CN107422598A - Mask plate and preparation method thereof - Google Patents
Mask plate and preparation method thereof Download PDFInfo
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- CN107422598A CN107422598A CN201710409355.XA CN201710409355A CN107422598A CN 107422598 A CN107422598 A CN 107422598A CN 201710409355 A CN201710409355 A CN 201710409355A CN 107422598 A CN107422598 A CN 107422598A
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- mask plate
- opening
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- electroformed layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
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- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of mask plate and preparation method thereof.Above-mentioned mask plate includes：Mask plate matrix, mask plate matrix has AA areas and non-AA areas, and mask plate matrix includes relative first surface and second surface, and AA areas have the first opening through mask plate matrix, and non-AA areas have the second opening on first surface；And first electroformed layer, on the first surface of mask plate matrix, and the first electroformed layer exposes the first opening, and covers the second opening.In above-mentioned mask plate, because the AA areas of mask plate matrix have the first opening and the second opening with non-AA areas respectively, and the first electroformed layer exposes the first opening, and covers the second opening, does not interfere with evaporation effect.Meanwhile non-AA areas are provided with being open with AA areas, the transitional region in AA areas and non-AA areas on mask plate during throwing the net can be avoided to produce mutation, be advantageous to the stabilization in AA areas, so as to be advantageous to improve the effect of pattern evaporation, lift the yield of product.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of mask plate and preparation method thereof.
Background technology
Flat-panel display device has many merits such as thin fuselage, power saving, radiationless, is widely used.It is existing
Flat-panel display device mainly includes source matrix organic light emitting diode (Active-matrix organic light
Emitting diode, AMOLED) and organic elctroluminescent device (Organic Light Emitting Display,
OLED).The making of flat-panel display device is related to the process that Thinfilm pattern is formed in substrate, i.e., using having figuratum evaporation
Mask plate mask, and required pattern is formed on substrate to be deposited by vacuum evaporation mode.
Traditional mask plate includes AA areas (Ative Area, effective display area domain) and non-AA areas, and Zhi AA areas are provided with
Evaporation opening, however, the pattern evaporation effect of this traditional mask plate is poor so that product yield is relatively low.
The content of the invention
Based on this, it is necessary to for traditional mask plate product yield it is relatively low the problem of, there is provided one kind can lift production
Mask plate of product yield and preparation method thereof.
A kind of mask plate, including：
Mask plate matrix, the mask plate matrix has AA areas and non-AA areas, and the mask plate matrix is included relatively
First surface and second surface, the AA areas have through the mask plate matrix first opening, the non-AA areas have
The second opening on the first surface；
And first electroformed layer, on the first surface of the mask plate matrix, and first electroformed layer exposes institute
The first opening is stated, and covers second opening.
In above-mentioned mask plate, because the AA areas of mask plate matrix have the first opening and the second opening with non-AA areas respectively,
And first electroformed layer expose the first opening, and cover the second opening, do not interfere with evaporation effect.Meanwhile non-AA areas and AA areas are equal
There is provided opening, and the transitional region in AA areas and non-AA areas on mask plate during throwing the net can be avoided to produce mutation, be advantageous to
The stabilization in AA areas, so as to be advantageous to improve the effect of pattern evaporation, lift the yield of product.
In addition, the first electroformed layer is located on the first surface of mask plate matrix, it can ensure that the surface of mask plate is smooth, have
Beneficial to detection of the detection device to mask plate.
In one of the embodiments, the thickness of first electroformed layer is 1 μm~5 μm.
In one of the embodiments, the mask plate also includes the on the second surface of the mask plate matrix
Two electroformed layers, second electroformed layer expose first opening.
In one of the embodiments, the thickness of second electroformed layer is 1 μm~5 μm.
In addition, also providing a kind of preparation method of mask plate, comprise the following steps：
Mask plate matrix is provided, the mask plate matrix has AA areas and non-AA areas, and the mask plate matrix includes
Relative first surface and second surface；
The first opening through the mask plate matrix is formed in the AA areas, and in first table in the non-AA areas
The second opening is formed on face；
The first core is filled in first opening, and first core is protruded from the first surface；Institute
State the second opening and fill the second core, and make the outer surface of second core concordant with the first surface；
The first electroformed layer is formed on the first surface, and first core is protruded from first electroformed layer,
And first electroformed layer covers second core；
And form the first electroformed layer on the first surface and remove first core afterwards, obtain mask plate.
In the preparation method of above-mentioned mask plate, due to form respectively first on the first surface in AA areas and non-AA areas
Opening and the second opening, and the opening of the first electroformed layer covering second, do not interfere with evaporation effect, meanwhile, non-AA areas and AA areas are equal
There is provided opening, and the transitional region in AA areas and non-AA areas on mask plate during throwing the net can be avoided to produce mutation, be advantageous to
The stabilization in AA areas, so as to be advantageous to improve the effect of pattern evaporation, lift the yield of product.
In one of the embodiments, formed on the first surface after the first electroformed layer, the system of the mask plate
Make the step of method also includes removing second core.
In one of the embodiments, second opening is the through hole through the mask plate matrix.
In one of the embodiments, after removing first core, the preparation method of the mask plate also include with
Lower step：
The 3rd core and the 4th core are filled in the described first opening and second opening respectively, and makes described the
Three cores protrude from the second surface, and the outer surface of the 4th core is concordant with the second surface；
The second electroformed layer is formed on the second surface, and the 3rd core is protruded from second electroformed layer,
And second electroformed layer covers the 4th core；
And formed on the second surface after the second electroformed layer and remove the 3rd core.
In one of the embodiments, second opening is blind hole.
In one of the embodiments, after removing first core, the preparation method of the mask plate also include with
Lower step：
The 3rd core is filled in first opening, and the 3rd core is protruded from the second surface；
The second electroformed layer is formed on the second surface, and the 3rd core is protruded from second electroformed layer；
And formed on the second surface after the second electroformed layer and remove the 3rd core.
Brief description of the drawings
Fig. 1 is the schematic diagram of the mask plate matrix of embodiment 1；
Fig. 2 is the schematic diagram formed on mask plate matrix after the first opening and the second opening of embodiment 1；
Fig. 3 is embodiment 1 respectively after the first opening and the second opening fill the first core and the second core
Schematic diagram；
Fig. 4 is the schematic diagram formed on the first surface after the first electroformed layer of embodiment 1；
Fig. 5 is the schematic diagram of the mask plate of embodiment 1；
Fig. 6 is the schematic diagram of the mask plate matrix of embodiment 2；
Fig. 7 is the schematic diagram formed on mask plate matrix after the first opening and the second opening of embodiment 2；
Fig. 8 is embodiment 2 respectively after the first opening and the second opening fill the first core and the second core
Schematic diagram；
Fig. 9 is the schematic diagram formed on the first surface after the first electroformed layer of embodiment 2；
Figure 10 is the schematic diagram of the mask plate of embodiment 2；
Figure 11 is the showing after the first opening and the second opening fill the 3rd core and the 4th core of embodiment 3
It is intended to；
Figure 12 is the schematic diagram formed on a second surface after the second electroformed layer of embodiment 3；
Figure 13 is the schematic diagram of the mask plate of embodiment 3.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of running counter to intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
Traditional mask plate includes AA areas (Ative Area, effective display area domain) and non-AA areas, and Zhi AA areas are provided with
Evaporation opening, however, the pattern evaporation effect of this traditional mask plate is poor so that product yield is relatively low.
The present inventor has found by research：This is due to that AA areas are different from the situation in non-AA areas, causes follow-up
The deformation of mask plate is more complicated in network process, and the intensity of mask plate changes on the border in AA areas, thus causes pattern to be deposited
Effect is poor so that product yield is relatively low.
Therefore, the present invention proposes a kind of mask plate, to lift evaporation product yield.
Fig. 5 is referred to, the mask plate 100 of embodiment 1 includes the electroformed layer 140 of mask plate matrix 110 and first.
Wherein, mask plate matrix 110 has AA areas and non-AA areas, and mask plate matrix 110 includes the first relative table
Face 111 and second surface 112, as shown in Figure 1.AA areas have the first opening 113 through mask plate matrix, and non-AA areas have position
In on first surface 111 second opening 114, as shown in Figure 2.
First electroformed layer 140 is located on the first surface 111 of mask plate matrix 110, and the first electroformed layer 140 exposes first
Opening 113, and cover the second opening 114.
Further, the thickness of the first electroformed layer 140 is preferably 1 μm~5 μm.The table of mask plate 100 can so be ensured
Face is smooth, is advantageous to the inspection of the detection devices such as AOI (plug-hole, particles, opening are bad) bad to the surface of mask plate 100 etc.
Survey.
Refer to Figure 13, the mask plate 300 of embodiment 3 includes mask plate matrix 210, the positioned at mask plate matrix 210
The first electroformed layer 240 on one surface 211 and the second electroformed layer on the second surface 212 of mask plate matrix 210
270, second electroformed layer 270 exposes first opening 213, and the second electroformed layer 270 of increase can increase detection device to covering
The recall rate on diaphragm plate surface bad (plug-hole, particles, opening are bad) etc..
Further, the thickness of the second electroformed layer 270 is 1 μm~5 μm.
In the mask plate of the present invention, because the AA areas of mask plate matrix with non-AA areas there is the first opening and second to open respectively
Mouthful, and the first electroformed layer exposes the first opening, and the second opening is covered, do not interfere with evaporation effect.Meanwhile non-AA areas and AA areas
It is provided with being open, the transitional region in AA areas and non-AA areas on mask plate during throwing the net can be avoided to produce mutation, favorably
Stabilization in AA areas, so as to be advantageous to improve the effect of pattern evaporation, lift the yield of product.
Second opening is preferably through hole, further, the through hole preferably with the size and dimension all same of the first opening.
Etching when, can Jiang Fei AA areas etched simultaneously with AA areas, using one of etching technics.
It should be noted that the first opening of mask plate and the second opening not limited to this.First opening and the second opening
Shape and size also can be different, can be specifically configured according to actual conditions.Because non-AA areas through hole (the second opening) is to it
Aperture precision requirement is not through hole that is very high, therefore can yet etching other shapes.In addition, the second opening also can be blind hole, now, can
To be obtained using half technique carved.
The preparation method of mask plate is further described with reference to specific embodiment.
Embodiment 1
The preparation method of the mask plate 100 of embodiment 1, comprises the following steps：
S10, refer to Fig. 1, there is provided mask plate matrix 110, mask plate matrix 110 has AA areas and non-AA areas, and covers
Diaphragm plate matrix 110 includes relative first surface 111 and second surface 112.
Mask plate matrix 110 can be obtained using calendering technology.In use, first surface 111 is relative with substrate to be deposited,
Second surface 112 is relative with vapor deposition source.
S20, the first opening 113 for running through mask plate matrix 110, and the first surface 111 in Fei AA areas are formed in AA areas
It is upper to form the second opening 114, as shown in Figure 2.
Etching technics can be used to form the first opening 113 and the second opening 114.Further, non-AA areas guarantee and AA
Area's identical etching, that is, etch the opening of size and dimension all same.Second opening 114 in the Fei AA areas of embodiment 1 is through hole,
Certainly, the shape and size of the first opening 113 and the second opening 114 also can be different, and the second opening 114 can also be opened in the
The blind hole on one surface 111.
The first core 120 is filled at S30, the first opening 113 in fig. 2, and the first core 120 is protruded from the first table
Face 111；The second core 130 is filled at the second opening 114 in fig. 2, and makes outer surface and the first surface of the second core 130
111 is concordant, as shown in Figure 3.
Further, it is the step of the first core 120 of filling at the first opening 113 in fig. 2：Using coating photoetching
Glue, development formation and the first 113 consistent openings of opening are exposed to photoresist, the first core 120 is made in opening, it
After remove photoresist.Similar, fill the second core 130 at the second opening 114 in fig. 2.
In this step, it is subsequently to form on first surface 111 the first core 120 is protruded from first surface 111
One electroformed layer 140 is prepared.And the purpose for making the outer surface of the second core 130 concordant with first surface 111 is to prevent from subsequently existing
Electroforming material leaks at the second opening 114 when the first electroformed layer 140 is formed on first surface 111.
S40, the first electroformed layer 140 is formed on first surface 111, and the first core 120 is protruded from the first electroformed layer
140, and the first electroformed layer 140 covers the second core 130, as shown in Figure 4.
Further, the thickness of the first electroformed layer 140 is preferably 1 μm~5 μm.First electroformed layer 140 is located at mask plate base
It on the first surface 111 of body 110, can ensure that the surface of mask plate is smooth, be advantageous to the detection devices such as AOI to mask plate surface
The bad detection such as particle, plug-hole.
S50, formed on first surface 111 after first electroformed layer 140 and remove the first core 120, obtain mask plate
100, as shown in Figure 5.
Further, formed on first surface 111 after first electroformed layer 140, the preparation method of mask plate also includes
The step of removing the second core 130.Certainly, also can not limited to this.Because the intensity of the second core 130 itself is weaker, Er Qie
It is to disconnect between two cores 130 and perforate, so, non-AA areas can't make it that intensity increase is larger because there is core.Cause
This, non-AA areas can not also remove the second core 130.Whether removing the second core 130 can depend on the circumstances.If for example, second
The opening size of opening 114 is more than the size of the second core 130, then can remove；If the opening size of the second opening 114 is less than the
The size of two cores 130, then the second core 130 can be retained in the second opening 114.When the size of the second core 130 is smaller
When, the second core 130 can be disappeared by the way of illumination removal.
In the preparation method of the mask plate 100 of embodiment 1, due to dividing on the first surface 111 in AA areas and non-AA areas
The first opening 113 and the second opening 114, and the opening 114 of the first electroformed layer 140 covering second are not formd, do not interfere with evaporation
Effect, meanwhile, non-AA areas and AA areas are provided with being open, and it is consistent to be advantageous to the deformation of mask plate 100 during throwing the net, and avoids
The transitional region in mask plate AA areas and non-AA areas produces mutation, is advantageous to the stabilization in AA areas, so as to be advantageous to improve pattern evaporation
Effect, lift the yield of product.
Embodiment 2
The preparation method of the mask plate 100 of embodiment 2, comprises the following steps：
S100, refer to Fig. 6, there is provided mask plate matrix 210, mask plate matrix 210 has AA areas and non-AA areas, and covers
Diaphragm plate matrix 210 includes relative first surface 211 and second surface 212.
Mask plate matrix 210 can be obtained using calendering technology.In use, first surface 211 is relative with substrate to be deposited,
Second surface 212 is relative with vapor deposition source.
S200, the first opening 213 for running through mask plate matrix 210, and the first surface 211 in Fei AA areas are formed in AA areas
It is upper to form the second opening 214, as shown in Figure 7.
Etching technics can be used to form the first opening 213 and the second opening 214.Further, non-AA areas guarantee and AA
Area's identical etching, that is, etch the opening of size and dimension all same.
Certainly, the shape and size of the first opening 213 and the second opening 214 also can be different, and the second opening 214 can be logical
Hole or the blind hole for being opened in first surface 211.
The first core 220 is filled at S300, the first opening 213 in the figure 7, and the first core 220 is protruded from first
Surface 211；The second core 230 is filled at the second opening 214 in the figure 7, and makes outer surface and the first table of the second core 230
Face 211 is concordant, as shown in Figure 8.
Further, it is the step of the first core 220 of filling at the first opening 213 in the figure 7：Using coating photoetching
Glue, development formation and the first 213 consistent openings of opening are exposed to photoresist, the first core 220 is made in opening, it
After remove photoresist.Similar, fill the second core 230 at the second opening 214 in the figure 7.
In this step, it is subsequently to form on first surface 211 the first core 220 is protruded from first surface 211
One electroformed layer 240 is prepared.And the purpose for making the outer surface of the second core 230 concordant with first surface 211 is to prevent from subsequently existing
Electroforming material leaks at the second opening 214 when the first electroformed layer 240 is formed on first surface 211.
S400, the first electroformed layer 240 is formed on first surface 211, and the first core 220 is protruded from the first electroformed layer
240, and the first electroformed layer 240 covers the second core 230, as shown in Figure 9.
Further, the thickness of the first electroformed layer 240 is preferably 1 μm~5 μm.First electroformed layer 240 is located at mask plate base
It on the first surface 211 of body 210, can ensure that the surface of mask plate is smooth, be advantageous to detection of the detection device to mask plate.
S500, formed on first surface 211 after first electroformed layer 240 and remove the first core 220, obtain mask plate
200, as shown in Figure 10.
Further, formed in the present embodiment on first surface 211 after first electroformed layer 240 and remain the second core
230。
It should be noted that the preparation method of the mask plate of embodiment 1 and embodiment 2 only forms on the first surface
First electroformed layer, but its not limited to this, the second electroformed layer can be also formed on a second surface.
Embodiment 3
The present embodiment after removing the first core 220, adds following steps on the basis of embodiment 2：
The 3rd core 250 and the 4th core are filled at S600, the first opening 213 and the second opening 214 respectively in the figure 7
Mould 260, and the 3rd core 250 is protruded from second surface 212, the outer surface of the 4th core 260 is concordant with second surface 212,
As shown in figure 11.
S700, the second electroformed layer 270 is formed on second surface 212, and the 3rd core 250 is protruded from the second electroformed layer
270, and the second electroformed layer 270 covers the 4th core 260, as shown in figure 12.
S800, formed on second surface 212 after second electroformed layer 270 and remove the 3rd core 250, obtain mask plate
300, as shown in figure 13.
Further, the 4th core on the second core in the present embodiment on the first electroformed layer 240 and the second electroformed layer 270
Mould, which can retain, to be removed.
Embodiment 4
On the basis of embodiment 1, the second opening of embodiment 1 is replaced with into blind hole, after removing the first core, mask
The preparation method of plate is further comprising the steps of：
The 3rd core is filled in the first opening, and the 3rd core is protruded from second surface.
The second electroformed layer is formed on a second surface, and the 3rd core is protruded from the second electroformed layer；
The second electroformed layer is formed on a second surface removes the 3rd core afterwards.
Further, the second core in the present embodiment on the first electroformed layer can retain and can also remove.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. mask plate, it is characterised in that including：Mask plate matrix, the mask plate matrix have AA areas and a non-AA areas, and the mask plate matrix includes relative the One surface and second surface, the AA areas have the first opening through the mask plate matrix, and the non-AA areas, which have, to be located at The second opening on the first surface；And first electroformed layer, on the first surface of the mask plate matrix, and first electroformed layer exposes described One opening, and cover second opening.
- 2. mask plate according to claim 1, it is characterised in that the thickness of first electroformed layer is 1 μm~5 μm.
- 3. mask plate according to claim 1, it is characterised in that the mask plate also includes being located at the mask plate matrix Second surface on the second electroformed layer, second electroformed layer expose it is described first opening.
- 4. mask plate according to claim 3, it is characterised in that the thickness of second electroformed layer is 1 μm~5 μm.
- 5. a kind of preparation method of mask plate, it is characterised in that comprise the following steps：Mask plate matrix is provided, the mask plate matrix has AA areas and non-AA areas, and the mask plate matrix is included relatively First surface and second surface；The first opening through the mask plate matrix is formed in the AA areas, and on the first surface in the non-AA areas Form the second opening；The first core is filled in first opening, and first core is protruded from the first surface；Described Two openings fill the second core, and make the outer surface of second core concordant with the first surface；The first electroformed layer is formed on the first surface, and first core is protruded from first electroformed layer, and institute State the first electroformed layer and cover second core；And form the first electroformed layer on the first surface and remove first core afterwards, obtain mask plate.
- 6. the preparation method of mask plate according to claim 5, it is characterised in that form first on the first surface After electroformed layer, the step of preparation method of the mask plate also includes removing second core.
- 7. the preparation method of the mask plate according to claim 5 or 6, it is characterised in that second opening is through institute State the through hole of mask plate matrix.
- 8. the preparation method of mask plate according to claim 7, it is characterised in that after removing first core, institute The preparation method for stating mask plate is further comprising the steps of：The 3rd core and the 4th core are filled in the described first opening and second opening respectively, and makes the 3rd core Mould protrudes from the second surface, and the outer surface of the 4th core is concordant with the second surface；The second electroformed layer is formed on the second surface, and the 3rd core is protruded from second electroformed layer, and institute State the second electroformed layer and cover the 4th core；And formed on the second surface after the second electroformed layer and remove the 3rd core.
- 9. the preparation method of the mask plate according to claim 5 or 6, it is characterised in that second opening is blind hole.
- 10. the preparation method of mask plate according to claim 9, it is characterised in that after removing first core, institute The preparation method for stating mask plate is further comprising the steps of：The 3rd core is filled in first opening, and the 3rd core is protruded from the second surface；The second electroformed layer is formed on the second surface, and the 3rd core is protruded from second electroformed layer；And formed on the second surface after the second electroformed layer and remove the 3rd core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409355.XA CN107422598B (en) | 2017-06-02 | 2017-06-02 | Mask plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710409355.XA CN107422598B (en) | 2017-06-02 | 2017-06-02 | Mask plate and manufacturing method thereof |
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| CN107422598A true CN107422598A (en) | 2017-12-01 |
| CN107422598B CN107422598B (en) | 2020-08-25 |
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ID=60429435
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| CN201710409355.XA Active CN107422598B (en) | 2017-06-02 | 2017-06-02 | Mask plate and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109321880A (en) * | 2018-10-18 | 2019-02-12 | 京东方科技集团股份有限公司 | A kind of mask plate |
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| Publication number | Publication date |
|---|---|
| CN107422598B (en) | 2020-08-25 |
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