CN107385421A - A kind of hydrophilic laminated film of heat conduction and preparation method thereof - Google Patents
A kind of hydrophilic laminated film of heat conduction and preparation method thereof Download PDFInfo
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- CN107385421A CN107385421A CN201710771690.4A CN201710771690A CN107385421A CN 107385421 A CN107385421 A CN 107385421A CN 201710771690 A CN201710771690 A CN 201710771690A CN 107385421 A CN107385421 A CN 107385421A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000010408 film Substances 0.000 claims description 165
- 239000000758 substrate Substances 0.000 claims description 40
- 238000000889 atomisation Methods 0.000 claims description 25
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 239000004411 aluminium Substances 0.000 claims description 15
- 238000005118 spray pyrolysis Methods 0.000 claims description 13
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 6
- 238000004090 dissolution Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000010148 water-pollination Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- RLQWHDODQVOVKU-UHFFFAOYSA-N tetrapotassium;silicate Chemical compound [K+].[K+].[K+].[K+].[O-][Si]([O-])([O-])[O-] RLQWHDODQVOVKU-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1258—Spray pyrolysis
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides a kind of hydrophilic laminated film of heat conduction and preparation method thereof, the hydrophilic laminated film of heat conduction includes heat conduction film and the hydrophilic film positioned at heat conduction film surface, wherein, the hydrophilic film is atomized by KP1 forms, and the thickness of the hydrophilic film is less than 100 nanometers.Because the hydrophilic film is inorganic, it is preferable relative to the hydrophilic film heat conductivility of organic material, and because the hydrophilic film is formed using atomizing type, thickness is less than 100 nanometers, only nanometer grade thickness, it is smaller so as to be influenceed on the heat conductivility of heat conduction film, namely the hydrophilic laminated film of heat conduction provided by the invention have it is hydrophilic on the basis of, also there is preferable heat conductivility simultaneously, when the hydrophilic laminated film of heat conduction i.e. provided by the invention is applied on a heat sink, the hydrophilicity for improving fin simultaneously, influences smaller on the heat conductivility of fin.
Description
Technical field
The invention belongs to film manufacturing techniques field, more particularly to hydrophilic laminated film of a kind of heat conduction and preparation method thereof.
Background technology
Hydrophilic film has unique performance, it is in heat exchanger, fin, antifog, automatically cleaning as a kind of surface coating
Have wide practical use in terms of Deng research, also increasingly paid attention to by widely studied person.
But the hydrophilic film heat conductivility applied in the market is poor, using on a heat sink when, can reduce scattered
The heat dispersion of backing.
With preferable heat conductivility and with preferable hydrophilic laminated film it is urgently to be resolved hurrily therefore it provides a kind of
Problem.
The content of the invention
In view of this, the present invention provides a kind of hydrophilic laminated film of heat conduction and preparation method thereof, to solve in the prior art
Hydrophilic film is applied the problem of causing the heat dispersion of fin to reduce when on a heat sink.
To achieve the above object, the present invention provides following technical scheme：
A kind of hydrophilic laminated film of heat conduction, including：
Heat conduction film, the heat conduction film are doping Sb SnO2Film；
Positioned at the hydrophilic film of the heat conduction film surface, the hydrophilic film is atomized by KP1 to be formed, and described
The thickness of hydrophilic film is less than 100 nanometers.
Preferably, the heat conduction film is by SnCl4·5H2O and SbCl3It is 1 according to mol ratio:1 to 9:1 ratio is mixed
Conjunction is dissolved in HCl solution, and stirring makes it fully dissolve, and forms the first solution, then first solution atomization is formed.
The present invention also provides a kind of heat conduction hydrophilic preparation method of composite film, including：
By SnCl4·5H2O and SbCl3It is 1 according to mol ratio:1 to 9:1 ratio mixed dissolution is in HCl solution, stirring
It is fully dissolved, form the first solution；
KP1 is added to the second solution for being configured to that mass fraction is 5%-10% in deionized water；
Substrate is provided, and the substrate is heated to more than 450 DEG C；
First solution is atomized using spray pyrolysis, the first solution after atomization is pyrolyzed on the substrate
Form one layer of doping Sb SnO2Film；
Second solution is atomized using spray pyrolysis, the second solution after atomization is the doping Sb's
SnO2Hydrophilic film is formed on film.
Preferably, described to be atomized first solution using spray pyrolysis, the first solution after atomization is in institute
State the SnO of hot layer forming solution doping Sb in substrate2Film, specifically include：
First solution is put into supersonic atomizer and is atomized；
The first solution after atomization is pyrolyzed, forms one layer of doping Sb SnO2Film.
Preferably, described to be atomized second solution using spray pyrolysis, the second solution after atomization is in institute
State doping Sb SnO2Hydrophilic film is formed on film, is specifically included：
Second solution is put into supersonic atomizer and is atomized；
The second solution after atomization is pyrolyzed, forms one layer of hydrophilic film.
Preferably, the substrate is aluminium substrate, aluminum alloy substrate, stainless steel base or substrate of glass.
Preferably, the temperature range of the substrate is 450 DEG C~550 DEG C, including endpoint value.
Preferably, SnCl4·5H2O and SbCl3Mol ratio be 9:1、8:2、7:3、6:4 or 5:5.
Understand that hydrophilic laminated film of heat conduction provided by the invention and preparation method thereof is described via above-mentioned technical scheme
The hydrophilic laminated film of heat conduction includes heat conduction film and the hydrophilic film positioned at heat conduction film surface, wherein, the hydrophilic film by
KP1 is atomized to be formed, and the thickness of the hydrophilic film is less than 100 nanometers.Because the hydrophilic film is inorganic,
It is preferable relative to the hydrophilic film heat conductivility of organic material, and because the hydrophilic film is formed using atomizing type, thickness
It is smaller namely provided by the invention so as to be influenceed on the heat conductivility of heat conduction film less than 100 nanometers, only nanometer grade thickness
The hydrophilic laminated film of heat conduction have it is hydrophilic on the basis of, while also there is preferable heat conductivility, i.e., it is provided by the invention to lead
The application of heat hydrophilic laminated film on a heat sink when, the hydrophilicity of fin is improved simultaneously, to the heat conductivility shadow of fin
Sound is smaller.
The hydrophilic preparation method of composite film of heat conduction provided by the invention, it can be formed by being atomized on the surface of heat conduction film
The hydrophilic film of nanometer grade thickness, the hydrophilic film improve the hydrophily of heat conduction film, while to the heat conduction of heat conduction film
Performance impact is smaller, so that when the hydrophilic laminated film of heat conduction is applied on a heat sink, to the heat conductivility of fin
Influence smaller.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of hydrophilic complex thin film structure schematic diagram of heat conduction provided in an embodiment of the present invention；
Fig. 2A-Fig. 2 C are different structure surface contact angle lab diagram provided in an embodiment of the present invention；
Fig. 3 is a kind of hydrophilic laminated film Making programme figure of heat conduction provided in an embodiment of the present invention；
Fig. 4 be ATO films provided in an embodiment of the present invention thermal conductivity factor and coefficient of heat transfer with temperature change relation
Figure.
Embodiment
Just as described in the background section, hydrophilic film heat conductivility of the prior art is poor, using on a heat sink
When, the new energy of radiating of fin can be reduced.
Inventor has found that it is that the hydrophilic film that in the market is applied in the prior art is mainly the reason for above-mentioned phenomenon occur
Organic hydrophilic film, but heat conductivility of organic hydrophilic film itself is poor.And prepared in the prior art using dip coating manner hydrophilic
Film, the thickness of gained hydrophilic film is thicker, and heat conductivility is also poor.
Based on this, the present invention provides a kind of hydrophilic laminated film of heat conduction, including：
Heat conduction film, the heat conduction film are doping Sb SnO2Film；
Positioned at the hydrophilic film of the heat conduction film surface, the hydrophilic film is atomized by KP1 to be formed, and described
The thickness of hydrophilic film is less than 100 nanometers.
The hydrophilic laminated film of heat conduction provided by the invention includes heat conduction film and the hydrophilic film positioned at heat conduction film surface,
Wherein, the hydrophilic film is atomized by KP1 forms, and the thickness of the hydrophilic film is less than 100 nanometers.Due to described
Hydrophilic film is inorganic, preferable relative to the hydrophilic film heat conductivility of organic material, and because the hydrophilic film is adopted
Formed with atomizing type, thickness is less than 100 nanometers, only nanometer grade thickness, so as to the heat conductivility of heat conduction film is influenceed compared with
It is small, namely the hydrophilic laminated film of heat conduction provided by the invention have it is hydrophilic on the basis of, while also there is preferable thermal conductivity
Can, i.e., the hydrophilic laminated film application of heat conduction provided by the invention on a heat sink when, improve the hydrophilicity of fin simultaneously, it is right
The heat conductivility of fin influences smaller.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
As shown in figure 1, be a kind of hydrophilic laminated film of heat conduction provided in an embodiment of the present invention, including：Heat conduction film 1, leads
Hot film 1 is doping Sb SnO2Film；Hydrophilic film 2 positioned at the surface of heat conduction film 1, hydrophilic film 2 is by KP1 mist
Change and formed, and the thickness H of hydrophilic film 2 is less than 100 nanometers.
It should be noted that hydrophilic film 2 is atomized by KP1 and formed in the present embodiment, and thickness is that nanoscale is thick
Degree, i.e. thickness are tens nanometers.The production method of heat conduction film and the thickness of heat conduction film are not limited in the present embodiment, it is optional
, heat conduction film is equally formed using atomizing type in the present embodiment, is specifically included by SnCl4·5H2O and SbCl3According to mole
Than for 1:1 to 9:For 1 ratio mixed dissolution in HCl solution, stirring makes it fully dissolve, and forms the first solution, then by described in
First solution atomization and formed.Wherein, SnCl4·5H2O and SbCl3Mol ratio can be 9:1、8:2、7:3、6:4 or 5:In 5
Any one, this is not limited in the present embodiment.
The concrete technology of KP1 atomization is not limited in the present embodiment, optionally, mist is carried out using Ultrasonic atomization method
Change, then deposit the inorganic hydrophilic film of nano thickness on the surface of heat conduction film using spray pyrolysis.
The doping Sb of high heat conduction SnO is used in the present embodiment2Film, namely ATO films are as cushion, then by potassium water
Glass atomization deposits the inorganic hydrophilic film of nano thickness, and because hydrophilic film has, film forming is uniform and thickness is nanoscale, right
The heat conductivility of heat conduction film influences less, and improves the hydrophilicity of heat conduction film.By hydrophilic film and heat conduction film group
Close the laminated film formed to apply on the substrates such as aluminium base fin, glass, it is possible to increase the heat conductivility of fin and hydrophilic
Performance.
Inventor it was proved that, obtain following heat conductivility Experimental comparison results：
The thermal conductivity factor contrast of 1 different film surfaces of table
| Substrate | Al | Laminated film is covered on Al |
| Thermal conductivity factor | 192.2 | 197.8 |
From table 1 it follows that the thermal conductivity factor of aluminium substrate is 192.2；On aluminum substrates covering atomization hydrophilic film and
Thermal conductivity factor after the laminated film of ATO heat conduction films increases to 197.8, namely covering atomization hydrophilic film provided by the invention
After the laminated film of ATO heat conduction films, the negative effect to the heat dispersion of aluminium substrate is smaller, improves hydrophilic basis
On, do not reduce the heat conductivility of aluminium substrate.
The lifting of hydrophilicity can be obtained by comparison diagram 2A- Fig. 2 C, and the contact angle if Fig. 2A is fine aluminium substrate is
69.4°；Fig. 2 B are that the surface contact angle after fine aluminium substrate surface makes ATO films is 55.9 °；And in fine aluminium substrate surface system
After the laminated film for making ATO heat conduction film and hydrophilic film provided by the invention, its surface contact angle as shown in Figure 2 C, is
5.6 °, by comparing surface contact angle, the hydrophilic laminated film of heat conduction provided by the invention can effectively improve aluminium substrate
Hydrophily.Further, since contact angle is small, water can form water membrane so that aluminium substrate has surface in the rapid drawout in surface
Automatical cleaning ability.
The embodiment of the present invention also provides a kind of heat conduction hydrophilic preparation method of composite film, as shown in figure 3, including：
S101：By SnCl4·5H2O and SbCl3It is 1 according to mol ratio:1 to 9:1 ratio mixed dissolution is in HCl solution
In, stirring makes it fully dissolve, and forms the first solution；
SnCl is not limited in the present embodiment4·5H2O and SbCl3Specific mol ratio, optionally, SnCl4·5H2O and
SbCl3Mol ratio be 9:1、8:2、7:3、6:4 or 5:5.
S102：KP1 is added to the second solution for being configured to that mass fraction is 5%-10% in deionized water；
It should be noted that when KP1 concentration is higher, gelation easily occurs, it is impossible to pyrolysis is atomized again, therefore,
KP1 mass fraction is 5%-10% in the present embodiment, including endpoint value.
In addition, it is necessary to illustrate, the preparation order of the first solution and the second solution is not limited in the present embodiment, both make
Standby order can be exchanged, and this is not limited in the present embodiment.
S103：Substrate is provided, and the substrate is heated to more than 450 DEG C；
Substrate described in the present embodiment can be aluminium substrate, aluminum alloy substrate, stainless steel base or substrate of glass, this implementation
This is not limited in example, designed according to the concrete application scene of the hydrophilic laminated film of heat conduction.
S104：First solution is atomized using spray pyrolysis, the first solution after atomization is in the substrate
Upper hot layer forming solution doping Sb SnO2Film；
Doping Sb SnO is formed in the present embodiment2During the heat conduction film of film, the technique used is spray pyrolysis method.
Specifically include：First solution is put into supersonic atomizer and is atomized；Heat is carried out to the first solution after atomization
Solution, form one layer of doping Sb SnO2Film.
It should be noted that as shown in figure 4, Fig. 4 is doping Sb SnO2The thermal conductivity factor of heat conduction film (ATO films) with
And coefficient of heat transfer is with temperature change relation, wherein, abscissa is temperature, and left side ordinate is thermal conductivity factor, right side ordinate
For coefficient of heat transfer, square represents the thermal conductivity factor of heat conduction film, the coefficient of heat transfer of square band × represent heat conduction film.Pass through Fig. 4
As can be seen that ATO films, when temperature is 450 DEG C -550 DEG C, heat conductivility is preferable, and especially at 500 DEG C, heat conductivility is most
It is good, therefore, in the present embodiment when being atomized the first solution formation ATO films, substrate is heated to more than 450 DEG C, in particular 450
DEG C -550 DEG C, including endpoint value.It is more optional, base reservoir temperature can be controlled at 500 DEG C or so, to form heat conductivility
Preferable heat conduction film.
Furthermore, it is contemplated that when base reservoir temperature is too low, pyrolytic reaction can not occur, cannot get ATO films, and when substrate is aluminium
During substrate, to avoid temperature too high, aluminium substrate is melted so that the adhesive force of molecule declines, will in the present embodiment preferably
Base reservoir temperature is controlled in 450 DEG C -550 DEG C, including endpoint value.
S105：Second solution is atomized using spray pyrolysis, the second solution after atomization is in the doping
Sb SnO2Hydrophilic film is formed on film.
The making of hydrophilic film is equally formed using spray pyrolysis in the present embodiment, is keeping the constant feelings of base reservoir temperature
Under condition, the second solution after atomization is formed into hydrophilic film on heat conduction film.Specifically, second solution is put into ultrasound
It is atomized in ripple atomising device；The second solution after atomization is pyrolyzed, one layer of formation is hydrophilic on the heat conduction film
Film.
The hydrophilic preparation method of composite film of heat conduction provided by the invention, it can be formed by being atomized on the surface of heat conduction film
The hydrophilic film of nanometer grade thickness, the hydrophilic film improve the hydrophily of heat conduction film, while to the heat conduction of heat conduction film
Performance impact is smaller, so that when the hydrophilic laminated film of heat conduction is applied on a heat sink, to the heat conductivility of fin
Influence smaller.Using the above method obtain hydrophilic film have film forming uniformly and thickness be nanoscale, the laminated film can be applied
On the substrates such as aluminium base fin, glass, the heat conductivility and hydrophilicity of fin are improved.
It should be noted that each embodiment in this specification is described by the way of progressive, each embodiment weight
Point explanation is all difference with other embodiment, between each embodiment identical similar part mutually referring to.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (8)
- A kind of 1. hydrophilic laminated film of heat conduction, it is characterised in that including：Heat conduction film, the heat conduction film are doping Sb SnO2Film；Positioned at the hydrophilic film of the heat conduction film surface, the hydrophilic film is atomized by KP1 to be formed, and described hydrophilic The thickness of film is less than 100 nanometers.
- 2. the hydrophilic laminated film of heat conduction according to claim 1, it is characterised in that the heat conduction film is by SnCl4· 5H2O and SbCl3It is 1 according to mol ratio:1 to 9:For 1 ratio mixed dissolution in HCl solution, stirring makes it fully dissolve, and is formed First solution, then first solution atomization is formed.
- A kind of 3. hydrophilic preparation method of composite film of heat conduction, it is characterised in that including：By SnCl4·5H2O and SbCl3It is 1 according to mol ratio:1 to 9:For 1 ratio mixed dissolution in HCl solution, stirring makes it Fully dissolving, form the first solution；KP1 is added to the second solution for being configured to that mass fraction is 5%-10% in deionized water；Substrate is provided, and the substrate is heated to more than 450 DEG C；First solution is atomized using spray pyrolysis, the first solution after atomization is pyrolyzed to be formed on the substrate One layer of doping Sb SnO2Film；Second solution is atomized using spray pyrolysis, SnO of the second solution after atomization in the doping Sb2It is thin Hydrophilic film is formed on film.
- 4. the hydrophilic preparation method of composite film of heat conduction according to claim 3, it is characterised in that described to use spray pyrolysis First solution is atomized by method, the hot layer forming solution doping Sb on the substrate of the first solution after atomization SnO2 Film, specifically include：First solution is put into supersonic atomizer and is atomized；The first solution after atomization is pyrolyzed, forms one layer of doping Sb SnO2Film.
- 5. the hydrophilic preparation method of composite film of heat conduction according to claim 3, it is characterised in that described to use spray pyrolysis Second solution is atomized by method, SnO of the second solution after atomization in the doping Sb2Formed on film hydrophilic thin Film, specifically include：Second solution is put into supersonic atomizer and is atomized；The second solution after atomization is pyrolyzed, forms one layer of hydrophilic film.
- 6. the hydrophilic preparation method of composite film of heat conduction according to claim 3, it is characterised in that the substrate is aluminium base Bottom, aluminum alloy substrate, stainless steel base or substrate of glass.
- 7. the hydrophilic preparation method of composite film of heat conduction according to claim 6, it is characterised in that the temperature model of the substrate Enclose for 450 DEG C~550 DEG C, including endpoint value.
- 8. the hydrophilic preparation method of composite film of heat conduction according to claim 3, it is characterised in that SnCl4·5H2O and SbCl3Mol ratio be 9:1、8:2、7:3、6:4 or 5:5.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4466832A (en) * | 1981-11-06 | 1984-08-21 | Daikin Kogyo Company, Limited | Composition for forming hydrophilic coating |
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