CN107340012A - Optical sensor module - Google Patents
Optical sensor module Download PDFInfo
- Publication number
- CN107340012A CN107340012A CN201710703216.8A CN201710703216A CN107340012A CN 107340012 A CN107340012 A CN 107340012A CN 201710703216 A CN201710703216 A CN 201710703216A CN 107340012 A CN107340012 A CN 107340012A
- Authority
- CN
- China
- Prior art keywords
- optical sensor
- sensor module
- circuit board
- slot
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 230000006641 stabilisation Effects 0.000 abstract description 2
- 238000011105 stabilization Methods 0.000 abstract description 2
- 230000006978 adaptation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
The present invention uses such a optical sensor module, including housing and the transmitter module, receiving module, circuit board, the wiring conducting strip that are arranged in housing；Wherein transmitter module and receiving module is all disposed within circuit board, and wiring conducting strip is using pin configuration is punctured, and multigroup to puncture the welding of pin one end on circuit boards, the other end is used for and cable connection；Whole optical sensor module natively compares miniaturization, and also very little, optical sensor module are designed the installing space between support and base using such, and dimensional space is assembled also very convenient with regard to very little；Part is fewer, and work also reliable stabilization；Wiring conducting strip is using pin configuration is punctured simultaneously, the size advantage and stable performance that are unable to reach compared with traditional round hole arrangement, the present invention with existing line plate.
Description
Technical field
The present invention relates to a kind of module for optical field, more particularly to a kind of optical sensor module.
Background technology
Sensor module is to use sensor of the photoelectric cell as detecting element.It first changes measured change
Into the change of optical signal, then electric signal is further converted optical signals into by photoelectric cell.Sensor module is typically by light
Source, optical path and photoelectric cell three parts composition.Overseas enterprise grasps more advanced, domestic enterprise to sensor module technology
Want to break the necessary autonomous innovation of monopolization of the overseas enterprise to these products.Most important of which is exactly the sensor die of the inside
Group, because size is small, installing space is also small, how preferably to realize its structure design and layout, is to need most consideration and solve
Part.
The content of the invention
In view of this, it is an object of the invention to provide a kind of more reliable and be readily produced the optical sensor mould of assembling
Block.
In order to realize the above object the present invention uses such a optical sensor module, including housing and it is arranged on
Transmitter module, receiving module, circuit board, wiring conducting strip in housing；Wherein transmitter module and receiving module is all disposed within electricity
On the plate of road, wiring conducting strip is multigroup to puncture the welding of pin one end on circuit boards using puncturing pin configuration, the other end be used for
Cable connection.
Whole optical sensor module natively compares miniaturization, the also very little of the installing space between support and base, light
Sensor assembly is learned using so design, dimensional space is assembled also very convenient with regard to very little；Part is fewer, and work is also compared
Relatively reliable stabilization；Wiring conducting strip is using pin configuration is punctured simultaneously, and compared with traditional round hole arrangement, the present invention has existing line
The size advantage and stable performance that plate is unable to reach.
The present invention, which is further arranged to housing, includes upper lid and shell body, and shell body is shaped as a cuboid, the length
The centre of cube is that through slot is used to place circuit board, and the size of through slot is adapted with circuit board, punctures pin from shell body
Lower section expose；It is upper to cover on shell body upper surface, opened up on upper lid and the transmitter module on circuit board and receiving module phase
The short slot of adaptation.
Said structure layout designs are reasonable, easy to assembly.
The surrounding for the through slot that the present invention is further arranged in shell body has big chamfering, and the bottom of upper lid extends downwardly
Formed and be greater than the air line distance of through slot both sides with the inserted block of through slot, the air line distance between the both sides of upper lid.
Upper lid in said structure forms close-fitting by the inserted block of bottom with shell body, prevents lid from being separated with shell body,
And circuit board is protected in shell body well.
The both sides that the present invention is further arranged to circuit board are distributed with 4 and puncture pin.
Brief description of the drawings
Fig. 1 is optical sensor module exploded pictorial of embodiment of the present invention Fig. 1.
Fig. 2 is optical sensor module exploded pictorial of embodiment of the present invention Fig. 2.
Fig. 3 is optical sensor module stereogram of the embodiment of the present invention.
Fig. 4 is optical sensor module sectional view of the embodiment of the present invention.
Fig. 5 is shell body front view of the embodiment of the present invention.
Fig. 6 is shell body sectional view of the embodiment of the present invention.
Fig. 7 is lid front view in the embodiment of the present invention.
Embodiment
As shown in figs. 1-7, the present invention is a kind of optical sensor module, including upper lid 6, shell body 7, transmitter module, is connect
Receive module, circuit board 8, wiring conducting strip；Shell body 7 is shaped as a cuboid, and the centre of the cuboid is through slot 71
For placing circuit board 8, the size of through slot 72 is adapted with circuit board 8, and wiring conducting strip, which uses, punctures the structure of pin 9,4 groups
Puncture the one end of pin 9 to be welded on circuit board 8, the other end is used to be connected with cable 4.Pin 9 is punctured from the lower section of shell body 7 to reveal
Go out；Upper lid 6 is covered on the upper surface of shell body 7, is opened up on upper lid 6 and is adapted with the transmitter module on circuit board 8 and receiving module
Short slot 61.Wherein transmitter module and receiving module are all disposed within circuit board 8.The surrounding tool of through slot 71 in shell body 7
There is a big chamfering 72, the bottom of upper lid 6 is downwardly extending the inserted block with through slot 71, the air line distance between the both sides of upper lid 6
It is greater than the air line distance of the both sides of through slot 61.
Claims (4)
- A kind of 1. optical sensor module, it is characterised in that：The optical sensor module includes housing and is arranged on housing Interior transmitter module, receiving module, circuit board, wiring conducting strip；Wherein transmitter module and receiving module is all disposed within circuit board On, wiring conducting strip is using pin configuration is punctured, and multigroup to puncture the welding of pin one end on circuit boards, the other end is used for and cable Connection.
- 2. optical sensor module according to claim 1, it is characterised in that：The housing includes upper lid and shell body, Shell body is shaped as a cuboid, and the centre of the cuboid is used to placing circuit board for through slot, the size of through slot with Circuit board is adapted, and is punctured pin and is exposed below shell body；It is upper to cover on shell body upper surface, opened up on upper lid and electricity The short slot that transmitter module and receiving module on the plate of road are adapted.
- 3. optical sensor module according to claim 2, it is characterised in that：The surrounding of through slot in the shell body With big chamfering, the bottom of upper lid is downwardly extending the inserted block with through slot, and the air line distance between the both sides of upper lid is big Air line distance in through slot both sides.
- 4. optical sensor module according to claim 2, it is characterised in that：The both sides of the circuit board are distributed with 4 It is individual to puncture pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703216.8A CN107340012A (en) | 2017-08-16 | 2017-08-16 | Optical sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710703216.8A CN107340012A (en) | 2017-08-16 | 2017-08-16 | Optical sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107340012A true CN107340012A (en) | 2017-11-10 |
Family
ID=60214036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710703216.8A Pending CN107340012A (en) | 2017-08-16 | 2017-08-16 | Optical sensor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107340012A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2627524Y (en) * | 2003-05-15 | 2004-07-21 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion module unit |
| US20110254763A1 (en) * | 2010-04-14 | 2011-10-20 | Samsung Electro-Mechanics Co., Ltd. | Optical pointing module and electronic apparatus |
| CN103728699A (en) * | 2014-01-06 | 2014-04-16 | 中国电子科技集团公司第三十四研究所 | Wireless optical module used for interconnection of circuit boards |
| CN104536103A (en) * | 2010-04-20 | 2015-04-22 | 富士康(昆山)电脑接插件有限公司 | Opto-electronic device assembly |
| CN204902857U (en) * | 2015-07-07 | 2015-12-23 | 康崔耐科斯公司 | Photoelectric sensor |
| CN205561870U (en) * | 2016-03-22 | 2016-09-07 | 深圳市鼎创电子有限公司 | Dualbeam penetrates sample formula photoelectric sensor directly |
-
2017
- 2017-08-16 CN CN201710703216.8A patent/CN107340012A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2627524Y (en) * | 2003-05-15 | 2004-07-21 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion module unit |
| US20110254763A1 (en) * | 2010-04-14 | 2011-10-20 | Samsung Electro-Mechanics Co., Ltd. | Optical pointing module and electronic apparatus |
| CN104536103A (en) * | 2010-04-20 | 2015-04-22 | 富士康(昆山)电脑接插件有限公司 | Opto-electronic device assembly |
| CN103728699A (en) * | 2014-01-06 | 2014-04-16 | 中国电子科技集团公司第三十四研究所 | Wireless optical module used for interconnection of circuit boards |
| CN204902857U (en) * | 2015-07-07 | 2015-12-23 | 康崔耐科斯公司 | Photoelectric sensor |
| CN205561870U (en) * | 2016-03-22 | 2016-09-07 | 深圳市鼎创电子有限公司 | Dualbeam penetrates sample formula photoelectric sensor directly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171110 |
|
| WD01 | Invention patent application deemed withdrawn after publication |