CN107340072A - Temperature patch and system for detecting temperature - Google Patents
Temperature patch and system for detecting temperature Download PDFInfo
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- CN107340072A CN107340072A CN201710534853.7A CN201710534853A CN107340072A CN 107340072 A CN107340072 A CN 107340072A CN 201710534853 A CN201710534853 A CN 201710534853A CN 107340072 A CN107340072 A CN 107340072A
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- 230000005540 biological transmission Effects 0.000 description 10
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- 238000009529 body temperature measurement Methods 0.000 description 9
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0002—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network
- A61B5/0004—Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network characterised by the type of physiological signal transmitted
- A61B5/0008—Temperature signals
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/20—Clinical contact thermometers for use with humans or animals
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Medical Informatics (AREA)
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- Computer Networks & Wireless Communication (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
The embodiment of the present application provides a kind of temperature patch, including substrate；Aerial coil, the aerial coil directly with the substrate contact；Chip, the chip are electrically connected with the aerial coil；Heat sensitive component, it is electrically connected with the chip；The heat sensitive component is used to detect dut temperature in real time, and real-time tele-communication number corresponding to determining the dut temperature that detects in real time, and the real-time tele-communication number is sent into the chip；The chip is used to the real-time tele-communication number being converted into data signal, and dut temperature corresponding to the data signal is sent into aerial coil.The technical scheme that the embodiment of the present application provides can complete contactless temperature detection, and simple in construction, cost is small, can substitute mercury clinical thermometer and carry out measurement of bldy temperature, avoid mercury pollution.The temperature patch that the application provides is also applied in the application scenarios of for example discontinuous thermometric, single thermometric, can avoid cross-infection.
Description
Technical field
The invention relates to field of medical article technology, more particularly to a kind of temperature patch and system for detecting temperature.
Background technology
The conventional method of measurement of bldy temperature has oral cavity mensuration, oxter mensuration etc. at present.Thermometer for oral cavity measurement
Oral thermometer is, the thermometer for oxter measurement is armpit table.But oral thermometer and armpit table are usually mercurial thermometer, and time of measuring is longer,
The medical personnel basis work amount of doing is big, can only obtain discrete data, easily causes mercury clinical thermometer in measurement and operating process
It is broken, damaged to personnel, cause mercury pollution.
On October 10th, 2013, " diplomatic conference of mercury treaty " sponsored by United Nations Environment Programme is in Kumamoto, Japan city table
Certainly pass through and be intended to control and reduce global mercury emissions《Minamata pact on mercury》.According to the agreement of Minamata pact, China
The production and import of aqueous silver products will be completely forbidden by being risen in the year two thousand twenty, that is to say, that the latest will be complete to the year two thousand twenty mercury clinical thermometer
Portion faces stopping production.
At the same time, required according to the management of current national infection control, in order to which the cross-infection reduced between patient is asked
Topic, avoids the reuse with patient contacting portions, therefore the mercury clinical thermometer of original reuse also encounters in clinic as far as possible
Very big challenge, therefore, the thermometric product of cross-infection and mercury pollution can be avoided to substitute mercury body temperature there is an urgent need to a kind of
Meter.
The content of the invention
The embodiment of the present application provides a kind of temperature patch and system for detecting temperature, can substitute mercury clinical thermometer and carry out body temperature
Measurement, can avoid cross-infection and mercury pollution.
In a first aspect, the embodiment of the present application provides a kind of temperature patch, including：
Substrate；
Aerial coil, the aerial coil directly with the substrate contact；
Chip, the chip are electrically connected with the aerial coil；
Heat sensitive component, it is electrically connected with the chip；
The heat sensitive component is used to detect dut temperature in real time, and determines real corresponding to the dut temperature that detects in real time
When electric signal, the real-time tele-communication number is sent to the chip；The chip is used to the real-time tele-communication number being converted into number
Word signal, and dut temperature corresponding to the data signal is sent to aerial coil.
Second aspect, the embodiment of the present application provide a kind of system for detecting temperature, including temperature patch and are pasted with the temperature
The temperature receptacle of piece connection, the temperature patch include：
Substrate；
Aerial coil, the aerial coil directly with the substrate contact；
Chip, the chip are electrically connected with the aerial coil；
Heat sensitive component, it is electrically connected with the chip；
The heat sensitive component is used to detect dut temperature in real time, and determines real corresponding to the dut temperature that detects in real time
When electric signal, the real-time tele-communication number is sent to the chip；The chip is used to the real-time tele-communication number being converted into number
Word signal, and dut temperature corresponding to the data signal is sent to aerial coil；
The temperature receptacle is used for the data signal that receiving antenna coil is sent.
The technical scheme that the embodiment of the present application provides can complete contactless temperature detection, and simple in construction, cost is small,
Mercury clinical thermometer can be substituted and carry out measurement of bldy temperature, avoid mercury pollution.The temperature patch that the application provides is also applied to example
In such as application scenarios of discontinuous thermometric, single thermometric, cross-infection can be avoided.Compare for mercury clinical thermometer, be free of
Mercury material, while soft texture, it is pleasant during wearing.Compare the bluetooth clinical thermometer occurred in recent years and nearly hundreds of
The cost of member, the temperature patch cost that the embodiment of the present application provides are cheap, it is only necessary to several first can manufactures of several members even zero point
Complete, be very suitable for disposable, so as to effectively being used in hospital, reach the purpose of effectively infection control.
Brief description of the drawings
, below will be to embodiment or existing in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are this Shens
Some embodiments please, for those of ordinary skill in the art, on the premise of not paying creative work, can be with root
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the schematic top plan view for the temperature patch that some embodiments of the application provide；
Fig. 2 is the schematic diagram based on some embodiment A faces shown in Fig. 1；
Fig. 3 is the circuit structure diagram for the temperature patch that some embodiments of the application provide；
Fig. 4 is the temperature of thermistor and the electrical characteristic curve synoptic diagram of resistance value in some embodiments of the application；
Fig. 5 A are the circuit structure diagram for the AD conversion unit that some embodiments of the application provide；
Fig. 5 B are the change curve of the electric capacity C shown in Fig. 5 A；
Fig. 6 is the side schematic view for the temperature patch that some embodiments of the application provide；
The side schematic view of Fig. 7 temperature patch that some other embodiments provide for the application；
Fig. 8 is the side schematic view of the application temperature patch that some embodiments provide in addition；
Fig. 9 is the schematic diagram for the system for detecting temperature that some embodiments of the application provide.
Label declaration：
101- chips；
102- conductive connectings；
103- aerial coils；
104- substrates, 1041- substrate surfaces, 1042- substrate floors；
105- heat sensitive components；
106- insulating layers；
107- protective layers.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In accompanying drawing, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described embodiment is
Some embodiments of the present application, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art
The every other embodiment obtained under the premise of creative work is not made, belong to the scope of the application protection.
Fig. 1 and Fig. 2 is referred to, shows the temperature patch that some embodiments of the application provide, including：Substrate 104, antenna
Coil 103, chip 101, heat sensitive component 105.The aerial coil directly with the substrate contact, optionally, aerial coil
103 are printed or are welded on substrate surface 1041.The chip 101 is electrically connected with the aerial coil 103, optionally,
Chip 101 is connected by conductive connecting 102 with aerial coil 103, in a certain optional embodiment, conductive connecting 102
It is metal contact wires such as copper connecting line, aluminum connecting line, optionally, metal contact wires 102 can be provided with solder joint, chip
101 are welded on solder joint.Wherein, substrate can be flexible material, can specifically be but not limited to PVC material, polyimides
Or PET (PET), because flexible material has softness, it may be such that human body skin and the wireless temperature paster
Fitting tightness degree it is more preferable, it is difficult for drop-off to reduce the extruding stress to temperature patch, temperature patch during human action.
Heat sensitive component 105 is electrically connected with the chip 101, and optionally, heat sensitive component can be the members such as thermistor, thermocouple
Device, it is specifically as follows the thermistor with wire, the thermistor is electrically connected by wire with conductive connecting.
In some other optional embodiments, the forming process of temperature patch is as follows：Substrate 104 is a kind of flexible base
Material, adhere to layer of metal material thereon as conductor, be generally copper sheet layer.102 and 103 be one whole under reset condition
Body, it is the metal material being attached on substrate.According to the design needs of circuit, such as the circuit structure diagram shown in Fig. 1, lead to
Over etching etches away the place for not needing copper cash, so as to form the pattern that circuit structure needs in Fig. 1, then in centre position
Reserve and carry out four pads, circuit chip 101 is welded on metal layer by way of welding, finally by heat sensitive component
105 are fixed on and are etched away by copper sheet on the position for exposing substrate 104, and the wire of heat sensitive component 105 is welded on and is conductively connected
Above the pad in the left side of line 102, so as to which heat sensitive component is connected to above circuit chip 101.When external receiver is close
When whole temperature patch, the Temperature numerical of measurement can be received.
The heat sensitive component 105 is used to detect dut temperature in real time, and the dut temperature for determining to detect in real time corresponds to
Real-time tele-communication number, the real-time tele-communication number is sent to the chip 101.The chip 101 is used for the real-time tele-communication
Number data signal is converted into, and dut temperature corresponding to the data signal is sent to aerial coil 103.
It should be appreciated that in the embodiment of the present application, dut temperature can be detected human body temperature or
Detected object temperature.
The operation principle of the embodiment of the present application is：The substrate of temperature patch is attached to the detected department of human body or object,
Heat sensitive component 105 detects dut temperature in real time.Heat sensitive component 105 is determined corresponding to the dut temperature that detects in real time in real time
Electric signal, the real-time tele-communication number is sent to chip 101.The real-time tele-communication number is converted into data signal by chip 101, and
Dut temperature corresponding to the data signal is sent to aerial coil 103.When aerial coil 103 receives external receiver hair
During the radiofrequency signal penetrated, antenna of the aerial coil 103 as chip 101, the data signal is transmitted.Specifically, work as antenna line
Circle 103 produces electric current when receiving the radiofrequency signal of external receiver transmitting be that chip 101 provides power supply, the temperature of chip 101
The temperature signal monitored is converted into electric signal and sends temperature measurement circuit to by sensor, and temperature measurement circuit converts electrical signals to data
Signal sends aerial coil 103 to, and the data signal received is sent to external receiver by aerial coil 103.Optionally,
Aerial coil 103 establishes data transmission channel with external receiver using near field communication protocols or non-contact radio-frequency identification.
The temperature patch that the embodiment of the present application provides can complete contactless temperature detection, and simple in construction, cost is small,
Mercury clinical thermometer can be substituted and carry out measurement of bldy temperature, avoid mercury pollution.The temperature patch that the embodiment of the present application provides can also answer
In the application scenarios for using for example discontinuous thermometric, single thermometric, cross-infection can be avoided.It should be appreciated that the application
The temperature patch that embodiment provides is also applied in the application scenarios of continuous temperature measurement, is repeated and is utilized, and is reduced and is wasted.Compare
For mercury clinical thermometer, not mercurous material, while soft texture, it is pleasant during wearing.Compare in recent years and occur
Bluetooth clinical thermometer and nearly hundreds of yuan of cost, the embodiment of the present application provide temperature patch cost it is cheap, it is only necessary to several members
Even several first cans manufactures of zero point are completed, and are very suitable for disposable, and so as to effectively be used in hospital, reaching has
The purpose of effect ground infection control.
Optionally, the chip includes central control unit and the modulus being electrically connected with the central control unit
Conversion unit, radio frequency unit, the analog-to-digital conversion unit are electrically connected with heat sensitive component, the radio frequency unit and aerial coil
It is electrically connected with；The analog-to-digital conversion unit is used to the real-time tele-communication number received being converted into data signal, the center control
Unit is used to determine dut temperature value corresponding to the data signal, and the dut temperature value in real time is passed by radio frequency unit
Deliver to aerial coil.Herein, central control unit can determine data signal according to the electrical characteristic curve of heat sensitive component
Corresponding dut temperature value, electrical characteristic curve can include dut temperature and the corresponding relation of data signal, can also include
The corresponding relation of the resistance of heat sensitive component, data signal and dut temperature, voltage, the numeral of heat sensitive component can also be included
The corresponding relation of signal and dut temperature.
Optionally, it is necessary to carry out temperature correction for detection has the heat sensitive component of error.The chip also includes
Memory cell, the memory cell are used for the electrical characteristic curve for storing the heat sensitive component, the electrical characteristic curve bag
Include for representing the reference dut temperature of heat sensitive component and the corresponding relation of reference digital signal, the analog-to-digital conversion unit is used
In the real-time tele-communication number received is converted into data signal, the central control unit is used to deposit according in the memory cell
The electrical characteristic curve of storage determines dut temperature value corresponding to the data signal, and the dut temperature value in real time is passed through
Radio frequency unit is sent to aerial coil.
Referring to Fig. 3, show the circuit structure diagram of some embodiment temperature patch of the application, this place heat sensitive component with
Exemplified by thermistor, because thermistor is resistance output, required on circuit, as long as circuit completes the accurate measurement of resistance
With wireless output can, circuit structure is relatively easy, and the volume of chip can also reduce, the cost and temperature patch of chip
Cost can reduce.Circuit shown in Fig. 3 includes thermistor TR, chip circuit and aerial coil ANTENA, chip circuit
Including analog-to-digital conversion unit ADC, central control unit LOGIC, memory cell EEPROM, wherein radio frequency unit RF, thermistor
TR is electrically connected with analog-to-digital conversion unit, and radio frequency unit RF is connected with aerial coil ANTENA.Optionally, chip circuit also includes
Antenna power unit R F-VCC and PMU Power Management.
The operation principle of circuit shown in Fig. 3 is specially：Radio frequency unit RF receiving antenna coils ANTENA energy, by energy
Antenna power unit R F-VCC is connected to, generating a power supply by antenna power unit R F-VCC exports, PMU
Power Managerment receive the output of this power supply, respectively to analog-to-digital conversion unit ADC, central control unit LOGIC and storage
Tri- program module power supplies of unit EEPROM.At the same time, radio frequency unit RF also has PA (Power Amplifer power amplifications
Device) and the circuit such as LNA (Low Noise Amplifer low noise operational amplifiers), the circuit such as PA and LINA is according to agreement by day
The valid data that line loop A NTENA is received extract, and give valid data to central control unit LOGIC, are controlled by center
Unit LOGIC is decoded into specified order according to valid data, and operation is written and read to memory cell EEPROM according to specified order.
While central control unit LOGIC receives specified order, analog-to-digital conversion unit ADC can be also controlled to proceed by adopting for data
Collection, is converted into data signal by the thermistor TP electric signals exported, then gives data signal to central control unit
LOGIC, by central control unit LOGIC storages into memory cell EEPROM.Central control unit LOGIC receives digital letter
Number when, radio frequency unit RF can be also controlled, by digital signal communication agreement by transmitting wirelessly away.
Specifically, the electrical characteristic curve of the memory cell EEPROM storage thermistors TR, optionally, electrical characteristic
Curve includes the corresponding relation for being used for the reference dut temperature and reference digital signal for representing heat sensitive component, and the corresponding relation can
With the reference dut temperature and the classification corresponding relation of reference digital signal to be determined according to the detection error of heat sensitive component；Mould
The real-time tele-communication number received is converted into data signal by number conversion unit ADC；Central control unit LOGIC is according to memory cell
The electrical characteristic curve stored on EEPROM determines dut temperature value corresponding to the data signal, and optionally, center control is single
First LOGIC determines according to the classification corresponding relation of the reference dut temperature and reference digital signal stored on memory cell EEPROM
Real time digital signal corresponding to the dut temperature detected in real time, and the real time digital signal is transmitted by radio frequency unit RF
To aerial coil ANTENA.Fig. 4 is that the temperature of thermistor and resistance value electrical characteristic curve show in some embodiments of the application
It is intended to；As shown in figure 4, thermistor is specifically by taking negative tempperature coefficient thermistor as an example, and when temperature raises, thermistor
Resistance taper into, lookup calculating is carried out on Fig. 4 curve, obtains temperature value corresponding to the resistance value, so as to
To accurate body temperature.
In the actual production process of thermistor, the influence of technique, the temperature-sensitive that same batch is produced are subject to processing
The resistance value of resistance and the homologous thread deviation of temperature are bigger.By taking 37 DEG C of 30K@thermistor as an example, when temperature becomes
When changing 0.1 DEG C, the resistance of thermistor should change 100 ohm, i.e. according to 0.1 DEG C of required precision, the heat under same batch
Quick resistance, at the same temperature, each resistance value should be ensured that between 29.9K and 30.1K.However, added due to common
The limitation of work technique, between it can even reach 29K-31K with the resistance of a batch of thermistor, each output, therefore
Cause to meet required precision only accounts for small proportion therein, so as to cause that ratio is selected from high-volume thermistor
The less a part of qualified products of example, otherwise the heat of high-precision requirement will be met to produce using the higher production technology of cost
Quick resistance, thereby increase the cost of single qualified thermistor.
Therefore, in some embodiments of the application, do not increasing cost or be realized with a low cost as far as possible, to same batch
Thermistor of the resistance of production between 29K-31K carries out screening grade, according to the output of thermistor at 37 DEG C per 0.1K
For grade separation, according to 29K-29.1K, 29.1K-29.2K, by that analogy, until 30.9K-31K, will be with a batch of temperature-sensitive
Resistance is divided into 20 grades.The deviation of the thermistor in each grade in that this 20 grade is relative to central value
No more than 0.05 DEG C (corresponding 50 ohm).Specifically, in some embodiments of the application, the center resistance value of each grade is deposited
Storage in the memory unit, is modified and calibrated so as to combine the actual resistance of the thermistor, so as to obtain accurate temperature
Angle value, along these lines, the precision of thermistor was both improved, and reduced the loss of thermistor again, reduce temperature
The production cost of paster.
The embodiment of the present application avoids thermistor in the prior art because matching is missed caused by the difference of electric parameter
The problem of difference and manufacturing cost are higher, realize and improve the accurate match of different heat sensitive components from each other, while and can drops
The effect of the production cost of low temperature paster.
Optionally, Fig. 5 A are referred to, show the circuit structure diagram of some embodiment analog-to-digital conversion units of the application, it is described
The circuit of analog-to-digital conversion unit includes measuring resistance standard, electric capacity C, comparator, logic circuit and door, counter
Counter, clock source CLK, wherein, measuring resistance standard is a high-precision measuring resistance, optionally, measuring resistance
Standard is the measuring resistance that precision is not less than 0.5%.One end of the counter Counter connects with central control unit
Connect, the other end is connected with the output end of logic circuit and door.One input of the logic circuit and door connects with clock source CLK
Connect, the output end connection of another input and comparator of logic circuit and door.The positive input terminal of the comparator and the first ginseng
Voltage Vref1 connections are examined, the negative input end of comparator is connected by first switch with thermistor TR, the negative input end of comparator
Also it is connected by second switch with measuring resistance standard one end.The measuring resistance standard other ends and the second reference
Voltage Vref2 connections, the tie point of the negative input end and first switch or second switch of described electric capacity C one end and comparator connect
Connect, other end ground connection.
The operation principle of circuit is specially shown in Fig. 5 A：It is (digitized herein that analog-to-digital conversion unit ADC starts digitlization
Mean the process for converting electrical signals to data signal) when, the electric charge on electric capacity C is bled off, will be with measuring resistance
The second switch closure of standard connections, the first switch being connected with thermistor TR is opened, then the second reference voltage
VREF2 charges to reinforced concrete structure, and the now output of comparator is high level.As the voltage on electric capacity starts to raise, work as electricity
When charging voltage in appearance increases above VREF1, comparator exports a low level.At the same time, when comparator exports height
During level, logic circuit and inputs of the gate control clock source CLK as counter Counter, by counter Counter to clock
Source CLK is counted, and when comparator output is low level, logic circuit stops counting with gate control counter Counter
Number, the output valve for writing down counter Counter is CNTVREF.With same operation principle, open and measuring resistance standard
The second switch of connection, the first switch being connected with thermistor TR is closed, thermistor TR is connected on electric capacity, recorded
The numerical value of counter when comparator stops counting is CNT, then obtains the resistance value of thermistor, i.e. TR=Rstd*
CNT/CNTVREF。
Fig. 5 B are the change curve above the electric capacity C shown in Fig. 5 A, because the difference of resistance value, measuring resistance and heat
Ascending curve caused by the resistance difference of quick resistance and heating-up time are inevitable different.Fixed in the clock frequency of clock source output
In the case of, t1 and t2 difference will result directly in the difference of the count value of counter output, be finally completed the number of resistance measurement
Word process.
In some embodiments of above-described embodiment, the length of the conductive connecting 102 is not shorter than preset length, described
Preset length can specifically be set as needed.Optionally, the preset length is 1cm.Carried out when temperature patch is used for oxter
During temperature detection, conductive connecting 102 not less than 1cm is designed to make heat sensitive component 105 to be placed on below armpit to examine
Testing temperature and chip 101 and aerial coil 103 are placed on outside arm, and aerial coil 103 will not be by arm when transmitting data
Block, improve the efficiency of transmission and transmission range of aerial coil 103.
When the temperature patch provided using some embodiments of the application is used for carrying out armpit temperature measurement, heat sensitive component
105 one side presses close to tested position.Because the material of substrate 104 is generally very thin, about 0.2mm is thick, heat sensitive component 105
The heat when (press close to tested position while) detection human body, in addition one side (away from be tested position while) pass through substrate
104 are radiating, then and when arm is opened, test, which obtains human body armpit temperature, can be less than actual armpit temperature value, so measure
Temperature is inaccurate.Therefore in some embodiments of above-described embodiment, applicant has made further improvement, referring to Fig. 6, this
Apply for that the temperature patch that embodiment provides also includes being used for the insulating layer 106 for reducing radiating, optionally, in substrate floor 1042
One layer of insulating layer 106 for being used to reduce radiating is placed, now substrate surface 1042 presses close to tested position.The insulating layer 106 can be with
For flexible material, the flexible material can be, but not limited to as PVC material, polyimides or PET
Or foam (PET).It should be appreciated that when substrate floor 1042 presses close to tested position, the insulating layer 106 is located at substrate top
Face 1041.
In some embodiments of above-described embodiment, set in the substrate described in the position setting of heat sensitive component 105
Insulating layer.Optionally, the area of the insulating layer 106 can cover the heat sensitive component 105, the i.e. area of insulating layer 106
More than the area of heat sensitive component 105.Radiating can be so reduced to greatest extent.Optionally, the area of insulating layer 106 is not small
In 25*50mm2, it is specifically as follows 25*50mm2.Optionally, the thickness of insulating layer is 1.0mm-3.0mm, is specifically as follows
1.6mm.By many experiments, it can ensure that test temperature and actual temperature deviation reduce using above-mentioned insulating layer, it is upper when utilizing
It can ensure within 0.2 DEG C of test temperature and actual temperature deviation during the insulating layer for stating thickness and area, otherwise, temperature is inclined
Difference can arrive 0.5-2 DEG C, basically can not react the real body temperature of human body.There are insulating layer, the temperature without insulating layer measurement to test number
According to as shown in the table.
It should be appreciated that the meaning of insulating layer thickness is that thickness is thicker, test temperature value is more possibly close to reality
Border body temperature, therefore, in the optional scope of insulating layer thickness, according to different wearing demands or testing requirement set it is different every
Warm thickness degree.
Referring to Fig. 7, in some embodiments of above-described embodiment, temperature patch also includes protective layer 107, can be located at substrate
Top surface 1041 or substrate floor 1042, optionally, protective layer 107 directly contacts with aerial coil 103, and is coated to and is pressed in substrate top
Face 1041.Wherein, protective layer 107, which has, can make the through hole that chip 101 passes through, and substrate surface is pressed in when protective layer 107 is coated
After 1041, chip 101 exposes from the through hole, optionally, shape of through holes and the shape adaptation of chip 101.Using the application
When the temperature patch that embodiment provides carries out thermometric, protective layer 107 can prevent aerial coil to be worn away.
Referring to Fig. 8, in some embodiments of above-described embodiment, temperature patch includes insulating layer 106 and protective layer
107.The technique effect and other parameter settings of insulating layer 106 and protective layer 107 see above, will not be repeated here.
Referring to Fig. 9, some embodiments of the application provide a kind of system for detecting temperature, including temperature receptacle 20 and temperature
Paster, the temperature receptacle 20 are used for the data signal that receiving antenna coil is sent.Optionally, the temperature receptacle 20 wraps
Radio circuit 201, digital processing element 202 and display unit 203 are included, the digital processing element 202 is used to control radio frequency electrical
Electromagnetic wave is launched on road 201, and the radio circuit 201 is used for the data signal of receiving antenna coil transmission, the digital processing list
Member 202 be additionally operable to receive radio circuit 201 transmission data-signal after control display unit 203 show corresponding to data and
Information.
With reference to Fig. 1 to Fig. 8, the temperature patch includes：Substrate 104, aerial coil 103, chip 101, heat sensitive component
105.The aerial coil is directly with the substrate contact, and optionally, aerial coil 103 is printed or is welded on substrate surface
1041.The chip 101 is electrically connected with the aerial coil 103, and optionally, chip 101 passes through conductive connecting 102 and day
Line coil 103 connects, and in a certain optional embodiment, conductive connecting 102 is metal contact wires such as copper connecting line, aluminium
Connecting line processed etc., optionally, metal contact wires 102 can be provided with solder joint, and chip 101 is welded on solder joint.Wherein, substrate can
Think flexible material, can specifically be but not limited to PVC material, polyimides or PET (PET), due to
Flexible material has softness, may be such that human body skin and the wireless temperature paster to be bonded tightness degree more preferable, reduce human body
Extruding stress in action process to temperature patch, temperature patch are difficult for drop-off.Heat sensitive component 105 and the electricity of chip 101
Property connection, optionally, heat sensitive component can be the components such as thermistor, thermocouple, be specifically as follows the heat with wire
Quick resistance, the thermistor are electrically connected by wire with conductive connecting.
In some other optional embodiments, the forming process of temperature patch is as follows：Substrate 104 is a kind of flexible base
Material, adhere to layer of metal material thereon as conductor, be generally copper sheet layer.102 and 103 be one whole under reset condition
Body, it is the metal material being attached on substrate.According to the design needs of circuit, such as the circuit structure diagram shown in Fig. 1, lead to
Over etching etches away the place for not needing copper cash, so as to form the pattern that circuit structure needs in Fig. 1, then in centre position
Reserve and carry out four pads, circuit chip 101 is welded on metal layer by way of welding, finally by heat sensitive component
105 are fixed on and are etched away by copper sheet on the position for exposing substrate 104, and the wire of heat sensitive component 105 is welded on and is conductively connected
Above the pad in the left side of line 102, so as to which heat sensitive component is connected to above circuit chip 101.When external receiver is close
When whole temperature patch, the Temperature numerical of measurement can be received.
The heat sensitive component 105 is used to detect dut temperature in real time, and the dut temperature for determining to detect in real time corresponds to
Real-time tele-communication number, the real-time tele-communication number is sent to the chip 101.The chip 101 is used for the real-time tele-communication
Number data signal is converted into, and dut temperature corresponding to the data signal is sent to aerial coil 103.
It should be appreciated that in the embodiment of the present application, dut temperature can be detected human body temperature or
Detected object temperature.
The operation principle of the embodiment of the present application is：The substrate of temperature patch is attached to the detected department of human body or object,
Heat sensitive component 105 detects dut temperature in real time.Heat sensitive component 105 is determined corresponding to the dut temperature that detects in real time in real time
Electric signal, the real-time tele-communication number is sent to chip 101.The real-time tele-communication number is converted into data signal by chip 101, and
Dut temperature corresponding to the data signal is sent to aerial coil 103.When aerial coil 103 receives external receiver hair
During the radiofrequency signal penetrated, antenna of the aerial coil 103 as chip 101, the data signal is transmitted.Specifically, work as antenna line
Circle 103 produces electric current when receiving the radiofrequency signal of external receiver transmitting be that chip 101 provides power supply, the temperature of chip 101
The temperature signal monitored is converted into electric signal and sends temperature measurement circuit to by sensor, and temperature measurement circuit converts electrical signals to count
It is believed that number sending aerial coil 103 to, the data signal received is sent to external receiver by aerial coil 103.Optionally,
Aerial coil 103 establishes data transmission channel with external receiver using near field communication protocols or non-contact radio-frequency identification.
The temperature patch that the embodiment of the present application provides can complete contactless temperature detection, and simple in construction, cost is small,
Mercury clinical thermometer can be substituted and carry out measurement of bldy temperature, avoid mercury pollution.The temperature patch that the embodiment of the present application provides can also answer
In the application scenarios for using for example discontinuous thermometric, single thermometric, cross-infection can be avoided.It should be appreciated that the application
The temperature patch that embodiment provides is also applied in the application scenarios of continuous temperature measurement, is repeated and is utilized, and is reduced and is wasted.Compare
For mercury clinical thermometer, not mercurous material, while soft texture, it is pleasant during wearing.Compare in recent years and occur
Bluetooth clinical thermometer and nearly hundreds of yuan of cost, the embodiment of the present application provide temperature patch cost it is cheap, it is only necessary to several members
Even several first cans manufactures of zero point are completed, and are very suitable for disposable, and so as to effectively be used in hospital, reaching has
The purpose of effect ground infection control.
Optionally, the chip includes central control unit and the modulus being electrically connected with the central control unit
Conversion unit, radio frequency unit, the analog-to-digital conversion unit are electrically connected with heat sensitive component, the radio frequency unit and aerial coil
It is electrically connected with；The analog-to-digital conversion unit is used to the real-time tele-communication number received being converted into data signal, the center control
Unit is used to determine dut temperature value corresponding to the data signal, and the dut temperature value in real time is passed by radio frequency unit
Deliver to aerial coil.Herein, central control unit can determine data signal according to the electrical characteristic curve of heat sensitive component
Corresponding dut temperature value, electrical characteristic curve can include dut temperature and the corresponding relation of data signal, can also include
The corresponding relation of the resistance of heat sensitive component, data signal and dut temperature, voltage, the numeral of heat sensitive component can also be included
The corresponding relation of signal and dut temperature.
Optionally, it is necessary to carry out temperature correction for detection has the heat sensitive component of error.The chip also includes
Memory cell, the memory cell are used for the electrical characteristic curve for storing the heat sensitive component, the electrical characteristic curve bag
Include for representing the reference dut temperature of heat sensitive component and the corresponding relation of reference digital signal, the analog-to-digital conversion unit is used
In the real-time tele-communication number received is converted into data signal, the central control unit is used for according to the memory cell
The electrical characteristic curve of storage determines dut temperature value corresponding to the data signal, and the dut temperature value in real time is passed through
Radio frequency unit is sent to aerial coil.
Referring to Fig. 3, show the circuit structure diagram of some embodiment temperature patch of the application, this place heat sensitive component with
Exemplified by thermistor, because thermistor is resistance output, required on circuit, as long as circuit completes the accurate measurement of resistance
With wireless output can, circuit structure is relatively easy, and the volume of chip can also reduce, the cost and temperature patch of chip
Cost can reduce.Circuit shown in Fig. 3 includes thermistor TR, chip circuit and aerial coil ANTENA, chip circuit
Including analog-to-digital conversion unit ADC, central control unit LOGIC, memory cell EEPROM, wherein radio frequency unit RF, thermistor
TR is electrically connected with analog-to-digital conversion unit, and radio frequency unit RF is connected with aerial coil ANTENA.Optionally, chip circuit also includes
Antenna power unit R F-VCC and PMU Power Management.
The operation principle of circuit shown in Fig. 3 is specially：Radio frequency unit RF receiving antenna coils ANTENA energy, by energy
Antenna power unit R F-VCC is connected to, generating a power supply by antenna power unit R F-VCC exports, PMU
Power Managerment receive the output of this power supply, respectively to analog-to-digital conversion unit ADC, central control unit LOGIC and storage
Tri- program module power supplies of unit EEPROM.At the same time, radio frequency unit RF also has PA (Power Amplifer power amplifications
Device) and the circuit such as LNA (Low Noise Amplifer low noise operational amplifiers), the circuit such as PA and LINA is according to agreement by day
The valid data that line loop A NTENA is received extract, and give valid data to central control unit LOGIC, are controlled by center
Unit LOGIC is decoded into specified order according to valid data, and operation is written and read to memory cell EEPROM according to specified order.
While central control unit LOGIC receives specified order, analog-to-digital conversion unit ADC can be also controlled to proceed by adopting for data
Collection, is converted into data signal by the thermistor TP electric signals exported, then gives data signal to central control unit
LOGIC, by central control unit LOGIC storages into memory cell EEPROM.Central control unit LOGIC receives digital letter
Number when, radio frequency unit RF can be also controlled, by digital signal communication agreement by transmitting wirelessly away.
Specifically, the electrical characteristic curve of the memory cell EEPROM storage thermistors TR, optionally, electrical characteristic
Curve includes the corresponding relation for being used for the reference dut temperature and reference digital signal for representing heat sensitive component, and the corresponding relation can
With the reference dut temperature and the classification corresponding relation of reference digital signal to be determined according to the detection error of heat sensitive component；Mould
The real-time tele-communication number received is converted into data signal by number conversion unit ADC；Central control unit LOGIC is according to memory cell
The electrical characteristic curve stored on EEPROM determines dut temperature value corresponding to the data signal, and optionally, center control is single
First LOGIC determines according to the classification corresponding relation of the reference dut temperature and reference digital signal stored on memory cell EEPROM
Real time digital signal corresponding to the dut temperature detected in real time, and the real time digital signal is transmitted by radio frequency unit RF
To aerial coil ANTENA.Fig. 4 is that the temperature of thermistor and resistance value electrical characteristic curve show in some embodiments of the application
It is intended to；As shown in figure 4, thermistor is specifically by taking negative tempperature coefficient thermistor as an example, and when temperature raises, thermistor
Resistance taper into, lookup calculating is carried out on Fig. 4 curve, obtains temperature value corresponding to the resistance value, so as to
To accurate body temperature.
In the actual production process of thermistor, the influence of technique, the temperature-sensitive that same batch is produced are subject to processing
The resistance value of resistance and the homologous thread deviation of temperature are bigger.By taking 37 DEG C of 30K@thermistor as an example, when temperature becomes
When changing 0.1 DEG C, the resistance of thermistor should change 100 ohm, i.e. according to 0.1 DEG C of required precision, the heat under same batch
Quick resistance, at the same temperature, each resistance value should be ensured that between 29.9K and 30.1K.However, added due to common
The limitation of work technique, between it can even reach 29K-31K with the resistance of a batch of thermistor, each output, therefore
Cause to meet required precision only accounts for small proportion therein, so as to cause that ratio is selected from high-volume thermistor
The less a part of qualified products of example, otherwise the heat of high-precision requirement will be met to produce using the higher production technology of cost
Quick resistance, thereby increase the cost of single qualified thermistor.
Therefore, in some embodiments of the application, do not increasing cost or be realized with a low cost as far as possible, to same batch
Thermistor of the resistance of production between 29K-31K carries out screening grade, according to the output of thermistor at 37 DEG C per 0.1K
For grade separation, according to 29K-29.1K, 29.1K-29.2K, by that analogy, until 30.9K-31K, will be with a batch of temperature-sensitive
Resistance is divided into 20 grades.The deviation of the thermistor in each grade in that this 20 grade is relative to central value
No more than 0.05 DEG C (corresponding 50 ohm).Specifically, in some embodiments of the application, the center resistance value of each grade is deposited
Storage in the memory unit, is modified and calibrated so as to combine the actual resistance of the thermistor, so as to obtain accurate temperature
Angle value, along these lines, the precision of thermistor was both improved, and reduced the loss of thermistor again, reduce temperature
The production cost of paster.
The embodiment of the present application avoids thermistor in the prior art because matching is missed caused by the difference of electric parameter
The problem of difference and manufacturing cost are higher, realize and improve the accurate match of different heat sensitive components from each other, while and can drops
The effect of the production cost of low temperature paster.
Optionally, Fig. 5 A are referred to, show the circuit structure diagram of some embodiment analog-to-digital conversion units of the application, it is described
The circuit of analog-to-digital conversion unit includes measuring resistance standard, electric capacity C, comparator, logic circuit and door, counter
Counter, clock source CLK, wherein, measuring resistance standard is a high-precision measuring resistance, optionally, measuring resistance
Standard is the measuring resistance that precision is not less than 0.5%.One end of the counter Counter connects with central control unit
Connect, the other end is connected with the output end of logic circuit and door.One input of the logic circuit and door connects with clock source CLK
Connect, the output end connection of another input and comparator of logic circuit and door.The positive input terminal of the comparator and the first ginseng
Voltage Vref1 connections are examined, the negative input end of comparator is connected by first switch with thermistor TR, the negative input end of comparator
Also it is connected by second switch with measuring resistance standard one end.The measuring resistance standard other ends and the second reference
Voltage Vref2 connections, the tie point of the negative input end and first switch or second switch of described electric capacity C one end and comparator connect
Connect, other end ground connection.
The operation principle of circuit is specially shown in Fig. 5 A：It is (digitized herein that analog-to-digital conversion unit ADC starts digitlization
Mean the process for converting electrical signals to data signal) when, the electric charge on electric capacity C is bled off, will be with measuring resistance
The second switch closure of standard connections, the first switch being connected with thermistor TR is opened, then the second reference voltage
VREF2 charges to reinforced concrete structure, and the now output of comparator is high level.As the voltage on electric capacity starts to raise, work as electricity
When charging voltage in appearance increases above VREF1, comparator exports a low level.At the same time, when comparator exports height
During level, logic circuit and inputs of the gate control clock source CLK as counter Counter, by counter Counter to clock
Source CLK is counted, and when comparator output is low level, logic circuit stops counting with gate control counter Counter
Number, the output valve for writing down counter Counter is CNTVREF.With same operation principle, open and measuring resistance standard
The second switch of connection, the first switch being connected with thermistor TR is closed, thermistor TR is connected on electric capacity, recorded
The numerical value of counter when comparator stops counting is CNT, then obtains the resistance value of thermistor, i.e. TR=Rstd*
CNT/CNTVREF。
Fig. 5 B are the change curve above the electric capacity C shown in Fig. 5 A, because the difference of resistance value, measuring resistance and heat
Ascending curve caused by the resistance difference of quick resistance and heating-up time are inevitable different.Fixed in the clock frequency of clock source output
In the case of, t1 and t2 difference will result directly in the difference of the count value of counter output, be finally completed the number of resistance measurement
Word process.
In some embodiments of above-described embodiment, the length of the conductive connecting 102 is not shorter than preset length, described
Preset length can specifically be set as needed.Optionally, the preset length is 1cm.Carried out when temperature patch is used for oxter
During temperature detection, conductive connecting 102 not less than 1cm is designed to make heat sensitive component 105 to be placed on below armpit to examine
Testing temperature and chip 101 and aerial coil 103 are placed on outside arm, and aerial coil 103 will not be by arm when transmitting data
Block, improve the efficiency of transmission and transmission range of aerial coil 103.
When the temperature patch provided using some embodiments of the application is used for carrying out armpit temperature measurement, heat sensitive component
105 one side presses close to tested position.Because the material of substrate 104 is generally very thin, about 0.2mm is thick, heat sensitive component 105
The heat when (press close to tested position while) detection human body, in addition one side (away from be tested position while) pass through substrate
104 are radiating, then and when arm is opened, test, which obtains human body armpit temperature, can be less than actual armpit temperature value, so measure
Temperature is inaccurate.Therefore in some embodiments of above-described embodiment, applicant has made further improvement, referring to Fig. 6,
The temperature patch that the embodiment of the present application provides also includes being used for the insulating layer 106 for reducing radiating, optionally, in substrate floor 1042
One layer of insulating layer 106 for being used to reduce radiating is placed, now substrate surface 1042 presses close to tested position.The insulating layer 106 can be with
For flexible material, the flexible material can be, but not limited to as PVC material, polyimides or PET
Or foam (PET).It should be appreciated that when substrate floor 1042 presses close to tested position, the insulating layer 106 is located at substrate top
Face 1041.
In some embodiments of above-described embodiment, set in the substrate described in the position setting of heat sensitive component 105
Insulating layer.Optionally, the area of the insulating layer 106 can cover the heat sensitive component 105, the i.e. area of insulating layer 106
More than the area of heat sensitive component 105.Radiating can be so reduced to greatest extent.Optionally, the area of insulating layer 106 is not small
In 25*50mm2, it is specifically as follows 25*50mm2.Optionally, the thickness of insulating layer is 1.0mm-3.0mm, is specifically as follows
1.6mm.By many experiments, it can ensure that test temperature and actual temperature deviation reduce using above-mentioned insulating layer, it is upper when utilizing
It can ensure within 0.2 DEG C of test temperature and actual temperature deviation during the insulating layer for stating thickness and area, otherwise, temperature is inclined
Difference can arrive 0.5-2 DEG C, basically can not react the real body temperature of human body.There are insulating layer, the temperature without insulating layer measurement to test number
According to as shown in the table.
It should be appreciated that the meaning of insulating layer thickness is that thickness is thicker, test temperature value is more possibly close to reality
Border body temperature, therefore, in the optional scope of insulating layer thickness, according to different wearing demands or testing requirement set it is different every
Warm thickness degree.
Referring to Fig. 7, in some embodiments of above-described embodiment, temperature patch also includes protective layer 107, can be located at substrate
Top surface 1041 or substrate floor 1042, optionally, protective layer 107 directly contacts with aerial coil 103, and is coated to and is pressed in substrate
Top surface 1041.Wherein, protective layer 107, which has, can make the through hole that chip 101 passes through, and substrate top is pressed in when protective layer 107 is coated
Behind face 1041, chip 101 exposes from the through hole, optionally, shape of through holes and the shape adaptation of chip 101.Applying this Shen
Please embodiment provide temperature patch carry out thermometric when, protective layer 107 can prevent aerial coil to be worn away.
Referring to Fig. 8, in some embodiments of above-described embodiment, temperature patch includes insulating layer 106 and protective layer
107.The technique effect and other parameter settings of insulating layer 106 and protective layer 107 see above, will not be repeated here.
In summary, the embodiment of the present application can reach following technique effect：
The technical scheme that some embodiments of the application provide can complete contactless temperature detection, simple in construction, into
This is small, can substitute mercury clinical thermometer and carry out measurement of bldy temperature, avoid mercury pollution.Compare for mercury clinical thermometer, not mercurous material
Matter, while soft texture, it is pleasant during wearing.Compare the bluetooth clinical thermometer that occurred in recent years and nearly hundreds of yuan
Cost, the technical scheme cost that the embodiment of the present application provides are cheap, it is only necessary to and several first can manufactures of several members even zero point are completed,
It is very suitable for disposable, so as to effectively being used in hospital, reaches the purpose of effectively infection control.
For the heat sensitive component with detection error, the technical scheme that some embodiments of the application provide can also be carried out
Amendment and calibration, so as to obtain accurate temperature value, along these lines, had both improved the precision of heat sensitive component, had subtracted again
Lack the loss of heat sensitive component, reduce the production cost of temperature patch.
The some embodiments of the application not less than preset length conductive connecting be designed to place heat sensitive component
The detection temperature below armpit and chip and aerial coil are placed on outside arm, aerial coil will not be by arm when transmitting data
Arm blocks, and improves the efficiency of transmission and transmission range of aerial coil.
The some embodiments of the application also include the insulating layer for reducing radiating, improve final dut temperature.
The some embodiments of the application also include the protective layer that can prevent that aerial coil is worn away.
Device embodiment described above is only schematical, wherein the unit illustrated as separating component can
To be or may not be physically separate, it can be as the part that unit is shown or may not be physics list
Member, you can with positioned at a place, or can also be distributed on multiple NEs.It can be selected according to the actual needs
In some or all of module realize the purpose of this embodiment scheme.Those of ordinary skill in the art are not paying creativeness
Work in the case of, you can to understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
Realized by the mode of software plus required general hardware platform, naturally it is also possible to pass through hardware.Based on such understanding, on
The part that technical scheme substantially in other words contributes to prior art is stated to embody in the form of software product, should
Computer software product can store in a computer-readable storage medium, such as ROM/RAM, magnetic disc, CD, including some fingers
Make to cause a computer equipment (can be personal computer, server, or network equipment etc.) to perform each implementation
Method described in some parts of example or embodiment.
Finally it should be noted that：Above example is only to illustrate the technical scheme of the application, rather than its limitations；Although
The application is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from each embodiment technical scheme of the application spirit and
Scope.
Claims (10)
- A kind of 1. temperature patch, it is characterised in that including：Substrate；Aerial coil, the aerial coil directly with the substrate contact；Chip, the chip are electrically connected with the aerial coil；Heat sensitive component, it is electrically connected with the chip；The heat sensitive component is used to detect dut temperature in real time, and by real-time tele-communication corresponding to the dut temperature detected in real time Number, the real-time tele-communication number is sent to the chip；The chip is used to the real-time tele-communication number being converted into data signal, And dut temperature corresponding to the data signal is sent to aerial coil.
- 2. temperature patch according to claim 1, it is characterised in that the chip passes through conductive connecting with aerial coil Connection.
- 3. temperature patch according to claim 2, it is characterised in that the length of the conductive connecting is not shorter than default length Degree.
- 4. temperature patch according to claim 1, it is characterised in that also include being used for the insulating layer for reducing radiating, it is described Insulating layer is located at substrate surface or located at substrate floor.
- 5. temperature patch according to claim 4, it is characterised in that the position for setting thermistor in the substrate is set The insulating layer.
- 6. temperature patch according to claim 4, it is characterised in that the area of the insulating layer can cover the temperature-sensitive Resistance.
- 7. temperature patch according to claim 6, it is characterised in that the area of the insulating layer is not less than 25*50mm2。
- 8. temperature patch according to claim 4, it is characterised in that the thickness of the insulating layer be 1.0~1.6mm and 1.6~3.0mm.
- 9. temperature patch according to claim 1, it is characterised in that also include the protective layer of direct Contact antenna coil.
- A kind of 10. system for detecting temperature, it is characterised in that including the temperature patch as described in claim 1 to 9 is any and with institute The temperature receptacle of temperature patch connection is stated, the temperature receptacle is used for the data signal that receiving antenna coil is sent.
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|---|---|---|---|
| CN201710534853.7A CN107340072A (en) | 2017-07-03 | 2017-07-03 | Temperature patch and system for detecting temperature |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710534853.7A CN107340072A (en) | 2017-07-03 | 2017-07-03 | Temperature patch and system for detecting temperature |
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| CN207636196U (en) * | 2017-07-03 | 2018-07-20 | 铂元智能科技(北京)有限公司 | Temperature patch and system for detecting temperature |
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Application publication date: 20171110 |