CN107278024B - Flexible circuit board assembly - Google Patents
Flexible circuit board assembly Download PDFInfo
- Publication number
- CN107278024B CN107278024B CN201710653439.8A CN201710653439A CN107278024B CN 107278024 B CN107278024 B CN 107278024B CN 201710653439 A CN201710653439 A CN 201710653439A CN 107278024 B CN107278024 B CN 107278024B
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- CN
- China
- Prior art keywords
- distance
- circuit board
- strip
- board assembly
- flexible circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Abstract
The present case relates to a flexible circuit board assembly, includes: the flexible substrate is provided with a plurality of strip-shaped convex grooves on the surface and is of a strip-shaped structure; the girdle band is provided with a first surface and a second surface, the girdle band is of a strip-shaped structure as a whole, the girdle band is made of elastic wear-resistant materials, a plurality of uniformly distributed salient points are arranged on the first surface, and a plurality of uniformly distributed first blind holes are arranged at the first end of the second surface; wherein, the clitellum constitutes a ring, and flexible substrate passes through the ring. Due to the arrangement of the salient points on the annular belt, the direct collision between the FPC and the shell is avoided, and the service life of the FPC is prolonged; the arrangement of the second blind holes enables the tail ends of the salient points to be of a honeycomb-like structure, so that the elasticity of the ring belt material is further enhanced, and the structure can reduce and absorb noise in the collision process, so that the noise level in the use process of the equipment is reduced.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a flexible circuit board assembly.
background
Flexible circuit boards, also known as flexible boards, abbreviated as FPCs in english, are used in a large number of various aspects of electronic devices because of their excellent stretchable and contractible properties. In many occasions requiring turning and folding, the circuit board is required to have the turning capability of more than 10 ten thousand times.
in the upset in-process of circuit board, go out following problem easily, the part stress that overturns is too concentrated, has finally led to FPC's fracture, and second FPC takes place the friction and collision with the shell in the upset process, sends the noise, has just accelerateed FPC fracture process concurrently, and third is FPC adopts traditional copper layer to cover the shielding, leads to FPC whole harder, easy rupture.
Disclosure of Invention
An object of the present invention is to solve at least the above problems or disadvantages and to provide at least the advantages described hereinafter.
The invention also aims to provide a flexible circuit board assembly, wherein a ring belt is arranged on a section of the flexible substrate needing to be turned over by matching the first blind hole on the second surface with the salient point on the first surface; due to the arrangement of the salient points on the annular belt, the direct collision between the FPC and the shell is avoided, and the service life of the FPC is prolonged; the arrangement of the second blind holes enables the tail ends of the salient points to be of a honeycomb-like structure, so that the elasticity of the ring belt material is further enhanced, and the structure can reduce and absorb noise in the collision process, so that the noise level in the use process of the equipment is reduced; the arrangement of the long-strip convex groove enables the flexibility of the flexible substrate in the overturning process to be stronger, when large deformation is encountered, stress cannot be concentrated too much to cause the breakage of the flexible substrate, the overturning and folding times of the FPC are increased, and the specific wiring in the FPC cannot be influenced; when the FPC is integrally turned over, the second-type row is close to the first-type row under deformation, and the tail ends of the first-type salient points are just accommodated in the first concave cavities on the first-type salient points, so that stress accumulation caused by mutual collision among the salient points after turning over is avoided; the copper sheet, the metal powder in the sealant and the metal powder in the girdle material are arranged, so that the electromagnetic shielding of the FPC is completed.
therefore, the technical scheme provided by the invention is as follows: a flexible circuit board assembly comprising:
The flexible substrate is provided with a plurality of strip-shaped convex grooves on the surface and is of a strip-shaped structure; and
The ring belt is provided with a first surface and a second surface, the ring belt is of a strip-shaped structure overall, the ring belt is made of elastic wear-resistant materials, a plurality of uniformly distributed salient points are arranged on the first surface, and a plurality of uniformly distributed first blind holes are arranged at the first end of the second surface;
wherein, the clitellum constitutes a ring, and flexible substrate passes through the ring.
preferably, the shape and size of the salient point are consistent with the inner space of the first blind hole.
Preferably, the longitudinal distance between the convex points is a first distance, the transverse distance between the convex points is a second distance, the longitudinal distance between the first blind holes is a third distance, the transverse distance between the convex points is a fourth distance, the first distance is equal to the third distance, and the second distance is equal to the fourth distance.
Preferably, a plurality of second blind holes are uniformly formed in the tail end of the salient point.
preferably, the bumps include a first type bump and at least a second type bump, a first concave cavity is formed by the middle of the tail end of the first type bump in a protruding mode, and the tail end of the second type bump is contained in the first concave cavity.
preferably, the first type of bumps form a plurality of first type columns, the second type of bumps form a plurality of second type columns, and the first type columns and the second type columns are arranged at intervals.
Preferably, a copper sheet is further embedded in the middle of the salient point, and the copper sheet is parallel to the first surface.
Preferably, the flexible circuit board assembly further comprises a sealant, the sealant contains metal powder, and the sealant blocks a gap between the circular ring and the flexible substrate.
Preferably, the ring belt material contains 3% -10% of metal powder.
Preferably, the length direction of the long-strip convex groove is perpendicular to the length direction of the flexible substrate, the depth of the long-strip convex groove is 5% -20% of the thickness of the flexible substrate, and the ratio of the width of the long-strip convex groove to the depth of the long-strip convex groove is 0.4-3.
The invention at least comprises the following beneficial effects:
1. The first blind hole in the second surface is matched with the salient point in the first surface, so that the ring belt is arranged on a section of the flexible substrate, which needs to be turned over;
2. Due to the arrangement of the salient points on the annular belt, the direct collision between the FPC and the shell is avoided, and the service life of the FPC is prolonged; the arrangement of the second blind holes enables the tail ends of the salient points to be of a honeycomb-like structure, so that the elasticity of the ring belt material is further enhanced, and the structure can reduce and absorb noise in the collision process, so that the noise level in the use process of the equipment is reduced;
3. The arrangement of the long-strip convex groove enables the flexibility of the flexible substrate in the overturning process to be stronger, when large deformation is encountered, stress cannot be concentrated too much to cause the breakage of the flexible substrate, the overturning and folding times of the FPC are increased, and the specific wiring in the FPC cannot be influenced;
4. When the FPC is integrally turned over, the second-type row is close to the first-type row under deformation, and the tail ends of the first-type salient points are just accommodated in the first concave cavities on the first-type salient points, so that stress accumulation caused by mutual collision among the salient points after turning over is avoided;
5. The copper sheet, the metal powder in the sealant and the metal powder in the girdle material are arranged, so that the electromagnetic shielding of the FPC is completed.
drawings
FIG. 1 is a top view of a flexible circuit board assembly according to the present invention;
FIG. 2 is a cross-sectional view of a first type of bump according to the present invention;
FIG. 3 is a top view of the deployed cuff of the present invention with the second surface facing upward.
Detailed Description
The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," when used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
Example one
as shown in connection with fig. 1-3, a flexible circuit board assembly comprising: the flexible substrate is provided with a plurality of strip-shaped convex grooves 110 on the surface, and the flexible substrate 100 is in a strip-shaped structure; the annular belt 200 is provided with a first surface 210 and a second surface 220, the annular belt 200 is of a strip-shaped structure overall, the annular belt 200 is made of elastic wear-resistant materials, a plurality of uniformly distributed salient points 211 are arranged on the first surface 210, and a plurality of uniformly distributed first blind holes 221 are arranged at the first end of the second surface 220; wherein the ring belt 200 forms a circular ring through which the flexible substrate 100 passes.
The shape and size of the protruding point 211 are consistent with the inner space of the first blind hole 221. The longitudinal distance between the convex points 211 is a first distance, the transverse distance between the convex points 211 is a second distance, the longitudinal distance between the first blind holes 221 is a third distance, the transverse distance between the convex points 211 is a fourth distance, the first distance is equal to the third distance, and the second distance is equal to the fourth distance. And a plurality of second blind holes are uniformly formed in the tail end of the salient point 211.
The annular belt 200 is arranged at a section of the flexible substrate 100 needing to be turned over by matching the first blind hole 221 of the second surface 220 with the salient point 211 of the first surface 210; due to the arrangement of the salient points 211 on the annular belt 200, the direct collision between the FPC and the shell is avoided, and the service life of the FPC is prolonged; the arrangement of the second blind holes enables the tail ends of the convex points 211 to be of a honeycomb-like structure, so that the elasticity of the material of the ring belt 200 is further enhanced, and the structure can reduce and absorb noise in the collision process, so that the noise level in the use process of the equipment is reduced.
The length direction of the long-strip convex groove 110 is perpendicular to the length direction of the flexible substrate 100, the depth of the long-strip convex groove 110 is 15% of the thickness of the flexible substrate 100, and the ratio of the width to the depth of the long-strip convex groove 110 is 1.
The setting of rectangular tongue 110 makes the flexibility of flexible substrate 100 in the upset in-process is stronger, when meetting great deformation, and stress can not too concentrate the fracture that leads to flexible substrate 100, has increased FPC's folding number of times that can overturn, and can not influence the concrete wiring in the FPC.
Example two
the bumps 211 comprise a first bump 211a and at least a second bump 211b, the middle of the tail end of the first bump 211a protrudes to form a first cavity 211a1, and the tail end of the second bump 211b is accommodated in the first cavity 211a 1. The first salient points 211a form a plurality of first type rows, the second salient points 211 form a plurality of second type rows, and the first type rows and the second type rows are arranged at intervals.
When the FPC is turned over as a whole, the second-type row approaches the first-type row under deformation, and the ends of the first-type bumps 211a are just accommodated in the first cavities 211a1 on the first-type bumps 211a, so that stress accumulation caused by mutual collision among the bumps 211 after turning is avoided.
EXAMPLE III
a copper sheet 211c is further embedded in the middle of the bump 211, and the copper sheet 211c is parallel to the first surface 210. The flexible circuit board assembly further comprises a sealant, wherein the sealant contains metal powder, and the sealant blocks a gap between the circular ring and the flexible substrate 100. The material of the ring belt 200 contains 3% -10% of metal powder.
The copper sheet 211c, the metal powder in the sealant and the metal powder in the material of the ring belt 200 are arranged, so that the electromagnetic shielding of the FPC is completed.
From the above, the first blind hole on the second surface is matched with the salient point on the first surface, so that the ring belt is arranged on the section of the flexible substrate which needs to be turned over; due to the arrangement of the salient points on the annular belt, the direct collision between the FPC and the shell is avoided, and the service life of the FPC is prolonged; the arrangement of the second blind holes enables the tail ends of the salient points to be of a honeycomb-like structure, so that the elasticity of the ring belt material is further enhanced, and the structure can reduce and absorb noise in the collision process, so that the noise level in the use process of the equipment is reduced; the arrangement of the long-strip convex groove enables the flexibility of the flexible substrate in the overturning process to be stronger, when large deformation is encountered, stress cannot be concentrated too much to cause the breakage of the flexible substrate, the overturning and folding times of the FPC are increased, and the specific wiring in the FPC cannot be influenced; when the FPC is integrally turned over, the second-type row is close to the first-type row under deformation, and the tail ends of the first-type salient points are just accommodated in the first concave cavities on the first-type salient points, so that stress accumulation caused by mutual collision among the salient points after turning over is avoided; the copper sheet, the metal powder in the sealant and the metal powder in the girdle material are arranged, so that the electromagnetic shielding of the FPC is completed.
while embodiments of the invention have been disclosed above, it is not intended to be limited to the uses set forth in the specification and examples. It can be applied to all kinds of fields suitable for the present invention. Additional modifications will readily occur to those skilled in the art. It is therefore intended that the invention not be limited to the exact details and illustrations described and illustrated herein, but fall within the scope of the appended claims and equivalents thereof.
Claims (7)
1. A flexible circuit board assembly, comprising:
The flexible substrate is provided with a plurality of strip-shaped convex grooves on the surface and is of a strip-shaped structure; and
The ring belt is provided with a first surface and a second surface, the ring belt is of a strip-shaped structure overall, the ring belt is made of elastic wear-resistant materials, a plurality of uniformly distributed salient points are arranged on the first surface, and a plurality of uniformly distributed first blind holes are arranged at the first end of the second surface;
The ring belt forms a ring, and the flexible substrate penetrates through the ring;
the shape and the size of the salient point are consistent with the inner space of the first blind hole;
a plurality of second blind holes are uniformly formed in the tail end of the salient point;
The length direction of the long-strip convex groove is perpendicular to the length direction of the flexible substrate, the depth of the long-strip convex groove is 5% -20% of the thickness of the flexible substrate, and the ratio of the width of the long-strip convex groove to the depth of the long-strip convex groove is 0.4-3.
2. The flexible circuit board assembly of claim 1, wherein the longitudinal distance between the bumps is a first distance, the lateral distance between the bumps is a second distance, the longitudinal distance between the first blind vias is a third distance, the lateral distance between the bumps is a fourth distance, the first distance is equal to the third distance, and the second distance is equal to the fourth distance.
3. The flexible circuit board assembly of claim 2, wherein the bumps include a first bump type and at least a second bump type, wherein a central portion of a distal end of the first bump type protrudes to form a first cavity, and a distal end of the second bump type is received in the first cavity.
4. The flexible circuit board assembly of claim 3, wherein the first plurality of bumps form a plurality of first columns and the second plurality of bumps form a plurality of second columns, the first columns being spaced apart from the second columns.
5. The flexible circuit board assembly of claim 1, wherein a copper sheet is embedded in the middle of the bump, and the copper sheet is parallel to the first surface.
6. the flexible circuit board assembly of claim 1, further comprising a sealant, wherein the sealant contains metal powder, and the sealant seals a gap between the ring and the flexible substrate.
7. The flexible circuit board assembly of claim 1, wherein the loop material comprises a metal powder in a ratio of 3% to 10%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710653439.8A CN107278024B (en) | 2017-08-02 | 2017-08-02 | Flexible circuit board assembly |
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CN201710653439.8A CN107278024B (en) | 2017-08-02 | 2017-08-02 | Flexible circuit board assembly |
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CN107278024A CN107278024A (en) | 2017-10-20 |
CN107278024B true CN107278024B (en) | 2019-12-17 |
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CN201710653439.8A Active CN107278024B (en) | 2017-08-02 | 2017-08-02 | Flexible circuit board assembly |
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KR20200124461A (en) * | 2019-04-24 | 2020-11-03 | 엘지이노텍 주식회사 | Stretchable circuit substrate |
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JPH0666549B2 (en) * | 1988-08-31 | 1994-08-24 | 信越ポリマー株式会社 | Method of manufacturing flexible substrate with through hole |
KR102295108B1 (en) * | 2015-02-13 | 2021-08-31 | 삼성전기주식회사 | Rigid-flexible printed circuit board and method for manufacturing the same |
CN205454242U (en) * | 2016-02-16 | 2016-08-10 | 中山市邦帝电子材料有限公司 | A buffer |
CN105898982B (en) * | 2016-06-30 | 2019-01-18 | 广东顺德施瑞科技有限公司 | A kind of high-voltage flexible wiring board and multi-layer flexible circuit board |
CN206196127U (en) * | 2016-09-30 | 2017-05-24 | 东莞翔国光电科技有限公司 | And has strong practicability |
CN206332901U (en) * | 2016-11-10 | 2017-07-14 | 昆山华乐电子科技有限公司 | Steel disc reinforcement electric-conductor |
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