Building waste multi-layer board thickness classifier
Technical Field
The invention relates to mechanical equipment, in particular to a thickness classifier for waste and old building multilayer boards.
Background
As is known, the recycling and reprocessing of waste and old building multilayer boards is a production mode which saves resources and is beneficial to environmental protection, at present, in the processing process of the waste and old multilayer boards, the thickness classification of the multilayer boards is not carried out, the multilayer boards with different thicknesses need to be subjected to fixed-thickness polishing in the processing process, and thus a large amount of raw materials are wasted and a large amount of labor and energy are consumed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the thickness classifier for the waste and old multilayer boards for buildings, which can classify the thickness of the multilayer boards, saves raw materials and energy, is simple to operate and has voice broadcasting and video display functions. The specific technical scheme is as follows: a thickness classifier for waste and old multi-layer boards for building comprises an upper frame, a lower frame, a power amplifier, a loudspeaker and a display screen, wherein a waveform operating table is arranged on a plane connected with the upper frame and the lower frame, a fixed plate is fixedly connected with the rear end of the waveform operating table, a photoelectric switch is installed on the upper edge of the fixed plate, a fixed frame is connected with the upper middle part of the fixed plate and the lower part of the table surface of the upper frame, a swing arm seat is fixedly connected with the right front lower part of the table surface of the upper frame, one end of a swing arm is sleeved in the swing arm seat through a pin shaft, a pressure spring is fixedly connected with the middle part of the swing arm, the other end of the pressure spring is fixedly connected with the fixed frame, a roller frame is fixedly connected with the other end of the swing arm, rollers are sleeved in the roller frame through rollers, pull rings are arranged at the two ends of the roller frame, The microphone is connected with a measurement control circuit.
The measurement control circuit comprises STM8S207C6 (embedded microcontroller), TM1639 (special circuit for LED drive control), Header4, 74HC595 (CMOS device with silicon structure), MC74HC14AD (six-phase reverse Schmitt trigger), Header5X2, XH2.54-5A, PM66 (voice chip), NS4158 (power amplifier), STM8S207C6 with its pin 1 connected to a reset circuit composed of R17 and C18 with its pins 2 and 3 connected to a crystal oscillator circuit composed of C19, C20 and Y1, pins 4, 5, 14 and 31 connected to ground, pin 6 connected to ground through C16, pins 7, 8, 13 and 32 connected to DC power supply circuit VCC, pin 9 connected to U1A, pin 10 connected to U1B, pin 21 connected U1C, pin 22 connected U1D, pin 26 connected U1, pin E connected to U E, pin 27 connected to VCC 1, pin 9 connected to power supply circuit, PM 4172 connected to PM 4172R 19, PM 4172 connected to PM 12, 12 connected to power supply circuit 12, 12 connected to voice chip 12, 12 connected to voice chip, STM8S207C6 has its pin 23 connected to U2C, its pin 24 connected to U2B, its pin 25 connected to U2A, its pins 28, 29, 30 connected to pins 6, 7, 8 of U7TM1639, its pins 33, 34, 41 connected to pins 6, 7, 8 of U8TM1639, its pins 43, 44, 45 connected to pins 6, 7, 8 of U9TM1639, its pins 46, 47, 48 connected to pins 6, 7, 8 of U6TM1639, its pins 38, 39 connected to DC power source VCC through R27, R25, its pin 42 connected to P9 pin 2, P9 is a burn program interface, U6TM1639 connected to control D4, D5, U7TM1639 connected to control D6, D7 and composed of S1-S8 for key scan and key scan data, TM 8D 1639 connected to control register 9, U589 connected to control D8.
The direct current power supply circuit consists of D1, D2, R11, R12, R13, C16, TVS1, ZD1, C13, LM259612.0 (switching voltage regulator), D3, L1, C15 and C14 and supplies direct current to all corresponding positions, and the 5V output end of the direct current power supply circuit is connected with the 3 pins of P1, R1 and P3, the 3 pins of R4 and P5 and R27.
In order to facilitate the moving and processing, universal wheels can be additionally arranged at the bottom of the lower rack.
According to the technical scheme, during classification work, the wood boards are placed on a waveform operating table and pushed, the rollers are lifted and sensed by a photoelectric switch in the pushing process, the photoelectric switch is started, measured data are transmitted to an STM8S207C6 (embedded microcontroller) through a stretching displacement sensor, the data are transmitted to a display, a power amplifier and a loudspeaker after being processed, workers can accurately classify and stack the multilayer boards through sound or a display screen, the multilayer boards are classified according to the thickness by burning a program interface before the machine works, and the processed data are classified into ten grades according to different thickness sizes. After the building waste multi-layer boards are classified, the same-grade splicing processing can be carried out according to the classified grades during processing, so that the produced boards are basically not wasted during polishing processing, and the required power is greatly reduced. The invention can completely achieve the invention aims of classifying the thickness of the multilayer board, saving raw materials and energy, having simple operation and having voice broadcasting and video display.
Drawings
FIG. 1 is a schematic structural diagram of a thickness classifier for waste and old multi-layer boards for buildings according to the invention;
FIG. 2 is a schematic structural diagram of a construction waste multi-layer board thickness classifier in a right view;
FIG. 3 is a schematic diagram of a measurement control circuit of the waste multi-layer board thickness classifier for building of the invention;
fig. 4 is a schematic diagram of a measurement control wiring circuit of the building waste multilayer board thickness classifier.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1, referring to fig. 1, fig. 2, fig. 3, and fig. 4, a thickness classifier for waste and old building multi-layer boards comprises an upper frame 11, a lower frame 1, a power amplifier 2, a microphone 3, and a display 9, wherein a waveform operation platform 16 is disposed on a plane connecting the upper and lower frames, a fixing plate 17 is fixedly connected to a rear end of the waveform operation platform, a photoelectric switch 4 is mounted on an upper edge of the fixing plate, a fixing frame 8 is disposed below a top surface of the upper frame, a swing arm seat 12 is fixedly connected to a front and lower portion of the top surface of the upper frame, a swing arm is sleeved in the swing arm seat by a pin 13, a pressure spring 10 is fixedly connected to a middle portion of the swing arm, the other end of the pressure spring is fixedly connected to the fixing frame, a roller frame 18 is fixedly connected to the other end of the swing arm 14, a roller 15 is sleeved in the roller frame by a roller 7, pull rings 6 are disposed at both ends of the roller, pull rings of, the pull rope displacement sensor, the power amplifier, the display screen and the loudspeaker are connected with a measurement control circuit.
The measurement control circuit comprises STM8S207C6 (embedded microcontroller), TM1639 (special circuit for LED drive control), Header4, 74HC595 (CMOS device with silicon structure), MC74HC14AD (six-phase reverse Schmitt trigger), Header5X2, XH2.54-5A, PM66 (voice chip), NS4158 (power amplifier), STM8S207C6 with its pin 1 connected to a reset circuit composed of R17 and C18 with its pins 2 and 3 connected to a crystal oscillator circuit composed of C19, C20 and Y1, pins 4, 5, 14 and 31 connected to ground, pin 6 connected to ground through C16, pins 7, 8, 13 and 32 connected to DC power supply circuit VCC, pin 9 connected to U1A, pin 10 connected to U1B, pin 21 connected U1C, pin 22 connected U1D, pin 26 connected U1, pin E connected to U E, pin 27 connected to VCC 1, pin 9 connected to power supply circuit, PM 4172 connected to PM 4172R 19, PM 4172 connected to PM 12, 12 connected to power supply circuit 12, 12 connected to voice chip 12, 12 connected to voice chip, STM8S207C6 has its pin 23 connected to U2C, its pin 24 connected to U2B, its pin 25 connected to U2A, its pins 28, 29, 30 connected to pins 6, 7, 8 of U7TM1639, its pins 33, 34, 41 connected to pins 6, 7, 8 of U8TM1639, its pins 43, 44, 45 connected to pins 6, 7, 8 of U9TM1639, its pins 46, 47, 48 connected to pins 6, 7, 8 of U6TM1639, its pins 38, 39 connected to DC power source VCC through R27, R25, its pin 42 connected to P9 pin 2, P9 is a burn program interface, U6TM1639 connected to control D4, D5, U7TM1639 connected to control D6, D7 and composed of S1-S8 for key scan and key scan data, TM 8D 1639 connected to control register 9, U589 connected to control D8.
The direct current power supply circuit consists of D1, D2, R11, R12, R13, C16, TVS1, ZD1, C13, LM259612.0 (switching voltage regulator), D3, L1, C15 and C14 and supplies direct current to all corresponding positions, and the 5V output end of the direct current power supply circuit is connected with the 3 pins of P1, R1 and P3, the 3 pins of R4 and P5 and R27.
In order to move conveniently, universal wheels can be additionally arranged at the bottom of the lower rack.