CN107238127A - A kind of high heat conduction thin type dry ground heating module and preparation method thereof - Google Patents
A kind of high heat conduction thin type dry ground heating module and preparation method thereof Download PDFInfo
- Publication number
- CN107238127A CN107238127A CN201710574616.3A CN201710574616A CN107238127A CN 107238127 A CN107238127 A CN 107238127A CN 201710574616 A CN201710574616 A CN 201710574616A CN 107238127 A CN107238127 A CN 107238127A
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- China
- Prior art keywords
- layer
- link span
- heat conduction
- heat
- damp
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/181—Insulating layers integrally formed with the flooring or the flooring elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
The invention discloses a kind of high heat conduction thin type dry ground heating module and preparation method thereof, including thermal insulation board, link span, heat-insulation layer and high thermal conductivity layer and heating tube, the link span is provided with tube seat, heat-insulation layer and high thermal conductivity layer are laid on link span successively, above high thermal conductivity layer heating tube is provided with tube seat position corresponding position, the thermal insulation board includes skid resistant course, damp-proof layer, bottom plate and boss, the damp-proof layer is set below daughter backplane, skid resistant course is provided with below damp-proof layer, the boss is arranged in above bottom plate, and reinforcement is provided between the adjacent lands.Fine aluminium heat-conducting layer is used on link span of the present invention, comprehensive heat conduction, its heat-conducting effect is traditional more than 5 times, and heat radiates upwards comprehensively, radiating is uniform, and the thermal efficiency is higher, backfilled instead of traditional silt, integral thickness is thin.
Description
Technical field
The present invention relates to heating control field, and in particular to a kind of high heat conduction thin type dry ground heating module.
Background technology
Floor heating is the abbreviation of floor panel heating, be using whole ground as radiator, by flooring radiation layer in heating agent,
Uniformly heat whole ground, the even whole ground of heating, the rule radiated upwards using the accumulation of heat and heat on ground itself by it is lower extremely
It is upper to be conducted, to reach the purpose of heating.Dry floor heating is also known as ultra-thin ground-warming, relative to common floor heating mounting means without ground
Warm backfill, therefore it is named dry floor heating.
Compared with traditional heating system, floor heating has radiating uniform, comfortable, and cleaning health, environmental protection and energy saving are elegant in appearance,
It is safe and reliable, the advantages of extra long life and efficient sound insulation.As the improvement of people's living standards, increasing family's winter
Begin to use floor heating to heat.Current electric heating film floor heating is constructed by the way of wet-laying, i.e., electric heating film floor heating is whole
It is embedded under cement flooring, ceramic tile is pasted on upper strata again.When upper strata is timber floor, if using wet-laying mode, will raise entirely
The height in face, influences the use of building.If upper strata is timber floor, extruded sheet is used for thermal insulation layer, without cement screed-coat,
Extruded sheet and heater are easily affected by the external environment, in fact it could happen that floating dust etc., are unfavorable for heat-insulated.
The content of the invention
Goal of the invention：For it is above-mentioned it is of the prior art exist the problem of and deficiency, led it is an object of the invention to provide a kind of height
Hot thin type dry ground heating module.
Technical scheme：To reach above-mentioned purpose, a kind of high heat conduction thin type dry ground heating module of the present invention, including every
Hot plate, link span, heat-insulation layer and high thermal conductivity layer and heating tube, the link span are provided with tube seat, link span laying guarantor successively
Heating tube is provided with above warm layer and high thermal conductivity layer, high thermal conductivity layer with tube seat position corresponding position, the thermal insulation board includes skid resistant course, prevented
Damp layer, bottom plate and boss, the damp-proof layer are set below daughter backplane, and skid resistant course is provided with below damp-proof layer, and the boss is arranged in
Above bottom plate, reinforcement is provided between the adjacent lands.
Further, the tube seat is in the type of falling Ω, and its depth is more than the diameter of heating tube.
Further, the high thermal conductivity layer is the soft state pure aluminum plate of heat conduction, and the thickness of the soft state pure aluminum plate of heat conduction is 0.2-
1mm。
Further, the link span surface is also molded with circular protrusions positioned at tube seat periphery.Between adjacent circular is raised
Provided with pipeline limited block.The design of circular protrusions is higher by the height of heating tube, can prevent laying floor or ground above heating tube
Heating tube formation is extruded after brick.
Further, the link span left and right ends are provided with the attachment structure spliced for adjacent link span.
Further, the damp-proof layer is thermoplastic polyurethane and the mixture of hydrophobic thermoplastic polyurethane.Can have
The situation that effect reduction floor heating module makes moist when not in use occurs.
A kind of high heat conduction thin type dry ground heating module and preparation method thereof, it is characterised in that：Specific preparation method is as follows：
1）Thermal insulation board is made, damp-proof layer is pasted onto below bottom plate, skid resistant course is pasted onto the lower section of damp-proof layer 12, then on bottom plate
Side makes by reinforcement to be coupled between boss, boss and fixed；
2）Link span is made, tube seat, circular protrusions and limited block processing is carried out respectively on link span surface；
3) prepare heat-insulation layer, heat-insulation layer is laid on link span first, and the position of correspondence tube seat is subjected to depression treatment；
4）Prepare high thermal conductivity layer, high thermal conductivity layer is laid on to the top of heat-insulation layer, and the position of correspondence tube seat is subjected to recess
Reason；
5）The link span for having attached heat-insulation layer and high thermal conductivity layer is fixed on above thermal insulation board；
6) heating tube is laid in tube seat and realizes positioning.
Above-mentioned technical proposal can be seen that beneficial effects of the present invention：
（1）Use fine aluminium heat-conducting layer on link span, comprehensive heat conduction, its heat-conducting effect is traditional more than 5 times, heat comprehensively to
Upper radiating, radiating is uniform, and the thermal efficiency is higher, is backfilled instead of traditional silt, and integral thickness is thin.
（2）Link span surface is also molded with circular protrusions positioned at tube seat periphery, and the design of circular protrusions is higher by heating tube
Highly, it can prevent from extruding heating tube formation after laying floor or floor tile above heating tube, be provided between adjacent circular is raised
Pipeline limited block, helps to be fixed on heating tube is spacing in tube seat, prevents heating tube from being skidded off in tube seat.
Brief description of the drawings
Fig. 1 is overall structure decomposing schematic representation of the present invention；
Fig. 2 for the present invention in link span structural representation.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is furture elucidated.
Embodiment
A kind of high heat conduction thin type dry ground heating module as shown in Figure 1, including thermal insulation board 1, link span 2, heat-insulation layer 3 and height
Heat-conducting layer 4 and heating tube 5, the link span 2 are provided with tube seat 6, link span 2 and lay heat-insulation layer 3 and high thermal conductivity layer 4 successively,
The top of high thermal conductivity layer 4 is provided with heating tube 5 with the position corresponding position of tube seat 5, and the thermal insulation board 1 includes skid resistant course 11, damp-proof layer 12, bottom
Plate 13 and boss 14, the damp-proof layer 12 set the lower section of daughter backplane 13, and the lower section of damp-proof layer 12 is provided with skid resistant course 11, the boss 14
It is arranged between the top of bottom plate 13, the adjacent lands 14 and is provided with reinforcement 15.The tube seat 6 is in the type of falling Ω, and its depth is more than
The diameter of heating tube.The high thermal conductivity layer 4 is the soft state pure aluminum plate of heat conduction, and the thickness of the soft state pure aluminum plate of heat conduction is 0.2-1mm.
The surface of link span 2 is also molded between circular protrusions 7, adjacent circular projection 7 spacing provided with pipeline positioned at the periphery of tube seat 5
Block 8.The left and right ends of link span 2 are provided with the attachment structure 9 spliced for adjacent link span 2.The damp-proof layer 12 is thermoplastic poly ammonia
The mixture of ester and hydrophobic thermoplastic polyurethane.
A kind of high heat conduction thin type dry ground heating module and preparation method thereof, it is characterised in that：Specific preparation method is as follows：
1）Thermal insulation board 1 is made, damp-proof layer 12 is pasted onto the lower section of bottom plate 13, skid resistant course 11 is pasted onto the lower section of damp-proof layer 12, then
Make by reinforcement 15 to be coupled between boss 14, boss 14 in the top of bottom plate 11 and fix；
2）Link span 2 is made, tube seat 6, circular protrusions 7 and limited block processing 8 is carried out respectively on the surface of link span 2；
3) prepare heat-insulation layer 3, heat-insulation layer 3 is laid on link span 2 first, and the position of correspondence tube seat 6 is subjected to recess
Reason；
4）Prepare high thermal conductivity layer 4, high thermal conductivity layer 4 is laid on to the top of heat-insulation layer 3, and the position progress of correspondence tube seat 6 is recessed
Fall into processing；
5）The link span 2 for having attached heat-insulation layer 3 and high thermal conductivity layer 4 is fixed on the top of thermal insulation board 1；
6) heating tube 5 is laid in tube seat 6 and realizes positioning.
Embodiment is only illustrative of the invention and is not intended to limit the scope of the invention, after the present invention has been read, this
Art personnel fall within the application appended claims limited range to the various equivalences of the present invention.
Claims (7)
1. a kind of high heat conduction thin type dry ground heating module, it is characterised in that：Including thermal insulation board（1）, link span（2）, heat-insulation layer（3）
And high thermal conductivity layer（4）And heating tube（5）, the link span（2）It is provided with tube seat（6）, link span（2）On lay heat-insulation layer successively
（3）And high thermal conductivity layer（4）, high thermal conductivity layer（4）Top and tube seat（5）Position corresponding position is provided with heating tube（5）, the thermal insulation board
（1）Including skid resistant course（11）, damp-proof layer（12）, bottom plate（13）And boss（14）, the damp-proof layer（12）Daughter backplane is set（13）
Lower section, damp-proof layer（12）Lower section is provided with skid resistant course（11）, the boss（14）It is arranged in bottom plate（13）Top, the adjacent lands
（14）Between be provided with reinforcement（15）.
2. a kind of high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The tube seat（6）It is in
The type of falling Ω, its depth is more than the diameter of heating tube.
3. a kind of high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The high thermal conductivity layer
（4）For the soft state pure aluminum plate of heat conduction, the thickness of the soft state pure aluminum plate of heat conduction is 0.2-1mm.
4. a kind of high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The link span（2）
Surface is located at tube seat（5）Periphery is additionally provided with circular protrusions（7）, adjacent circular projection（7）Between be provided with pipeline limited block（8）.
5. a kind of high heat conduction thin type dry ground heating module according to claim 5, it is characterised in that：The link span（2）
Left and right ends, which are provided with, supplies adjacent link span（2）The attachment structure of splicing（9）.
6. a kind of high heat conduction thin type dry ground heating module according to claim 1, it is characterised in that：The damp-proof layer（12）
For thermoplastic polyurethane and the mixture of hydrophobic thermoplastic polyurethane.
7. a kind of high heat conduction thin type dry ground heating module as described in claim 1-6 and preparation method thereof, it is characterised in that：Tool
Body preparation method is as follows：
1）Make thermal insulation board（1）, by damp-proof layer（12）It is pasted onto bottom plate（13）Lower section, skid resistant course（11）It is pasted onto damp-proof layer（12）
Lower section, then in bottom plate（11）Top makes boss（14）, boss（14）Between pass through reinforcement（15）It is coupled and fixes；
2）Make link span（2）, in link span（2）Surface carries out tube seat, circular protrusions and limited block processing respectively；
3) heat-insulation layer is prepared（3）, first by heat-insulation layer（3）It is laid on link span（2）On, and will correspondence tube seat（6）Position enter
Row depression treatment；
4）Prepare high thermal conductivity layer（4）, by high thermal conductivity layer（4）It is laid on heat-insulation layer（3）Top, and will correspondence tube seat（6）Position
Put carry out depression treatment；
5）Heat-insulation layer will be attached（3）And high thermal conductivity layer（4）Link span（2）It is fixed on thermal insulation board（1）Top；
6) by heating tube（5）It is laid on tube seat（6）It is interior to realize positioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710574616.3A CN107238127A (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710574616.3A CN107238127A (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107238127A true CN107238127A (en) | 2017-10-10 |
Family
ID=59990581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710574616.3A Pending CN107238127A (en) | 2017-07-14 | 2017-07-14 | A kind of high heat conduction thin type dry ground heating module and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107238127A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747758A (en) * | 2017-11-06 | 2018-03-02 | 上海品宅装饰科技有限公司 | A kind of assembled floor heating module plastic support suspension member |
| CN108204094A (en) * | 2017-12-07 | 2018-06-26 | 广州孚达保温隔热材料有限公司 | A kind of dry floor heating extruded sheet and its construction technology |
| CN114482307A (en) * | 2022-02-21 | 2022-05-13 | 重庆公共运输职业学院 | Method for arranging aluminum skin heat conduction layer on curved groove heat insulation plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11315629A (en) * | 1998-05-01 | 1999-11-16 | Sunpot Co Ltd | Raised floor |
| CN201339300Y (en) * | 2009-01-14 | 2009-11-04 | 北京三恒科贸有限公司 | Water-electrical multifunctional thin thermal insulating board |
| CN201362908Y (en) * | 2009-02-24 | 2009-12-16 | 冯雪凤 | Environment-friendly dry type ground heating module |
| CN202101311U (en) * | 2011-03-01 | 2012-01-04 | 海宁伊满阁太阳能科技有限公司 | Composite heat conduction heating floor with heating elements embedded in grooves of wrapping edges |
| CN202371802U (en) * | 2011-12-21 | 2012-08-08 | 李芬莲 | Assembled heat insulating module integration used for floor heating |
| CN207146503U (en) * | 2017-07-14 | 2018-03-27 | 苏州灵均暖通科技有限公司 | A kind of high heat conduction thin type dry ground heating module |
-
2017
- 2017-07-14 CN CN201710574616.3A patent/CN107238127A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11315629A (en) * | 1998-05-01 | 1999-11-16 | Sunpot Co Ltd | Raised floor |
| CN201339300Y (en) * | 2009-01-14 | 2009-11-04 | 北京三恒科贸有限公司 | Water-electrical multifunctional thin thermal insulating board |
| CN201362908Y (en) * | 2009-02-24 | 2009-12-16 | 冯雪凤 | Environment-friendly dry type ground heating module |
| CN202101311U (en) * | 2011-03-01 | 2012-01-04 | 海宁伊满阁太阳能科技有限公司 | Composite heat conduction heating floor with heating elements embedded in grooves of wrapping edges |
| CN202371802U (en) * | 2011-12-21 | 2012-08-08 | 李芬莲 | Assembled heat insulating module integration used for floor heating |
| CN207146503U (en) * | 2017-07-14 | 2018-03-27 | 苏州灵均暖通科技有限公司 | A kind of high heat conduction thin type dry ground heating module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747758A (en) * | 2017-11-06 | 2018-03-02 | 上海品宅装饰科技有限公司 | A kind of assembled floor heating module plastic support suspension member |
| CN108204094A (en) * | 2017-12-07 | 2018-06-26 | 广州孚达保温隔热材料有限公司 | A kind of dry floor heating extruded sheet and its construction technology |
| CN114482307A (en) * | 2022-02-21 | 2022-05-13 | 重庆公共运输职业学院 | Method for arranging aluminum skin heat conduction layer on curved groove heat insulation plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171010 |
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| RJ01 | Rejection of invention patent application after publication |