CN107283062B - A method of laser prepares lyophobic surface in the liquid phase - Google Patents
A method of laser prepares lyophobic surface in the liquid phase Download PDFInfo
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- CN107283062B CN107283062B CN201710304952.6A CN201710304952A CN107283062B CN 107283062 B CN107283062 B CN 107283062B CN 201710304952 A CN201710304952 A CN 201710304952A CN 107283062 B CN107283062 B CN 107283062B
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- 238000000034 method Methods 0.000 title claims abstract description 51
- 239000007791 liquid phase Substances 0.000 title claims abstract description 21
- 238000003682 fluorination reaction Methods 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 14
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims abstract description 14
- 238000004321 preservation Methods 0.000 claims abstract description 7
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 5
- 239000011343 solid material Substances 0.000 claims abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- 229910045601 alloy Inorganic materials 0.000 claims description 19
- 239000000956 alloy Substances 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 14
- 229910052757 nitrogen Inorganic materials 0.000 claims description 12
- 239000010935 stainless steel Substances 0.000 claims description 12
- 229910001220 stainless steel Inorganic materials 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 10
- 229920005591 polysilicon Polymers 0.000 claims description 10
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims description 9
- 238000003491 array Methods 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 241000209202 Bromus secalinus Species 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 230000004323 axial length Effects 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229960000935 dehydrated alcohol Drugs 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- MWKJTNBSKNUMFN-UHFFFAOYSA-N trifluoromethyltrimethylsilane Chemical compound C[Si](C)(C)C(F)(F)F MWKJTNBSKNUMFN-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000012271 agricultural production Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The embodiment of the invention discloses a kind of methods that laser prepares lyophobic surface in the liquid phase, are related to Machine Design and manufacturing field.The embodiment of the present invention is cleaned by ultrasonic processing object 6 to 8 minutes using acetone soln；Fluoride is selected to be made into the fluorination liquid that mass fraction is 0.4%~2%；The processing object is put into the fluorination liquid, while the processing object is processed using laser processing technology, processes microstructure array；There to be the taking-up of microstructure array processing object, and be put into incubator and be heat-treated, treatment temperature is 150~250 DEG C, cooled to room temperature after heat preservation 1 to 2 hours.The present invention is suitable for carrying out the processing of micro-structure lyophobic surface on metal material or nonmetal solid material, can be formed in micro-structured inner with certain thickness lyophobic layers.The stability and tribological property of lyophobic surface can be improved.
Description
Technical field
The present invention relates to Machine Design manufacturing technology fields, more particularly to a kind of laser in the liquid phase to prepare lyophobic surface
Method.
Background technique
It is a large amount of studies have shown that the wetability of the surface of solids be made of its surface chemistry, microcosmic and macroscopical geometry
What structure codetermined.By adjusting and changing the chemical component and surface topography of the surface of solids, can artificially control
The wettability of the surface of solids, to make used in its mankind's daily life and industrial and agricultural production, this progress to the mankind are pushed
There is very important meaning.In addition, many external influence factors such as light, thermal and magnetic field, heat and solvent etc. are to the surface of solids
Wetability also have very important influence.
From technical method, it is numerous that the method for being much used to prepare lyophobic material still has equipment raw material valuableness, step
The disadvantages of miscellaneous, poor repeatability；In terms of stability, at present most methods preparation lyophobic surface chemical stability compared with
It is poor and also more sensitive to mechanism, it is mainly manifested in rugged environment and certain mechanicals efforts is easy to make lyophobicity
It can lose, these all greatly hinder the practical application and industrial production of lyophobic surface.In conclusion the chemistry of lyophobic surface
Stability and mechanical durability difference are Related Research Domain urgent problems to be solved, while being prepared with good or superpower steady
Qualitative lyophobic surface also increasingly becomes the target of researchers' effort.
Summary of the invention
The embodiment of the present invention provides a kind of method that laser prepares lyophobic surface in the liquid phase, can be in processing object table
The microstructure array of obtained channel form, side's hole shape or mixed type on face, and obtained micro-structure surface is with thin
Liquid characteristic can be formed in the inside of microstructure array with certain thickness lyophobic layers.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
In a first aspect, the embodiment of the present invention provides a kind of method that laser prepares lyophobic surface in the liquid phase, comprising:
Step 1: ultrasonic cleaning 6 to 8 minutes is carried out to processing object using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 0.4%~2%；
Step 3: the processing object is put into the fluorination liquid, while being added using laser processing technology processing is described
Work object processes microstructure array；
Step 4: there will be microstructure array processing object to be put into incubator, be heat-treated, treatment temperature is
150~250 DEG C, cooled to room temperature after heat preservation 1 to 2 hours.As one embodiment, the processing object is metal material
Or nonmetal solid material.
As one embodiment, the processing object is metal material, such as hard alloy, stainless steel, hardened steel or non-
Metal solid material, such as silicon, ceramics, simple glass.
As one embodiment, fluoride described in step 2 is the mixing of silicon fluoride type organic and alcohol type organic
Object.The silicon fluoride type organic, commonly for example: trifluoromethyl trimethylsilane, dimethyl silicone polymer and fluorine-containing propene
Acid ester copolymer.The alcohol type organic, commonly for example: dehydrated alcohol, ethylene glycol.
As one embodiment, the microstructure array includes:
Single channel form, round pool shape, triangle or elliptical shape；Either compound combination of shapes.
As one embodiment, the processing object is put into the fluorination liquid, comprising: the upper table of the processing object
Height of the identity distance from the fluorination liquid liquid level is 2 millimeters；
As one embodiment, the step 3, further includes:
S101 configures laser graphics machined parameters, and the parameter includes: microstructure sizes, array pitch and array
Group number；
S102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 6w~12w, processing times 5 times, scanning speed
Spend 8mm/s；
S103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on processing object surface；
S104 takes out processing object after processing is completed, and is dried up with high pure nitrogen；
A kind of method that laser prepares lyophobic surface in the liquid phase provided in an embodiment of the present invention, can be on processing object surface
The microstructure array of upper obtained channel form or side hole shape either mixed type, and obtained micro-structure surface has lyophoby
Characteristic can be formed in the inside of microstructure array with certain thickness lyophobic layers.With lyophoby characteristic micro-structure surface
When material is used in actual use, even if material microstructure surface lyophobic layers are worn, the emerging material because of abrasion
Layer also has certain lyophoby characteristic.Use the material of the micro-structure surface with lyophoby characteristic prepared by present invention method
Expect that there is higher durability than the lyophobic surface being prepared with other methods, and lyophoby performance is also more firm, tribology
Performance is also more excellent.
Detailed description of the invention:
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
The flow diagram of Fig. 1 embodiment of the present invention；
Fig. 2 is the single channel form lyophoby micro-structure surface that the embodiment of the present invention 1 provides；
Fig. 3 is that the single side that the embodiment of the present invention 2 provides cheats shape lyophoby micro-structure surface；
Fig. 4 is the single triangle lyophoby micro-structure surface that the embodiment of the present invention 3 provides；
Fig. 5 is the single ellipticity lyophoby micro-structure surface that the embodiment of the present invention 4 provides；
Fig. 6 is that the side that the embodiment of the present invention 5 provides cheats, channel form mixes lyophoby micro-structure surface；
(the Qingdao research [D] of the preparation of Fu Yongqiang aluminium base super-double-hydrophobic surface and mechanical hydrophobic durability degree: Qingdao Fig. 7 (a)
Polytechnics, 2014:24.) it is the super-double-hydrophobic surface micro-structure electron microscope that in the prior art prepared by chemical etching method；
Fig. 7 (b) is the electron microscope of the lyophoby micro-structure surface prepared in the liquid phase with laser in the prior art.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, with reference to the accompanying drawing and specific embodiment party
Present invention is further described in detail for formula.Embodiments of the present invention are described in more detail below, the embodiment is shown
Example is shown in the accompanying drawings, and in which the same or similar labels are throughly indicated same or similar element or has identical or class
Like the element of function.It is exemplary below with reference to the embodiment of attached drawing description, for explaining only the invention, and cannot
It is construed to limitation of the present invention.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific term) there is meaning identical with the general understanding of those of ordinary skill in fields of the present invention.Should also
Understand, those terms such as defined in the general dictionary, which should be understood that, to be had and the meaning in the context of the prior art
The consistent meaning of justice, and unless defined as here, it will not be explained in an idealized or overly formal meaning.
Such as Fig. 7 (a) (preparation of Fu Yongqiang aluminium base super-double-hydrophobic surface and the Qingdao research [D] of mechanical hydrophobic durability degree: green
Island Polytechnics, 2014:24.) shown in, it is the electron microscope of the super-double-hydrophobic surface using chemical etching method preparation in the prior art,
It is the electron microscope of the lyophobic surface prepared in the liquid phase with laser as shown in Fig. 7 (b), two kinds of processing methods make processing pair
As surface has good lyophoby characteristic.But by comparison it is found that the microstructure aspects pattern of lyophobic surface is more clear in Fig. 7 (b)
Clear, microstructure appearance more meets the lyophobic surface microstructure appearance of nature animals and plants body surface, microprotrusion numbers of particles it is more and
With certain altitude, so that lyophobic layers are thicker, more preferably lyophoby characteristic is shown.
The embodiment of the present invention provides a kind of method that laser prepares lyophobic surface in the liquid phase, can be in processing object table
The microstructure array of obtained channel form, side's hole shape or mixed type on face, and obtained micro-structure surface is with thin
Liquid characteristic can be formed in the inside of microstructure array with certain thickness lyophobic layers.
In order to achieve the above objectives, the embodiment of the present invention is by taking hard alloy YT15 as an example, wherein the YT15 main component
And ratio are as follows: cobalt (6%), titanium carbide (15%), tungsten carbide (79%).Laser process equipment YLP pulse optical fiber, tool
Body:
Step 1: ultrasonic cleaning 8 minutes is carried out to hard alloy YT15 using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 0.8%, the fluoride is that silicon fluoride class is organic
Object and alcohol type organic；
Step 3: the hard alloy YT15 is put into the fluorination liquid, while processing institute using laser processing technology
Hard alloy YT15 is stated, microstructure array is processed；
Step 4: there will be microstructure array hard alloy YT15 to be put into incubator, be heat-treated, treatment temperature
It is 200 DEG C, cooled to room temperature after heat preservation 1 hour.
As one embodiment, for processing hard alloy YT15, for processing channel form microstructure array, such as
Shown in Fig. 2, the step 3 is specifically included:
S1-101, configuration trench size are as follows: long 1mm, wide 0.1mm, array pitch 0.1mm, number of arrays are 35 groups, are processed altogether
4 rows, line space 0.3mm；
S1-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 12w, processing times 5 times, scanning speed
8mm/s；
S1-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface hard alloy YT15；
S1-104 takes out the hard alloy YT15 after processing is completed, and is dried up with high pure nitrogen；
Optionally, compound microcosmic with processing side hole, groove for processing hard alloy YT15 as one embodiment
For array of structures, as shown in fig. 6, the step 3, further includes:
S2-101, configuration side cheat size are as follows: long 1mm, wide 1mm；Configuration trench size are as follows: long 1mm, wide 0.1mm, groove battle array
Column pitch 0.1mm；Hole and groove array spacing are 0.5mm；Hole array processes 5 groups above every a line, and groove array processes 5 groups,
6 rows, line space 0.2mm are processed altogether；
S2-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 10w, processing times 5 times, scanning speed
8mm/s；
S2-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface hard alloy YT15；
S2-104 takes out the hard alloy YT15 after processing is completed, and is dried up with high pure nitrogen；
As one embodiment, the embodiment of the present invention is by taking stainless steel 3Cr13 as an example, wherein the 3Cr13 essential element
Ingredient and ratio are as follows: chromium (15%), silicon (0.5%), manganese (0.5%), carbon (0.2%).Laser process equipment YLP pulse fiber
Laser, specifically:
Step 1: ultrasonic cleaning 8 minutes is carried out to stainless steel 3Cr13 using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 1.0%, the fluoride is that silicon fluoride class is organic
Object and alcohol type organic；
Step 3: the stainless steel 3Cr13 is put into the fluorination liquid, while using described in laser processing technology processing
Stainless steel 3Cr13 processes microstructure array；
Step 4: there will be microstructure array stainless steel 3Cr13 to be put into incubator, be heat-treated, treatment temperature
It is 150 DEG C, cooled to room temperature after heat preservation 1.5 hours.
As one embodiment, by taking processing stainless steel 3Cr13 as an example, by taking processing side cheats shape microstructure array as an example, such as
Shown in Fig. 3, the step 3 is specifically included:
S3-101, configuration side cheat size are as follows: long 1mm, wide 1mm, array pitch 0.2mm, number of arrays are 11 groups, process 4 altogether
Row, line space 0.2mm；
S3-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 8w, processing times 5 times, scanning speed
8mm/s；
S3-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface stainless steel 3Cr13；
S3-104 takes out the stainless steel 3Cr13 after processing is completed, and is dried up with high pure nitrogen.
As an example, the embodiment of the present invention is by taking simple glass as an example, wherein the simple glass main component
Are as follows: sodium metasilicate, calcium silicates and silica.Laser process equipment YLP pulse optical fiber, specifically:
Step 1: ultrasonic cleaning 6 minutes is carried out to simple glass using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 0.6%, the fluoride is that silicon fluoride class is organic
Object and alcohol type organic；
Step 3: the simple glass is put into the fluorination liquid, while described general using laser processing technology processing
Logical glass, processes microstructure array；
Step 4: the simple glass with microstructure array being put into incubator, is heat-treated, and treatment temperature is
150 DEG C, cooled to room temperature after heat preservation 1 hour.
As one embodiment, for processing simple glass, for processing triangle microstructure array, such as Fig. 4
It is shown, the step 3, specifically further include:
S4-101 configures triangle size are as follows: side length 0.5mm, three angles are 60 °；Array pitch is 0.1mm；Array
Number is 14 groups, processes 4 rows, line space 0.5mm altogether；
S4-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 12w, processing times 5 times, scanning speed
8mm/s；
S4-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment in surface of ordinary glass；
S4-104 takes out the simple glass after processing is completed, and is dried up with high pure nitrogen；
As an example, by taking polysilicon chip as an example, laser process equipment is swashed the embodiment of the present invention with YLP pulse fiber
Light device, specifically:
Step 1: ultrasonic cleaning 6 minutes is carried out to polysilicon chip using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 1.2%, the fluoride is that silicon fluoride class is organic
Object and alcohol type organic；
Step 3: the polysilicon chip is put into the fluorination liquid, while described more using laser processing technology processing
Crystal silicon chip processes microstructure array；
Step 4: the polysilicon chip with microstructure array being put into incubator, is heat-treated, and treatment temperature is
150 DEG C, cooled to room temperature after heat preservation 1.5 hours.
As one embodiment, for processing polysilicon chip, for processing oval microstructure array, such as Fig. 5
Shown, the step 3 specifically includes:
S5-101 configures oval size are as follows: long axial length 1.0mm, the long 0.35mm of short axle；Array pitch is 0.5mm；Number of arrays
It is 21 groups, processes 4 rows, line space 1.2mm altogether；
S5-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor
100ns, defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 8w, processing times 5 times, scanning speed
8mm/s；
S5-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on polysilicon chip surface；
S5-104 takes out the polysilicon chip after processing is completed, and is dried up with high pure nitrogen
As one embodiment, the processing object is metal material, such as hard alloy, stainless steel, hardened steel, or
It is nonmetal solid material, such as silicon, ceramics, simple glass.
As one embodiment, fluoride described in step 2 is the mixing of silicon fluoride type organic and alcohol type organic
Object.The silicon fluoride type organic object, commonly for example: trifluoromethyl trimethylsilane, dimethyl silicone polymer and fluorine-containing third
Olefin(e) acid ester copolymer.The alcohol type organic, commonly for example: dehydrated alcohol, ethylene glycol.
As one embodiment, the microstructure array includes:
Single channel form, round pool shape, triangle or elliptical shape；Either compound combination of shapes, such as groove
The combination just cheated.
As one embodiment, the processing object is put into the fluorination liquid, comprising: the upper table of the processing object
Height of the identity distance from the fluorination liquid liquid level is 2 millimeters；
The method that one kind provided in an embodiment of the present invention prepares lyophobic surface in the liquid phase, can make on processing object surface
It obtains channel form or cheats the microstructure array of shape either mixed type, and obtained micro-structure surface has lyophoby characteristic,
It can be formed in the inside of microstructure array with certain thickness lyophobic layers.Material with lyophoby characteristic micro-structure surface is used
When in actual use, even if material microstructure surface lyophobic layers are worn, because of abrasion, emerging material layer also has
Standby certain lyophoby characteristic.The material ratio of the micro-structure surface with lyophoby characteristic prepared using present invention method is used
The lyophobic surface that other methods are prepared have higher durability, and lyophoby performance is also more firm, tribological property more
It is excellent.
All the embodiments in this specification are described in a progressive manner, same and similar portion between each embodiment
Dividing may refer to each other, and each embodiment focuses on the differences from other embodiments.Especially for equipment reality
For applying example, since it is substantially similar to the method embodiment, so describing fairly simple, related place is referring to embodiment of the method
Part explanation.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of method that laser prepares lyophobic surface in the liquid phase characterized by comprising
Step 1: ultrasonic cleaning 6 to 8 minutes is carried out to processing object using acetone soln；
Step 2: fluoride is selected to be made into the fluorination liquid that mass fraction is 0.4%~2%；
Step 3: the processing object is put into the fluorination liquid, while using the laser processing technology processing processing pair
As processing microstructure array；
Step 4: the processing object with microstructure array being put into incubator, is heat-treated, treatment temperature 150
~250 DEG C, cooled to room temperature after heat preservation 1 to 2 hours；
Wherein, height of the upper surface of the processing object apart from the fluorination liquid liquid level is 1 to 5 millimeter.
2. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 1, which is characterized in that described to add
Work object is metal material or nonmetal solid material.
3. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 1, which is characterized in that step 2
Described in fluoride be silicon fluoride type organic and alcohol type organic mixture.
4. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 1, which is characterized in that described micro-
Seeing array of structures includes:
Single channel form, side hole shape, triangle or elliptical shape；Either compound combination of shapes.
5. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 1, which is characterized in that the step
Rapid three, further includes:
S101 configures laser graphics machined parameters, and the parameter includes: microstructure sizes, array pitch and array group number；
S102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns, from
Burnt amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 6w~12w, processing times 5 times, scanning speed 8mm/s；
S103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on processing object surface；
S104 takes out processing object after processing is completed, and is dried up with high pure nitrogen.
6. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 5, which is characterized in that processing is hard
When matter alloy Y T15, if processing channel form microstructure array, the step 3 specifically include:
S1-101, configuration trench size are as follows: long 1mm, wide 0.1mm, array pitch 0.1mm, number of arrays are 35 groups, process 4 rows altogether,
Line space 0.3mm；
S1-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns,
Defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 12w, processing times 5 times, scanning speed 8mm/s；
S1-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface hard alloy YT15；
S1-104 takes out the hard alloy YT15 after processing is completed, and is dried up with high pure nitrogen.
7. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 5, which is characterized in that processing is hard
When matter alloy Y T15, if processing side hole, the compound microstructure array of groove, the step 3, further includes:
S2-101, configuration side cheat size are as follows: long 1mm, wide 1mm；Configuration trench size are as follows: long 1mm, wide 0.1mm, between groove array
Away from 0.1mm；Hole and groove array spacing are 0.5mm；Every a line top hole array processes 5 groups, and groove array processes 5 groups, adds altogether
6 row of work, line space 0.2mm；
S2-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns,
Defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 10w, processing times 5 times, scanning speed 8mm/s；
S2-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface hard alloy YT15；
S2-104 takes out the hard alloy YT15 after processing is completed, and is dried up with high pure nitrogen.
8. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 5, which is characterized in that processing is not
When rust steel 3Cr13, if processing side cheats shape microstructure array, the step 3 is specifically included:
S3-101, configuration side cheat size are as follows: long 1mm, wide 1mm, array pitch 0.2mm, number of arrays are 11 groups, process 4 rows altogether, row
Spacing 0.2mm；
S3-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns,
Defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 10w, processing times 5 times, scanning speed 8mm/s；
S3-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on the surface stainless steel 3Cr13；
S3-104 takes out the stainless steel 3Cr13 after processing is completed, and is dried up with high pure nitrogen.
9. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 5, which is characterized in that processing is general
When logical glass, if processing triangle microstructure array, the step 3, specifically further include:
S4-101 configures triangle size are as follows: side length 0.5mm, three angles are 60 °；Array pitch is 0.1mm；Number of arrays is
14 groups, 4 rows, line space 0.5mm are processed altogether；
S4-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns,
Defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 12w, processing times 5 times, scanning speed 8mm/s；
S4-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment in surface of ordinary glass；
S4-104 takes out the simple glass after processing is completed, and is dried up with high pure nitrogen.
10. a kind of method that laser prepares lyophobic surface in the liquid phase according to claim 5, which is characterized in that processing
When polysilicon chip, if processing oval microstructure array, the step 3 is specifically included:
S5-101 configures oval size are as follows: long axial length 1.0mm, the long 0.35mm of short axle；Array pitch is 0.5mm；Number of arrays is 21
Group processes 4 rows, line space 1.2mm altogether；
S5-102 configures laser processing parameter are as follows: center emission wavelength 1064nm, transmitted bandwidth 5nm, pulse duty factor 100ns,
Defocusing amount [- 1.2,1.2] mm, pulse frequency 80kHz, average pulse power 8w, processing times 5 times, scanning speed 8mm/s；
S5-103 carries out the processing and fluorination treatment of micro structure array under room temperature environment on polysilicon chip surface；
S5-104 takes out the polysilicon chip after processing is completed, and is dried up with high pure nitrogen.
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| CN109822222A (en) * | 2019-03-29 | 2019-05-31 | 湖州师范学院 | A method of dimple lens array is quickly prepared using low pulse energy femtosecond laser |
| CN112548359B (en) * | 2020-11-30 | 2023-03-21 | 贵州大学 | Preparation method of surface functional composite structured monocrystalline silicon carbide |
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| CN115922091A (en) * | 2023-03-15 | 2023-04-07 | 中国科学院长春光学精密机械与物理研究所 | Method for rapidly preparing ultralyophobic surface |
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