CN107238325A - A kind of assemble method of Low energy exploding foil initiator - Google Patents
A kind of assemble method of Low energy exploding foil initiator Download PDFInfo
- Publication number
- CN107238325A CN107238325A CN201710697310.7A CN201710697310A CN107238325A CN 107238325 A CN107238325 A CN 107238325A CN 201710697310 A CN201710697310 A CN 201710697310A CN 107238325 A CN107238325 A CN 107238325A
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- CN
- China
- Prior art keywords
- top electrode
- schottky diode
- exploding foil
- conducting resinl
- welding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/195—Manufacture
- F42B3/198—Manufacture of electric initiator heads e.g., testing, machines
Abstract
A kind of assemble method of Low energy exploding foil initiator, the initiating unit includes ceramic bases, composite metal film layer, insulating barrier, Top electrode Ti/W/Ti/Cu/Au, Schottky diode or high-voltage tube and acceleration thorax, it is characterised in that the step of including following orders：(1) pcb board polishing, cleaning；(2) substrate machined is adhered to correct position and the solidification of pcb board using insulating cement；(3) Schottky diode is reversely bonded on Top electrode Ti/W/Ti/Cu/Au using conducting resinl or high-voltage tube is bonded on Top electrode Ti/W/Ti/Cu/Au and solidified using conducting resinl；(4) using aluminium strip wedge bonding connection Schottky diode and PCB pads；(5) using copper strips manual welding connection Top electrode and PCB pads.This method uses thin-film technique, and precision is high, integrated level is high, and the volume of the initiation system of preparation is smaller, more safe and reliable；And the impedance reduction in loop of detonating, initiation system firing energy is low；Also, independent component can repeatedly do over again to realize being used for multiple times for Exploding Foil laboratory sample.
Description
Technical field
The present invention relates to a kind of preparation method of Exploding foil initiator, more particularly to a kind of Low energy exploding foil initiator
Assemble method.
Background technology
Exploding foil initiator (Exploding Foil Initiator, EFI) is a kind of with high reliability and high safety
The in-line arrangement Fire load of property, is mainly used in explosive loading detonation and solid propellant rocket propellant fire.EFI basic knot
Structure mainly includes pulse power units and Exploding Foil initiating unit two parts.Pulse power units mainly include high voltage power supply, electricity
Container, high-voltage switch gear, flat cable and control circuit；Exploding Foil initiating unit mainly includes substrate, Exploding Foil, polymer and flown
Piece, acceleration thorax and desensitized explosive.EFI breaches the limitation of sensitive priming medicament and loose explosive in conventional detonators, Exploding Foil
Do not contact directly, mechanical resistant impact, radioresistance, electrostatic, stray electrical current and electromagnetic interference, intrinsic safety is high, and make with explosive
With rapid reliable, there is wide application prospect in armament systems.
Publication No. CN104697405A Chinese invention patent disclose EFI chip units and preparation method thereof and
Exploding Foil priming device based on the chip unit.The EFI chip units include：Ceramic bases, Ti/Cu layers of metal,
C layers of Parylene, Top electrode Ti/W/Ti/Cu/Au, Schottky diode and Su8 accelerate thorax, the Exploding Foil priming device bag
Include the EFI chip units, film flying, explosive column, printed circuit board base, transmission line, low pressure patch capacitor, high pressure patch capacitor.
Described metal Ti/Cu layers are made bottom electrode in one-shot switch unit, make Exploding Foil, Parylene in Exploding Foil initiating unit
The C layers of insulating barrier made in one-shot switch unit between upper/lower electrode, Exploding foil initiator is made in Exploding Foil initiating unit
Film flying layer, accelerates thorax to use Su8 photoresist Integrated manufactures, reduces technological process, cost is low, small volume；Using Schottky two
Pole pipe has reverse breakdown characteristics, enables switch anti-stray current, the security with essence.
Publication No. CN103868417A Chinese invention patent is related to a kind of chip-shaped Exploding Foil component and its producer
Method.The chip-shaped Exploding Foil component includes Exploding Foil, film flying and electrode, and the film flying is bonded in the Exploding Foil；The electricity
Pole is welded in the Exploding Foil；The Exploding Foil is rectangle, and the Exploding Foil array arrangement is on substrate；The Exploding Foil
Scribing is molded；The electrode is stamping forming copper foil.Film flying selects hot sticky Kapton, manual mass bonding；Weldering
Tin realizes that batch is coated using small-sized hand-operated screen process press；Exploding Foil component pushes back welding machine using pulse heat and passes through programming
Realize batch automatic welding.The invention belongs to in-line arrangement impact piece priming system detonation part, the Exploding Foil component of chip design
Simple in construction, the mode of production is adapted to mass, automation, and product quality uniformity is good, and production efficiency is high, and cost is low.Be conducive to
The popularization and application of Slapper detonator.
Low energy Exploding Foil initiation system (Low Energy Exploding System, LEEFIs) is in traditional Exploding Foil
The New initiation system grown up on the basis of initiation system, its basic structure mainly include transformer, high-voltage energy storage capacitor,
High-voltage switch gear, control circuit, metal foil bridge, film flying layer, acceleration thorax and desensitized explosive.LEEFIs key technologies therein are to pass through
MEMS technology is by high-voltage switch gear, metal foil bridge and film flying is integrated is produced on silicon base chip, with small size, the Schottky of low energy consumption
One-shot switch replaces three traditional electrode pilot spark gap switches, and Kapton prepared by original position is both as switch
Insulating barrier, and it is used as film flying layer.Compared with traditional Exploding Foil initiation system, LEEFIs reduces first device using new material and new technology
Part volume, realizes the integrated manufacture of some components, so as to reduce the impedance in detonation loop, reduces initiation system firing energy
And volume.Correspondingly, substrate processing and assembling of the higher integrated and smaller volume requirement to LEEFIs proposes difficulty
Higher challenge.
The content of the invention
This project aims to provide a kind of assemble method of Low energy exploding foil initiator, by the effective procedure of this method and just
Really assembling can prepare smaller volume, more high integration and safe and reliable low energy Exploding Foil initiation system.
The technical solution for realizing the object of the invention is：A kind of assemble method of Low energy exploding foil initiator, the blast
The initiating unit of paper tinsel initiator includes ceramic bases, composite metal film layer, insulating barrier, Top electrode Ti/W/Ti/Cu/Au, Xiao Te
Base diode or high-voltage tube and accelerate thorax, it is characterised in that the step of including following orders：
(1) prepare before the assembling of pcb board：Prefabricated pcb board surrounding is polished smooth with sand paper, cleaned by freon
Machine is rinsed 3~5 minutes；
(2) substrate is glued：The substrate machined is adhered to correct position and the solidification of pcb board using insulating cement, wherein
Insulating cement is preferably XXX type one-component insulating cements, and condition of cure is：145 DEG C~155 DEG C of temperature, 60~70min of time；
(3) Schottky diode or high-voltage tube are glued：Schottky diode is reversely bonded in using conducting resinl by Top electrode Ti/
W/Ti/Cu/Au is upper or high-voltage tube is bonded on Top electrode Ti/W/Ti/Cu/Au and solidified using conducting resinl, wherein conductive
Glue is preferably XXX type two-component conducting resinls, and condition of cure is：145 DEG C~155 DEG C of temperature, 30~70min of time；
(4) Schottky diode is connected：Schottky diode and PCB pads, aluminium strip preferably are connected using aluminium strip wedge bonding
A diameter of 200 μm, the technological parameter of wedge bonding aluminium strip is：250~300g of pressure, 2.0~3.0powor of power, time 2.5
~3.5ms；Conducting resinl is coated at aluminium strip two ends and solidify to reinforce connection after welding；
(5) Top electrode is connected：Top electrode and PCB pads are connected using copper strips manual welding, wherein copper strips manual welding is preferred
The solder material used is Sn62/Pb36/Ag2, and welding temperature is 350 DEG C~400 DEG C；Finished product is placed in freon after welding
Rinse 30~60s.
PC layers or PI layers are set on the metal Ti/Cu layers of the Low energy exploding foil initiator, PC layers or PI layers are completely covered down
Electrode district and part Qiao Bo areas, make the metal copper layer of Qiao Bo areas wide end not being connected with lower electrode area exposed；The lower electrode area
Set on PC layers or PI layers on Top electrode Ti/W/Ti/Cu/Au, Top electrode Ti/W/Ti/Cu/Au and Schottky diode is set, institute
State lower electrode area, the PC being arranged in lower electrode area layers or PI layers, Top electrode Ti/W/Ti/Cu/Au and Schottky diode structure
Into one-shot switch unit；Described PC layers or PI layer constitutes film flying layer above Exploding Foil, accelerates above film flying layer provided with Su8
Thorax.
Main advantages of the present invention are：1. this method uses thin-film technique, and precision is high, and the component volume of assembling is smaller,
So that the integrated level of Exploding Foil is increased substantially, the volume of initiation system also significantly reduces；What 2. thin-film technique was brought is higher
Integrated level and smaller volume, can have sufficient space to set Multi- Switch detonation passage so that the security of Exploding Foil initiation system
It is relatively reliable；3. this method uses the integrated assembling of thin-film technique, reduces the impedance in detonation loop, while reducing detonation system
System firing energy；4. this method possesses good process advantage：Thin-film technique is stable and precision is high, workable, independent
Component can repeatedly do over again to realize being used for multiple times for Exploding Foil laboratory sample in sample stage.
Embodiment
With reference to specific embodiment, the present invention is furture elucidated, it should be understood that these embodiments are merely to illustrate the present invention
Rather than limitation the scope of the present invention, after the present invention has been read, various equivalences of the those skilled in the art to the present invention
The modification of form falls within the application appended claims and limited.
Embodiment 1
A kind of assemble method of Low energy exploding foil initiator, the initiating unit of the Exploding foil initiator include ceramic bases,
Ti/Cu layers of metal, PC layers, Top electrode Ti/W/Ti/Cu/Au, Schottky diode and Su8 accelerate thorax, it is characterised in that it is assembled
The step of method includes following orders：
(1) prepare before the assembling of pcb board：Prefabricated pcb board surrounding is polished smooth with sand paper, cleaned by freon
Machine is rinsed, and rinsing step is followed successively by freon spray 1min, and heat steams 3min, sprays 1min；
(2) substrate is glued：The substrate machined is adhered to the correct position of pcb board using XXX type one-component insulating cements
And solidify, condition of cure is：150 DEG C of temperature, time 60min；
(3) Schottky diode is glued：Schottky diode is reversely bonded in by Top electrode using XXX type two-component conducting resinls
On Ti/W/Ti/Cu/Au, wherein condition of cure is：150 DEG C of temperature, time 30min；
(4) Schottky diode is connected：Schottky diode and PCB pads are connected using aluminium strip wedge bonding, aluminium strip is a diameter of
200 μm, the technological parameter of wedge bonding aluminium strip is：Pressure 300g, power 2.0powor, time 2.5ms；In aluminium strip two after welding
End coating conducting resinl simultaneously solidifies to reinforce connection；
(5) Top electrode is connected：Top electrode and PCB pads are connected using copper strips manual welding, is removed with scalpel on bottom electrode
Part PC or PI, for Schottky one-shot switch, be directly connected with the pad of pcb board；For miniature Exploding foil initiator,
It is connected by the metallization via on PCB with one end of Exploding Foil；The solder material that wherein copper strips manual welding is preferred to use is
Sn62/Pb36/Ag2, welding temperature is 350 DEG C；Finished product is placed in freon after welding and rinses 60s.
PC layers are set on the metal Ti/Cu layers of the Low energy exploding foil initiator, PC layers are completely covered lower electrode area and part
Qiao Bo areas, make the metal copper layer of Qiao Bo areas wide end not being connected with lower electrode area exposed；On being set on the lower electrode area PC layers
Schottky diode is set on electrode Ti/W/Ti/Cu/Au, Top electrode Ti/W/Ti/Cu/Au, the lower electrode area, this is arranged on
PC layers, Top electrode Ti/W/Ti/Cu/Au and Schottky diode in lower electrode area constitute one-shot switch unit；It is described PC layers
Film flying layer is constituted above Exploding Foil, thorax is accelerated provided with Su8 above film flying layer.
Embodiment 2
A kind of assemble method of Low energy exploding foil initiator, the initiating unit of the Exploding foil initiator include ceramic bases,
Ti/Cu layers of metal, PI layers, Top electrode Ti/W/Ti/Cu/Au, Schottky diode and Su8 accelerate thorax, it is characterised in that including under
The step of stating order：
(1) prepare before the assembling of pcb board：Prefabricated pcb board surrounding is polished smooth with sand paper, cleaned by freon
Machine is rinsed, and rinsing step is followed successively by freon spray 1min, and heat steams 1min, sprays 1min；
(2) substrate is glued：The substrate machined is adhered to the correct position of pcb board using XXX type one-component insulating cements
And solidify, condition of cure is：145 DEG C of temperature, time 70min；
(3) Schottky diode is glued：Schottky diode is reversely bonded in by Top electrode using XXX type two-component conducting resinls
On Ti/W/Ti/Cu/Au, wherein condition of cure is：145 DEG C of temperature, time 50min；
(4) Schottky diode is connected：Schottky diode and PCB pads are connected using aluminium strip wedge bonding, aluminium strip is a diameter of
200 μm, the technological parameter of wedge bonding aluminium strip is：Pressure 250g, power 3.0powor, time 3ms；At aluminium strip two ends after welding
Coating conducting resinl simultaneously solidifies to reinforce connection；
(5) Top electrode is connected：Top electrode and PCB pads are connected using copper strips manual welding, is removed with scalpel on bottom electrode
Part PI, for Schottky one-shot switch, be directly connected with the pad of pcb board；For miniature Exploding foil initiator, pass through
Metallization via on PCB is connected with one end of Exploding Foil；The solder material that wherein copper strips manual welding is preferred to use is Sn62/
Pb36/Ag2, welding temperature is 350 DEG C；Finished product is placed in freon after welding and rinses 60s.
PI layers are set on the metal Ti/Cu layers of the Low energy exploding foil initiator, PI layers are completely covered lower electrode area and part
Qiao Bo areas, make the metal copper layer of Qiao Bo areas wide end not being connected with lower electrode area exposed；On being set on the lower electrode area PI layers
Schottky diode is set on electrode Ti/W/Ti/Cu/Au, Top electrode Ti/W/Ti/Cu/Au, the lower electrode area, this is arranged on
PI layers, Top electrode Ti/W/Ti/Cu/Au and Schottky diode in lower electrode area constitute one-shot switch unit；It is described PC layers
Film flying layer is constituted above Exploding Foil, thorax is accelerated provided with Su8 above film flying layer.
Two embodiments of the invention are above are only, but the design concept of the present invention is not limited thereto, it is all to utilize
This design carries out the change of unsubstantiality to the present invention, all should belong to the behavior for invading the scope of protection of the invention.In every case it is not
Depart from the content of technical solution of the present invention, it is any type of simple that the technical spirit according to the present invention is made to above example
Modification, equivalent variations and remodeling, still fall within the protection domain of technical solution of the present invention.
Claims (1)
1. a kind of assemble method of Low energy exploding foil initiator, the initiating unit of the Exploding foil initiator includes ceramic bases, answered
Close metal film layer, insulating barrier, Top electrode Ti/W/Ti/Cu/Au, Schottky diode or high-voltage tube and accelerate thorax, its feature exists
The step of including following orders：
(1) prepare before the assembling of pcb board：Prefabricated pcb board surrounding is polished smooth with sand paper, rushed by freon cleaning machine
Wash 3~5 minutes；
(2) substrate is glued：The substrate machined is adhered to correct position and the solidification of pcb board using insulating cement, wherein insulating
Glue is preferably XXX type one-component insulating cements, and condition of cure is：145 DEG C~155 DEG C of temperature, 60~70min of time；
(3) Schottky diode or high-voltage tube are glued：Schottky diode is reversely bonded in using conducting resinl by Top electrode Ti/W/
Ti/Cu/Au is upper or high-voltage tube is bonded on Top electrode Ti/W/Ti/Cu/Au and solidified using conducting resinl, wherein conducting resinl
Preferably XXX types two-component conducting resinl, condition of cure is：145 DEG C~155 DEG C of temperature, 30~70min of time；
(4) Schottky diode is connected：Schottky diode and PCB pads, aluminium strip diameter preferably are connected using aluminium strip wedge bonding
For 200 μm, the technological parameter of wedge bonding aluminium strip is：250~300g of pressure, 2.0~3.0powor of power, the time 2.5~
3.5ms；Conducting resinl is coated at aluminium strip two ends and solidify to reinforce connection after welding；
(5) Top electrode is connected：Top electrode and PCB pads are connected using copper strips manual welding, wherein copper strips manual welding is preferred to use
Solder material be Sn62/Pb36/Ag2, welding temperature be 350 DEG C~400 DEG C；Finished product is placed in freon after welding and rinsed
30~60s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710697310.7A CN107238325A (en) | 2017-08-15 | 2017-08-15 | A kind of assemble method of Low energy exploding foil initiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710697310.7A CN107238325A (en) | 2017-08-15 | 2017-08-15 | A kind of assemble method of Low energy exploding foil initiator |
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| Publication Number | Publication Date |
|---|---|
| CN107238325A true CN107238325A (en) | 2017-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710697310.7A Pending CN107238325A (en) | 2017-08-15 | 2017-08-15 | A kind of assemble method of Low energy exploding foil initiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945746A (en) * | 2019-03-22 | 2019-06-28 | 中国电子科技集团公司第四十三研究所 | The preparation method of chip Exploding Foil |
-
2017
- 2017-08-15 CN CN201710697310.7A patent/CN107238325A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109945746A (en) * | 2019-03-22 | 2019-06-28 | 中国电子科技集团公司第四十三研究所 | The preparation method of chip Exploding Foil |
| CN109945746B (en) * | 2019-03-22 | 2021-07-23 | 中国电子科技集团公司第四十三研究所 | Preparation method of sheet type explosive foil |
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Application publication date: 20171010 |