CN107417296A - Honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard and preparation method thereof - Google Patents
Honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard and preparation method thereof Download PDFInfo
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- CN107417296A CN107417296A CN201710740083.1A CN201710740083A CN107417296A CN 107417296 A CN107417296 A CN 107417296A CN 201710740083 A CN201710740083 A CN 201710740083A CN 107417296 A CN107417296 A CN 107417296A
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- blind hole
- mobile phone
- backboard
- zirconium oxide
- regular polygon
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910001928 zirconium oxide Inorganic materials 0.000 title claims abstract description 29
- 239000011224 oxide ceramic Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- 238000002347 injection Methods 0.000 claims abstract description 33
- 239000007924 injection Substances 0.000 claims abstract description 33
- 238000007493 shaping process Methods 0.000 claims abstract description 22
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 19
- 229920000620 organic polymer Polymers 0.000 claims abstract description 18
- 239000004033 plastic Substances 0.000 claims abstract description 18
- 229920003023 plastic Polymers 0.000 claims abstract description 18
- 235000015895 biscuits Nutrition 0.000 claims abstract description 13
- 238000005238 degreasing Methods 0.000 claims abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 16
- -1 polyethylene Polymers 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 13
- 229920000647 polyepoxide Polymers 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 13
- 239000012188 paraffin wax Substances 0.000 claims description 12
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 239000003607 modifier Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- JPNZKPRONVOMLL-UHFFFAOYSA-N azane;octadecanoic acid Chemical compound [NH4+].CCCCCCCCCCCCCCCCCC([O-])=O JPNZKPRONVOMLL-UHFFFAOYSA-N 0.000 claims description 6
- 239000000499 gel Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 235000021355 Stearic acid Nutrition 0.000 claims description 5
- 229940088990 ammonium stearate Drugs 0.000 claims description 5
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 5
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 239000008117 stearic acid Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- 230000035939 shock Effects 0.000 abstract description 2
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 239000011799 hole material Substances 0.000 description 96
- 238000010792 warming Methods 0.000 description 20
- 239000000843 powder Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- 238000005452 bending Methods 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 238000009413 insulation Methods 0.000 description 7
- 238000000227 grinding Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000007656 fracture toughness test Methods 0.000 description 5
- 239000005416 organic matter Substances 0.000 description 5
- 238000000643 oven drying Methods 0.000 description 5
- 238000013001 point bending Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 238000005070 sampling Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000010257 thawing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003643 water by type Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- YFVKHKCZBSGZPE-UHFFFAOYSA-N 1-(1,3-benzodioxol-5-yl)-2-(propylamino)propan-1-one Chemical compound CCCNC(C)C(=O)C1=CC=C2OCOC2=C1 YFVKHKCZBSGZPE-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
- C04B38/06—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof by burning-out added substances by burning natural expanding materials or by sublimating or melting out added substances
- C04B38/063—Preparing or treating the raw materials individually or as batches
- C04B38/0635—Compounding ingredients
- C04B38/0645—Burnable, meltable, sublimable materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
- C04B41/4853—Epoxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/49—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Organo-clay compounds; Organo-silicates, i.e. ortho- or polysilicic acid esters ; Organo-phosphorus compounds; Organo-inorganic complexes
- C04B41/4905—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Organo-clay compounds; Organo-silicates, i.e. ortho- or polysilicic acid esters ; Organo-phosphorus compounds; Organo-inorganic complexes containing silicon
- C04B41/4922—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Organo-clay compounds; Organo-silicates, i.e. ortho- or polysilicic acid esters ; Organo-phosphorus compounds; Organo-inorganic complexes containing silicon applied to the substrate as monomers, i.e. as organosilanes RnSiX4-n, e.g. alkyltrialkoxysilane, dialkyldialkoxysilane
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/82—Coating or impregnation with organic materials
- C04B41/83—Macromolecular compounds
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Signal Processing (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard and preparation method thereof,The process is by being injection moulded cell phone back laminin base,Utilize the plasticity of biscuit,Backboard shaping is obtained into the cell phone back laminin base with honeycomb blind hole at low temperatures,Organic polymer plastic material is injected into ceramic body blind hole after degreasing sintered and solidified,Organically pottery backboard is combined with organic polymer plastic material,Organic polymer plastic material can effective apparatus with shock absorbing in falling process is collided,Improve the fracture toughness of mobile phone backboard,Organic polymer plastic material is hidden in inside mobile phone pottery backboard simultaneously,Outer surface is overall ceramic material,It is elegant in appearance,Simultaneously hard outer surface ceramics provide good anti-wear performance,Still further aspect is that organic polymer plastic material density is far below zirconia ceramics,It is lightening to be advantageous to mobile phone backboard.
Description
Technical field
The present invention relates to structural member preparation field, and in particular to consumer electronics back board structure part preparation field, more particularly to
Honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard and preparation method thereof.
Background technology
With the fast development of the consumer electronics such as mobile phone, the structural member such as shell (backboard) of consumer electronics achieves considerable
It is progressive, also run into the problem of new.The material that the particularly following 5G epoch offset power-consuming subshell (backboard) proposes harsher
It is required that.Conventional metals bring huge challenge to Antenna Design, it would be unavailable for 5G shells (backboard) due to its shield effectiveness
Manufacture, and plastics its inborn low-intensity, it is not wear-resisting limit its application in large scale screen, ultra-thin field, in addition with
And consume aesthetic raising, the shell (backboard) of the single metal shell of tradition and plastic material will also be difficult to move consumer.
Due to ZrO2Ceramics have high obdurability, good hardness, high-wearing feature, are widely used in structural ceramics
With function ceramics field, have been reported that PSZ (TZP) can prepare the watch of corrosion resistant by powder metallurgy process
Shell, table part and Other Instruments part.Therefore in recent years, it is applied to phone housing and is also more and more tasted by researcher
Examination.Such as addition aluminum oxide, titanium oxide etc. in zirconium oxide principal phase are employed in the patent of Application No. 201510309285.1 and is added
Agent is added to prepare phone housing by the way of curtain coating.In another example with yttrium stabilization in the patent of Application No. 201510940002.3
Zirconia ceramics powder and organic matter mixing extrusion shaping mobile phone shell.Evidence thanks to will roc work in addition《Structural ceramics》One books and newspapers
Road, the best ZrO of volume production toughness reinforcing performance2Ceramic fracture toughness is also only 8~12MPa.m1/2, commercialization still has problem：Oxidation
Zircon ceramic and metal and plastics ratio, fracture toughness is still bad, and anti-dropping capability is poor, and this necessarily limits its application.On the other hand
Zirconia ceramics backboard is necessarily manufactured, some are very to reach the equal anti-dropping capability of other materials using the thicker ceramics of size
Person's thickness is more than 1mm, and zirconia ceramics density is up to 6.1g/cm3, this necessarily causes zirconia ceramics backboard heavy, with electricity
The sub- lightening development path of product is not inconsistent.
The content of the invention
In view of this, in view of the existing deficiencies of the prior art, on the one hand its main purpose is to provide a kind of honeycomb to the present invention
Shape blind hole toughened zirconium oxide ceramic mobile phone backboard, the mobile phone backboard are more than to have in the first plane of zirconia ceramics mobile phone backboard
The regular polygon blind hole of one, cure package organic polymer plastic material in blind hole.
Preferably, organic polymer plastic material is epoxy resin or silica gel.
Preferably, the hole depth of positive shape changeable blind hole is 0.1mm~0.9mm, the side of the regular polygon of regular polygon blind hole
A length of 0.5mm~10mm, the wall thickness of two neighboring regular polygon blind hole is 0.5mm~3mm.
Preferably, regular polygon blind hole is equilateral triangle blind hole, square blind hole, regular pentagon blind hole, regular hexagon
It is a kind of in blind hole and round blind hole.
To achieve these goals, on the other hand the invention provides the preparation method of the mobile phone backboard, specifically by following
It is prepared by step：
A) by surface modifier, inorganic nano Zirconium powder, paraffin and high-molecular organic material in banbury high temperature
Negative pressure banburying obtains feeding；
B) will be melted under mould cavity negative pressure in mould of the feeding injection with more than one regular polygon boss,
The pressurization shaping of fritting state secondary mould closing obtains the backboard biscuit with more than one regular polygon blind hole；
C) backboard biscuit is obtained into backboard blank through degreasing heat preservation sintering；
D) using the regular polygon blind hole of surface improver processing backboard blank；
E) injection liquid-state epoxy resin or liquid-state silicon in the regular polygon blind hole of the backboard blank by step d) processing
In 60 DEG C~180 DEG C temperature-curable 5min~120min after glue.
Preferably, through backboard blank mechanical process treated step f).
Preferably, the reshaping temperature in step c) is 90 DEG C~120 DEG C, and shaping pressure is 150MPa~250MPa, shaping
Time is 1s~2min；
Preferably, organic polymer is a kind of in polyethylene, polypropylene, polyphenylene sulfide in step a)；Surface modifier
Mass percent is 0.5%~0.8%, and the mass percent of inorganic nano Zirconium powder is 85.2%~92.5%, paraffin
For mass percent be 4%~9%, organic macromolecule mass percent be 3%~5%.
Preferably, step b) dorsulums biscuit thickness is 0.3mm~2mm.
Preferably, the hole depth of the positive shape changeable blind hole of step b) shapings is 0.1mm~0.9mm, regular polygon blind hole
The length of side of regular polygon is 0.5mm~10mm, and the wall thickness of two neighboring regular polygon blind hole is 0.5mm~3mm, wherein just polygon
Shape blind hole is a kind of in equilateral triangle blind hole, square blind hole, regular pentagon blind hole, regular hexagon blind hole and round blind hole.
Preferably, step a) and d) in surface improver be a kind of in stearic acid, ammonium stearate and silane coupler.
Preferably, silane coupler is γ-aminopropyl triethoxysilane (KH550), γ-glycidyl ether oxygen propyl
One or two kinds of groups in trimethoxy silane (KH560) and γ-(methacryloxypropyl) propyl trimethoxy silicane (KH570)
Close.
Preferably, inorganic nano Zirconium powder is the stable nano zircite of yttrium, and its D50 is 30nm~200nm.
Preferably, mixing temperature is 120 DEG C~150 DEG C in step a), and negative pressure is -0.05MPa~-0.08MPa, during banburying
Between be 1h~4h.
Preferably, injecting forming temperature is 130 DEG C~155 DEG C in step b), and negative pressure is -0.07MPa~-0.09MPa.
Preferably, step c) sintering temperatures are 1300 DEG C~1500 DEG C, soaking time 2h~4h.
The beneficial effects of the invention are as follows：The invention discloses a kind of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard and
Its preparation method, it is that the material that the feeding of melting is injected into repressurization pressure shaping semi-molten state after die cavity obtains mobile phone
Backboard biscuit, backboard blank is obtained by cell phone back laminin base is degreasing sintered, then organic polymer plastic material is injected into backboard hair
In the blind hole of base and solidification obtains honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard.Compared with being directly molded, using injection
The technique of shaping solves the problems, such as that the thin-wall part that thickness is less than 0.2mm can not be molded again afterwards.Organic polymer plastic cement in blind hole
Material is in the effective apparatus with shock absorbing of collision falling process energy, the fracture toughness of raising mobile phone backboard, while organic polymer
Plastic material is hidden in inside mobile phone pottery backboard, is not affected the appearance, and outer surface ceramic segment provides good resistance to of backboard
Performance is ground, still further aspect composite ceramics backboard reduces the dosage of ceramics, lightening beneficial to backboard.
Brief description of the drawings
Fig. 1 is honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard preparation method schematic diagram.
Fig. 2 is cured epoxy resin toughened zirconium oxide ceramic mobile phone backboard schematic diagram in cellular blind round hole.
Embodiment
The present invention is described in further detail below, wherein used raw material and equipment are commercially available, is not important to
Ask.It is understood that specific embodiment described herein is only used for explaining related invention, rather than the restriction to the invention.
Honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard disclosed by the invention is interior for zirconia ceramics mobile phone backboard
The multiple regular polygon blind holes of shaping on surface, cure package organic polymer plastic material in blind hole.This blind hole can also be
The polygonal blind hole of irregular type, in this example preferably regular polygon blind hole.
In this example, organic polymer plastic material is epoxy resin or silica gel.
In this example, the hole depth of positive shape changeable blind hole is 0.1mm~0.9mm, the regular polygon of regular polygon blind hole
The length of side be 0.5mm~10mm, the wall thickness of two neighboring regular polygon blind hole is 0.5mm~3mm.
In this example, regular polygon blind hole is equilateral triangle blind hole, square blind hole, regular pentagon blind hole, positive six
It is a kind of in side shape blind hole and round blind hole.
In order to prepare above-mentioned honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard, the invention provides a kind of mobile phone backboard
Preparation method, specifically prepare according to the following steps：
A) by surface modifier, inorganic nano Zirconium powder, paraffin and high-molecular organic material in banbury high temperature
Negative pressure banburying obtains feeding.In this example, preferable organic polymer is one kind in polyethylene, polypropylene, polyphenylene sulfide；
The mass percent of surface modifier is 0.5%~0.8%, the mass percent of inorganic nano Zirconium powder for 85.2%~
92.5%, the mass percent that paraffin is is 4%~9%, and organic macromolecule mass percent is 3%~5%.In this example
In, preferable surface modifier is that one or two kinds of combinations, silane coupler are in stearic acid, ammonium stearate, silane coupler
γ-aminopropyl triethoxysilane (KH550), γ-glycidyl ether oxygen propyl trimethoxy silicane (KH560) and γ-(first
Base acryloyl-oxy) the one or two kinds of combinations of propyl trimethoxy silicane (KH570).In this example, preferable inorganic nano oxygen
It is the stable nano zircite of yttrium to change zirconium powder body, and its D50 is 30nm~200nm.In this example, according to preferable organic polymer
Different different with paraffin content, preferable mixing temperature is 120 DEG C~150 DEG C, and the intracavitary in internal mixing pass in banbury is born
Press as -0.05MPa~-0.08MPa, between, mixing time is 1h~4h.
B) will be melted under mould cavity negative pressure in mould of the feeding injection with more than one regular polygon boss,
The pressurization shaping of fritting state secondary mould closing obtains the backboard biscuit with more than one regular polygon blind hole.In this example
The preferable injection molding temperature of injection phase is 130 DEG C~155 DEG C, injection front mold die cavity negative pressure be -0.07MPa~-
0.09MPa, the zirconia ceramics cell phone back laminin base thickness of injection is 0.3mm~2mm.Avoid injection thickness small in this example
It is not high in 0.2mm backboard biscuit, increase injection difficulty, yield.Under semi-molten state before material does not solidify completely after injection
Matched moulds pressurization shaping reaming again, can cause the thickness of backboard biscuit thinnest part to be less than 0.2mm, can not be direct so as to solve
The problem of injection is less than 0.2mm backboard biscuits.In the present embodiment for more preferable shaping.It is preferred that truing phase mold temperature is 90
DEG C~120 DEG C, shaping pressure 150MPa~250MPa, training time is 1s~2min.In this example, what shaping obtained is just more
Side shape blind hole is one in equilateral triangle blind hole, square blind hole, regular pentagon blind hole, regular hexagon blind hole and round blind hole
Kind.In this example, the hole depth of positive shape changeable blind hole is 0.1mm~0.9mm, the length of side of the regular polygon of regular polygon blind hole
For 0.5mm~10mm, the wall thickness of two neighboring regular polygon blind hole is 0.5mm~3mm.
C) backboard blank is obtained through degreasing heat preservation sintering by the treated backboard biscuits of step b), in this example preferably
Sintering temperature be 1300 DEG C~1500 DEG C, soaking time 2h~4h, in order to improve product yield, debinding rate, sintering heating
Speed and rate of temperature fall all should be relatively slower.
D) injected in the regular polygon blind hole of backboard blank after liquid-state epoxy resin or liquid-state silicon gel at 60 DEG C~180 DEG C
Temperature-curable 5min~120min obtains the honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard, in order to improve organic polymer
Plastic material and the inner surface bond strength of mobile phone backboard blank blind hole, should also be by the mobile phone backboard hair with blind hole after sintering
Base uses stearic acid (ammonium) or silane coupler modified processing.
E) flash and surplus are machined away by the backboard blank handled in step e) using CNC process equipments, then made
The honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard is obtained with ceramic grinding and polishing processing.
It is below the specific embodiment of the present invention：
Embodiment 1
Weigh 3Y-TZP ceramic powders 1.85kg, No. 58 paraffin 80g (4%) and the 60g that stearic acid 10g, D50 are 200nm
Polyphenylene sulfide, the organic matter weighed is added in 3L banbury and is warming up to 120 DEG C and makes its thawing, then divides 3 times by ceramics
Powder adds banburying, after the completion for the treatment of that ceramic powder adds, banbury is taken out into negative pressure to -0.08MPa, obtained in 150 DEG C of banburying 1h
Feeding.Feeding is loaded in the hopper of injection machine, then by size be length of side 10mm, blind hole depth 0.9mm, wall thickness 3mm triangles are blind
Punch die loads injection machine and die cavity is evacuated into -0.07MPa, and the die cavity of the mould is thick for 2mm, and size is 5 inches.Setting injection
Machine barrel temperature is 155 DEG C, and injection pressure is molded for 150MPa, and mold temperature is 120 DEG C, the feeding of melting is injected mould at a high speed
Pressurize 1s in chamber, mould clamp force is promoted to shaping pressurize 1min under 200MPa again, it is deep to obtain length of side 10mm, blind hole
0.9mm, wall thickness 3mm equilateral triangle blind hole cell phone back laminin base.
The cell phone back laminin base stacking is put into debinding furnace and is to slowly warm up to 170 DEG C with 0.2 DEG C/min speed, insulation
Furnace cooling after 20h, then cell phone back laminin base stacking is put into sintering furnace by 1 DEG C/min, it is small to be warming up to 450 DEG C of insulations two
When, then 1 DEG C/min is warming up to 650 DEG C, cools after being then warming up to 1500 DEG C of insulation 2h with 5 DEG C/min speed by 5 DEG C/min
Mobile phone backboard blank is obtained to 950 DEG C of furnace coolings.
Weigh γ-aminopropyl triethoxysilane (KH550) 50g and add 2kg deionized waters and 2kg alcohol mixed solutions
In, then mobile phone backboard blank is put into after wherein impregnating 2h and is put into oven drying, then coat liquid-state epoxy resin to blind
Scrape off after unnecessary liquid-state epoxy resin that 60 DEG C of solidification 120min, postnotum blank use CNC process equipments in an oven in hole
Flash and surplus are machined away, its grinding and polishing processing is then obtained into the honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard.
By the more sub-samplings of sample requirement of three-point bending method test bending strength and Single edge notch beam test fracture toughness
Test is averaged, and test result is that the bending strength of the composite ceramics is 1067MPa, fracture toughness 14.8MPa.m1/2, and
According to thank will roc work《Structural ceramics》One book introduction Y-TZP commercial at present bending strength is usually 800~1200MPa, is broken
It is 8~12MPa.m to split toughness1/2.With the Y-TZP ceramic phases ratio of commercialization, fracture toughness is significantly improved, is particularly suited for outside mobile phone
Shell (backboard).
Embodiment 2
Weigh 3Y-TZP ceramic powder 1.704kg, 180g56 paraffin and 100g that ammonium stearate 16g, D50 are 30nm
Polyethylene, make its thawing by being warming up to 120 DEG C in the organic matter weighed addition 3L banbury, then divide 3 times by ceramic powder
Banburying is added, after the completion for the treatment of that ceramic powder adds, banbury is taken out into negative pressure to -0.05MPa, feeding is obtained in 120 DEG C of banburying 4h.
Feeding is loaded in the hopper of injection machine, then by size be length of side 0.5mm, blind hole depth 0.1mm, wall thickness 0.5mm square blind holes
Mould loads injection machine and die cavity is evacuated into -0.09MPa, and the die cavity of the mould is thick for 0.3mm, and size is 4 inches.Setting injection
Machine barrel temperature is 130 DEG C, and injection pressure is molded for 200MPa, and mold temperature is 110 DEG C, the feeding of melting is injected mould at a high speed
Pressurize 1.5s in chamber, mould clamp force is promoted to shaping pressurize 1s under 250MPa again, it is deep to obtain length of side 0.5mm, blind hole
0.1mm, wall thickness 0.5mm square blind hole cell phone back laminin base.
Cell phone back laminin base stacking is put into debinding furnace is to slowly warm up to 170 DEG C with 0.2 DEG C/min speed, is incubated 20h
Furnace cooling afterwards, cell phone back laminin base stacking is put into sintering furnace by 1 DEG C/min, is warming up to 400 DEG C and is incubated two hours, then
1 DEG C/min is warming up to 650 DEG C, and 950 DEG C are cooled to by 5 DEG C/min after being then warming up to 1300 DEG C of insulation 4h with 5 DEG C/min speed
Furnace cooling obtains mobile phone backboard blank.
Weigh γ-aminopropyl triethoxysilane (KH550) 30g and γ-glycidyl ether oxygen propyl trimethoxy silicane
(KH560) 20g is added in 2kg deionized waters and 2kg alcohol mixed solutions, is then put into mobile phone backboard blank and is wherein impregnated 2h
After be put into oven drying, then liquid-state silicon gel is coated to scraping off after unnecessary liquid-state silicon gel resin in an oven 180 in blind hole
DEG C solidification 5min, then backboard blank flash and surplus are machined away using CNC process equipments, then its grinding and polishing is handled and produced
To the honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard.
By the more sub-samplings of sample requirement of three-point bending method test bending strength and Single edge notch beam test fracture toughness
Test is averaged, and test result is that the bending strength of the composite ceramics is 1132MPa, fracture toughness 14.1MPa.m1/2。
Embodiment 3
Weigh the 3Y-TZP ceramic powders that γ-(methacryloxypropyl) propyl trimethoxy silicane 16g, D50 is 30nm
1.704kg, No. 58 paraffin 180g and 100g polypropylene, the organic matter weighed is added in 3L banbury and is warming up to 130 DEG C
Make its thawing, then divide 3 times and ceramic powder is added into banburying, treat ceramic powder add after the completion of, by banbury take out negative pressure to-
0.05MPa, feeding is obtained in 135 DEG C of banburying 3h.By feeding load injection machine hopper in, then by size be length of side 5mm, blind hole
The positive five shapes blind hole mould of deep 0.1mm, wall thickness 2mm loads injection machine and die cavity is evacuated into -0.08MPa, and the die cavity of the mould is
0.8mm is thick, and size is 5.5 inches.Injection machine barrel temperature is set as 145 DEG C, injection pressure is molded for 180MPa, mold temperature
For 90 DEG C, the feeding of melting is set to inject pressurize 2s in die cavity at a high speed, mould clamp force is promoted into shaping under 150MPa again protects
2min is pressed, obtains length of side 5mm, blind hole depth 0.1mm, wall thickness 2mm regular pentagon blind hole cell phone back laminin base.
Cell phone back laminin base stacking is put into debinding furnace is to slowly warm up to 170 DEG C with 0.2 DEG C/min speed, is incubated 20h
Furnace cooling afterwards, cell phone back laminin base stacking is put into sintering furnace by 1 DEG C/min, is warming up to 430 DEG C and is incubated two hours, then
1 DEG C/min is warming up to 650 DEG C, and 950 DEG C are cooled to by 5 DEG C/min after being then warming up to 1350 DEG C of insulation 2h with 5 DEG C/min speed
Furnace cooling obtains mobile phone backboard blank.
Weigh γ-(methacryloxypropyl) propyl trimethoxy silicane 50g and add 2kg deionized waters and the mixing of 2kg ethanol
In solution, then mobile phone backboard blank is put into after wherein impregnating 2h and is put into oven drying, then coat liquid-state silicon gel to blind
180 DEG C of solidification 10min in an oven are scraped off after unnecessary liquid-state silicon gel in hole, then backboard blank uses CNC process equipments general
Flash and surplus are machined away, and pottery backboard blank grinding and polishing processing i.e. then is obtained into the honeycomb blind hole toughened zirconium oxide ceramic hand
Machine backboard.
By the more sub-samplings of sample requirement of three-point bending method test bending strength and Single edge notch beam test fracture toughness
Test is averaged, and test result is that the bending strength of the composite ceramics is 1209MPa, fracture toughness 15.6MPa.m1/2。
Embodiment 4
Weigh γ-aminopropyl triethoxysilane 12g, D50 be 50nm 8Ce-TZP ceramic powders 1.708kg,
The polypropylene of 180g58 paraffin and 100g, make its thawing by being warming up to 130 DEG C in the organic matter weighed addition 3L banbury,
Then divide 3 times and ceramic powder is added into banburying, after the completion for the treatment of that ceramic powder adds, banbury is taken out into negative pressure extremely -0.07MPa,
140 DEG C of banburying 3h obtain feeding.Feeding is loaded in the hopper of injection machine, then by size be length of side 3mm, blind hole depth 0.3mm, wall
The thick positive six shapes blind hole moulds of 2mm load injection machine and die cavity are evacuated into -0.08MPa, and the die cavity of the mould is thick for 1.2mm, size
For 6 inches.Injection machine barrel temperature is set as 150 DEG C, injection pressure is molded for 190MPa, and mold temperature is 100 DEG C, makes melting
Feeding at a high speed injection die cavity in pressurize 1s, mould clamp force is promoted to shaping pressurize 30s under 220MPa again, obtains the length of side
3mm, blind hole depth 0.3mm, wall thickness 2mm positive six shapes blind hole cell phone back laminin base.
Cell phone back laminin base stacking is put into debinding furnace is to slowly warm up to 170 DEG C with 0.2 DEG C/min speed, is incubated 20h
Furnace cooling afterwards, cell phone back laminin base stacking is put into sintering furnace by 1 DEG C/min, is warming up to 420 DEG C and is incubated two hours, then
1 DEG C/min is warming up to 650 DEG C, and 950 DEG C are cooled to by 5 DEG C/min after being then warming up to 1400 DEG C of insulation 2h with 5 DEG C/min speed
Furnace cooling obtains mobile phone backboard blank.
Weigh and be well mixed in stearic acid 50g addition 3kg ethanol solutions, then mobile phone backboard blank is put into and wherein impregnated
Oven drying is put into after 3h, then coats liquid-state epoxy resin to scraping off in blind hole after unnecessary liquid-state epoxy resin in baking oven
In 80 DEG C solidification 40min, then backboard blank flash and surplus are machined away using CNC process equipments, then using ceramic grinding
Throw processing and obtain the honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard.
By the more sub-samplings of sample requirement of three-point bending method test bending strength and Single edge notch beam test fracture toughness
Test is averaged, and test result is that the bending strength of the composite ceramics is 1104MPa, fracture toughness 14.9MPa.m1/2。
Embodiment 5
Weigh γ-glycidyl ether oxygen propyl trimethoxy silicane 6g, γ-(methacryloxypropyl) propyl trimethoxy silicon
Alkane 6g, D50 are 30nm 3Y-TZP ceramic powder 1.708kg, 160g56 paraffin and 80g polyphenylene sulfide, are had what is weighed
Being warming up to 145 DEG C in machine thing addition 3L banbury makes its thawing, then divides 3 times ceramic powder adding banburying, treat ceramic powder
After the completion of body adds, banbury is taken out into negative pressure to -0.06MPa, feeding is obtained in 150 DEG C of banburying 2h.Feeding is loaded into injection machine
Hopper in, then by size be diameter 6mm, blind hole depth 0.2mm, wall thickness 1.5mm blind round hole mould loads injection machine and by mould
Chamber is evacuated to -0.08MPa, and the die cavity of the mould is thick for 1mm, and size is 5.7 inches.Injection machine barrel temperature is set as 155 DEG C, is noted
Blow pressure is molded for 190MPa, and mold temperature is 100 DEG C, the feeding of melting is injected pressurize 1s in die cavity at a high speed, again by mould
Tool clamp force is promoted to shaping pressurize 40s under 230MPa, and it is blind to obtain diameter 6mm, blind hole depth 0.2mm, wall thickness 1.5mm positive six shape
Hole cell phone back laminin base.
Cell phone back laminin base stacking is put into debinding furnace is to slowly warm up to 170 DEG C with 0.2 DEG C/min speed, is incubated 20h
Furnace cooling afterwards, cell phone back laminin base stacking is put into sintering furnace by 1 DEG C/min, is warming up to 450 DEG C and is incubated two hours, then
1 DEG C/min is warming up to 650 DEG C, and 950 DEG C are cooled to by 5 DEG C/min after being then warming up to 1380 DEG C of insulation 2h with 5 DEG C/min speed
Furnace cooling obtains mobile phone backboard blank.
Weigh and be well mixed in ammonium stearate 50g addition 3kg ethanol solutions, then mobile phone backboard blank is put into and wherein soaked
Oven drying is put into after stain 3h, then liquid-state epoxy resin is coated to after scraping off unnecessary liquid-state epoxy resin in blind hole and dried
70 DEG C solidify 60min in case, and then backboard blank is machined away flash and surplus using CNC process equipments, then by its grinding and polishing
Processing obtains the honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard, as shown in Figure 2.
By the more sub-samplings of sample requirement of three-point bending method test bending strength and Single edge notch beam test fracture toughness
Test is averaged, and test result is that the ceramic bending strength is 1203MPa, fracture toughness 15.8MPa.m1/2。
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical schemes for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical scheme that the technical characteristic of energy is replaced mutually and formed.
Claims (10)
1. honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard, it is characterised in that：The first of zirconia ceramics mobile phone backboard is flat
There is more than one regular polygon blind hole on face, cure package organic polymer plastic material in blind hole.
2. honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 1, it is characterised in that：Organic high score
Sub- plastic material is epoxy resin or silica gel.
3. honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 2, it is characterised in that：Positive shape changeable
The hole depth of blind hole is 0.1mm~0.9mm, and the length of side of the regular polygon of regular polygon blind hole is 0.5mm~10mm, two neighboring
The wall thickness of regular polygon blind hole is 0.5mm~3mm.
4. honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 3, it is characterised in that：Regular polygon
Blind hole is one kind in equilateral triangle blind hole, square blind hole, regular pentagon blind hole, regular hexagon blind hole and round blind hole.
5. a kind of preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard, it is characterised in that comprise the following steps：
A) by surface modifier, inorganic nano Zirconium powder, paraffin and high-molecular organic material in banbury high temperature negative pressure
Banburying obtains feeding；
B) will be melted under mould cavity negative pressure in mould of the feeding injection with more than one regular polygon boss, in fritting
The pressurization shaping of state secondary mould closing forms the backboard biscuit with more than one regular polygon blind hole；
C) backboard biscuit is obtained into backboard blank through degreasing heat preservation sintering；
D) using the regular polygon blind hole of surface improver processing backboard blank；
E) after injecting liquid-state epoxy resin or liquid-state silicon gel in the regular polygon blind hole of the backboard blank handled by step d)
In 60 DEG C~180 DEG C temperature-curable 5min~120min.
6. the preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 5, its feature exist
In：Mold temperature is 90 DEG C~120 DEG C during shaping in step b), and pressure be 150MPa~250MPa, the dwell time for 1s~
2min；
Organic polymer is one kind in polyethylene, polypropylene, polyphenylene sulfide in step a)；The mass percent of surface modifier
For 0.5%~0.8%, the mass percent of inorganic nano Zirconium powder is 85.2%~92.5%, the quality percentage of paraffin
Than for 4%~9%, organic macromolecule mass percent is 3%~5%.
7. the preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 6, its feature exist
In：
Step b) dorsulum biscuits thickness is 0.3mm~2mm；The hole depth for the positive shape changeable blind hole that shaping obtains be 0.1mm~
0.9mm, the length of side of the regular polygon of regular polygon blind hole is 0.5mm~10mm, and the wall thickness of two neighboring regular polygon blind hole is
0.5mm~3mm, wherein regular polygon blind hole are equilateral triangle blind hole, square blind hole, regular pentagon blind hole, regular hexagon
It is a kind of in blind hole and round blind hole；
Step a) and d) in surface improver be stearic acid, ammonium stearate and silane coupler in one kind.
8. the preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 7, its feature exist
In：Silane coupler is γ-aminopropyl triethoxysilane, γ-glycidyl ether oxygen propyl trimethoxy silicane and γ-(first
Base acryloyl-oxy) one or two kinds of combinations in propyl trimethoxy silicane；Inorganic nano Zirconium powder is the stable nano oxygen of yttrium
Change zirconium, its D50 is 30nm~200nm.
9. the preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 8, its feature exist
In：Mixing temperature is 120 DEG C~150 DEG C in step a), and negative pressure is -0.05MPa~-0.08MPa, and mixing time is 1~4h；Step
It is rapid b) in injecting forming temperature be 130 DEG C~155 DEG C, negative pressure is -0.07MPa~-0.09MPa.
10. the preparation method of honeycomb blind hole toughened zirconium oxide ceramic mobile phone backboard according to claim 9, its feature exist
In：Step c) sintering temperatures are 1300 DEG C~1500 DEG C, soaking time 2h~4h.
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