CN107351269A - A kind of solar silicon wafers cutting machine aids in routing device - Google Patents
A kind of solar silicon wafers cutting machine aids in routing device Download PDFInfo
- Publication number
- CN107351269A CN107351269A CN201710770040.8A CN201710770040A CN107351269A CN 107351269 A CN107351269 A CN 107351269A CN 201710770040 A CN201710770040 A CN 201710770040A CN 107351269 A CN107351269 A CN 107351269A
- Authority
- CN
- China
- Prior art keywords
- silicon wafers
- cutting machine
- solar silicon
- routing device
- action bars
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 235000012431 wafers Nutrition 0.000 title claims abstract description 22
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 4
- 239000010432 diamond Substances 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
Abstract
The invention discloses a kind of solar silicon wafers cutting machine to aid in routing device, it includes action bars, one end of the action bars is by can rotationally be provided with line wheel, and baffle plate is respectively and fixedly provided with the both sides of the line wheel by limiting component on the action bars, the wire casing for housing diamond wire is offered on the outer wheel face of the line wheel.Above-mentioned solar silicon wafers cutting machine auxiliary routing device is not only simple in structure, easy to operate；And sliding is good, it can be ensured that the cut quality of solar silicon wafers after cabling.
Description
Technical field
The invention belongs to solar silicon wafers process technology, is walked more particularly, to a kind of solar silicon wafers cutting machine auxiliary traditional thread binding
Put.
Background technology
Increasingly pay attention to as society utilizes to green regenerative energy sources, photovoltaic solar power field increasingly obtains fluffy
The exhibition of breaking out.In field of photovoltaic power generation, common crystal silicon solar energy battery is to need casting made of on high quality silicon chip
The big silicon ingot formed carries out retrofit and formed.
Solar silicon wafers cutting machine is the important cutting tool of solar silicon wafers.It is well known that cut in solar silicon wafers
During machine is use, it is often necessary to carry out bonding wire or stay piece cabling to operate, at present, existing bonding wire or stay piece cabling to grasp
All it is as aid using common wire-crossing wheel.In the presence of operation inconvenience, cabling sliding is low and cabling after influence the sun
The shortcomings that cut quality of energy silicon chip.
The content of the invention
It is an object of the invention to provide a kind of solar silicon wafers cutting machine to aid in routing device, to solve in the prior art
Existing above mentioned problem when saw blade cutting machine uses wire-crossing wheel cabling.
To use following technical scheme up to this purpose, the present invention：
A kind of solar silicon wafers cutting machine aids in routing device, and it includes action bars, and one end of the action bars passes through energy
Line wheel is rotationally provided with, and baffle plate is respectively and fixedly provided with the both sides of the line wheel by limiting component on the action bars, it is described
The wire casing for housing diamond wire is offered on the outer wheel face of line wheel.
Especially, bearing is installed between the action bars and the line wheel.
Especially, the limiting component includes being opened in the stage portion of the action bars, and positioned at inner end, baffle plate passes through described
Stage portion progress is spacing, and the baffle plate positioned at outer end is fixed by locking member.
Especially, the locking member includes the external thread section for being opened in the operation boom end, and locking nut is assemblied in
The external thread section fixes the baffle plate positioned at outer end.
Especially, the locking member includes the neck for being opened in the operation boom end, and installation is limited in the neck
Position circle, is fixed the baffle plate positioned at outer end by spacing collar.
Beneficial effects of the present invention are that the solar silicon wafers cutting machine aids in routing device not only compared with prior art
It is simple in construction, it is easy to operate；And sliding is good, it can be ensured that the cut quality of solar silicon wafers after cabling.
Brief description of the drawings
Fig. 1 is the structural representation for the solar silicon wafers cutting machine auxiliary routing device that the specific embodiment of the invention 1 provides
Figure.
In figure：
1st, action bars；2nd, bearing；3rd, line wheel；4th, wire casing；5th, baffle plate；6th, stage portion；7th, external thread section；8th, locking nut.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Refer to shown in Fig. 1, Fig. 1 is the solar silicon wafers cutting machine auxiliary cabling that the specific embodiment of the invention 1 provides
The structural representation of device.
In the present embodiment, a kind of solar silicon wafers cutting machine auxiliary routing device includes action bars 1 made of metal, described
One end of action bars 1 can rotationally be provided with line wheel 3 by bearing 2, be offered on the outer wheel face of the line wheel 3 for accommodating gold
The wire casing 4 of firm line, and baffle plate 5, the line are respectively and fixedly provided with the both sides of the line wheel 3 by limiting component on the action bars 1
Wheel 3 and baffle plate 5 adopt it is made of plastic, and the radius of the baffle plate 5 be more than the line wheel 3 radius.
The limiting component includes being opened in the stage portion 6 of the action bars 1, passes through the step positioned at inner end baffle plate 5
Portion 6 carries out spacing, and the baffle plate 5 positioned at outer end is fixed by locking member.The locking member includes being opened in the action bars 1
The external thread section 7 of end, locking nut 8 are assemblied in the external thread section 7 and fix the baffle plate 5 positioned at outer end.Certain lock
Tight part can also use spacing collar, only need to open up neck on action bars 1.
Bonding wire or when staying piece cabling, diamond wire is wound in line wheel 3, then hand-held bar 1 is operated.
Above example is to elaborate the general principle and characteristic of the present invention, and the present invention is not limited by above-mentioned example,
Without departing from the spirit and scope, the present invention also has various change and change, and these changes and modifications are both fallen within
In scope of the claimed invention.The scope of the present invention is defined by the appended claims and its equivalents.
Claims (5)
1. a kind of solar silicon wafers cutting machine aids in routing device, it is characterised in that it includes action bars, and the one of the action bars
End is respectively and fixedly provided with gear by limiting component on the action bars by can rotationally be provided with line wheel in the both sides of the line wheel
Plate, the wire casing for housing diamond wire is offered on the outer wheel face of the line wheel.
2. solar silicon wafers cutting machine according to claim 1 aids in routing device, it is characterised in that the action bars with
Bearing is installed between the line wheel.
3. solar silicon wafers cutting machine according to claim 1 aids in routing device, it is characterised in that the limiting component
Stage portion including being opened in the action bars, spacing, the gear positioned at outer end is carried out by the stage portion positioned at inner end baffle plate
Plate is fixed by locking member.
4. solar silicon wafers cutting machine according to claim 3 aids in routing device, it is characterised in that the locking member
External thread section including being opened in the operation boom end, locking nut are assemblied in the external thread section by positioned at the baffle plate of outer end
It is fixed.
5. solar silicon wafers cutting machine according to claim 3 aids in routing device, it is characterised in that the locking member
Including being opened in the neck for operating boom end, spacing collar is installed in the neck, by spacing collar by positioned at outer end
Baffle plate is fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710770040.8A CN107351269A (en) | 2017-08-31 | 2017-08-31 | A kind of solar silicon wafers cutting machine aids in routing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710770040.8A CN107351269A (en) | 2017-08-31 | 2017-08-31 | A kind of solar silicon wafers cutting machine aids in routing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107351269A true CN107351269A (en) | 2017-11-17 |
Family
ID=60289514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710770040.8A Pending CN107351269A (en) | 2017-08-31 | 2017-08-31 | A kind of solar silicon wafers cutting machine aids in routing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107351269A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999549A (en) * | 2017-12-29 | 2018-05-08 | 无锡常欣科技股份有限公司 | Wheel structure of wire |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201728758U (en) * | 2010-07-06 | 2011-02-02 | 绍兴县精功机电研究所有限公司 | Pulley gear of multi-wire cutting machine |
| CN102312298A (en) * | 2011-05-15 | 2012-01-11 | 无锡平盛科技有限公司 | Line guide wheel device of wire drawing machine |
| CN102615731A (en) * | 2012-04-14 | 2012-08-01 | 无锡市协清机械制造有限公司 | Guide wheel device on numerical control multi-wire swinging cutting machine |
| CN203141675U (en) * | 2013-03-26 | 2013-08-21 | 西安隆基硅材料股份有限公司 | Guiding wheel used for silicon slice cutting |
| CN203805158U (en) * | 2014-04-11 | 2014-09-03 | 扬州协鑫光伏科技有限公司 | Wire distribution net wire routing device of silicon wafer multi-wire sawing machine |
| CN204087920U (en) * | 2014-07-18 | 2015-01-07 | 焦作市森格高新材料有限责任公司 | A kind of ultra tiny enamelled wire changes group the Line tool of dish online |
| CN204414390U (en) * | 2014-12-22 | 2015-06-24 | 杭州慧翔电液技术开发有限公司 | A kind of guide roller for diamond cutting line slicing machine |
| CN106493629A (en) * | 2016-11-14 | 2017-03-15 | 陈红玲 | The replaceable guide wheel assembly of abrasive wire sawing equipment |
| CN207240536U (en) * | 2017-08-31 | 2018-04-17 | 高佳太阳能股份有限公司 | A kind of solar silicon wafers cutting machine aids in routing device |
-
2017
- 2017-08-31 CN CN201710770040.8A patent/CN107351269A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201728758U (en) * | 2010-07-06 | 2011-02-02 | 绍兴县精功机电研究所有限公司 | Pulley gear of multi-wire cutting machine |
| CN102312298A (en) * | 2011-05-15 | 2012-01-11 | 无锡平盛科技有限公司 | Line guide wheel device of wire drawing machine |
| CN102615731A (en) * | 2012-04-14 | 2012-08-01 | 无锡市协清机械制造有限公司 | Guide wheel device on numerical control multi-wire swinging cutting machine |
| CN203141675U (en) * | 2013-03-26 | 2013-08-21 | 西安隆基硅材料股份有限公司 | Guiding wheel used for silicon slice cutting |
| CN203805158U (en) * | 2014-04-11 | 2014-09-03 | 扬州协鑫光伏科技有限公司 | Wire distribution net wire routing device of silicon wafer multi-wire sawing machine |
| CN204087920U (en) * | 2014-07-18 | 2015-01-07 | 焦作市森格高新材料有限责任公司 | A kind of ultra tiny enamelled wire changes group the Line tool of dish online |
| CN204414390U (en) * | 2014-12-22 | 2015-06-24 | 杭州慧翔电液技术开发有限公司 | A kind of guide roller for diamond cutting line slicing machine |
| CN106493629A (en) * | 2016-11-14 | 2017-03-15 | 陈红玲 | The replaceable guide wheel assembly of abrasive wire sawing equipment |
| CN207240536U (en) * | 2017-08-31 | 2018-04-17 | 高佳太阳能股份有限公司 | A kind of solar silicon wafers cutting machine aids in routing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999549A (en) * | 2017-12-29 | 2018-05-08 | 无锡常欣科技股份有限公司 | Wheel structure of wire |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171117 |