CN107390780A

CN107390780A - The arrangement of electronic installation and its module

Info

Publication number: CN107390780A
Application number: CN201710273376.3A
Authority: CN
Inventors: 金炯达; 权悟赫; 姜涵璨; 金俊英; 金纹顷; 金鋿燮; 朴正植; 郑熙锡; 赵成; 申兴植; 吴志雄
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2016-12-05
Filing date: 2017-04-21
Publication date: 2017-11-24
Anticipated expiration: 2037-04-21
Also published as: CN107390780B; CN206848866U

Abstract

Display and flexible printed circuit board (FPCB) may include according to the electronic installation of an embodiment, wherein, display includes the join domain that viewing area and the side from the viewing area extend, and FPCB electrically connects with the join domain.A part for the join domain is spine folded towards the viewing area, and to cause the back side of the FPCB and the back side of the viewing area to separate relatively, and the back side of the FPCB can be disposed with predetermined module.

Description

The arrangement of electronic installation and its module

Technical field

Embodiments disclosed herein is related to a kind of arrangement of the module in electronic installation.

Background technology

With PC (personal computer) popularization, nearest smart mobile phone (smartphone) is wearable (wearable) portable electron device that equipment etc. has display is popularized more and more widely.The portable electron device Display can realize as the so-called touch-screen display with touch panel.The touch-screen display can not only be used as can Depending on property display device, can be used as to receive the input unit of user's operation and performing.

With the demand of user, the touch-screen display that is carried on the portable electron device (for example, smart mobile phone) Size to have from the increase of 3 inch be more than 5 inches of trend.With the Enlargement Tendency of the touch-screen display, Quite a few positive region of the electronic installation can be occupied by touch-screen display.

The content of the invention

The technical problem of solution

It is disclosed herein in the case where the positive whole outward appearance of electronic installation is substantially made up of touch-screen display Embodiment can provide it is a kind of be used for the bottom of the touch-screen display (below) arrange hardware module (for example, pressure Force snesor, biology sensor etc.) structure and electronic installation including the structure.

Solution method

According to embodiments disclosed herein, the display device of electronic installation may include display and FPCB (flexibility prints Printed circuit board), wherein, display includes the join domain that viewing area and the side from the viewing area extend, and FPCB electrically connects with the join domain.A part for the join domain can towards the spine folded of the viewing area, with So that the back side at the back side of the FPCB and the viewing area separates relatively, and the back side of the FPCB can be disposed with (mount) predetermined module.

Display panel and FPCB may include according to the electronic installation of another embodiment, wherein, FPCB includes showing with described The flat site (planar area) for showing the bending area (bent area) of panel electrical connection and being connected with the bending area. The bending area can be towards the spine folded of the display panel, to cause the back side of the flat site and the display surface The back side of plate separates (apart from) with respect to (facing), and pre- cover half can be disposed with the back side of the flat site Block.

Beneficial effect

According to embodiments disclosed herein, filled for the electronics that display is disposed with its positive most of region Put, it can be in the case of without prejudice to the display of display and (touch) input function, there is provided based on being arranged in the display The function of the hardware module of device bottom.Furthermore it is possible to provide the multi-effect directly or indirectly recognized by the present invention.

Brief description of the drawings

Fig. 1 shows the electronic installation according to various embodiments.

Fig. 2 shows the block diagram of the electronic installation according to various embodiments.

Fig. 3 shows the front elevation of the electronic installation according to an embodiment.

Fig. 4 shows the exploded perspective view of the electronic installation according to an embodiment.

Fig. 5 a and Fig. 5 b show the display device according to an embodiment.

Fig. 6 a and Fig. 6 b show the arrangement of the hardware module of the electronic installation according to an embodiment.

Fig. 7 a and Fig. 7 b show the arrangement of the hardware module of the electronic installation according to another embodiment.

Fig. 8 a and Fig. 8 b show the arrangement of the hardware module of the electronic installation according to another embodiment.

Fig. 9 shows the arrangement of the biology sensor and pressure sensor according to an embodiment.

Figure 10 shows the arrangement of the biology sensor and pressure sensor according to various embodiments.

Figure 11 a and Figure 11 b are shown to be arranged according to the biology sensor of various embodiments and the FPCB of pressure sensor Structure.

Figure 12 shows the flow chart of the fingerprint verification method according to an embodiment.

Figure 13 is shown according to an embodiment to illustrate the diagram of fingerprint verification method.

Embodiment

Lower section, recorded with reference to the accompanying drawing with the various embodiments of the present invention.However, this is not intended as to this hair Bright particular implementation form is defined, and is interpreted as including a variety of modifications of embodiment of the present invention (modification), equivalent (equivalent) and/or substitute (alternative).On brief description of the drawings, to similar Inscape similar reference marker can be used.

In this specification, the wording such as " with ", " can with ", " comprising " or " may include " represents this feature (for example, number The inscapes such as value, function, operation or component) presence, and be not precluded from the presence of supplementary features.

In this specification, " A or B ", " at least one in A or/and B " or " one or more of A or/and B " etc. arrange Diction may include all possible combination for the project together listed.For example, " A or B ", " at least one in A and B ", " in A or B It is at least one " may refer to that (1) includes at least one A, (2) include at least one B or (3) while including at least one A With at least one B situation.

In this specification, the wording such as " the 1st ", " the 2nd ", " first ", " second " can independently repair with order and/or importance Adorn a variety of inscapes, and these wording merely for the purpose for differentiating an inscape and another inscape and Use, not these inscapes are defined.For example, the first user equipment and second user equipment can be with orders and important Property independently represents user equipment different from each other.For example, in the feelings without departing from the right described in this specification Under condition, the first inscape can be described as the second inscape, and similarly, the second inscape is also alternatively referred to as the first composition Key element.

When referring to being some inscape (for example, first inscape) and another inscape (for example, second form will Element) (functionally or communicatedly) connection ((operatively or communicatively) coupled with/to) or even When meeting (connected to), it is thus understood that some described inscape directly couples with another inscape or passes through it Its inscape (for example, the 3rd inscape) is coupled.On the contrary, when referring to being some inscape (for example, the first structure Into key element) with another inscape (for example, second inscape) " directly coupling " or " being directly connected to " when, it will be appreciated that be described Other inscapes (for example, the 3rd inscape) are not present between some inscape and another inscape.

Wording as used in this specification " be configured to (or be arranged to；Configured to) " can according to circumstances for example With " being suitable for (suitable for) ", " there is ... ability (having the capacity to) ", " be made as (made To) " or " can (capable of) " alternatively uses.Term " being configured to (or being arranged to) " may might not only represent with The structure of example, in hardware " special design (specifically designed to) ".In some cases, wording " configuration For ... device " may imply that the device " can " together " execution " operates with other devices or part.For example, sentence " configuration (or setting) is execution A, BC processor " may imply that the application specific processor for performing corresponding operating, or can At least one software program in storage device is stored in perform the general processor (generic- of corresponding operating by operation purpose processor；For example, CPU or application processor).

It is as used in this specification to be used to use merely for the purpose of description particular implementation, it is not intended that to limit The scope of other embodiment.Unless conclusivelying show contrary within a context, singular references may include plural statement.This Term (including technology is used for or scientific words) used in text can have the implication being generally understood that with those skilled in the art Identical implication.In term as used in this specification, the term being defined in common dictionary may be interpreted as to it related The possessed same or similar implication of implication in the context of technology, unless clearly being defined in this specification, otherwise should not The implication for being construed to preferable or excessively formalizing.As the case may be, even term defined in this specification not yet The embodiment of this specification can be construed to exclude.

For example it may include according to the electronic installation of the various embodiments of this specification at least one in item set forth below：Intelligence Can mobile phone (smartphone), tablet personal computer (tablet personal computer), mobile phone (mobile phone), Visual telephone, E-book reader (e-book reader), desktop computer (desktop PC), laptop computer (laptop PC), net book (netbook computer), work station (workstation), server, PDA (personal digital assistants； Personal digital assistant), PMP (portable media player, portable multimedia Player), MP3 player, ambulatory medical device, camera or wearable device (wearable device).According to various realities Mode is applied, wearable device is at least one in item set forth below including may include：Jewellery type is (for example, table, ring, bangle, pin Chain, necklace, glasses, contact lenses or wear-type device (head-mounted-device；HMD)), fabric or clothing one Type (for example, Electronic Clothes), body attachment type (for example, pad skin (skin pad) or tatoo) or biological embedded type are (for example, can At least one of implantation circuit).

In some embodiments, electronic installation can be household electrical appliance (home appliance).Household electrical appliance are for example It may include at least one in item set forth below：TV, DVD player (Digital Video Disk player), audio are broadcast Put device, refrigerator, air-conditioning, dust catcher, baking box, electromagnetic oven, washing machine, air purifier, set top box (set-top box), family Automated condtrol panel (home automation control panel), security control panel (security control Panel), TV boxes (for example, Samsung HomeSyncTM, apple TVTM or Google TV TM), game console (for example, XboxTM, PlayStationTM), electronic dictionary, electron key, video camera or digital photo frame.

In another embodiment, electronic installation may include at least one in item set forth below：Various Medical Devices (examples Such as, various portable medical detection devices (glucometer, heart rate measuring instrument, survey meter of blood pressure or body temperature measuring instrument etc.)), MRA (Magnetic Resonance Angiography, magnetic resonance angiography), MRI (magnetic resonance imaging, magnetic Resonance imaging), CT (computed tomography, computed tomography), video camera or ultrasonic equipment Deng), navigation (navigation) device, global position system (GNSS (GLONASS, Global Navigation Satellite System)), EDR (event data recorder, event data recorder), FDR (flight data recordings Device, flight data recorder), vehicle infotainment (infotainment) device, ship with electronic installation (for example, Ship positioner, gyro compass etc.), avionic device (avionics), safety means, vehicle acoustics head unit (head unit), industrial or domestic robot, ATM (ATM, the automatic teller's of financial institution Machine), the POS (retail point, point of sales) or Internet of things device (internet of things) (example in shop Such as, bulb, various sensors, electrical equipment or gas meter, automatic fire extinguisher, fire alarm, thermoregulator (thermostat), street lamp, toaster (toaster), sports equipment, boiler, heater, boiler etc.).

According to some embodiments, electronic installation may include at least one in item set forth below：Furniture (furniture) Or the part of building/structure, electron plate (electronic board), electronic signature reception device (electronic Signature receiving device), projecting apparatus (projector) or various measuring apparatus be (for example, water, electricity, gas or electricity Wave measurement equipment etc.).In various embodiments, electronic installation can be one or more in above-mentioned a variety of devices Combination.Can be flexible electronic device according to the electronic installation of some embodiments.In addition, according to this specification embodiment Electronic installation is not limited to aforementioned device, and may include the new electronic installation developed with technology.

Hereinafter, referring to the drawings to being described according to the electronic installation of various embodiments.In this specification, term " is used Family " may refer to the people using electronic installation or the device (for example, artificial intelligence electronic installation) using electronic installation.

Fig. 1 shows the electronic installation according to various embodiments.

Reference picture 1, the electronic installation 101,102,104 or server 106 of various embodiments can pass through network 162 or office Domain net 164 is connected to each other.Electronic installation 101 may include bus 110, processor 120, memory 130, input/output interface 150, Display 160 and communication interface 170.In some embodiments, electronic installation 101 can omit at least one in inscape Or it can additionally include other inscapes.

Between bus 110 for example may include to make inscape 110 to inscape 170 be connected to each other and transmit inscape Communication (for example, control message and/or data) circuit.

Processor 120 may include CPU (central processing unit；CPU), application processor (application processor；) or communication processor (communication processor AP；CP one in) or It is multiple.Such as executable control and/or communication with least one other inscape of electronic installation 101 of processor 120 has The calculating or data processing of pass.

Memory 130 may include volatile memory and/or nonvolatile memory.Memory 130 can for example store with The related order of at least one other inscape of electronic installation 101 or data.According to an embodiment, memory 130 can Store software and/or program 140.Program 140 for example may include kernel 141, intermediate equipment 143, application programming interface (Application Programming Interface；API) 145 and/or application program (or " application ") 147 etc..Kernel 141st, at least a portion in intermediate equipment 143 or API 145 may refer to operating system (Operating System；OS).

Kernel 141 for example can be to being embodied in other programs (for example, intermediate equipment 143, API 145 or using journey in execution Sequence 147) in operation or used system resource (for example, bus 110, processor 120 or memory 130 etc.) is entered during function Row control or management.In addition, kernel 141 in intermediate equipment 143, API 145 or application program 147 by accessing electronic installation 101 indivedual inscapes and providing can control or the interface of management system resource.

Intermediate equipment 143 can for example play instrumentality so that API 145 or application program 147 are led to kernel 141 Believe to exchange data.

Asked in addition, intermediate equipment 143 can handle at least one operation received from application program 147 according to priority Ask.For example, intermediate equipment 143 can use the system of electronic installation 101 to provide at least one imparting in application program 147 The priority in source (for example, bus 110, processor 120 or memory 130 etc.).For example intermediate equipment 143 can be according to institute The priority processing job request of at least more than one that at least one application program 147 assigns is stated, so as to perform pair The scheduling of the job request of at least more than one or load balancing etc..

API 145 for example can be that the function provided in kernel 141 or intermediate equipment 143 is controlled for application program 147 Interface, and such as may include for document control, window control, image procossing or message control at least one interface Or function (for example, instruction).

Input/output interface 150, which can for example play, will be passed from the order or data of user or the input of other external equipments It is handed to the effect of the interface of other inscapes of electronic installation 101.In addition, input/output interface 150 can will be from electronic installation Order that 101 other inscapes receive or data output are to user or other external equipments.

Display 160 for example may include liquid crystal display (liquid crystal display；LCD), light emitting diode (light-emitting diode；LED) display, Organic Light Emitting Diode (organic LED；OLED) display or micro- Electronic mechanical system (microelectromechanical systems；MEMS) display or Electronic Paper (electronic Paper) display.Display 160 can for example show various contents (for example, text, image, video, icon or symbol to user Deng).Display 160 may include touch-screen, such as receive the touch carried out using a part for electronic pen or user's body, hand The inputs such as gesture, close or hovering (hovering).

For example settable electronic installation 101 of communication interface 170 and external device (ED) (for example, the first external electronic 102, Second external electronic 104 or server 106) between communication.For example, communication interface 170 by radio communication or can have Line is communicatively connected to network 162 so as to enter with the external device (ED) (for example, the second external electronic 104 or server 106) Row communication.

Radio communication is for example as cellular communication protocol, such as may include to use LTE (Long Term Evolution, long-term Evolution), LTE-A (long-term evolution upgrading version, LTE-advanced), CDMA (CDMA connected mode, code Division multiple access), WCDMA (WCDMA connected mode, WIdeband CDMA), UMTS it is (general GSM, universal mobile telecommunications system), WiBro (WiMAX, Wireless broadband) or GSM (global system for mobile communications, global system for mobile Communications at least one cellular communication in).According to an embodiment, radio communication for example may include following institute It is at least one in lising：Wi-Fi (wireless networking, wireless fidelity), bluetooth, low-power consumption bluetooth (BLE), purple peak Agreement (Zigbee), NFC (near-field communication, near field communication), magnetic force secure transmission technique (MST； Magnetic Secure Transmission), radio frequency (RF) or body area network (BAN) or GNSS.

MST can utilize electromagnetic signal to produce pulse according to transmission data, and the pulse can produce magnetic field signal.Electronics The magnetic field signal is transferred to POS (vending machine, point of sales) by device 101, and POS utilizes MST readers (MST Reader the magnetic field signal) is detected, and the magnetic field signal detected is converted into electric signal so as to recover the data.

GNSS for example may include GPS (global positioning system, Global Positioning according to territory of use or bandwidth System), Glonass (global navigational satellite system, Global Navigation Satellite System), big-dipper satellite are led Boat system (hereinafter referred to as " Beidou ") or Galileo (European GPS, the European global Satellite-based navigation system) in it is at least one.Hereinafter, in this manual, " GPS " can be with " GNSS " is used interchangeably (interchangeably used).Wire communication for example may include USB (USB, Universal serial bus), HDMI (HDMI, high definition multimedia Interface), (plain old telephone takes by RS-232 (proposed standard -232, recommended standard-232) or POTS Business, plain old telephone service) etc. in it is at least one.Network 162 is used as communication network (telecommunications network) for example may include computer network (computer network) (for example, LAN or WAN it is), at least one in internet or telephone network (telephone network).

First and second external electronic 102,104 can be respectively and 101 identical or different species of electronic installation Device.According to an embodiment, server 106 may include the group of one or more servers.According to various embodiments, electricity All or part of of performed operation can be in another electronic installation or multiple electronic installations (for example, electronics in sub-device 101 Device 102,104 or server 106) on perform.According to an embodiment, needed in electronic installation 101 automatically or according to please When seeking some function or service of execution, electronic installation 101 can be outside independently perform function or service additionally to other dresses Put (for example, electronic installation 102,104 or server 106) and ask relative at least part function, or also can not be autonomous Perform function or service.Executable the asked function of other devices (for example, electronic installation 102,104 or server 106) or Additional function, and result is transferred to electronic installation 101.Electronic installation 101 can be intactly or additional by the result of reception Ground provides asked function or service after being handled.Therefore, for example using cloud computing, Distributed Calculation or client- Server computing technique.

Reference picture 2, electronic installation 201 for example may include all or part of of the electronic installation 101 shown in Fig. 1.Electronics Device 201 may include：At least one processor (for example, AP) 210, communication module 220, subscriber identity module 224, memory 230th, sensor assembly 240, input unit 250, display 260, interface 270, audio-frequency module 280, photographing module 291, power supply Management module 295, battery 296, indicator 297 and motor 298.

Processor 210 can for example drive operating system or application program to control the multiple hardware being connected with processor 210 Or software sharing key element, and can perform various data processings and calculating.Processor 210 can for example be realized System, system on chip).According to an embodiment, processor 210 may also include GPU (graphics processing unit, graphic Processing unit) and/or image-signal processor (image signal processor).Processor 210 may also include At least a portion (for example, cellular module 221) in inscape shown in Fig. 2.Processor 210 will can be wanted from other compositions The order of at least one reception in plain (for example, nonvolatile memory) or data loading (load) to volatile memory simultaneously Handled, and can be by a variety of data storages (store) to nonvolatile memory.

Communication module 220 can have and the 170 same or analogous structure of communication interface in Fig. 1.Communication module 220 is for example It may include cellular module 221, Wi-Fi module 222, bluetooth module 223, GNSS module 224 (for example, GPS module, Glonass moulds Block, Beidou modules or Galileo modules), NFC module 225, MST modules 226 and RF (radio frequency, radio frequency) Module 227.

Cellular module 221 for example can provide voice call, video calling, messenger service or Internet service by communication network Deng.According to an embodiment, cellular module 221 can utilize subscriber identity module (for example, SIM card) 229 in a communication network Perform the differentiation and certification of electronic installation 201.According to an embodiment, cellular module 221 can perform processor 210 and can provide Function at least a portion function.According to an embodiment, cellular module 221 may include communication processor (CP).

Wi-Fi module 222, bluetooth module 223, GNSS module 224, NFC module 225 or MST modules 226 can for example be distinguished Including the processor for being handled the data received and dispatched by corresponding module.According to some embodiments, cellular module 221st, at least a portion in Wi-Fi module 222, bluetooth module 223, GNSS module 224, NFC module 225, MST modules 226 (e.g., more than 2) can be included in an IC (integrated chip, integrated chip) or IC package.

RF modules 227 can for example receive and dispatch signal of communication (for example, RF signals).RF modules 227 for example may include transceiver (transceiver), PAM (power amplifier module, power amp module), frequency filter (frequency Filter), LNA (low-noise amplifier, low noise amplifier) or antenna etc..According to other embodiment, honeycomb mould It is at least one in block 221, Wi-Fi module 222, bluetooth module 223, GNSS module 224, NFC module 225 and MST modules 226 RF signals can be received and dispatched by other RF modules.

Subscriber identity module 229 for example may include the card and/or embedded SIM with subscriber identity module (embedded SIM), and may include intrinsic identification information (for example, ICCID (integrated circuit card identifier, integrated Circuit card identifier)) or customer information (for example, IMSI (the mobile subscriber identity in the world, international mobile subscriber identity))。

Memory 230 (for example, memory 130) for example may include internal memory 232 or external memory 234.It is built-in Memory 232 for example may include at least one in being listd：Volatile memory (for example, DRAM (dynamic ram), SRAM (static RAM) or SDRAM (synchronous dynamic ram) etc.), non-volatile (non-volatile) memory is (for example, OTPROM (disposable programmable read only memory), PROM (programming ROM), EPROM (erasable programmable ROM), EEPROM (electrically erasables Except programming ROM), mask (mask) ROM, flash (flash) ROM, flash memory (for example, nand flash memory) or NOR flash memory etc.), it is hard Disk drive or SSD (solid state hard disc).

External memory 234 for example may also include flash drive (flash drive), CF (compact flash), SD (peaces It is digital), Micro-SD, Mini-SD, xD (extreme digital), MMC (multimedia memory card) or memory stick (memory stick) Deng.External memory 234 can functionally and/or physically be connected to electronic installation 201 by multiple interfaces.

Module of the security module 236 as the memory space for including relatively higher level of security compared to memory 230, It can be to ensure that the circuit of safe data storage and shielded running environment.Security module 236 can be realized to be single Circuit, and may include single processor.Security module 236 for example may include detachable intelligent chip, be present in SD (safety Numeral) Ka Nei or embedded-type security element (the embedded secure that are embedded in the intrinsic chip of electronic installation element；eSE).In addition, security module 236 can by the different operating system of the operating system (OS) from electronic installation 201 Lai Driving.For example, security module 236 can be operated based on JCOP (java cards open platform) operating system.

For example measurable physical quantity of sensor assembly 240 or the mode of operation for sensing electronic installation 201, and will measurement or sense The information measured is converted to electric signal.Sensor assembly 240 for example may include at least one in item set forth below：Gesture senses Device 240A, gyro sensor 240B, baroceptor 240C, magnetic sensor 240D, acceleration transducer 240E, grip pass Sensor 240F, proximity transducer 240G, color sensor 240H (for example, RGB sensors), biology sensor 240I, temperature/wet Spend sensor 240J, irradiance sensor 240K or UV (ultraviolet) sensor 240M.Additionally or alternatively, sensor assembly 240 for example may include olfactory sensor (E-nose sensor), EMG (electromyogram) sensor, EEG (brain wave) sensor, ECG (electrocardiogram) sensor, IR (infrared ray) sensor, iris sensor and/or fingerprint sensor.Sensor assembly 240 is also It may include the control circuit for controlling the sensor of at least more than one in the sensor assembly.In some embodiments In, electronic installation 201 can further comprise as processor 210 it is a part or single, be configured to control sensor die The processor of block 240 so that processor 210 can control sensor assembly 240 during being in dormancy (sleep) state.

Input unit 250 for example may include touch panel (touch panel) 252, (number) sensor (pen Sensor) 254, key (key) 256 or ultrasonic wave (ultrasonic) input unit 258.Touch panel 252 is for example using electricity At least one of appearance formula, pressure sensing type, infrared mode or ultrasonic wave mode mode.In addition, touch panel 252 may also include control Circuit processed.Touch panel 252 may also include tactile layer (tactile layer), to provide a user tactile response.

(number) sensor 254 for example may include as touch panel it is a part or other be used to identifying it is thin Piece (sheet).Key 256 for example may include physical button, optical profile type key or keyboard.Ultrasonic wave input device 258 can pass through Mike Wind (for example, microphone 288) carrys out caused ultrasonic wave in sensing input device, and confirms corresponding with the ultrasonic wave sensed Data.

Display 260 (for example, display 160) may include：Panel 262, hologram apparatus 264 or projecting apparatus 266.Panel 262 may include and the 160 same or analogous structure of display in Fig. 1.For example, panel 262 can be realized to be flexible (flexible), transparent (transparent) or wearable (wearable).Panel 262 can also match somebody with somebody with touch panel 252 It is set to a module.Hologram apparatus 264 can utilize the interference of light that stereo-picture is presented in the air.Projecting apparatus 266 can throw light It is mapped on screen and display image.Screen can for example be located at the internal or external of electronic installation 201.According to an embodiment, face Plate 262 may include the pressure sensor (or force snesor) that can detect the pressure size of user's touch.The pressure sensor It can be embodied as with the touch panel 252 one-piece type, or be implemented separately with the touch panel 252 as more than one sensing Device.According to an embodiment, display 260 may also include for controlling the panel 262, the hologram apparatus 264 or throwing The control circuit of shadow instrument 266.

Interface 270 for example may include HDMI 272, USB 274, optical interface (optical interface) 276 or D-sub (D-subminiature)278.Interface 270 is for example included in the communication interface 170 shown in Fig. 1.Additionally or alternatively, Interface 270 for example may include that MHL (mobile high definition link) interface, SD card/MMC interfaces or IrDA (Infrared Data Association) standard connect Mouthful.

Audio-frequency module 280 for example can carry out bi-directional conversion to sound (sound) and electric signal.Audio-frequency module 280 is at least A part of inscape is included in input/output interface 150 as shown in Figure 1.Audio-frequency module 280 for example can be to by raising Sound device 282, receiver 284, earphone 286 or microphone 288 etc. are inputted or the acoustic information of output is handled.

Photographing module 291 is for example as the device photographed to rest image and video, and according to an embodiment, it can Including more than one imaging sensor (for example, front sensor or back side sensor), camera lens, ISP (picture signal processing Device) or flash lamp (flash) (for example, LED or xenon lamp (xenon lamp)).

Power management module 295 can be for example managed to the power supply of electronic installation 201.According to an embodiment, power supply Management module 295 may include PMIC (power management integrated circuit), charging IC (charger integrated circuit) or battery gauge or combustion Oil meter (battery or fuel gauge).PMIC can have wiredly and/or wirelessly charging modes.Wireless charging mode is for example It may include magnetic resonance mode, magnetic induction way or means of electromagnetic waves etc., and may also include the adjunct circuit for wireless charging, Such as coil, resonance circuit or rectifier.For example measurable surplus of battery 296 of battery gauge, charging in voltage, electric current or Temperature.Battery 296 for example may include TunePower (rechargeable battery) and/or solar cell (solar battery)。

Indicator 297 can display electronics assemblies 201 or one part (for example, processor 210) particular state, for example, Starting state, message status or charged state etc..Motor 298 can convert electrical signals to mechanical oscillation, and can produce vibration Or tactile (haptic) effect etc. (vibration).Though being not shown, electronic installation 201 may include the place for supporting to move TV Manage device (for example, GPU).For supporting that the processing unit for moving TV for example can be to based on DMB (DMB), DVB The media data of (DVB) or MediaFLOTM equal-specifications is handled.

Described inscape can be made up of one or more components (component) respectively in this specification, and The title of these inscapes can change according to the species of electronic installation.In various embodiments, electronic installation can configure It is to include in this specification at least one in described inscape, and clipped inscape or can may also include Additional other inscapes.In addition, according in the inscape of the electronic installation of various embodiments a part can be combined and An entity (entity) is formed, so as to the function identical function of these inscapes before performing and combining.

Fig. 3 shows the electronic installation according to an embodiment.

Reference picture 3, display 310 and shell 320 may include according to the electronic installation 300 of an embodiment.The display 310 can occupy quite a few of electronic installation 300 positive (above).The front of electronic installation 300, which can expose, forms side A part for shell 320.

According to an embodiment, the electronic installation 300 may be in response to scheduled event (for example, touching, physical button is pressed The motion sensing etc. of pressure, gyro sensor/acceleration transducer), or under always on state (always-on) by table Show that the navigational figure 315 of home button is shown on display 310.For example, electronic installation 300 with the navigational figure 315 Corresponding inside can be disposed with the hardware module according to the various embodiments of the present invention (for example, biology sensor, pressure sensor Deng).

Reference picture 4, glass cover 410, display device 420, bracket may include according to the electronic installation 401 of an embodiment 430th, circuit substrate 440, shell on the back (rear housing) 450, battery 460 and/or back-cover (back cover) 470.According to each Kind embodiment, electronic installation 401 also may not include the part-structure shown in Fig. 4, or additionally can also include in Fig. 4 not The structure shown.

Glass cover 410 can pass through the light as caused by display device 420.In addition, user can pass through on the glass cover 410 The part (for example, finger) for contacting body performs touch (using the contact of electronic pen).The glass cover 410 is for example It can be formed by safety glass, reinforced plastics, flexible (flexible) high polymer material etc., to protect display device 420 and institute Each structure that electronic installation 401 includes is stated from external impact.According to various embodiments, the glass cover 410 also can quilt Referred to as windowpane (glass window).

The bottom of the glass cover 410 can be arranged or be incorporated into display device 420, and by the glass cover 410 extremely Few part exposure.The 420 exportable content of display device (for example, text, image, video, icon, window primary structural component or Symbol etc.), or receive user touch input (including：Touch, gesture, hovering (hovering) etc.).

According to an embodiment, the display device 420 may include viewing area 421 and from the viewing area 421 The join domain 422 of side (for example, bottom (lower side)) extension.Pixel can be disposed with the viewing area 421 (pixels), such as OLED etc..The join domain 422 can be filled by a variety of conductive patterns (distribution) with being arranged in the display The FPCB 425 for putting 420 back sides is electrically connected.The point that the join domain 422 extends is not limited to the bottom of viewing area 421.According to Various embodiments, the join domain 422 also can be from the top of the viewing area 421 (upper side), left side (left Side) and right side (right side) extends.

A part for the join domain 422 can be towards the spine folded of the viewing area 421 so that FPCB's 425 The back side at the back side and viewing area 421 separates relatively.According to various embodiments, on the subregion 427 of the FPCB 425 The conductive pattern (distribution) formed cross the side of bracket 430 and by predetermined connector and circuit substrate 440 (for example, Main circuit substrate 440m) electrical connection.According to various embodiments, according to the design of electronic installation 401, gone back in join domain 422 Similarly pixel can be disposed with viewing area 421.

According to an embodiment, the display device 420 may include liquid crystal display (LCD) panel, light emitting diode (LED) Display panel, Organic Light Emitting Diode (OLED) display panel or microelectromechanical systems (MEMS) display panel or Electronic Paper show Show panel.In addition, for example, the display device 420 may include that capacitive touch panels, pressure sensing type touch panel, resistance-type are touched Touch panel, infrared mode touch panel or ultrasonic wave mode touch panel.The touch panel can be inserted in display panel (add-on touch panels), or (on-cell touch panels) is formed directly on display panel, or in display panel Portion's (in-cell touch panels).

Bracket (bracket) 430 can be for example made up of magnesium alloy, and be arranged in lower section and the circuit base of display device 420 The top of plate 440.The bracket 430 can be combined with the display device 420 and the circuit substrate 440 and physically supported They.According to an embodiment, it is contemplated that the expansion of battery 460 caused by aging, expansion can be formed on the bracket 430 Gap (swelling gap).

Circuit substrate 440 for example may include main (main) circuit substrate 440m or son (sub) circuit substrate 440s.According to one Embodiment, main circuit substrate 440m and sub-circuit the substrate 440s are arranged in the lower section of bracket 430 (below), and they can lead to Cross predetermined connector or predetermined distribution is electrically connected to each other.Circuit substrate 440m, 440s can be for example realized as rigidity printing electricity Road plate (rigid PCB；rigid printed circuit board).According to an embodiment, circuit substrate 440m, 440s It is upper installation (mount) or arrangement (arrange) have various electronic units, element, printed circuit of electronic installation 401 etc. (for example, Processor, memory, telecommunication circuit etc.).According to various embodiments, circuit substrate 440m, 440s is referred to alternatively as mainboard, PBA (printed circuit-board assembly), or PCB can be referred to only as.

Shell on the back 450 is arranged in the lower section of circuit substrate 440, and can store each structure of the electronic installation 401.Shell on the back 450 can form the side outward appearance of electronic installation 401.The shell on the back 450 is also referred to as back side shell (rear case) or backboard (rear plate) etc..The shell on the back 450 may include to be not exposed to region outside electronic installation 401 and exposed to electronic installation The region of 401 exterior lateral sides.For example, the region for being not exposed to electronic installation 401 can be made up of plastic injection thing.It is exposed to The region of the exterior lateral sides of electronic installation 401 can be made up of metal.The side exposed region being made up of metal material can also quilt Referred to as metal edge frame (metal bezel).According to an embodiment, at least a portion in the metal edge frame can be used as receiving and dispatching The antenna radiator of the signal of preset frequency.

Battery 460 can carry out bi-directional conversion to chemical energy and electric energy.For example, chemical energy can be converted to electric energy by battery 460, So that the electric energy is supplied into display device 420 and the various structures or module that are equipped in circuit substrate.Or the battery 460 can be stored chemical energy is converted to from the electric energy of external reception.According to an embodiment, circuit substrate 440 may include For managing the power management module of the discharge and recharge of battery 460.

Back-cover 470 can be bound to the back side of electronic installation.The back-cover 470 can by safety glass, plastic injection thing and/or The formation such as metal.According to various embodiments, back-cover 470 can integratedly be realized with the shell on the back 450, or can realize as can Dismantled by user.

Fig. 5 a and Fig. 5 b show the electronic installation according to an embodiment.

Reference picture 5a, display device 520 may include viewing area 521, join domain 522 and FPCB 525.The display Interchangeably (interchangeably) is referred to as " display module " or " display module (assembly) " device 520.As one Example, the display device 520 may correspond to the display device 420 shown in Fig. 4.

According to an embodiment, (or display) plurality of kinds of contents exportable in the viewing area 521 is (for example, image, text This etc.), or receive (touch) input of user.The join domain 522 extends from the side of the viewing area 521, and (fold) or bending (bend) can be folded towards predetermined direction.The FPCB 525 is with forming on join domain 522 Conductive pattern (distribution) electrically connects.According to various embodiments, the conduction that is formed on the subregion 527 of the FPCB 525 Pattern (distribution) can be electrically connected by predetermined connector with main circuit substrate.

Reference picture 5b, it illustrates the sectional view of display device 520 corresponding with the boost line x-x' shown in Fig. 5 a.

According to an embodiment, in the viewing area 521 of display device 520 it is stackable have touch screen display panel 521-1, Synthetic resin film is (for example, polyimides (PI：Polyimide) film) 521-2 and other panel/film layers be (for example, diaphragm (PF：protection film))521-3.Front (a front towards first direction of the synthetic resin film 521-2 Surface facing a first direction) on can be disposed with display panel 521-1, and the synthetic resin film It is disposed with the 521-2 back side (a rear surface facing a second direction) towards second direction Its panel/film layer 521-3.

It is stackable on the join domain 522 of display device 520 to have included by viewing area 521 according to an embodiment All or part of layer in a variety of layers.For example, the join domain 522 may include from the extension of the side of the viewing area 521 Synthetic resin film 521-2.Be disposed with the first direction front of the synthetic resin film 521-2 hardware module 531 (for example, Circuit of display driving (DDI：Display driving integrated circuit) etc.).

According to an embodiment, FPCB 525 can include a variety of conductions in front and/or the second direction back side in a first direction Pattern (distribution).The conductive pattern (distribution) formed on FPCB 525 front and/or the back side can be with forming in the connection Conductive pattern (distribution) electrical connection on region 522.According to an embodiment, can be arranged on the FPCB 525 second direction back side There is the hardware module (for example, biology sensor or pressure sensor) 532 for performing predetermined function.

According to an embodiment, a part for the join domain 522 can be towards the second direction of the viewing area 521 It is spine folded, to cause the FPCB 525 second direction back side and the second direction back side of viewing area 521 to separate relatively.By This, the module 532 being arranged on the back side of the FPCB 525 can be disposed at the lower section (below) of viewing area 521.

Fig. 6 a show the arrangement of the hardware module of the electronic installation according to an embodiment.

Shown in reference picture 6a, electronic installation may include display 610, FPCB 620, backplate 630, first (hardware) mould Block 640, buffer component 645, adhesive layer 653, pressure sensor 655, second (hardware) module 650 and the 3rd (hardware) module 660.According to an embodiment, the display 610 and FPCB 620 may make up display device 601.According to various embodiments, The electronic installation may not include the part-structure shown in Fig. 6 a, or also can additionally include the knot not shown in Fig. 6 a Structure.

Display 610 may include that viewing area 611 and the side from the viewing area 611 extend the connection of (extend) Region 612.A part of region (bending area) 612-1 of the join domain 612 can be towards the back side of the viewing area 611 Fold, to cause FPCB 620 back side and the back side of viewing area 611 to separate relatively.

According to an embodiment, the viewing area 611 of the display 610 may include multiple layers.For example, the multiple layer It may include adhesive layer (adhesive layer), polarization layer (polarization layer), display panel and synthetic resin film It is at least one in (for example, PI films).The viewing area 611 can be by being contained in multiple pixels of the display panel (pixels) plurality of kinds of contents is exported.

According to an embodiment, the join domain 612 of the display 610 can be folded, to cause on FPCB 620 Predetermined module (for example, first module 640) separates relatively with display 610.As the join domain 612 is bent, the company At least a portion for connecing region 612 can have predetermined curvature (curvature).

The join domain 612 may include at least one layer in multiple layers included by the viewing area 611.According to One embodiment, the join domain 612 can be formed by the PI materials for not forming pixel.According to another embodiment, the company Connecing region 612 can be by forming the part of display panel including multiple pixels.

According to various embodiments, the bending area 612-1 of the join domain 612 may also include for preventing bending section Morcel the BPL (bend protection layer, bending protect layer) split.In addition, the flat region in the join domain 612 The 3rd module 660 (for example, circuit of display driving) can be disposed with a domain 612-2 surface (front or the back side).

FPCB 620 can electrically connect with the join domain 612 of display 610.For example, the back side (first of the FPCB 620 Face；The face relative with the viewing area 611 of display 610) on can be disposed with the first module 640 (for example, biology sensor, pressure Force snesor etc.).In addition, for example, FPCB 620 front (the second face；The surface opposite with first face) on can cloth It is equipped with another (another) predetermined module, i.e. the second module 650.Second module 650 is (for example, biology sensor IC, pressure Force snesor IC etc.) it is associated with the function of first module 640.

Backplate (back panel) (or C- panels) 630 can form (or arrangement) in the viewing area 611 of display 610 Lower section, for example, being formed at the back side of the display 610.For example, the backplate 630 may include in item set forth below extremely It is few one：For shielding the light shielding layer (namely EMBO layers) of light caused by display 610, for buffered display 610 The cushion (for example, sea slick) impacted caused by the input of user, sheet-metal layers are (for example, copper (Cu) graphite (graphite) layer) and electronic pen sensing layer.According to an embodiment, correspond to the first module 640 in the backplate 630 Region, i.e., top (above) place of described first module 640 can be formed with opening (opening).

First module 640 may include the multiple hardwares module that can be arranged in the lower section of display 610.For example, described first Module 640 may include biology sensor (for example, fingerprint sensor), pressure sensor, or both.For example, in first mould , can be with the life on FPCB 620 back side (the first face) in the case that block 640 includes biology sensor and pressure sensor It is disposed with least one pressure sensor (reference picture 9 and Figure 10) thing sensor adjacent (adjacent to).Now, for example, When pressure sensor detects the pressure of more than predetermined value, biology sensor can be activated (reference picture 12 and Figure 13).

(facing) relative with display 610 that buffer component 645 can be disposed in the surface of first module 640 On simultaneously.The buffer component 645 can prevent due to user physics (touch) input cause display 610 be bent so as to Oppress the first module 640.For example, the buffer component 645 can be made up of polyurethane foam (for example, Poron).

Adhesive layer 653 can be formed by the flashing member for bypassing air through and isolating moisture.According to an embodiment, backplate 630 can pass through adhesive layer 653 and FPCB620 around the region of opening and bond.Thus, the first module 640 can pass through display 610th, the medial surface, adhesive layer 653 and FPCB 620 for being formed at the opening of backplate 630 are sealed.

Pressure sensor 655 can be arranged between backplate 630 and FPCB 620 by adhesive layer 653.Correspondingly, when aobvious When showing that device 610 receives physics (touch) input of user, the pressure sensor 655 can detect that the physics (touch) inputs Pressure.

Fig. 6 b show the arrangement of the hardware module of the electronic installation according to an embodiment.

Reference picture 6b, electronic installation may include that display 610, FPCB 620, backplate 630, adhesive layer 653, pressure pass Sensor 655, second (hardware) module 650 and the 3rd (hardware) module 660.According to an embodiment, the He of display 610 FPCB 620 may make up display equipment 601.For Fig. 6 b explanation, can omit to identical with the reference marker in Fig. 6 a The mutually isostructural description of reference marks.

The difference of backplate 630 shown in backplate 630 and Fig. 6 a according to an embodiment shown in Fig. 6 b exists Opening is not formed thereon.In addition, in figure 6b in shown electronic installation, the lower of backplate 630 can be omitted as in Fig. 6 a The first module 640 structure.According to an embodiment, the lower of the backplate 630 can be disposed with adhesive layer 653 and pressure Sensor 655.

According to an embodiment, pressure sensor 655 can be arranged in backplate 630 and FPCB 620 by adhesive layer 653 Between.When display 610 receives physics (touch) input of user, the pressure sensor 655 can detect that the physics The pressure of (touch) input.

When the pressure sensor 655 detects the pressure of more than predetermined value, it is (right that electronic installation can perform predetermined function Function comprising inscape in an electronic, the control of operation).

For example, electronic installation with sleep pattern (close display 610, and low power state it is inferior treat user input Pattern) operation during, when pressure sensor 655 detects the pressure of more than predetermined value, the electronic installation can activate institute State display 610 and export home screen (home screen) or lock-screen (lock screen) to the display 610.According to various embodiments, the electronic installation can be by the pressure size detected according to the pressure sensor 655 UI (user interface, user interface) is exported to the display 610.

Fig. 7 a and Fig. 7 b show the arrangement of the hardware module according to another embodiment.

Reference picture 7a, electronic installation may include glass cover 710, OCA (optically clear adhesive, optical clear Adhesive) layer 715, polarization layer 720, display panel 730, PI films 735, diaphragm 737, BPL 739, backplate 740, fingerprint Sensor (a kind of biology sensor) 750, buffer component 755, adhesive layer 761,765, it is pressure sensor 763, FPCB 770, viscous Close layer 780, diaphragm 785, circuit of display driving 790.According to an embodiment, it will be appreciated that for OCA layers 715, polarization layer 720th, display panel 730, PI films 735, BPL 739 and FPCB 770 form display device.In addition, in figure 7 a, as biology Sensor illustrates fingerprint sensor 750, but be not restricted to that this.For example, the fingerprint sensor 750 can be by iris sensor Instead of.

Glass cover 710 can pass through the light as caused by display panel 730.In addition, user can lead on the glass cover 710 The part (for example, finger) 7 for crossing contact body performs touch.

OCA layers 715 can bond glass cover 710 and polarization layer 720 as transparent adhesive layer.

In order to improve panel visibility (panel visibility), polarization layer (or, polarizing coating) 720 in bright place The reflection of exterior light can be prevented.The polarization layer 720 can be by PFT (polyethylene terephthalate, poly ethylene Terephthalate) film or TAC (triacetyl cellulose, tri-acetyl cellulose) film are formed.

Display panel 730 for example may include scan line (scan line) and data wire (data line), based on by described The signal that scan line and the data wire provide produces the light-emitting component (for example, OLED) of light, is disposed with the light-emitting component Substrate is (for example, low temperature polycrystalline silicon (LTPS；Low temperature poly silicon) substrate) and it is described for protecting Thin-film package film (the TFE of light-emitting component；thin film encapsulation).

PI films 735 (a kind of flexible member) can be disposed at the lower section of display panel 730.The PI films 735 may include to be used for The distribution of electric power and/or signal is provided to display panel 730.The PI films 735 may include first contacted with display panel 730 Region and the second area not contacted with display panel 730.

According to an embodiment, the second area of the PI films 735 can be towards the spine folded of display panel 730. The second area can divide into bending area 735-1 and flat site 735-2.Pass through the bending area 735-1, the PI The flat site 735-2 of film 735 can be relative with display panel 730, and fingerprint sensor 750 may be disposed to and display panel 730 separate relatively.

According to various embodiments, the PI films 735 can be disposed at the top of display panel 730, or can also be used as display A part for panel 730 is contained in the display panel 730.

Diaphragm 737 can be disposed at the lower section of PI films 735, and support the PI films 735.

BPL 739 attaches at least one to the bending of PI films 735 (bend) region 735-1 and/or flat site 735-2 On part.The BPL 739 can prevent the fragmentation of bending area 735.

Backplate 740 can be formed at the lower section of (or being arranged in) diaphragm 737, for example, being formed at the display panel 730 The back side.For example, the backplate 740 may include light shielding layer (for example, EMBO layers) 741, cushion (for example, sea slick) 743 and sheet-metal layers (for example, copper (Cu) graphite (graphite) layer) in it is at least one.

According to an embodiment, the backplate 740 with 750 corresponding region of biology sensor, i.e. the fingerprint passes The top (above) of sensor 750 can be formed with opening (Wopening, W are open).By the opening (Wopening), formed Fingerprint in user's finger 7 can be identified by fingerprint sensor 750.For example, described in the light as caused by display panel 730 reflexes to Fingerprint on finger 7, and the light of the reflection can by glass cover 710, OCA layers 715, polarization layer 720, display panel 730, PI films 735, diaphragm 737 and the opening (Wopening) reach fingerprint sensor 750.That is, described fingerprint sensor 750 can Be arranged to using at least one pixel in multiple pixels included in display panel 730 as finger print identifying light source and Use.

The fingerprint image of (capture) finger can be caught from fingerprint sensor 750.According to an embodiment, the fingerprint Sensor 750 may correspond to optical fingerprint sensor.The fingerprint sensor 750 can utilize built-in imaging sensor (example Such as, CMOS, CCD) catch (capture) fingerprint image.The fingerprint sensor 750 is for example extractable to be derived from the fingerprint image Fingerprint unique (unique) fingerprint feature point (fingerprint minutiae).The fingerprint feature point for example wraps Include：It is contained in streakline end points (ridge ending), crosspoint (crossover) of fingerprint, ramification point (bifurcation), The various features point such as hole (pore).The fingerprint feature point can be by being contrasted to be used for registered fingerprint feature point Family certification.

Buffer component 755 can be disposed at the surface of fingerprint sensor 750.The buffer component 755 can prevent due to Physics (touch) input of the finger 7 at family causes diaphragm 737 to oppress fingerprint sensor 750.For example, the buffer component 755 It can be made up of polyurethane foam (for example, Poron).

Adhesive layer 761,765 can be formed by the flashing member for bypassing air through and isolating moisture.According to an embodiment, glue Pressure sensor 763 can be disposed between layer 761 and adhesive layer 765 by closing.The pressure sensor 763, which can sense, passes through glass cover 710th, OCA layers 715, polarization layer 720, display panel 730, PI films 735, diaphragm 737, backplate 740 and adhesive layer 761 transmit User finger 7 pressure.

According to an embodiment, backplate 740 can pass through adhesive layer 761, pressure around the region of opening (Wopening) Force snesor 763 and adhesive layer 765 and FPCB 770 are attached.Thus, fingerprint sensor 750 can by diaphragm 737, be formed at Medial surface, adhesive layer 761, pressure sensor 763, adhesive layer 765 and the FPCB 770 of the opening of backplate 740 are sealed.

FPCB 770 can electrically connect with the flat site 735-2 of PI films 735.For example, FPCB770 can be with forming in PI films Conductive pattern (or distribution) electrical connection on 735.According to an embodiment, fingerprint biography can be disposed with FPCB 770 surface Sensor 750.Although it is not shown, according to various embodiments, the fingerprint can be disposed with FPCB 770 another surface The driving IC of sensor 750.

Adhesive layer 780 and diaphragm 785 are attached between backplate 740 and PI films 735, so as to physically supporting glass Lid 710, OCA layers 715, polarization layer 720, display panel 730, PI films 735 and diaphragm 737.

Circuit of display driving 790 can control display panel 730.The circuit of display driving 790 can will be from processor The picture signal corresponding to view data that (main frame) receives is supplied to display panel 730 with frame number set in advance.It is described Circuit of display driving 790 can be disposed on the flat site 735-2 of PI films 735 surface.

Reference picture 7b, it illustrates the arrangement of the hardware module according to another embodiment.Electricity shown in Fig. 7 b Sub-device may include and the same or analogous structure of the structure of the electronic installation shown in Fig. 7 a.For Fig. 7 b explanation, can save Slightly to the description with the structure with the reference marker identical reference marker in Fig. 7 a.

According to an embodiment, backplate 740 is gone back on the basis of light shielding layer 741, cushion 743, sheet-metal layers 745 It may include electronic pen sensing layer 744.The electronic pen sensing layer 744 can be used for sensing electronic pen (for example, position indicator (position indicator), stylus (stylus), digital conversion pen) contact whether and contact position.Electronics It is a variety of that sensing layer 744 is referred to alternatively as electronic pen sensing thin plate, digital conversion layer etc..

Although being shown as electronic pen sensing layer 744 in fig.7b to be arranged between cushion 743 and sheet-metal layers 745, It is not limited to this.For example, the electronic pen sensing layer 744 can be disposed between light shielding layer 741 and cushion 743, and It can be disposed between light shielding layer 741 and diaphragm 737.

Fig. 8 a and Fig. 8 b show the arrangement of the hardware module according to another embodiment.

Reference picture 8a, electronic installation may include glass cover 810, OCA layers 815, polarization layer 820, display panel 830, PI films 835th, diaphragm 837, backplate 840, fingerprint sensor 850, buffer component 855, adhesive layer 861,865, pressure sensor 863rd, FPCB 870, adhesive layer 880, diaphragm 885 and circuit of display driving 890.According to an embodiment, it will be appreciated that be OCA layers 815, polarization layer 820, display panel 830, PI films 835 and FPCB 870 form display device.In addition, make in Fig. 8 a Fingerprint sensor 850 is illustrated for biology sensor, but be not restricted to that this.For example, the fingerprint sensor 850 can be by iris Sensor replaces.In Fig. 8 a explanation, the explanation pair with the structure identical structure shown in Fig. 7 a can be omitted.

According to an embodiment, FPCB 870 can electrically connect with display panel 830.For example, the FPCB 870 can pass through Hot welding press (hot bar) or welding (soldering) electrically connect with the display panel 830.

According to an embodiment, FPCB 870 may include bending area (bent area) 870-1 and with the bending area The flat site 870-2 of 870-1 connections.The bending area 870-1 can be connected with the display panel 830 and show towards described Show the spine folded of panel 830.That is, different from Fig. 7 a situation, FPCB 870 can be folded in Fig. 8 a.

By the bending area 870-1, FPCB 870 of the FPCB 870 flat site 870-2 back side can with it is described The back side of display panel 830 separates relatively.Correspondingly, fingerprint sensor 850 and pressure sensor 863 can be with display panels 830 Separate relative.

According to an embodiment, the flat site 870-2 of the FPCB 870 back side (the first face；With display panel 830 Relative one side) on can be disposed with fingerprint sensor 850 and at least one pressure being disposed adjacent with the fingerprint sensor 850 Sensor 863.The pressure sensor 863 can be attached to the flat site 870-2's of the FPCB 870 by adhesive layer 865 The back side.In addition, circuit of display driving 890 can be disposed at FPCB 870 flat site 870-2 front (the second face；With guarantor The opposing face in the face attached by cuticula 885).

Reference picture 8b, it illustrates the arrangement of the hardware module according to another embodiment.Electricity shown in Fig. 8 b Sub-device may include and the same or analogous structure of the structure of the electronic installation shown in Fig. 8 a.For Fig. 8 b explanation, can save Slightly to the explanation with the structure with the reference marker identical reference marker in Fig. 8 a.

According to an embodiment, backplate 840 is gone back on the basis of light shielding layer 841, cushion 843, sheet-metal layers 845 It may include electronic pen sensing layer 844.The electronic pen sensing layer 844 can be used for sensing electronic pen contact whether and contact position Put.Although electronic pen sensing layer 844 is shown as in figure 8b to be arranged between cushion 843 and sheet-metal layers 845, and it is unlimited In this.For example, the electronic pen sensing layer 844 can be disposed between light shielding layer 841 and cushion 843, and can also arrange Between light shielding layer 841 and diaphragm 837.

Reference picture 9, pressure sensor 920a may be disposed so that around biology sensor (for example, fingerprint sensor) 910a.Root According to an embodiment, the pressure sensor 920a may include：First electrode 921a, second electrode 925a and dielectric layer (dielectric layer)923a.For example, the pressure sensor 920a can be based on the touch and described in change Capacitance between first electrode 921a and second electrode 925a, sense the pressure of the touch.

According to an embodiment, the first electrode 921a and/or second electrode 925a can be realized to be transparent or impermeable It is bright.For example, be embodied as it is opaque in the case of, the first electrode 921a and/or second electrode 925a can by copper (Cu), silver (Ag), magnesium (Mg), titanium (Ti), opaque graphene (graphene) are realized.In addition, be embodied as it is transparent in the case of, it is described First electrode 921a and/or second electrode 925a can be by ITO (indium tin oxide, indium tin oxide), IZO (indium zinc oxygen Compound, indium zinc oxide), nano silver wire (Ag nanowire), wire netting (metal mesh), transparent polymer lead Body, transparent graphene are realized.

Dielectric layer 923a can be realized by the dielectric medium with recuperability, such as silicon foam (foam), silicon fiml (membrane), sea Silk floss, rubber, polymer (for example, PC (makrolon, polycabonate), PET (polyethylene terephthalate, Polyethylene terephthalate) etc.) composition.

According to another embodiment, the pressure sensor 920b may be disposed so that around biology sensor 910b, and draw It is divided into multiple (for example, 4) pressure sensors.Now, the pressure sensor 920b can not only detect the size of pressure, The position distribution of pressure being applied in can also be detected.

With reference to electronic installation 1001, be may be disposed so that according to the pressure sensor 1012 of an embodiment around biology sensor (for example, fingerprint sensor) 1011.Biology sensor 1011 can have the rectangular shape that horizontal edge is longer than vertical edge.The pressure sensing Device 1012 may include single first electrode, second electrode and dielectric layer (reference picture 9).With reference to electronic installation 1002, pressure sensing Device 1022 may be disposed so that around biology sensor (for example, fingerprint sensor) 1021.Now, biology sensor 1021 can have perpendicular The length of side is in the rectangular shape of horizontal edge.

With reference to electronic installation 1003, can be respectively arranged according to the 2 of an embodiment pressure sensors 1032-1,1032-2 To be adjacent with the upside horizontal edge and downside horizontal edge of biology sensor (for example, fingerprint sensor) 1031.Reference electronic installation 1004, 2 pressure sensors 1042-1,1042-2 can be respectively arranged as the left side with biology sensor (for example, fingerprint sensor) 1041 Vertical edge and right side vertical edge are adjacent.

With reference to electronic installation 1005, according to the 4 of an embodiment pressure sensor 1052-1,1052-2,1052-3, 1052-4 can be respectively arranged to be adjacent with four sides of biology sensor (for example, fingerprint sensor) 1051.For example, the finger of user 10-5a can be touched (namely " power touch ") near the right side upper end of biology sensor 1051 with predetermined pressure.This When, electronic installation 1005 can be by being arranged in the pressure sensor 1052-1 of upside and being arranged in the pressure sensor on right side 1052-2 identifies that the power of the finger 10-5a touches.According to another embodiment, the finger 10-5b of user can be in bio-sensing The left side lower end of device 1051 carries out power touch.Now, electronic installation 1005 can pass through the pressure sensor on the downside of being arranged in The 1052-3 and pressure sensor 1052-4 for being arranged in right side identifies that the power of the finger 10-5b touches.According to electronic installation 1005, finger 10-5a power touch and the touch of finger 10-5b power can be identified as different inputs.Thereby, it is possible to provide with Function corresponding to each input.

Reference picture 11a, it can be disposed at according to biology sensor (for example, fingerprint sensor) 1120a of an embodiment On a FPCB 1110a surface.For example, the biology sensor 1120a may correspond to institute in 640 shown in Fig. 6 a, Fig. 7 a Show 750,850 shown in Fig. 8 a, and the FPCB 1110a may correspond to shown in Fig. 6 a 620, shown in Fig. 7 a 770,870 shown in Fig. 8 a., can be formed with being etched (etch) on a FPCB 1110a surface according to an embodiment Recess (recessed portion) 1115a.Biology sensor 1120a can be placed on the recess 1115a.

Reference picture 11b, according to biology sensor (for example, fingerprint sensor) 1120b of an embodiment and multiple pressure Sensor 1130b can be disposed on a FPCB 1110b surface.For example, the multiple pressure sensor 1130b may correspond to 655 shown in Fig. 6 a, 863 shown in 763 or Fig. 8 a shown in Fig. 7 a.According to various embodiments, the multiple pressure Force snesor 1130b front and the back side can additionally be attached with adhesive layer (for example, band).According to an embodiment, FPCB Recess 1115b can be formed on a 1110b surface.Biology sensor 1120b and multiple pressure sensor 1130b can be placed in shape Into the recess 1115b on FPCB 1110b.

According to Figure 11 a and Figure 11 b embodiment, by formed FPCB 1110a, 1110b recess 1115a, 1115b, being disposed with biology sensor 1120a, 1120b FPCB 1110a and FPCB 1110b thickness can reduce.

Reference picture 12, according to an embodiment, fingerprint verification method may include step 1201 to step 1213.The step Each step in 1201 to step 1213 for example can be with can be by the instruction (life of the computing device (or operation) of electronic installation Make) realize.The instruction can be for example stored in built-in/external memory of computer readable medium or electronic installation.

In step 1201, electronic installation can utilize pressure sensor sensing finger to one of display (or, glass cover) Point (for example, shown in Fig. 3, represent home button navigational figure 315 shown by region) apply pressure.It is real according to one Mode is applied, electronic installation can not only be applied sensing in the state of the display panel of the display opens (ON) by the finger The pressure added, in the state of (OFF) is closed, it can also be sensed.

In step 1203, when the pressure sensed in step 1201 is more than predetermined value, electronic installation can activate fingerprint Sensor (example of biology sensor).That is, when the power for receiving user touches, fingerprint sensor and its fingerprint is driven to pass Sensor IC can be triggered to be operated.

In step 1205, electronic installation detects the fingerprint (characteristic point) of finger using the fingerprint sensor being activated.Example Such as, in the case where the fingerprint sensor corresponds to optical fingerprint sensor, to improve the degree of accuracy of fingerprint recognition, display The corresponding part in the region with being disposed with the fingerprint sensor of device (for example, shown in Fig. 3, represent drawing for home button Lead the region shown by image 315) can be with predetermined brightness emission light.

In step 1207, electronic installation can store the fingerprint detected in step 1205 to memory, or can be by it Compareed with the fingerprint registered in server.

In step 1209, electronic installation can determine whether the fingerprint that is compareed in step 1207 and registration fingerprint whether Match somebody with somebody.When the fingerprint that the judged result in step 1209 detects for described in is with the registration fingerprint matching, in step 1211, electricity Sub-device can perform the first predetermined function.

If for example, when performing step 1201, dispaly state is in (OFF) state of closing, then first function can Function including dispaly state to be converted to opening (ON) state.Now, first function may also include and will be unlocked Screen export to the function on the display.In another example if when performing step 1201, the state of display, which is in, beats Open (ON) state and the display exports lock-screen, then first function may include the screen that will be unlocked Export to the function on the display.

When the judged result in step 1209 is the fingerprint that detects and the fingerprint of registration mismatches, electronic installation can be The second predetermined function is performed in step 1213.For example, executable second function different from first function of electronic installation.

If for example, when performing step 1201, the state of display is in (OFF) state of closing, then second work( The function of the closed mode of maintaining the display can be may include.In another example some when performing step 1201, display State be in and open (ON) state and the display and export lock-screen, then second function may include to maintain institute State the function of lock-screen.

Electronic installation according to an embodiment of the present invention can sense more than scheduled pressure value in pressure sensor Fingerprint sensor is activated when touching (power touch), and certification performs the fingerprint of the finger of the touch.Thus, the pressure sensor It substantially can be used as home button, and stressed Fingers applied on the pressure sensor due to that can identify immediately Line, it can aid in user's convenience in use.

Figure 13 is shown for illustrating the fingerprint verification method according to an embodiment.

Reference picture 13, it is exportable including table according to (touch-screen) display 1310 of the electronic installation 1301 of an embodiment Show the screen 1311 of the navigational figure 1315 of home button.For example, the navigational figure 1315 can essentially be with always on Mode (always-on) export on the display 1310.

For example, the region implementation capacity that user can have navigational figure 1315 to output in display 1310 touches 13.When described Power touches 13 and occurred when on the display 1310, and electronic installation 1301 can be passed based on the pressure activation fingerprint that the power touches Sensor.By the fingerprint sensor being activated, the fingerprint for performing the finger that the power touches 13 can detect that.Electronic installation 1301 can be compareed the fingerprint detected with the registration fingerprint stored in memory.

For example, when the fingerprint detected is with the registration fingerprint matching (that is, finger print identifying success), electronic installation 1301 can be by the State Transferring of display 1310 to open (ON) state, and the home screen 1312 to unlock is exported to aobvious Show on device 1310 (example of the first function).

On the contrary, for example, (that is, finger print identifying loses when the fingerprint detected mismatches with the registration fingerprint Lose), then electronic installation 1301 can continue to output current screen 1311 (example of the second function).According to various embodiments, when During the finger print identifying failure, the electronic installation 1301 can also temporarily export the fingerprint and registration fingerprint for representing to detect Unmatched warning notice.

Generally, fingerprint sensor is arranged in physical button (for example, home button).However, according to the various of the present invention The module arrangement structure of the electronic installation of embodiment, fingerprint sensor and pressure sensor can be disposed at the viewing area of display The lower section in domain.Thus, by the function distribution of physical button to the pressure sensor, and fingerprint sensor and the pressure are passed When sensor is disposed adjacent to, even if the whole front of electronic installation is configured into display, remain able to maintain existing homepage The function of button.

Display, FPCB and predetermined module may include according to the electronic installation of an embodiment, wherein, display includes aobvious Show the join domain that region and the side from the viewing area extend, FPCB electrically connects with the join domain, and makes a reservation for Module arrangement is on the first face of the FPCB.The join domain is flexible to cause the predetermined module and the display Separate relative.

According to an embodiment, the join domain can not form display panel, and by polyimides (PI) material shape Into.

According to an embodiment, the join domain is formed as at least a portion of display panel.

According to an embodiment, at least a portion of the join domain is flexible to form predetermined curvature.

According to an embodiment, the electronic installation, which may also include, is arranged in the opposite with first face of the FPCB Another (another) predetermined module on second face.

According to an embodiment, it is associated with the function of the predetermined module that another predetermined module may be configured as execution Function.

According to an embodiment, the electronic installation may also include the backplate for being formed at the display back side, and Can be formed with opening on the region corresponding with the predetermined module of the backplate.

According to an embodiment, the backplate can be attached around the region of the opening by adhesive layer and FPCB, And the adhesive layer may include to bypass air through and isolate the flashing member of moisture.

According to an embodiment, the display may include to be formed backplate overleaf.Do not formed on the backplate Opening, and the predetermined module can be pressure sensor.

According to an embodiment, the predetermined module may include biology sensor or pressure sensor.

According to an embodiment, the biology sensor may be configured as in multiple pixels included in the display At least one pixel be used as light source.

According to an embodiment, the predetermined module can be biology sensor, and first face can be disposed with At least one pressure sensor that the predetermined module is disposed adjacent.

According to an embodiment, the biology sensor may be configured as detecting at least one pressure sensor pre- It can be activated during more than definite value pressure.

According to an embodiment, the one side relative with the display of the predetermined module can be disposed with buffer component.

According to an embodiment, the electronic installation may also include to be used in combination on a surface for be arranged in the join domain In the circuit of display driving for controlling the display.

According to an embodiment, the electronic installation may include FPCB, sensor and display, wherein, FPCB includes flat Smooth region and bending area, sensor arrangement is in the first face of the flat site, and display is connected to the buckled zone Domain.The bending area is flexible to cause the sensor and the display to separate relatively.

According to an embodiment, the electronic installation may also include the backplate for being formed at the display back side.It is described Can be formed with opening on the region corresponding with the sensor of backplate.

According to an embodiment, the sensor may be configured as by multiple pixels included in the display extremely A few pixel is used as light source.

According to an embodiment, the electronic installation may additionally include described for making on a surface of the flat site The circuit of display driving that display is operated.

According to an embodiment, electronic installation may include display panel, flexible member, circuit of display driving, FPCB and Biology sensor, wherein, display panel includes and the display surface formed with multiple pixels for display content, flexible member The first area of the surface contact of plate and the second area from surface extension, circuit of display driving are arranged in described On the second area of flexible member, FPCB is connected with the second area, and biosensor arrangement is in the FPCB A surface on.

According to an embodiment, the biology sensor may be configured as using at least one pixel in the multiple pixel Make light source.

According to an embodiment, the second area it is flexible with cause the biology sensor and the display panel every Open relative.

According to an embodiment, electronic installation may include display and FPCB (flexible printed circuit board, flexible Printed circuit board), wherein, display includes the connection that viewing area and the side from the viewing area extend Region, and FPCB electrically connects with the join domain.The back side of the part for the join domain towards the viewing area Fold, to cause the back side of the FPCB and the back side of the viewing area to separate relatively, the back side arrangement of the FPCB (mount) there is predetermined module.

According to an embodiment, electronic installation may include：Display panel, and including electrically connecting with the display panel The FPCB of bending area and the flat site being connected with the bending area.The bending area can be towards the display panel It is spine folded, to cause the back side of the flat site and the back side of the display panel to separate relatively, the flat site The back side can be disposed with predetermined module.

The term " module " used in the present invention for example may imply that including in hardware, software or firmware (firmware) One or at least two combination unit (unit)." module " for example can be with unit (unit), logic (logic), logical block The term such as (logical block), component (component) or circuit (circuit) is used interchangeably (interchangeably use)." module " can perform the least unit or one part of one or more functions." mould Block " can be achieved as mechanical or electronic type.For example, " module " may include：It is known or what will be developed is able to carry out some behaviour ASIC (application specific integrated circuit, application-specific integrated circuit) chip of work, FPGAs (scenes Programmable gate array, field-programmable gate arrays) or PLD (programmable- Logic device) in it is at least one.

According at least one of the device (for example, module or its function) or method (for example, operation) of various embodiments Computer-readable recording medium (computer-readable storage with program module, form can for example be passed through by dividing Media the order of storage is realized in).It is described at least one when the order is performed by program (for example, program 420) The executable function corresponding to the order of program.Computer-readable recording medium for example can be memory 430.

Computer readable recording medium storing program for performing may include hard disk, floppy disk, magnetic medium (magnetic media) (for example, magnetic Band), optical recording media (optical media) is (for example, CD-ROM, DVD (digital versatile disc, digital Versatile disc), magnet-optical medium (magneto-optical media) (for example, photomagneto disk (floptical disk)), Hardware unit (for example, ROM, RAM or flash memory etc.) etc..In addition, program command can not only include as formed by compiler Machine-language coding, may also include computer can be encoded using translater etc. come the high-level language performed.Described hardware dress Put and may be configured as at least one software module and operate, to perform the operation of various embodiments, vice versa.

May include according to the module of various embodiments or program module it is at least one in above-mentioned inscape, or omit A part, or may also include additional other inscapes.According to the module of various embodiments, program module or by other The operation that inscape performs can be run in order, block form, repeatedly or heuristic (heuristic) method.Separately Outside, part operation can run or be omitted in other sequences, or this adds other operations.

Embodiment disclosed by the invention, the explanation of technology contents and the purpose of understanding are proposed for providing, not It is intended to limit the scope of the present invention.Therefore, the scope of this specification should be interpreted that including being carried out according to the technology of the present invention thought All changes or various other embodiments.

Claims

1. a kind of electronic installation, including：

Display, including the join domain that viewing area and the side from the viewing area extend；

Flexible printed circuit board, the flexible printed circuit board electrically connect with the join domain；And

Predetermined module, it is arranged on the first face of the flexible printed circuit board,

Wherein, the join domain can be bent so that the predetermined module separates relatively with the display.

2. electronic installation according to claim 1, wherein,

Display panel is not formed on the join domain, and is formed by polyimide material.

3. electronic installation according to claim 1, wherein,

At least a portion formed with display panel on the join domain.

4. electronic installation according to claim 1, in addition to：

Another predetermined module, it is arranged on second face opposite with first face of the flexible printed circuit board.

5. electronic installation according to claim 1, in addition to：

Backplate, the back side of the display is formed at,

Wherein, formed with opening on the region corresponding with the predetermined module of the backplate.

6. electronic installation according to claim 5, wherein,

The backplate is attached around the region of the opening by adhesive layer and the flexible printed circuit board,

The adhesive layer includes bypassing air through and isolating the flashing member of moisture.

7. electronic installation according to claim 1, wherein,

The display includes the backplate for being formed at the back side of the display,

Opening is not formed on the backplate, and

The predetermined module is pressure sensor.

8. electronic installation according to claim 1, wherein,

The predetermined module includes at least one in biology sensor and pressure sensor.

9. electronic installation according to claim 8, wherein,

The biology sensor is arranged at least one pixel in multiple pixels included in the display being used as light Source.

10. electronic installation according to claim 1, wherein,

The predetermined module is biology sensor, and

At least one pressure sensor adjacent with the predetermined module is disposed with first face.

11. electronic installation according to claim 10, wherein,

The biology sensor is arranged to be swashed when at least one pressure sensor detects the pressure of more than predetermined value It is living.

12. electronic installation according to claim 1, wherein,

Buffer component is disposed with the surface relative with the display of the predetermined module.

13. electronic installation according to claim 1, in addition to：

Circuit of display driving, it is arranged on a surface of the join domain, and for controlling the display.

14. a kind of display device, including：

Display panel, formed with multiple pixels for display content；

Flexible member, including the first area contacted with a surface of the display panel and extend from a surface second Region；

Circuit of display driving, it is arranged on the second area of the flexible member；

Flexible printed circuit board, the flexible printed circuit board are connected with the second area；And

Biology sensor, it is arranged on the surface of the flexible printed circuit board.

15. display device according to claim 14, wherein,

The second area can be bent so that the biology sensor separates relatively with the display panel.