CN107336508A - Multilayer material is bonded special-shaped processing technology and cutting die used - Google Patents
Multilayer material is bonded special-shaped processing technology and cutting die used Download PDFInfo
- Publication number
- CN107336508A CN107336508A CN201710556463.XA CN201710556463A CN107336508A CN 107336508 A CN107336508 A CN 107336508A CN 201710556463 A CN201710556463 A CN 201710556463A CN 107336508 A CN107336508 A CN 107336508A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- faced adhesive
- cutting
- double faced
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
- B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
Abstract
Being bonded special-shaped processing technology and cutting die used, the technique the invention discloses a kind of multilayer material includes：It is cut mould, cutting die is changed to mirror image cutting die, double faced adhesive tape is die cut with mirror image cutting die, the type of cutting goes out symmetrical profiled holes, covers grenadine, to patch, entirely to the step such as die-cutting machine entire volume set position processing cross cutting external form in the double-layer and double-side adhesive tape that posts, the processing of product is completed, cutting die used simplifies processing process, shortens process time and reduces fussy degree.
Description
【Technical field】
The present invention relates to materials processing technology field, more particularly to multilayer material abnormity processing technology.
【Background technology】
The present invention relates to the fitting process technology of multilayer material, in particular for needing to align alignment and then mould by aperture
Cut, cut the material completed to patch before.Due to being heterotypic material, the process cut every time single can only all be processed and cut, so
After paste, process is more, and efficiency is low.
Existing process is cumbersome, it is necessary to the following steps first step：Need to cut special-shaped double faced adhesive tape；Second step：First
Step cuts the good double faced adhesive tape one side of type and covers last layer grenadine；3rd step：Cut type another side double faced adhesive tape；4th step：Pass through small borehole jack
By the double faced adhesive tape in second step, it covers the one side of grenadine with the double faced adhesive tape in the 3rd step to patch to position locating dowel；5th step：It is single
It is individual to cut external form, complete whole process.
【The content of the invention】
The present invention proposes one kind for case above and cut down the number of intermediate links process, there is provided the multilayer material of operating efficiency is bonded different
Type processing technology.
Multilayer material abnormal shape processing technology involved in the present invention：
Step 1：Mould is cut, cutting die is changed to mirror image cutting die, straight knife type broken line is provided with the centre of two mirror image cutting dies, this
Mould release membrance is cut out impression and is easy to fold by straight knife type broken line；
Step 2：Double faced adhesive tape is die cut with mirror image cutting die, the type of cutting goes out symmetrical profiled holes, needed unnecessary double faced adhesive tape among symmetrical profiled holes
Remove, a profiled holes respectively occur in both sides, keep double faced adhesive tape surface mould release membrance not separate；
Step 3：Grenadine is covered, wherein after the completion of a double faced adhesive tape cuts type, removes the double faced adhesive tape of wherein one side, grenadine is covered in
Double faced adhesive tape removes on the one side of mould release membrance, and is compressed by overlay film roller, and a double faced adhesive tape maintains the original state in addition；
Step 4：To patch, the double faced adhesive tape for being covered with grenadine and the double faced adhesive tape for not tearing mould release membrance are carried out to patch, by the double faced adhesive tape of entire volume
It is wrapped on dispensing shaft, is a double faced adhesive tape for being covered with grenadine while being the double faced adhesive tape for not tearing mould release membrance, separation is wherein
The double faced adhesive tape mould release membrance on one side, the face for being covered with grenadine is carried out to patch with tearing the glue surface of mould release membrance off；
Step 5：Entirely to die-cutting machine entire volume set position processing cross cutting external form in the double-layer and double-side adhesive tape that posts.
In step 3, the wide cut of grenadine exceedes two-sided tape wide cut.
The cutting die used in special-shaped processing technology is bonded in multilayer material, including two symmetrical mirror image die-cutting rules are with
Between straight knife type broken line, be provided with straight knife type broken line between mirror image die-cutting rule.
Multiple positioning holes and locating dowel are provided among the cutting die.
In overall two and half arcs of mirror image die-cutting rule, be provided with positioning hole at the center of two and half arcs, and half arc it
Locating dowel is provided among outside and straight knife type broken line.
Cutting die used simplifies processing process, shortens process time and reduces fussy degree.
【Brief description of the drawings】
Fig. 1 is the structural representation for the cutting die that multilayer material of the present invention is bonded special-shaped processing technology；
Wherein：1st, mirror image die-cutting rule；2nd, straight knife type broken line；3rd, positioning hole；4th, locating dowel.
【Embodiment】
Special-shaped processing technology is bonded to multilayer material of the present invention below in conjunction with the drawings and specific embodiments of the present invention to enter to advance
The detailed description of one step.
Multilayer material abnormal shape processing technology involved in the present invention：
Step 1：Mould is cut, cutting die is changed to mirror image cutting die, straight knife type broken line is provided with the centre of two mirror image cutting dies, this
Mould release membrance is cut out impression and is easy to fold by straight knife type broken line；
Step 2：Double faced adhesive tape is die cut with mirror image cutting die, the type of cutting goes out symmetrical profiled holes, needed unnecessary double faced adhesive tape among symmetrical profiled holes
Remove, a profiled holes respectively occur in both sides, keep double faced adhesive tape surface mould release membrance not separate；
Step 3：Grenadine is covered, by grenadine covering wherein on a double faced adhesive tape one side cut after the completion of type, and pass through overlay film roller
Compress, a double faced adhesive tape maintains the original state in addition；
Step 4：To patch, the double faced adhesive tape for being covered with grenadine and the double faced adhesive tape for not tearing mould release membrance are carried out to patch, by the double faced adhesive tape of entire volume
It is wrapped on dispensing shaft, is a double faced adhesive tape for being covered with grenadine while being the double faced adhesive tape for not tearing mould release membrance, separation is wherein
The double faced adhesive tape mould release membrance on one side, the face for being covered with grenadine is carried out to patch with tearing the glue surface of mould release membrance off；
Step 5：Entirely to die-cutting machine entire volume set position processing cross cutting external form in the double-layer and double-side adhesive tape that posts.
In step 3, the wide cut of grenadine exceedes two-sided tape wide cut.
The cutting die used in special-shaped processing technology, including two symmetrical Hes of mirror image die-cutting rule 1 are bonded in multilayer material
Middle straight knife type broken line 2, straight knife type broken line 2 is provided between mirror image die-cutting rule 1.
Multiple positioning holes and locating dowel are provided among the cutting die.
In overall two and half arcs of mirror image die-cutting rule, be provided with positioning hole 3 at the center of two and half arcs, and half arc it
Locating dowel 4 is provided among outside and straight knife type broken line.
Cutting die used simplifies processing process, shortens process time and reduces fussy degree.
It is described above, only it is present pre-ferred embodiments, any formal limitation not is made to the present invention, although
The present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any person skilled in the art,
Do not depart from the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent
The equivalent embodiment of change, as long as being without departing from technical solution of the present invention content, refer to implement to more than according to the technology of the present invention
Any simple modification, equivalent change and modification that example is made, is belonged in the range of technical solution of the present invention.
Claims (5)
- A kind of 1. multilayer material abnormal shape processing technology：It is characterised in that it includes following steps,Step 1：Mould is cut, cutting die is changed to mirror image cutting die, straight knife type broken line is provided with the centre of two mirror image cutting dies, this Mould release membrance is cut out impression and is easy to fold by straight knife type broken line；Step 2：Double faced adhesive tape is die cut with mirror image cutting die, the type of cutting goes out symmetrical profiled holes, needed unnecessary double faced adhesive tape among symmetrical profiled holes Remove, a profiled holes respectively occur in both sides, keep double faced adhesive tape surface mould release membrance not separate；Step 3：Grenadine is covered, wherein after the completion of a double faced adhesive tape cuts type, removes the double faced adhesive tape of wherein one side, grenadine is covered in Double faced adhesive tape removes on the one side of mould release membrance, and is compressed by overlay film roller, and a double faced adhesive tape maintains the original state in addition；Step 4：To patch, the double faced adhesive tape for being covered with grenadine and the double faced adhesive tape for not tearing mould release membrance are carried out to patch, by the double faced adhesive tape of entire volume It is wrapped on dispensing shaft, is a double faced adhesive tape for being covered with grenadine while being the double faced adhesive tape for not tearing mould release membrance, separation is wherein The double faced adhesive tape mould release membrance on one side, the face for being covered with grenadine is carried out to patch with tearing the glue surface of mould release membrance off；Step 5：Entirely to die-cutting machine entire volume set position processing cross cutting external form in the double-layer and double-side adhesive tape that posts.
- 2. multilayer material abnormity processing technology according to claim 1, it is characterised in that in step 3, the wide cut of grenadine More than two-sided tape wide cut.
- 3. a kind of cutting die that special-shaped processing technology is bonded applied to multilayer material, it is characterised in that the cutting die includes two symmetrically Mirror image die-cutting rule and middle straight knife type broken line, be provided with straight knife type broken line between mirror image die-cutting rule.
- 4. it is applied to the cutting die that multilayer material is bonded special-shaped processing technology according to claim 3, it is characterised in that in the knife Multiple positioning holes and locating dowel are provided among mould.
- 5. it is applied to the cutting die that multilayer material is bonded special-shaped processing technology according to claim 4, it is characterised in that in mirror image Overall two and half arcs of die-cutting rule, positioning hole is provided with the center of two and half arcs, and in the outside of half arc and straight knife type Locating dowel is provided among broken line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710556463.XA CN107336508A (en) | 2017-07-10 | 2017-07-10 | Multilayer material is bonded special-shaped processing technology and cutting die used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710556463.XA CN107336508A (en) | 2017-07-10 | 2017-07-10 | Multilayer material is bonded special-shaped processing technology and cutting die used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107336508A true CN107336508A (en) | 2017-11-10 |
Family
ID=60218475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710556463.XA Pending CN107336508A (en) | 2017-07-10 | 2017-07-10 | Multilayer material is bonded special-shaped processing technology and cutting die used |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107336508A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582799A (en) * | 2018-06-11 | 2018-09-28 | 东莞市美芯龙物联网科技有限公司 | A kind of grenadine processing unit (plant) and grenadine processing technology |
| CN111114090A (en) * | 2019-12-26 | 2020-05-08 | 东莞领益精密制造科技有限公司 | Processing technology of multilayer material composite waterproof dustproof net |
| CN111378388A (en) * | 2018-12-27 | 2020-07-07 | 昊佰电子科技（上海）有限公司 | Composite material belt for processing double-sided adhesive tape product |
| CN111873458A (en) * | 2020-07-02 | 2020-11-03 | 苏州伟铂瑞信电子科技有限公司 | Die-cutting opposite-pasting process |
-
2017
- 2017-07-10 CN CN201710556463.XA patent/CN107336508A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582799A (en) * | 2018-06-11 | 2018-09-28 | 东莞市美芯龙物联网科技有限公司 | A kind of grenadine processing unit (plant) and grenadine processing technology |
| CN108582799B (en) * | 2018-06-11 | 2021-02-12 | 东莞市美芯龙物联网科技有限公司 | Gauze processing device and gauze processing technology |
| CN111378388A (en) * | 2018-12-27 | 2020-07-07 | 昊佰电子科技（上海）有限公司 | Composite material belt for processing double-sided adhesive tape product |
| CN111114090A (en) * | 2019-12-26 | 2020-05-08 | 东莞领益精密制造科技有限公司 | Processing technology of multilayer material composite waterproof dustproof net |
| CN111114090B (en) * | 2019-12-26 | 2021-12-24 | 东莞领益精密制造科技有限公司 | Processing technology of multilayer material composite waterproof dustproof net |
| CN111873458A (en) * | 2020-07-02 | 2020-11-03 | 苏州伟铂瑞信电子科技有限公司 | Die-cutting opposite-pasting process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171110 |
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| WD01 | Invention patent application deemed withdrawn after publication |