power pump wavelength controller |
| CN103022868A (en) * | 2012-12-25 | 2013-04-03 | 中国电子科技集团公司第十一研究所 | Pulse optical fiber laser |
| CN103368051A (en) * | 2013-07-12 | 2013-10-23 | 北京信息科技大学 | Semiconductor laser driving system used for fiber laser pump |
| CN103606811A (en) * | 2013-12-11 | 2014-02-26 | 北京信息科技大学 | Pulse fiber laser driven power control system based on CPLD (Complex Programmable Logic Device) |
| CN207625065U (en) * | 2017-09-05 | 2018-07-17 | 深圳市杰普特光电股份有限公司 | A kind of laser TEC devices and laser |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171201 |
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| RJ01 | Rejection of invention patent application after publication |