CN107370931A - A kind of camera module and electronic equipment - Google Patents
A kind of camera module and electronic equipment Download PDFInfo
- Publication number
- CN107370931A CN107370931A CN201710772665.8A CN201710772665A CN107370931A CN 107370931 A CN107370931 A CN 107370931A CN 201710772665 A CN201710772665 A CN 201710772665A CN 107370931 A CN107370931 A CN 107370931A
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- CN
- China
- Prior art keywords
- camera module
- sensitive chip
- sensitive
- chip
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
Abstract
This application discloses a kind of camera module and electronic equipment, wherein, the camera module has multiple different types of sensitive chips, when having different photosensitive parameter requests to the camera module, the sensitive chip of a target can be selected to work by way of sending output order to the process chip of the camera module, to realize the purpose for the view data for receiving different types of sensitive chip output, demand of the electronic equipment to different grades of camera module is adapted to so as to meet, improve the applicability of the camera module, and then reduce the development cost of camera module.
Description
Technical field
The application is related to picture pick-up device technical field, more specifically to a kind of camera module and electronic equipment.
Background technology
With the mature of camera technique, integrating camera function in the electronic device turns into the basic training of electronic equipment
Energy.
Due to the update speed of electronic equipment, the species of the camera module of demand is not yet quickly, in each class of electronic devices
Identical to the greatest extent, this allows for the demand that camera module manufacturer needs constantly follow-up electronic equipment for camera module, constantly to taking the photograph
As module is improved, so as to need camera module manufacturer constantly to reopen mould, so as to cause the cost of camera module gradually to rise
It is high, it is difficult to adapt to fierce market competition further.
The content of the invention
In order to solve the above technical problems, the invention provides a kind of camera module and electronic equipment, the camera module are real
Show and adapted to purpose of the electronic equipment to the demand of different grades of camera module, improved the applicability of camera module, so as to
Reduce the development cost of camera module.
To realize above-mentioned technical purpose, the embodiments of the invention provide following technical scheme：
A kind of camera module, including：
Substrate；
Positioned at multiple different types of sensitive chips of the substrate surface, the photosensitive parameter of every kind of sensitive chip is not
Together；
Positioned at the supporting construction of the substrate surface, the supporting construction is around multiple sensitive chips；
The motor being equipped in the supporting construction；
The camera lens being equipped in the motor, the light of the camera lens convergence are projeced into multiple sensitive chip surfaces；
The process chip being connected with the multiple sensitive chip, for selecting a sensitive chip according to output order
Work, and receive the view data of the sensitive chip output of work.
Optionally, the output order is the mark of the sensitive chip.
Optionally, in addition to：The controller being connected with multiple sensitive chips；
The controller is used for after the output order is received, and the photosensitive core of work is determined according to the output order
Piece and the center that the sensitive chip of work is moved to the light projected area of the camera lens convergence.
Optionally, the substrate is turmeric substrate or plating gold base.
Optionally, in addition to：
Optical filter between the sensitive chip and the camera lens.
Optionally, the camera lens is plastic cement camera lens or glass lens.
Optionally, the sensitive chip is complementary metal oxide semiconductor sensor or charge coupled cell sensor.
A kind of electronic equipment, including：Electronic equipment described in any one as described above.
It can be seen from the above technical proposal that the embodiments of the invention provide a kind of camera module and electronic equipment, wherein,
The camera module has multiple different types of sensitive chips, is there is different photosensitive parameter requests to the camera module
When, the sensitive chip work of a target can be selected by way of sending output order to the process chip of the camera module
Make, to realize the purpose for the view data for receiving different types of sensitive chip output, electronic equipment pair is adapted to so as to meet
The demand of different grades of camera module, improves the applicability of the camera module, and then reduces the exploitation of camera module
Cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of structural representation for camera module that one embodiment of the application provides；
Fig. 2 is a kind of structural representation for camera module that another embodiment of the application provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
The embodiment of the present application provides a kind of camera module, as shown in figure 1, including：
Substrate 13；
Multiple different types of sensitive chips 12 positioned at the surface of substrate 13, every kind of sensitive chip 12 it is photosensitive
Parameter is different；
Supporting construction (not marked in accompanying drawing 1) positioned at the surface of substrate 13, the supporting construction is around multiple described
Sensitive chip 12；
The motor (not marked in accompanying drawing 1) being equipped in the supporting construction；
The camera lens 11 being equipped in the motor, the light that the camera lens 11 converges are projeced into multiple sensitive chips 12
Surface；
The process chip being connected with the multiple sensitive chip 12, for selecting a photosensitive core according to output order
Piece 12 works, and the view data that the sensitive chip 12 for receiving work exports.
It also show base 14 in Fig. 1, in Fig. 1 only by taking 3 sensitive chips as an example, in the other embodiment of the application,
Sensitive chip quantity positioned at the surface of substrate 13 can also be 2,4,5 etc..The application is not limited this, tool
Depending on stereoscopic actual conditions.
Found it should be noted that inventor studies, the update of present camera module is mainly reflected in camera module
The upgrading of the pixel size included in the view data of output；Such as upgrade to output from the camera module of 10M pixel of output
The camera module of 15M pixel or 20M pixel.Therefore we can be multiple different types of by being integrated in camera module
Sensitive chip 12, when needing which sensitive chip 12 to be operated, by sending output order to the process chip
Mode controls the chip operation so that the camera module goes for each class of electronic devices, without to whole shooting mould
Group is changed, and largely reduces the development cost of camera module.
The photosensitive parameter of the sensitive chip 12 includes but is not limited to the Pixel Dimensions (pixel size) of sensitive chip 12
And resolution ratio, there is the pixel included in the view data of its output of the sensitive chip 12 of different pixels size and resolution parameter
Number is different.
In addition, it should also be noted that, it can not be projected when the spot size of the light of the camera lens 11 convergence itself is smaller
, can be by increasing optical unit in camera module, so that the optical unit pair when all 12 surfaces of sensitive chip
Light is handled, and ensures that the light that the camera lens 11 converges can be projeced into all surfaces of sensitive chip 12.
Specifically, the optical unit can be single optical element, can also be the combination of multiple optical elements, specifically
Depending on its set location.
Specifically, the optical unit is level crossing, speculum, convex lens, concavees lens, spherical lens, prism and optical fiber
In one kind or any a variety of combination.
On the basis of above-described embodiment, in one embodiment of the application, the output order is the photosensitive core
The mark of piece 12, to allow the sensitive chip 12 to realize according to the mark determination of sensitive chip 12, the mark can
To be the photosensitive parameter of sensitive chip 12 or the factory number etc. of sensitive chip 12, as long as can be to the shooting mould
Sensitive chip 12 in group is made a distinction, and the application is not limited this, specifically depending on actual conditions.
On the basis of above-described embodiment, in another embodiment of the application, the camera module also includes：
The controller being connected with multiple sensitive chips 12；
The controller is used for after the output order is received, and the photosensitive core of work is determined according to the output order
Piece 12 and the center that the sensitive chip 12 of work is moved to the light projected area that the camera lens 11 converges.
In the present embodiment, the controller can determine the sensitive chip 12 of work according to the output order, then
The sensitive chip 12 is moved to the center for the light projected area that the camera lens 11 converges, to ensure that the sensitive chip 12 can
Receive complete scene information, it is ensured that the service behaviour of camera module.
Optionally, also include with reference to figure 2, the camera module：
Optical filter 15 between the sensitive chip 12 and the camera lens 11.
It should be noted that, although people's naked eyes None- identified infrared light, but the sensitive chip 12 can sense it is infrared
Light, and after the sensitive chip 12 senses infrared light, can produce that focal shift, colour cast are bad, influence the camera module
Imaging effect.Therefore in the present embodiment, optical filter 15 is fixed away from the side of substrate 13 in above-mentioned sensitive chip 12, with filtering
Infrared light, the sensitive chip 12 is avoided because sensing focal shift caused by infrared light and colour cast.
On the basis of above-described embodiment, in another specific embodiment of the application, the optical filter 15 is absorption
Formula optical filter 15.Traditional reflection optical filter 15 infrared light region reflectivity is higher, transmitance is relatively low.Therefore, when with
The array camera module of the standby reflection optical filter 15 in shooting photo angled with scenery infrared light described
Larger reflection, infrared light multiple reflections between the reflection optical filter 15 and the camera lens 11 are had on absorption optical filter 15
Halation phenomenon can be formed, influences the imaging effect of the camera module；And the absorption optical filter 15 has suction to infrared light
Adduction, when being equipped with the camera module of the absorption optical filter 15 in shooting photo angled with scenery, infrared light
By the absorption of the absorption optical filter 15, will not between the absorption optical filter 15 and the camera lens 11 multiple reflections shape
Into halation phenomenon, its imaging effect is better than the camera module for being equipped with the reflection optical filter 15.But the reflection optical filter
15 price will be much smaller than the absorption optical filter 15, therefore the reflection optical filter 15 is widely used in the shooting of low side
Module.The application is not limited the specific species of the optical filter 15, specifically depending on actual conditions.
Optionally, the camera lens 11 is plastic cement camera lens 11 or glass lens 11.
Optionally, the sensitive chip 12 is that complementary metal oxide semiconductor sensor or charge coupled cell sense
Device.
Optionally, the substrate 13 is turmeric substrate 13 or plating gold base 13.
It should be noted that for the turmeric substrate 13 plating gold base 13 thicker compared to coating, have cost low
The advantages of, thus using turmeric substrate 13 as the substrate 1313 of the camera module can reduce the camera module into
This.
Accordingly, the embodiment of the present application additionally provides a kind of electronic equipment, including taking the photograph as described in above-mentioned any embodiment
As module.
In summary, the embodiment of the present application provides a kind of camera module and electronic equipment, wherein, the camera module tool
There are multiple different types of sensitive chips, can be by institute when having different photosensitive parameter requests to the camera module
The mode for stating the process chip transmission output order of camera module selects the sensitive chip work of a target, is received not with realizing
The purpose of the view data of congener sensitive chip output, electronic equipment is adapted to different grades of shooting mould so as to meet
The demand of group, improves the applicability of the camera module, and then reduce the development cost of camera module.
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (8)
- A kind of 1. camera module, it is characterised in that including：Substrate；Positioned at multiple different types of sensitive chips of the substrate surface, the photosensitive parameter of every kind of sensitive chip is different；Positioned at the supporting construction of the substrate surface, the supporting construction is around multiple sensitive chips；The motor being equipped in the supporting construction；The camera lens being equipped in the motor, the light of the camera lens convergence are projeced into multiple sensitive chip surfaces；The process chip being connected with the multiple sensitive chip, for selecting a sensitive chip work according to output order Make, and receive the view data of the sensitive chip output of work.
- 2. camera module according to claim 1, it is characterised in that the output order is the mark of the sensitive chip Know.
- 3. camera module according to claim 1, it is characterised in that also include：It is connected with multiple sensitive chips Controller；The controller is used for after the output order is received, and the sensitive chip of work is determined simultaneously according to the output order The sensitive chip of work is moved to the center of the light projected area of the camera lens convergence.
- 4. camera module according to claim 1, it is characterised in that the substrate is turmeric substrate or plating gold base.
- 5. camera module according to claim 1, it is characterised in that also include：Optical filter between the sensitive chip and the camera lens.
- 6. camera module according to claim 1, it is characterised in that the camera lens is plastic cement camera lens or glass lens.
- 7. camera module according to claim 1, it is characterised in that the sensitive chip is that CMOS is partly led Body sensor or charge coupled cell sensor.
- 8. a kind of electronic equipment, it is characterised in that including：Electronic equipment as described in claim any one of 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710772665.8A CN107370931A (en) | 2017-08-31 | 2017-08-31 | A kind of camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710772665.8A CN107370931A (en) | 2017-08-31 | 2017-08-31 | A kind of camera module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107370931A true CN107370931A (en) | 2017-11-21 |
Family
ID=60311960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710772665.8A Pending CN107370931A (en) | 2017-08-31 | 2017-08-31 | A kind of camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107370931A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109218579A (en) * | 2018-08-23 | 2019-01-15 | 宁波金晟芯影像技术有限公司 | A kind of universal camera shooting mould group |
| WO2019114301A1 (en) * | 2017-12-11 | 2019-06-20 | 格力电器（武汉）有限公司 | Dual-camera module, and electronic apparatus |
| CN111263028A (en) * | 2018-11-30 | 2020-06-09 | 中芯集成电路（宁波）有限公司 | Camera shooting assembly and packaging method thereof, lens module and electronic equipment |
| CN111371978A (en) * | 2020-03-24 | 2020-07-03 | 合肥维信诺科技有限公司 | Display terminal |
| CN111953817A (en) * | 2019-05-16 | 2020-11-17 | Oppo广东移动通信有限公司 | Electronic device |
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| CN101060611A (en) * | 2007-05-09 | 2007-10-24 | 北京中星微电子有限公司 | A method and system for acquiring the video data |
| US20130010183A1 (en) * | 2011-07-08 | 2013-01-10 | Yen-Chao Chen | Sensing range selectable image sensor module |
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Cited By (5)
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|---|---|---|---|---|
| WO2019114301A1 (en) * | 2017-12-11 | 2019-06-20 | 格力电器（武汉）有限公司 | Dual-camera module, and electronic apparatus |
| CN109218579A (en) * | 2018-08-23 | 2019-01-15 | 宁波金晟芯影像技术有限公司 | A kind of universal camera shooting mould group |
| CN111263028A (en) * | 2018-11-30 | 2020-06-09 | 中芯集成电路（宁波）有限公司 | Camera shooting assembly and packaging method thereof, lens module and electronic equipment |
| CN111953817A (en) * | 2019-05-16 | 2020-11-17 | Oppo广东移动通信有限公司 | Electronic device |
| CN111371978A (en) * | 2020-03-24 | 2020-07-03 | 合肥维信诺科技有限公司 | Display terminal |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171121 |
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| RJ01 | Rejection of invention patent application after publication |