CN107301817A - In-mold labels - Google Patents

In-mold labels Download PDF

Info

Publication number
CN107301817A
CN107301817A CN201710605230.4A CN201710605230A CN107301817A CN 107301817 A CN107301817 A CN 107301817A CN 201710605230 A CN201710605230 A CN 201710605230A CN 107301817 A CN107301817 A CN 107301817A
Authority
CN
China
Prior art keywords
layer
label
mold labels
hole
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710605230.4A
Other languages
Chinese (zh)
Inventor
陈活强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Times Printing Factory
Guangdong Hong Kong (guangzhou) Intelligent Printing Co Ltd
Original Assignee
Guangzhou Times Printing Factory
Guangdong Hong Kong (guangzhou) Intelligent Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Times Printing Factory, Guangdong Hong Kong (guangzhou) Intelligent Printing Co Ltd filed Critical Guangzhou Times Printing Factory
Priority to CN201710605230.4A priority Critical patent/CN107301817A/en
Publication of CN107301817A publication Critical patent/CN107301817A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02Forms or constructions
    • G09F2003/0257Multilayer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Wrappers (AREA)

Abstract

The present invention relates to a kind of in-mold labels, then got and punched on a series of hole on the label cut by machinery or laser, because the material after punching extrudes effect, boss will be formed around the hole at the back side of label film;When avoiding using automated machine crawl, the phenomenon of overlapping tags and/or the label that comes off is formed due to the bonding between label;Simultaneously as perforate and boss on label film, it is to avoid label film and plastic packaging containers produce bubble during laminating.

Description

In-mold labels
Technical field
The present invention relates to a kind of label, and in particular to a kind of in-mold labels.
Background technology
At present, tag adhering in mould is widely used, and usually used relative to the past is plastics with polymeric labels The method of label containers, it is not necessary to coat adhesive in label facestock sheet, it is not required that being set under adhesive to shell From paste carrier.
Tag adhering in mould method of the prior art is side's absorption label film by negative pressure of vacuum or Electrostatic Absorption, and is led to Cross manipulator in-mold labels are automatically fed into plastic packaging containers die cavity, be attached to the outer wall of corresponding plastic packaging containers, Label is pasted onto to the surface of plastic packaging containers by heat fused, traditional artificial general is instead of using robotic automatic coating Label is pasted on the mode of plastic packaging containers outer wall one by one.
But use above-mentioned tag adhering in mould method usually require by one pile label stack place, stack when by Extruded in gravity and by the air between film label, simultaneously because between the effect of Electrostatic Absorption, the smooth label of surfacing It is easy bond, cause label to be bonded together, when being captured using automated machine, it is difficult to ensure that every time only crawl one Label, easily forms overlapping tags and/or the label that comes off.Further, since label and the plastic packaging containers shape during laminating Into closed chamber, it is possible to produce bubble during laminating, causes waste product or needs subsequently to pierce through the PROCESS FOR TREATMENT of bubble.
The content of the invention
The invention aims to solve it is of the prior art stacked because label is in heaps, between the label being placed adjacent It is also easy to produce electrostatic, absorption affinity big, easily adsorbs multiple labels when capturing label, cause the folded Zhang Wenti of labelling, solve simultaneously Determine and the phenomenon of bubble is easily produced after label application in the prior art.
To achieve the above object, technical scheme is as follows:In a side surface coated heat melt material of base layer Form hot melt layer;In another side surface application to printed material formation printing layer of base layer;By the label needed for in-mold label film Size and shape is cut;Punched on the in-mold labels cut, boss is formed around the hole on the surface of label film.
In order to further realize the present invention, base layer includes one kind at least polymeric material, metal material, base layer Thickness is 50~100 μm.
In order to further realize the present invention, described matrix layer is BOPET film, BOPP film, PE films, polypropylene are thin One kind in film, polyethylene film, poly- third poly- second coextruded film, polystyrene film, built up membrane;Institute's hot sealing layer is after heating The material easily melted is constituted.
In order to further realize the present invention, the boss is located at the surface of the hot sealing layer.
In order to further realize the present invention, the hole can be through hole or non-through hole.
In order to further realize the present invention, the hole is formed by mechanical punching or laser boring.
In order to further realize the present invention, a diameter of 0.01-1mm in the hole, preferably 0.1-0.5mm.
In order to further realize the present invention, the superficial layer is printing layer.
In order to further realize the present invention, the Kong Zhen of the hole formation rule arrangement.
In order to further realize the present invention, the Kong Zhen of the hole formation rule arrangement.
In order to further realize the present invention, the material that the hot sealing layer easily melts after heating is constituted.
Beneficial effect
One of the object of the invention is by machinery or laser boring, it is to avoid label film and plastic packaging containers were being fitted Bubble is produced in journey;Boss can be formed in a side surface (being usually thermoplastic layer) for label film punch simultaneously after, so that There is gap between label film, it is to avoid the bonding between label, when being captured using automated machine, overlapping tags will not be formed And/or the phenomenon for the label that comes off.
Brief description of the drawings
Fig. 1 is the structural representation of label of the prior art;
Fig. 2 is the structural representation of the label film of the present invention.
Description of reference numerals:
1st, base layer;2nd, hot melt layer;3rd, printing layer;4th, hole;5th, boss.
Embodiment
A kind of embodiment of the present invention is described below:First selection base layer material (such as BOPET film, BOPP film, PE films, polypropylene film, polyethylene film, poly- third poly- second coextruded film, polystyrene film, built up membrane In), in a side surface coated heat melt material (such as EVA) the formation hot melt layer of base layer;Applied in another side surface of base layer The printing layer of duplication brush material formation;Tag size and shape needed for in-mold label film is cut, can according to trade mark, Cut the need for pattern and decoration;Then a series of hole is got on the label cut by machinery or laser, by Effect is extruded in the material after punching, boss will be formed around the hole at the back side of label film.
The thickness of base layer is 50~100 μm, a diameter of 0.01-1mm in hole, preferably 0.1-0.5mm, formation rule or non- Regularly arranged Kong Zhen;Label film after punching is placed in label box in a pile.
Label is captured by manipulator, generally using side's absorption label of negative pressure of vacuum or Electrostatic Absorption, and along machinery Pushing ahead for the tracks of hand, in-mold labels are automatically fed into plastic packaging containers die cavity, are attached to corresponding plastics The outer wall of packing container.
Heating of plastic packing container, (can be typically due to plastic packaging containers by the waste-heat of plastic packaging containers Just blow molding, still remains with certain heat temperature when being blow molded out) so that the heat-fusible materials fusing of hot melt layer and with modeling Material packing container is bonded to one.
Because hot melt layer melts after heating, it is integrated with plastic packaging containers fusion, the boss of hot melt layer disappears after fusion is closed Lose, while hot melt layer material can be in access aperture by the closing of pores after heating, the label surface flat smooth after final assembly, The attractive in appearance of surface is not interfered with.
The better embodiment of the present invention is the foregoing is only, the invention is not limited in above-mentioned embodiment, is being implemented During there may be local small structural modification, if the various changes or modification to the present invention do not depart from the essence of the present invention God and scope, and belong within the scope of the claim and equivalent technologies of the present invention, then the present invention is also intended to comprising these changes And modification.

Claims (10)

1. a kind of in-mold labels, it is characterised in that:Several holes are formed with the surface of the in-mold labels.
2. in-mold labels according to claim 1, it is characterised in that:The hole passes through mechanical punching or laser boring shape Into.
3. in-mold labels according to claim 1, it is characterised in that:The hole is label surface is regular or irregular row Row.
4. in-mold labels according to claim 1, it is characterised in that:The shape around the hole on the surface of the in-mold labels Into there is boss.
5. in-mold labels according to claim 1, it is characterised in that:A diameter of 0.1-0.5mm in the hole.
6. in-mold labels according to claim 1, it is characterised in that:The in-mold labels at least include first layer, second Layer, third layer, the first layer are superficial layer, and the second layer is base layer, and the third layer is hot sealing layer.
7. in-mold labels according to claim 6, it is characterised in that:Described matrix layer includes at least polymeric material, metal One kind in material, the thickness of described matrix layer is 50~100 μm.
8. in-mold labels according to claim 6, it is characterised in that:The superficial layer is printing layer.
9. in-mold labels according to claim 6, it is characterised in that:The material structure that the hot sealing layer easily melts after heating Into.
10. in-mold labels according to claim 9, it is characterised in that:The material easily melted after the heating is EVA.
CN201710605230.4A 2017-07-20 2017-07-20 In-mold labels Pending CN107301817A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710605230.4A CN107301817A (en) 2017-07-20 2017-07-20 In-mold labels

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710605230.4A CN107301817A (en) 2017-07-20 2017-07-20 In-mold labels

Publications (1)

Publication Number Publication Date
CN107301817A true CN107301817A (en) 2017-10-27

Family

ID=60134554

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710605230.4A Pending CN107301817A (en) 2017-07-20 2017-07-20 In-mold labels

Country Status (1)

Country Link
CN (1) CN107301817A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116252519A (en) * 2022-12-07 2023-06-13 深圳源明杰科技股份有限公司 Label preparation method and system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001058670A1 (en) * 2000-02-11 2001-08-16 Mail-Well, Inc. In-mold label with perforations
CN1684999A (en) * 2002-07-25 2005-10-19 优泊公司 Stretched resin film and label comprising the same
CN101084101A (en) * 2004-11-18 2007-12-05 优泊公司 Labeled molded object obtained by in-mold labeling and in-mold label
CN101156192A (en) * 2005-03-30 2008-04-02 优泊公司 In-mold molding label and molded product using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001058670A1 (en) * 2000-02-11 2001-08-16 Mail-Well, Inc. In-mold label with perforations
CN1684999A (en) * 2002-07-25 2005-10-19 优泊公司 Stretched resin film and label comprising the same
CN101084101A (en) * 2004-11-18 2007-12-05 优泊公司 Labeled molded object obtained by in-mold labeling and in-mold label
CN101156192A (en) * 2005-03-30 2008-04-02 优泊公司 In-mold molding label and molded product using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116252519A (en) * 2022-12-07 2023-06-13 深圳源明杰科技股份有限公司 Label preparation method and system
CN116252519B (en) * 2022-12-07 2024-03-26 深圳源明杰科技股份有限公司 Label preparation method and system

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Legal Events

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PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20171027