CN107390735A - Temprature control method and device - Google Patents

Temprature control method and device Download PDF

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Publication number
CN107390735A
CN107390735A CN201710708470.7A CN201710708470A CN107390735A CN 107390735 A CN107390735 A CN 107390735A CN 201710708470 A CN201710708470 A CN 201710708470A CN 107390735 A CN107390735 A CN 107390735A
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China
Prior art keywords
microserver
temperature
cluster
affiliated
determined
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CN201710708470.7A
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Chinese (zh)
Inventor
叶胡星
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Shenzhen One Electronics Co Ltd
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Shenzhen One Electronics Co Ltd
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Priority to CN201710708470.7A priority Critical patent/CN107390735A/en
Publication of CN107390735A publication Critical patent/CN107390735A/en
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00Control of temperature
    • G05D23/19Control of temperature characterised by the use of electric means
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0421Multiprocessor system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/22Pc multi processor system
    • G05B2219/2214Multicontrollers, multimicrocomputers, multiprocessing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Stored Programmes (AREA)

Abstract

The embodiment of the present invention, which provides temprature control method and device, this method, to be included:When first microserver detects that the temperature of first microserver meets preparatory condition, the second microserver is determined in the affiliated microserver cluster of first microserver;First microserver sends radiating shared instruction to second microserver;First microserver is radiated using the cooling system of second microserver to first microserver, to reduce the temperature of first microserver.It using the embodiment of the present invention, can effectively be radiated, improve the service life of microserver.

Description

Temprature control method and device
Technical field
The present invention relates to communication technical field, more particularly to temprature control method and device.
Background technology
With the fast development of cloud storage technology, Internet data center (Internet Data Center, IDC) computer room Data storage medium arrangement furnishings density more and more higher, requirement to server radiating performance also more and more higher.Current Server field be essentially all using air cooling system be heater element cooled, still, in large-scale data center, only according to By the air-cooled requirement for being insufficient for high heat flux server for radiating, therefore, it is current for how effectively carrying out radiating The technical problem of urgent need to resolve.
The content of the invention
The embodiment of the present invention provides temprature control method and device, can effectively be radiated, improve the use of microserver Life-span.
In a first aspect, the embodiment of the present invention provides a kind of temprature control method, including:
When first microserver detects that the temperature of first microserver meets preparatory condition, described first in incognito The second microserver is determined in the business affiliated microserver cluster of device;
First microserver sends radiating shared instruction to second microserver;
First microserver is carried out using the cooling system of second microserver to first microserver Radiating, to reduce the temperature of first microserver.
Optionally, when first microserver detects that the temperature of first microserver meets preparatory condition, The second microserver is determined in the affiliated microserver cluster of first microserver, including:
When first microserver detects that the temperature of first microserver is higher than the first preset temperature threshold value, really The temperature of fixed first microserver meets the preparatory condition;
First microserver determines the second microserver in the affiliated microserver cluster of first microserver.
Optionally, when first microserver detects that the temperature of first microserver meets preparatory condition, The second microserver is determined in the affiliated microserver cluster of first microserver, including:
First microserver detects temperature gap of first microserver in preset time period higher than the During two preset temperature threshold values, determine that the temperature of first microserver meets the preparatory condition;
First microserver determines the second microserver in the affiliated microserver cluster of first microserver.
Optionally, it is described to determine the second microserver in the affiliated microserver cluster of first microserver, including:
First microserver obtains the cooling system for each microserver that the microserver cluster is included Cooling medium output quantity;
First microserver is using the microserver belonging to the less cooling system of cooling medium output quantity as described in Second microserver.
Optionally, it is described to determine the second microserver in the affiliated microserver cluster of first microserver, including:
First microserver obtains the CPU usage for each microserver that the microserver cluster is included;
First microserver is using the less microserver of CPU usage as second microserver.
Second aspect, the embodiment of the present invention provide a kind of temperature control equipment, and described device includes:
Server determining module, when the temperature for detecting first microserver meets preparatory condition, described The second microserver is determined in the affiliated microserver cluster of first microserver;
Instruction sending module, for sending radiating shared instruction to second microserver;
Radiating module, first microserver is dissipated for the cooling system using second microserver Heat, to reduce the temperature of first microserver.
Optionally, the server determining module, is specifically used for:
When the temperature for detecting first microserver is higher than the first preset temperature threshold value, described first is determined in incognito The temperature of business device meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the server determining module, is specifically used for:
When detecting that temperature gap of first microserver in preset time period be higher than the second preset temperature threshold value When, determine that the temperature of first microserver meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the server determining module, is specifically used for:
Obtain the cooling medium output quantity of the cooling system for each microserver that the microserver cluster is included;
Using the microserver belonging to the less cooling system of cooling medium output quantity as second microserver.
Optionally, the server determining module, is specifically used for:
Obtain the CPU usage for each microserver that the microserver cluster is included;
Using the less microserver of CPU usage as second microserver.
The third aspect, the embodiments of the invention provide a kind of microserver, it is characterised in that is set including processor, input Standby, output equipment and memory, the processor, input equipment, output equipment and memory are connected with each other, wherein, it is described to deposit Reservoir is used to store computer program, and the computer program includes programmed instruction, and the processor is arranged to call institute Programmed instruction is stated, performs method as described in relation to the first aspect.
Fourth aspect, the embodiments of the invention provide a kind of computer-readable recording medium, it is characterised in that the calculating Machine storage medium is stored with computer program, and the computer program includes programmed instruction, and described program instruction is when by processor Make the method for the computing device as described in relation to the first aspect during execution.
In the embodiment of the present invention, the first microserver detects that the temperature of first microserver meets preparatory condition When, determine the second microserver in the affiliated microserver cluster of first microserver;First microserver is to institute State the second microserver and send radiating shared instruction;First microserver uses the cooling system of second microserver First microserver is radiated, to reduce the temperature of first microserver, can effectively be radiated, is improved micro- The service life of server.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, it will use below required in embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability For the those of ordinary skill of domain, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached Figure.
Fig. 1 is a kind of schematic flow sheet of temprature control method provided in an embodiment of the present invention;
Fig. 2 is a kind of structural representation of temperature control equipment provided in an embodiment of the present invention;
Fig. 3 is a kind of structural representation of microserver provided in an embodiment of the present invention;
Fig. 4 is a kind of structural representation of temperature control system provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is part of the embodiment of the present invention, rather than whole embodiments.Based on this hair Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made Example, belongs to the scope of protection of the invention.
Fig. 1 is referred to, Fig. 1 is a kind of schematic flow sheet of temprature control method provided in an embodiment of the present invention, such as Fig. 1 institutes Show, comprise the following steps:
When step 101, the first microserver detect that the temperature of first microserver meets preparatory condition, described The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the first microserver detects that the temperature of first microserver is higher than the first preset temperature threshold value When, determine that the temperature of first microserver meets the preparatory condition;First microserver can be described first The second microserver is determined in the affiliated microserver cluster of microserver.
Optionally, the first microserver detects that temperature gap of first microserver in preset time period is higher than During the second preset temperature threshold value, it may be determined that the temperature of first microserver meets the preparatory condition;Described first is micro- Server determines the second microserver in the affiliated microserver cluster of first microserver.
Optionally, the first microserver can obtain the cooling for each microserver that the microserver cluster is included The cooling medium output quantity of system;First microserver by belonging to the less cooling system of cooling medium output quantity in incognito Device be engaged in as second microserver.
Optionally, the first microserver can obtain the CPU for each microserver that the microserver cluster is included Utilization rate;First microserver is using the less microserver of CPU usage as second microserver.
Step 102, the first microserver send radiating shared instruction to second microserver.
Step 103, the first microserver are using the cooling system of second microserver to first microserver Radiated, to reduce the temperature of first microserver.
In the embodiment of the present invention, the first microserver detects that the temperature of first microserver meets preparatory condition When, determine the second microserver in the affiliated microserver cluster of first microserver;First microserver is to institute State the second microserver and send radiating shared instruction;First microserver uses the cooling system of second microserver First microserver is radiated, to reduce the temperature of first microserver, can effectively be radiated, is improved micro- The service life of server.
Fig. 2 is referred to, Fig. 2 is a kind of structural representation of temperature control equipment provided in an embodiment of the present invention, such as Fig. 2 institutes Show, including:
Server determining module 201, when the temperature for detecting first microserver meets preparatory condition, in institute State in the affiliated microserver cluster of the first microserver and determine the second microserver;
Instruction sending module 202, for sending radiating shared instruction to second microserver;
Radiating module 203, for being carried out using the cooling system of second microserver to first microserver Radiating, to reduce the temperature of first microserver.
Optionally, the server determining module 201, is specifically used for:
When the temperature for detecting first microserver is higher than the first preset temperature threshold value, described first is determined in incognito The temperature of business device meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the server determining module 201, is specifically used for:
When detecting that temperature gap of first microserver in preset time period be higher than the second preset temperature threshold value When, determine that the temperature of first microserver meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the server determining module 201, is specifically used for:
Obtain the cooling medium output quantity of the cooling system for each microserver that the microserver cluster is included;
Using the microserver belonging to the less cooling system of cooling medium output quantity as second microserver.
Optionally, the server determining module 201, is specifically used for:
Obtain the CPU usage for each microserver that the microserver cluster is included;
Using the less microserver of CPU usage as second microserver.
In the embodiment of the present invention, it is default that server determining module 201 detects that the temperature of first microserver meets During condition, the second microserver is determined in the affiliated microserver cluster of first microserver;Instruction sending module 202 to Second microserver sends radiating shared instruction;Radiating module 203 uses the cooling system pair of second microserver First microserver is radiated, and to reduce the temperature of first microserver, can effectively be radiated, and is improved in incognito The service life of business device.
Referring to Fig. 3, Fig. 3 is a kind of structure chart of microserver provided in an embodiment of the present invention.As shown in figure 3, micro services Device includes:Processor 301, memory 302, network interface 304 and user interface 303.Each component in microserver passes through Bus system 305 is coupled.Bus system 305 in addition to including data/address bus, in addition to power bus, controlling bus and Status signal bus in addition.But for the sake of clear explanation, various buses are all designated as bus system 305 in figure 3.
Wherein, user interface 303 can include display, keyboard or pointing device (for example, mouse, trace ball (track ball), touch-sensitive plate or touch-screen etc..
It is appreciated that the memory 302 in the embodiment of the present invention can be volatile memory or nonvolatile memory, Or it may include both volatibility and nonvolatile memory.Wherein, nonvolatile memory can be read-only storage (Read- Only Memory, ROM), programmable read only memory (Programmable ROM, PROM), the read-only storage of erasable programmable Device (Erasable PROM, EPROM), Electrically Erasable Read Only Memory (Electrically EPROM, EEPROM) or Flash memory.Volatile memory can be random access memory (Random Access Memory, RAM), and it is used as outside high Speed caching.By exemplary but be not restricted explanation, the RAM of many forms can use, such as static RAM (Static RAM, SRAM), dynamic random access memory (Dynamic RAM, DRAM), Synchronous Dynamic Random Access Memory (Synchronous DRAM, SDRAM), double data speed synchronous dynamic RAM (Double Data Rate SDRAM, DDRSDRAM), enhanced Synchronous Dynamic Random Access Memory (Enhanced SDRAM, ESDRAM), synchronized links Dynamic random access memory (Synchlink DRAM, SLDRAM) and direct rambus random access memory (Direct Rambus RAM, DRRAM).The memory 302 of system and method described herein be intended to including but not limited to these and it is any its It is adapted to the memory of type.
In some embodiments, memory 302 stores following element, can perform module or data structure, or Their subset of person, or their superset:Operating system 3021 and application program 3022.
Wherein, operating system 3021, comprising various system programs, such as ccf layer, core library layer, driving layer etc., it is used for Realize various basic businesses and the hardware based task of processing.Application program 3022, include various application programs, such as media Player (Media Player), browser (Browser) etc., for realizing various applied business.Realize the embodiment of the present invention The program of method may be embodied in application program 3022.
In embodiments of the present invention, by calling program or the instruction of the storage of memory 302, specifically, can be application The program stored in program 3022 or instruction, processor 301 are used for:
When detecting that the temperature of first microserver meets preparatory condition, belonging to first microserver in incognito The second microserver is determined in business device cluster;
Radiating shared instruction is sent to second microserver;
First microserver is radiated using the cooling system of second microserver, to reduce described The temperature of one microserver.
Optionally, when the processor 301 detects that the temperature of first microserver meets preparatory condition, described The second microserver is determined in the affiliated microserver cluster of first microserver, is specifically as follows:
When detecting that the temperature of first microserver is higher than the first preset temperature threshold value, first micro services are determined The temperature of device meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, when processor 301 detects that the temperature of first microserver meets preparatory condition, described first The second microserver is determined in the affiliated microserver cluster of microserver, is specifically as follows:
When detecting that temperature gap of first microserver in preset time period is higher than the second preset temperature threshold value, Determine that the temperature of first microserver meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
Optionally, the processor 301 determines second in incognito in the affiliated microserver cluster of first microserver Business device, is specifically as follows:
Obtain the cooling medium output quantity of the cooling system for each microserver that the microserver cluster is included;
Using the microserver belonging to the less cooling system of cooling medium output quantity as second microserver.
Optionally, the processor 301 determines second in incognito in the affiliated microserver cluster of first microserver Business device, is specifically as follows:
Obtain the CPU usage for each microserver that the microserver cluster is included;
Using the less microserver of CPU usage as second microserver.
The method that the embodiments of the present invention disclose can apply in processor 301, or be realized by processor 301. Processor 301 is probably a kind of IC chip, has the disposal ability of signal.In implementation process, the above method it is each Step can be completed by the integrated logic circuit of the hardware in processor 301 or the instruction of software form.Above-mentioned processing Device 301 can be general processor, digital signal processor (Digital Signal Processor, DSP), special integrated electricity Road (Application Specific Integrated Circuit, ASIC), ready-made programmable gate array (Field Programmable Gate Array, FPGA) either other PLDs, discrete gate or transistor logic, Discrete hardware components.It can realize or perform disclosed each method, step and the logic diagram in the embodiment of the present invention.It is general Processor can be microprocessor or the processor can also be any conventional processor etc..With reference to institute of the embodiment of the present invention The step of disclosed method, can be embodied directly in hardware decoding processor and perform completion, or with the hardware in decoding processor And software module combination performs completion.Software module can be located at random access memory, flash memory, read-only storage, may be programmed read-only In the ripe storage medium in this area such as memory or electrically erasable programmable memory, register.The storage medium is located at Memory 302, processor 301 read the information in memory 302, with reference to the step of its hardware completion above method.
It is understood that embodiments described herein can use hardware, software, firmware, middleware, microcode or its Combine to realize.Realized for hardware, processing unit can be realized in one or more application specific integrated circuit (Application Specific Integrated Circuits, ASIC), digital signal processor (Digital Signal Processing, DSP), digital signal processing appts (DSP Device, DSPD), programmable logic device (Programmable Logic Device, PLD), field programmable gate array (Field-Programmable Gate Array, FPGA), general processor, In controller, microcontroller, microprocessor, other electronic units for performing herein described function or its combination.
Realize, can be realized herein by performing the module (such as process, function etc.) of function described herein for software Described technology.Software code is storable in memory and passes through computing device.Memory can within a processor or Realized outside processor.
Fig. 4 is referred to, is the schematic block diagram of temperature control system provided in an embodiment of the present invention.Retouched in the present embodiment The system stated, specifically, as shown in figure 4, the system of the embodiment of the present invention comprises at least the first microserver 401 and second Microserver 402, wherein:
When first microserver 401 detects that the temperature of first microserver 401 meets preparatory condition, described The second microserver 402 is determined in microserver cluster belonging to one microserver 401;
First microserver 401 sends radiating shared instruction to second microserver 402;
First microserver 401 is using the cooling system of second microserver 402 to first micro services Device 401 is radiated, to reduce the temperature of first microserver 401.
Optionally, first microserver 401 detects that the temperature of first microserver 401 meets preparatory condition When, the second microserver 402 is determined in microserver cluster belonging to first microserver 401, including:
First microserver 401 detects that the temperature of first microserver 401 is higher than the first preset temperature threshold During value, determine that the temperature of first microserver 401 meets the preparatory condition;
First microserver 401 determines that second is micro- in microserver cluster belonging to first microserver 401 Server 402.
Optionally, first microserver 401 detects that the temperature of first microserver 401 meets preparatory condition When, the second microserver 402 is determined in microserver cluster belonging to first microserver 401, including:
First microserver 401 detects temperature gap of first microserver 401 in preset time period During higher than the second preset temperature threshold value, determine that the temperature of first microserver 401 meets the preparatory condition;
First microserver 401 determines that second is micro- in microserver cluster belonging to first microserver 401 Server 402.
Optionally, it is described to determine the second microserver in microserver cluster belonging to first microserver 401 402, including:
First microserver 401 obtains the cooling system for each microserver that the microserver cluster is included Cooling medium output quantity;
First microserver 401 is using the microserver belonging to the less cooling system of cooling medium output quantity as institute State the second microserver 402.
Optionally, it is described to determine the second microserver in microserver cluster belonging to first microserver 401 402, including:
The CPU that first microserver 401 obtains each microserver that the microserver cluster is included is used Rate;
First microserver 401 is using the less microserver of CPU usage as second microserver 402.
Those of ordinary skill in the art are it is to be appreciated that the list of each example described with reference to the embodiments described herein Member and algorithm steps, it can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually Performed with hardware or software mode, application-specific and design constraint depending on technical scheme.Professional and technical personnel Described function can be realized using distinct methods to each specific application, but this realization is it is not considered that exceed The scope of the present invention.
It is apparent to those skilled in the art that for convenience and simplicity of description, the system of foregoing description, The specific work process of device and unit, the corresponding process in preceding method embodiment is may be referred to, will not be repeated here.
In embodiment provided herein, it should be understood that disclosed apparatus and method, others can be passed through Mode is realized.For example, device embodiment described above is only schematical, for example, the division of the unit, is only A kind of division of logic function, can there is an other dividing mode when actually realizing, for example, multiple units or component can combine or Person is desirably integrated into another system, or some features can be ignored, or does not perform.Another, shown or discussed is mutual Between coupling or direct-coupling or communication connection can be INDIRECT COUPLING or communication link by some interfaces, device or unit Connect, can be electrical, mechanical or other forms.
The unit illustrated as separating component can be or may not be physically separate, show as unit The part shown can be or may not be physical location, you can with positioned at a place, or can also be distributed to multiple On NE.Some or all of unit therein can be selected to realize scheme of the embodiment of the present invention according to the actual needs Purpose.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, can also That unit is individually physically present, can also two or more units it is integrated in a unit.
If the function is realized in the form of SFU software functional unit and is used as independent production marketing or in use, can be with It is stored in a computer read/write memory medium.Based on such understanding, technical scheme is substantially in other words The part to be contributed to prior art or the part of the technical scheme can be embodied in the form of software product, the meter Calculation machine software product is stored in a storage medium, including some instructions are causing a computer equipment (can be People's computer, server, or network equipment etc.) perform all or part of step of each embodiment methods described of the present invention. And foregoing storage medium includes:USB flash disk, mobile hard disk, ROM, RAM, magnetic disc or CD etc. are various can be with store program codes Medium.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.

Claims (10)

1. a kind of temprature control method, it is characterised in that methods described includes:
When first microserver detects that the temperature of first microserver meets preparatory condition, in first microserver The second microserver is determined in affiliated microserver cluster;
First microserver sends radiating shared instruction to second microserver;
First microserver is radiated using the cooling system of second microserver to first microserver, To reduce the temperature of first microserver.
2. according to the method for claim 1, it is characterised in that first microserver detects first micro services When the temperature of device meets preparatory condition, the second microserver is determined in the affiliated microserver cluster of first microserver, Including:
When first microserver detects that the temperature of first microserver is higher than the first preset temperature threshold value, institute is determined The temperature for stating the first microserver meets the preparatory condition;
First microserver determines the second microserver in the affiliated microserver cluster of first microserver.
3. according to the method for claim 1, it is characterised in that first microserver detects first micro services When the temperature of device meets preparatory condition, the second microserver is determined in the affiliated microserver cluster of first microserver, Including:
First microserver detects that temperature gap of first microserver in preset time period is pre- higher than second If during temperature threshold, determine that the temperature of first microserver meets the preparatory condition;
First microserver determines the second microserver in the affiliated microserver cluster of first microserver.
4. according to the method for claim 1, it is characterised in that described in the affiliated microserver collection of first microserver The second microserver is determined in group, including:
First microserver obtains the cooling of the cooling system for each microserver that the microserver cluster is included Medium output quantity;
First microserver is using the microserver belonging to the less cooling system of cooling medium output quantity as described second Microserver.
5. according to the method for claim 1, it is characterised in that described in the affiliated microserver collection of first microserver The second microserver is determined in group, including:
First microserver obtains the CPU usage for each microserver that the microserver cluster is included;
First microserver is using the less microserver of CPU usage as second microserver.
6. a kind of temperature control equipment, it is characterised in that described device includes:
Server determining module, when the temperature for detecting first microserver meets preparatory condition, described first The second microserver is determined in the affiliated microserver cluster of microserver;
Instruction sending module, for sending radiating shared instruction to second microserver;
Radiating module, first microserver is radiated for the cooling system using second microserver, with Reduce the temperature of first microserver.
7. device according to claim 6, it is characterised in that the server determining module, be specifically used for:
When the temperature for detecting first microserver is higher than the first preset temperature threshold value, first microserver is determined Temperature meet the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
8. device according to claim 6, it is characterised in that the server determining module, be specifically used for:
When detecting that temperature gap of first microserver in preset time period is higher than the second preset temperature threshold value, really The temperature of fixed first microserver meets the preparatory condition;
The second microserver is determined in the affiliated microserver cluster of first microserver.
9. device according to claim 6, it is characterised in that the server determining module, be specifically used for:
Obtain the cooling medium output quantity of the cooling system for each microserver that the microserver cluster is included;
Using the microserver belonging to the less cooling system of cooling medium output quantity as second microserver.
10. device according to claim 6, it is characterised in that the server determining module, be specifically used for:
Obtain the CPU usage for each microserver that the microserver cluster is included;
Using the less microserver of CPU usage as second microserver.
CN201710708470.7A 2017-08-17 2017-08-17 Temprature control method and device Pending CN107390735A (en)

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