CN107390798A - Paper-folded mobile phone/computer integrated super flexible apparatus - Google Patents
Paper-folded mobile phone/computer integrated super flexible apparatus Download PDFInfo
- Publication number
- CN107390798A CN107390798A CN201710784838.8A CN201710784838A CN107390798A CN 107390798 A CN107390798 A CN 107390798A CN 201710784838 A CN201710784838 A CN 201710784838A CN 107390798 A CN107390798 A CN 107390798A
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- Prior art keywords
- foldable
- flexible
- mobile phone
- folded
- paper
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
Abstract
The invention provides a kind of paper-folded mobile phone/computer integrated super flexible apparatus, it is related to super flexible electronic devices technical field.The equipment includes positive flexible foldable polymer encapsulation layer, foldable transparent thin film capacitance touch sensitive layer, foldable polymer insulation layer (built-in magnet and iron plate, to realize that the magnetic after equipment folding is bonded fixation), foldable OLED display screen, the foldable flexible circuit board embedded with rigid treatment device and battery and the foldable flexible packaging bottom layer of bottom；Conduction is such as needed between layers, then using the compound adhesion of electrically conducting transparent glue, such as needs to insulate between layers, then hard parts is not introduced using the insulation compound adhesion of OCA optical cements, overall package mode.For example and without limitation, scheme provided by the invention, its advantage are：The equipment bendable is folded, and can arbitrarily bend a large amount of numbers, to realize the conversion back and forth of mobile phone and portable computer function, and it is easy to operate, it is practical.
Description
Technical field
The present invention relates to super flexible electronic devices technical field, more particularly to a kind of paper-folded hand that arbitrarily can be bent repeatedly
Machine/computer integrated super flexible apparatus.
Background technology
With the reach of science and the progress of technology, people are to electronics (particularly mobile phone, flat board, computer)
It is required that also increasingly improved with relying on, and becoming stronger day by day with cell-phone function so that it develops towards the direction of microcomputer,
But due to the limitation of mobile phone screen size so that it still can not substitute the Core Feature of notebook computer；It is simultaneously as electric
Brain is unhandy to carry about, and this hinders computer and realizes mobile phone again, if can be by the function of mobile phone, flat board and computer integrated one
Body is simultaneously realized portable, it will the development of communication electronics industry is promoted significantly, so as to significantly facilitate the work of people and life.
To realize the target, mode the most direct, then be can by way of arbitrarily changing instrument size, reach mobile phone, flat board,
The random conversion of computer.Therefore, countries in the world associated companies and research institution are all actively carrying out correlative study.Main progress
The problem of with existing, is as follows：
Though Apple Inc. does not propose the concept of portable computer integration formally, but designs and applied related foldable
The patent of phone housing, and the patent of entitled " flexible display device " (No.9504170), apple make use of nickel in the patent
The elastic construction of titanium alloy and can memory characteristic, and replace existing flexible polymer.In some citings in the patent,
This folding smart mobile phone includes foldable base, and is divided into two parts up and down, and each part contains processing
Device, sensor and the common circuit unit of some smart mobile phones.Such as top half will include camera, display controller,
Loudspeaker module and ambient light sensor, and then have microphone, CPU, GPU, vibrator and some other necessity in the latter half
Component.Its upper and lower two part is all connected by a single or multiple hinge mechanism, and can be moved and be folded each other,
Upper and lower two parts carry out data exchange by flexible print wiring board, but the integration of these designed distance portable computers is mutually gone very
Far, only may be regarded as intelligent clamshell phone, its limitation have it is following some：1) be to use hinge folding technique at folding, be only capable of into
Row doubling, is unfavorable for effective diminution of equipment, and practicality is not strong；2) apple design these flexible stretchable screens and
Device, any change instrument size that can not be truly, nor flexible foldable equipment.
Canadian Queens University once issued a paper mobile phone, can carry out mobile phone operation, still, 1 by bend mode) it is adopted
Flexible material can only realize the bending of certain angle, can not wide-angle fold, therefore can not realize portable computer integration；
2) it can not carry out a selection operation by touching, and can only should be operated by bending progress mechanical sense, intelligence is omitted in part
Most of part of energy mobile phone.
Samsung proposes integrated conception, and devises related notion product, and it is by three pieces of mobile phone sizes
Operation display panel is spliced, and by the bearing of junction can fold and sprawl around axle, be mobile phone after folding, spread
It is tablet personal computer after exhibition, turns into notebook computer after external connection keyboard, but still to reach three-dimensional far away any for the concept product
The purpose of scaling and requirement, thus integration apparatus can not be called at all, reason has three：1) in terms of area scaling, by
The limitation of every piece of splice plate size, longitudinal size can not change, so as to cause：Can not further it reduce downwards, it is not readily portable；
It can not further increase upwards, influence vision and be not easy to operate.2) in terms of thickness and volume, because every piece of operation panel is exactly
One mobile phone so that whole equipment is blocked up after folding, and volume is excessive, very heavy, can not meet operation readiness and takes with oneself
The requirement of band；3) on folding mode, the concept product is not to take flexible folding mode of operation, but by the machinery of bearing
Stir and folded, it is similar to conventional clamshell phone, it is exactly the mechanical connection of three pieces of mobile phones, so, the product is with regard to nothing
Method freely scales in three dimensions, because rather than what innovation design, far from integrated conception.In a word, this is general
Read product and realize any folding mode due to failing, so it is not more convenient, but more clumsy to use, and just
The property taken and functionally on the contrary not as good as single mobile phone, flat board and computer：It is long blocked up overweight for it is as mobile phone, inconvenience
Carry；For flat board, size is uncoordinated；And be used as computer, screen is too small and too flat, and function is too weak, far from
And existing notebook computer, and one external connection keyboard of band is also needed to, it can not carry with all.So its so-called mobile phone
It is computer integrated to have the suspicion disguised replacement of concept, it can not really realize at all and mobile phone, flat board and electricity are carried out on the premise of carrying with
Any conversion of brain, thus can not still be called real integration apparatus.
Sum it up, countries in the world using existing super flexible material using paper-folded not yet it has been proposed that designed come real at present
Existing mobile phone, flat board and computer integrated conception, more nobody can really produce mobile phone and computer integrated equipment.
The content of the invention
It is an object of the invention to：A kind of overcome the deficiencies in the prior art, there is provided paper-folded mobile phone/computer integrated super soft
Property equipment, the miniaturization portability of computer screen can not only be realized, can also realize the maximization of mobile phone, mobile phone is improved and use body
Test, i.e., can realize the conversion back and forth of mobile phone and portable computer function.
To realize above-mentioned target, the invention provides following technical scheme:
A kind of mobile phone of paper-folded/computer integrated super flexible apparatus, it is characterised in that：The equipment includes positive flexibility
Foldable polymer encapsulation layer, foldable transparent thin film capacitance touch sensitive layer, foldable polymer insulation layer, foldable OLED
The foldable flexible packaging bottom layer of display screen, the foldable flexible circuit board embedded with rigid treatment device and bottom；
When needing conduction between layers, using the compound adhesion of electrically conducting transparent glue；When needing insulation between layers, use
The insulation compound adhesion of OCA optical cements, and overall package mode does not introduce hard parts.
Preferably, the inside of the foldable polymer insulation layer is embedded with magnet and iron plate；
The magnet and iron plate be symmetrically distributed in couples the foldable polymer insulation layer two edge positions and in
The inside of line position, to realize that the magnetic after equipment folding is bonded fixation.
Preferably, the magnet and iron plate being embedded with inside the foldable polymer insulation layer respectively set 1-4 pieces.
Further, the equipment also includes processor and battery, the processor and battery be scattered be embedded in it is foldable soft
On four angles of property circuit board, and it is connected between each other with flexible circuit；
The foldable transparent thin film capacitance touch sensitive layer 2, foldable OLED display screen 4 respectively by connection line with
The processor connection.
Preferably, the flexible circuit uses ink jet printing flexible circuit, and technical process is：
1) get COPP nitrile resin ready (molecular weight is higher than 6-8 ten thousand)；
2) step 1) COPP nitrile resin is dissolved through solvent dromisol, forms viscosity as in the range of 1.8-2.8
Polyacrylonitrile Polymer Solution；
3) first by ethylene glycol, 2- methyl ethers according to volume ratio 1：1 is mixed, then acetylene black is dissolved in mixed solution, wherein second
The percentage that acetylene black accounts for gross mass is 3%, standby；
4) the polyacrylonitrile Polymer Solution of step 2) is mixed with the acetylene black mixed solution of step 3), that is, is made poly- third
Alkene nitrile high molecular electrically conductive ink；
5) required line pattern is designed in computer according to being actually needed；
6) using designed line pattern in ink-jet printer output computer, inkjet printing is carried out, is specially：Step
4) the polyacrylonitrile conductive polymer ink print prepared is on copper clad laminate, before obtaining being printed on polyacrylonitrile macromolecule
The copper foil of body circuit network；
7) copper foil that step 6) is printed on to polyacrylonitrile macromolecule precursor circuit network is put in atmosphere at progress Low Temperature Thermal
Reason, 270 DEG C are heated to, are incubated 0.5-3h, pre-oxidation treatment, form the high molecular copper foil of pre-oxidation for being printed on black；
8) the high molecular copper foil of pre-oxidation that step 7) is printed on to black again is carried out at 800 DEG C of high temperature cabonizations in nitrogen
Reason, eventually forms the copper foil for being printed on super flexible carbon circuit network；
9) foldable flexible plate is prepared, by the foldable flexible plate laminated in the super flexible carbon network on step 8) copper foil
On circuit, and hot pressing is heated, super flexible carbon network line is departed from copper foil and is shifted imprinted on foldable flexible plate, finally obtain
Obtain foldable flexible circuit board 5 of the invention.
Preferably, adopted between the flexible foldable polymer encapsulation layer and foldable transparent thin film capacitance touch sensitive layer
With using the compound adhesion of electrically conducting transparent glue；
It is described foldable between the foldable transparent thin film capacitance touch sensitive layer 2 and foldable polymer insulation layer 3
Between polymer insulation layer 3 between foldable OLED display screen 4, the foldable OLED display screen 4 and foldable flexible electricity
Between road plate 5, between the foldable flexible circuit board 5 and foldable flexible packaging bottom layer 6, the above is using insulation OCA light
Learn the compound adhesion of glue.
The above technical scheme that the present invention uses, compared with prior art, its innovation is：
(1) design innovation：1) the thinking limitation for breaking through equipment splicing extension and being folded mechanically, is designed to unbounded size system
The new model that arbitrarily folds of super flexible 3 D direction, so as to really realize mobile phone, flat board, computer integrated；2) propose first
Distributing mainboard processor designs, and effectively breaks the whole up into parts, solves the problems, such as that equipment mainboard can not rigidly fold；3) design carries first
Go out embedded magnet laminating type, ensure that equipment is brought into close contact after folding and realize integrality.
(2) technological innovation：1) folding super flexible carbon ink jet printing circuit technique thereof technology can be subjected to；2) first Application
First existing semi liquid state form ion touch-screen, breaks through the physical constraints of traditional ITO rigidity touch-screen completely, and breaks away from need
To greatly simplify production in the problem of the cumbersome wiring of touch screen surface and touch technique, innovate the new touch of smart machine
Induction mode, and fully achieve the function that touch-screen arbitrarily folds；3) it is super soft to choose existing PDMS high light transmittances polymer
Property material as phone housing, solving device housings can not a large amount of folding problem.
Brief description of the drawings
Fig. 1 is when paper-folded mobile phone provided in an embodiment of the present invention/computer integrated super flexible apparatus is in computermatic
Bottom section figure；
Fig. 2 is the 3D effect figure of paper-folded mobile phone provided in an embodiment of the present invention/computer integrated super flexible apparatus；
Fig. 3 is bowing for the folding process of paper-folded mobile phone provided in an embodiment of the present invention/computer integrated super flexible apparatus
Depending on schematic diagram.
Description of reference numerals：
Flexible foldable polymer encapsulation layer 1, foldable transparent thin film capacitance touch sensitive layer 2, foldable polymer are exhausted
Edge layer 3, foldable OLED display screen 4, foldable flexible circuit board 5, foldable flexible packaging bottom layer 6, magnet 7, iron plate 8, just
Property processor region A.
Embodiment
Below in conjunction with specific embodiment and its accompanying drawing to paper-folded mobile phone provided by the invention/computer integrated super flexibility
The technical scheme of equipment is described further.With reference to following explanation, advantages and features of the invention will be apparent from.
It should be noted that embodiments of the invention have preferable implementation, it is not to any type of limit of the present invention
It is fixed.The combination of technical characteristic or technical characteristic described in the embodiment of the present invention is not construed as isolated, and they can
Reach superior technique effect to be mutually combined.The scope of the preferred embodiment for the present invention can also include other reality
It is existing, and this should be understood by person of ordinary skill in the field of the embodiment of the present invention.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as authorizing part for specification.Institute that is shown here and discussing
Have in example, any occurrence should be construed as merely exemplary, not as restriction.Therefore, exemplary embodiment
Other examples can have different values.
The accompanying drawing of the present invention uses using very simplified form and non-accurately ratio, only to convenient, apparent
Ground aids in illustrating the purpose of the embodiment of the present invention, is not to limit the enforceable qualifications of the present invention.The modification of any structure,
The change of proportionate relationship or the adjustment of size, in the case where not influenceing the effect of the invention that can be generated and the purpose that can reach,
It should fall in the range of disclosed technology contents can be covered.And the identical label appeared in each accompanying drawing of the present invention
Identical feature or part are represented, can be applied in different embodiments.
As shown in Figure 1 to Figure 3, the present invention provides a kind of paper-folded mobile phone/computer integrated super flexible apparatus.
As shown in figure 1, the paper-folded mobile phone/computer integrated super flexible apparatus is under full deployed condition, from top to bottom according to
It is secondary including positive flexible foldable polymer encapsulation layer 1, foldable transparent thin film capacitance touch sensitive layer 2, foldable polymerization
It is thing insulating barrier 3 (built-in magnet 7 and iron plate 8), foldable OLED display screen 4, foldable soft embedded with rigid treatment device and battery
Property circuit board 5 and the foldable flexible packaging bottom layer 6 of bottom.
Wherein, each layer specific embodiment is as follows：
(1) positive flexible foldable polymer encapsulation layer 1 using existing high light transmittance polymer (such as PU, PET,
PDMS etc.), it can not only reduce the refraction and scattering of light, ensure screen imaging fidelity factor, while can also remain good close
Feng Xing.
(2) height that foldable transparent thin film capacitance touch sensitive layer 2 is made using the PAHG containing LiCl
The hydrogel ion touch-screen of transparency；Its external form is solid but has characteristics of liquids, is similar jelly or soft sweets kenel
Gelatinous mass；And turn into the core technology of electrostatic contact panel as conductor with ionic compartmentation electronics, breach electronics and return
The physical limit currently used for contact panel material such as road, transistor, diode；After gel containing ion is shakeout, four
Individual corner sticks electrode and forms contact panel, and surface is driven with electrostatic capacity type, and electric current caused by touch-control is communicated to four
After corner, the amount for measuring electric current is converted into coordinate again, and then goes out the position of finger touching in prediction on such basis；Because it has liquid
Property, there is certain fluidity, thus folding ability of mind can be realized, and light transmittance is good, electric conductivity is good, and sensing is sensitive.
(3) foldable polymer insulation layer 3 uses common high molecular polymer, such as dimethyl silicone polymer (PDMS).When
When dimethyl siloxane is in molten, embedded magnet 7 and iron plate 8, its specific embedded location are respectively four tops of insulating barrier 3
Angle and four sides abut midline position, and then cooling down is molded.
When integral device is folded, that of contact surface edge is attracted each other to magnet 7 and iron plate 8 after, makes to connect
Contacting surface mutually fits fixation；
When equipment need to be deployed again, attraction can be separated by slightly applying external force；That is magnetic folding locked die type.
Preferably, the magnet 7 and iron plate 8 that the foldable inside of polymer insulation layer 3 is embedded with can respectively set 1-4 pieces.
(4) foldable OLED display screen 4 can have been put into volume production and sold using the country/offshore company (such as Samsung)
Foldable OLED display screen；Such foldable super flexible display screen of OLED has the display characteristic of fine definition high-fidelity rate,
And it can pass through and repeatedly fold without influenceing the functions such as imaging.
(5) in the foldable flexible circuit board 5 (using PDMS substrate) embedded with rigid treatment device and battery, processor and electricity
Pond is because its occupied area is smaller, therefore without flexible., can by scattered be embedded in of processor and battery in order to not influence the folding of equipment
On four angles of folded flexible circuitry plate 5, and it is connected between each other with flexible circuit.Specifically, flexible base board surface is using spray
The innovative thinking that ink print technique is combined with circuit network design, using flexible base board copper foil as " printing paper ", will be designed
Good circuit network input computer, and by its by raw material for polyacrylonitrile Polymer Solution printing of inkjet printer in copper foil
On, be then super flexible carbon circuit network by copper foil surface macromolecule circuit high temperature cabonization, then by foldable flexible plate laminated in
It is printed on the copper foil of arrangement circuit, circuit is departed from copper foil and imprinted on foldable flexible plate, so as to complete foldable flexible
The trace arrangements on the surface of plate 5, the final foldable flexible circuit board 5 for obtaining the present invention；Meanwhile processor and cell parts utilize
Surface mounting technology (SMT) after improvement is mounted on flexible base board.For geometry angle, equipment can be any with doubling
It is secondary, as long as product is more than processor area behind doubling, processor and battery are not interfered with.
Further, the super flexible carbon circuit network of above-mentioned inkjet printing, it is as follows to provide specific process implementing step：
1) using routine techniques first by acrylonitrile and a small amount of second comonomer (methyl acrylate), Third monomer (methene fourth two
Ester) copolymerization generation COPP nitrile resin (molecular weight is higher than 6-8 ten thousand)；
2) and then by COPP nitrile resin (molecular weight is higher than 6-8 ten thousand) through solvent dromisol dissolve, Formation and characteristics
Viscosity is the polyacrylonitrile Polymer Solution in the range of 1.8-2.8；
3) first by ethylene glycol, 2- methyl ethers according to volume ratio 1：1 is mixed with mixed solution, then acetylene black is dissolved in into described mix
Close in solution, the percentage that wherein acetylene black accounts for gross mass is 3%, standby；
4) the polyacrylonitrile Polymer Solution of step 2) is mixed with the acetylene black mixed solution of step 3), that is, is made poly- third
Alkene nitrile high molecular electrically conductive ink；
5) required line pattern is designed in computer according to being actually needed；
6) using designed line pattern in ink-jet printer output computer, inkjet printing is carried out, is specially：Step
4) the polyacrylonitrile conductive polymer ink print prepared is on copper clad laminate, before obtaining being printed on polyacrylonitrile macromolecule
The copper foil of body circuit network.Printer (is given birth to using pull-down voltage inkjet nozzle by Microfab Technologies companies
Production, aperture 30um), and printhead is installed at the three-dimensional platform system of computer control.
7) copper foil that step 6) is printed on to polyacrylonitrile macromolecule precursor circuit network is put in atmosphere at progress Low Temperature Thermal
Reason, 270 DEG C are heated to, are incubated 0.5-3h, i.e. pre-oxidation treatment, be allowed to occur aoxidize, be pyrolyzed, being crosslinked, being cyclized a series of chemistry
Reaction forms heat-resisting ladderlike polymer, that is, forms the high molecular copper foil of pre-oxidation for being printed on black；
8) the high molecular copper foil of pre-oxidation that step 7) is printed on to black again carries out 800 DEG C of high-temperature process in nitrogen, i.e.,
Carbonization treatment, then circuit macromolecule further produces crosslinking cyclisation, aromatisation and polycondensation reaction, and removes hydrogen, nitrogen, oxygen atom,
Eventually form the copper foil for being printed on super flexible carbon circuit network；
9) foldable flexible plate is prepared, by the foldable flexible plate laminated in the super flexible carbon network on step 8) copper foil
On circuit, and hot pressing is heated, super flexible carbon network line is departed from copper foil and is shifted imprinted on foldable flexible plate, finally obtain
Obtain foldable flexible circuit board 5 of the invention.
The foldable flexible plate, its material are PDMS foldable flexible plate, for flexible macromolecule that can be folding
Material, and be insulator.
Why to be designed to first carry out ink-jet/carbonization machine-shaping of carbon network line on copper foil, then retransfer
Two-step method onto macromolecule flexible substrates, it is due to：Follow-up carbonisation needs high temperature, and macromolecule foldable flexible plate can not
Tolerance, therefore first polyacrylonitrile macromolecule precursor circuit is printed upon on copper foil；And ink-jet carbon line road is transferred to flexible electrical from copper foil
The purpose of the step for road plate is that short circuit caused by order to avoid directly application is printed on the copper foil meeting of super flexible carbon circuit network is existing
As, and copper foil can not be subjected to folding, and the foldable flexible plate that material is PDMS is flexible high score that can be folding
Sub- material, and be insulator, conducting wire will not be caused short-circuit, therefore the super flexible carbon circuit network on copper foil is transferred to can
On folded flexible circuitry plate；Finally give the foldable flexible circuit board 5 for being printed on super flexible carbonaceous conductive circuit network.
(6) bottom foldable flexible packaging bottom layer 6 uses non-light transmittance polymer, and selects common foldable flexible polymerization
Thing can (such as PDMS, PEO/PVDF).
Further, between each layer longitudinally through colloid adhesion to complete overall package, and hard parts are not introduced (such as
Screw etc.).Conduction is such as needed between layers, then the colloid uses electrically conducting transparent glue (conduction)；It is as exhausted in needed between layers
Edge, then the colloid use optical cement (insulation).
Specifically, the assembling mode between each layer is as follows：
(1) foldable transparent thin film capacitance touch sensitive layer 2, foldable OLED display screen 4 are passed through into connection line respectively
It is attached with the processor on flexible PCB 5.The connected mode specific implementation is that each layer of circuit both positive and negative polarity is each pre-
Stay one section of copper wire wire, in a series arrangement connect three layers, and be sequentially overlapped up and down, interlayer and need not use up learn glue or
Other modes bond.
(2) the positive and back side of foldable transparent thin film capacitance touch sensitive layer 2 of foldable polymer insulation layer 3 is used
OCA optical cement adhesions, and the gluing company of optics is also used in its back side and the front of foldable OLED display screen 4.
(3) by the back side of foldable OLED display screen 4 OCA optical cements and the flexible mainboard of foldable flexible circuit board 5
Adhesion.
(4) the front four edges line of foldable transparent thin film capacitance touch sensitive layer 2 is gathered with transparent flexible foldable
The conducting resin adhesion of compound encapsulated layer 1, back side optical cement and the foldable flexible packaging bottom layer 6 of foldable flexible circuit board 5
Adhesion.
(5) finally, the edge of upper and lower encapsulated layer (1,6) is subjected to packaging by hot pressing shaping, does not influence intraware, it is so far complete
Into whole assemblings.
As shown in Fig. 2 the paper-folded mobile phone/computer integrated super flexible apparatus, when all deploying, as rectangle surpasses
Thin flexible portable's computer (having gravity sensing system), carrying out folding operation can make the equipment from computermatic successively to pad formulas, hand
Hold formula, palm-type, the conversion of palm of the hand formula；Thus, the paper-folded mobile phone/computer integrated super flexible apparatus is keeping computer cell phone work(
While can be integrated, use and carrying mode can also be changed by folding.
For example and without limitation, a kind of folding process of the paper-folded mobile phone/computer integrated super flexible apparatus, such as scheme
Shown in 3.When the equipment is fully deployed, presentation is computermatic, and four angles of the style device are distributed with four rigidity respectively
Device region A is managed, while two sidelines of the foldable polymer insulation layer 3 of the style device and center line side difference are paired
Embedded magnet 7 and iron plate 8；Wherein, left side sideline is disposed with iron plate 8 (tip position) from top to bottom, magnet 7 (lean on by middle part
Upper position), magnet 7 (bottom position), the tip position of center line is provided with magnet 7, and the bottom position of center line is provided with iron plate 8,
Right side sideline is disposed with magnet 7 (tip position), iron plate 8 (middle part is top), iron plate 8 (bottom position) from top to bottom.
In a preferred embodiment, the paper-folded mobile phone/computer integrated super flexible apparatus is in folding process
Folding mode is, by the rearwardly doubling of its bottom, or passes through its right side rearwardly doubling.
Specifically, when style device is folded, by the rearwardly doubling of its bottom, and pass through doubling contact surface side
The magnet 7 of edge and iron plate 8 are attracted each other after, contact surface is mutually fitted fixation, to complete doubling, so that this be set
It is standby to be folded into pad formulas by computermatic；When pad formula equipment is folded, by its right side rearwardly doubling, and connect by doubling
The magnet 7 at contacting surface edge and iron plate 8 are attracted each other after, contact surface is mutually fitted fixation, to complete secondary doubling, so as to
The equipment is folded into hand-held by pad formulas；Above-mentioned two doubling process is repeated, further can be folded into the equipment successively
Palm-type, palm of the hand formula.When equipment needs to deploy again, as long as the attraction of magnet, iron plate can be separated by slightly applying external force, so that will
Equipment is deployed successively.Thus, in deployment lifting process, what is utilized is the paper-folded mobile phone/computer integrated super flexible apparatus
Magnetic folding locked die type.
In the present invention, it is real by configuring computer advanced processor, foldable display screen and touch-screen, built-in soft keyboard
Computer cell phone function integration is showed；By the design (except processor and battery) of equipment components flexibility foldableization,
Realize any paper-folded foldability repeatedly of three-dimensional of integration apparatus complete machine；Pass through surface coating technique, R2R technologies
The assembling of whole equipment is realized with OCA optical cement coating techniques, so as to reach mobile phone, flat board and computer integrated technology effect
Fruit.It is of the invention with the design comparison of existing Related product for, abandoned completely and the thinking folded realized by rotating shaft, compared to turning
For the single fold design of axle, design of the invention can carry out any repeatedly multi-angle and fold, so as to unconfined progress
The scaling of equipment profile, and it is mostly organic matter or netted carbon material to design raw material, compares the gold in existing relevant design product
It is more frivolous for belonging to component, there is portability and flexibility truly.Wherein, shell is polymerize using insulating polymer
Thing realizes that shell is foldable, and touch-screen realizes that touch-screen is foldable using ionic hydrogels touch-screen, and display screen use can roll over
Folded OLED realizes that display screen is foldable, and motherboard design by rigid chips by the way of disperseing to be arranged on flexible foldable substrate
(this is innovative design, respectively separates chip, memory, reader, four big core of battery, is dispersed in screen corner
And connected with flexible circuitry.) the foldable of processor main board is realized, so as to realize that complete machine is foldable.
The innovation of technical solution of the present invention is：1. the tectonic sieving (main body innovation) of foldable integral machine；2. can be through
By folding super flexible carbon ink jet printing circuit technique thereof technology (original innovation)；3. rigid chips segmentation interconnection technique (solution
Certainly equipment hard parts influence the problem of folding effect)；4. embedded magnet/(realization is set iron plate group flexible folding coating technique
Complete integraty after standby folding).
Technical scheme, for example and without limitation, have the advantages that：
(1) equipment bendable is folded, and can arbitrarily bend a large amount of numbers.
(2) effectively solves the fitting effect of faying surface after equipment bending by the form of built-in magnet so that set after bending
Standby globality is unaffected.
(3) foldable transparent thin film capacitance touch sensitive layer can utilize the existing PAHG system containing LiCl
The ion touch-screen of the high grade of transparency of work assembles, and realizes the foldability of touch-screen.
(4) design of foldable flexible circuit board is realized：Processor main board is distributed, is distributed in flexible base board
Corner, directly solves the folding problem of processor main board that prior art can not be realized, compared to the flexibility occurred more at present
Flexible mainboard, existing flexible mainboard are merely capable of bending smaller angle, can not folded, and otherwise can directly result in processor damage
It is bad, and the present invention completely avoid influence of the folding operation to processor using partition type design, folding whole process will not touch
Processor.
(5) the super flexible carbon ink jet printing circuit that the present invention uses, which breaches, can not print circuit network on flexible substrates
Bottleneck, and obtain super flexible circuitry；And first using carbon material as line material, and the current existing circuit of solution can not be multiple
The problem of folding.Carbonization-transfer-impressing the flow being related in embodiments directly solves super flexible base board in line material
The problem of can not being resistant in the high-temperature operation of carbonization.The innovative technology makes it possible processor main board foldable flexible.
(6) the big I of device screen is arbitrarily expanded and reduced within the specific limits.
(7) equipment can realize less parking space by curved folded mode, realize that the carry-on of device of computer function is taken
Band.
(8) equipment is not easy to break because it is flexible.
(9) no matter the integration apparatus folds how many times, and it has the function of mobile phone and computer concurrently.
(10) functions of the equipments are better than existing mobile phone, and portability is better than existing notebook computer, and energy consumption is less than one
As computer, be following optimal mobile phone and computer, for mobile phone should not expanded functionality on the premise of extended volume, for
For computer, it is easy to carry without reducing function.
Foregoing description is only the description to present pre-ferred embodiments, is not any restriction to the scope of the invention.Appoint
Any change or modification what those skilled in the art makes according to the technology contents of the disclosure above should regard
For equivalent effective embodiment, the scope that technical solution of the present invention is protected is belonged to.
Claims (6)
- A kind of 1. mobile phone of paper-folded/computer integrated super flexible apparatus, it is characterised in that：The equipment can including positive flexibility Folded polymeric thing encapsulated layer (1), foldable transparent thin film capacitance touch sensitive layer (2), foldable polymer insulation layer (3), can Fold OLED display screen (4), the foldable flexible circuit board (5) embedded with rigid treatment device and the encapsulation of the foldable flexible of bottom Bottom (6)；When needing conduction between layers, using the compound adhesion of electrically conducting transparent glue；When needing insulation between layers, using insulation The compound adhesion of OCA optical cements, and overall package mode does not introduce hard parts.
- 2. paper-folded mobile phone according to claim 1/computer integrated super flexible apparatus, it is characterised in that：It is described to roll over The inside of folded polymer insulation layer (3) is embedded with magnet and iron plate；The magnet and iron plate are symmetrically distributed in two edge positions and center line of the foldable polymer insulation layer (3) in couples The inside of position, to realize that the magnetic after equipment folding is bonded fixation.
- 3. paper-folded mobile phone according to claim 2/computer integrated super flexible apparatus, it is characterised in that：It is described to roll over The magnet and iron plate being embedded with inside folded polymer insulation layer (3) respectively set 1-4 pieces.
- 4. paper-folded mobile phone according to claim 1/computer integrated super flexible apparatus, it is characterised in that：Also include Processor and battery, the processor and battery are scattered to be embedded on four angles of foldable flexible circuit board (5), and mutually it Between be connected with flexible circuit；The foldable transparent thin film capacitance touch sensitive layer (2), foldable OLED display screen (4) respectively by connection line with The processor connection.
- 5. paper-folded mobile phone according to claim 4/computer integrated super flexible apparatus, it is characterised in that：The flexibility Circuit uses ink jet printing flexible circuit, and technical process is：1) get COPP nitrile resin ready (molecular weight is higher than 6-8 ten thousand)；2) step 1) COPP nitrile resin is dissolved through solvent dromisol, forms viscosity as gathering in the range of 1.8-2.8 Acrylonitrile Polymer Solution；3) first by ethylene glycol, 2- methyl ethers according to volume ratio 1：1 is mixed, then acetylene black is dissolved in mixed solution, wherein acetylene black The percentage for accounting for gross mass is 3%, standby；4) the polyacrylonitrile Polymer Solution of step 2) is mixed with the acetylene black mixed solution of step 3), that is, polyacrylonitrile is made Conductive polymer ink；5) required line pattern is designed in computer according to being actually needed；6) using designed line pattern in ink-jet printer output computer, inkjet printing is carried out, is specially：Step 4) is made The polyacrylonitrile conductive polymer ink print got ready is on copper clad laminate, so as to obtain being printed on polyacrylonitrile macromolecule precursor net The copper foil of shape circuit；7) copper foil that step 6) is printed on to polyacrylonitrile macromolecule precursor circuit network is put and carries out Low Temperature Heat Treatment in atmosphere, adds Heat is incubated 0.5-3h, pre-oxidation treatment, forms the high molecular copper foil of pre-oxidation for being printed on black to 270 DEG C；8) the high molecular copper foil of pre-oxidation that step 7) is printed on to black again carries out 800 DEG C of high temperature cabonization processing in nitrogen, most The copper foil for being printed on super flexible carbon circuit network is formed afterwards；9) foldable flexible plate is prepared, by the foldable flexible plate laminated in the super flexible carbon network line on step 8) copper foil On, and hot pressing is heated, super flexible carbon network line is departed from copper foil and is shifted imprinted on foldable flexible plate, final acquisition is originally The foldable flexible circuit board (5) of invention.
- 6. paper-folded mobile phone according to claim 1/computer integrated super flexible apparatus, it is characterised in that：The flexibility Electrically conducting transparent glue is used between foldable polymer encapsulation layer (1) and foldable transparent thin film capacitance touch sensitive layer (2) Compound adhesion；It is described foldable between the foldable transparent thin film capacitance touch sensitive layer (2) and foldable polymer insulation layer (3) Between polymer insulation layer (3) between foldable OLED display screen (4), the foldable OLED display screen (4) with it is foldable Between flexible PCB (5), between the foldable flexible circuit board (5) and foldable flexible packaging bottom layer (6), the above is adopted With the insulation compound adhesion of OCA optical cements.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710784838.8A CN107390798B (en) | 2017-09-04 | 2017-09-04 | Paper folding type mobile phone/computer integrated super-flexible equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710784838.8A CN107390798B (en) | 2017-09-04 | 2017-09-04 | Paper folding type mobile phone/computer integrated super-flexible equipment |
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| CN107390798A true CN107390798A (en) | 2017-11-24 |
| CN107390798B CN107390798B (en) | 2023-08-04 |
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| CN113395831A (en) * | 2021-06-02 | 2021-09-14 | 深圳市合盛创杰科技有限公司 | Electronic component packaging structure of IML touch film and manufacturing method thereof |
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| CN107390798B (en) | 2023-08-04 |
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