CN107328754B - Photoelectric synergistic surface plasmon-exciton catalytic reaction device and preparation method thereof - Google Patents

Photoelectric synergistic surface plasmon-exciton catalytic reaction device and preparation method thereof Download PDF

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CN107328754B
CN107328754B CN201710609332.3A CN201710609332A CN107328754B CN 107328754 B CN107328754 B CN 107328754B CN 201710609332 A CN201710609332 A CN 201710609332A CN 107328754 B CN107328754 B CN 107328754B
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孙萌涛
曹恩
林炜铧
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University of Science and Technology Beijing USTB
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Abstract

The invention provides a photoelectric synergistic surface plasmon-exciton catalytic reaction device and a preparation method thereof, and belongs to the technical field of surface catalytic reaction devices. Firstly, thermally evaporating noble metal nano particles on a silicon slice of silicon dioxide/monocrystalline silicon, transferring a two-dimensional semiconductor material onto a noble metal nano particle substrate, and sequentially evaporating gold/chromium nano particles onto a two-dimensional semiconductor material and metal nano particle composite substrate as a source electrode/drain electrode in a thermal evaporation mode according to a chromium-first-and-gold-last sequence, wherein the sizes and gaps of the two electrodes are controllable; and finally, introducing a gate voltage at the bottom of the device by using the base. When the method is used for specifically manufacturing a device, the size of the shelter is convenient to control, so that the size of a gap between the source electrode and the drain electrode is controllable, gaps with different sizes can be designed according to the requirements of specific experiments, the available area of molecular reaction is improved, the local surface plasmon resonance effect is further improved, and the efficiency of surface catalysis reaction is improved.

Description

光电协同表面等离激元-激子催化反应器件及制备方法Optoelectronic synergistic surface plasmon-exciton catalytic reaction device and preparation method

技术领域technical field

本发明涉及表面催化反应器件技术领域,特别是指一种光电协同表面等离激元-激子催化反应器件及制备方法。The invention relates to the technical field of surface catalytic reaction devices, in particular to a photoelectric cooperative surface plasmon-exciton catalytic reaction device and a preparation method.

背景技术Background technique

表面等离激元(SPs)是电磁波(光)与金属(或掺杂半导体)表面内的准自由电子气集体振荡相干耦合后形成的一种共振激发元。通常把能局域于金属纳米颗粒表面的电子振荡称为局域表面等离激元共振(LSPR)。在纳米尺度范围,等离激元诱导的催化反应占据主导地位,通常我们把它称作等离激元诱导化学反应。众所周知,等离激元衰减而产生的热电子在等离激元诱导的化学反应中扮演着重要的角色。当热电子暂时吸附于目标分子时,等离激元诱导化学反应中的分子的中性势能面(PES)被注入电子,因此使分子的反应势垒显著降低,同时热电子还能暂时起到连接分子的作用。同时,热电子的动能可以有效地转移给目标分子,为催化反应提供能量;热电子还能作为催化反应所需的能量推动分子反应的发生。Surface plasmons (SPs) are resonant excitation elements formed by coherent coupling of electromagnetic waves (light) and quasi-free electron gas collective oscillations in the surface of metals (or doped semiconductors). The electronic oscillation that can be localized on the surface of metal nanoparticles is usually called localized surface plasmon resonance (LSPR). In the nanoscale range, plasmon-induced catalytic reactions dominate, and we usually call it plasmon-induced chemical reactions. It is well known that hot electrons generated by plasmon decay play an important role in plasmon-induced chemical reactions. When the hot electrons are temporarily adsorbed on the target molecule, the neutral potential energy surface (PES) of the molecule in the plasmon-induced chemical reaction is injected with electrons, so that the reaction barrier of the molecule is significantly lowered, and the hot electrons can also temporarily act The role of linker molecules. At the same time, the kinetic energy of hot electrons can be effectively transferred to target molecules to provide energy for catalytic reactions; hot electrons can also be used as the energy required for catalytic reactions to promote molecular reactions.

但是,如文献1(Langmuir,2011;27[17]:10677)中的数据可以看出等离激元衰减产生的热电子的态密度非常低,寿命短,因此等离激元诱导的表面催化反应的效率相对低下。为了克服这些缺点,表面等离激元-激子耦合相互作用的出现提供了新思路,因为激子的存在,耦合体系产生的热电子更容易积累了,并且其寿命相较仅等离激元时大幅提升了,从飞秒提升到了皮秒。另一方面,局域表面等离激元共振效应能使局域电磁场大大增强,从而能够进一步促进激子的产生,增加催化反应的效率。总而言之,等离激元-激子耦合共驱动表面催化反应的效率要远高于仅表面等离激元诱导的催化反应。However, as can be seen from the data in Document 1 (Langmuir, 2011; 27[17]:10677), the hot electrons generated by plasmon decay have very low density of states and short lifetimes, so plasmon-induced surface catalysis The efficiency of the reaction is relatively low. In order to overcome these shortcomings, the emergence of surface plasmon-exciton coupling interaction provides a new idea, because of the existence of excitons, the hot electrons generated by the coupling system are easier to accumulate, and their lifetime is compared with only plasmon The time has been greatly improved, from femtoseconds to picoseconds. On the other hand, the local surface plasmon resonance effect can greatly enhance the local electromagnetic field, which can further promote the generation of excitons and increase the efficiency of catalytic reactions. All in all, the efficiency of plasmon-exciton coupling co-driven surface catalytic reactions is much higher than that induced by surface plasmons alone.

但如今常见的引入激子的方法主要是通过光诱导。如文献2(Materials TodayEnergy,2017;5:72)所报道的,通过激光和二维半导体材料的相互作用,光诱导产生激子与等离激元发生耦合作用,从而驱动表面催化反应的进行。But today's common method of introducing excitons is mainly through light induction. As reported in literature 2 (Materials Today Energy, 2017; 5:72), through the interaction of laser and two-dimensional semiconductor materials, light-induced excitons are coupled with plasmons to drive surface catalytic reactions.

而其中涉及到的,常见的电学器件的设计主要局限于微纳尺寸,如文献3(Nature,2008;451:163)中所报道的,可观测的范围小,加工难度高,成本高,普遍使用的拉曼散射光谱仪器难以对其进行精准定位。The design of common electrical devices involved in it is mainly limited to the micro-nano size, as reported in Document 3 (Nature, 2008; 451:163), the observable range is small, the processing is difficult, and the cost is high. It is difficult to precisely locate it with the Raman scattering spectroscopy instrument used.

发明内容Contents of the invention

本发明要解决的技术问题是提供一种光电协同表面等离激元-激子催化反应器件及制备方法,使在光场调控表面等离激元-激子耦合催化反应的同时引入电场作用,并且能够改善器件设计使催化反应能够更低价并有效得进行。The technical problem to be solved in the present invention is to provide a photoelectric synergistic surface plasmon-exciton catalytic reaction device and a preparation method, so that the electric field is introduced while the optical field regulates the surface plasmon-exciton coupling catalytic reaction, And device design can be improved so that catalytic reactions can be performed more cheaply and efficiently.

该器件包括硅片、二维半导体材料和源极/漏极,硅片上覆盖贵金属纳米颗粒,贵金属纳米颗粒上覆盖二维半导体材料,源极/漏极位于二维半导体材料上,硅片置于底座上,底座底部引入门电压。The device includes a silicon wafer, a two-dimensional semiconductor material and a source/drain, the silicon wafer is covered with noble metal nanoparticles, the noble metal nanoparticles are covered with a two-dimensional semiconductor material, the source/drain is located on the two-dimensional semiconductor material, and the silicon wafer is placed On the base, the gate voltage is introduced at the bottom of the base.

其中,硅片包括SiO2层和Si层,Si层上覆盖SiO2层。Wherein, the silicon wafer includes a SiO 2 layer and a Si layer, and the Si layer is covered with a SiO 2 layer.

该器件的制备方法包括如下步骤:The preparation method of the device comprises the following steps:

S1:在二氧化硅/单晶硅的硅片上热蒸发贵金属纳米颗粒,得到贵金属纳米材料基底;根据适合的激光波长,用热蒸发的方法沉积不同厚度的金属纳米颗粒,例如用532nm激光时可热蒸发10nm的银纳米颗粒;S1: Thermally evaporate noble metal nanoparticles on silicon dioxide/monocrystalline silicon wafers to obtain noble metal nanomaterial substrates; according to the appropriate laser wavelength, deposit metal nanoparticles with different thicknesses by thermal evaporation, for example, when using a 532nm laser 10nm silver nanoparticles can be thermally evaporated;

S2:将二维半导体材料转移到S1中制得的贵金属纳米颗粒基底上,并进行清洗保证表面清洁;S2: transfer the two-dimensional semiconductor material to the noble metal nanoparticle substrate prepared in S1, and wash to ensure the surface is clean;

S3:将金/铬纳米颗粒通过热蒸发的方式按照先铬后金的顺序蒸发到S2中制得的二维半导体材料与金属纳米颗粒复合基底上作为源极/漏极;S3: Evaporate gold/chromium nanoparticles onto the composite substrate of two-dimensional semiconductor material and metal nanoparticles prepared in S2 in the order of first chromium and then gold by thermal evaporation as source/drain;

S4:利用底座在S3中制成的器件底部引入门电压。(一般硅片上SiO2层的击穿电压为110V)。S4: using the base to introduce gate voltage at the bottom of the device fabricated in S3. (Generally the breakdown voltage of the SiO 2 layer on the silicon wafer is 110V).

其中,S1中热蒸发的贵金属纳米颗粒厚度为1-100nm。Wherein, the thickness of the noble metal nanoparticles thermally evaporated in S1 is 1-100 nm.

S3中铬的厚度为5nm,金的厚度为80-100nm。The thickness of chromium in S3 is 5nm, and the thickness of gold is 80-100nm.

S3中源极/漏极两电极的尺寸和间隙能够调节,目标分子位于两电极之间。The size and gap of the source/drain electrodes in S3 can be adjusted, and the target molecule is located between the two electrodes.

本发明器件可用于如下测定:Device of the present invention can be used for following determination:

(1)利用本发明中的器件测定不同门电压(-60V~60V)和偏压下(-1.0V~1.0V)的电流图;(1) Utilize the device in the present invention to measure the current diagram under different gate voltages (-60V~60V) and bias voltage (-1.0V~1.0V);

(2)利用本发明中的器件测定不同激光波长(200nm~1000nm)和光强(5uW~10mW)下的催化反应过程的拉曼光谱图;(2) Utilize the device in the present invention to measure the Raman spectrogram of the catalytic reaction process under different laser wavelengths (200nm~1000nm) and light intensity (5uW~10mW);

(3)利用本发明中的器件测定某一固定激光波长(200nm~1000nm)和某一光强(5uW~10mW)以及某一固定门电压(-60V~60V)下,偏压(-1.0V~1.0V)驱动的表面催化反应过程的拉曼光谱图;(3) under a certain fixed laser wavelength (200nm~1000nm) and a certain light intensity (5uW~10mW) and a certain fixed gate voltage (-60V~60V) measured by the device in the present invention, the bias voltage (-1.0V ~1.0V) driven Raman spectrum of surface catalytic reaction process;

(4)利用本发明中的器件测定不同激光波长(200nm~1000nm)和光强(5uW~10mW),不同门电压(-60V~60V)和偏压(-1.0V~1.0V)下的表面催化反应过程的拉曼光谱图。(4) Utilize the device in the present invention to measure different laser wavelengths (200nm~1000nm) and light intensity (5uW~10mW), the surface under different gate voltages (-60V~60V) and bias voltage (-1.0V~1.0V) Raman spectrum of the catalytic reaction process.

本发明的上述技术方案的有益效果如下:The beneficial effects of above-mentioned technical scheme of the present invention are as follows:

(1)在具体制作器件时,由于掩体的尺寸方便控制,所以源极/漏极间的间隙尺寸可控,可根据具体实验的需求设计不同尺寸的间隙,提高分子反应的可利用区域,进而提高局域表面等离激元共振效应,提高表面催化反应的效率;(1) When making the device, the size of the gap between the source and the drain is controllable due to the convenient control of the size of the shelter, and different sizes of gaps can be designed according to the needs of specific experiments to increase the available area for molecular reactions, and then Improve the local surface plasmon resonance effect and improve the efficiency of surface catalytic reactions;

(2)只要二维半导体材料的转移得当,器件的尺寸非常容易控制,因此大大减少了器件的制作成本,同时更容易将电场调控引入到体系中;(2) As long as the two-dimensional semiconductor material is properly transferred, the size of the device is very easy to control, thus greatly reducing the manufacturing cost of the device, and it is easier to introduce electric field regulation into the system;

(3)该器件的结构设计适合光电协同调控,在引入电场的同时,入射光源的调控作用不会受到影响。(3) The structural design of the device is suitable for photoelectric coordinated control, and the control function of the incident light source will not be affected when the electric field is introduced.

此外,本发明光电协同调控表面等离激元-激子耦合催化反应的优点如下:In addition, the advantages of the photoelectric cooperative regulation of the surface plasmon-exciton coupling catalytic reaction of the present invention are as follows:

(1)在保证不影响激光调控表面等离激元-激子耦合催化反应的同时,引入了电场调控表面等离激元-激子耦合催化反应,因此,可调控的参数大大增加,使表面催化反应的驱动方式变得多样。同时还能测量器件的电学性能,从而解释表面催化反应性能的提高;(1) While ensuring that the laser-regulated surface plasmon-exciton coupling catalytic reaction is not affected, an electric field is introduced to regulate the surface plasmon-exciton coupling catalytic reaction. Therefore, the adjustable parameters are greatly increased, making the surface The driving methods of catalytic reactions have become diverse. At the same time, the electrical performance of the device can be measured to explain the improvement in the performance of the surface catalytic reaction;

(2)通过调节门电压,可以调控二维半导体材料(单层石墨烯等)和贵金属纳米颗粒(银、金等)的耦合体系的费米面,进一步提高热电子的态密度,提高了表面催化反应的效率;(2) By adjusting the gate voltage, the Fermi surface of the coupling system of two-dimensional semiconductor materials (single layer graphene, etc.) the efficiency of the reaction;

(3)通过调节偏压产生电流,让等离激元产生的热电子获得更大的动能,推动表面催化反应的发生,并且提高催化效率;(3) By adjusting the bias voltage to generate current, the hot electrons generated by plasmons can obtain greater kinetic energy, promote the occurrence of surface catalytic reactions, and improve catalytic efficiency;

(4)更有利于深入分析等离激元和激子耦合作用的物理原理,以及电子在催化反应中的参与机理。(4) It is more conducive to in-depth analysis of the physical principles of the coupling between plasmons and excitons, as well as the participation mechanism of electrons in catalytic reactions.

附图说明Description of drawings

图1为本发明的光电协同表面等离激元-激子催化反应器件结构示意图;Fig. 1 is a schematic structural diagram of a photoelectric synergistic surface plasmon-exciton catalytic reaction device of the present invention;

图2为本发明表面等离激元-激子耦合催化反应器件上未吸附和吸附目标分子(4NBT)时的电学测量图,(a)为未吸附目标分子(4NBT)时的门电压和偏压调控电流变化3D连续图,(b)为吸附目标分子(4NBT)时的门电压和偏压调控电流变化3D连续图,(c)为未吸附目标分子(4NBT)时的不同门电压下的偏压-电流图,(d)为吸附目标分子(4NBT)时的不同门电压下的偏压-电流图,(e)为未吸附目标分子(4NBT)且偏压VBias=0.1V时的门电压-电导图,(f)为吸附目标分子(4NBT)且偏压VBias=0.1V时时的门电压-电导图;Fig. 2 is the electrical measurement diagram of the surface plasmon-exciton coupling catalytic reaction device of the present invention when no target molecule is adsorbed and adsorbed (4NBT), (a) is the gate voltage and bias when the target molecule is not adsorbed (4NBT) 3D continuous graph of voltage-regulated current change, (b) is the 3D continuous graph of the gate voltage and bias voltage-regulated current change when the target molecule is adsorbed (4NBT), (c) is the gate voltage under different gate voltages when the target molecule is not adsorbed (4NBT) Bias-current diagram, (d) is the bias-current diagram under different gate voltages when the target molecule is adsorbed (4NBT), (e) is when the target molecule is not adsorbed (4NBT) and the bias voltage V Bias = 0.1V Gate voltage-conductance diagram, (f) is the gate voltage-conductance diagram when the target molecule (4NBT) is adsorbed and the bias voltage V Bias =0.1V;

图3是不同激光功率调控下表面等离激元-激子耦合催化反应器件上的表面催化反应过程的拉曼光谱图;Figure 3 is the Raman spectrum of the surface catalysis reaction process on the surface plasmon-exciton coupled catalytic reaction device under different laser power regulation;

图4是光电协同表面等离激元-激子耦合催化反应过程的拉曼光谱图及原理图(偏压调控),(a)为固定激光功率下且门电压为0V时偏压调控的表面等离激元-激子耦合催化反应,(b)为固定激光功率下且门电压为40V时偏压调控的表面等离激元-激子耦合催化反应,(c)为固定激光光强下且门电压为-40V时偏压调控的表面等离激元-激子耦合催化反应,(d)为光电协同表面等离激元-激子耦合催化反应的原理图(偏压调控),其中三角形内白色区域为空穴,黑色填充区域为电子;Figure 4 is the Raman spectrum and schematic diagram (bias control) of photoelectric synergistic surface plasmon-exciton coupling catalytic reaction process, (a) is the surface with bias control under fixed laser power and gate voltage of 0V Plasmon-exciton coupling catalytic reaction, (b) is the surface plasmon-exciton coupling catalytic reaction under the fixed laser power and the gate voltage is 40V, and (c) is the fixed laser light intensity And when the gate voltage is -40V, the surface plasmon-exciton coupling catalytic reaction controlled by the bias voltage, (d) is the schematic diagram of the optoelectronic cooperative surface plasmon-exciton coupling catalytic reaction (bias control), where The white areas in the triangle are holes, and the black filled areas are electrons;

图5是光电协同表面等离激元-激子耦合催化反应过程的拉曼光谱图及原理图(门电压调控),(a)为固定激光功率下且偏压为0V时门电压调控的表面等离激元-激子耦合催化反应,(b)为固定激光功率下且偏压为1V时门电压调控的表面等离激元-激子耦合催化反应,(c)为固定激光光强下且偏压为-1V时门电压调控的表面等离激元-激子耦合催化反应,(d)为光电协同表面等离激元-激子耦合催化反应的原理图(门电压调控),其中三角形内白色区域为空穴,黑色填充区域为电子。Figure 5 is the Raman spectrum and schematic diagram (gate voltage regulation) of photoelectric synergistic surface plasmon-exciton coupling catalytic reaction process, (a) is the surface with gate voltage regulation under fixed laser power and bias voltage of 0V Plasmon-exciton coupling catalytic reaction, (b) is the surface plasmon-exciton coupling catalytic reaction under the fixed laser power and the bias voltage is 1V, and the gate voltage is regulated, (c) is the fixed laser light intensity And when the bias voltage is -1V, the surface plasmon-exciton coupling catalytic reaction controlled by the gate voltage, (d) is the schematic diagram of the optoelectronic cooperative surface plasmon-exciton coupling catalytic reaction (gate voltage control), where The white areas in the triangle are holes, and the black filled areas are electrons.

其中:1-入射激光;2-源极/漏极;3-目标分子;4-二维半导体材料;5-银纳米颗粒;6-SiO2层;7-Si层。Among them: 1-incident laser; 2-source/drain; 3-target molecule; 4-two-dimensional semiconductor material; 5-silver nanoparticles; 6-SiO 2 layer; 7-Si layer.

具体实施方式Detailed ways

为使本发明要解决的技术问题、技术方案和优点更加清楚,下面将结合附图及具体实施例进行详细描述。In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

本发明提供一种光电协同表面等离激元-激子催化反应器件及制备方法。The invention provides a photoelectric cooperative surface plasmon-exciton catalytic reaction device and a preparation method.

1.光电协同表面等离激元-激子耦合催化反应器件的制作:1. Fabrication of optoelectronic synergistic surface plasmon-exciton coupled catalytic reaction devices:

1)在室温真空度为8.6x10-5Pa的环境中,用热蒸发的方法以

Figure BDA0001359138750000051
的速率将10nm厚度的银纳米颗粒5沉积到有300nm厚二氧化硅的硅片上;1) In an environment with a vacuum of 8.6x10 -5 Pa at room temperature, use thermal evaporation to
Figure BDA0001359138750000051
Silver nanoparticles 5 with a thickness of 10nm are deposited onto a silicon wafer with a thickness of 300nm of silicon dioxide at a rate of 100nm;

2)在CVD生长的铜基单层石墨烯上旋涂PMMA(3000rpm,1min)后,放入0.5Mol/L三氯化铁溶液中腐蚀基底4小时以上直到除去铜基,得到二维半导体材料4,用去离子水清洗4次以上后转移到有银纳米颗粒5的基底上,最后用丙酮除去石墨烯表面的PMMA;2) After spin-coating PMMA (3000rpm, 1min) on the CVD-grown copper-based single-layer graphene, put it in a 0.5Mol/L ferric chloride solution to corrode the substrate for more than 4 hours until the copper-based substrate is removed to obtain a two-dimensional semiconductor material 4, after washing with deionized water for more than 4 times, transfer to the substrate with silver nanoparticles 5, and finally remove the PMMA on the graphene surface with acetone;

3)将单层石墨烯-银纳米颗粒基底多次清洗吹干后,用热蒸发将源极/漏极2两电极加在单层石墨烯-银纳米颗粒基底上的两侧,源极/漏极2两电极间隙为60微米,沉淀金属的真空度为1.10x10-5Pa。具体步骤包括以下部分:首先将一根60微米的线放置在单层石墨烯-银纳米颗粒基底上,然后以

Figure BDA0001359138750000053
的速率沉积5nm厚的铬纳米颗粒,最后以
Figure BDA0001359138750000052
沉积90nm厚的金薄膜。光电协同表面等离激元-激子耦合催化反应器件的设计见图1,上方为入射激光1,源极/漏极2间为目标分子3,银纳米颗粒5热蒸发在SiO2层6上,SiO2层6下为Si层7。3) After cleaning and drying the single-layer graphene-silver nanoparticle substrate several times, add source/drain electrode 2 two electrodes on the both sides of the single-layer graphene-silver nanoparticle substrate with thermal evaporation, source/drain electrode 2 The gap between the two electrodes of the drain 2 is 60 microns, and the vacuum degree of the deposited metal is 1.10x10 -5 Pa. The specific steps include the following parts: First, a 60-micron wire is placed on a single-layer graphene-silver nanoparticle substrate, and then
Figure BDA0001359138750000053
Deposit 5nm thick chromium nanoparticles at a rate of
Figure BDA0001359138750000052
A 90 nm thick gold film was deposited. The design of photoelectric synergistic surface plasmon-exciton coupled catalytic reaction device is shown in Figure 1, the incident laser light 1 is on the top, the target molecule 3 is between the source/drain electrodes 2, and the silver nanoparticles 5 are thermally evaporated on the SiO 2 layer 6 , SiO 2 layer 6 under the Si layer 7.

2.光电协同表面等离激元-激子耦合催化反应的测量:2. Measurement of photoelectric synergistic surface plasmon-exciton coupled catalytic reactions:

1)为了保护目标分子,在真空探针台上测定该器件未吸附和吸附目标分子时,在不同门电压和偏压下的电流变化趋势,如图2(a-d)所示。以及未吸附和吸附目标分子时,在偏压为0.1V时的电导随门电压的变化图,如附图2(e-f)。其中,通过将单层石墨烯-银纳米颗粒基底浸泡在浓度为1x10-3M的4NBT中3-4小时使分子能够均匀的吸附到器件表面,在浸泡后用乙醇清洗冲洗,并且用高纯氮气使之干燥。图2证明了单层石墨烯和银纳米颗粒之间存在耦合相互作用,即表面等离激元和激子之间存在耦合相互作用,并且直接验证了本发明中的新型器件适用于电学测量;1) In order to protect the target molecules, the current variation trend of the device under different gate voltages and bias voltages was measured on a vacuum probe station when the device was not adsorbed and adsorbed target molecules, as shown in Figure 2(ad). And when the target molecule is not adsorbed and adsorbed, the conductance changes with the gate voltage when the bias voltage is 0.1V, as shown in Figure 2 (ef). Among them, the single-layer graphene-silver nanoparticle substrate was soaked in 4NBT with a concentration of 1x10 -3 M for 3-4 hours so that the molecules could be evenly adsorbed to the surface of the device, washed with ethanol after soaking, and washed with high-purity Nitrogen to dry. Figure 2 proves that there is a coupling interaction between single-layer graphene and silver nanoparticles, that is, there is a coupling interaction between surface plasmons and excitons, and directly verifies that the novel device in the present invention is suitable for electrical measurements;

2)调控532nm激光(光强约5mW)衰减强度的不同(5.36uW/47.42uW/496.82uW/1.19Mw/2.37mW/4.93mW),利用本发明中的新型器件测定4NBT分子在不同光强下催化反应生成DMAB分子的分子反应动力学过程的拉曼光谱图,见图3,其中积分时间为5秒,1109cm-1和1306cm-1属于4NBT的拉曼特征峰,而1390cm-1and 1438cm-1属于DMAB拉曼特征峰。图4直接验证了本发明中的新型器件适用于激光调控表面等离激元-激子耦合催化反应的测量,同时可得在532nm激光强度为5.36uW时,表面催化反应无法发生,为光电协同调控催化反应的发生提供对照组;2) Regulate the difference in attenuation intensity (5.36uW/47.42uW/496.82uW/1.19Mw/2.37mW/4.93mW) of the 532nm laser (light intensity about 5mW), and use the novel device of the present invention to measure 4NBT molecules under different light intensities The Raman spectrogram of the molecular reaction kinetics process of the catalytic reaction to generate DMAB molecules is shown in Figure 3, where the integration time is 5 seconds, 1109cm -1 and 1306cm -1 belong to the Raman characteristic peaks of 4NBT, and 1390cm -1 and 1438cm - 1 belongs to the characteristic peak of DMAB Raman. Figure 4 directly verifies that the new device in the present invention is suitable for the measurement of laser-regulated surface plasmon-exciton coupled catalytic reactions. At the same time, it can be obtained that when the 532nm laser intensity is 5.36uW, the surface catalytic reaction cannot occur, which is photoelectric synergy Regulating the occurrence of catalytic reactions provides a control group;

3)532nm激光强度为5.36uW时,测量门电压分别为0V/40V时,偏压调控表面催化反应的发生,见图4(a-b)。门电压为-40V的数据作为对照组用于调查表面等离激元-激子耦合效应中电子和空穴的转移过程,见图4(c)。图4(d)为偏压调控等离激元-激子耦合催化反应中电子转移过程的原理图。3) When the 532nm laser intensity is 5.36uW, when the measured gate voltage is 0V/40V, the bias voltage regulates the surface catalytic reaction, see Figure 4 (a-b). The data with a gate voltage of -40V was used as a control group to investigate the transfer process of electrons and holes in the surface plasmon-exciton coupling effect, as shown in Figure 4(c). Figure 4(d) is a schematic diagram of the electron transfer process in the bias-regulated plasmon-exciton coupled catalytic reaction.

4)532nm激光强度为5.36uW时,测量偏压分别为0V/1V/-1V时,门电压调控表面催化反应的发生,见图5(a-c)。图5(d)为门电压调控等离激元-激子耦合催化反应中电子转移过程的原理图。4) When the 532nm laser intensity is 5.36uW, when the measurement bias voltage is 0V/1V/-1V respectively, the gate voltage regulates the surface catalytic reaction, see Figure 5(a-c). Figure 5(d) is a schematic diagram of the electron transfer process in the plasmon-exciton coupled catalytic reaction regulated by the gate voltage.

以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明所述原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above description is a preferred embodiment of the present invention, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, these improvements and modifications It should also be regarded as the protection scope of the present invention.

Claims (4)

1.一种光电协同表面等离激元-激子催化反应器件,其特征在于:包括硅片、二维半导体材料(4)、源极/漏极(2)和入射激光(1),硅片上覆盖贵金属纳米颗粒,贵金属纳米颗粒上覆盖二维半导体材料(4),源极/漏极(2)位于二维半导体材料(4)上,硅片置于底座上,底座底部引入门电压;1. A photoelectric synergistic surface plasmon-exciton catalytic reaction device, characterized in that it includes a silicon wafer, a two-dimensional semiconductor material (4), a source/drain (2) and an incident laser (1), silicon The chip is covered with noble metal nanoparticles, the noble metal nanoparticles are covered with a two-dimensional semiconductor material (4), the source/drain (2) is located on the two-dimensional semiconductor material (4), the silicon chip is placed on the base, and the gate voltage is introduced at the bottom of the base ; 所述源极/漏极(2)的两电极尺寸和间隙能够调节,目标分子(3)位于两电极之间,所述贵金属纳米颗粒厚度为1-100nm。The size and gap between the two electrodes of the source/drain (2) can be adjusted, the target molecule (3) is located between the two electrodes, and the thickness of the noble metal nanoparticles is 1-100nm. 2.根据权利要求1所述的光电协同表面等离激元-激子催化反应器件,其特征在于:所述硅片包括SiO2层(6)和Si层(7),其中,Si层(7)上覆盖SiO2层(6)。2. The optoelectronic synergistic surface plasmon-exciton catalytic reaction device according to claim 1, characterized in that: the silicon wafer comprises a SiO2 layer (6) and a Si layer (7), wherein the Si layer ( 7) Covered with SiO 2 layer (6). 3.根据权利要求1所述的光电协同表面等离激元-激子催化反应器件的制备方法,其特征在于:包括如下步骤:3. The method for preparing a photoelectric synergistic surface plasmon-exciton catalytic reaction device according to claim 1, characterized in that: comprising the following steps: S1:在二氧化硅或单晶硅的硅片上热蒸发贵金属纳米颗粒,得到贵金属纳米材料基底;S1: Thermally evaporate noble metal nanoparticles on a silicon wafer of silicon dioxide or single crystal silicon to obtain a noble metal nanomaterial substrate; S2:将二维半导体材料转移到S1中制得的贵金属纳米颗粒基底上,并进行清洗保证表面清洁;S2: transfer the two-dimensional semiconductor material to the noble metal nanoparticle substrate prepared in S1, and wash to ensure the surface is clean; S3:将金/铬纳米颗粒通过热蒸发的方式按照先铬后金的顺序蒸发到S2中制得的二维半导体材料与金属纳米颗粒复合基底上作为源极/漏极;S3: Evaporate gold/chromium nanoparticles onto the composite substrate of two-dimensional semiconductor material and metal nanoparticles prepared in S2 in the order of first chromium and then gold by thermal evaporation as source/drain; S4:利用底座在S3中制成的器件底部引入门电压。S4: using the base to introduce gate voltage at the bottom of the device fabricated in S3. 4.根据权利要求3所述的光电协同表面等离激元-激子催化反应器件制备方法,其特征在于:所述S3中铬的厚度为5nm,金的厚度为80-100nm。4. The photoelectric synergistic surface plasmon-exciton catalytic reaction device preparation method according to claim 3, characterized in that: the thickness of chromium in the S3 is 5 nm, and the thickness of gold is 80-100 nm.
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