CN107289845A - Heat-insulation layer thickness measuring chi and its application method - Google Patents
Heat-insulation layer thickness measuring chi and its application method Download PDFInfo
- Publication number
- CN107289845A CN107289845A CN201610193818.9A CN201610193818A CN107289845A CN 107289845 A CN107289845 A CN 107289845A CN 201610193818 A CN201610193818 A CN 201610193818A CN 107289845 A CN107289845 A CN 107289845A
- Authority
- CN
- China
- Prior art keywords
- probe
- insulation layer
- heat
- layer thickness
- slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
- G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
- G01B5/066—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness of coating
Abstract
The present invention relates to the realm of building construction, specifically a kind of heat-insulation layer thickness measuring chi, it is characterized in that:It includes substrate, probe slot, probe and probe buckle;Probe slot has a plurality of, arrange and be vertically provided on substrate in yi word pattern, the quantity of probe is corresponding with probe slot and in probe slot, probe buckle is located at the top of probe slot, by being opened and closed the realization of probe buckle to the clamping of probe and loosening, substrate is provided with a plurality of graduated scale, and graduated scale is located at the side of every probe slot.The probe diameter of this heat-insulation layer thickness measuring chi is very thin, very little to detected material bulk damage, therefore is not required to carry out follow-up remedial measure;This measuring scale need not be repeated when using, it is to avoid accumulated error;And this measuring scale size is small, can detect at any time, detection limit size, can in time, the quality of real reflection construction overall process.
Description
Technical field
The present invention relates to the realm of building construction, specifically a kind of heat-insulation layer thickness measuring chi and its application method.
Background technology
Continuous improvement with country to building energy conservation requirement, the heat preservation energy-saving construction volume of building is very big.At present, in practice of construction, for the effective detection means at any time of construction process control neither one of insulation layer thickness, or being that progress is destructive mostly digs out one piece, detected roughly, repaired again afterwards with steel tape, it is time-consuming;Be exactly after construction is finished please specialty detection unit detect, it is necessary to time and a high expense, and detect that concentrations, detection limit are small, it is impossible to which in time, real reflection constructs total quality.
The content of the invention
It is an object of the present invention to provide device behind a kind of side for not destroying insulation layer surface.
In order to achieve the above object, the present invention is realized in:
A kind of heat-insulation layer thickness measuring chi, it includes substrate, probe slot, probe and probe buckle;Probe slot has a plurality of, arrange and be vertically provided on substrate in yi word pattern, the quantity of probe is corresponding with probe slot and in probe slot, probe buckle is located at the top of probe slot, by being opened and closed the realization of probe buckle to the clamping of probe and loosening, substrate is provided with a plurality of graduated scale, and graduated scale is located at the side of every probe slot.
Described heat-insulation layer thickness measuring chi, the side end of substrate one is provided with handle.
The application method of the heat-insulation layer thickness measuring chi, including
Step 1, by heat-insulation layer thickness measuring chi as insulation layer surface;
Step 2, by probe buckle unclamp probe is skidded off from probe slot;
Step 3, by probe be pierced into heat-insulation layer in until the roof-base under probe top to heat-insulation layer;
Step 4, locking probe buckle simultaneously remove heat-insulation layer thickness measuring chi from insulation layer surface;
Step 5, the graduated scale reading of reading probe side, so as to obtain insulation layer thickness numerical value.
The application method of above-mentioned heat-insulation layer thickness measuring chi, all probe buckles on chi will be detected simultaneously to unclamp and all probes are pierced into heat-insulation layer and probe are fixed with probe buckle, multiple insulation layer thickness numerical value can be so obtained, take its average value to measure heat-insulation layer average thickness numerical value.
The probe diameter of this heat-insulation layer thickness measuring chi is very thin, very little to detected material bulk damage, therefore is not required to carry out follow-up remedial measure;This measuring scale need not be repeated when using, it is to avoid accumulated error;And this measuring scale size is small, can detect at any time, detection limit size, can in time, the quality of real reflection construction overall process.
Brief description of the drawings
Fig. 1 is the structural representation of this measuring scale.
Embodiment
The present invention is further illustrated below by way of specific embodiment.
As shown in figure 1, a kind of heat-insulation layer thickness measuring chi, it includes substrate 1, probe slot 2, probe 3 and probe buckle 4;Probe slot 2 has a plurality of, arrange and be vertically provided on substrate 1 in yi word pattern, the quantity of probe 3 is corresponding with probe slot 2 and in probe slot 2, probe buckle 4 is located at the top of probe slot 2, the clamping to probe 3 is realized by being opened and closed probe buckle 4 and is loosened, substrate 1 is provided with a plurality of graduated scale 5, and graduated scale 5 is located at the side of every probe slot 2.
Described heat-insulation layer thickness measuring chi, the side end of substrate 1 one is provided with handle 6.
The application method of the heat-insulation layer thickness measuring chi, including
Step 1, by heat-insulation layer thickness measuring chi as insulation layer surface;
Step 2, by probe buckle unclamp probe is skidded off from probe slot;
Step 3, by probe be pierced into heat-insulation layer in until the roof-base under probe top to heat-insulation layer;
Step 4, locking probe buckle simultaneously remove heat-insulation layer thickness measuring chi from insulation layer surface;
Step 5, the graduated scale reading of reading probe side, so as to obtain insulation layer thickness numerical value.
The application method of above-mentioned heat-insulation layer thickness measuring chi, all probe buckles on chi will be detected simultaneously to unclamp and all probes are pierced into heat-insulation layer and probe are fixed with probe buckle, multiple insulation layer thickness numerical value can be so obtained, take its average value to measure heat-insulation layer average thickness numerical value.
The probe diameter of this heat-insulation layer thickness measuring chi is very thin, very little to detected material bulk damage, therefore is not required to carry out follow-up remedial measure;This measuring scale need not be repeated when using, it is to avoid accumulated error;And this measuring scale size is small, can detect at any time, detection limit size, can in time, the quality of real reflection construction overall process.
Claims (4)
1. a kind of heat-insulation layer thickness measuring chi, it is characterized in that:It includes substrate, probe slot, probe and probe buckle;Probe slot has a plurality of, arrange and be vertically provided on substrate in yi word pattern, the quantity of probe is corresponding with probe slot and in probe slot, probe buckle is located at the top of probe slot, by being opened and closed the realization of probe buckle to the clamping of probe and loosening, substrate is provided with a plurality of graduated scale, and graduated scale is located at the side of every probe slot.
2. heat-insulation layer thickness measuring chi according to claim 1, it is characterized in that:The side end of substrate one is provided with handle.
3. the application method of heat-insulation layer thickness measuring chi described in claim 1, it is characterized in that:Including
Step 1, by heat-insulation layer thickness measuring chi as insulation layer surface;
Step 2, by probe buckle unclamp probe is skidded off from probe slot;
Step 3, by probe be pierced into heat-insulation layer in until the roof-base under probe top to heat-insulation layer;
Step 4, locking probe buckle simultaneously remove heat-insulation layer thickness measuring chi from insulation layer surface;
Step 5, the graduated scale reading of reading probe side, so as to obtain insulation layer thickness numerical value.
4. the application method of heat-insulation layer thickness measuring chi according to claim 3, it is characterized in that:All probe buckles on chi will be detected simultaneously to unclamp and all probes are pierced into heat-insulation layer and probe are fixed with probe buckle, can so be obtained multiple insulation layer thickness numerical value, be taken its average value to measure heat-insulation layer average thickness numerical value.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610193818.9A CN107289845A (en) | 2016-03-31 | 2016-03-31 | Heat-insulation layer thickness measuring chi and its application method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610193818.9A CN107289845A (en) | 2016-03-31 | 2016-03-31 | Heat-insulation layer thickness measuring chi and its application method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107289845A true CN107289845A (en) | 2017-10-24 |
Family
ID=60087909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610193818.9A Pending CN107289845A (en) | 2016-03-31 | 2016-03-31 | Heat-insulation layer thickness measuring chi and its application method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107289845A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109724493A (en) * | 2018-12-29 | 2019-05-07 | 天津博迈科海洋工程有限公司 | Three foot needle-like fireproof coating wet-film thickness measuring instruments of one kind and its measurement method |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1183410A (en) * | 1997-09-11 | 1999-03-26 | Kansai Paint Co Ltd | Film thickness measuring instrument |
CN201045574Y (en) * | 2007-05-22 | 2008-04-09 | 王全民 | Portable thermal insulation layer thickness measuring instrument |
WO2013104370A1 (en) * | 2012-01-11 | 2013-07-18 | Abd El-Lateef Zaky Abd El-Lateef Zaky | Tool for measuring surface indentations |
CN203432495U (en) * | 2013-07-17 | 2014-02-12 | 江苏建科建设监理有限公司 | Insulation material thickness detection apparatus for supervision |
CN204478986U (en) * | 2015-03-31 | 2015-07-15 | 陈明雄 | Building test measuring device |
CN104841897A (en) * | 2014-02-13 | 2015-08-19 | 宝山钢铁股份有限公司 | Measuring method and measuring apparatus for the thickness of molten layer of mold powder and fluctuation of liquid level of molten steel |
CN105202998A (en) * | 2015-10-21 | 2015-12-30 | 西安长庆科技工程有限责任公司 | Heat insulation thickness detection tool |
CN205066640U (en) * | 2015-10-31 | 2016-03-02 | 中国二十二冶集团有限公司 | Thickness gauge is spread to pitch pine |
-
2016
- 2016-03-31 CN CN201610193818.9A patent/CN107289845A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1183410A (en) * | 1997-09-11 | 1999-03-26 | Kansai Paint Co Ltd | Film thickness measuring instrument |
CN201045574Y (en) * | 2007-05-22 | 2008-04-09 | 王全民 | Portable thermal insulation layer thickness measuring instrument |
WO2013104370A1 (en) * | 2012-01-11 | 2013-07-18 | Abd El-Lateef Zaky Abd El-Lateef Zaky | Tool for measuring surface indentations |
CN203432495U (en) * | 2013-07-17 | 2014-02-12 | 江苏建科建设监理有限公司 | Insulation material thickness detection apparatus for supervision |
CN104841897A (en) * | 2014-02-13 | 2015-08-19 | 宝山钢铁股份有限公司 | Measuring method and measuring apparatus for the thickness of molten layer of mold powder and fluctuation of liquid level of molten steel |
CN204478986U (en) * | 2015-03-31 | 2015-07-15 | 陈明雄 | Building test measuring device |
CN105202998A (en) * | 2015-10-21 | 2015-12-30 | 西安长庆科技工程有限责任公司 | Heat insulation thickness detection tool |
CN205066640U (en) * | 2015-10-31 | 2016-03-02 | 中国二十二冶集团有限公司 | Thickness gauge is spread to pitch pine |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109724493A (en) * | 2018-12-29 | 2019-05-07 | 天津博迈科海洋工程有限公司 | Three foot needle-like fireproof coating wet-film thickness measuring instruments of one kind and its measurement method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2574911B1 (en) | Method and arrangement for crack detection in a metallic material | |
CN111157157B (en) | Cold-rolled sheet residual stress prediction and measurement method | |
CN104198313A (en) | Residual stress detection method based on instrumented indentation technology | |
HRP20221397T1 (en) | Board testing apparatus | |
CN103969128A (en) | Method for detecting bending mechanical property of sample | |
CN107289845A (en) | Heat-insulation layer thickness measuring chi and its application method | |
CN111189892B (en) | Method for detecting soil oxidation reduction potential Eh change based on DGT technology | |
CN203929593U (en) | A kind of high-temperature high-pressure apparatus material corrosion comprehensive study experiment table reactor | |
CN103954691A (en) | Nondestructive detection method for material composition fractions | |
CN104101288A (en) | Device for measuring concrete surface stripping degree | |
CN104165795A (en) | Method for determining residual flexural capacity of historic building beams | |
CN102147301A (en) | Nondestructive testing method of hard alloy anvil | |
CN201653588U (en) | Temperature measuring device used for concrete track slabs and test blocks and maintenance device | |
CN103901063A (en) | Method for testing C-fiber reinforced resin based composite material by virtue of X-ray diffraction | |
CN105651862A (en) | Device and method for detecting damage to composite by aid of Lamb guide waves | |
CN102607370A (en) | Detection card for thickness of coating layer of waterproof coating | |
CN206347989U (en) | A kind of photovoltaic frame cubing | |
CN206556629U (en) | One kind carrier band thickness detection apparatus | |
CN206019521U (en) | Diamond mould overcoat dimension measuring implement | |
CN109029200A (en) | A kind of off-line checking method of Varying-thickness Automobile Plate | |
CN201945302U (en) | Wafer angle testing location device | |
JP2016224000A (en) | Estimation method and estimation device | |
Epple | Accounting for long term environmental influences on ultrasonic monitoring measurements of reinforced concrete constructions with embedded transducers | |
CN203965293U (en) | Rock burette test testing table | |
CN105107762B (en) | A kind of core inductance detection means used based on inductor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171024 |