CN107333035A - Low-power consumption, small size, the outer binocular thermometric camera of expansible visible red - Google Patents
Low-power consumption, small size, the outer binocular thermometric camera of expansible visible red Download PDFInfo
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- CN107333035A CN107333035A CN201710455995.4A CN201710455995A CN107333035A CN 107333035 A CN107333035 A CN 107333035A CN 201710455995 A CN201710455995 A CN 201710455995A CN 107333035 A CN107333035 A CN 107333035A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C19/00—Electric signal transmission systems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
- H04L12/10—Current supply arrangements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/65—Control of camera operation in relation to power supply
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
- H04N5/265—Mixing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses binocular thermometric camera outside a kind of low-power consumption, small size, expansible visible red.Including sensor data acquisition module, control module, PoE module and data-interface, sensor data acquisition module is connected through data-interface with control module, and control module is connected through PoE module with external network, is powered by PoE module；Sensor data acquisition module includes visible images acquisition module, infrared array acquisition module, other sensors data acquisition module and multi-path digital analogy signal processing unit, PoE module includes the power supply module and Network Interface Module being connected, and control module includes control chip, image co-registration module and data memory module.Thermometric camera of the present invention, which has, to be easy to extend, install the features such as simple, easy to maintenance, low in energy consumption, size is small, especially has very strong practical significance in the monitoring scene being had higher requirements to power consumption, space.
Description
Technical field
The present invention relates to a kind of thermometric camera, one kind of more particularly to safety precaution monitoring field can be used for low temperature
Section thermometric, low-power consumption, small size, the outer binocular thermometric camera of expansible visible red.
Background technology
In modern industry production process, in order to ensure the normal operation of technique productions equipment and ensure that production environment exists
In required ambient temperature range, it is often necessary to carry out temperature monitoring to technique productions equipment, product and environment.In the past this
Plant monitoring and typically take the relatively low infrared point temperature measurer collecting temperature information of power consumption, but it can only measure a certain of measured object every time
The average temperature value of individual small area, it is impossible to reflect the bulk temperature distribution of testee, so as to greatly reduce infrared temperature point
The value of analysis.Although thermal infrared imager can measure the temperature field of testee, whole object surface temperature information is carried out real
When gather and analyze, but its is expensive, and power consumption is high, and volume is big, and is not suitable for carrying out secondary development, be not suitable for cost,
The monitoring scene that power consumption, space have higher requirements.
The content of the invention
The technical problems to be solved by the invention, are just to provide a kind of low-power consumption, small size, outside expansible visible red
Binocular thermometric camera, can realize the Overlapping display of visible ray and object multiple spot surface temperature field, realize temperature finding i.e. institute
, available in contactless monitoring.
Above-mentioned technical problem is solved, the present invention is adopted the following technical scheme that：
The present invention includes sensor data acquisition module, data-interface, control module and the PoE module being sequentially connected, and passes
Sensor data acquisition module is through data-interface link control module, and data-interface is used to obtain the collection of sensor data acquisition module
The data obtained carry out protocol conversion and are sent to again, control module connection server after PoE module, external network, control module,
Multi-path digital analogy signal processing unit in data-interface and sensor data acquisition module is powered by PoE module, PoE module
Connect external power source.
The sensor data acquisition module includes visible images acquisition module, infrared array acquisition module, other biographies
Sensor data acquisition module and multi-path digital analogy signal processing unit, it is seen that light image acquisition module, infrared array collection
Module, other sensors data acquisition module are connected with multi-path digital analogy signal processing unit respectively, multi-path digital simulation letter
Number processing unit output end is connected to data-interface, by multi-path digital analogy signal processing unit by the visible ray number of collection
Data-interface is sent to according to, infrared data and other sensors data.
Described visible images acquisition module includes cmos image sensor, the image data processing unit being sequentially connected
With serial camera control bus (SCCB) interface circuit, cmos image sensor is successively through image data processing unit, serial
It is connected after camera control bus interface circuit with multi-path digital analogy signal processing unit.
Described infrared array acquisition module includes infrared sensor array, the infrared array data processing list being sequentially connected
Member and the first I2C (IC bus) interface circuit, infrared sensor array is successively through infrared array data processing unit, the
It is connected after one I2C interface circuits with multi-path digital analogy signal processing unit.
Described other sensors data acquisition module include be sequentially connected user's replaceable sensor, replaceable sensing
Device data processing unit and the 2nd I2C interface circuits, user's replaceable sensor is successively through replaceable sensor data processing list
It is connected after member, the 2nd I2C interface circuits with multi-path digital analogy signal processing unit.
In described visible images acquisition module, infrared array acquisition module, other sensors data acquisition module
Modules are connected with power module of voltage regulation, are powered by power module of voltage regulation.
Described user's replaceable sensor includes temperature sensor, humidity sensor, harmful gas sensor, acceleration
Meter, ultrasonic sensor and pressure sensor one or more therein, sensor support I2C agreements.
Described control module includes control chip, image co-registration module and data memory module, described control chip
Respectively with the Network Interface Module connection communication of image co-registration module, data memory module, data-interface and PoE module.
Described PoE module includes the power supply module and Network Interface Module being connected, and Network Interface Module is also connected to
The control chip of external network, Network Interface Module transmission data and power supply to the control module so that control module is by net
Network interface module is powered and receives data.
The input of described data-interface is connected at the multi-path digital analog signal of sensor data acquisition module respectively
The output end of unit and control chip is managed, the output end of data-interface is connected to the input of data memory module, data storage
The output end of module is connected to control chip.
The camera is applied to non-contacting infrared field of temperature measurement and picture control field, and -20 degrees Celsius of temperature-measuring range is arrived
300 degrees Celsius.
In specific implementation, external ethernet network can be Ethernet, and control chip uses ARM control chips.
The present invention can realize low-power consumption use corresponding means be by software control hardware io break-make its due to
Sensor data acquisition module in a non-operative state, can be closed, restarted during operation by camera by power module of voltage regulation,
Therefore low-power consumption effect can be reached.
The beneficial effects of the invention are as follows：
Binocular thermometric camera of the present invention can realize the Overlapping display of visible ray and object multiple spot surface temperature field, realize
Temperature What You See Is What You Get is small with being easy to extend, installing simple, easy to maintenance, low in energy consumption, size with preferable flexibility
The features such as, especially there is very strong practical significance in the monitoring scene being had higher requirements to power consumption, space.
The present invention is powered using PoE, and without individually laying power line, simplied system structure is easy for installation simple, it is ensured that net
Network runs well and can be greatly lowered cost.
The present invention is less than 3w in the power of working condition, and size is 3cm × 3cm × 3cm, is equipped with infrared array acquisition module
Realize point position temperature survey, and can by the various types of sensors of I2C bus extensions, realize on-the-spot record visualization, it is low
Cost, high efficiency, reach the purpose of the Overlapping display of visible ray and object multiple spot surface temperature field, and application surface is very wide.
Brief description of the drawings
Fig. 1 is the principle schematic of the present invention；
Fig. 2 is the composition and annexation schematic diagram of the present invention；
Fig. 3 is the control module circuit theory diagrams of the present invention；
Fig. 4 is the Network Interface Module circuit theory diagrams of the present invention；
Fig. 5 is the image data processing unit circuit theory diagrams of the present invention；
Fig. 6 is the power module of voltage regulation circuit theory diagrams of the present invention.
Reference is referred in figure：10- sensor data acquisition modules, 20- control modules, 30-PoE modules, 40- data
Interface, 50- external networks, 60- servers.
Embodiment
The embodiment of the present invention is described in detail with reference to Figure of description.
As shown in figure 1, the present invention includes the sensor data acquisition module 10 being sequentially connected, data-interface 40, control mould
Block 20 and PoE module 30, sensor data acquisition module 10 are used for through the link control module 20 of data-interface 40, data-interface 40
The data that sensor data acquisition module 10 is gathered into acquisition carry out protocol conversion and are sent to again, and control module 20 is through PoE module
30th, it is many in connection server 60 after external network 50, control module 20, data-interface 40 and sensor data acquisition module 10
Railway digital analogy signal processing unit 104 is powered by PoE module 30, the connection external power source of PoE module 30.
Gathered as shown in Fig. 2 sensor data acquisition module 10 includes visible images acquisition module 101, infrared array
Module 102, other sensors data acquisition module 103 and multi-path digital analogy signal processing unit 104, it is seen that light image is adopted
Collect module 101, infrared array acquisition module 102, other sensors data acquisition module 103 respectively with multi-path digital analog signal
Processing unit 104 is connected, and the output end of multi-path digital analogy signal processing unit 104 is connected to data-interface 40, passes through many ways
The visible data of collection, infrared data and other sensors data are sent to data and connect by word analogy signal processing unit 104
Mouth 40.
Visible images acquisition module 101 includes cmos image sensor 1011, the image real time transfer list being sequentially connected
Member 1012 and serial camera control bus (SCCB) interface circuit 1013, cmos image sensor 1011 is successively through view data
With multi-path digital analogy signal processing unit after processing unit 1012, serial camera control bus (SCCB) interface circuit 1013
104 connections；
Infrared array acquisition module 102 includes infrared sensor array 1021, the infrared array data processing being sequentially connected
The I2C interface circuits 1023 of unit 1022 and the first, infrared sensor array 1021 is successively through infrared array data processing unit
1022nd, it is connected after the first I2C interface circuits 1023 with multi-path digital analogy signal processing unit 104；
Other sensors data acquisition module 103 include be sequentially connected user's replaceable sensor 1031, it is replaceable pass
The I2C interface circuits 1033 of sensor data processing unit 1032 and the 2nd, and for connect modules and power it is infrared steady
Piezoelectricity source module 1034, user's replaceable sensor 1031 is successively through replaceable sensor data processing unit 1032, the 2nd I2C
It is connected after interface circuit 1033 with multi-path digital analogy signal processing unit 104.
User's replaceable sensor 1031 includes temperature sensor, humidity sensor, harmful gas sensor, acceleration
The one or more therein such as meter, ultrasonic sensor, pressure sensor, sensor must support I2C agreements.
As shown in Fig. 2 control module 20 includes control chip 201, image co-registration module 202 and data memory module 203,
The net of control chip 201 respectively with image co-registration module 202, data memory module 203, data-interface 40 and PoE module 30
The connection communication of network interface module 302；
As shown in Fig. 2 PoE module 30 includes the power supply module 301 and Network Interface Module 302 being connected, network interface
Module 302 is also connected to external network 50, server 60, and control chip is arrived in the transmission data of Network Interface Module 302 and power supply
201 so that control module 201 is powered by Network Interface Module and receives data.
As shown in Fig. 2 the input of data-interface 40 connects the multi-path digital mould of sensor data acquisition module 10 respectively
Intend the output end of signal processing unit 104 and control chip 201, the output end of data-interface 40 is connected to data memory module
203 input.
As shown in figure 3, control module 40 includes resistance R84~R86, electric capacity C83~C84 and control chip U2, core is controlled
Piece U2 is powered using 3.3V.Control chip U2 VDD pin connection supply voltage 3.3V, VDD pin is connected and is grounded with electric capacity C83,
SDA pin, SCL pin respectively between supply voltage 3.3V series resistance R84 and resistance R85, NRST pin and supply voltage 3.3V it
Between series resistance R86, BOOST pin be grounded, reset switch RESET and resistance C84, VSS pin in parallel between NRST pin and BOOT pin
Ground connection, OSC pin are connected with 8M crystal oscillators Y2.
The control chip U2 of control module 40 is embedded with the software of image co-registration module 202.Data memory module 203 passes through
The control chip U2 connections of DCMII DATA pins and control module 40.
Data-interface 40 is as shown in figure 4, including network chip U1, resistance R35, electric capacity C8, LED LED0 and cable interface
CABLE, network chip U1 is powered using 3.3V, the control chip U2 of network chip U1 ETH_CMD pin link control module 40
RMII_DATA pin, network chip U1 RMII_DATA pin connection control chip U2 ETH_CMD pin, VDD pin connection power supply
Interface 3.3V, VDD pin is connected and is grounded with electric capacity C8, VSS pin ground connection, CABLE pin connected with network cable, and NET_LED pin are successively through two
Connect and be grounded after pole luminous tube LED0, resistance R35, CLK pin connection 24M crystal oscillators Y2.
As shown in figure 5, image data processing unit 1012 includes electric capacity C93 and image real time transfer chip U7, use
3.3V powers, image real time transfer chip U7 1 pin connection power supply 3.3V interfaces, image real time transfer chip U7 1 pin and ground
Between series capacitance C93, image real time transfer chip U7 2 pin connection control chip U2 DCMI_DATA pin, at view data
Manage chip U7 3 pin connection control chip U2 DCMI_CMD pin, 4 pin connection ground.
The image real time transfer chip U7 of image data processing unit 1012 is successively through serial camera control EBI
It is connected to network chip U1's after circuit 1013, multi-path digital analogy signal processing unit 104.
As shown in fig. 6, power module of voltage regulation includes resistance R80~R84, electric capacity C81~C84 and synchronous buck conversion chip
U8, synchronous buck conversion chip U8 models MP1470.Power module of voltage regulation uses 0~12V supply inputs, synchronous buck conversion
Chip U8 VIN pin are connected by resistance R80 with the EN pin of itself, and VIN pin are connected to the ground by electric capacity C81, and VIN pin pass through tantalum
Electric capacity E1 is connected to the ground, tantalum electric capacity E1 positive poles connection power interface 12V, tantalum electric capacity E1 negative poles connection ground.BST pin are through resistance R81
It is connected with the SW pin after electric capacity C82 with itself, SW pin connect after inductance L80, resistance R83, resistance R82 with the FB pin of itself successively
Connect, output 3.3V voltages are drawn between inductance L80 and resistance R83, between 3.3V voltages and ground and be connected to electric capacity C83 and electric capacity
C84, draws between resistance R83 and resistance R82 and is connect through resistance R84.
The specific implementation of the present invention is as follows：
Network Interface Module 302 is connected by RMII interfaces with control chip 201, linear speed 10M/s.
It is connected with each other between server 60, PoE module 30 by PoE interchangers, constitutes external network network 50.Extranets
Network diagram network 50 carries out network data transmission by the standard external network transmission protocol.Network data includes the control that server is sent
Signal and the answer signal for the control module 20 for being sent to server, view data, temperature array data, other sensors data.
Control signal is sent by long-range server, via the Network Interface Module 302 in the incoming PoE module 30 of network, passes through network
The signal pins of interface circuit are incoming to control chip 201, the incoming collection that correspondence transducing signal is performed after parsing after parsing.
The design of this camera meets PoE design specifications, therefore each camera only needs one group of line so that wiring is more
It is simple and cheap.
Infrared array acquisition module 102 gathers infrared image, the floating number temperature battle array that infrared array data format is 16*4
Row；Visible images acquisition module 101 gathers visible images, and image acquisition data form is jpeg format.
User's replaceable sensor uses temperature sensor, humidity sensor, accelerometer etc., temperature sensor, humidity
The one or more therein such as sensor, harmful gas sensor, accelerometer, ultrasonic sensor, pressure sensor, are passed
Sensor supports I2C agreements in itself.
Data handled by data-interface 40 include the picture number for the jpeg format that visible images acquisition module 101 is exported
According to the temperature array data that infrared array acquisition module 102 is exported, the simulation that other sensors data acquisition module 103 is exported
Or digital sensor signal.
The view data for the jpeg format that visible images acquisition module 101 is exported is fast by SCCB bus protocols and DCMI
Fast utilizing camera interface carries out data transmission；The temperature array data that infrared array acquisition module 102 is exported, other sensors data
The simulation or digital sensor signal that acquisition module 103 is exported are carried out data transmission by I2C bus protocols.
Image co-registration module 202 is used to will be seen that light image data and infrared picture data are overlapped, specifically visible
The superposition of light and object multiple spot surface temperature field, is embodied in, and the present invention can measure the continuous multiple spot of body surface in real time
Temperature, so as to reach the measure to body surface Temperature Distribution, and cause the infrared temperature distribution of object with it is tested it is in kind can
See light image correspondence, and can continuously obtain data, obtain the actual two-dimentional absolute temperature distribution map of testee surface each point.
In the case where not using and connecting other sensors data acquisition module 103, work(of the present invention in working condition
Rate is less than 3w, as shown in figure 4, the circuit apparent size that the present invention is formed is 3cm × 3cm × 3cm, its temperature-measuring range is taken the photograph for -20
Family name's degree is to 300 degrees Celsius.
As can be seen here, the present invention is equipped with infrared array acquisition module and realizes the temperature survey of point position, and can pass through I2C buses
Various types of sensors are extended, on-the-spot record visualization, low cost, high efficiency is realized, reaches visible ray and object multiple spot table
The purpose of the Overlapping display in face temperature field, wide application.
Claims (7)
1. a kind of low-power consumption, small size, the outer binocular thermometric camera of expansible visible red, it is characterized in that：Including connecting successively
Sensor data acquisition module (10), data-interface (40), control module (20) and the PoE module (30) connect, sensing data
Acquisition module (10) is through data-interface (40) link control module (20), and control module (20) is through PoE module (30), external network
(50) connection server (60) afterwards, control module (20), data-interface (40) and sensor data acquisition module (10) are by PoE moulds
Block (30) is powered.
2. a kind of low-power consumption according to claim 1, small size, the outer binocular thermometric camera of expansible visible red,
It is characterized in that：The sensor data acquisition module (10) includes visible images acquisition module (101), infrared array collection mould
Block (102), other sensors data acquisition module (103) and multi-path digital analogy signal processing unit (104), it is seen that light figure
As acquisition module (101), infrared array acquisition module (102), other sensors data acquisition module (103) respectively with many ways
Word analogy signal processing unit (104) is connected, and multi-path digital analogy signal processing unit (104) output end is connected to data-interface
(40), by multi-path digital analogy signal processing unit (104) by the visible data of collection, infrared data and other sensors
Data are sent to data-interface (40).
3. a kind of low-power consumption according to claim 2, small size, the outer binocular thermometric camera of expansible visible red,
It is characterized in that：
Described visible images acquisition module (101) includes cmos image sensor (1011), the view data being sequentially connected
Processing unit (1012) and serial camera control bus interface circuit (1013), cmos image sensor (1011) is successively through figure
As data processing unit (1012), serial camera control bus interface circuit (1013) afterwards with multi-path digital analog signal processing
Unit (104) is connected；
Described infrared array acquisition module (102) includes infrared sensor array (1021), the infrared array number being sequentially connected
According to processing unit (1022) and the first I2C interface circuits (1023), infrared sensor array (1021) is successively through infrared array number
It is connected afterwards with multi-path digital analogy signal processing unit (104) according to processing unit (1022), the first I2C interface circuits (1023)；
Described other sensors data acquisition module (103) include be sequentially connected user's replaceable sensor (1031), can
Change sensing data processing unit (1032) and the 2nd I2C interface circuits (1033), user's replaceable sensor (1031) according to
It is secondary after replaceable sensor data processing unit (1032), the 2nd I2C interface circuits (1033) with multi-path digital analog signal
Processing unit (104) is connected；
Described visible images acquisition module (101), infrared array acquisition module (102), other sensors data acquisition module
Modules in block (103) are connected with power module of voltage regulation (105), are powered by power module of voltage regulation (105).
4. a kind of low-power consumption according to claim 3, small size, the outer binocular thermometric camera of expansible visible red,
It is characterized in that：Described user's replaceable sensor (1031) includes temperature sensor, humidity sensor, pernicious gas sensing
Device, accelerometer, ultrasonic sensor and pressure sensor one or more therein, sensor support I2C agreements.
5. a kind of low-power consumption according to claim 1, small size, the outer binocular thermometric camera of expansible visible red,
It is characterized in that：Described control module (20) includes control chip (201), image co-registration module (202) and data memory module
(203), described control chip (201) respectively with image co-registration module (202), data memory module (203), data-interface
(40) and PoE module (30) Network Interface Module (302) connection communication；
Described PoE module (30) includes the power supply module (301) and Network Interface Module (302) being connected, network interface mould
Block (302) is also connected to external network (50), and the control module (20) is arrived in Network Interface Module (302) transmission data and power supply
Control chip (201) so that control module (201) is powered by Network Interface Module (302) and receives data.
6. a kind of low-power consumption according to claim 1, small size, the outer binocular thermometric camera of expansible visible red,
It is characterized in that：The input of described data-interface (40) connects the multi-path digital mould of sensor data acquisition module (10) respectively
Intend the output end of signal processing unit (104) and control chip (201), the output end of data-interface (40) is connected to data storage
The input of module (203), the output end of data memory module (203) is connected to control chip (201).
7. binocular thermometric camera outside the visible red according to claim any one of 1-6, it is characterized in that：The camera
Applied to non-contacting infrared field of temperature measurement and picture control field, -20 degrees Celsius to 300 degrees Celsius of temperature-measuring range.
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| CN201710455995.4A CN107333035A (en) | 2017-06-16 | 2017-06-16 | Low-power consumption, small size, the outer binocular thermometric camera of expansible visible red |
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| CN113179379A (en) * | 2021-04-22 | 2021-07-27 | 太原理工大学 | Visual sensor based on single sensitive device for visible light and near infrared imaging |
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