CN107302550A - A kind of high in the clouds integrated chip design method - Google Patents
A kind of high in the clouds integrated chip design method Download PDFInfo
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- CN107302550A CN107302550A CN201610232158.0A CN201610232158A CN107302550A CN 107302550 A CN107302550 A CN 107302550A CN 201610232158 A CN201610232158 A CN 201610232158A CN 107302550 A CN107302550 A CN 107302550A
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- chip
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- internet
- things
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L67/00—Network arrangements or protocols for supporting network services or applications
- H04L67/01—Protocols
- H04L67/10—Protocols in which an application is distributed across nodes in the network
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
Abstract
The present invention provides a kind of high in the clouds integrated chip design method, and high in the clouds integration is intended to break traditions, and chip data processing is isolated, the industry barrier that mode is single.Chip and mysorethorn are now seamlessly connected, chip is cloud, cloud is chip, with high in the clouds, efficiently, at a high speed, in real time, easily disposal ability makes up that traditional die operating rate is low, the small restraint of trade of processing data amount.The epoch of Internet of Things are the thing thing connected epoch, compared with traditional internet, Internet of Things has bigger computing and real-time requirement to data, therefore the epoch of Internet of Things are the epoch of big data and cloud computing, and this feature just determines that single chip or local network can not solve the firm need of Internet of Things at all.And the method for high in the clouds integrated chip design, just it is the key for solving this problem, local chip is assigned by the operational capability of the resource of whole internet and large-scale server, lift chip performance, makes up chip defect.
Description
Technical field
The present invention relates to a kind of high in the clouds integrated chip design method, belong to technology of Internet of things, can apply in intelligent family
The fields such as technology are occupied, more particularly to legacy hardware devices realize the design of high in the clouds integration.
Background technology
Internet of Things refers to that by various information sensing devices real-time collection any need is monitored, connected, interaction in a broad sense
Object or the various needs such as process information, the huge network combined to form with internet.The purpose is to realize thing with
Thing, thing and people, the connection of all article and network and are controlled convenient identification, management.Internet of Things is quickly grown, and realizes all things on earth
Interconnection is, it is necessary to which MCU provides more powerful, more wisdom calculating, and for the method for existing chip design, traditional approach mainly has following
It is several：
(1) the ASIC epoch (1990-2000) are characterized in chip in " application "." application specific integrated circuit " causes hardware design
Person can develop the chip for the specific function that have cured for different application demands, and it does not have programmable features, presses
User needs, towards special-purpose and the integrated circuit that specially designs and produces.A large amount of universal integrated circuits for producing and standardizing
The need for whole users typically can not be met, the new electronic system of development often needs various with specific function or special technique index
Integrated circuit.Customization integrated circuit is to solve one of important channel of this problem, is that one of integrated circuit development is important
Aspect.But, full custom ic be it is anticipated that function and technical indicator and specially design the integrated circuit being made, manufacture
Cycle length, cost are high, and modification is difficult after being made.
(2) SoC epoch (2001-2015)：It is characterized in the chip in " system ", the chip is more to processor
(including CPU, DSP), memory, various interface control modules, various interconnections it is integrated, current chip design industry is faced with
A series of challenge, System on Chip/SoC SoC has become the focus that IC designs industry, and SoC performances are more and more stronger, and scale is increasingly
Greatly.The computing capability of SoC chip is limited, is limited to SoC local computings.In SoC design, emulation is that SoC is set with checking
Link most complicated, most time-consuming in flow is counted, the 50%~80% of whole chip development cycle is accounted for.System level chip is because of hundred
Worked under the integrated level of more than ten thousand and hundreds of million clock frequencies, there will be the power consumption of tens of watts or even upper hectowatt.Huge power consumption
Problem is all brought in terms of encapsulation and reliability, therefore reduces the certainty that the design of power consumption is system-Level IC Design
It is required that.
As Internet of Things develops, the industry such as smart home needs MCU to provide more powerful, more wisdom calculating, SoC framves
The chip ability of structure is only limitted to the computing capability in piece, if can borrowing the ability extension MCU computing capabilitys in high in the clouds, there is provided more
Powerful function, such as：Recognition of face, speech recognition and man-machine interaction.
Therefore, proposing a kind of computing capability that will be held and lift MCU as the design of one with cloud.
The content of the invention
In view of the deficiency of above-mentioned existing chip design method, high in the clouds integration is intended to the chip data processing orphan that breaks traditions
The single industry barrier of vertical, mode.Chip and mysorethorn are now seamlessly connected, chip is cloud, cloud is chip, it is high with high in the clouds
Effect, at a high speed, in real time, easily disposal ability makes up that traditional die operating rate is low, the small restraint of trade of processing data amount.Internet of Things
The epoch of net are the thing thing connected epoch, compared with traditional internet, and Internet of Things has bigger computing to data and needed in real time
Ask, thus Internet of Things epoch be big data and cloud computing epoch, this feature just determines single chip or part
Network can not solve the firm need of Internet of Things at all.And the method for high in the clouds integrated chip design, just it is the pass for solving this problem
Key, local chip is assigned by the operational capability of the resource of whole internet and large-scale server, is lifted chip performance, is made up core
Piece defect.
Specifically, the invention provides following technical scheme：
1. a kind of high in the clouds integrated chip design method, it is characterised in that
The working mechanism of high in the clouds integrated chip is made up of end node with cloud node two parts：End node is die terminals,
Cloud Server is accessed in the part by proprietary network, and slitless connection is realized in end with cloud using EVENT/ACTION mechanism；
The form that all actions of chip can be packaged into EVENT (event) with response as parameter reports cloud service
There is a set of perfect action listener mechanism in device, Cloud Server, audiomonitor event is simultaneously handled, after the completion of processing, will be located
Reason result is packaged into ACTOR, by high in the clouds ACTION mechanism, is issued to die terminals, die terminals directly obtain result data.
2. a kind of high in the clouds integrated design method, it is characterised in that
Beyond the clouds in integrated working mechanism, die terminals are only used as environment sensing and interchange server, and the place of data
Managing and give the service of user all has Cloud Server to complete；
Server is received after the demand of chip upload, can call all related resources in whole Generation Internet, is chosen
Best solution, realizes the integration and optimum allocation of Internet resources, is service by result and resource consolidation, with certain
Authorization policy distributes to user.
Compared with prior art, the beneficial effects of the invention are as follows：
1st, economy.The high in the clouds integrated chip design of the present invention, is equivalent to common MCU prices, that is, meets list
The computing capability of piece machine, there is the function of realizing cloud service.It is significantly less than by the cost of single-chip microcomputer+networking module.
2nd, function is strong.The high in the clouds integrated chip design of the present invention, die terminals are only used as environment sensing and interchange server,
And the processing of data and giving the service of user all has Cloud Server to complete, the chip of high in the clouds integration can accomplish with
Shi Tianjia is serviced, and the service of computing capability can be improved at any time.
3rd, it is easy to operate.The high in the clouds integrated chip design of the present invention, is equivalent to common MCU, reduces MCU processing
Data are connected with providing the agreement that the third party of cloud service is docked to realize with high in the clouds.
Brief description of the drawings
Fig. 1 is integrated chip design method structural representation in high in the clouds of the present invention；
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Ability
Field technique personnel are it is to be understood that following specific embodiments or embodiment, are that the present invention is that specific hair is explained further
Bright content and the set-up mode of series of optimum enumerated, and be that can be combined with each other or mutually between those set-up modes
Association is used, unless clearly proposed some of which or a certain specific embodiment in the present invention or embodiment can not be with other
Embodiment or embodiment be associated setting or be used in conjunction with.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained, belongs to the scope of protection of the invention.
Embodiment 1
Chip can surf the Net, it is possible to assign chip the ability of net, accomplished cloud on chip, onboard all communications
Agreement is SPI, IFC, serial ports etc. nothing but, and the ability of these communications is at maximum up to 55M, and the onboard ability of serial ports is lower.Present net
The handling capacity of network is 100M, and the handling capacity of optical fiber is higher, so the ability of network is far longer than onboard ability, therefore network meter
Calculation ability is completely out of question to the input capability of single-chip microcomputer.
Embodiment 2
High in the clouds one chip design is made up of die terminals with high in the clouds two parts, and the calculating disposal ability of die terminals is cloud
End, high in the clouds contains the cloud of service, the cloud of business, the cloud of specialty；Cloud the cloud that chip is service, the cloud of business, specialty
Cloud is in chip, without the Cloud Server that refers on chip, nor the AS layers of cloud computing are on chip.
Single-chip microcomputer is united two into one with high in the clouds, and chip is bound together online with cloud in real time, and the service required for us all may be used
To be obtained on cloud.Chip deposit that loading capability is also equivalent to cloud deposit loading capability, even if single-chip microcomputer deposits loading capability very little, I
It can be replaced and be put into again single-chip microcomputer on after the completion of single-chip microcomputer by service cloud needing system to be processed be placed on cloud.Accomplish cloud+end
Integrated design, the function definition that the function of front end is defined with high in the clouds is a pair.The chip of high in the clouds integration can be accomplished at any time
Addition service, can improve the service of computing capability at any time.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, on the premise of principle of the present invention is not departed from, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (2)
1. a kind of high in the clouds integrated chip design method, it is characterised in that
The working mechanism of high in the clouds integrated chip is made up of end node with cloud node two parts：End node is die terminals, the portion
Divide and Cloud Server is accessed by proprietary network, slitless connection is realized in end with cloud using EVENT/ACTION mechanism；
The form that all actions of chip can be packaged into EVENT (event) with response as parameter reports Cloud Server, cloud
There is a set of perfect action listener mechanism in server, audiomonitor event is simultaneously handled, after the completion of processing, by result
ACTOR is packaged into, by high in the clouds ACTION mechanism, die terminals are issued to, die terminals directly obtain result data.
2. a kind of high in the clouds integrated design method, it is characterised in that
Beyond the clouds in the working mechanism of integrated chip, die terminals are only used as environment sensing and interchange server, and the place of data
Managing and give the service of user all has Cloud Server to complete；
Server is received after the demand of chip upload, can call all related resources in whole Generation Internet, chooses optimal
Solution, realizes the integration and optimum allocation of Internet resources, is service by result and resource consolidation, with certain authority
Strategy distributes to user.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610232158.0A CN107302550A (en) | 2016-04-15 | 2016-04-15 | A kind of high in the clouds integrated chip design method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610232158.0A CN107302550A (en) | 2016-04-15 | 2016-04-15 | A kind of high in the clouds integrated chip design method |
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| CN107302550A true CN107302550A (en) | 2017-10-27 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103389719A (en) * | 2013-08-02 | 2013-11-13 | 临沂市拓普网络股份有限公司 | Intelligent home monitoring system and method based on cloud computing |
| US20140082093A1 (en) * | 2012-09-14 | 2014-03-20 | Box, Inc. | Batching notifications of activities that occur in a web-based collaboration environment |
| CN104202353A (en) * | 2014-07-09 | 2014-12-10 | 武汉领傲科技有限公司 | Cloud event processing method and device for internet of things interconnected cooperative system |
| CN105024995A (en) * | 2015-05-29 | 2015-11-04 | 四川长虹电器股份有限公司 | Household smart device control system |
| CN105407174A (en) * | 2015-12-15 | 2016-03-16 | 上海仪电(集团)有限公司 | Cloud-based IOT monitoring method and system |
-
2016
- 2016-04-15 CN CN201610232158.0A patent/CN107302550A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140082093A1 (en) * | 2012-09-14 | 2014-03-20 | Box, Inc. | Batching notifications of activities that occur in a web-based collaboration environment |
| CN103389719A (en) * | 2013-08-02 | 2013-11-13 | 临沂市拓普网络股份有限公司 | Intelligent home monitoring system and method based on cloud computing |
| CN104202353A (en) * | 2014-07-09 | 2014-12-10 | 武汉领傲科技有限公司 | Cloud event processing method and device for internet of things interconnected cooperative system |
| CN105024995A (en) * | 2015-05-29 | 2015-11-04 | 四川长虹电器股份有限公司 | Household smart device control system |
| CN105407174A (en) * | 2015-12-15 | 2016-03-16 | 上海仪电(集团)有限公司 | Cloud-based IOT monitoring method and system |
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